TWI227939B - Encapsulated structure of COF (chip on film) - Google Patents

Abstract

A encapsulated structure of COF (chip on film), including base membrane, a plural of metal conducting wires, chip, first metal plate, and second metal plate. The first metal plate is formed on the surface of base membrane, metal conducting wire is formed on the surface of membrane and located outside the two sides of first metal plate, and at least a metal conducting wire is electrically connected to the first metal plate. Chip has an active surface with multiple bumps thereon that bump is electrically connected to metal conducting wire to make chips allocate on the surface of membrane. The second metal plate is allocated on active surface and is at least electrically connected to one bump. The second metal plate and first metal plate form a capacitor.

Description

1227939 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a COF packaging structure, and the chip on film (chip on film) between the two metal electrodes is related to- Wafer and substrate thin film structure. M as a thin-film sticky-crystal packaging junction for internal capacitors. [Previous technology] In the case of a packaged wafer that becomes a thin film, the use of organic substrate = process, its special substrate. It is automatically named as a female through the film. Set the daily Japanese film (1 g, TAB) in a continuous-loading process, and the batch of operations on the t4 brain is performed in batches to seal the clothing and install the Japanese daily film on the base film. Please refer to FIG. 1A and FIG. 1B at the same time. FIG. 1A shows a top view of a traditional thin-film sticky-crystal packaging structure. The section line 1B-1B of FIG. 1β ′ shows the thin-film adhesive 1 ^ 苐 1Α Figure 1 A FI m R "Cross-sectional view of the package structure. In Figure 1A and Figure t, the ㈣bond crystal package structure 1 (): = mide, PI) film 12, chip 14 and several copper two = 16. The Chengimine film 12 has—the film surface center and the film sides m and 12c, the copper rhenium wires 16a and 16b are arranged at two ends of the film surface lja in a spaced manner. The copper foil wire 16a is formed by the film surface 12a The central area of the film extends to the side of the film 12b, and the copper foil line 6b extends from the central area of the film surface 2a to the side of the film 12c. Among them, the copper box wires "a and 16b are near the film surface 丨 2a One end of the central area is the connecting bump end,

1W1240F) .ptd page 5 1227939 Description of the invention and the copper bumps 16a and 16b are connected at a distance from each other by a distance. The sheet 14 has an active surface 14 & there are several inPut / output aluminum pads on both ends of the active surface 14a, and there are several gold bumps on the -I / O The bumps 18a and 18b. The bumps 18a and 18b are used to connect the copper bumps 16a and 16b to the bump ends of the copper foil wires, respectively, and make electrical connections, so that the chip 14 is disposed on the polycrystalline silicon with the active surface 1 4 ^ facing the film surface 12a. On the imine film 12. ¥ 1A Picture of the film sticky crystal packaging structure 1 〇 When configured on a printed circuit board, at least one additional capacitor c is usually installed on the printed circuit board, as shown in Figure 1 (: === capacitor C can be used as an external device, for example). The Vcc power supply provides ⑽ current to the chip's buffer element that can be used for 4 days, to prevent the current carrying high-frequency noise from entering the chip i 2 'or to serve as an energy tank (energy tank) to supply the instantaneous high current needs ^ ^ to maintain the 12 Normal operation. Of course, this capacitor can be external: Cui Li, (c 1 ck) howl enters the chip 14 before a buffer element, in order to reduce electromagnetic interference (EMI) The chip package structure 10 operates smoothly, and the printed circuit has a sufficient area to place capacitors. In the 1/0 soldering chip of the chip :: 2 meshes and the trend of denser 'positioned in thin-film sticky chip package ti :: The more capacitors there are, the more printed circuit boards are used for placement. The area of the board must be larger, and the cost of purchasing or manufacturing printed circuit boards will increase a lot. [Contents of the Invention]

