1221105 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（1 ) 【發明所屬之技術領域】 本發明爲關於半導體晶圓用硏磨墊及具備其之半導體 晶圓用硏磨多層體以及半導體晶圓之硏磨方法。更詳細爲 關於不使硏磨性能降低，可以透過光，藉由透過光能夠容 易檢測硏磨終點之半導體晶圓用硏磨墊及具備其之半導體 晶圓用硏磨多層體以及利用其之半導體晶圓之硏磨方法。 【習知技術】 在半導體晶圓之硏磨中，達成硏磨之目的以結束該硏 磨之硏磨終點的決定，可以以由經驗上所獲得之時間爲基 準而進行。但是，構成被硏磨面之材料爲各式各樣，依據 那些材料，硏磨時間完全不同。另外，構成被硏磨面之材 料今後可以想像有各種之變化。進而，在使用於硏磨之漿 料和硏磨裝置也相同。因此，在種種不同之硏磨中，想要 由各各全部獲得硏磨時間，效率上非常差。對於此，近年 來例如關於被揭示在日本專利特開平9 - 7 9 8 5號公報 以及日本專利特開2 0 0 0 - 3 2 6 2 2 0號公報等之利 用可以直接測量被硏磨面的狀態的光學方法的光學式終點 檢測裝置及方法的硏究正被推展。 在此光學式終點檢測裝置及方法中，一般例如被揭示 在曰本專利特表平11 一 512977號公報等，在硏磨 墊形成由以終點檢測用光可以透過之硬質而均勻的樹脂所 形成之不具有硏磨能力的窗，只通過此光以測量被硏磨面 。此窗不具有硏磨能力，不具備漿料粒子的吸收、輸送之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---------辦衣----Γ--1T------於 (請先閲讀背面之注意事項再填寫本頁) -4- 1221105 A7 B7 五、發明説明（2 ) 本質上的能力。 (請先閲讀背面之注意事項再填寫本頁) 但是，在上述之硏磨墊中，因窗不具有硏磨能力故， 因設置窗有硏磨墊的硏磨性能降低之虞。另外，本質上不 具有漿料之保持、排出能力，因此，由於設置窗，有產生 不均勻化之虞。因此，使窗變大、增加窗的數目、設置爲 環狀有其困難。 【發明槪要】 本發明爲解決上述問題者，目的在提供於利用光學式 終點檢測裝置之半導體晶圓的硏磨中，不使硏磨性能降低 ，可以使終點檢測用光透過之半導體晶圓用硏磨墊及具備 其之半導體晶圓用硏磨多層體以及半導體晶圓之硏磨方法 0 經濟部智慧財產局員工消費合作社印製 本發明者們就被使用於利用光學式終點檢測裝置之硏 磨的半導體晶圓用硏磨墊進行檢討，發現即使不具備如習 知般之由透明度高的樹脂所形成的小窗的硏磨墊，構成硏 磨墊之素材本身如具有透過性，窗部可以確保充分的透過 性，利用該種硏磨墊，可以藉由光學式終點檢測器檢測硏 磨終點。另外，因在構成硏磨墊之基塊中含有內含物故， 即使產生光的散射，也發現可以確保充分的透光性。 另外，發現：本質上即使不具有漿料的保持、排出能 力之硬質均勻的樹脂，如將具有透光性的透光性構件當成 窗使用，也可以確保充分之透光性，利用該種硏磨墊，可 以檢測硏磨終點。而且，發現：藉由使用以水溶性粒子與 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -5- 1221105 A7 _ B7 五、發明説明（3 ) 分散、含有此水溶性粒子之基塊材料等所構成之窗，在硏 磨時，可以具有漿料的保持、排出能力。 (請先閲讀背面之注意事項再填寫本頁) 本發明爲基於此種見識所完成者。 1 _ 一種半導體晶圓用硏磨墊，其特徵爲：具備：非 水溶性基塊材料、與被分散在該非水溶性基塊材料中之水 溶性粒子，具有透光性。 2 ·如上述1所記載之半導體晶圓用硏磨墊，其中在 厚度設爲2 m m之情形，波長4 0 0〜8 0 0 n m之間的 任一種的波長之光的透過率在0 · 1 %以上，或者波長 4 0 0〜8 0 0 n m之間的任一種的波長帶的累積透過率 在0 · 1 %以上。 3 ·如上述2所記載之半導體晶圓用硏磨墊，其中具 有薄肉部，終點檢測用光透過該薄肉部。 4 ·如上述3所記載之半導體晶圓用硏磨墊，其中上 述非水溶性基塊材料之至少其中一部份爲架橋聚合物。 5 ·如上述2所記載之半導體晶圓用硏磨墊，其中上 述非水溶性基塊材料之至少其中一部份爲架橋聚合物。 6 ·如上述5所記載之半導體晶圓用硏磨墊，其中上 經濟部智慧財產局員工消費合作社印製 述架橋聚合物爲1, 2 -聚丁二烯。 7 · —種半導體晶圓用硏磨墊，其特徵爲：具備：具 有貫穿表裡的貫穿孔的硏磨墊用基體、與被嵌合在該貫穿 孔內之透光性構件，該透光性構件由包含：非水溶性基塊 材料、與被分散在該非水溶性基塊材料中之水溶性粒子所 形成。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -6 - 1221105 A7 __ _B7_ 五、發明説明（4 ) (請先閱讀背面之注意事項再填寫本頁) 8 .如上述7所記載之半導體晶圓用硏磨墊，其中上 述透光性構件爲··在設厚度爲2 m m之情形，波長4 0 0 〜8 〇 〇 n m之間的任一種的波長之光的透過率在〇 . i %以上，或者波長4 0 0〜8 0 0 n m之間的任一種的波 長帶的累積透過率在0.1%以上。 9 ·如上述8所記載之半導體晶圓用硏磨墊，其中上 述透光性構件被薄肉化。 1 0 ·如上述9所記載之半導體晶圓用硏磨墊，其中 上述非水溶性基塊材料之至少其中一部份爲架橋聚合物。 1 1 ·如上述8所記載之半導體晶圓用硏磨墊，其中 上述非水溶性基塊材料之至少其中一部份爲架橋聚合物。 1 2 ·如上述1 1所記載之半導體晶圓用硏磨墊，其 中上述架橋聚合物爲被架橋之1， 2-聚丁二烯。 1 3 · —種半導體晶圓用硏磨多層體，其特徵爲：具 備：具有非水溶性基塊材料、與被分散在該非水溶性基塊 材料中之水溶性粒子之硏磨墊、以及被積層在該硏磨墊的 裏面側之支持層，在積層方向具有透光性。 經濟部智慧財產局員工消費合作社印製 14 · 一種半導體晶圓用硏磨多層體，其特徵爲：具 備：具有貫穿表裡的貫穿孔之硏磨墊用基體、與被嵌合在 該貫穿孔內之透光性構件，該透光性構件具備··由包含非 水溶性基塊材料、與被分散在該非水溶性基塊材料中之水 溶性粒子所形成之硏磨墊、以及被積層在該硏磨墊的裏面 側的支持層，在積層方向具有透光性。 1 5 · —種半導體晶圓之硏磨方法，其特徵爲：利用 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 ___ B7 五、發明説明（5 ) (請先閲讀背面之注意事項再填寫本頁) 具備：非水溶性基塊材料、與被分散在該非水溶性基塊材 料中的水溶性粒子而具有透光性的硏磨墊，硏磨半導體晶 圓，利用光學式終點檢測器進行該硏磨終點的檢測。 1 6 · —種半導體晶圓之硏磨方法，其特徵爲：利用 具備：具有貫穿表裡的貫穿孔的硏磨墊用基體、與被嵌合 在該貫穿孔內之透光性構件，該透光性構件由包含：非水 溶性基塊材料、與被分散在該非水溶性基塊材料中之水溶 性粒子所形成之硏磨墊，硏磨半導體晶圓，利用光學式終 點檢測器進行該硏磨終點的檢測。 1 7 . —種半導體晶圓之硏磨方法，其特徵爲：利用 具備：具有非水溶性基塊材料、與被分散在該非水溶性基 塊材料中之水溶性粒子的硏磨墊、以及被積層在該硏磨墊 之裏面側的支持層，在積層方向具有透光性之硏磨多層體 ，硏磨半導體晶圓，利用光學式終點檢測器進行該硏磨終 點的檢測。 經濟部智慧財產局員工消費合作社印製 1 8 · —種半導體晶圓之硏磨方法，其特徵爲：利用 具備：具有貫穿表裡之貫穿孔之硏磨墊用基體、與被嵌合 在該貫穿孔內之透光性構件，該透光性構件具備：由非水 溶性基塊材料與被分散在該非水溶性基塊材料中之水溶性 粒子所形成之硏磨墊、以及被積層在該硏磨墊之裏面側的 支持層，在積層方向具有透光性之硏磨多層體，硏磨半導 體晶圓，利用光學式終點檢測器進行該硏磨終點的檢測。 【發明之效果】 -8- 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） 1221105 A7 _B7____ 五、發明説明（6 ) (請先閱讀背面之注意事項再填寫本頁) 如依據第1以及第2觀點之發明的半導體晶圓用硏磨 墊、以及半導體晶圓用硏磨多層體，在硏磨之際，可以不 使硏磨性能降低，能夠容易進行硏磨終點的光學式檢測。 特別是如依據第1觀點之發明的硏磨墊，在硏磨中，關於 其之整體，不單是硏磨終點，可以經常光學地觀察硏磨狀 況之全部。 如依據本發明之半導體晶圓之硏磨方法，可以一面掌 握硏磨狀況，一面有效率地硏磨半導體晶圓，另外，不會 有過度硏磨。 【發明之詳細說明】 第1觀點之發明的半導體晶圓用硏磨墊（以下，也有 單稱爲「硏磨墊」），其特徵爲：具備非水溶性基塊材料 、與被分散在此非水溶性基塊材料中之水溶性粒子，具有 透光性。 經濟部智慧財產局員工消費合作社印^ 構成本發明之第1觀點的發明之半導體晶圓用硏磨墊 之上述「非水溶性基塊材料」，具有維持硏磨墊之形狀， 在硏磨墊中保持水溶性粒子之任務。 形成此非水溶性基塊材料的材料，只要是在硏磨墊賦 予透光性者即可，並不特別限定，可以舉出：熱可塑性樹 脂、熱硬化性樹脂、彈性體以及橡膠等。這些可以單獨使 用1種或者組合2種以上而使用。 上述熱可塑性樹脂，例如可以舉出：聚烯系樹脂、聚 苯乙烯系樹脂、（間）丙烯系樹脂等之聚丙烯系樹脂、除 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） -9 - 1221105 A7 ___B7_ 五、發明説明（7 ) (請先閱讀背面之注意事項再填寫本頁) 了聚丙烯樹脂之乙烯酯樹脂、聚酯系樹脂、聚醯胺系樹脂 、氟樹脂、聚碳酸酯樹脂、聚縮醛樹脂等。這些可以單獨 使用1種或者組合2種以上而使用。 另外，上述熱硬化性樹脂，例如可以舉出：酚樹脂、 環氧樹脂、不飽和聚酯樹脂、聚亞胺酯樹脂、聚亞胺酯. 尿素樹脂以及尿素樹脂、矽系樹脂等。這些可以單獨使用 1種或者組合2種以上而使用。 上述彈性體可以舉出··苯乙烯· 丁二烯•苯乙烯嵌段 共聚物（SBS)、其之氫添加嵌段共聚物（SEBS) 等之苯乙烯系彈性體、聚烯彈性體（T P 0 )、熱可塑性 聚亞胺酯彈性體（T P U )、熱可塑性聚酯彈性體（丁 P EE)、聚醯胺彈性體（TPAE) 、1, 2 —聚丁二烯 等之二烯系彈性體等之熱可塑性彈性體、矽樹脂系彈性體 、氟樹脂系彈性體等。這些可以單獨使用1種或者組合2 種以上而使用。 經濟部智慧財產局U貝工消費合作社印製 另外，橡膠可以舉出：丁二烯橡膠、苯乙烯· 丁二烯 橡膠、異戊間二烯橡膠、異丁烯•異戊間二烯橡膠、丙烯 基橡膠、丙烯腈•丁二烯橡膠、乙烯•丙烯橡膠、乙烯· 丙烯•二烯橡膠、矽橡膠、氟橡膠等。這些可以單獨使用 1種或者組合2種以上而使用。 這些材料也可以藉由酸酐基、羧基、羥基、環氧基以 及氨基等而被變性。藉由變性可以調節水溶性粒子和磨粒 、水系媒體等之親和性等。另外，這些被變性的材料也可 以組合2種以上而使用。 -10- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 B7 五、發明説明（8 ) 另外，上述非水溶性基塊材料也可以爲架橋聚合物， 也可以爲非架橋聚合物，但是其中至少其中一部份爲架橋 聚合物爲佳。又，上述非水溶性基塊材料在由2種以上的 材料所形成之情形，某1種之至少其中一部份如爲架橋聚 合物即可。 藉由使上述非水溶性基塊材料之至少其中一部份具有 架橋構造，可以對硏磨墊賦予彈性恢復力。因此，可以將 由於硏磨時施加在硏磨墊之應力所造成之變形壓抑得比較 小，能夠防止在硏磨時以及修整時，非水溶性基塊材料被 過度延伸而塑性變形，水溶性粒子溶解或者脫離所形成之 細孔被埋住。另外，也可以防止硏磨墊之表面過度起毛。 因此，硏磨時之漿料的保持性良好，由修整所造成之漿料 的保持性之恢復也容易，進而，也可以防止龜裂之產生。 上述架橋聚合物可以舉出：使聚亞胺酯樹脂、環氧 樹脂、聚丙烯基樹脂、不飽和聚酯樹脂、除了聚丙烯基樹 脂之乙烯酯樹脂等之樹脂，和1, 2-聚丁二烯等之二烯 系彈性體、丁二烯橡膠、異戊間二烯橡膠、丙烯基橡膠、 丙烯腈•丁二烯橡膠、苯乙烯•丁二烯橡膠、乙烯•丙烯 橡膠、矽橡膠、氟橡膠、苯乙烯•異戊間二烯橡膠等架橋 之聚合物，和在架橋劑存在下，或者藉由紫外線或者電子 射線等之照射使聚乙烯、聚氟化亞乙烯基等架橋之聚合物 等。其它，也可以使用離聚物等。 \ ί (請先閱讀背面之注意事項再填寫本頁) 在這些架橋聚合物之中，可以賦予充分之透光性，對 於在很多的漿料中所含有的強酸和強鹼安定，進而，由於 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 11 I2211Q5__ A7 B7 五、發明説明（9 ) 吸:水所造成之軟化也少，因此，以被架橋之1，2 -聚丁 二燦特別理想。此被架橋之1， 2-聚丁二烯也可以與丁 二烯橡膠和異戊間二烯橡膠混合而使用。 賦予透光性之方法並無特別限制，例如，可以藉由結 晶丨匕度等之控制而進行。另外，上述非水溶性基塊材料只 胃可以賦予透光性（不管可見光之透過的有無），其本身 並不需要爲透明（包含半透明），但是以透光性更高者爲 佳，進而，以透明者更佳。 此種上述之非水溶性基塊材料在依據J I S K 6 2 5 1使由上述非水溶性基塊材料所形成之試片在8 0 °C破壞之情形，可以使破壞後所殘留的延伸（以下，單單 稱爲「破壞殘留延伸」）在1 0 0 %以下。即可以當成破 壞後的試片的標線間合計距離在破壞前之標線間距離的2 倍以下的非水溶性基塊材料。另外，此破壞殘留延伸最好 在3 0 %以下，更好爲在1 〇 %以下，特別好爲在5 %以 下。另外，通常在0%以下。隨著破壞殘留延伸超過 100%而變大，有在硏磨時以及面更新時，由硏磨墊表 面被刮取或者被拉長的微細片容易塞住細孔之傾向。1221105 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the Invention (1) [Technical Field to which the Invention belongs] The present invention relates to a honing pad for a semiconductor wafer and a honing multilayer body for the semiconductor wafer provided with the same And honing methods for semiconductor wafers. In more detail, a honing pad for a semiconductor wafer, a honing multilayer body for a semiconductor wafer having the same, and a semiconductor using the same can transmit light without reducing the honing performance, and can easily detect the honing end point by transmitting the light. Honing of wafers. [Known Technology] In the honing of semiconductor wafers, the decision to achieve the purpose of honing to end the honing of the honing can be made on the basis of the time obtained empirically. However, there are various materials that constitute the honing surface, and honing time is completely different depending on those materials. In addition, the material constituting the honing surface can be imagined to have various changes in the future. Furthermore, the same applies to a slurry and a honing apparatus used for honing. Therefore, in various honing, it is very inefficient to obtain honing time from each of them. Regarding this, in recent years, for example, it has been disclosed in Japanese Patent Laid-Open Publication No. 9-7 9 8 5 and Japanese Patent Laid-Open Publication No. 2 0 0-3 2 6 2 2 0 to directly measure the honing surface. The study of the optical endpoint detection device and method of the optical method of the state is being developed. This optical endpoint detection device and method are generally disclosed, for example, in Japanese Patent Publication No. Hei 11-512977, etc., and are formed on a honing pad by a hard and uniform resin that can transmit light for endpoint detection. For a window that does not have honing ability, only this light is used to measure the honing surface. This window does not have honing ability, and does not have the size and size of the paper particles to absorb and transport. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) --------- Doing clothes ---- Γ--1T ------ Yu (Please read the notes on the back before filling this page) -4- 1221105 A7 B7 V. Description of the invention (2) Essential ability. (Please read the precautions on the back before filling out this page.) However, in the above-mentioned honing pads, since the window does not have the honing ability, the honing performance of the honing pad may be reduced. In addition, since the slurry has no ability to hold and discharge the slurry, there is a possibility that unevenness may occur due to the installation of the window. Therefore, it is difficult to increase the number of windows, increase the number of windows, and arrange them in a ring shape. [Summary of the invention] The present invention aims to solve the above problems, and aims to provide a semiconductor wafer for honing semiconductor wafers using an optical endpoint detection device without degrading the honing performance and transmitting light for endpoint detection. Using a honing pad and a honing multilayer body for semiconductor wafers, and a honing method for semiconductor wafers. 0 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs. The honing pads for honing semiconductor wafers were reviewed, and it was found that even if there is no honing pad with a small window formed of a resin with high transparency as is conventional, the material constituting the honing pad itself is transparent, and the window This unit can ensure sufficient permeability. With this type of honing pad, the end point of honing can be detected by an optical endpoint detector. In addition, since the base block constituting the honing pad contains inclusions, it has been found that sufficient light transmittance can be secured even if light is scattered. In addition, it was found that even if a hard and uniform resin that does not have the ability to retain and discharge slurry, if a light-transmitting transparent member is used as a window, sufficient light-transmitting property can be ensured. Abrasive pad, can detect the end of honing. In addition, it was found that by using water-soluble particles and this paper size, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) was applied -5- 1221105 A7 _ B7 V. Description of the invention (3) Dispersion and containing this water-soluble The window formed by the base material of the sexual particles can have the ability to hold and discharge the slurry during honing. (Please read the notes on the back before filling out this page) The present invention has been completed based on this knowledge. 