TWI228802B - Cavity down type package for avoiding the exposure of gold wire - Google Patents

Abstract

A cavity down type package for avoiding the exposure of gold wire is provided. The package includes a substrate, a passive component, a die, and a molding compound. The substrate has a cavity and a concave. The passive component is disposed in the concave. The die is disposed in the cavity. The die is electrically connected to the substrate through a number of gold wires. At least one of the gold wires goes across the concave. The molding compound covers the die and the gold wires. By disposing the passive component in the concave on the substrate, the height of the gold wire is reduced and the exposure of gold wires is avoided. The invention further has the advantages of shorten the length of the gold wire, improving the electrical properties of the gold wire, and lowering the cost.

Description

1228802

The present invention relates to a package, and more particularly to a Cavity Type (Wave Type) package that can prevent the gold wire from being exposed. [Technical field to which the invention belongs] [Prior art] Please refer to FIG. 1, which shows a side view of a conventional cavity-down type package. The conventional cavity-down type package 100 includes a substrate 102, a passive component 104, a die 106, a molding compound 110, and a plurality of solder balls ii2. . The substrate 100 has a crystal cavity 114 for receiving crystal grains. The passive element 104 is disposed above the first surface 10 of the substrate 102 and is close to the side of the cavity 114. The die 106 is electrically connected to the signal layer 118 on the substrate 02 through a plurality of gold wires 08. The colloid 10 is used to coat the crystal grains 106 and gold wires 108. The tin ball 11 2 is formed on the first surface 102 A of the substrate 102. Wherein, when the cavity-down type package 100 is to be arranged on a circuit board (not shown in the figure), the package 100 needs to be turned upside down 180 degrees before the package 100 is arranged on the circuit board. on. Since the passive component 104 is arranged beside the crystal cavity 114, when performing the wire bonding process, since the gold wire 108 must cross the passive element 104, the gold wire 108 must be pulled up. In order to avoid that the gold wire 108 touches the passive element 104, the gold wire 108 and the passive element 104 are short-circuited. However, an excessively high gold wire 108 may not be completely covered by the colloid 110, and a part of the gold wire 108 may be exposed outside the colloid 100. The exposed gold wire 108 will be affected by external moisture. In addition, the electrical characteristics of the exposed gold wire 108

TW1220F (Sun Moonlight) .ptd Page 7 1228802

The gun can also be deteriorated. [Summary of the invention] There is a bell here, and the exposed cavity faces a groove downward, which can expose the purpose. Features of the invention and reduced cost According to the present invention, a face-down package, a target package of the present invention. To achieve the advantage of making the golden thread more subtractive. The purpose is to include a substrate body. The substrate has a cavity and a recess to provide a way to reduce the height of the passive element and reduce the length of the gold wire, and to change a type that can avoid gold, a passive element, and the like. Grain system configurational connection. At least this grain with these gold threads. According to the present invention, a cavity-down-type package, a die, and a first side of a jig on the first side. In the hole, and adhere to the first side, the electrical connection is covered with crystal grains. In order to make the hair easier to understand, a slot is given below. The passive element is in a crystal cavity, and the crystal grain crosses the groove through one of a plurality of gold wires. And the other purpose of the item includes a colloid. Based on the proposal, an avoidable substrate and a heat sink plate have a first surface with a cavity and a groove. The heat sink is mounted on the heat sink. ’At least these gold wires. The above purpose of the preferred embodiment is placed in the groove. The crystal grains pass through one of a plurality of gold wires, spanning, characteristics, and advantages, and in combination with the drawings, can prevent the gold wires from being arranged on the substrate and the electrical wires of the gold wires from being exposed. The grain and a glue are arranged on the gold wire of the groove and the substrate. The electric gel coats the exposed gold wire, a passive element and a second surface. It is arranged on the substrate. The grain is arranged on the groove of the gold wire and the substrate. . And colloid can be more obvious

1228802 Fifth, the description of the invention (3) is as follows: [Embodiment] The present invention achieves the purpose of reducing the height of the gold wire and preventing the gold wire from being exposed by arranging the passive element in a groove on the substrate. For an example, please refer to FIG. 2, which illustrates a side view of a package-type package 200 that can prevent the gold wire from being exposed according to a first embodiment of the present invention. The cavity-down package 200 has a substrate 202, a passive element 204, a die 206, a colloid 210, and a solder ball 212. The substrate 202 has a first surface 202A and a second surface 202B opposite to each other, and the substrate 202 has multiple signal layers, such as a signal layer 218A on the first surface 202 and a signal layer 218B inside the substrate 202. A cavity 214 and a groove 216 are formed on the first surface 202A. The passive components 2 0 4 are arranged in the grooves 21 6. The grains 206 are arranged in the cavity 214, and the grains 206 are fixed on the bottom of the cavity 2 14 through the adhesive 220. The die 206 is electrically connected to the signal layer 218A on the first surface 202A of the substrate 202 through a plurality of gold wires, for example, the gold wires 208A and 208B. The gold wire 208A crosses the groove 208. The colloid 210 covers the die 206, the passive element 204, and all the gold wires. The plurality of solder balls 212 are disposed on the first surface 202A of the substrate 202. The passive component 204 in the groove 216 is electrically connected to the signal layer 218B. The passive element 204 is electrically connected to the signal layer 218B by, for example, soldering or conducting adhesive on the signal layer 218B. Depth of groove 216

