:1298185 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種可監控製程環境之晶圓傳送盒，特別 係關於一種可在晶圓進行製程反應之過程中即時進行環境 取樣之晶圓傳送盒。 【先前技術】 一般積體電路元件之製造係經由數個製程模組所完成， 並藉由晶圓傳送系統在製程模組之間傳送晶圓。目前半導 體製造商均先將晶圓置於晶圓傳送盒内，再藉由機械手臂 將晶圓從晶圓傳送盒中取出並傳送至製程反應室内進行反 應。如此，只要控制晶圓傳送盒内較小空間之潔淨度，即 可降低外部無塵室之潔淨度要求，藉以減省晶圓製程設備 之潔淨成本。然而，晶圓傳送盒内部雖然潔淨度較高，但 於载入製程設備之過程中，晶圓傳送盒之盒蓋開啟或關閉 動作，易於將周遭微塵或人體粉塵帶入製程設備内污染内 部晶圓。 習知技藝進行污染源分析時，係藉由取樣器（sampHng accessory)吸取可疑環境（例如製程機台之反應腔、晶圓傳送 盒内部或反應機台與晶圓傳送盒之傳輸介面）之空氣，再取 出取樣斋内之吸附劑進行化學分析以確認可疑環境之空氣 並據以推論污染來源。特而言之，習知技藝欲藉由取樣 杰吸取密封之晶圓傳送盒内之空氣時，必須先將晶圓傳送 里開啟，惟此一開啟動作本身就會產生污染微粒。再者， 藉由取樣器在開啟之晶圓傳送盒内吸取空氣時，取樣器本 005〇88i28 I298l85 身亦常π染晶圓傳送盒内之環境，因而難以發現實際污染 源。 申吕之’習知技藝係在污染發生之後，再從製程環境中 進行取樣，並根據化學分析結果在時間上反向推論污染之 t生機制。由於事後之環境取樣與實際污染發生時之製程 環境可能並不相同，因此習知之污染源分析技術具有相當 程度的不準確性。 _ _ 【發明内容】 本發明之主要目的係接I ^ 幻糸叔供一種可在晶圓進行製程反應之 過程中即時進行製程環境取 兄取樣之日日圓傳迗盒，可避免開啟 晶圓傳送盒或將取樣器伸人晶圓傳送盒中而造成污染。 為達成上述目的’本發明提出_種可監控製程環境之晶 圓傳送盒，其包含一可交—^ , 肩複數個晶圓之本體以及一設置 於4本體上之取樣機構。該取 /取樣機構係用以吸附該本體内 之工氣污染物，可設置於該 、 體之頂面、为面或兩側面之 一。較佳地，該取樣機構包含—填充吸附劑（例如玻璃棉） 之内室:且該内室具有複數個與該本體内部相通之開口。 此外，该取樣機構可包含一 動門或一開口，以供一使用 者不品打開該晶圓傳送盒即 了及取该本體内部之空氣。再 者’该取樣機構亦可包含一訊 3叹置於該本體上之内件以及一 扣合於该内件上之外件，复 ，/、中该内件與該外件具有一開口 〇使以本體之内部與外部環境相通。 相較於習知技藝進行取樣 «哭柚入曰门油 卞义肩開啟晶圓傳送盒或將取 樣叩伸入日日圓傳送盒中而九 成5木，本發明藉由在晶圓傳 P26i64 PD0108 005088128 1298185 送盒上設置一取樣機構，再經由取樣機構進行晶圓傳送盒 内之空氣取樣。如此’即可避免開啟晶圓傳送盒或將取樣 器伸入晶圓傳送盒中而造成污染，且可在半導體製程進行 過程中即時在製程線上（on line)吸附空氣中之污染物。 【實施方式】 圖1例示本發明第一實施例之晶圓傳送盒1 〇。該晶圓傳送 盒10包含一可容納複數個晶圓12之本體20以及一設置於該 本體20上之取樣機構30’其可吸附該本體20内之空氣污毕 物。該本體20包含一背面24、一底面26、一頂面28及二側 面32A及32B，而该晶圓12係藉由一盒蓋22密封之開口進出 該晶圓傳送盒10。該取樣機構30包含一設置於該頂面28下 方之内室42、填塞於該内室42之吸附劑44(例如玻璃棉μ乂及 一上盖48。該内室42之側壁具肴複數個開口 46，而該本體 20内之空氣經由該開口流過該取樣機構3〇時，該吸附劑44 即可吸附空氣中之污染物。當該晶圓傳送盒1〇中的晶圓12 經歷一半導體製程後，重回該晶圓傳送盒10時，該吸附劑 44可在製程線上（〇n Hne)即時吸附晶圓傳送盒⑺空氣中之 /可染物’該空氣中的污染物為由晶圓12於經歷一半導體製 転後’即時釋放於該晶圓傳送盒10内所產生的。故待完成 製私反應後再開啟該上蓋48取出該吸附劑44並進行化學分 析’即可鏗別該半導體製程之空氣污染物。 人圖2例不本發明第二實施例之晶圓傳送盒60。該晶圓傳送 皿60之取樣機構係由一設置於該背面24之導架ό2、一活動 門64及一開σ ^ 66構成。較佳地，該導架62及該活動門64係 P26164 PDoio8 005088128 1298185 由聚鱗酸亞胺構成，可避免該活動門64開啟時產生微粒。 將該活動門64向上拉，即可露出設置於該背面24之開口 66 ’其大小約略等於該取樣器54之取樣頭56的直徑。在進行 半導體製程時，該活動門64係下拉以避免外界空氣經由該 開口 66進入該本體20内部。在進行取樣時再上拉該活動門 64 ’以便該取樣頭56從該開口 66吸取該本體20内部之空氣 〇 圖3及圖4例示本發明第三實施例之晶圓傳送盒8〇。該晶 圓傳送盒80之取樣機構70包含一設置於該本體20之頂面28 上的内件7 2以及一扣合於該内件7 2之外件7 4。該内件7 2具 有一開口73且該外件74具有一開口75，可使該本體20之内 部與外部環境相通。在進行半導體製程時，該開口 75係以 一塞件78予以密封。在進行取樣時拔開該塞件78，以便該 取樣頭56可從該開口 75吸取該本體20内部之空氣。較佳地 ’该取樣機構70可另包含一設置於該内件72及該外件74間 之吸附片76，其可由玻璃棉構成，以吸附該晶圓傳送盒2〇 内之空氣污染物。 相較於習知技藝進行取樣時必須開啟晶圓傳送盒或將取 樣器伸入晶圓傳送盒中而造成污染，本發明藉由在晶圓傳 送盒上設置一取樣機構，再經由取樣機構進行晶圓傳送盒 内之空氣取樣。如此，即可避免開啟晶圓傳送盒或將取樣 為伸入晶圓傳送盒中而造成污染，且可在半導體製程進行 過程中即時在製程線上吸附空氣中之污染物。 本發明之技術内容及技術特點已揭示如上，然而熟乘本 P26164 PDoio8 〇〇5〇88l28 1298185 % t ' 項技術之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 ^ 【圖式簡要說明】 ' 圖1例示本發明第一實施例之晶圓傳送盒； 圖2例示本發明第二實施例之晶圓傳送盒；以及 圖3及圖4例示本發明第三實施例之晶圓傳送盒。 