1 _ A honing pad for a semiconductor wafer, comprising: a water-insoluble base material, and water-soluble particles dispersed in the water-insoluble base material, which are translucent. 2 · The honing pad for a semiconductor wafer as described in 1 above, wherein when the thickness is 2 mm, the transmittance of light having a wavelength between any wavelength of 4 0 to 8 0 nm is 0 · 1% or more, or the cumulative transmittance of any wavelength band between 400 to 800 nm is 0.1 · 1% or more. 3. The honing pad for a semiconductor wafer according to the above 2, wherein the honing pad has a thin meat portion, and light for end point detection is transmitted through the thin meat portion. 4. The honing pad for a semiconductor wafer according to the above 3, wherein at least a part of the insoluble base material is a bridging polymer. 5. The honing pad for a semiconductor wafer according to the above 2, wherein at least a part of the water-insoluble base material is a bridging polymer. 6. The honing pad for semiconductor wafers as described in 5 above, wherein the cross-linked polymer printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is 1,2-polybutadiene. 7 · A honing pad for a semiconductor wafer, comprising: a base for a honing pad having a through hole penetrating through a front surface and a back surface; and a light transmitting member fitted in the through hole, the light transmitting The sexual member is composed of a water-insoluble base material and water-soluble particles dispersed in the water-insoluble base material. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -6-1221105 A7 __ _B7_ V. Description of the invention (4) (Please read the precautions on the back before filling this page) 8. The honing pad for semiconductor wafers described in the above-mentioned translucent member, when the thickness is 2 mm, the transmittance of light having a wavelength between any wavelength of 400 to 800 nm is between 〇. I% or more, or the cumulative transmittance of any wavelength band between 400 to 800 nm is 0.1% or more. 9. The honing pad for a semiconductor wafer according to the above 8, wherein the light-transmitting member is thinned. 10 · The honing pad for a semiconductor wafer according to the above 9, wherein at least a part of the water-insoluble base material is a bridging polymer. 1 1 · The honing pad for a semiconductor wafer according to the above 8, wherein at least a part of the water-insoluble base material is a bridging polymer. 1 2 The honing pad for a semiconductor wafer as described in 1 1 above, wherein the bridging polymer is bridged 1,2-polybutadiene. 1 3 · A honing multilayer body for a semiconductor wafer, comprising: a honing pad having a water-insoluble base material, and water-soluble particles dispersed in the water-insoluble base material; The support layer laminated on the back side of the honing pad has a light-transmitting property in the direction of the lamination. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs14. A honing multilayer body for semiconductor wafers, comprising: a base for a honing pad having a through hole penetrating into the front and rear surfaces, and a through hole fitted into the through hole A light-transmitting member inside, the light-transmitting member is provided with a honing pad formed of a water-insoluble base material and water-soluble particles dispersed in the water-insoluble base material, and a laminated layer The support layer on the back side of the honing pad is transparent in the lamination direction. 1 5 · A honing method for semiconductor wafers, characterized in that the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 1221105 A7 ___ B7 V. Description of the invention (5) (Please read first (Notes on the reverse side, please fill in this page again.) It includes: a water-insoluble base material, and a light-transmitting honing pad with water-soluble particles dispersed in the water-insoluble base material. An optical endpoint detector detects the honing end point. 16 A honing method for a semiconductor wafer, comprising: a base for a honing pad having a through hole penetrating through a front surface and a back surface; and a light-transmitting member fitted in the through hole. The light-transmitting member is composed of a honing pad including a water-insoluble base material and water-soluble particles dispersed in the water-insoluble base material, honing a semiconductor wafer, and performing the optical end detector. Detection of Honing Endpoints. 17. A honing method for a semiconductor wafer, comprising: a honing pad having a water-insoluble base material, and water-soluble particles dispersed in the water-insoluble base material; A support layer laminated on the inner side of the honing pad, a honing multilayer body having translucency in the lamination direction, honing a semiconductor wafer, and detecting the end of the honing using an optical endpoint detector. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 18 · A honing method for semiconductor wafers, which is characterized by using a base for a honing pad having a penetrating hole penetrating the surface and A light-transmitting member in a through-hole, the light-transmitting member includes a honing pad formed of a water-insoluble base material and water-soluble particles dispersed in the water-insoluble base material, and a laminated layer formed thereon. The backing layer on the inner side of the honing pad is a honing multilayer body having translucency in the lamination direction, honing the semiconductor wafer, and detecting the honing end point using an optical endpoint detector. [Effects of the invention] -8- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) 1221105 A7 _B7____ 5. Description of the invention (6) (Please read the precautions on the back before filling this page) The honing pad for semiconductor wafers and the honing multilayer body for semiconductor wafers according to the inventions of the first and second aspects, the optical type that can easily perform the honing end point without reducing the honing performance during honing Detection. In particular, as for the honing pad according to the invention according to the first aspect, in honing, the entire honing pad is not only the honing end point, but the entire honing condition can always be observed optically. According to the honing method of a semiconductor wafer according to the present invention, the semiconductor wafer can be honed efficiently while holding the honing condition, and in addition, there is no excessive honing. [Detailed description of the invention] The honing pad for semiconductor wafers (hereinafter also referred to as "honing pad") of the invention of the first aspect is characterized by including a water-insoluble base material and being dispersed therein The water-soluble particles in the water-insoluble base material are translucent. Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ The above-mentioned" water-insoluble base material "of the semiconductor wafer honing pad constituting the invention of the first aspect of the present invention has the shape of a honing pad, The task of maintaining water-soluble particles. The material forming the water-insoluble base material is not particularly limited as long as it imparts transparency to the honing pad, and examples thereof include thermoplastic resins, thermosetting resins, elastomers, and rubbers. These can be used individually by 1 type or in combination of 2 or more types. Examples of the thermoplastic resin include polypropylene resins such as polyolefin resins, polystyrene resins, and (m-) acrylic resins. Except for the paper size, China National Standard (CNS) A4 (210X29 *) is applicable. 7 mm) -9-1221105 A7 ___B7_ 5. Description of the invention (7) (Please read the notes on the back before filling out this page) Vinyl resin, polyester resin, polyamide resin, polypropylene resin, Fluorine resin, polycarbonate resin, polyacetal resin, etc. These can be used alone or in combination of two or more. Examples of the thermosetting resin include phenol resins, epoxy resins, unsaturated polyester resins, polyurethane resins, polyurethane resins, urea resins, urea resins, and silicon-based resins. These can be used individually by 1 type or in combination of 2 or more types. Examples of the elastomer include styrene elastomers such as styrene, butadiene, and styrene block copolymers (SBS), hydrogen-added block copolymers (SEBS), and polyene elastomers (TP 0), thermoplastic polyurethane elastomer (TPU), thermoplastic polyester elastomer (butyl PEE), polyamide elastomer (TPAE), 1, 2-polybutadiene and other diene-based elasticity Thermoplastic elastomers, silicone elastomers, fluororesin elastomers, etc. These can be used individually by 1 type or in combination of 2 or more types. Printed by U Bayong Consumer Cooperative, Intellectual Property Bureau of the Ministry of Economic Affairs. Examples of rubber include butadiene rubber, styrene butadiene rubber, isoprene rubber, isobutylene isoprene rubber, and acrylic. Rubber, acrylonitrile · butadiene rubber, ethylene · propylene rubber, ethylene · propylene · diene rubber, silicone rubber, fluorine rubber, etc. These can be used individually by 1 type or in combination of 2 or more types. These materials may be denatured by an acid anhydride group, a carboxyl group, a hydroxyl group, an epoxy group, and an amino group. The denaturation can adjust the affinity of water-soluble particles and abrasive particles, aqueous media, etc. These denatured materials may be used in combination of two or more. -10- This paper size applies Chinese National Standard (CNS) A4 (210X297 mm) 1221105 A7 B7 V. Description of the invention (8) In addition, the above water-insoluble base material can also be a bridging polymer or a non-water-soluble base material. Cross-linking polymers, but preferably at least one of them is a cross-linking polymer. In the case where the above-mentioned water-insoluble base material is formed of two or more materials, at least a part of one of them may be a cross-linking polymer. By providing at least a part of