TW1240F Yijing) .ptd Page 6 1227939 V. Description of the invention (3) In view of this, this package structure. It is designed to be an internal capacitor. When the circuit board is brushed, the cost of the printed circuit board does not need to be reduced. According to the present invention, at least the base film and the second metal electrode are included. The wire system is formed on the film surface with a plurality of bumps, and is connected so that the wafer is above the main film. The objects and substrates of the first gold invention can be used on the printed film circuit board between the film and the area to be used for printing, and the purpose is to reduce the number of metal wires and the substrate surface. These bumps are electrodes on the moving surface and provide a thin-film sticky crystal configuration. Two metal electrodes are used as a packaging structure to be placed on the external capacitor of the printed women's clothing, so that the industry can purchase or manufacture printed two thin, sticky crystal packages. Structure, the wafer, the first metal electrode has a sheet with a method for matching the metal electrode to the thin film surface according to the structure, at least the sheet and the second system are formed to be thin and located on the second wire for the active surface to be electrically disposed. The wafer is used to form a base metal sheet including the present invention. A metal sheet on the surface of the film is connected to both ends of the first gold, and is on the surface of the second metal film on the film surface. These metal conductive surfaces, and the active surface are electrically connected to the metal wires. The first metal electrode and the second capacitor are separated from each other and between the base film and the base film, and a base film. The gold on both sides of the external chip has several properties such that the wafer is above the surface. A kind of thin film sticky crystal package junction, chip, and first metal metal wire have a thin film, which is a wire system, and these metals are connected. The wafer bumps have an active surface, a second metal sheet surface, and the first metal sheet is formed on the film surface. At least one metal of the wire has an active surface. The bumps are used to connect the gold to the first metal sheet. With the first metal piece

TW1240F Reliance View) .ptd Page 7 1227939 Another target film, binding piece of a metal sheet. These metal electrical connection blocks on the surface of the base film are on the active surface metal fins and are electrically connected to each other, and are arranged on the active surface for the above purposes, characteristics, and advantages of these bumps. Example, and with the attached wafer, the film surface sheet is equipped with a metal rotating surface metal guide method with a fin phase of the second gold opening π the first gold fifth, the description of the invention (4) separated and opposite sides. The second metal sheet, the first metal sheet, and the structure according to the present invention include at least a base fin and a second metallic wire system formed on the surface, and are located on at least one metal wire surface with a plurality of protrusions, so that the wafer is a thin film. Above. The second is disposed on the active surface to form a capacitor with the opening of the at least one bump metal fin. In order to make the present invention understandable, the following enumeration is specifically described as follows: Above, at least one of the bumps forms a capacitor. A thin metal wire is proposed. The bottom film has a thin upper surface. First metal fin between wires, first. The wafer has a main bump to surround the film-facing surface with the bumps of the first metal. The second metal fin, two metal scales, and the first metal are electrically connected to the bump by the bumps and bumps. The gold is placed on the thin sheet for the age. Active: The wire is electrically connected to the base compartment. The method belongs to the fin system and the first to the fin system. The points can be more clearly and easily illustrated. [Embodiment] The present invention particularly provides a thin film viscous crystal (chi ρ ο nf 彳 τ. 11 in 5 C 〇p

Packaging structure, which is configured in the space between the wafer and the base film > Γ electrode to form an internal capacitor design, can be bonded in a thin film & two gold