【主要元件符號說明】 10 晶圓傳送盒 12 晶0 20 本體 22 盒蓋 24 背面 26 底面 28 頂面 30 取樣機構 32A 側面 32B 側面 42 内室 44 吸附劑 46 開口 48 上蓋 54 取樣器 56 取樣頭 60 晶圓傳送盒 62 導架 64 活動門 66 開口 70 取樣機構 72 内件 73 開口 74 外件 75 開口 76 吸附片 78 塞件 005〇88i28 10-BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer cassette capable of monitoring a process environment, and more particularly to a wafer capable of performing environmental sampling immediately during a process reaction of a wafer. Transfer box. [Prior Art] The fabrication of a general integrated circuit component is accomplished by a plurality of process modules, and the wafer is transferred between the process modules by a wafer transfer system. Currently, semiconductor manufacturers place wafers in wafer transfer boxes, and then remove the wafers from the wafer transfer cassette and transfer them to the process chamber for reaction. In this way, as long as the cleanliness of the small space in the wafer transfer box is controlled, the cleanliness requirements of the external clean room can be reduced, thereby reducing the cleaning cost of the wafer process equipment. However, although the inside of the wafer transfer cassette is relatively clean, in the process of loading the process equipment, the lid of the wafer transfer box is opened or closed, and it is easy to bring the surrounding dust or human dust into the process equipment to pollute the internal crystal. circle. The conventional technique uses a sampler (sampHng accessory) to extract air from a suspicious environment (such as a reaction chamber of a process machine, a wafer transfer cassette, or a transfer interface between a reaction machine and a wafer transfer cassette). The adsorbent in the sample was taken for chemical analysis to confirm the air of the suspect environment and to infer the source of the contamination. In particular, conventional techniques in which the air in the sealed wafer transfer cassette is to be sucked by the sampler must be opened in the wafer transfer, but the opening action itself generates contaminating particles. Moreover, when the sampler draws air in the opened wafer transfer cassette, the sampler 005〇88i28 I298l85 is also often π dyed in the environment inside the wafer transfer cassette, so that it is difficult to find the actual pollution source. Shen Luzhi's “Knowledge Technology” system takes samples from the process environment after the occurrence of pollution, and infers the mechanism of pollution in time based on the results of chemical analysis. Since the environmental sampling after the event may not be the same as the process environment when the actual pollution occurs, the conventional pollution source analysis technique has a considerable degree of inaccuracy. _ _ [Description of the Invention] The main purpose of the present invention is to connect the I ^ 糸 糸 供 for a process in the process of wafer processing, the process of the environment to take the sample of the Japanese yen sampling box, to avoid opening the wafer transfer The cartridge or the sampler extends into the wafer transfer box to cause contamination. To achieve the above object, the present invention provides a crystal transfer box capable of monitoring a process environment, comprising a body that can be used to transfer a plurality of wafers, and a sampling mechanism disposed on the body of the body. The taking/sampling mechanism is for adsorbing the chemical pollutants in the body, and can be disposed on the top surface of the body, on one side or on both