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TWI299164B - Memory ic testing tool and probe structure - Google Patents

Memory ic testing tool and probe structure Download PDF

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Publication number
TWI299164B
TWI299164B TW094102657A TW94102657A TWI299164B TW I299164 B TWI299164 B TW I299164B TW 094102657 A TW094102657 A TW 094102657A TW 94102657 A TW94102657 A TW 94102657A TW I299164 B TWI299164 B TW I299164B
Authority
TW
Taiwan
Prior art keywords
memory
testing tool
probe structure
probe
testing
Prior art date
Application number
TW094102657A
Other languages
Chinese (zh)
Other versions
TW200627462A (en
Inventor
Kun Ho Wu
Hai Feng Chuang
Yumin Cheng
Cheng Hsien Lin
Original Assignee
Power Quotient Int Co Ltd
Ccp Contact Probes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power Quotient Int Co Ltd, Ccp Contact Probes Co Ltd filed Critical Power Quotient Int Co Ltd
Priority to TW094102657A priority Critical patent/TWI299164B/en
Publication of TW200627462A publication Critical patent/TW200627462A/en
Application granted granted Critical
Publication of TWI299164B publication Critical patent/TWI299164B/en

Links

TW094102657A 2005-01-28 2005-01-28 Memory ic testing tool and probe structure TWI299164B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094102657A TWI299164B (en) 2005-01-28 2005-01-28 Memory ic testing tool and probe structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102657A TWI299164B (en) 2005-01-28 2005-01-28 Memory ic testing tool and probe structure

Publications (2)

Publication Number Publication Date
TW200627462A TW200627462A (en) 2006-08-01
TWI299164B true TWI299164B (en) 2008-07-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102657A TWI299164B (en) 2005-01-28 2005-01-28 Memory ic testing tool and probe structure

Country Status (1)

Country Link
TW (1) TWI299164B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469151B (en) * 2011-08-26 2015-01-11 Powertech Technology Inc Testing interface board specially for dram memory packages
TWI657251B (en) * 2017-08-18 2019-04-21 台灣積體電路製造股份有限公司 Semiconductor testing apparatus, semiconductor testing system and semiconductor testing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113002952B (en) * 2021-02-08 2022-12-09 杭州旗捷科技有限公司 Consumable packaging box, consumable and consumable packaging box assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469151B (en) * 2011-08-26 2015-01-11 Powertech Technology Inc Testing interface board specially for dram memory packages
TWI657251B (en) * 2017-08-18 2019-04-21 台灣積體電路製造股份有限公司 Semiconductor testing apparatus, semiconductor testing system and semiconductor testing method

Also Published As

Publication number Publication date
TW200627462A (en) 2006-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees
MM4A Annulment or lapse of patent due to non-payment of fees