TWI221189B - Method for fabricating test piece and method for forming protection layer of test piece of epoxy resin - Google Patents
Method for fabricating test piece and method for forming protection layer of test piece of epoxy resin Download PDFInfo
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- TWI221189B TWI221189B TW92126791A TW92126791A TWI221189B TW I221189 B TWI221189 B TW I221189B TW 92126791 A TW92126791 A TW 92126791A TW 92126791 A TW92126791 A TW 92126791A TW I221189 B TWI221189 B TW I221189B
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- test piece
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- 238000012360 testing method Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000003822 epoxy resin Substances 0.000 title claims description 6
- 229920000647 polyepoxide Polymers 0.000 title claims description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 59
- 239000010410 layer Substances 0.000 claims description 44
- 230000001681 protective effect Effects 0.000 claims description 42
- 239000011241 protective layer Substances 0.000 claims description 33
- 230000005540 biological transmission Effects 0.000 claims description 14
- 238000010884 ion-beam technique Methods 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Sampling And Sample Adjustment (AREA)
Abstract
Description
1221189 案號 92126791 年 月 曰 修正 五、發明說明（1) 【發明所屬之技術領域 本發明是有關於一 的製作方法，且特別是 片的製作方法以及試片 【先前技術】 在半導體產業之製 需要作薄膜檢測，或是 厚度量測或表層結構檢 級的量測，必須藉由穿 e由使分 定子離積撞 在子，表 OP藉常度 預離被沉碰 然離時的 SC須通厚 些式會面的 雖受小片 ro必。及 這焦面表束 ，不個晶 ic作理度 當聚表片子 面時5-6片 Μ製處寬 ，用片晶離 方割5整 on片來、 而使晶於隔 一切費於 tr試機度 然在層管阻 另在耗而 ec的割長。 ，護爐層。 片須， 1鏡切成片 片保由護構 晶積點 種試片之保護層的形成方法及試片 有關於一種穿透式電子顯微鏡的試 之保護層的形成方法。 程中，生產線上的一些生產步驟常 在故障分析步驟中也需要進行表層 查。因上述之量測皆屬於微米尺寸 透式電子顯微鏡（Transmission ，TEM)來進行，而穿透式電子顯微 聚焦式離子束（Focused Ion Beam) 用F I B將晶片上須觀察的位置切割 別為1 5微米、5微米及0 · 1微米之薄 接受檢測之表層厚度或結構的晶 束切割機切割試片時，若其表層無 子束損壞。傳統的做法是必須再經 一層氮化石夕保護層’以此氮化^夕保 ，藉此達到準確量測表層厚度及結 晶片上沈積氮化矽保護層能夠保護 束破壞，然而，氮化石夕保護層的沈 為了量測屬於微米尺寸級的檢測 面沉積保護層，不僅非常費時且耗1221189 Case No. 92126791 Rev. V. Description of the Invention (1) [Technical Field to which the Invention belongs] The present invention relates to a manufacturing method, and in particular, to a method for manufacturing a tablet and a test piece. [Prior technology] Manufacturing in the semiconductor industry Need to do thin film inspection, or thickness measurement or surface structure inspection level measurement, must pass through e to make the sub-stator separation product hit the sub, the table OP must be pre-separated from the SC when it is bumped away. Through the thicker style of meeting, although a small piece of ro must. And this focal plane table beam, no crystal ic operation degree when the surface of the sheet is gathered, 5-6 pieces of M system wide, cut with a piece of crystal 5 squares away from the side, so that the crystal will cost everything tr The test machine is in the layer pipe resistance and the ec cut length. , Furnace layer. Sheet whisker, 1 mirror cut into pieces, the chip is protected by a protective structure, the formation method of the protective layer of the test piece, and the test piece relates to a test method of the protective layer of a transmission electron microscope. During the process, some production steps on the production line often require surface inspection during the failure analysis step. Because the above measurements are carried out by micron size transmission electron microscope (Transmission, TEM), the transmission electron microscope focused ion beam (Focused Ion Beam) uses FIB to cut the position to be observed on the wafer to 1. 5 micron, 5 micron, and 0.1 · 1 micron. When the test piece is cut by a beam cutting machine with a thickness or structure of the test surface, if the surface layer has no sub-beam damage. The traditional method is to pass another layer of nitrided nitride protective layer to nitridate it, so as to achieve accurate measurement of the surface layer thickness and the deposition of a silicon nitride protective layer on the crystalline wafer can protect the beam from damage. However, the nitrided silicon protective layer Depositing a protective layer to measure a micron-sized detection surface is not only time-consuming and time-consuming.