sides. Preferably, the sampling mechanism includes an inner chamber filled with an adsorbent (e.g., glass wool): and the inner chamber has a plurality of openings that communicate with the interior of the body. In addition, the sampling mechanism may include a moving door or an opening for a user to open the wafer transfer cassette and take the air inside the body. Furthermore, the sampling mechanism may further comprise an inner member slid on the body and an outer member fastened to the inner member, and the inner member and the outer member have an opening. The internal and external environments of the body are connected. Sampling compared to the conventional technique «Crying pomelo into the Tuen Mun oil to open the wafer transfer box or inserting the sample into the Japanese yen transfer box and the 90% wood, the present invention transmits P26i64 PD0108 on the wafer. 005088128 1298185 A sampling mechanism is set on the sending box, and the air sampling in the wafer transfer box is performed through the sampling mechanism. This can avoid contamination by opening the wafer transfer cassette or inserting the sampler into the wafer transfer cassette, and can immediately adsorb pollutants in the air on the line during the semiconductor manufacturing process. [Embodiment] FIG. 1 illustrates a wafer transfer cassette 1 of a first embodiment of the present invention. The wafer cassette 10 includes a body 20 that can accommodate a plurality of wafers 12 and a sampling mechanism 30' disposed on the body 20 for adsorbing airborne impurities in the body 20. The body 20 includes a back surface 24, a bottom surface 26, a top surface 28 and two side surfaces 32A and 32B. The wafer 12 enters and exits the wafer cassette 10 through a sealed opening of a lid 22. The sampling mechanism 30 includes an inner chamber 42 disposed below the top surface 28, and an adsorbent 44 (such as a glass wool 乂 and an upper cover 48). The side wall of the inner chamber 42 has a plurality of The opening 46, when the air in the body 20 flows through the sampling mechanism 3, the adsorbent 44 can adsorb the pollutants in the air. When the wafer 12 in the wafer transfer cassette 1 undergoes a After returning to the wafer transfer cassette 10 after the semiconductor process, the adsorbent 44 can instantly adsorb the wafer transfer box (7) in the air/dyeth on the process line (〇n Hne). The circle 12 is immediately released into the wafer transfer cassette 10 after undergoing a semiconductor fabrication process. Therefore, after the completion of the privacy reaction, the upper cover 48 is opened to take out the adsorbent 44 and perform chemical analysis. The air transport contaminant of the semiconductor process. Figure 2 is a wafer transfer cassette 60 of the second embodiment of the present invention. The sampling mechanism of the wafer transfer tray 60 is provided by a guide frame 2 disposed on the back surface 24. The door 64 and an opening σ ^ 66 are formed. Preferably, the guide 62 and the activity 64 series P26164 PDoio8 005088128 1298185 is composed of polyacrylic acid imide to prevent