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TWI299175B - Flat light source and manufacturing method thereof - Google Patents

Flat light source and manufacturing method thereof Download PDF

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Publication number
TWI299175B
TWI299175B TW95100314A TW95100314A TWI299175B TW I299175 B TWI299175 B TW I299175B TW 95100314 A TW95100314 A TW 95100314A TW 95100314 A TW95100314 A TW 95100314A TW I299175 B TWI299175 B TW I299175B
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TW
Taiwan
Prior art keywords
electrode
substrate
light source
insulating layer
planar light
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Application number
TW95100314A
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Chinese (zh)
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TW200727322A (en
Inventor
Chao Jen Chang
Hon We Wu
Te Chu Lu
Cheng Kuai Hsu
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Chunghwa Picture Tubes Ltd
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Priority to TW95100314A priority Critical patent/TWI299175B/en
Publication of TW200727322A publication Critical patent/TW200727322A/en
Application granted granted Critical
Publication of TWI299175B publication Critical patent/TWI299175B/en

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Description

rtwf.doc/006 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種光源及其製造方法,且特別是有 關於一種平面燈源及其製造方法。 【先前技術】 近年來,大部分的顯示螢幕皆以液晶顯示面板(Liquid fryStal Display panel,LCD panel)為主流。然而,因為液晶 顯示面板本身並不具有發光的功能,故在液晶顯示面板下 方必須長:供一背光模組(Back light module)以提供光源,進 ,達到顯示的功能。背光模組中的燈源一般是發光燈管所 提供,而燈管所發出之光線再通過背光模組中之光學膜片 I進行散射後,形成一適於照射液晶顯示面板之面光源。 但是,若能直接利用平面燈源,則可以提昇光線的利 用放率以及更均勻的面光源,且平面燈源除了可以應用於 液晶顯示面板之背光源外,也可應用在許多其他之領域 上。因此,平面燈源有其發展的優勢。 般而§ ’平面燈源是一種電槳發光元件,其主要是 利,在電極對之間形成一高電壓差以產生高能電子,並經 由高能電子撞擊惰性氣體(inertgas)而形成所謂之電漿: ^彳^ ’電漿中被激發的激態原子會以放射紫外線的方式將 月匕里釋放出來,而所放射之紫外線會進一步激發平面燈源 中的螢光粉(phosphor),以發出可見光。 圖1是習知之一種平面燈源的剖面示意圖。請參照圖 ’通常傳統平面燈源的電極對l〇4a、104b會形成在第一 rtwf.doc/006 基板100上,而介電圖案106會覆蓋住電極對104a、104b。 螢光層108會塗佈在介電圖案1〇6的表面上。而當於第_ 與第二基板1〇〇、102之間通入惰性氣體,並於電極對 104a、104b之間施予電壓以產生高能電子時,會在電極對 104a、104b之間形成一放電路徑110。然而,由於放電路 徑110會通過螢光層108,因而會使螢光層1〇8不斷的受 到電漿的轟擊,導致螢光層108加速劣化。如此一來,$ 面燈源的使用壽命將無法持久。另外,在傳統平面燈源中, 於電極對lG4a、lG4b之間產生—高能電子所f的點火電壓 以及維持(sustain)電壓都需要一定程度的高電壓,因此二 平面燈源還有耗電之缺點。 、 【發明内容】Rtwf.doc/006 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a light source and a method of fabricating the same, and more particularly to a planar light source and a method of fabricating the same. [Prior Art] In recent years, most of the display screens have been dominated by Liquid FyStal Display Panels (LCD panels). However, since the liquid crystal display panel itself does not have the function of emitting light, it must be long under the liquid crystal display panel: a backlight module is provided to provide a light source, to enter, and to achieve the display function. The light source in the backlight module is generally provided by the light-emitting tube, and the light emitted by the light tube is scattered by the optical film I in the backlight module to form a surface light source suitable for illuminating the liquid crystal display panel. However, if the planar light source can be directly used, the utilization rate of the light and the more uniform surface light source can be improved, and the planar light source can be applied to many other fields in addition to the backlight of the liquid crystal display panel. . Therefore, the planar light source has its development advantages. General § 'The flat light source is an electric pad light-emitting element, which is mainly advantageous in that a high voltage difference is formed between the electrode pairs to generate high-energy electrons, and the so-called plasma is formed by the high-energy electrons striking the inert gas (inertgas). : ^彳^ 'The excited atoms excited in the plasma will release the Moonlight in the form of ultraviolet rays, and the emitted ultraviolet rays will further excite the phosphor in the planar light source to emit visible light. . 