TWI231246B - Method for polishing diamond wafer - Google Patents

Abstract

This invention relates to a method for polishing diamond wafer. A diamond wafer is adhered to a ceramic workpiece by wax. The diamond wafer is then affixed to the ceramic workpiece upon applying a predetermined pressure. The ceramic workpiece is then affixed to a first transmission device of polishing equipment by vacuum. A first transmission device then causes the ceramic workpiece to approach a metal sheet secured to a second transmission device and rotates constantly, such that the metal sheet is used to polish the diamond wafer on the ceramic workpiece. This invention uses rotation of the metal sheet to polish the diamond wafer so as to reduce the cost of the polishing equipment, reduce polishing time and improve polishing efficiency.

Description

1231246 "Wu Zheng _ case number 93102852 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention is a method for polishing diamond wafers by using a method to grind diamond wafers. In particular, the previous technology using gold L] In the semiconductor process, in order to improve the thickness and flatness of the material of the heterogeneous layer, strict requirements are required. The density of the wafer is important in the semiconductor process; The surface of the wafer is flat and connected to this load. The main process is chemical mechanical polishing, which is an important process technology for flattening the surface. As shown in the figure, it is a schematic diagram of a chemical mechanical polishing device. As shown in FIG. 1, the polishing head 10 uses the method of changing the air pressure to adsorb the back surface of a wafer 12 and makes the front surface of the wafer 12 face a polishing pad 14 for polishing. In order to avoid the damage of the wafer 12 caused by the direct contact between the polishing head 10 and the wafer 12, a cushion pad 16 having a plurality of vent holes will be provided between the polishing head 10 and the wafer 12 as a buffer. When the circle 12 is being ground, there is still a grinding liquid conveying device 18 that sprays a grinding liquid 20 (Slurry) to assist the grinding. However, for diamond wafers, that is, for wafers with a diamond film formed on the surface, the diamond film has excellent physical and chemical properties, so it is difficult for traditional chemical mechanical polishing methods to effectively grind the diamond film. The application of diamond films to precision electronic components is limited by the surface roughness of diamond films up to several microns. Although there are many studies on diamond film planarization technology, diamonds are very difficult to process. Therefore, considering the processing efficiency, required equipment cost, and processing time, etc., there is no effective diamond wafer polishing method yet. In view of this, the present invention proposes a diamond wafer polishing method to modify

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Knowing the shortcomings of technology. [Summary of the invention] The present invention: the main purpose is to provide a diamond wafer grinding method: using a first transmission device to drive the diamond wafer to a rotation of close to, so that the metal sheet grinds the surface of the diamond wafer, For the purpose of Daruma efficiency. 9 advanced research diamond wafer polishing methods

Another object of the present invention is to provide time and cost savings in grinding. According to the present invention, first, at least one diamond wafer is fixed in a vacuum, and a workpiece is fixed on a first transmission device of a grinding machine. The first transmission device will drive the workpiece to a second transmission device to metal. h Nearly 'this metal sheet is in the turning state of the first: pass =' So when the iron wafer fixed on the surface of the workpiece is close to the metal sheet of bismuth, it will grind the diamond wafer. The following description of specific embodiments, and refer to the attached. It is easier to understand the purpose, technical content, characteristics and features of the present invention; 忐: efficacy. [Embodiment] First Turn This and the present invention provide a diamond wafer polishing method, which uses a moving metal sheet to polish the surface of the diamond wafer, thereby saving research time, shortening the polishing time, and improving the polishing efficiency. As shown in the second figure, the diamond wafer grinding wax procedure of the present invention is to attach a plurality of diamond wafers 30 to wax with one on one, and then use a certain pressure to attach the diamond wafer 30 to the workpiece. "Solid = 3 in 2 1-5. Description of the invention (3) After the waxing process is completed, the grinding process is started. Refer to the third circle. The grinding process includes the following steps: First, use the vacuum method J, The workpiece 32 to which the diamond wafer 30 is attached is fixed to the first drive of the grinding machine 34. The device 36 is used to drive the workpiece 32 and the wafer 30 thereon forward, backward, and rotate. Move up, down, left and right; in the fixed installation, that is: operate a control device 38 to control the first drive to maintain the state of rotation, and the position remains unchanged, and up and down two: two grinding parameters to properly control the diamond wafer; J 8: Grinding time, grinding method, etc .; therefore = under the control of grinding exhaustion and grinding device 38, the transmission device 36 will control its contact with the rotating metal sheet ㈣: 3 "== 3. Go forward and make-a period of time later 'The control device 38 can grind the transmission device 36 according to the research operation. Drive the setting of the diamond wafer belt to move the first dagger to the right; then, the first transmission device revolves with the rotation, so that the metal sheet 40 repeats the research and waste J, repeats the other progress and the stone wafer 30 is ground to the required The thickness is 2 diamond wafers 30. In addition, in order to cool the abrasive particles or broken particles, etc., the grinding machine 34 is changed and the grinding powder 44 is washed, as shown in the third figure; The material for cooling the diamond wafer 30 or metal = :: = can mouth the cooling liquid to punch. The material can be steel or its alloy. Moreover, the metal sheet 40 is second grade: and other materials, and the second grade of diamond can be Tao Wanwai can also be fixed to the workpiece 32 by other sticky materials or other methods on the workpiece 32 1231246-"篆 号 931 咖啡 R9 year, month, day, amendment five, description of the invention (4) and in order to increase the flexibility of the invention Referring to the third figure, during the grinding of the diamond wafer 30, it is also possible to keep the first and moving clothes 36 stationary through the control of the control device 38, and the second transmission device 42 to drive the metal piece 40 to rotate. * Turn 'and drive the metal sheet 40 to the diamond wafer 30 at the same time. Grinding its thickness is the same. The control device 38 can also control the first and second transmissions 36 and 42 to perform rotation, forward, backward, or up, down, left, and right movements according to the different input grinding parameters, thereby achieving a variety of grinding. Method and grinding effect. However, the embodiments described above are only preferred embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention.