TW1240F Reliance) _ Page 8 1227939

The structure is configured on the printed circuit 柘 ^ ^ ^ ^ capacitor, which can reduce the printed circuit board mounting external F ^ HP ^ »ί Φ circuit board use area, and reduce the cost of purchasing the second printed circuit board. How to arrange the orientation? Each η Λ is known and included with the package. All the iLu electrodes are in accordance with the separation and relative to the previous Japanese-Japanese-style packaging structure. Example 2 The illustration of the attached drawings will show that In the example of implementation and the first embodiment, as shown in Figs. 2A to 2B, Fig. 2A shows an exploded top view of the thin film sticky crystal packaging structure according to the present invention = Example 1. It is an exploded cross-sectional view of the thin film viscous seal I as viewed along the section line 2B-2β of FIG. 2A. In FIGS. 2A to 2B, the thin-film sticky-crystal package junction: 10 to 10 includes a base film 2 1 2, a wafer 2 1 4, a plurality of metal wires 2 1 6 and two metal electrodes, for example, the two metal electrodes are the first Among the metal sheet 232 and the second metal sheet 234, the 'base film 212 has a film front surface 212a, and the first metal sheet 232 and the metal wires 216 all form the film surface 21 ". In addition, the metal wires 2 1 6 It is symmetrically located outside the two sides of the first metal sheet 2 μ, and one metal sheet 232 is used to electrically connect with one of the metal wires 2 ΐ β and one metal wire. The chip 214 has an active surface 214a, the active surface There are several bumps 218 on both ends of 21 4a. These bumps 218 are used to electrically connect the 2U electrical lines. The second metal sheet 234 is connected to the first metal sheet '2 =. Are arranged on the active surface 214a in a relative and opposite manner and are surrounded by these bumps

1227939 V. Description of invention (6) 218. The second gold and bump are electrically connected. In addition, 4 is used to be electrically connected to at least one of these bumps 2 1 8. The first metal sheet 2 3 4 of the mine cannot be connected to any of the bumps 2 1 8) (not shown in 2a). One of the metal pads in 214 (pad closed, brother 2A ~ 2B in the picture). The Tianji bump 218 is welded with the two 乂 of the first all-in-one piece 丨 216 and is electrically far from both sides of the second piece 2 32. The way of the metal wire and the metal piece 232: the chip 214 faces the first piece 234 and the first gold with the active surface 214a; the piece is on the film surface 212a 'and the second metal is shown. The piece 232 forms a capacitor, as 3A ~ 3B on the road, rb;: Electricity "The Japanese-style package structure is arranged at 21 ° outside the printed circuit and then added." The film adhesive crystal package has a lot of advantages. | The cost of the industry in purchasing shells or manufacturing printed circuit boards The second embodiment of the present invention is the same as: 4A ~ 4β, which are respectively shown in accordance with the second embodiment of the present invention. For the thin-film sticky-crystal package structure, see the 8 μm thin-film sticky-crystal package structure. The difference lies in the structure of the two metal electrodes of the capacitor to be formed. Orientation. That is, the present invention designs two metal electrodes as a first metal fin 432 and a second metal fin 434. As for the thin-film sticky-crystal packaging structure of this embodiment, the remaining constituent elements are implemented. Example 1 of a thin film sticky crystal package structure 2 丨 〇 of

1227939 V. Description of the invention (7) The constituent elements are the same and will not be repeated here. = As shown in FIG. 4A, the first metal fin 432 is disposed on the surface of the film. The first metal fin 432 is located between the metal wires 216, and the first metal * fin 432 is used to electrically connect the metal wires 216. The eleventh piece of metal 434 is arranged on the active surface of the wafer 214 in a manner separated from the first piece of = 432. 2: Ray: 218 surrounds the fth metal fin 434 to be connected with at least the -bump 218 connection. In addition, the second metal binding piece 434 does not need to be electrically connected to any of the bumps, and it can be electrically connected to the metal pad 214 in the chip 214-metal pad (in the figure, ~ 4β). As shown in FIG. 4B, when the wafer 214 is on the bottom film 212, the openings of the first metal fin 432 and the second metal fin are opposite to each other, and the first metal fin 432 and the second metal fin 432 are opposite to each other and Separately, such as the first and second metal fins and the second metal fin 434 are formed, so 'the first-metal fin ^ is used for t: the second metal fin can also be directly disposed on the surface of the film, and one less metal wire is electrically Sexual connection. It should be noted that {, the first metal, the metal wire connected to the sheet, and the metal wire are different. / Bay /, the gold connected to the first metal fin can also be arranged on the active surface of the chip. The connected bump must be the same as the bump Γ connected to the second metal Korean sheet. PI is not limited, PI )thin. Among them, those skilled in the art can also understand the technology of the present invention. For example, the base film is a polyimide film. The metal wires are several copper I wires, and the bumps are several gold bumps.