1 is a schematic cross-sectional view of a conventional planar light source. Referring to the drawing, the electrode pairs 104a, 104b of the conventional planar light source are formed on the first rtwf.doc/006 substrate 100, and the dielectric pattern 106 covers the electrode pairs 104a, 104b. The phosphor layer 108 is coated on the surface of the dielectric pattern 1〇6. When an inert gas is introduced between the first and second substrates 1 and 102, and a voltage is applied between the electrode pairs 104a and 104b to generate high-energy electrons, a pair is formed between the electrode pairs 104a and 104b. Discharge path 110. However, since the discharge path 110 passes through the phosphor layer 108, the phosphor layer 1 8 is continuously bombarded by the plasma, resulting in accelerated degradation of the phosphor layer 108. As a result, the life of the $light source will not last long. In addition, in the conventional planar light source, the ignition voltage and the sustain voltage of the high-energy electron f are generated between the pair of electrodes lG4a and lG4b, and a certain high voltage is required, so that the two-plane light source has power consumption. Disadvantages. [Content of the invention]

本發明之目的是提供一種平面燈源,以解決傳 燈源存在低使用壽命以及需高點火以及 題。 J 點 本务明之另口叩疋促货一禋平面燈源的製造 法,所製出的平面燈源具有較長的使用壽命,且所 火電壓以及維持電壓也都較低。 _本發明提出—種平面燈源,其包括-第-基板、多個 Z壁、-螢光層、—第二基板、多個電極圖案以及 ^丄阻隔妓配置於第_基板上。螢光層是配置於阻隔 :=二:第:基板是配置於第一基板的上方。電極圖 木疋配置於*二基板上’且每—電極圖案會與第一基板上 I299^8^twf^d〇c/006 的每-阻隱對齊。絕緣層會覆難電 別是’第-基板與第二基板之間填人有— = 螢光層上方的相鄰兩電極圖案之間會形成—放電:在 依據本發明-較佳實施例,上述之電極 : 介於5至300微米之間。 口木的阿度疋 依據本發明一較佳實施例,上述之 从 括一咸光性導^ 圖木的材料包 祜生W材枓。在一貫施例中 包括有金屬粒子。 凡丨王令私材枓内 依據本發明一較佳實施例,上述之絕緣層包括一第一 =層:及2二絕緣層,第一絕緣層覆蓋電極圖案的側 表面’弟二絕緣層覆蓋電極圖案的頂部表面。在— 中,第一絕緣層以及第二絕緣層之材質不相同。貝 玻璃依據本發明-較讀闕,上述之町罐之材質包括 依據本發明-較佳實施例,上述之 於50至300微米之間。 弋冋度疋" 2本發明—難實闕,本發明之平面燈源更包括 一反射層,配置於第一基板的表面上。 楚一if明另提ΐ—種平面光源的製造方法。首先提供一 土反,且在第一基板上形成多個阻隔壁,再於 =表=上形成-螢光層。接著,提供—第二基板,並且在 弟二土板上域多個電極圖案,在電極圖案的表面上形成 ^緣2。之後將第—基板與第二基板組立在_起,並於 弟-與第二基板之間填入—惰性氣體。特別是,位於榮光 1299 ί gT^twf.doc/006 層上方的相鄰兩電極_之間會形成-放電路徑。 發明—較佳實施例,在第—基板上形成阻隔壁 =方法b括利用-模製製程,以模製出具有_壁 基板。 依據本發明一較佳實施例,在第一 之方法包括:在第-私上开基板上形成阻隔壁 ^ ο 在弟基扳上形成一材料層;在材料声上擗 ίί 進行一喷砂製程,以定義出阻隔壁;“移除 荦,佳實關,在第二紐上形成電極圖 第二基板上形成—第_絕 括·在 基板上定羞屮/、中弟一絶緣層會於第二 夕们龟極區;於電極區内开i成一带扠JS 構成電於雜贿的 成成^層’以 依據本發明-較佳實施例,在第^ 絕緣層。 緣層的方法包括利用一模製製程。土反㊉成第-絕 依據本發明—較佳實 緣層的方法包括進行一噴砂製程。弟—基板场成第—絕 依據本發明—較估奋 方法包括:直接將將:電極區内形成電極層的 行一乾燥步驟。%極材㈣料注人電極區中;以及進 依據本發明一較佳净 方法包括:於第二電極區内形成電極層的SUMMARY OF THE INVENTION It is an object of the present invention to provide a planar light source that addresses the low lifetime of the light source and the need for high ignition. J point This is a separate method of manufacturing a flat light source. The flat light source produced has a long service life, and the fire voltage and the sustain voltage are also low. The present invention provides a planar light source comprising a -first substrate, a plurality of Z walls, a phosphor layer, a second substrate, a plurality of electrode patterns, and a plurality of barrier spacers disposed on the first substrate. The phosphor layer is disposed on the barrier: = two: the substrate is disposed above the first substrate. The electrode pattern is disposed on the *two substrates and each of the electrode patterns is aligned with each of the I299^8^twf^d〇c/006 on the first substrate. The insulating layer may be hard-to-charge, and the first substrate and the second substrate are filled with each other. - The adjacent two electrode patterns above the phosphor layer are formed. Discharge: In accordance with the present invention, a preferred embodiment, The above electrode: between 5 and 300 microns. Adu 疋 of the Mouth Wood According to a preferred embodiment of the present invention, the above material is formed from a material package comprising a salty light guide wood. Metal particles are included in consistent applications. According to a preferred embodiment of the present invention, the insulating layer comprises a first layer and a second insulating layer, and the first insulating layer covers the side surface of the electrode pattern The top surface of the electrode pattern. In -, the materials of the first insulating layer and the second insulating layer are different. According to the present invention - the material of the above-mentioned cans comprises, according to the present invention - the preferred embodiment, between 50 and 300 microns.