11046twf1.ptc 第6頁 1221189 _案號92126791_年月日__ 五、發明說明（2) 成本，而且，亦無法快速進行檢測以達到即時監控製程缺 陷的目的。 【發明内容】 因此，本發明之目的是提供一種試片的製作方法以及 試片之保護層的形成方法，能夠在進行離子束切割時保護 試片的表層結構，使晶片不受離子束損壞。 本發明之另一目的是提供一種試片的製作方法以及試 片之保護層的形成方法，能夠節省時間與成本。 本發明提供一種試片的製作方法，此方法係提供一試 樣，其中於此試樣上具有預定形成試片的區域，然後於此 試樣上形成一保護材料層，其中保護材料層僅覆蓋在預定 形成試片的區域及其周圍，接著使用切割機切割試樣上之 預定形成試片的區域以形成試片。 在上述試片的製作方法中，本發明之保護材料層的材 質例如是高分子聚合物，而以環氧樹脂為佳。 而且，本發明之保護材料層的厚度例如是介於0 . 2微 米至0. 5微米之間。 並且，本發明之形成保護材料層的方法係使用一針狀 物沾取一保護層形成材料，再以針狀物將保護層形成材料 塗佈於試樣上以形成保護材料層。 如上所述，由於本發明在製作穿透式電子顯微鏡之試 片時，藉由在試樣表面的預定區域形成一層以高分子聚合 物為材質的保護材料層來阻隔聚焦式離子束切割機之離子 撞擊，因此能保護試片表層結構的完整性。11046twf1.ptc Page 6 1221189 _Case No. 92126791_Year Month Date__ 5. Description of the invention (2) Cost, and it can not be detected quickly to achieve the purpose of real-time monitoring of process defects. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a test piece and a method for forming a protective layer of the test piece, which can protect the surface structure of the test piece during ion beam cutting so that the wafer is not damaged by the ion beam. Another object of the present invention is to provide a method for manufacturing a test strip and a method for forming a protective layer of the test strip, which can save time and cost. The invention provides a method for manufacturing a test piece. The method is to provide a sample, wherein the sample has an area where a test piece is to be formed, and then a protective material layer is formed on the sample, wherein the protective material layer only covers In the area where the test piece is to be formed and the surrounding area, the area where the test piece is to be formed on the sample is then cut using a cutter to form a test piece. In the method for manufacturing the test piece, the material of the protective material layer of the present invention is, for example, a polymer, and an epoxy resin is preferred. Moreover, the thickness of the protective material layer of the present invention is, for example, between 0.2 micrometers and 0.5 micrometers. In addition, the method for forming a protective material layer of the present invention is to use a needle to dip a protective layer forming material, and then apply the protective layer forming material to the sample with a needle to form a protective material layer. As described above, when the present invention is used to prepare a test piece for a transmission electron microscope, a protective material layer made of a polymer is used to block a focus ion beam cutter in a predetermined area on the surface of the sample. Ion impact, so the integrity of the surface structure of the test strip can be protected.