1227939 V. Description of the invention (8) The material of the first metal sheet, the second metal sheet, the first metal fin and the second metal fin may be copper, gold, under bump material or other applicable materials Of conductive materials. In addition, the thin-film sticky-crystal packaging structure can further arrange an insulating substance between the first metal sheet and the first metal sheet or the first metal Korean sheet and the second metal sheet, and the insulating substance is air or resin. . In addition, the thin-film sticky-crystal packaging structure can cover a metal layer and a film surface other than the chip with a cover layer. The cover layer J is a solder mask. . In the present invention, the thin-film sticky crystal packaging structure disclosed in the embodiment has two metal electrodes arranged between the wafer and the base film as an internal design. When the thin-film sticky-crystal sealing structure is arranged on a printed circuit board, External capacitors need to be installed on the printed circuit board, which can reduce the use area of the printed circuit board, and reduce the cost of purchasing or manufacturing printed circuit boards. In summary, the invention has been disclosed as above with a preferred embodiment, but it is not intended to limit it. Anyone who is familiar with this skill, within the spirit and scope of the company, can owe you ^ without departing from this The essence of the invention ^ Tian can be used as a protection for all kinds of mobile phones. The scope of protection is subject to the change of 4 *, which is defined by the scope of the patent application as protected by Ben Laming. quasi. 1,

TW1240F) .ptd Page 12 1227939 Brief description of the drawings [Simplified description of the drawings] Figure u shows the traditional thin-film sticking crystals. Figure shows the top view along the cross-section of Figure 1A. Sticky crystal, cross-sectional view of package structure. 、、、 ～ 1B The top view of the structure of the thin film mounting structure plus an electric device according to the present invention is shown in Figure 1C. Figure 1C is a top view of the state of the thin film sticking valley in Figure i A. . Flying seal Figure 2A shows an exploded top view of the package structure. Figure 2B shows an exploded cross-sectional view of the sticky-crystal package structure along the section of Figure 2A. The film viewed by 2B Figure 3A shows the film adhesive view of Figure 2A. Combination of eight package structures Figure 3B shows the thin-film die-attach plane view of Figure 2β. Combined Section of Flying Package Structure FIG. 4A shows an exploded top view of the mounting structure according to the implementation of the present invention. First, the thin film sticky crystal seal Figure 4B shows a combined top view of the mounting structure according to the present invention. The component fins of the thin film viscous crystal seal of y, Figure 4C "is the first three-dimensional view of the figure". 6 and the second description of the figure 10, 210, 410 ··························· Structure

TW1240F) .ptd Page 13 1227939 Brief description of the drawings 12a, 212a: film surface 12b, 12c · film side 1 4, 2 1 4: wafer 14a, 214a: active surface 16a, 16b: copper foil wire 18a, 18b: gold bump 2 1 2: base film 2 1 6: metal wire 2 1 8: bump 232: first metal sheet 234: second metal sheet 432: first genus fin 434: second metal fin

TW1240F Reliance) .ptd Page 14

Claims (1)