弋冋度疋" 2 The invention is difficult to implement. The planar light source of the present invention further comprises a reflective layer disposed on the surface of the first substrate. Chu Yi if Ming also mentions the method of manufacturing a planar light source. First, a soil reverse is provided, and a plurality of barrier walls are formed on the first substrate, and a -fluorescent layer is formed on the = table. Next, a second substrate is provided, and a plurality of electrode patterns are formed on the second earth plate, and a ^2 is formed on the surface of the electrode pattern. Thereafter, the first substrate and the second substrate are grouped together, and an inert gas is filled between the second substrate and the second substrate. In particular, a -discharge path is formed between adjacent electrodes _ above the layer of glory 1299 ί gT^twf.doc/006. Invention - A preferred embodiment is to form a barrier wall on a first substrate. The method b includes a use-molding process to mold a substrate having a wall. According to a preferred embodiment of the present invention, the first method includes: forming a barrier wall on the first-private open substrate, forming a material layer on the substrate, and performing a sandblasting process on the material sound 擗ίί To define the barrier wall; "Remove 荦, Jiashiguan, form the electrode on the second substrate on the second layer. - _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the second day of the turtle pole region; in the electrode region, a fork JS is formed into a layer of electrical bribes. According to the present invention - a preferred embodiment, the second insulating layer. The method of the edge layer includes The use of a molding process. The soil is inferior to the tenth - according to the invention - the preferred solid edge layer method comprises a sandblasting process. The younger - the substrate field is the first - according to the invention - the method of estimating the effort includes: directly Forming: a drying step of forming an electrode layer in the electrode region. The % electrode (4) is injected into the electrode region; and a preferred method according to the present invention comprises: forming an electrode layer in the second electrode region

心^ 電極材料,留下位於電極區的C 依據本發明—較 电乜^的電極材料。 ’於電極區_成電極層的 1299 说 twf.doc/006 方法包括:於第二基板上形成—電極材料;以+ 砂製程,以圖案化電極材料,留下位於 進仃—11貧 依據本發明—触實關,於f__了第 二絕緣層的方法包括進行—網板印刷製程。貝娜成弟 第二ίΓΓ之rT面燈源及其製造方法因將電極對製作在 弟一土板上,因此電極對之間所形成的放電路徑避 合的赏光層。如此—來,螢光層受到電漿轟擊的機 會大幅減少,因而能夠增加平面燈源的使用壽命。 一為讓本毛明之上述和其他目的、特徵和優黑占能更明顯 易懂,下文特舉較佳實施例,並配合所附圖式,作 明如下。 【實施方式】 圖^是依照本發明之一實施例之一種平面燈源的示意 圖。凊芩照圖2,本實施例之平面燈源包括一第一基板 200、多個阻隔壁204、一螢光層208、一第二基板2〇2、 多個電極圖案210a、210b以及一絕緣層216。 第一基板200以及第二基板2〇2之材質例如是透明的 玻璃。阻隔壁204是配置於第一基板200上。在一實施例 中’阻隔壁204之材質包括玻璃。此外,阻隔壁204之高 度例如是介於50至300微米之間。螢光層208是配置於阻 隔壁204的表面上。在另一實施例中,在第一基板2〇〇表 面上更可以配置一反射層206,此反射層206可以使平面 燈源所產生的光線能往顯示方向透射出去。在圖2所繪示 1299¾ 7twf.doc/0〇6 的平面燈源中,反射層206是配置於第一基板200與阻隔 壁204之間。在另一實施例中,如圖3所示,反射層2〇7 是配置於第一基板200的底部表面。 此外’電極圖案210a、210b是配置於第二基板202 上,且每一電極圖案2l〇a或21〇b會與第一基板200上的 每一阻隔壁2〇4對齊。在一實施例中,電極圖案21〇a、21〇b 的咼度是介於5至300微米之間。電極圖案21〇a、21〇b 的材料例如包括一感光性導電材料。而此感光性導電材料 内包括有金屬粒子,其例如是銀粒子、紹粒子、銅粒子或 其他具有導電性的金屬粒子。 此外’絕緣層216是覆蓋住電極圖案2l〇a、210b的表 面。在一實施例中,絕緣層216包括一第一絕緣層212以 及一第二絕緣層214,第一絕緣層212覆蓋電極圖案21〇a、 210b的侧表面,第二絕緣層214覆蓋電極圖案21〇a、21〇b 的頂部表面。第一絕緣層212以及第二絕緣層214之材質 例如是不相同的材質。在一實施例中,第一絕緣層212之 材質包括玻璃,而第二絕緣層214之材質包括金屬氧化 物,其例如是氧化鋅或氧化鉛等等。 特別是,在第一基板200與第二基板202之間填入有 一惰性氣體,當施予電壓於電極圖案21〇a、210b上時,在 螢光層208上方的電極圖案21 〇a、210b之間會形成一放電 路徑218。而在放電路徑218中所產生的電漿的激態原子 會放射I外線’以激發螢光層11〇發出可見光。值得注意 的是,由於本發明之平面燈源中的放電路徑218避開了榮 ㈣m twf.doc/〇〇6 光層^)8 ’因此螢光層规受到電衆轟擊的機會大幅減少, 因而能夠增加平面燈源的使用壽命。 