11046twfl.ptc 第7頁 1221189 _案號92126791_年月曰 修正_ 五、發明說明（3) 而且，本發明係僅對預定形成試片的區域進行精密的 定點塗佈，使得此保護材料層僅形成於預定形成試片的區 域及其周圍，並可以快速的形成，因此本發明的保護材料 形成方法與試片製作方法係能夠節省時間及成本。 此外，由於本發明之保護材料層能夠相當快速的製作 完成，因此能夠快速的進行檢測以達到即時監控製程缺陷 的目的。 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細 說明如下： 【實施方式】 請參照第1圖，第1圖所繪示為穿透式電子顯微鏡試片 之製作方法的步驟流程圖。 首先，請參照步驟S 1 0 0 :提供一試樣，其中於此試樣 上具有預定形成穿透式電子顯微鏡試片之一區域。此試樣 例如是尚未形成用於試片切割時之保護層的晶片。 接著，請參照步驟s 1 2 0 :於試樣上形成一保護材料 層，且此保護材料層只覆蓋在預定形成試片的區域及區域 的周圍。其中僅於預定形成試片的區域及其周圍上形成保 護材料層的方法係如下所述： 首先係將此試樣在光學儀器例如是光學顯微鏡下辨識 出於一預定區域，此預定區域即是所要檢測的區域。 接著，請同時參照第2圖與第3圖，第2圖為用以在試 樣上形成保護材料層之儀器的實體示意圖，且第3圖所繪11046twfl.ptc Page 7 1221189 _Case No. 92126791_Year Month Amendment_ V. Description of the Invention (3) Moreover, the present invention applies precise spot coating only to the area where the test strip is to be formed, so that the protective material layer is only It is formed in the area where the test strip is to be formed and its surroundings, and can be quickly formed. Therefore, the method for forming a protective material and the test strip manufacturing method of the present invention can save time and cost. In addition, since the protective material layer of the present invention can be manufactured quite quickly, it can be quickly detected to achieve the purpose of real-time monitoring of process defects. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the preferred embodiments are described below in detail with the accompanying drawings as follows: [Embodiment] Please refer to FIG. 1, FIG. 1 is a flowchart showing the steps of a method for manufacturing a transmission electron microscope test piece. First, please refer to step S 100: providing a sample, wherein an area of a sample of a transmission electron microscope is formed on the sample. This sample is, for example, a wafer on which a protective layer for cutting a test piece has not been formed. Next, please refer to step s 1 2 0: forming a protective material layer on the sample, and the protective material layer only covers the area and the area around the area where the test piece is to be formed. The method of forming a protective material layer only on the area where the test piece is to be formed and its surroundings is as follows: First, the sample is identified by an optical instrument, such as an optical microscope, as a predetermined area, and the predetermined area is The area to be detected. Next, please refer to Fig. 2 and Fig. 3 at the same time. Fig. 2 is a physical diagram of an instrument for forming a protective material layer on a test sample, and the drawing is drawn in Fig. 3
11046twfl.ptc 第8頁 1221189 案號 92126791 曰 修正 五、發明說明（4) 示為此儀器之塗佈保護材料層部分的放大示意圖。如第2 圖所示，本發明所使用之在試樣上形成保護材料層之儀 器，例如是可精密微調的三軸移動座2 0 0，並且，第3圖所 示係為第2圖之圈示部位A的放大圖，如第3圖所示，在此 三軸移動座2 0 0上係配置有探針狀的針狀物2 1 0，其中此針 狀物2 1 0例如是藉由條狀玻璃片2 2 0而連接配置在此可精密 微调的二轴移動座2 0 0上，用以沾取塗料並塗佈於晶片 弟4圖所緣不為使用具有針狀物的三轴移動座於試樣 上形成保護層的上視圖，第5圖所繪示為使用具有針狀物 的二軸移動座於試樣上形成保護層的剖面示意圖，請同時 參照第4圖與第5圖，首先係使用針狀物2 1 〇的尖端沾取保 護層形成材料。接著，藉由調整可精密微調的三軸移動座 200，以使連接於其上的針狀物21〇能前後左右上下移動 (亦即是沿X軸、Y軸及Z軸移動）於試樣（晶片）4〇〇的表面以 接近之預定形成試片的區域450，並藉由調整三軸移動座 2 0 0以使針狀物2 1 0上下移動，而將保護材料層4 3 〇形成材 料塗佈在試樣4 0 0之表層結構4 1 〇上預定形成試片的位置及 其周圍’以僅在試樣400上預定形成試片的區域45〇及其周 圍形成一層保護材料層430。其中此保護層材料43〇之材質 例如是高分子聚合物，而以環氧樹脂（Ep〇xy resin)為 佳，並且，此保護材料層的厚度例如是介於〇 · 2微米至〇 · 5 微米之間。假如保護材料層42〇的厚度超過〇 5微米，將會 於切割機切割之後，保護材料層43〇造成游塌而使試片無11046twfl.ptc Page 8 1221189 Case No. 92126791 Amendment V. Description of the invention (4) Shown as an enlarged schematic diagram of the part of the protective coating layer coated with this instrument. As shown in FIG. 2, the instrument used to form a protective material layer on the sample used in the present invention is, for example, a three-axis moving base 200 that can be fine-tuned. Moreover, FIG. 3 is shown in FIG. 2. The enlarged view of the circled part A, as shown in FIG. 3, is a probe-like needle 2 1 0 arranged on the three-axis moving seat 2 0 0, where the needle 2 1 0 is borrowed, for example The strip-shaped glass sheet 2 2 0 is connected and arranged on the finely adjustable two-axis moving seat 2 0 0 for dipping and coating the paint on the wafer. The edge of the figure 4 is not the three The top view of the axis moving seat on the sample to form a protective layer. Figure 5 shows a cross-sectional schematic diagram of the use of a two-axis moving seat with a needle to form a protective layer on the sample. Please refer to FIGS. 4 and 4 at the same time. In Fig. 5, the protective layer forming material is first dipped with the tip of a needle 2 10. Then, by adjusting the finely adjustable three-axis moving base 200, the needles 21 connected to it can move back and forth, left, right, up and down (that is, move along the X axis, Y