1227939 VI. Scope of patent application 1. A thin-film sticking type (chip on structure, including at least: a base film, having a plurality of metal wires on the surface of the thin film, formed on the surface, and connecting to the thin 'C0F) Packaging a wafer 'has an active surface bump, which is used to make the wafer over the active surface and the base film; and on the film surface; the active surface has some metal wire electrical film surfaces. Way and the second structure, the wire electric bump structure 3. the structure, the metal conductor 4 · structure, the bump 5. structure, the metal sheet a first metal electrode and a second metal bottom film configuration The first metal electrode and the second metal electrode are electrically connected to each other, and the second metal electrode is electrically connected to the chip and the base two metal electrode to form a capacitor. As described in item 1 of the scope of the patent application, the two metal wires of the first metal electrode and the second wire are electrically connected. The first metal electrode and the second two bumps are electrically connected as described in item 1 of the scope of the patent application. As described in item 1 of the scope of the patent application, the first metal electrode system is configured. The first metal sheet is located between the electrodes, and the phases are between the phases. There is a plurality of individual connections between the thin-film sticky crystal metal electrodes of the bumps and the thin-film sticky crystal metal electrodes. The metal wires on the surface of the thin film have a plurality of individual connections. Tie at least one metal to at least _ the package junction and the package junctions and the package junctions first, and the first 1227939 VI. Scope of patent application The two-metal electrode system and the metal sheet are structured as described above, wherein the first metal binding sheet and the second metal are structured as described above, and the base film is incorporated as described above. 8. Rushen 1 structure, of which 9. Rushen 1 structure, of which 10. 10. Rushen structure 'where the 11th. Rushen structure, where the 1 2 · Rushen structure, where the thin one is insulated物 electrode. 13 · Rushen, of which the absolute 14. 14. Rushen The second metal sheet is disposed on the active surface and surrounded by bumps. : The thin film viscous sealing tape company described in the second item-j belongs to the second metal j ,,,. -The second metal slit 2 is-the openings of the first fin are opposite to each other. The opening of the genus is ten W. The film sticky crystal seal of the betintin fan | The bottom binding win is a poly drunk · (1 · ♦ 0imine (polyimide, pj t patent scope of the first range of the metal wire is plural For the copper Γ patent scope, the bump mentioned in the first item is a thin film sticky crystal packaging box line with a plurality of gold bumps. For thin film sticky crystal packaging thin junctions, please refer to the thin film sticky crystal agency described in item i of the patent scope. : The material of the metal electrode is copper or gold.% The material of the thin-film sticky crystal-type sealed metal electrode described in item 1 of the patent scope is copper or gold. \ ~ Please use the thin-film sticky crystal of item i in the patent scope. The film-bonded crystal packaging structure at the package type further includes: x ... negative 'is disposed on the first metal electrode and the second metal, and the thin-film adhesive-type edge-sealing substance described in item 2 of the patent scope is air. Please refer to the scope of the patent for the thin film adhesive crystal package junction described in item 2 1227939 6. The scope of the patent application structure, wherein the 15. such as the structure, wherein the one of the overlaid wafer 16. 16. a substrate a first plural The first metal piece is obtained by a plurality of bumps with the first wafer The sheet is arranged on the sheet in a second form on the sheet surface to be used with the and the first gold. An insulating substance is the film sheet of the first layer of the cover layer of the patent application for the scope of the patent application. A kind of thin-film sticky crystal sealing film has a thin, line-forming, and outer-shaped shape. These electrically connected metal pieces on both sides of the metal sheet have a metal sheet, and the metal sheet has active projections; the metal sheet actively shows some bumps. The sheet system is a kind of thin film between a plurality of metal guides and a first metal fin. These metal wires have an active surface bump for surface-to-face contact with the surface and at least _ to form an electro-adhesive crystal seal with a Thin wires, tie-shaped pieces, are equipped with the first gold. The thin-film sticky crystal package junction structure described in item 1 further includes: 'It covers the metal wires and the surface. The structure is at least including · The surface of the film; on the surface of the film; formed on the surface of the film and located on at least one surface of the metal wire, and the two surfaces of the active surface are electrically connected with the metal wires so that the first One The metal sheet is arranged in a manner that the first metal sheet is surrounded by the bumps opposite to each other, the second metal bump is electrically connected, and the second metal sheet contains a mounting structure, including at least: a film surface; Formed on the surface of the film; placed on the surface of the film and located on the genus II sheet to be used with the metal wires Page 17 1227939 6. The scope of the patent application is at least one metal wire is electrically connected; a chip has an active surface, the active surface has a plurality of bumps, and the bumps are used to electrically connect with the metal wires, So that the chip is disposed on the base film such that the active surface faces the film surface; and a second metal fin is disposed on the active surface in a manner separated from the first metal fin and is The second metal fins are surrounded by the bumps, and are electrically connected to at least one of the bumps. The openings of the second metal fins are opposite to the openings of the first metal fins. The second metal fin and the first metal fin form a capacitor. TW1240F) .ptd p.18