另外,由於本發明之平面燈源中的放電路徑相較於傳 統平面燈源的放電路徑來得短,因此本發明之平面燈源所 需的點火電壓及維持電壓都比較低,因而具有較為省電的 優點。如表1所列示之比較數據: 表1 電壓 電流 電源 亮度 傳統之平面燈源 24V 24A 576W 11974nit 本發明之平面燈源 ---—-------- 17V 20A 340W ----— 11965nit 、在表1中,傳統平面燈源與本發明之平面燈源在相同 或相似的亮度條件下,所需的電壓分別是24v以及17V, 所需的電源分別是576W以及340W。由此可知,本發明 之平面燈源相較於傳統平面燈源確實具有較省電的功效。 而上述圖2或圖3之平面燈源的製造方法如下所述。 首先,在第一基板200上形成阻隔壁2〇4,而其形成方法 可以利用一模製製程來完成。較詳細的說明是,請參照圖 4 A,利用機械模製方式直接將玻璃融鑄成第一基板2 〇 〇以 及阻隔壁204。之後,請參照圖4B,於第一基板2〇〇之底 部表面貼上反射層207。接著,再進行螢光層塗佈步驟, 即形成如圖3所示之第一基板200與位於第一基板2〇〇上 的各個構件。 依照本發明另一實施例,在第一基板200上形成阻隔 11 1299 ^(^twf.doc/OOe 璧204亦可以利用一喷砂製程來完成。較詳細的說明是, 請參照圖5A,首先在第一基板200上以印刷、塗佈、貼附 戒是其他合適之方法形成反射層206 ,在於反射層2〇6上 形成材料層203,其例如是一玻璃層。接著,於玻璃層 203上形成一罩幕5〇() ’其例如是利用貼附一乾膜光阻層並 進行一微影製程而形成。隨後,進行一喷砂製程5Q2,以 移除未被罩幕500所覆蓋的玻璃層203。之後,請參照圖 5B,移除罩幕500,而形成阻隔壁204,且反射層206是 形成於阻隔壁204與第一基板200之間。隨後,再進行螢 光層塗佈步驟,即形成如圖2所示之第一基板200與位於 第一基板200上的各個構件。 另外,關於第二基板202以及第二基板200上個各構 件的製造方法如下所述。首先,請參照圖6A,在第二基板 202上形成第一絕緣層212,其中第一絕緣層212會於第二 基板200上定義出多個電極區600。而在第二基板202上 形成第一絕緣層212的方法例如是利用一模製製程或是一 喷砂製程。也就是說,可以利用機械模製方式直接將玻璃 融鑄成第二基板202以及第一絕緣層212。或者是,於第 二基板202上塗佈上一玻璃層(未繪示)’並且在玻璃層上 行成一罩幕(未繪示),再進行一喷砂製程,以於第二基板 202形成第一絕緣層212。 接著,請參照圖6B,在電極區600中内形成一電極層 210 ’以構成如圖2及圖3所示之電極圖案210a、21〇b。 而於電極區600中形成一電極層210之方法例如是將一電 12 1299磘 twf.doc/006 桎材料漿料直接注人電極區_ ——。 固化電極材料漿料。上诚 仃乾魅步驟以 子:子,子或===是含有銀粒 之方法如圖=中首在先中内形成-電極層21。 第二基板搬上。之後材料;^面的形成在 上方設置一光罩_,2圖^不’在第二基板搬的 , 亚進仃一曝光製程802,以蔣氺1The core material of the electrode, leaving the electrode material located in the electrode region in accordance with the present invention. 'In the electrode region _ into the electrode layer 1299 said twf.doc / 006 method includes: forming a - electrode material on the second substrate; + sand process to pattern the electrode material, leaving the 位于 - 11 poverty based Invention - The method of touch-off, the method of f__ the second insulating layer comprises performing a screen printing process. Bena Chengdi's second-level rT surface light source and its manufacturing method are made by making the electrode pairs on a slab, so that the discharge path formed between the electrode pairs avoids the light-receiving layer. As a result, the chances of the phosphor layer being bombarded by the plasma are greatly reduced, thereby increasing the life of the planar light source. In order to make the above and other objects, features and advantages of the present invention more apparent, the preferred embodiments are described below in conjunction with the accompanying drawings. [Embodiment] Figure 2 is a schematic view of a planar light source in accordance with an embodiment of the present invention. Referring to FIG. 2, the planar light source of the present embodiment includes a first substrate 200, a plurality of barrier walls 204, a phosphor layer 208, a second substrate 2, a plurality of electrode patterns 210a, 210b, and an insulation. Layer 216. The material of the first substrate 200 and the second substrate 2〇2 is, for example, transparent glass. The barrier ribs 204 are disposed on the first substrate 200. In one embodiment, the material of the barrier wall 204 comprises glass. Further, the height of the barrier ribs 204 is, for example, between 50 and 300 microns. The phosphor layer 208 is disposed on the surface of the barrier rib 204. In another embodiment, a reflective layer 206 can be disposed on the surface of the first substrate 2, and the reflective layer 206 can transmit light generated by the planar light source to the display direction. In the planar light source of 12993⁄4 7twf.doc/0〇6 shown in FIG. 2, the reflective layer 206 is disposed between the first substrate 200 and the barrier wall 204. In another embodiment, as shown in FIG. 3, the reflective layer 2〇7 is disposed on the bottom surface of the first substrate 200. Further, the electrode patterns 210a, 210b are disposed on the second substrate 202, and each of the electrode patterns 21a or 21b is aligned with each of the barrier walls 2A4 on the first substrate 200. In an embodiment, the twist of the electrode patterns 21a, 21〇b is between 5 and 300 microns. The material of the electrode