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5. Description of the invention (4) It may be approximately equal to the depth of the crystal cavity 214, as shown in FIG. In addition, the depth of the groove 216 may be smaller than the depth of the cavity 214, as long as the passive element can be electrically connected to one of the plurality of signal layers in the substrate. Please refer to FIG. 2 and FIG. 3 at the same time, wherein FIG. 3 is a simplified top view of the substrate 202 of FIG. 2. The cavity 214 and the groove 216 are adjacent to each other, and the distance between them is small. The area of the bottom of the cavity 21 4 and the groove 21 6 corresponds to the area of the crystal grain 206 and the passive element 204. Since the passive element 204 is accommodated in the groove 216, the gold wire 208 A will not touch the passive element 204 during the wire bonding process. Therefore, when the wire bonding process is performed, the gold wire 208A does not need to be specially pulled up to avoid short circuit between the gold 208A and the passive component 204. Therefore, the height of the gold wire of the present invention can be reduced, so the gold wire of the present invention can be completely covered in the colloid U 0. Therefore, the gold wire of the present invention, which can be completely coated in the colloid 21, will be protected from the influence of external moisture and retain good electrical characteristics. For the second embodiment, please refer to FIG. 4 and FIG. 5. Among them, the drawing in FIG. 4 is a side view of the second embodiment of the present invention-a kind of crystal 400 which can prevent the gold wire from being exposed. The substrate 402 of FIG. 4 is simplified. Unlike the first embodiment, the cavity 414 and the groove 416 formed on the first surface 402A of the package are in communication with each other. In addition, as shown in FIG. 4, the groove 416 may be smaller than the crystal cavity 414, and the adhesive 420 is fixed at the bottom of the cavity 414. The passive element 416 is fixed to the groove 416. The bottom is electrically connected to the signal layer 418.

TW1220F (Sun and Moonlight) .Ptd Page 10 1228802 V. Description of the Invention (5) Embodiment 3 Please refer to FIG. 6, which shows the third type of the present invention, which can prevent the gold wire from being exposed downward. Side view of package 600. The third embodiment is different from the first embodiment in that the die 606 can be fixed on the heat sink 603 through the adhesive 620 to achieve a good heat dissipation effect. In detail, the package 600 has a substrate 602, a heat sink 603, a passive element 604, a die 606, a colloid 610, and a plurality of solder balls 612. The substrate 60 02 has a first surface 60 2A and a second surface 60 2B, and a cavity 614 and a groove 616 are formed on the first surface 60 2A of the substrate 60 02. The heat radiation sheet 603 is disposed on the second surface 602B of the substrate 602. The passive element 604 is disposed in the groove 616. The crystal grains 606 are arranged in the crystal cavity 614 and adhered to the heat sink 603. The die 60 is electrically connected to the first surface 602A of the substrate 602 through a plurality of gold wires, such as gold wires 608A and 608B. The gold wire 608A crosses the groove 616. The colloid 610 covers the crystal grains 60, the passive element 604, and all the gold wires. The solder ball 612 is disposed on the first surface 602 A of the substrate 602. The substrate 602 has a plurality of signal layers, such as a signal layer 618A on the first surface 602A of the substrate 602 and a signal layer 61 8B on the inside of the substrate. The passive element 604 in the groove 616 is electrically connected to the signal layer 608B. The cavity 61 4 is adjacent to the groove 6 1 6. The depth of the groove 6 1 6 is smaller than the depth of the cavity 61 4. Example 4

