TWI220799B - Light-emitting device with metal matrix composite material carrier - Google Patents

Abstract

The present invention is related to a light-emitting device having metal matrix composite material carrier. The invention contains the followings: a metal matrix composite material carrier, which is featured with having adjustable thermal conduction coefficient or heat expansion coefficient; one bonding layer formed on the metal matrix composite material carrier; and one light-emitting stacked layer formed on the bonding layer.

Description

1220799 V. Description of the Invention (1) Technical Field of the Invention The present invention relates to a light-emitting element, and particularly to a light-emitting element having a metal matrix composite carrier. The applications of light-emitting elements are quite wide, for example, they can be applied to optical display devices, laser diodes, traffic signs, data storage devices, communication devices, lighting devices, and medical devices. Prior technology The material of traditional light-emitting elements is mainly semiconductors, which have poor thermal conductivity. When the light-emitting element is energized, heat is generated because the light-emitting element emits light. Because the light-emitting element is a semiconductor material, it does not conduct heat well. If this heat cannot be removed properly, the light-emitting element will reduce the light-emitting efficiency due to heat. For example, for materials composed of A 1 G a I η P, under the same current conditions, when the external temperature rises from 20 ° C to 80 ° C, the brightness will drop by 20% to 50%. The aforementioned problem is that on small-sized light-emitting elements, since the current is less than 30 m A to 50 m A at low current operation, the heat generated by light emission can be barely conducted by the stack, so the problem is not obvious; but When it occurs in a large-sized light-emitting element, and the current is greater than 100 m A ~ 1 A at high current operation, the heat generated by the large-sized light-emitting element cannot be removed in time, and the temperature of the light-emitting element will rise. , The brightness is significantly reduced, so that the luminous power of the light-emitting element is greatly reduced. A light emitting diode is disclosed in U.S. Patent No. 6 2 8 7 8 8 2

Page 5 1220799 V. Description of the invention (2) A metal reflective adhesive bonds a light-emitting stack and a metal substrate, so that the light-emitting diode has the functions of reflection and heat conduction. In the Republic of China Patent No. 151410, a semiconductor element with a metal substrate is disclosed. A metal material is plated on a semiconductor light-emitting stack by electroplating to form a metal substrate. The metal substrate is used to replace the traditional semiconductor substrate. To achieve the function of heat conduction. However, in the above two structures, because the thermal expansion coefficient of the metal substrate is different from that of the semiconductor light-emitting stack, the difference between the two is very large. Therefore, during the subsequent processing, the difference in thermal expansion coefficient between the metal substrate and the light-emitting stack makes the There is peeling between the two, which reduces the reliability of the product. SUMMARY OF THE INVENTION In a document published by Kevin A. Moores et al. (Future Circuits International, Issue No. 7, pp. 45-49, 2001), a metal matrix composite (MMC) carrier is mentioned, in which the metal The matrix composite carrier is filled with a suitable metal matrix in a carrier having holes, so that the metal matrix composite carrier has a tunable heat transfer coefficient or thermal expansion coefficient characteristic. When thinking about how to solve the foregoing problems, the inventor of the present case thought that if a metal matrix composite (MMC) carrier was used to make the thermal expansion coefficient of the metal matrix composite carrier close to that of a light-emitting stack, then An adhesive layer combines the metal matrix composite carrier with the light-emitting laminate. So will

Page 6 1220799 V. Description of the invention (3) It can solve the problem of peeling between the metal substrate and the light-emitting stack in the conventional structure. In addition, because the metal matrix composite material carrier is filled with a metal matrix, the metal matrix composite material carrier also has a high heat transfer coefficient, thereby achieving the function of heat energy dissipation. The main object of the present invention is to provide a light emitting element having a metal matrix composite carrier. By using a metal matrix composite carrier, the thermal expansion coefficient of the metal matrix composite carrier is close to that of a light emitting stack. In this way, the problem of peeling between the metal substrate and the light emitting stack in the conventional structure can be solved. Another object of the present invention is to provide a light-emitting element having a metal matrix composite carrier. The metal matrix composite carrier also has a high heat transfer coefficient. In this way, the problem that the thermal energy in the light-emitting element cannot be removed immediately. According to a preferred embodiment of the present invention, a light-emitting element having a metal matrix composite material carrier includes a metal matrix composite carrier, wherein the metal matrix composite carrier is filled with a metal matrix in a carrier having holes; An adhesive layer combines the metal matrix composite carrier with a luminescent stack. The aforementioned metal matrix composite carrier is selected from the group consisting of MMC (Metal Matrix Composites) and CMC (

Page 7 1220799 V. Description of the invention (4)