The shapes, hibiscuses, characteristics, and characteristics described in the scope * + f θ T equal changes and modifications based on characteristics and spirits should all be included in the patent application for this creation 1231246 _ case number 93102852_ year month The modified diagram is briefly explained. The first diagram is a schematic diagram of a conventional chemical mechanical polishing process. The second figure is a schematic diagram of the waxing procedure of the present invention. The third figure is a schematic diagram of the grinding process of the present invention.

Description of drawing number: 10 polishing head 12 wafer 14 polishing pad 16 cushion pad 18 polishing liquid conveying device 20 polishing liquid 30 diamond wafer 32 workpiece 34 polishing machine table 36 first transmission device 38 control device 40 metal piece 42 second transmission device 44 coolant outlet

Claims (1)

Amendment 1231246-plug No. Q3102852 6th, patent application ^-1. A diamond wafer grinding method, which includes the following steps: At least one diamond wafer is fixed on a workpiece; the workpiece is fixed on a grinding On the first transmission of the machine, the surface of the round stone faces a second piece of metal piece fixed to the grinding machine; and the control of the grinding machine is used to place the metal piece on the first machine. Pass = keep rotating, and make the workpiece close to each other on the second transmission belt metal piece, thereby grinding the diamond crystal on the workpiece, the diamond wafer grinding as described in the first patent application scope, and grinding the workpiece. Department of ceramic work. The diamond wafer grinding method as described in item 1 of the patent application scope. The diamond wafer is attached to the workpiece by wax, and is fixed to each other by a stone wafer and the workpiece. 4. According to the diamond wafer grinding method described in item 1 of the patent application scope, the first transmission device is used to fix the work by means of vacuum suction. 5. The iron wafer wafer polishing method described in item i of the patent scope is required. The material of the metal sheet is selected from steel or its alloy. 6. According to the diamond wafer grinding method described in item [Scope of the patent application], the grinding machine is provided with a control part, and the pottery can be turned into grinding parameters. Diamond crystal time and grinding method. Destroyed by the center 7. As described in item i of the patent application, the metal piece is under the control of the second transmission device, and the ::::: square, pieces] under the control of the first transmission vibration and The upper moving device of the swinging device drives the lower circle to the circle. Method, where method, where the force causes the drilling method, where 〇 method, where method, where, with transmittance, grinding, method, where the state and position are close to the Page 10 1231246 ----- ES ^ 93j ^ 2852 VI. Patent Application ® " " " " " " ~ 、 --------- Correct the metal sheet to make the diamond Crystal ^ 8, as described in the scope of the patent application for further grinding. _The diamond wafer grinding method described in the first transmission item, in which iron and stone wafers are brought under the control of a certain period of time and approach the metal sheet to grind the 9, Keep away from the metal sheet for a certain time. The workpiece is a diamond wafer polishing method described in the first transmission item, wherein the metal sheet is a process. Driven by the device, repeatedly approach and move away from the 10, as described in the first paragraph of the diamond wafer grinding method described in the first pass of the workpiece, its side is perpendicular to the row, and the side approaches the metal. The diamond wafer polishing method according to item 1 in the middle range of the sheet '1, driven by a transmission device, is close to the metal sheet, ▽ the mouth :: The diamond wafer polishing method according to item 1, A transmission device of his brother can move forward, backward and back and forth perpendicular to the direction of travel under the control of the control device. ㈣Metal sheet 1 3. According to the diamond wafer grinding method described in item 1 of the scope of the patent application, the machine has at least one cooling liquid ejection port ', which will spray cooling liquid to rinse and cool the metal sheet and the diamond wafer.