TW1220F (sun and moonlight) .ptd Page 11 1228802 V. Description of the invention (6) Please refer to the avoidable gold wire embodiment and the same. The lower package of the present invention can be effectively built in the body. The electrical characteristics of the hair can also reduce the resistance of the gold wire. After all, it is not necessary to use the essence of the present invention. The above facts, due to the reduction of Mingzhijin. Even if it is short, such as resistance, it is stated at the cost, although the passive line will be avoided by the example of limiting the scope of the god and the scope of protection. At this high level, the message can be promoted. The items that were later disclosed were reduced by the outside world and reduced by the shortened number. It has been shown in Figure 7 that the green display is a side view of an exposed cavity-down type package 700 according to the fourth embodiment of the present invention. The difference between the fourth embodiment and the third embodiment is that the cavity 714 and the groove 716 are in phase to prevent the exposed gold wire from being placed in the groove, and the height line of the gold wire can be completely covered with glue. Influence, and maintain a good gold thread, the required length of the δίΐ number of the gold wire to transmit the path length, degrading quality. In addition, the preferred embodiment of the shortening of the length of the gold wire is disclosed above. Those skilled in this art will not depart from various changes and retouches, so please define the scope of the patent as

1228802

Brief Description of the Drawings [Simplified Illustration of the Drawings] Figure 1 is not a side view of a traditional cavity-down type package. = 2 Figure 2 illustrates a method to prevent the gold wire from being exposed according to a first embodiment of the present invention. A side view of the cavity-down type package; 'FIG. 3 is a simplified top view of the substrate of FIG. 2; FIG. 4 is an exposed cavity of the second embodiment of the present invention A side view of a downward-facing package; FIG. 5 is a simplified top view of the substrate of FIG. 4; FIG. 6 is a view of a third embodiment of the present invention, which can prevent the gold wire from being exposed. A side view of the down-type package; and FIG. 7 is a side view of a down-type package that can prevent the gold wires from being exposed, according to the fourth embodiment of the present invention. Description of drawing symbols 100, 200, 400, 600, 700: Packages 102, 202, 402, 602: Substrates 102A, 202A, 402A, 602A: First side 402B, 604B: Second side 104, 204, 404, 604 : Passive element 106, 206 ^ 406, 606: Die 108, 208A, 208B, 608A, 608B: Gold wire 110 > 210 > 610: Colloid 11 2, 2 1 2, 61 2 •• Ball 114, 214 , 414, 614, 714: Crystal Cavern

TW1220F (say moonlight) .ptd Page 13 1228802 Brief description of the diagrams 216 118 220 416, 616, 716: grooves 218A, 218B, 418, 618A 420, 620

TWH20F (Sun Moonlight) .ptd Page 14

Claims (1)

1228802 VI. Scope of patent application 1. A Cavity Down Type package that can prevent the gold wire from being exposed 'includes: a substrate with a cavity and a four slot; a passive component' Is arranged in the groove; a die is arranged in the cavity, the grain is electrically connected to the substrate through a plurality of gold wires, and at least one of the gold wires crosses the A groove; and a colloid (Molding Compound) covering the crystal grains and the gold wires. 2. The package according to item 1 of the scope of patent application, wherein the cavity is adjacent to the groove. 3. The package according to item 1 of the scope of patent application, wherein the cavity is in communication with the groove. For example, if the scope of patent claim 4, it has a plurality of signal layers, and the passive component is connected to one of these signal layers. 5. The package according to item 1 of the scope of patent application, wherein the package further has a plurality of solder balls, and the substrate has a first surface and a second surface opposite to each other: 豸 grains pass through the gold The wire is connected to the first surface of the substrate; the property = is connected, and the solder balls are arranged on the first surface of the substrate. The package according to item 1 of the patent range of Deep 6 products, wherein the ice degree of the groove is smaller than the depth of the cavity. The package as described in the scope of patent application item !, wherein the groove TW1220F (Sun Moonlight) .ptd Page 15 1228802 VI. The depth of the scope of patent application is approximately equal to the depth of the cavity. 8. · A Cavity Down Type package that can prevent the gold wire from being exposed, including: a substrate having a first side and a second side, and a cavity and A groove; a heat sink 'is disposed on the second surface of the substrate; a passive element' is disposed in the groove; a die is disposed in the crystal cavity and is adhered to the heat sink The crystal grains are electrically connected to the first surface of the substrate through a plurality of gold wires, at least one of the gold wires spans the groove; and a gel coats the crystal grains and the gold wires . 9-The package as described in item 8 of the patent application, wherein the cavity is adjacent to the groove. 10. The package according to item 8 of the scope of patent application, wherein the cavity is in communication with the groove system. 11. The package according to item 8 of the scope of patent application, wherein the substrate has a plurality of signal layers, and the passive element is electrically connected to one of the signal layers. 12. The package according to item 8 of the scope of application for a patent, wherein the package further has a plurality of solder balls, and the solder balls are arranged on the first surface of the substrate. 13. The package according to item 8 of the scope of patent application, wherein the depth of the recess is smaller than the depth of the cavity.