the water-insoluble base material with a bridge structure, it is possible to impart elastic restoring force to the honing pad. Therefore, it is possible to suppress the deformation caused by the stress applied to the honing pad during honing to be relatively small, and to prevent the water-insoluble base material from being excessively stretched and plastically deformed during honing and trimming. Water-soluble particles The pores formed by dissolution or detachment are buried. In addition, excessive fluffing of the surface of the honing pad can be prevented. Therefore, the holding property of the slurry at the time of honing is good, and the holding property of the slurry by dressing is easily restored, and further, the occurrence of cracks can be prevented. Examples of the bridge polymer include resins such as polyurethane resin, epoxy resin, polypropylene-based resin, unsaturated polyester resin, vinyl ester resin other than polypropylene-based resin, and 1,2-polybutylene. Diene-based elastomers such as diene, butadiene rubber, isoprene rubber, propylene-based rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber, ethylene-propylene rubber, silicone rubber, Cross-linking polymers such as fluoro rubber, styrene and isoprene rubber, and cross-linking polymers such as polyethylene and polyvinylidene fluoride in the presence of a cross-linking agent or by irradiation with ultraviolet rays or electron rays Wait. Alternatively, an ionomer or the like may be used. \ ί (Please read the precautions on the back before filling out this page) Among these bridging polymers, it can provide sufficient light transmission, and it is stable to the strong acids and alkalis contained in many slurries. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 11 I2211Q5__ A7 B7 V. Description of the invention (9) Absorption: There is less softening caused by water, so it is bridged by 1, 2-poly Ding Ercan is particularly ideal. This bridged 1,2-polybutadiene can also be used in combination with butadiene rubber and isoprene rubber. The method for imparting light transmittance is not particularly limited. For example, it can be performed by controlling the crystallinity and the like. In addition, the above-mentioned water-insoluble base material can only impart light transmittance to the stomach (regardless of the transmission of visible light). It does not need to be transparent (including translucent), but it is better to have higher light transmittance. It is better to be transparent. When such a water-insoluble base block material is broken at 80 ° C in accordance with JISK 6 2 51, the test piece formed by the water-insoluble base block material can be extended after the destruction (hereinafter , Which is simply called "damage residual elongation") is less than 100%. That is, it can be regarded as a water-insoluble base material whose total distance between the marks of the test piece after the damage is less than twice the distance between the marks before the failure. The residual elongation at break is preferably 30% or less, more preferably 10% or less, and particularly preferably 5% or less. In addition, it is usually 0% or less. As the damage residue extends beyond 100% and becomes larger, there is a tendency that the fine surface of the honing pad is scraped or elongated to easily plug the pores during honing and surface renewal.
\ 土 ：P (請先閱讀背面之注意事項再填寫本頁) 又，所謂破壞殘留延伸是在依據J I S K 6 2 5 1 「加硫橡膠的拉伸試驗方法」，以試片形狀啞鈴狀3號形 狀、拉伸速度5 0 0 m m /分、試驗溫度8 0 °C ,在拉伸 試驗終始試片破壞之情形，由被破壞分割之試片的各各標 線至破壞部爲止之合計距離減去試驗前的標線間距離的延 伸量。又，關於試驗溫度，在實際的硏磨中由於滑動所達 本紙張尺度適用中國國家標準（CNS ) A4規格（210x297公釐） 1221105 A7 ___B7_ 五、發明説明（1〇 ) 到之溫度爲8 0 °C之程度故，所以以此溫度進行。 (請先閱讀背面之注意事項再填寫本頁) 構成第1觀點之發明的硏磨墊的上述「水溶性粒子」 是被分散在上述非水溶性基塊材料中，在硏磨時，藉由與 由外部所供應的水系媒體接觸，溶解或者膨脹而由硏磨墊 之表面脫離（由於溶解或者膨脹等），在此脫離之痕跡處 可以保持漿料，能夠暫時使硏磨屑滯留之形成細孔的粒子 〇 經濟部智慧財產局員工消費合作社印製 上述水溶性粒子並無特別限制，可以使用種種的材料 ，例如可以使用有機系水溶性粒子以及無機系水溶性粒子 。有機系水溶性粒子可以使用以：糊精、環糊精、甘露醇 、乳糖等之糖類、羥丙基纖維素、甲基纖維素等之纖維素 類、澱粉、蛋白質、聚乙烯醇、聚乙烯吡咯烷酮、聚丙烯 酸、聚乙烯氧化物、水溶性之感光性樹脂、硕化聚異戊二 烯、硕化聚異戊二烯共聚合物等所構成者。另外，無機系 水溶性粒子可以使用以：硫酸鉀、醋酸鉀、硝酸鉀、碳酸 鉀、碳酸氫鉀、氯化鉀、溴化鉀、磷酸鉀、硝酸錳等所構 成者。在這些之中，以環糊精、硫酸鉀爲佳。也可以單獨 使用1種或者組合2種以上之以這些上述各成分所構成之 水溶性粒子。進而，上述水溶性物質也可以組合使用有機 系以及無機系。 上述水溶性粒子之形狀並無特別限制，通常以更接近 球形者爲佳，更好爲以球形者爲佳。另外，各水溶性粒子 以形狀更爲一致者爲佳。藉由此所形成之細孔的形狀一致 ，可以進行良好之硏磨。 本纸張尺度適用中國國家標準（CNS ) A4規格（210'〆297公釐） -13- 1221105 A7 B7 五、發明説明〇1 ) 另外，上述水溶性粒子的大小也沒有特別限制，通常 以0 . 1〜 5 0 0 β η 1、更好爲0 . 5〜 1 0 0 // m，更 爲理想爲1 〜8 0 β η 1。粒徑如低於0 · 1 A m ,細孔的 (請先閱讀背面之注意事項再填寫本頁) 大小有可能比磨粒小，有可能產生細孔無法保持磨粒之問 題，並不理想。另一方面，如超過500//m,所形成之 細孔的大小變得過大，有硏磨墊的機械強度以及硏磨速度 降低的傾向。 另外，被包含在硏磨墊的上述水溶性粒子的量在非水 溶性基塊材料與水溶性粒子的合計爲1 0 0體積％之情形 ，最好爲10〜90體積％，更好爲15〜60體積％, 更爲理想爲2 0〜4 0體積％。上述水溶性粒子的含有量 如低於1 0體積％，無法形成充分量的細孔，硏磨速度有 降低的傾向。另一方面，如超過9 0體積％，有難於防止 不單露出硏磨墊表面的水溶性粒子，連同存在於內部的水 溶性粒子非預期地溶解或者膨脹。因此，難於在硏磨時將 硏磨墊的硬度以及機械強度保持在適當値。 經濟部智慧財產局員工消費合作社印製 另外，上述水溶性粒子以只露出在硏磨墊的表面者溶 解於水，沒有露出而存在於硏磨墊內部者不吸濕以及膨脹 爲佳。因此，也可以在水溶性粒子的最外部的至少其中一 部份形成由抑制吸濕的環氧樹脂、聚亞醯胺、聚醯胺以及 聚矽酸鹽等所構成的外殼。 上述水溶性粒子在硏磨時形成細孔之機能以外，也具 有使硏磨墊的押入硬度變大的機能。例如，最好簫氏D硬 度爲3 5〜1 0 0。藉由此押入硬度大，硏磨墊可以使施 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -14- 1221105 Α7 Β7 五、發明説明（12 ) (請先閲讀背面之注意事項再填寫本頁) 加在被硏磨面的壓力變大，不單可以提升硏磨速度，同時 ，也可以獲得高的硏磨平坦性。因此，此水溶性粒子以在 硏磨墊內可以確保充分的押入硬度之中實體爲佳。 另外，將上述水溶性粒子分散於上述非水溶性基塊材 料中的方法並無特別限制，通常，將構成上述非水溶性基 塊材料的材料、水溶性粒子以及其它的添加劑等加以混練 。在此混練中，爲了使構成非水溶性基塊材料的材料容易 加工，而一面加熱一面加以混練，但是此時的溫度，以水 溶性粒子爲固體爲佳。藉由固體，可以使得與構成上述非 水溶性基塊材料的材料的相溶性的大小無關地，容易將水 溶性粒子在保持前述理想的平均粒徑的狀態下加以分散。 因此，最好依據構成所使用的非水溶性基塊材料的材料的 加工溫度，選擇水溶性粒子的種類。 在第1觀點的發明之硏磨墊中，在上述非水溶性基塊 材料以及水溶性粒子以外，也可以在能夠維持透光性之範 圍內使含有習知上在漿料中所含有的磨粒、氧化劑、鹼金 屬的氫氧化物、酸、p Η調節劑、表面活性劑、刮傷防止 經濟部智慧財產局員工消費合作社印製 劑等。藉由此，也可以在硏磨時只供應水便可以進行硏磨 〇 另外，爲了使得上述非水溶性基塊材料與上述水溶性 粒子的親和性、以及被包含在非水溶性基塊材料的水溶性 粒子的分散性成爲理想，可以配合相溶化劑。相溶化劑可 以舉出··藉由酸酐基、羧基、羥基、環氧基以及氨基等而 被變性的聚合物、嵌段共聚物、以及隨機共聚物、進而， 本纸張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -15- 1221105 A7 _B7___ 五、發明説明〇3 ) 種種的陰離子系表面活性劑、耦合劑等。這些可以單獨使 用1種或者組合2種以上而使用。 (請先閲讀背面之注意事項再填寫本頁) 進而，在第1觀點的發明之硏磨墊中，因應需要，可 以使含有：塡充劑、軟化劑、氧化防止劑、紫外線吸收劑 、帶電防止劑、滑動劑、可塑劑等之各種的添加劑。另外 ,也可以添加硫磺和過氧化物等之反應性添加劑使之產生 反應而使之架橋。 上述塡充劑可以舉出··提升碳酸鉀、碳酸鎂、滑石粉 、黏土等之剛性的材料、以及二氧化矽、氧化鋁、二氧化 鈽、氧化鉻、二氧化鈦、二氧化錳、三氧化二錳、碳酸鋇 等之具有硏磨效果的材料等。這些可以單獨使用1種或者 組合2種以上使用。 關於第1觀點的發明之硏磨墊可以將由上述各成份的 組成物導入預定形狀的模具等而加以製造。 經濟部智慧財產局員工消費合作社印製 第1觀點的發明之硏磨墊爲藉由細孔以保持漿料，進 而，可以使硏磨屑暫時滯留者。此硏磨墊的平面形狀並無 特別限定，例如，可以設成圓盤狀等之圓形和四角形（皮 帶狀、輥輪狀）等之多角形。另外，其大小也無特別限定 ，例如，在圓盤狀的情形，可以設爲直徑5 0 0〜9 0 0 mm ° 另外，第1觀點的發明之硏磨墊的厚度雖可以因應用 途而設爲不同，但是通常以0 . 5mm以上、更好爲1〜 3mm。硏磨墊的厚度也可以爲一定，也可以設爲部份不 同厚度。硏磨終點在以光進行檢測之際，一般在使光透過 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐〉 -16- 1221105 A7 B7 五、發明説明（14 ) (請先閲讀背面之注意事項再填寫本頁) 透光性的物體之情形，考慮該光的強度與透過物體的長度 的平方成正比而衰減之性質，可以在硏磨墊之至少其中一 部份設置光容易透過之部份。因此，例如，使以光檢測硏 磨終點之部份薄肉化，可以飛躍提升透過率，進而也提升 檢測感度。進而，在此被薄肉化之部份以外，即使在終點 的檢測上，充分強度之光不易透過，但是在薄肉部可以確 保終點檢測所必要之充分的光強度。 因此，以具有薄肉部爲佳。此薄肉部具體爲被形成爲 比硏磨墊的最大厚度還薄之部位（例如，參考第1〜第4 圖）。此薄肉部的平面形狀並無特別限定，例如，可以設 爲圓形、扇形、正方形、長方形以及梯形等之多角形以及 環形等。另外，薄肉部的剖面形狀例如可以設爲四角形、 五角形等之多角形，圓頂形或者其它形狀（參考第1〜第 4圖）。各圖的上方設爲硏磨面。另外，薄肉部的大小也 無特別限定，例如，在爲圓形之情形，以直徑2 0 m m以 上爲佳，在環形之情形，以其寬幅在2 0 m m以上爲佳， 在長方形之情形，以縱深3 0 m m以上而且橫向1 0 m m 以上爲佳。 經濟部智慧財產局員工消費合作社印製 進而，被設置在硏磨墊之薄肉部的數目也爲特別限定 ，可以爲1個地方、2個地方以上。另外，該位置也爲特 別限定。例如，在具備1個薄肉部之情形，可以設置在如 第5圖以及第6圖之場所。進而，在設置2個以上之薄肉 部的情形，可以形成爲同心圓狀（參考第7圖）等。 此薄肉部的厚度並無特別限定，通常在薄肉部中最薄 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -17- 1221105 A7 __B7____ 五、發明説明（15 ) (請先閱讀背面之注意事項再填寫本頁) 部份的厚度以0 · 1 m m以上、更好爲〇 · 3 m m以上爲 佳。又，通常在3mm以下。在低於〇 . 1mm時，要充 分確保此部份的機械強度有變得困難之傾向。 進而，上述薄肉部雖可以藉由硏磨墊的硏磨面側凹陷 而形成（參考第2圖），但是以在裏面側形成凹陷爲佳（ 參考第1圖）。藉由裏面側成爲凹陷，能夠對硏磨性能沒 有影響地獲得良好的透光性。 又，也可以有別於此薄肉部的凹陷，在硏磨墊的硏磨 面因應需要，以預定的寬幅（例如，0 . 1〜2 m m )、 深度、間隔形成溝部，和設置點圖案。藉由此，能夠提升 漿料的保持性、使使用完畢的漿料的排出性變好。這些溝 以及點圖案例如可以以同心圓形狀、格子形狀、渦卷形狀 '輻射線形狀等之預定的形狀形成。另外，此溝以及點圖 案也可以由爲了形成上述薄肉部而凹陷形成之凹部所兼用 〇 上述「透光性」，只要可以使光透過，並無特別限定 ，在設硏磨墊的厚度爲2mm之情形，以波長100〜 經濟部智慧財1局員工消費合作社印^ 3 0 0 〇 n m之間的任一波長的光的透過率在〇 · 1 %以 上，或者波長1 0 0〜3 0 0 0 n m之間的任一波長帶的 累積透過率在〇 . 1 %以上爲佳。此透過率或者累積透過 率以在1 %以上爲佳，以2 %以上更爲理想。但是，此透 過率或者累積透過率即使高至必要以上，通常只要在5 0 %以下即可，更好以3 0 %以下，特別在2 0 %以下亦可 〇 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 __ _B7 五、發明説明（16 ) (請先閱讀背面之注意事項再填寫本頁) 另外，在使用於利用光學式終點檢測器之硏磨的硏磨 墊中，進而以當成終點檢測用光的使用頻度在特別高頻帶 之4 0 0〜8 0 0 nm的透過率爲高者爲佳。因此，在設 厚度爲2 m m之情形，以波長4 0 0〜8 0 0 n m之間的 任一波長的光的透過率在0 . 1 %以上（更好在1 %以上 ，更爲理想爲2 %以上，特別以3 %以上最爲理想，通常 在50%以下），或者波長400〜800nm之間的任 一波長帶的累積透過率在〇 . 1%以上（更好在1%以上 ，更爲理想在2 %以上，特別以3 %以上最爲理想，通常 在5 0 %以下）爲佳。 但是，此透過率或者累積透過率即使高至必要以上亦 可，通常在2 0%以下，進而在10%以下亦可，特別是 在5 %以下亦可。 又，此透過率爲利用對厚度2 m m的試片，可以測量 預定波長的吸光度之U V吸光度計等之裝置，測量各波長 的光的透過率時之値。關於累積透過率也可以累積同樣測 量的預定波長帶的透過率而求得。 經濟部智慧財產局員工消費合作社印製 第2觀點的發明之半導體晶圓用硏磨墊，其特徵爲具 備：具有貫穿表裏之貫穿孔的硏磨墊用基體、與被嵌合在 此貫穿孔內之透光性構件，此透光性構件由包含：非水溶 性基塊材料、與被分散在此非水溶性基塊材料中的水溶性 粒子所形成。 關於第2觀點之上述「硏磨墊用基體」爲其本身具有 硏磨性能，在其表面保持漿料，進而，可以暫時使硏磨屑 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) 經濟部智慧財產局R工消費合作社印製 1221105 A7 ____B7 五、發明説明（17 ) 滯留者。不管此硏磨墊用基體的透光性之有無。另外，該 平面形狀也無特別限定，例如，可以設爲圓形和四角形等 之多角形。另外，其大小也無特別限定。 另外，爲了在硏磨時保持漿料，使硏磨屑暫時滯留故 ,以在上述硏磨墊用基體的表面至少形成微細孔和溝爲佳 。即可以在上述硏磨墊用基體預先形成微細孔以及/或者 溝（例如，發泡體等）、在硏磨時脫離形成細孔以及/或 者溝者較爲理想。其中後者，可以使用在非水溶性基塊材 料中分散粒子形狀、線形狀等之預定形狀的水溶性材料者 。具備此種硏磨墊用基體的硏磨墊在硏磨時藉由與水系媒 體接觸，水溶性材料溶解火者脫離，在硏磨墊用基體的表 面形成細孔以及/或者溝。 構成上述硏磨墊用基體的材料並無特別限定，可以使 用種種材料。特別由容易形成預定形狀以及性狀、能夠賦 予適當彈力性等，以使用有機材料爲佳。此有機材料可以 使用發泡材料，和構成後述的透光性構件的種種材料。但 是，構成上述硏磨墊用基體的材料與構成透光性構件的材 料，可以相同也可以不同。 關於第2觀點的發明之硏磨墊用基體的厚度可以因應 用途而設爲不同，通常在0 · 5mm以上，更好爲1〜3 mm。硏磨墊用基體的厚度可以爲全體一定，或者部份不 同。 上述「貫穿孔」爲貫穿上述硏磨墊用基體的表裏，透 光性構件被嵌合在裏面用者。