Ceramic Metal Composites (Ceramic Metal Composites), at least one of the material groups or other alternative materials. For an embodiment, please refer to FIG. 1. According to a preferred embodiment 1 of the present invention, a light-emitting element 1 having a metal matrix composite carrier includes a metal matrix composite carrier 10, wherein the metal matrix composite carrier is in a cavity having a hole. The carrier is filled with a suitable metal matrix, so that the thermal expansion coefficient of the metal matrix composite carrier is close to that of a light-emitting stack; a metal reflective layer 1 1 formed on the metal matrix composite carrier; and formed on the metal reflection A transparent adhesive layer 12 on the layer; a transparent conductive layer 13 formed on the transparent adhesive layer, wherein the upper surface of the transparent conductive layer includes a first surface region and a second surface region; A light emitting stack 14 on the first surface region; a first wiring electrode 15 formed on the second surface region; and a second wiring electrode 16 formed on the light emitting stack. In the above embodiment 1, a first reaction layer may be formed between the metal reflective layer and the transparent adhesive layer; a second reaction layer may be formed between the transparent adhesive layer and the transparent conductive layer to improve the Adhesion. In Embodiment 1 described above, the metal reflective layer may be formed between the transparent adhesive layer and the transparent conductive layer. In addition, in the above embodiment, the transparent adhesive layer may be replaced by an opaque adhesive layer, and at the same time, the metal reflective layer is formed.

Page 8 1220799 V. Description of the invention (5) Between the opaque adhesive layer and the transparent conductive layer. In the above-mentioned Embodiment 1, a first reaction layer may be formed between the metal reflective layer and the conductive transparent adhesive layer; a second reaction layer may be formed between the conductive transparent adhesive layer and the transparent conductive layer, so that Improve adhesion between. In the above-mentioned Embodiment 1, the transparent adhesive layer may be replaced by a conductive transparent adhesive layer. The metal reflective layer may also be formed between the conductive transparent adhesive layer and the transparent conductive layer. In addition, in the foregoing embodiment, the conductive transparent adhesive layer may be replaced by a conductive adhesive layer, and the metal reflective layer is formed between the conductive adhesive layer and the transparent conductive layer. Please refer to FIG. 2. According to another preferred embodiment 2 of the present invention, a light-emitting element 2 having a metal matrix composite carrier includes a metal matrix composite carrier 20, wherein the metal matrix composite carrier is on a carrier having holes. A suitable metal matrix is filled in the metal matrix, so that the thermal expansion coefficient of the metal matrix composite carrier is close to that of a light-emitting stack; a metal bonding layer 2 1 formed on the metal matrix composite carrier; An upper light emitting stack 2 2; and a wiring electrode 23 formed on the light emitting stack. The aforementioned metal matrix composite carrier is selected from the group consisting of MMC (Metal Matrix Composites) and CMC (Ceramic

Page 9 1220799 V. Description of the invention (6)

Metal Composites, at least one of the materials in the family of materials or other alternative materials; the aforementioned light-emitting stacks include at least one of the materials in the family of AlGalnP, A1 InGaN and AlGaAs series ^ The adhesive layer includes at least one material selected from the group consisting of polyimide (PI), benzocyclobutane (BCB), or perfluorocyclobutane (PFCB); the conductive transparent adhesive layer includes an optional 2. spontaneously conducting

polymer) or at least one material in a polymer group doped with a conductive material, wherein the conductive material includes a material selected from the group consisting of indium tin oxide, cadmium tin oxide, antimony tin oxide, zinc oxide, zinc tin oxide, and Au And at least one material in the group of materials formed by N i / Au; the first anti-wide layer system includes at least one material selected from the group of materials formed by Si NX, Ti or C r; The second reaction layer includes at least one material selected from the group consisting of Si NX and τ i. The metal reflection layer ^ includes a material selected from In, Sn, Al, Au, Pt, Zn, and Ge. , Ag, Ti, Pb, -Pd, Cu, AuBe, AuGe, Ni, PbSn, or AiiZn; at least one of the material groups; the aforementioned metal bonding layer system is selected from the group consisting of

In, Sn, Α1, Αυ, Pt, Zη, Ge, Ag, Ti, Pb, Pd, Cu;

The material group ψ U,, 1 T <A, consisting of AuBe, AuGe, Ni, PbSn, or AuZn is at least one material. Although the light-emitting element of the present invention has been disclosed above with preferred embodiments, the scope of the invention is not limited to the above-mentioned preferred embodiments, but should be defined by the following claims. So anyone who knows the art well, at $ =

1220799

Page 11 1220799 Brief description of the drawings Brief description of the drawings: Fig. 1 is a schematic diagram showing a light-emitting element having a metal matrix composite carrier according to a preferred embodiment of the present invention. Fig. 2 is a schematic view showing a light emitting device having a metal matrix composite carrier according to another preferred embodiment of the present invention.