axis, and Z axis) on the sample. (Wafer) The surface of 400 is close to the area 450 where the test piece is scheduled to be formed, and the protective material layer 4 3 is formed by adjusting the three-axis moving seat 200 to move the needle 2 10 up and down. The material is coated on the surface of the sample 400 with the surface structure 4 1 0 where it is intended to form a test piece and its surroundings to form a protective material layer 430 only on the area 400 on the sample 400 where the test piece is to be formed. . The material of the protective layer material 43 is, for example, a high molecular polymer, and epoxy resin (Epoxy resin) is preferred, and the thickness of the protective material layer is, for example, between 0.2 μm and 0.5 μm. Between micrometers. If the thickness of the protective material layer 42 is more than 0.5 micron, after the cutting machine cuts, the protective material layer 43 will cause the test piece to collapse and make the test piece non-existent.
1221189 案號 92126791 曰 修正 五、發明說明（5) 法使用。而若厚度小於0 . 2微米，則此試樣4 0 0的表層結構 4 1 0依然會因切割機的離子束撞擊而損壞。 第6圖為本發明將保護層材料塗佈在試樣表面之預定 區域上的保護材料層4 3 0之局部放大影像圖。如第6圖所 示，本發明確實能準確地僅將保護層材料塗佈在試樣表面 之預定形成試片的區域及其周圍上，以形成一保護材料 層。 接著，請參照步驟s 1 4 0 :切割試樣表面上之預定形成 試片的區域以形成試片。此切割步驟係將已形成保護材料 層之試樣放入切割機進行切割，其中此切割機例如是聚焦 式離子束切割機，並且其離子束係使用以鎵為離子源的液 相金屬離子源。 請參照第7圖，第7圖為經由聚焦式離子束切割機切割 後之試片，經由穿透式電子顯微鏡所獲得的剖面影像圖。 如第7圖所示，在此試片700中，由於在試片700上係形成 有保護材料層430以覆蓋表層結構720，因此在製作穿透式 電子顯微鏡之試片時，係能夠保護試樣的表層不受離子束 的撞擊，從而保持形成在基底710上之表層結構720的完 整。 如上所述，本發明的技術特徵係在製作穿透式電子顯 微鏡之試片時，藉由在試樣表面的預定區域形成一層以高 分子聚合物為材質的保護材料層來阻隔聚焦式離子束切割 機之離子撞擊，因此能保護試片表層結構的完整性。 而且，本發明係僅對預定形成試片的區域進行精密的1221189 Case No. 92126791 Amendment V. Description of Invention (5) Method used. If the thickness is less than 0.2 micron, the surface structure of the sample 400 will still be damaged by the impact of the ion beam of the cutting machine. Fig. 6 is a partial enlarged image diagram of the protective material layer 430 in which the protective layer material is coated on a predetermined area on the surface of the sample according to the present invention. As shown in FIG. 6, the present invention can indeed accurately coat only the protective layer material on the surface of the sample and the area around the test strip to be formed to form a protective material layer. Next, refer to step s 1 40: cutting a predetermined area on the surface of the sample to form a test piece to form a test piece. In this cutting step, a sample having a protective material layer formed is put into a cutting machine for cutting. The cutting machine is, for example, a focused ion beam cutting machine, and its ion beam uses a liquid metal ion source using gallium as an ion source. . Please refer to Figure 7. Figure 7 is a cross-sectional image of a test piece cut by a focused ion beam cutter through a transmission electron microscope. As shown in FIG. 7, in this test piece 700, a protective material layer 430 is formed on the test piece 700 to cover the surface structure 720. Therefore, when a test piece of a transmission electron microscope is manufactured, the test piece can be protected. The sample surface layer is not impacted by the ion beam, thereby maintaining the integrity of the surface layer structure 720 formed on the substrate 710. As described above, the technical feature of the present invention is to block a focused ion beam by forming a protective material layer made of a high-molecular polymer material in a predetermined area on the surface of the sample when preparing a test piece for a transmission electron microscope. The ion impact of the cutting machine can protect the integrity of the surface structure of the test strip. Moreover, the present invention precisely performs precision
11046twfl.ptc 第10頁 1221189 ___案號 92126791_年月日__ 五、發明說明（6) 定點塗佈，使得此保護材料層僅形成於預定形成試片的區 域及其周圍，並可以快速的形成，因此本發明的保護材料 形成方法與試片製作方法係能夠節省時間及成本。 此外，由於本發明之保護材料層能夠相當快速的製作 完成，因此能夠快速的進行檢測以達到即時監控製程缺陷 的目的。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。11046twfl.ptc Page 10 1221189 ___Case No. 92126791_Year Month Day__ V. Description of the invention (6) Spot coating, so that this protective material layer is formed only in the area where the test piece is to be formed and its surroundings, and can quickly Therefore, the method for forming a protective material and the method for preparing a test piece of the present invention can save time and cost. In addition, since the protective material layer of the present invention can be manufactured quite quickly, it can be quickly detected to achieve the purpose of real-time monitoring of process defects. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be determined by the scope of the attached patent application.