上述貫穿孔可以設置在硏磨 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)Soil: P (please read the precautions on the back before filling this page) Also, the so-called break residual extension is based on JISK 6 2 5 1 "Vulcanized rubber tensile test method", with a test piece shape dumbbell shape No. 3 Shape, tensile speed of 500 mm / min, test temperature of 80 ° C. When the test piece is broken at the end of the tensile test, the total distance from each marked line of the broken and divided test piece to the broken part is reduced. The extension of the distance between the marks before the test. In addition, as for the test temperature, in actual honing, the paper size reached due to sliding is applicable to the Chinese National Standard (CNS) A4 (210x297 mm) 1221105 A7 ___B7_ V. Description of the invention (10) The temperature to 80 ° C, so proceed at this temperature. (Please read the precautions on the back before filling this page.) The "water-soluble particles" constituting the honing pad of the invention according to the first aspect are dispersed in the above-mentioned water-insoluble base material. It comes into contact with the aqueous medium supplied from the outside, dissolves or swells and detaches from the surface of the honing pad (due to dissolution or swelling, etc.). The slurry can be maintained at the detached trace, and the honing debris can be temporarily retained to form fine Porous particles 0 There are no particular restrictions on the printing of the water-soluble particles by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and various materials can be used, such as organic water-soluble particles and inorganic water-soluble particles. As the organic water-soluble particles, dextrin, cyclodextrin, mannitol, lactose and the like, cellulose such as hydroxypropyl cellulose, methyl cellulose, starch, protein, polyvinyl alcohol, and polyethylene can be used. It is composed of pyrrolidone, polyacrylic acid, polyethylene oxide, water-soluble photosensitive resin, master polyisoprene, master polyisoprene copolymer, and the like. In addition, as the inorganic water-soluble particles, potassium sulfate, potassium acetate, potassium nitrate, potassium carbonate, potassium bicarbonate, potassium chloride, potassium bromide, potassium phosphate, manganese nitrate, and the like can be used. Among these, cyclodextrin and potassium sulfate are preferred. These water-soluble particles composed of these components may be used singly or in combination of two or more kinds. Furthermore, the water-soluble substance may be used in combination with an organic system and an inorganic system. The shape of the water-soluble particles is not particularly limited, and it is generally preferred to be closer to a sphere, more preferably to a sphere. In addition, it is preferable that each water-soluble particle has a more uniform shape. With the uniform shape of the pores thus formed, good honing can be performed. This paper size applies the Chinese National Standard (CNS) A4 specification (210'〆297 mm) -13- 1221105 A7 B7 V. Description of the invention 〇1) In addition, the size of the above water-soluble particles is not particularly limited, usually 0 1 to 5 0 0 β η 1, more preferably 0.5 to 1 0 0 // m, and more preferably 1 to 8 0 β η 1. If the particle size is less than 0 · 1 A m, the size of the pores (please read the precautions on the back before filling this page) may be smaller than the abrasive grains, which may cause the problem that the pores cannot keep the abrasive grains, which is not ideal. . On the other hand, if it exceeds 500 // m, the size of the formed pores becomes too large, and the mechanical strength and honing speed of the honing pad tend to decrease. In addition, when the amount of the water-soluble particles contained in the honing pad is 100% by volume, the total amount of the water-insoluble base material and the water-soluble particles is preferably 10 to 90% by volume, more preferably 15% by volume. ~ 60 vol%, more preferably 20 to 40 vol%. If the content of the water-soluble particles is less than 10% by volume, sufficient pores cannot be formed, and the honing rate tends to decrease. On the other hand, if it exceeds 90% by volume, it is difficult to prevent the water-soluble particles from not only exposing the surface of the honing pad, but also the water-soluble particles present inside, from undesirably dissolving or expanding. Therefore, it is difficult to maintain the hardness and mechanical strength of the honing pad at a proper honing during honing. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In addition, it is preferable that the water-soluble particles are dissolved in water only when exposed on the surface of the honing pad, and those that are not exposed but are present inside the honing pad do not absorb moisture and swell. Therefore, it is also possible to form a shell made of epoxy resin, polyimide, polyimide, polysilicate, or the like which suppresses moisture absorption in at least a part of the outermost part of the water-soluble particles. In addition to the function of forming the pores during honing, the water-soluble particles also have a function of increasing the hardness of the honing pad. For example, the hardness of Xiao D is preferably 35 to 100. As a result, the hardness of the honing pad can make the paper size applicable to the Chinese National Standard (CNS) A4 (210X297 mm) -14- 1221105 Α7 Β7 V. Description of the invention (12) (Please read the note on the back first Please fill in this page again.) The pressure on the honing surface becomes larger, which can not only increase the honing speed, but also achieve high honing flatness. Therefore, it is preferable that the water-soluble particles are solid enough to ensure sufficient hardness in the honing pad. The method for dispersing the water-soluble particles in the water-insoluble base material is not particularly limited. Generally, the materials constituting the water-insoluble base material, water-soluble particles, and other additives are kneaded. In this kneading, in order to make the material constituting the water-insoluble base material easier to process, the kneading is performed while heating, but at this time, it is preferable that the water-soluble particles are solid. With the solid, it is possible to easily disperse the water-soluble particles while maintaining the above-mentioned desired average particle diameter regardless of the compatibility of the materials constituting the water-insoluble base material. Therefore, it is desirable to select the type of water-soluble particles depending on the processing temperature of the material constituting the water-insoluble base material used. In the honing pad of the invention according to the first aspect, in addition to the water-insoluble base material and the water-soluble particles, the polishing pad containing the conventionally contained slurry can be maintained within a range capable of maintaining light transmittance. Granules, oxidants, hydroxides of alkali metals, acids, p Η regulators, surfactants, scratch prevention, employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, consumer cooperative printing products, etc. As a result, honing can also be performed by supplying only water during honing. In addition, in order to make the water-insoluble base material compatible with the water-soluble particles, and to include the water-insoluble base material, The dispersibility of the water-soluble particles is ideal, and a compatibilizing agent can be blended. Examples of the compatibilizing agent include polymers, block copolymers, and random copolymers that are denatured by acid anhydride groups, carboxyl groups, hydroxyl groups, epoxy groups, and amino groups. Furthermore, this paper is in accordance with Chinese national standards. (CNS) A4 specification (210 × 297 mm) -15-1221105 A7 _B7___ V. Description of the invention 〇3) Various anionic surfactants, coupling agents, etc. These can be used individually by 1 type or in combination of 2 or more types. (Please read the precautions on the back before filling in this page.) Furthermore, the honing pad of the invention of the first aspect may contain, as required, an antistatic agent, a softener, an oxidation inhibitor, an ultraviolet absorber, and an electrification agent. Various additives such as inhibitors, slip agents, and plasticizers. In addition, reactive additives such as sulfur and peroxide may be added to cause reaction and bridge the reaction. Examples of the above-mentioned concrete fillers include materials that enhance the rigidity of potassium carbonate, magnesium carbonate, talc, clay, and the like, as well as silicon dioxide, aluminum oxide, thorium dioxide, chromium oxide, titanium dioxide, manganese dioxide, and trioxide. Materials with honing effect such as manganese and barium carbonate. These can be used individually by 1 type or in combination of 2 or more types. The honing pad according to the invention of the first aspect can be produced by introducing the composition of each component into a mold having a predetermined shape or the like. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The invention of the honing pad of the first aspect is to hold the slurry through pores, so that honing debris can be temporarily retained. The planar shape of the honing pad is not particularly limited. For example, the honing pad may be formed in a circular shape such as a disc, and a polygonal shape such as a belt or a roller. In addition, the size is not particularly limited. For example, in the case of a disk, the diameter may be 500 to 900 mm. In addition, the thickness of the honing pad according to the first aspect of the invention may be set according to the application. It is different, but it is usually 0.5 mm or more, more preferably 1 to 3 mm. The thickness of the honing pad can also be constant, or it can be set to some different thicknesses. When the end point of honing is detected by light, the standard of China National Standard (CNS) A4 (210X29 * 7 mm>) is generally applied when the light is transmitted through the paper size. -16- 1221105 A7 B7 V. Description of the invention (14) (Please Read the precautions on the back before filling in this page.) In the case of a light-transmitting object, consider the property that the intensity of the light is attenuated in proportion to the square of the length of the transmitted object. It can be set on at least one part of the honing pad Light is easy to pass through. Therefore, for example, thinning the portion where the end point of the honing is detected by light can greatly increase the transmittance, and thus improve the detection sensitivity. Furthermore, in addition to the thinned portion, In the detection of the end point, light of sufficient intensity is not easy to pass through, but the thin meat portion can ensure sufficient light intensity necessary for the detection of the end point. Therefore, it is better to have a thin meat portion. This thin meat portion is specifically formed more than the honing pad. The part with the largest thickness (for example, refer to Figures 1 to 4). The planar shape of this thin meat part is not particularly limited. For example, it can be circular, fan-shaped, square, or rectangular. As well as polygonal shapes such as trapezoids, ring shapes, etc. In addition, the cross-sectional shape of the thin meat portion can be, for example, a polygonal shape such as a quadrangular shape, a pentagonal shape, a dome shape, or other shapes (refer to FIGS. 1 to 4). It is a honing surface. In addition, the size of the thin meat portion is not particularly limited. For example, in the case of a circle, a diameter of 20 mm or more is preferable, and in the case of a ring, the width is preferably 20 mm or more. In the case of a rectangle, it is preferable that the depth is more than 30 mm and the width is more than 10 mm. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Furthermore, the number of thin meat parts to be placed on the honing pad is also particularly limited. It is one place, two places or more. In addition, this position is also particularly limited. For example, when one thin meat portion is provided, it can be installed in places such as FIG. 5 and FIG. 6. Furthermore, two places are provided. The above thin meat portion can be formed into concentric circles (refer to Figure 7), etc. The thickness of this thin meat portion is not particularly limited, and it is usually the thinnest in the thin meat portion. The paper size applies to Chinese national standards. CNS) A4 specification (210X297 mm) -17- 1221105 A7 __B7____ 5. Description of the invention (15) (Please read the precautions on the back before filling in this page) The thickness of the part is 0 · 1 mm or more, and more preferably 〇 · 3 mm or more is preferred. It is usually 3 mm or less. When it is less than 0.1 mm, it is difficult to sufficiently ensure the mechanical strength of this part. Furthermore, the thin meat part can be honed by a honing pad. The honing surface is formed with depressions (refer to Figure 2), but it is better to form depressions on the inside (refer to Figure 1). By forming depressions on the inside, it is possible to obtain good transparency without affecting the honing performance. In addition, it is also possible to form a groove portion with a predetermined width (for example, 0.1 to 2 mm), depth, and interval on the honing surface of the honing pad as needed, different from the depression of the thin meat portion, and Set the dot pattern. Thereby, it is possible to improve the retention of the slurry and to improve the dischargeability of the used slurry. These grooves and dot patterns can be formed in a predetermined shape such as a concentric circle shape, a lattice shape, a spiral shape, a radiation shape, or the like. In addition, the groove and the dot pattern may be used by the recessed portion formed to be recessed in order to form the thin meat portion. The aforementioned "light-transmitting property" is not particularly limited as long as it can transmit light. The thickness of the honing pad is 2 mm. In the case of a wavelength of 100 ~ 1, printed by an employee consumer cooperative of the Bureau of Intellectual Property of the Ministry of Economic Affairs, ^ 3 0 0 nm, the transmittance of light at any wavelength is greater than 0.1%, or the wavelength is 1 0 0 to 3 0 0 The cumulative transmittance of any wavelength band between 0 nm is preferably above 0.1%. The transmittance or cumulative transmittance is preferably 1% or more, and more preferably 2% or more. However, even if this transmittance or cumulative transmittance is higher than necessary, it is usually only 50% or less, more preferably 30% or less, and especially 20% or less. This paper standard applies Chinese national standards ( CNS) A4 specification (210X297 mm) 1221105 A7 __ _B7 V. Description of the invention (16) (Please read the precautions on the back before filling out this page) In addition, it is used for honing using the honing of the optical endpoint detector In the pad, it is further preferred that the frequency of use as the end-point detection light in a particularly high frequency band of 400 to 800 nm is high. Therefore, with a thickness of 2 mm, the transmittance of light at any wavelength between 400 and 800 nm is 0.1% or more (more preferably 1% or more, and more preferably 1% or more (more preferably 3% or more, usually 50% or less), or the cumulative transmittance of any wavelength band between 400 and 800nm is 0.1% or more (more preferably 1% or more, More preferably, it is more than 2%, especially more than 3%, and usually less than 50%). However, this transmittance or cumulative transmittance may be as high as necessary or more, and it is usually below 20%, further below 10%, and especially below 5%. In addition, this transmittance is measured by a device such as a UV absorber, which can measure the absorbance of a predetermined wavelength on a test piece having a thickness of 2 mm, and measures the transmittance of light of each wavelength. The accumulated transmittance can also be obtained by accumulating the transmittance of a predetermined wavelength band that is also measured. The second aspect of the invention is a honing pad for semiconductor wafers printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, which is characterized by comprising a base for a honing pad having a through hole penetrating through the front and back, and a through hole fitted into the pad The light-transmitting member is formed by a water-insoluble base material and water-soluble particles dispersed in the water-insoluble base material. Regarding the second aspect, the "substrate for honing pads" has honing performance by itself, and maintains a slurry on its surface, so that honing scraps can be temporarily applied to the paper standard of China National Standard (CNS) A4 (210X297). (Mm) Printed by the R Industrial Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221105 A7 ____B7 V. Description of Invention (17) Detainees. It does not matter whether or not the substrate for the honing pad has a light transmitting property. The planar shape is not particularly limited, and may be, for example, a polygon such as a circle or a quadrangle. The size is not particularly limited. In addition, in order to maintain the slurry during honing and temporarily retain honing debris, it is preferable to form at least fine holes and grooves on the surface of the base for the honing pad. That is, micropores and / or grooves (for example, foams) can be formed in advance in the base for a honing pad, and fine holes and / or grooves can be formed by detaching during honing. Among the latter, a water-soluble material having a predetermined shape such as a particle shape or a linear shape dispersed in a water-insoluble base block material can be used. A honing pad provided with such a base for a honing pad is in contact with an aqueous medium during honing, and the water-soluble material dissolves the fire and detaches, thereby forming fine holes and / or grooves on the surface of the base for the honing pad. The material constituting the base for the honing pad is not particularly limited, and various materials can be used. In particular, it is preferable to use an organic material because it is easy to form a predetermined shape and properties, and can impart appropriate elasticity. As the organic material, a foamed material and various materials constituting a light-transmitting member described later can be used. However, the material constituting the base for the honing pad and the material constituting the translucent member may be the same or different. The thickness of the base for a honing pad according to the second aspect of the invention may be different depending on the application, but it is usually 0.5 mm or more, more preferably 1 to 3 mm. The thickness of the base for the honing pad may be constant for the whole or partly different. The "through-hole" is a surface that penetrates the base of the honing pad, and a light-transmitting member is fitted on the inside. The above through-holes can be set in honing. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)
-20- 1221105 A7 _B7 五、發明説明（18 ) (請先閲讀背面之注意事項再填寫本頁) 墊用基體的任何位置，可以在中心部、也可以在端部，硏 磨墊用基體的端部也可以成爲切口部。上述貫穿孔的形狀 並無特別限定，例如，其開口部的平面形狀可以爲圓形、 扇形、正方形以及梯形等之多角形以及環形等。另外，上 述貫穿孔的剖面形狀例如可以爲T字狀、倒T字狀、四角 形或者其它形狀（參考第8圖〜第1 1圖。圖中，硏磨墊 用基體以12表示、貫穿孔以13表示。又，各圖的上方 設爲硏磨面側）。其中，以設爲T字狀特別理想。 上述貫穿孔的1個的大小並無特別限定，通常在開口 部爲圓形之情形，以直徑在2 0 m m以上（通常，在硏磨 墊的半徑的2 / 3以下）爲佳，在環狀的貫穿孔的情形， 以其之寬幅在2 0mm以上（通常，在硏磨墊的半徑的 2 / 3以下）爲佳，在四角形之情形，以縱深3 0 m m以 上（通常，在硏磨墊的半徑的2 / 3以下），而且橫向在 1 〇mm以上（通常，在硏磨墊的半徑的2/3以下）爲 佳。各貫穿孔如比上述小，有很難使終點檢測用光等的光 線確實透過之情形。其它，貫穿孔的數目也沒有特別限定 〇 絰濟部智慧財產局員工消費合作社印製 上述「透光性構件」是指具有容易使硏磨終點的檢測 變得容易用之透光性，而且，被嵌合在上述貫穿孔之構件 〇 上述透光性構件是含有：非水溶性基塊材料、與被分 散在此非水溶性基塊材料之中的水溶性粒子者。 形成構成上述透光性構件之非水溶性基塊材料的材料 本纸張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） -21 - 1221105 A7 ______B7 五、發明説明（19 ) (請先閱讀背面之注意事項再填寫本覓) 以使用例示於形成上述第1觀點的發明之非水溶性基塊材 料的材料者最爲理想。因此，構成上述透光性構件之非水 溶性基塊材料至少以由架橋聚合物所構成者爲佳，該架橋 聚合物以被架橋之1， 2-聚丁二烯爲佳。 構成上述透光性構件的水溶性粒子並無特別限定，在 考慮透光性構件的大小所能發揮的性質下，以使用上述第 1觀點的發明之水溶性粒子爲佳。即可以設爲與上述第1 觀點的發明之水溶性粒子的種類、形狀以及構成相同。另 外，如前述般地，也可以在上述水溶性粒子的表面形成由 環氧樹脂、聚亞醯胺、聚醯胺、聚矽酸鹽等所構成之外殻 〇 上述水溶性粒子在硏磨時形成細孔之機能以外，也具 有使透光性構件的押入硬度與硏磨墊的其它部份匹配的機 能。爲了使硏磨時所施加的壓力變大、提升硏磨速度以獲 得高平坦性，以使硏磨墊整體之簫氏D硬度爲3 5〜 經濟部智慧財產局員工消費合作社印製 1 0 0爲佳。但是，在只由構成上述非水溶性基塊材料的 材料有難於獲得所期望的簫氏D硬度之情形，在此種情形 ，在使含有上述水溶性粒子以形成細孔以外，可以使簫氏 D硬度提升至與硏磨墊的其它部位相同程度。由此理由， 上述水溶性粒子以在硏磨墊內可以確保充分的押入硬度之 中實體爲佳。 上述透光性構件的形狀並無特別限定，硏磨墊的硏磨 面側的平面形狀通常依存於貫穿孔的形狀，通常與貫穿孔 的形狀相同，可以設爲如前述之圓形和多角形等。另外， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 __B7 五、發明説明（2〇 ) (請先閲讀背面之注意事項再填寫本頁) 該剖面形狀也無特別限定，通常爲至少其之一部份被嵌合 在貫穿孔內之形狀。例如，可以設爲如第1 2圖〜第1 9 圖所示之剖面形狀。第1 2圖以及第1 2 4圖爲顯示與硏 磨墊用基體1 2相同厚度的透光性構件1 4完全被嵌合在 貫穿孔之狀態的硏磨墊，第1 3圖、第1 5圖、第1 6圖 、第1 7圖以及第1 9圖爲顯示與硏磨墊用基體1 2不同 厚度的透光性構件1 4被嵌合在貫穿孔之狀態的硏磨墊。 另外，上述透光性構件如第1 2圖等般地，雖也可以 不使薄肉化，但是也可以使之薄肉化。所謂薄肉化爲包含 :例如第1 3圖、第1 5圖、第1 6圖、第1 7圖以及第 1 9圖所示般地，使透光性構件的厚度比硏磨墊用基體的 最大厚度還薄；或者，如第1 8圖般地，在透光性構件本 身薄薄形成上述光透過之部份。 上述透光性構件可以原樣使用關於第1觀點之發明的 硏磨墊的薄肉部所具備的性質。 經濟部智慧財產局員工消費合作社印製 因此，藉由使用薄肉化的透光性構件，能夠飛躍提升 透光性，容易檢測硏磨終點。但是，上述透光性構件的厚 度最好在0 · 1mm以上、更好爲0 . 3mm以上，通常 在3 m m以下。如低於〇 · 1 m m ,有要充分確保透光性 構件的機械強度變得困難之傾向。 上述透光性構件的數目並無特別限定，配合貫穿孔的 數目、可以爲1個、也可以爲2個以上。另外，其配置也 並無特別限定。例如，在具備1個透光性構件之情形，可 以如第2 0圖以及第2 1圖般地配置。進而，在具備2個 -23- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部智慧財產局員工消費合作社印製 1221105 A7 ____B7_ 五、發明説明（21 ) 以上的透光性構件之情形，如第2 2圖所示般地，可以配 置爲同心圓狀。 另外，獲得上述水溶性粒子分散的上述非水溶性基塊 材料的方法並無特別限定，與上述第1觀點的發明之硏磨 墊相同，可以混練構成非水溶性基塊材料的材料、水溶性 粒子以及其它的添加劑等之混合物而獲得。 另外，在製造上述透光性構件之際，在構成非水溶性 基塊材料的材料以及水溶性粒子以外，也可以含有提升這 些之親和性以及包含在非水溶性基塊材料之中的水溶性粒 子的分散射用之相溶化劑（藉由酸酐基、羧基、羥基、環 氧基以及氨基等而被變性的聚合物、嵌段共聚物、以及隨 機共聚物等），進而，no n i on系表面活性劑、 以及耦合劑等和這些之殘基。 構成第2觀點的發明之硏磨墊之上述硏磨墊用基體以 及上述透光性構件，也可以在能夠維持透光性之範圍內使 含有習知上在漿料中所含有的磨粒、氧化劑、鹼金屬的氫 氧化物、酸、P Η調節劑、表面活性劑、刮傷防止劑等。 在這些之外，可以使含有：塡充劑、軟化劑、氧化防 止劑、紫外線吸收劑、帶電防止劑、滑動劑、可塑劑等之 各種的添加劑。特別是塡充劑，可以使用：提升碳酸鉀、 碳酸鎂、滑石粉、黏土等之剛性的材料、以及二氧化矽、 氧化鋁、二氧化鈽、氧化鍩、二氧化鈦、二氧化錳、三氧 化二錳、碳酸鋇等之具有硏磨效果的材料等。 