patterns 21A, 21B includes, for example, a photosensitive conductive material. Further, the photosensitive conductive material includes metal particles, which are, for example, silver particles, particles, copper particles or other conductive metal particles. Further, the insulating layer 216 is a surface covering the electrode patterns 21a, 210b. In one embodiment, the insulating layer 216 includes a first insulating layer 212 and a second insulating layer 214. The first insulating layer 212 covers the side surfaces of the electrode patterns 21〇a, 210b, and the second insulating layer 214 covers the electrode patterns 21. The top surface of 〇a, 21〇b. The materials of the first insulating layer 212 and the second insulating layer 214 are, for example, different materials. In one embodiment, the material of the first insulating layer 212 comprises glass, and the material of the second insulating layer 214 comprises a metal oxide such as zinc oxide or lead oxide or the like. In particular, an inert gas is filled between the first substrate 200 and the second substrate 202, and when the voltage is applied to the electrode patterns 21a, 210b, the electrode patterns 21a, 210b above the phosphor layer 208 A discharge path 218 is formed between them. The exciting atoms of the plasma generated in the discharge path 218 emit an I line ' to excite the phosphor layer 11 to emit visible light. It is worth noting that since the discharge path 218 in the planar light source of the present invention avoids the glory (four) m twf.doc/〇〇6 optical layer ^) 8 ', the chance of the fluorescent layer gauge being bombarded by the electric power is greatly reduced. Can increase the life of the flat light source. In addition, since the discharge path in the planar light source of the present invention is shorter than the discharge path of the conventional planar light source, the planar light source of the present invention requires relatively low ignition voltage and sustain voltage, thereby providing more power saving. The advantages. The comparison data listed in Table 1: Table 1 Voltage and current power supply brightness Traditional planar light source 24V 24A 576W 11974nit The planar light source of the present invention -------------- 17V 20A 340W ---- — 11965nit. In Table 1, the conventional planar light source and the planar light source of the present invention have the same or similar brightness conditions, and the required voltages are 24V and 17V, respectively, and the required power supplies are 576W and 340W, respectively. It can be seen that the planar light source of the present invention does have a more power-saving effect than a conventional planar light source. The method of manufacturing the planar light source of Fig. 2 or Fig. 3 described above is as follows. First, the barrier ribs 2 〇 4 are formed on the first substrate 200, and the formation method thereof can be performed by a molding process. In more detail, referring to Fig. 4A, the glass is directly cast into the first substrate 2 〇 and the barrier rib 204 by mechanical molding. Thereafter, referring to Fig. 4B, a reflective layer 207 is attached to the bottom surface of the first substrate 2''. Next, a phosphor layer coating step is further performed, i.e., the first substrate 200 as shown in Fig. 3 and the respective members on the first substrate 2 are formed. According to another embodiment of the present invention, a barrier 11 1299 ^ is formed on the first substrate 200 (^twf.doc/OOe 璧 204 can also be completed by a sand blasting process. For a detailed description, please refer to FIG. 5A, first The reflective layer 206 is formed on the first substrate 200 by printing, coating, attaching, or other suitable method, and a material layer 203 is formed on the reflective layer 2〇6, which is, for example, a glass layer. Next, in the glass layer 203 Forming a mask 5 〇 () is formed, for example, by attaching a dry film photoresist layer and performing a lithography process. Subsequently, a sand