11046twfl.ptc 第11頁 1221189 _案號92126791_年月日__ 圖式簡單說明 第1圖為穿透式電子顯微鏡試片之製作方法的步驟流 程圖。 第2圖為用以在試樣上形成保護材料層之儀器的實體 示意圖。 第3圖所繪示為此儀器之塗佈保護材料層部分的放大 示意圖。 第4圖。所繪示為使用具有針狀物的三軸移動座於試樣 上形成保護層的上視圖。 第5圖所繪示為使用具有針狀物的三軸移動座於試樣 上形成保護層的剖面圖。 第6圖係顯示本發明能準確地將保護層材料僅塗佈在 試樣表面的預定形成晶片區域的局部放大影像圖。 第7圖為經由聚焦式離子束切割機切割後之試片，經 由穿透式電子顯微鏡所獲得的剖面影像圖。 【圖式標示說明】 - S100 、S120 、S140 ：步驟 2 0 0 :可精密微調的三軸移動座 2 1 0 :針狀物 2 2 0 :條狀玻璃片 4 0 0 :試樣 4 1 0、7 2 0 :表層結構 4 3 0 :保護材料層 4 5 0 :預定形成試片的區域 7 0 0 :試片11046twfl.ptc Page 11 1221189 _Case No. 92126791_Year Month Day__ Brief Description of Drawings Figure 1 is a flow chart showing the steps of the method for making a transmission electron microscope test piece. Fig. 2 is a schematic diagram of a device for forming a protective material layer on a sample. Figure 3 shows an enlarged schematic view of the part of the protective coating layer coated for this instrument. Figure 4. Shown is a top view of a protective layer formed on a specimen using a three-axis moving seat with needles. Figure 5 is a cross-sectional view of a protective layer formed on a sample using a three-axis moving seat with needles. Fig. 6 is a partial enlarged image view showing that the present invention can accurately coat the protective layer material only on the surface of the sample where a predetermined wafer is to be formed. Fig. 7 is a sectional image of a test piece cut by a focused ion beam cutter through a transmission electron microscope. [Illustration of Graphical Symbols]-S100, S120, S140: Step 2 0 0: Three-axis moving base with fine adjustment 2 1 0: Needle 2 2 0: Strip glass piece 4 0 0: Sample 4 1 0 7 2 0: Surface layer structure 4 3 0: Protective material layer 4 5 0: Area where test piece is planned to be formed 7 0 0: Test piece
11046twf1.ptc 第12頁 1221189 案號 92126791 年 月 修正 圖式簡單說明 71 0 :基底 11046twfl.ptc 第13頁 1111046twf1.ptc Page 12 1221189 Case No. 92126791 Amendment Brief description of the drawing 71 0: Base 11046twfl.ptc Page 13 11
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| TW92126791A TWI221189B (en) | 2003-09-29 | 2003-09-29 | Method for fabricating test piece and method for forming protection layer of test piece of epoxy resin |
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| Application Number | Priority Date | Filing Date | Title |
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| TW92126791A TWI221189B (en) | 2003-09-29 | 2003-09-29 | Method for fabricating test piece and method for forming protection layer of test piece of epoxy resin |
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