又，由於薄肉化所產生之貫穿孔內的不存在上述透光 本紙張尺度適用中國國家標準（CNS ) Α4規格（210乂29：7公釐） (請先閲讀背面之注意事項再填寫本頁)-20- 1221105 A7 _B7 V. Description of the invention (18) (Please read the precautions on the back before filling this page) Any position of the base for the pad can be at the center or at the end. The end portion may be a cutout portion. The shape of the above-mentioned through hole is not particularly limited. For example, the planar shape of the opening portion may be a polygon, a circle, a circle, a fan, a square, a trapezoid, or the like. In addition, the cross-sectional shape of the through-hole may be, for example, a T-shape, an inverted T-shape, a quadrangle, or other shapes (refer to FIGS. 8 to 11. In the figure, the base for the honing pad is represented by 12, and the through-hole is represented by 12. It is represented by 13. Moreover, the upper side of each figure is set as a honing surface side). Among them, the T shape is particularly preferable. The size of one of the above-mentioned through holes is not particularly limited. Generally, when the opening portion is circular, the diameter is preferably 20 mm or more (usually, less than 2/3 of the radius of the honing pad). In the case of a through-hole, the width is preferably greater than 20 mm (usually, less than 2/3 of the radius of the honing pad). In the case of a quadrangle, the depth is more than 30 mm (usually, at 硏The radius of the polishing pad is less than 2/3), and the transverse direction is more than 10mm (usually, it is less than 2/3 of the radius of the honing pad). If each of the through holes is smaller than the above, it may be difficult to surely transmit the light such as the end detection light. In addition, the number of through-holes is not particularly limited. The above-mentioned "light-transmitting member" printed by the Consumer Cooperatives of the Ministry of Economic Affairs and Intellectual Property Bureau means that it has light-transmitting properties that make it easier to detect the end of the honing. A member to be fitted into the through-hole. The light-transmitting member includes a water-insoluble base material and water-soluble particles dispersed in the water-insoluble base material. Materials forming the water-insoluble base material constituting the above-mentioned light-transmitting member The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X29 * 7 mm) -21-1221105 A7 ______B7 V. Description of the invention (19) ( (Please read the notes on the back before filling in this search.) It is ideal to use the material of the water-insoluble base material exemplified in the invention of the first aspect described above. Therefore, the non-water-soluble base material constituting the light-transmitting member is preferably at least a bridge polymer, and the bridge polymer is preferably 1,2-polybutadiene that is bridged. The water-soluble particles constituting the light-transmitting member are not particularly limited, and it is preferable to use the water-soluble particles of the first aspect of the invention in consideration of properties exhibited by the size of the light-transmitting member. That is, it can be the same as the kind, shape, and structure of the water-soluble particle of the invention of the said 1st viewpoint. In addition, as described above, a shell made of epoxy resin, polyamide, polyamide, polysilicate, or the like may be formed on the surface of the water-soluble particles. When the water-soluble particles are honed, In addition to the function of forming pores, it also has a function of matching the pressing hardness of the light-transmitting member to the other parts of the honing pad. In order to increase the pressure applied during honing and increase the honing speed to obtain high flatness, the hardness D of the honing pad as a whole is 3 5 ~ printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 0 0 Better. However, in the case where it is difficult to obtain the desired Diao hardness of the material constituting the water-insoluble base material alone, in this case, in addition to making the water-soluble particles to form fine pores, the Diao D hardness increased to the same degree as the other parts of the honing pad. For this reason, it is preferred that the water-soluble particles are solids which can secure sufficient hardness in the honing pad. The shape of the light-transmitting member is not particularly limited. The planar shape of the honing surface side of the honing pad generally depends on the shape of the through hole, and is generally the same as the shape of the through hole. The shape can be circular or polygonal as described above. Wait. In addition, the size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 1221105 A7 __B7 V. Description of the invention (20) (Please read the precautions on the back before filling this page) The shape of the cross section is not particularly limited , Usually a shape in which at least one part is fitted in the through hole. For example, the cross-sectional shape shown in FIG. 12 to FIG. 19 may be used. 12 and 12 are honing pads showing a state where the light-transmitting member 14 having the same thickness as the base 12 for the honing pad is completely fitted into the through hole, and FIG. 13 and FIG. 5, FIG. 16, FIG. 17, and FIG. 19 are honing pads showing a state where the light-transmitting member 14 having a thickness different from that of the base 12 for the honing pad is fitted into the through hole. The light-transmitting member may not be thinned as shown in Figs. 12 and the like, but may be thinned. The so-called thinness includes, for example, as shown in FIGS. 13, 15, 16, 17, and 19, the thickness of the light-transmitting member is made smaller than that of the base for the honing pad. The maximum thickness is also thin; or, as shown in FIG. 18, the light-transmitting member itself is thin to form the light-transmitting portion. The light-transmitting member can use the properties possessed by the thin meat portion of the honing pad according to the invention of the first aspect. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Therefore, by using thin and light transparent members, the light transmittance can be greatly improved and the end point of honing can be easily detected. However, the thickness of the light-transmitting member is preferably 0.1 mm or more, more preferably 0.3 mm or more, and usually 3 mm or less. If it is less than 0.1 mm, it tends to become difficult to sufficiently secure the mechanical strength of the light-transmitting member. The number of the light-transmitting members is not particularly limited, and the number of the through holes may be one or two or more. The arrangement is not particularly limited. For example, when one light-transmitting member is provided, it can be arranged as shown in Figs. 20 and 21. Furthermore, if there are 2 -23- this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221105 A7 ____B7_ 5. Light transmission above the invention description (21) In the case of a sexual member, as shown in FIG. 22, it can be arranged in a concentric circle shape. In addition, the method for obtaining the water-insoluble base material in which the water-soluble particles are dispersed is not particularly limited, and the material constituting the water-insoluble base material and the water-soluble material can be kneaded in the same manner as the honing pad of the first aspect of the invention. A mixture of particles and other additives. In addition, in the production of the light-transmitting member, in addition to the material constituting the water-insoluble base material and the water-soluble particles, water-soluble base materials may be added to enhance the affinity of these materials and water-soluble base materials. Compatibility agents for particle scattering (polymers, block copolymers, random copolymers, etc. denatured by acid anhydride groups, carboxyl groups, hydroxyl groups, epoxy groups, amino groups, etc.) Surfactants, coupling agents, etc. and these residues. The base material for the honing pad and the light-transmitting member constituting the honing pad of the invention of the second aspect may also contain abrasive grains conventionally contained in a slurry within a range capable of maintaining light transmission, Oxidants, hydroxides of alkali metals, acids, P <(R)> regulators, surfactants, scratch preventives, etc. In addition to these, various additives such as a filler, a softener, an oxidation inhibitor, an ultraviolet absorber, an antistatic agent, a slip agent, and a plasticizer may be contained. In particular, rhenium fillers can be used: materials that enhance the rigidity of potassium carbonate, magnesium carbonate, talc, clay, and the like, as well as silicon dioxide, aluminum oxide, hafnium oxide, hafnium oxide, titanium dioxide, manganese dioxide, and dioxide Materials with honing effect such as manganese and barium carbonate. In addition, the above-mentioned light transmission does not exist in the through-holes caused by thinning. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 乂 29: 7 mm) (Please read the precautions on the back before filling this page. )