blasting process 5Q2 is performed to remove the glass not covered by the mask 500. Layer 203. Thereafter, referring to FIG. 5B, the mask 500 is removed to form the barrier wall 204, and the reflective layer 206 is formed between the barrier wall 204 and the first substrate 200. Subsequently, a phosphor layer coating step is performed. That is, the first substrate 200 and the respective members on the first substrate 200 as shown in Fig. 2 are formed. Further, the manufacturing methods of the respective members of the second substrate 202 and the second substrate 200 are as follows. First, please Referring to FIG. 6A, the first substrate is formed on the second substrate 202. The edge layer 212, wherein the first insulating layer 212 defines a plurality of electrode regions 600 on the second substrate 200. The method for forming the first insulating layer 212 on the second substrate 202 is, for example, a molding process or a The blasting process, that is, the glass can be directly cast into the second substrate 202 and the first insulating layer 212 by mechanical molding. Alternatively, a glass layer is coated on the second substrate 202 (not shown) And forming a mask (not shown) on the glass layer, and performing a sandblasting process to form the first insulating layer 212 on the second substrate 202. Next, referring to FIG. 6B, the electrode region 600 is formed. An electrode layer 210' is formed to form the electrode patterns 210a, 21b as shown in FIGS. 2 and 3. The method of forming an electrode layer 210 in the electrode region 600 is, for example, an electric 12 1299 磘 twf.doc / 006桎Material slurry directly injected into the electrode area _ ——. Curing electrode material slurry. On the steps of the 仃 仃 以 以 以 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子Forming the electrode layer 21. The second substrate is carried on. After the material; _ A reticle, FIG. 2 does not ^ 'transfer of the second substrate, a sub-intake Ding exposure process 802 to 1 JIANG Shui

00上的圖案轉移到電極材料700。之後,進行一曰 程,以移除一部份的電極 丁頦衫衣 的電極層⑽,如_所^^ 電極區細内 7新在又Ί貫施例中’在電極區中形成電極層之方法如圖 所不’ f先將一電極材料7〇〇全面的塗佈在第二基板202 上。之後,如圖9所示,在電極材料700上形成一罩幕9〇〇, 亚且進行-喷砂製程9〇2,以移除未被罩幕_覆蓋的電 極材料700 ’而留下電極區6〇〇内的電極層21〇,如圖犯The pattern on 00 is transferred to electrode material 700. Thereafter, a process is performed to remove a portion of the electrode layer (10) of the electrode of the electrode, such as the electrode region of the electrode, and the electrode layer is formed in the electrode region. The method is as follows: First, an electrode material 7 is entirely coated on the second substrate 202. Thereafter, as shown in FIG. 9, a mask 9 is formed on the electrode material 700, and a sandblasting process 9〇2 is performed to remove the electrode material 700' that is not covered by the mask to leave an electrode region. The electrode layer 21 within 6〇〇, as shown in the figure

所不之結構。 在70成電極層210的製作之後,請參照圖6C,於電 極層210的頂部形成一第二絕緣層214,其例如是利用印 刷製程而形成。如此一來,電極層21〇的侧表面會被第— 絕緣層212覆蓋,而其頂部表面會被第二絕緣層214覆蓋。 最後’再將以上述方式製成的第一基板2〇〇與第二基 板202組立在一起,並於第一與第二基板2〇〇、2〇2之間填 入一惰性氣體,如此即完成一平面燈源的製作。 綜上所述,本發明之平面燈源及其製造方法因將電極 13 ㈣瑞 7twf.doc/006 對製作在第二基板上,因此電極對之間所形成的放電路徑 避開了第一基板上的螢光層。如此一來,螢光層受到電漿 轟擊的機會大幅減少,因而能夠增加平面燈源的使用壽 命。此外,由於放電路徑的路徑長度變短,因此本發明之 平面燈源所需的點火電壓及維持電壓可以減低,因而具有 省電的優點。 八 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保護 範圍¥視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是習知之一種平面燈源的剖面示意圖。 圖2是依照本發明之一實施例之一種平面燈源的示意 圖。 μ 圖3疋依照本發明另一實施例之一種平面燈源的示意 圖。 〜 圖4 Α至圖4 Β是依照本發明—實施例之平面燈源之第 一基板及位於第一基板上的構件的製造流程剖面示音圖。 ^圖5A至圖是依照本發明另一實施例之平面^源之 弟一基板及位於第一基板上的構件的製造流程剖面示意 圖。 … 圖6A至圖6C是依照本發明另一實施例之平面燈源之 第二基板及位於第二基板上的構件的製造流程剖意 14 1299 m— _ 圖。 圖7至圖9是依照本發明之實施例之於第二基板上形 成電極圖案的製造流程剖面示意圖。 