1296369 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係一種適用於發熱電 " 子元件之散熱裝置。 * 【先前技術】 當前，隨著電腦産業之迅速發展，微處理晶片等發熱 電子元件産生之熱量愈來愈多，爲將該等多餘之熱量有效 I 散發，習知之方法係在發熱電子元件之表面貼設一散熱 器，在散熱風扇之輔助下將發熱電子元件産生之熱量强制 散去。請參照圖3，其所示爲一種習知之散熱裝置20 ,該 散熱裝置20包括一散熱風扇22及一散熱器24，該散熱器 24具有複數平行排列之散熱鰭片242並與一發熱電子元件 (圖未示)熱接觸，以吸收該發熱電子元件産生之熱量。該散 熱風扇22包括一殼體222、一定子(圖未示)及一轉子223， 該散熱風扇22之殼體222形成有一出風口 221，該散熱器 Β 24位於該出風口 221處。當該散熱風扇22順時針運轉時， 轉子223産生一冷却氣流26對該散熱器24進行强制散熱。 如圖3所示，由於該散熱器24之散熱鰭片242之排列 方向與該冷却氣流26之流向有一定夾角，導致部分冷却氣 流26被散熱鰭片242反彈回去，使冷却氣流26損失部分 動能，從而降低該冷却氣流26之流速，最終降低該散熱裝 置20之散熱效率。 6 1296369 【發明内容】 有鑒於此，有必要提供一種散熱效率較高之散熱裝置。 該散熱裝置用於散發電子元件産生之熱量，包括_散 熱風扇及一散熱器，該散熱風扇用於産生冷却氣流對該散 熱器進行强制散熱，該散熱器包括複數散熱片，其中，每 一散熱片分別具有一導流部及一本體部，該導流部對應該 冷却氣流之流向設置，且該導流部與該本體部之間呈一夾1296369 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device suitable for a heating element. * [Prior Art] At present, with the rapid development of the computer industry, heat generated by heat-generating electronic components such as micro-processing wafers is increasing, so that the excess heat is effectively emitted, and the conventional method is based on the heat-generating electronic components. A heat sink is attached to the surface, and the heat generated by the heat-generating electronic components is forcibly dissipated with the aid of the heat-dissipating fan. Referring to FIG. 3, a heat dissipating device 20 is illustrated. The heat dissipating device 20 includes a heat dissipating fan 22 and a heat sink 24 having a plurality of heat dissipating fins 242 arranged in parallel and associated with a heat generating electronic component. (not shown) is in thermal contact to absorb the heat generated by the heat-generating electronic component. The heat dissipating fan 22 includes a housing 222, a stator (not shown), and a rotor 223. The housing 222 of the cooling fan 22 is formed with an air outlet 221, and the heat sink 24 is located at the air outlet 221 . When the cooling fan 22 is operated clockwise, the rotor 223 generates a cooling airflow 26 to forcibly dissipate the heat sink 24. As shown in FIG. 3, since the arrangement direction of the heat dissipation fins 242 of the heat sink 24 is at an angle with the flow direction of the cooling airflow 26, the partial cooling airflow 26 is bounced back by the heat dissipation fins 242, so that the cooling airflow 26 loses part of the kinetic energy. Thereby, the flow rate of the cooling airflow 26 is reduced, and finally the heat dissipation efficiency of the heat sink 20 is reduced. 6 1296369 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device with high heat dissipation efficiency. The heat dissipating device is configured to dissipate heat generated by the electronic component, including a heat dissipating fan and a heat sink, wherein the heat dissipating fan is configured to generate a cooling airflow to forcibly dissipate the heat sink, the heat sink includes a plurality of heat sinks, wherein each heat sink Each of the sheets has a flow guiding portion and a body portion, the flow guiding portion is disposed corresponding to the flow direction of the cooling airflow, and the flow guiding portion and the body portion are sandwiched
與習知技術相比，藉由該導流部及該本體部之設置， 使得冷却氣流之流動方向可以平緩過渡，降低該散熱器之 流阻並增加該散熱器之散熱面積，從而使該散熱裝置具有 散熱效率較高之優點。 【實施方式】 圖1所示爲本發明散熱裝置其中一實施例之立體分解 圖’該散熱裝置10包括一散熱器12及一散熱風扇14。其 中’該散熱器12與一發熱電子元件(圖未示)熱連接，該散 熱風扇14用於對該散熱器12進行强制散熱。 該散熱風扇14爲一離心式散熱風扇，包括一殼體 、一定子(圖未示)及一轉子142，該定子及該轉子142 安裝在該殼體141内，該轉子142包括複數扇葉142a。 該殼體141包括一上蓋144、一底蓋146及一側壁 147。該上蓋144上設有一進風孔144a，該底蓋146上設有 複數進風孔146a。該側壁147爲一弧狀結構，並與該底蓋 146及上蓋144組成一具有出風口 148之半封閉結構。 7 1296369 清參照圖2，該等扇葉142a之最外端與該側壁147間 隔一定距離形成一流道149，爲提高轉子142產生之冷却 ^ 氣流16之流速，在沿順時針之方向即該冷却氣流16之流 :· 動方向上，該流道149逐漸變寬。 • 請參照圖1及圖2，該散熱器12係由複數散熱片121 堆叠形成’該散熱器12在整體上排列形成一弧狀結構，以 與散熱風扇14之轉子142及出風口 148相配合。