-24 - 1221105 A7 _B7_ 五、發明説明（22 ) (請先閲讀背面之注意事項再填寫本頁) 性構件的部位之凹部（參考第1 3圖），和透光性構件的 凹部（參考第1 8圖）雖可以形成在硏磨墊的表裏之任一 側，但是藉由形成在裏面側，可以不影響硏磨性能而使透 光性構件的厚度變薄。 本發明之半導體晶圓用硏磨多層體7 (以下，也單單 稱爲「硏磨多層體」）其特徵爲：具備在上述說明之半導 體晶圓用硏磨墊、與被積層在其裏面側的支持層1 5 ,在 積層方向具有透光性（參考第2 3圖）。 上述支持層是被積層在與硏磨墊的硏磨面相反的裏面 側之層。上述支持層的平面形狀並無特別限定，例如，可 以設爲圓形、四角形等之多角形等，通常與硏磨墊爲相同 之平面形狀。又，在具有藉由凹陷部以確保透光性之部位 的情形，使該部位除外。另外，此支持層可以爲1層，也 可以由2層以上所積層者。進而，在積層2層以上的支持 層之情形，各層可以由相同成份所構成，也可以由不同成 份而構成。 經濟部智慧財產局員工消費合作社印製 上述支持層的厚度並無特別限定，通常可以設爲硏磨 墊的厚度的0.1〜2倍。另外，上述支持層的硬度並無 特別限定，藉由使簫氏D硬度在10〜80,更好爲20 〜5 0 ,即使關於第1觀點的發明之硏磨墊或者第2觀點 的發明之硏磨墊用基體的簫氏D硬度高至6 0〜9 0之情 形，在硏磨時，硏磨多層體整體具有充分之柔軟性，對於 被硏磨面之凹凸可以適當追隨。又，在使用關於第1觀點 的發明之硏磨墊用基體的情形所具備的支持層的厚度以比 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -25- 1221105 A7 B7 五、發明説明（23 ) 上述硏磨墊用基體的硬度還小者爲佳。 (請先閱讀背面之注意事項再填寫本頁) 在第1以及第2觀點的發明之硏磨墊設置支持層之情 形，以支持層的至少被使用在終點檢測的部份具有透光性 爲佳。因此，可以使支持層的一部份薄肉化、開以缺口， 進而，在此缺口部配置具有透光性之構件。 在使用不具有透光性的支持體之情形，藉由使通過光 的一部份開以缺口等之方法，可以確保硏磨多層體的透光 性。 構成上述支持層之材料並無特別限定，可以使用種種 材料。特別是由容易形成爲預定的形狀以及性狀，能夠賦 予適當彈力性等，以使用有機材料爲佳。此有機材料可以 使用被適用在構成上述透光性構件的非水溶性基塊材料的 材料等。但是，構成上述支持層之材料與構成上述透光性 構件的非水溶性基塊材料的材料可以相同，也可以不同。 經濟部智慧財產局員工消費合作社印¾ 因上述第1以及第2觀點的發明之硏磨墊分別具有透 光性故，可以使用在具備光學式終點檢測器的半導體晶圓 硏磨裝置。另外，在上述硏磨墊的裏面積層支持層之硏磨 多層體藉由在上述支持層設置缺口等而使之具備透過光的 部份，同樣也可以使用在具備光學式終點檢測器之半導體 晶圓硏磨裝置。此光學式終點檢測器爲使光由硏磨墊g勺裏 面側透過硏磨面側，由在被硏磨體的表面被反射的光& H 測被硏磨面的硏磨狀況，因而能夠檢測硏磨終點之裝g。 在硏磨墊或者硏磨多層體爲圓盤狀之情形，藉由與此圓盤 的中心成爲同心圓狀將透光性構件設置爲環狀，可以經常 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -26- 1221105 A7 ___B7 五、發明説明（24 ) (請先閲讀背面之注意事項再填寫本頁) 一面觀測硏磨終點一面進行硏磨。如使用此光學式終點檢 測器，不會過度硏磨而在最適當的硏磨終點確實結束硏磨 ，非常有效率。 本發明之半導體晶圓之硏磨方法是一種利用本發明的 硏磨墊或者硏磨多層體的半導體晶圓之硏磨方法，其特徵 爲：利用光學式終點檢測器進行該半導體晶圓之硏磨終點 的檢測。 關於上述「光學式終點檢測器」是與前述者相同。本 發明的半導體晶圓之硏磨方法例如可以利用如第2 4圖所 示之硏磨裝置。即具備：硏磨墊1、與固定此硏磨墊1， 可以旋轉之平板2、與可以旋轉與在縱橫方向移動的加壓 頭3、與在單位時間可以一定量地將漿料滴到平板上之漿 料供給部5、與被設置在平板的下方之光學式終點檢測器 6之裝置。 經濟部智慧財產局員工消费合作社印製 在此硏磨裝置中，在平板上固定本發明之硏磨墊（或 者硏磨多層體）1,一方面，在加壓頭3的下端面固定半 導體晶圓4，一面將此半導體晶圓4以預定的壓力按壓在 硏磨墊1,一面使其抵接在硏磨墊1。然後，由漿料供給 部5 —面將漿料等以預定量地滴到平板上，一面使平板2 以及加壓頭3旋轉，使半導體晶圓4與硏磨墊1、滑動而進 行硏磨。 另外，在此硏磨之際，由光學式終點檢測器6將預定 波長或者波長帶的中鹼檢測用光R 1由平板2 (平板本身 具有透光性，或者一部份有缺口，終點檢測用光可以透過 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -27- 經濟部智慧財1局員工消費合作社印製 1221105 A7 B7__ 五、發明説明（25 ) )之下方，通過第1觀點的發明之硏磨墊或者第2觀點的 發明之透光性構件，朝半導體晶圓的被硏磨面照射。然後 ,以光學式終點檢測器6捕捉此終點檢測用光在半導體晶 圓4的被硏磨面被反射之反射光R 2 ,能夠由此反射光一 面觀測被硏磨面的狀況，一面進行硏磨。 又，上述漿料雖是意指至少含有磨粒的水系分散體， 但在硏磨之際，由外部所供給的可以爲漿料，或者只是不 含有磨粒等之水系媒體。在只供給水系媒體之情形，例如 藉由由硏磨墊內被釋出的磨粒等與水系媒體在硏磨過程被 混合而形成漿料。 如依據本發明的半導體晶圓之硏磨方法，可以一面,經 常觀測硏磨狀況一面進行硏磨，能夠在最適當的硏磨終點 確實結束硏磨。 【發明的實施形態】 以下，依據實施例具體說明本發明。 實施例1 〔1〕硏磨墊之製造 將之後被架橋，成爲非水溶性基塊材料之1 , 2〜聚 丁二烯（J SR股份有限公司製造，品名「JSR R B 8 3 0」）8 0體積％與當成水溶性粒子之/3 -環糊精（ 橫濱國際生物硏究所股份有限公司製造，品名「r牛〉^ A /3 - 1〇〇」）20體積％以被加熱爲120 °c之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ ^* (請先閲讀背面之注意事項再填寫本頁} .裝- -線· 1221105 A7 B7 五、發明説明（26 ) 混合機加以混練。之後，對於1 , 2 -聚丁二烯與/3 -環 (請先閱讀背面之注意事項再填寫本頁) 糊精之合計1 0 0質量部，添加9夕S少A —才牛寸 < 卜、、 (日本油脂股份有限公司製造，品名「A —夕$ 乂 D」 0 . 2質量部，進一步混練後，在沖壓模具內以1 7 0 °C 、2 0分鐘使之架橋反應、成形，獲得直徑6 0 cm、厚 度2mm之圓盤狀的硏磨墊。 〔2〕透過率之測量 利用U V吸光度計（日立製作所股份有限公司製造， 形式「U - 2 0 1 0」），在硏磨墊上不同的5個地點測 量在上述所獲得的硏磨墊的波長4 0 0〜8 0 0 nm的透 過率，算出其平均値。其結果在5次的平均累積透過率爲 7%。另外，633nm( —般爲He - Ne雷射之波長 )的透過率爲6.5%。 〔3〕硏磨性能之測量 經濟部智慧財度局W工消費合作社印^ 將在上述所獲得的硏磨墊裝置在硏磨裝置之平板，在 平板旋轉數爲5 0 r pm、漿料流量每分鐘1 〇 〇cc之條 件下，進行熱氧化膜晶圓的硏磨。其結果爲：硏磨速度每 分鐘9 8 0 A。 實施例2 利用市售之不具有透光性的發泡聚亞胺酯製造硏磨墊 (口 r —少•二7夕公司製造，品名「I C 1 〇 〇 0」） ，以與實施例1相同之條件進行硏磨，硏磨速度爲每分鐘 9 5 0 A。在此硏磨墊設置直徑2 0 nm之圓形的貫穿孔， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 ____B7_ 五、發明説明炉） (請先閲讀背面之注意事項再填寫本頁) 嵌合與上述實施例1的硏磨墊相同構成成份的透光性構件 。利用此新的硏磨墊，以與實施例1相同條件進行硏磨， 硏磨速度爲每分鐘9 5 0 A。 如此，獲得將形成爲預定的大小之透光性構件嵌合在 設置於不具有透光性的發泡聚亞胺酯製硏磨墊之一部份的 貫穿孔內而獲得的硏磨墊，即使利用此硏磨墊進行硏磨之 情形，也知道不會降低不具有透光性的發泡聚亞胺酯製硏 磨墊的硏磨性能。 【圖面之簡單說明】 第1圖是表示本發明之硏磨墊的薄肉部的剖面的一例 之模型圖。 第2圖是表示本發明之硏磨墊的薄肉部的剖面的一例 之模型圖。 第3圖是表示本發明之硏磨墊的薄肉部的剖面的一例 之模型圖。 第4圖是表示本發明之硏磨墊的薄肉部的剖面的一例 之模型圖。 經濟部智慧財產局8工消費合作社印製 第5圖是由表示本發明的薄肉部的平面形狀的一例之 裏面方向所見之模型圖。 第6圖是由表示本發明的薄肉部的平面形狀的一例之 裏面方向所見之模型圖。 第7圖是由表示本發明的薄肉部的平面形狀的一例之 裏面方向所見之模型圖。 -30- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 B7 五'發明説明（28 ) 第8圖是表示被設置在本發明之硏磨墊的貫穿孔的一 例之剖面模型圖。 (請先閲讀背面之注意事項再填寫本頁} 第9圖是表示被設置在本發明之硏磨墊的貫穿孔的一 例之剖面模型圖。 第10圖是表示被設置在本發明之硏磨墊的貫穿孔的 一例之剖面模型圖。 第1 1圖是表示被設置在本發明之硏磨墊的貫穿孔的 一例之剖面模型圖。 第1 2圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 第1 3圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 第1 4圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 第1 5圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 第1 6圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 經濟部智慧財產局員工消費合作社印製 第1 7圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 第1 8圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 第1 9圖是表示硏磨墊用基體以及透光性構件的形狀 以及各各之嵌合插入狀態之一例的模型圖。 -31 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1221105 A7 B7 五、發明説明（29 ) 第2 0圖是表示透光性構件被嵌合插入硏磨墊用基體 的貫穿孔之硏磨墊的一例之平面圖。 第21圖是表示透光性構件被嵌合插入硏磨墊用基體 的貫穿孔之硏磨墊的一例之平面圖。 第2 2圖是表示透光性構件被嵌合插入硏磨墊用基體 的貫穿孔之硏磨墊的一例之平面圖。 第2 3圖是表示本發明的硏磨多層體之一例的剖面模 型圖。 第2 4圖是解說利用本發明之硏磨墊或者硏磨多層體 之硏磨裝置的模型圖。 【標號說明】 1 :硏磨墊， 1 1 :薄肉部， 1 2 :硏磨墊用基體， 1 3 :貫穿孔， 1 4 :透光性構件， 1 5 :支持層， 2 :平板， 3 :加壓頭， 4 :半導體晶圓， 5 :漿料供給部， 6 :光學式終點檢測器， 7 :硏磨多層體， 本纸張尺度適用中國國豕標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁} 裝· 經濟部智慈財產局員工消費合作社印製 32- 1221105 A7 _B7 五、發明説明（3〇 )R 1 :終點檢測用光，R 2 :反射光 I---------裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -33--24-1221105 A7 _B7_ V. Description of the invention (22) (Please read the precautions on the back before filling out this page) Recesses (see Figure 13) of the parts of the transmissive member, and recesses of the translucent member (see the section (Figure 18) Although it can be formed on either side of the front and back of the honing pad, by forming it on the back side, the thickness of the translucent member can be reduced without affecting the honing performance. The honing multilayer body 7 for semiconductor wafers of the present invention (hereinafter, also simply referred to as a "honed multilayer body") is characterized by including the honing pad for a semiconductor wafer described above, and an underlayer on its inner side. The support layer 15 is transparent in the lamination direction (refer to Figure 23). The support layer is a layer laminated on the inner side opposite to the honing surface of the honing pad. The planar shape of the support layer is not particularly limited. For example, it can be a polygon, such as a circle, a quadrangle, or the like, and generally has the same planar shape as the honing pad. In addition, in the case where there is a portion in which the translucency is ensured by the recessed portion, the portion is excluded. In addition, the supporting layer may be one layer, or two or more layers may be stacked. Furthermore, when two or more supporting layers are laminated, each layer may be composed of the same component, or may be composed of different components. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The thickness of the above support layer is not particularly limited, and it can usually be set to 0.1 to 2 times the thickness of the honing pad. In addition, the hardness of the support layer is not particularly limited. The hardness of the Xiao D is 10 to 80, more preferably 20 to 50, even if the honing pad of the first aspect of the invention or the second aspect of the invention is When the hardness D of the base for the honing pad is as high as 60 to 90, the honing multilayer body has sufficient flexibility as a whole during honing, and can appropriately follow the unevenness of the honing surface. In addition, when the substrate for a honing pad according to the invention of the first aspect is used, the thickness of the support layer is in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm) -25- 1221105 A7, which is larger than the paper size. B7 V. Description of the invention (23) The hardness of the above-mentioned substrate for the honing pad is still small. (Please read the precautions on the back before filling out this page.) In the case where a support layer is provided in the honing pad of the inventions of the first and second aspects, at least the part of the support layer that is used for the end point detection is transparent. good. Therefore, a part of the support layer can be thinned and notched, and a light-transmitting member can be disposed in the notched portion. In the case of using a support having no light-transmitting property, by transmitting a part of the passing light with a notch or the like, the light-transmitting property of the honing multilayer body can be ensured. The material constituting the support layer is not particularly limited, and various materials can be used. In particular, it is preferable to use an organic material because it can be easily formed into a predetermined shape and properties, and can impart appropriate elasticity and the like. As the organic material, a material suitable for the water-insoluble base material constituting the light-transmitting member can be used. However, the material constituting the support layer and the material of the water-insoluble base material constituting the translucent member may be the same or different. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ¾ Since the honing pads of the inventions of the first and second aspects described above are each transparent, they can be used in a semiconductor wafer honing device equipped with an optical endpoint detector. In addition, the honing multilayer body having a support layer on the inner surface of the honing pad is provided with a portion for transmitting light by providing a notch or the like in the support layer, and can also be used in a semiconductor crystal having an optical endpoint detector. Round honing device. This optical endpoint detector allows the light to pass from the inside of the honing pad to the honing surface side, and the light reflected on the surface of the honing body to measure the honing condition of the honing surface. Check the g of the honing end point. In the case where the honing pad or the honing multilayer body is disc-shaped, the light-transmitting member is set in a ring shape by becoming concentric with the center of the disc, and the Chinese national standard (CNS) can be applied to this paper standard. A4 specification (210X297 mm) -26- 1221105 A7 ___B7 V. Description of the invention (24) (Please read the precautions on the back before filling this page) While observing the end of the honing, perform honing. If this optical end-point detector is used, it will not end the honing excessively and it will end the honing at the most suitable honing end point, which is very efficient. The honing method for a semiconductor wafer according to the present invention is a honing method for a semiconductor wafer using the honing pad or honing multilayer body of the present invention, which is characterized in that the honing of the semiconductor wafer is performed using an optical endpoint detector. Detection of grinding end point. The aforementioned "optical endpoint detector" is the same as the aforementioned one. The honing method for a semiconductor wafer according to the present invention can use, for example, a honing apparatus as shown in FIG. 24. That is, the honing pad 1 is fixed with the honing pad 1, the flat plate 2 that can be rotated, the pressure head 3 that can be rotated and moved in the vertical and horizontal directions, and the slurry can be dropped onto the flat plate in a certain amount per unit time. The above-mentioned slurry supply unit 5 and a device for an optical endpoint detector 6 provided below the flat plate. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed this honing device to fix the honing pad (or honing multilayer body) 1 of the present invention on a flat plate. On the one hand, a semiconductor crystal is fixed to the lower end face of the pressure head 3 Circle 4, the semiconductor wafer 4 is pressed against the honing pad 1 with a predetermined pressure while the semiconductor wafer 4 is pressed against the honing pad 1. Then, the slurry supply unit 5 drops slurry and the like onto the flat plate in a predetermined amount, while rotating the flat plate 2 and the pressing head 3, the semiconductor wafer 4 and the honing pad 1 are slid to perform honing. . In addition, at the time of honing, the optical endpoint detector 6 transmits the intermediate-alkali detection light R 1 of a predetermined wavelength or wavelength band to the flat plate 2 (the flat plate itself is light-transmissive or a part is notched, and the end point is detected The light can be transmitted through this paper. The Chinese National Standard (CNS) A4 specification (210X297 mm) is applied. -27- Printed by the Employees ’Cooperatives of the 1st Bureau of Smart Finance of the Ministry of Economic Affairs 1221105 A7 B7__ 5. The invention description (25) The honing pad of the invention according to the first aspect or the light-transmitting member of the invention according to the second aspect is irradiated onto the to-be-honed surface of the semiconductor wafer. Then, the optical end point detector 6 captures the reflected light R 2 of the end point detection light reflected on the honed surface of the semiconductor wafer 4, and the reflected light can be used to observe the state of the honed surface while performing the 硏mill. The above-mentioned slurry means an aqueous dispersion containing at least abrasive grains, but during honing, the slurry may be supplied from the outside, or the aqueous medium may not contain abrasive grains or the like. When only the water-based medium is supplied, for example, the abrasive particles released from the honing pad are mixed with the water-based medium during the honing process to form a slurry. According to the honing method of a semiconductor wafer according to the present invention, honing can be performed while observing honing conditions frequently, and the honing can be surely ended at the most appropriate honing end point. [Embodiments of the invention] Hereinafter, the present invention will be specifically described based on examples. Example 1 [1] The manufacturing of the honing pad will be bridged afterwards to become a water-insoluble base block material of 1, 2 to polybutadiene (manufactured by J SR Co., Ltd. under the name "JSR RB 8 3 0") 8 0% by volume and / 3 -cyclodextrin as a water-soluble particle (manufactured by Yokohama International Biological Laboratory Co., Ltd., product name "r cow> ^ A / 3-100") 20% by volume to be heated to 120 The paper size of ° c applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ ^ * (Please read the precautions on the back before filling out this page}. Installation--Line · 1221105 A7 B7 V. Description of the invention ( 26) Mixer to knead. After that, for 1, 2-polybutadiene and / 3-ring (please read the precautions on the back before filling this page) Total dextrin 1 0 0 quality part, add 9 y S Less A — Only Niu inch < Bu ,, (manufactured by Japan Oil and Fat Co., Ltd., product name "A — $$ 乂 D" 0.2 quality department, after further kneading, in the stamping die at 1 70 ° C, 2 The bridge was reacted and shaped in 0 minutes to obtain a disc-shaped honing pad with a diameter of 60 cm and a thickness of 2 mm. [2] Measurement of transmittance A UV absorbance meter (manufactured by Hitachi, Ltd., in the form "U-2 0 1 0") was used to measure the wavelengths of the obtained honing pads at 5 different locations on the honing pads 4 0 0 to 8 0 The average transmittance of 0 nm is calculated. The average cumulative transmittance at 5 times is 7%. In addition, the transmittance of 633 nm (typically He-Ne laser wavelength) is 6.5%. [3] Measurement of Honing Performance Printed by the Wisdom and Consumer Cooperative of the Bureau of Wisdom and Finance of the Ministry of Economic Affairs ^ The honing pad obtained in the above is installed on the plate of the honing device, the number of rotations of the plate is 50 r pm, the slurry flow rate is 1 per minute Honing of the thermally oxidized film wafer was performed under the condition of 〇〇cc. The result was a honing rate of 980 A per minute. Example 2 A commercially available foamed polyurethane without light transmission was used. A honing pad was manufactured (port r — manufactured by Shaoji Company, under the product name “IC 1 000”), and honing was performed under the same conditions as in Example 1. The honing rate was 9 50 A per minute. This honing pad is provided with a circular through hole with a diameter of 20 nm. The paper size is applicable to the Chinese National Standard (CNS ) A4 size (210X297 mm) 1221105 A7 ____B7_ V. Inventive furnace) (Please read the precautions on the back before filling out this page) Fit a light-transmitting member with the same composition as the honing pad of Example 1 above. With this new honing pad, the honing was performed under the same conditions as in Example 1, and the honing speed was 9 50 A per minute. Thus, a light-transmitting member formed into a predetermined size was fitted to a unit provided in It is known that a honing pad obtained by penetrating through a part of a part of a light-transmitting foamed honing pad made of polyurethane is not reduced even if the honing pad is used for honing. Honing performance of a light-foamed polyurethane honing pad. [Brief description of the drawings] Fig. 1 is a model diagram showing an example of a cross section of a thin meat portion of a honing pad according to the present invention. Fig. 2 is a model diagram showing an example of a cross section of a thin meat portion of a honing pad of the present invention. Fig. 3 is a model diagram showing an example of a cross section of a thin meat portion of a honing pad of the present invention. Fig. 4 is a model diagram showing an example of a cross section of a thin meat portion of a honing pad according to the present invention. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Industrial Cooperative Cooperative. Fig. 5 is a model view seen from the inner direction showing an example of the planar shape of the thin meat portion of the present invention. Fig. 6 is a model view seen from the back surface showing an example of the planar shape of the thin meat portion of the present invention. Fig. 7 is a model view seen from the back surface showing an example of the planar shape of the thin meat portion of the present invention. -30- This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 1221105 A7 B7 Five 'Invention Description (28) Figure 8 shows an example of a through hole provided in the honing pad of the present invention. Section model diagram. (Please read the precautions on the back before filling in this page.) Figure 9 is a cross-sectional model view showing an example of a through hole provided in the honing pad of the present invention. Figure 10 is a view showing the honing provided in the present invention. Sectional model view of an example of a through hole of a pad. Fig. 11 is a cross-sectional model view showing an example of a through-hole provided in a honing pad of the present invention. Fig. 12 shows a base for a honing pad and light transmission. Figure 13 is a model view showing an example of the shape of the flexible member and each of the fitting and inserting states. Figures 13 and 13 are model views showing the shape of the base for the honing pad and the light-transmitting member and an example of the fitting and inserting status of each of the members. Fig. 14 is a model view showing an example of the shape of a base for a honing pad and a light-transmitting member, and a fitting state of each of them. Fig. 15 shows a shape of a base for a honing pad and a light-transmitting member. And a model diagram of an example of each of the mating insertion states. FIG. 16 is a model diagram showing the shape of a base and a transparent member for a honing pad and an example of each of the mating insertion states. Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperation Fig. 17 printed by the company is a model view showing an example of the shape of a base for a honing pad and a light-transmitting member and a state of fitting and insertion of each. Fig. 18 is a view showing a base for a honing pad and light-transmitting property. Fig. 19 is a model diagram showing an example of the shape of a member and a mating insertion state of each mating insert. Fig. 19 is a model diagram showing an example of a shape of a base for a honing pad and a light-transmitting member and each mating insertion state.- 31-This paper size applies the Chinese National Standard (CNS) A4 (210X297 mm) 1221105 A7 B7 V. Description of the invention (29) Figure 20 shows the penetration of the translucent member inserted into the base of the honing pad. A plan view of an example of a honing pad for a hole. Fig. 21 is a plan view showing an example of a honing pad in which a light-transmitting member is fitted into a through-hole of a base for a honing pad. Figs. 22 and 22 show a light-transmitting member. A plan view of an example of a honing pad being inserted into a through hole of a base for a honing pad. Figs. 23 and 3 are cross-sectional model views showing an example of a honing multilayer body of the present invention. Figs. Honing pad or honing multilayer body Model diagram of honing device. [Label description] 1: honing pad, 1 1: thin meat part, 12: base for honing pad, 1 3: through hole, 1 4: translucent member, 1 5: support Layer, 2: flat plate, 3: pressurizing head, 4: semiconductor wafer, 5: slurry supply section, 6: optical end point detector, 7: honing multilayer body, this paper is in accordance with China's national standard ( CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling out this page} Equipment · Printed by the Consumer Consumption Cooperative of the Intellectual Property Office of the Ministry of Economy 32-1221105 A7 _B7 V. Description of Invention (3〇) R 1 : End-point detection light, R 2: Reflected light I --------- install-(Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs Paper size applies to China National Standard (CNS) A4 (210X297 mm) -33-