【主要元件符號說明】 Λ 100、200 :第一基板 ” 102、202 :第二基板 104a、104b、210a、210b :電極圖案 ® 106:介電圖案 108、208 :螢光層 110、218 :放電路徑 203 :材料層 204 :阻隔壁 206、207 ··反射層 210 :電極層 212、214、216 :絕緣層 φ 500、900 :罩幕 502、902 :喷砂製程 • 600 ·電極區 700 ·電極材料 800 ··光罩 802 :曝光製程 15No structure. After the fabrication of 70% of the electrode layer 210, referring to Fig. 6C, a second insulating layer 214 is formed on the top of the electrode layer 210, which is formed, for example, by a printing process. As a result, the side surface of the electrode layer 21 is covered by the first insulating layer 212, and the top surface thereof is covered by the second insulating layer 214. Finally, the first substrate 2A made in the above manner is assembled with the second substrate 202, and an inert gas is filled between the first and second substrates 2〇〇, 2〇2, that is, Complete the production of a flat light source. In summary, the planar light source of the present invention and the manufacturing method thereof are formed on the second substrate by the electrode 13 (four) ray 7twf.doc/006 pair, so the discharge path formed between the electrode pairs avoids the first substrate The fluorescent layer on the top. As a result, the chance of the phosphor layer being bombarded by the plasma is greatly reduced, thereby increasing the life of the planar light source. Further, since the path length of the discharge path becomes short, the ignition voltage and the sustain voltage required for the planar light source of the present invention can be reduced, thereby having the advantage of power saving. The present invention has been described above by way of a preferred embodiment, and is not intended to limit the invention, and it is intended that the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection of the invention is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view of a conventional planar light source. 2 is a schematic illustration of a planar light source in accordance with an embodiment of the present invention. Figure 3 is a schematic illustration of a planar light source in accordance with another embodiment of the present invention. 4 to 4 are schematic cross-sectional views showing the manufacturing process of the first substrate of the planar light source and the members on the first substrate in accordance with the present invention. Figure 5A is a cross-sectional view showing the manufacturing process of a substrate of a planar source and a member on a first substrate in accordance with another embodiment of the present invention. 6A to 6C are cross-sectional views showing the manufacturing process of the second substrate of the planar light source and the member on the second substrate in accordance with another embodiment of the present invention. 7 to 9 are schematic cross-sectional views showing a manufacturing process for forming an electrode pattern on a second substrate in accordance with an embodiment of the present invention. [Main component symbol description] Λ 100, 200: first substrate" 102, 202: second substrate 104a, 104b, 210a, 210b: electrode pattern® 106: dielectric pattern 108, 208: phosphor layer 110, 218: discharge Path 203: material layer 204: barrier walls 206, 207 · reflective layer 210: electrode layers 212, 214, 216: insulating layer φ 500, 900: mask 502, 902: sand blasting process • 600 • electrode area 700 • electrode Material 800 ··Photomask 802: Exposure Process 15

Claims (1)

Ι2991?ο5™〇〇6 十、申請專利範圍: 1. 一種平面燈源,包括: 一第一基板; 多個阻隔壁,配置於該第一基板上; 一螢光層,配置於該些阻隔壁的表面上; 一第二基板,配置於該第一基板的上方; 多個電極圖案,配置於該第二基板上,且每一電極圖 案會與該第一基板上的每一阻隔壁對齊;以及 一絕緣層,覆蓋住該些電極圖案的表面, 其中,該第一基板與該第二基板之間填入有一惰性氣 體,且在該螢光層上方的該些電極圖案之間會形成一放電 路徑。 2. 如申請專利範圍第1項所述之平面燈源,其中該些 電極圖案的高度是介於5至300微米之間。 3. 如申請專利範圍第1項所述之平面燈源,其中該些 電極圖案的材料包括一感光性導電材料。 4. 如申請專利範圍第3項所述之平面燈源,其中該感 光性導電材料内包括有金屬粒子。 5. 如申請專利範圍第1項所述之平面燈源,其中該絕 緣層包括一第一絕緣層以及一第二絕緣層,該第一絕緣層 覆蓋該些電極圖案的侧表面,該第二絕緣層覆蓋該些電極 圖案的頂部表面。 6. 如申請專利範圍第5項所述之平面燈源,其中該第 一絕緣層以及該第二絕緣層之材質不相同。 16 1299 l^twf.d()c/006 進行一喷砂製程,以定義出該些阻隔壁;以及 移除該罩幕。 13. 如申請專利範圍第10項所述之平面燈源的製造方 法,其中在該第二基板上形成該些電極圖案’並且在該些 電極圖案的表面上形成該絕緣層之方法包括: 在該第二基板上形成一第一絕緣層,其中該第一絕緣 層會於該第二基板上定義出多個電極區; 於該些電極區内形成一電極層,以構成該些電極圖 案;以及 於該些電極圖案的頂部形成一第二絕緣層。 14. 如申請專利範圍第13項所述之平面燈源的製造方 法,其中在該第二基板上形成該第一絕緣層的方法包括利 用一模製製程。 15. 如申請專利範圍第13項所述之平面燈源的製造方 法,其中在該第二基板上形成該第一絕緣層的方法包括進 行一喷砂製程。 16. 如申請專利範圍第13項所述之平面燈源的製造方 法,其中於該些電極區内形成該電極層的方法包括· 將一電極材料漿料直接注入該些電極區中;以及 進行一乾燥步驟。 17. 