DESCRIPTION OF SYMBOLS 1 Light emitting element 10 Metal matrix composite carrier 11 Metal reflective layer 12 Transparent adhesive layer 13 Transparent conductive layer 14 Light emitting stack 15 First wiring electrode 16 Second wiring electrode 2 Light emitting element 20 Metal matrix composite carrier 21 Metal bonding layer 22 Light emitting stack 23 Wiring electrode 第 12 页

Claims (1)

1220799 VI. Scope of patent application 1. A light emitting element having a metal matrix composite carrier, comprising: a metal matrix composite carrier; an adhesive layer formed on the metal matrix composite carrier; and a layer formed on the adhesive layer A luminescent stack. 2. The light-emitting element having a metal matrix composite material carrier as described in item 1 of the scope of the patent application, wherein the adhesive layer is a transparent adhesive layer. 3. The light-emitting element with a metal matrix composite material carrier as described in the second item of the patent application scope, wherein the transparent adhesive layer is a transparent conductive adhesive. 4. As described in the second scope of the patent application, the light-emitting element has a metal matrix composite. The light emitting element of the material carrier, wherein the transparent adhesive layer is a transparent non-conductive adhesive layer. 5. The light-emitting device having a metal matrix composite carrier as described in item 1 of the scope of the patent application, wherein the bonding layer is an opaque bonding layer. 6. The light-emitting element having a metal matrix composite carrier as described in item 5 of the scope of the patent application, wherein the opaque adhesive layer is an opaque conductive adhesive layer. 7. The composite material with metal matrix as described in item 5 of the scope of patent application. Page 13 1220799 VI. Patent application body Light-emitting element, wherein the opaque adhesive layer is an opaque non-conductive adhesive layer. 8. The light-emitting element having a metal matrix composite carrier as described in item 1 of the scope of the patent application, further comprising a first reaction layer between the metal matrix composite matrix and the bonding layer. 9. The light-emitting element having a metal matrix composite carrier as described in item 1 of the scope of the patent application, wherein a second reaction layer is further included between the bonding layer and the light-emitting stack. 10. The light-emitting element having a metal matrix composite carrier as described in item 8 of the scope of the patent application, further comprising a metal reflective layer between the metal matrix composite carrier and the first reaction layer. 1 1. The light-emitting element having a metal matrix composite carrier as described in item 9 of the scope of the patent application, further comprising a metal reflective layer between the second reaction layer and the light-emitting stack. 1 2. The light-emitting element having a metal matrix composite carrier as described in item 11 of the scope of the patent application, further comprising a transparent conductive layer between the metal reflective layer and the light-emitting stack. 1 3. Composite material with metal matrix as described in item 1 of the scope of patent application Page 14 1220799 6. Scope of patent application The light-emitting element of the carrier, wherein the bonding layer is a metal bonding layer. 1 4. The light-emitting element having a metal matrix composite carrier as described in item 1 of the scope of the patent application, wherein the bonding layer is a metal reflective bonding layer. 1 5. The light-emitting element having a metal matrix composite carrier as described in item 1 of the scope of patent application, wherein the metal matrix composite carrier comprises a material selected from the group consisting of MMC (Metal Matrix Composites) and CMC (Ceramic Metal Composites) o 1 6. The light-emitting element having a metal matrix composite carrier as described in item 2 of the scope of the patent application, wherein the transparent adhesive layer comprises a material selected from the group consisting of polyimide (PI), benzocyclobutane (BCB), and Perfluorocyclobutane (PFCB) at least one of the materials in the material group or other alternative materials. 1 7. The light-emitting element with a metal matrix composite carrier as described in item 3 of the scope of the patent application, wherein the transparent conductive adhesive layer is selected from the group consisting of an intrinsically conducting polymer or a polymer At least one of the materials in the material group composed of doped conductive materials or other alternative materials. 1 8. The light-emitting element having a metal matrix composite material carrier as described in item 17 of the scope of patent application, wherein the conductive material comprises a material selected from indium oxide Page 15 1220799 6. Scope of patent application At least one of the materials in the material group consisting of tin, cadmium tin oxide, antimony tin oxide, zinc oxide, zinc tin oxide, Au and Ni / Au or other alternative materials. 19. The light-emitting element having a metal matrix composite carrier as described in item 13 of the scope of the patent application, wherein the metal bonding layer comprises a material selected from the group consisting of I η, Sn, A1, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu and at least one of the materials in the group of materials or other alternative materials. 20. The light-emitting element having a metal matrix composite material Φ carrier according to item 14 of the scope of the patent application, wherein the metal reflective adhesive layer comprises a material selected from the group consisting of In, Sn, A1, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu and at least one of the materials in the material group or other alternative materials. Page 16