particles from being generated when the movable door 64 is opened. Pulling the movable door 64 upwards, the opening 66' disposed on the back surface 24 is exposed to be approximately equal to the size. The diameter of the sampling head 56 of the sampler 54. During the semiconductor process, the movable door 64 is pulled down to prevent outside air from entering the interior of the body 20 via the opening 66. The movable door 64' is pulled up again during sampling. The sampling head 56 sucks the air inside the body 20 from the opening 66. FIG. 3 and FIG. 4 illustrate the wafer transfer cassette 8 of the third embodiment of the present invention. The sampling mechanism 70 of the wafer transfer cassette 80 includes a The inner piece 7 2 on the top surface 28 of the body 20 and the outer piece 7 4 of the inner piece 7 2 are fastened. The inner piece 7 2 has an opening 73 and the outer piece 74 has an opening 75. The interior of the body 20 is in communication with the external environment. The opening 75 is sealed by a plug 78 during semiconductor processing. The plug 78 is unscrewed during sampling so that the sampling head 56 can draw from the opening 75. The air inside the body 20. Preferably, the sampling mechanism 70 further includes an adsorption sheet 76 disposed between the inner member 72 and the outer member 74, which may be composed of glass wool to adsorb air contaminants in the wafer cassette 2 . The invention has to open the wafer transfer cassette or project the sampler into the wafer transfer box to cause contamination when sampling by the prior art. The present invention provides a sampling mechanism on the wafer transfer cassette and then performs the crystal via the sampling mechanism. Sampling the air in the round transfer box. This avoids contamination by opening the wafer transfer cassette or by sampling into the wafer transfer cassette, and can adsorb airborne contamination on the process line during the semiconductor manufacturing process. Things. The technical content and technical features of the present invention have been disclosed as above, however, those skilled in the art of P26164 PDoio8 〇〇5〇88l28 1298185 % t 'the technology may still be replaced by the spirit and scope of the present invention based on the teachings and disclosures of the present invention. And modification. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [FIG. 1 illustrates a wafer transfer cassette of a first embodiment of the present invention; FIG. 2 illustrates a wafer transfer cassette of a second embodiment of the present invention; and FIGS. 3 and 4 illustrate a third embodiment of the present invention. Example wafer transfer box. [Main component symbol description] 10 wafer transfer box 12 crystal 0 20 body 22 cover 24 back 26 bottom surface 28 top surface 30 sampling mechanism 32A side 32B side 42 inner chamber 44 adsorbent 46 opening 48 upper cover 54 sampler 56 sampling head 60 Wafer transfer box 62 Guide 64 Removable door 66 Opening 70 Sampling mechanism 72 Inner member 73 Opening 74 Outer member 75 Opening 76 Adsorption sheet 78 Plug 005〇88i28 10-