如申請專利範圍第13項所述之平面燈源的製造方 法,其中於該些電極區内形成該電極層的方法包括: 於該第二基板上形成一電極材料;以及 進行一微影製程,以圖案化該電極材料,留下位於該 18 rtwf.doc/006 些電極區的該電極材料。 18. 如申請專利範圍第13項所述之平面燈源的製造方 法,其中於該些電極區内形成該電極層的方法包括: 於該第二基板上形成一電極材料;以及 進行一喷砂製程,以圖案化該電極材料,留下位於該 些電極區的該電極材料。 19. 如申請專利範圍第13項所述之平面燈源的製造方 法,其中於該些電極圖案的頂部形成該第二絕緣層的方法 包括進行一網板印刷製程。 19Ι2991?ο5TM〇〇6 X. Patent application scope: 1. A planar light source comprising: a first substrate; a plurality of barrier walls disposed on the first substrate; a phosphor layer disposed at the barriers a second substrate disposed above the first substrate; a plurality of electrode patterns disposed on the second substrate, and each electrode pattern is aligned with each barrier wall on the first substrate And an insulating layer covering the surface of the electrode patterns, wherein an inert gas is filled between the first substrate and the second substrate, and the electrode patterns are formed between the electrode patterns above the phosphor layer A discharge path. 2. The planar light source of claim 1, wherein the height of the electrode patterns is between 5 and 300 microns. 3. The planar light source of claim 1, wherein the material of the electrode patterns comprises a photosensitive conductive material. 4. The planar light source of claim 3, wherein the photosensitive conductive material comprises metal particles. 5. The planar light source of claim 1, wherein the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer covering a side surface of the electrode patterns, the second An insulating layer covers the top surfaces of the electrode patterns. 6. The planar light source of claim 5, wherein the material of the first insulating layer and the second insulating layer are different. 16 1299 l^twf.d()c/006 Perform a sandblasting process to define the barrier walls; and remove the mask. 13. The method of manufacturing a planar light source according to claim 10, wherein the forming the electrode patterns on the second substrate and forming the insulating layer on the surface of the electrode patterns comprises: Forming a first insulating layer on the second substrate, wherein the first insulating layer defines a plurality of electrode regions on the second substrate; forming an electrode layer in the electrode regions to form the electrode patterns; And forming a second insulating layer on top of the electrode patterns. 14. The method of fabricating a planar light source of claim 13, wherein the method of forming the first insulating layer on the second substrate comprises using a molding process. 15. The method of fabricating a planar light source of claim 13, wherein the method of forming the first insulating layer on the second substrate comprises performing a sandblasting process. 16. The method of manufacturing a planar light source according to claim 13, wherein the method of forming the electrode layer in the electrode regions comprises: injecting an electrode material slurry directly into the electrode regions; A drying step. 17. The method of manufacturing a planar light source according to claim 13, wherein the method of forming the electrode layer in the electrode regions comprises: forming an electrode material on the second substrate; and performing a lithography The process is to pattern the electrode material leaving the electrode material in the electrode regions of the 18 rtwf.doc/006. 18. The method of manufacturing a planar light source according to claim 13, wherein the method of forming the electrode layer in the electrode regions comprises: forming an electrode material on the second substrate; and performing a sand blasting The process is to pattern the electrode material leaving the electrode material located in the electrode regions. 19. The method of fabricating a planar light source of claim 13, wherein the method of forming the second insulating layer on top of the electrode patterns comprises performing a screen printing process. 19
TW95100314A 2006-01-04 2006-01-04 Flat light source and manufacturing method thereof TWI299175B (en)

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