每一散熱 φ 片121包括一導流部122及一本體部123，該導流部122 與該本體部123係一體成型，且二者之間呈一夾角。該導 流部122及該本體部123之兩侧分別向該散熱片121之一 侧彎折形成一折邊122a、123a，該等散熱片121藉由該等 折邊122a、123a相互抵接形成流道供冷却氣流16通過。 請參照圖2，該等散熱片121之導流部122在與該散 熱風扇14産生之冷却氣流16相平行之方向上排列，使得 冷却氣流16可以迅速流入。藉由導流部122與本體部123 ^ 之間之夾角之設置’使冷却氣流16之流動方向可以在該散 熱器12内平緩過渡’减少冷却氣流]^衝擊該等散熱片cl 而造成之能量損失，降低該散熱器12之流阻。另一方面， 藉由該導流部122及該本體部123之設置，增加散熱器12 之散熱面積，提高散熱器12之散熱效率。 可以理解地，該導流部122與本體部123之間還可以 采用相互叠壓接觸之方式相連接，只需保證該導流部122 與本體部123之間呈一定角度即可。 由以上敘述可知，藉由該導流部122及該本體部123 8 1296369 之設置，使得冷却氣流16之流動方向可以平緩過渡，降低 該散熱器12之流阻並增加該散熱器12之散熱面積，從而 使得該散熱裝置10具有散熱效率較高之優點。 【圖式簡單說明】 圖1爲本發明散熱裝置其中-實施例之立體分解圖。 圖2細1所示散熱|置去掉上蓋後之俯視圖。 圖3爲-習知散熱裳置去掉上蓋後之俯視圖。 【主要元件符號說明】Compared with the prior art, the flow direction of the cooling airflow can be smoothly transitioned by the flow guiding portion and the body portion, and the flow resistance of the heat sink is reduced and the heat dissipation area of the heat sink is increased, thereby dissipating the heat dissipation. The device has the advantage of high heat dissipation efficiency. [Embodiment] FIG. 1 is a perspective exploded view of an embodiment of a heat sink according to the present invention. The heat sink 10 includes a heat sink 12 and a heat sink fan 14. The heat sink 12 is thermally coupled to a heat generating electronic component (not shown) for forcibly dissipating heat from the heat sink 12. The cooling fan 14 is a centrifugal fan, and includes a casing, a stator (not shown) and a rotor 142. The stator and the rotor 142 are mounted in the casing 141. The rotor 142 includes a plurality of blades 142a. . The housing 141 includes an upper cover 144, a bottom cover 146 and a side wall 147. The upper cover 144 is provided with an air inlet hole 144a, and the bottom cover 146 is provided with a plurality of air inlet holes 146a. The side wall 147 has an arc-like structure and forms a semi-closed structure with the air outlet 148 with the bottom cover 146 and the upper cover 144. 7 1296369 Referring to FIG. 2, the outermost ends of the blades 142a are spaced apart from the side walls 147 to form a flow path 149. To increase the flow rate of the cooling gas stream 16 generated by the rotor 142, the cooling is performed in a clockwise direction. The flow of the air stream 16: In the moving direction, the flow path 149 is gradually widened. Referring to FIG. 1 and FIG. 2, the heat sink 12 is formed by stacking a plurality of heat sinks 121. The heat sinks 12 are integrally arranged to form an arc structure to match the rotor 142 and the air outlet 148 of the heat dissipation fan 14. . Each of the heat dissipation φ pieces 121 includes a flow guiding portion 122 and a body portion 123. The flow guiding portion 122 is integrally formed with the body portion 123 at an angle therebetween. The two sides of the heat-dissipating fins 121 are bent to form a folded edge 122a, 123a, and the heat-dissipating fins 121 are abutted by the folded edges 122a, 123a. The flow path is passed through the cooling gas stream 16. Referring to Fig. 2, the flow guiding portions 122 of the fins 121 are arranged in a direction parallel to the cooling airflow 16 generated by the heat radiating fan 14, so that the cooling airflow 16 can flow in rapidly. By setting the angle between the flow guiding portion 122 and the main body portion 123^, the flow direction of the cooling airflow 16 can be smoothly transitioned within the heat sink 12 to reduce the cooling airflow, and the energy caused by the heat sinks cl Loss, reducing the flow resistance of the heat sink 12. On the other hand, by the arrangement of the flow guiding portion 122 and the main body portion 123, the heat dissipation area of the heat sink 12 is increased, and the heat dissipation efficiency of the heat sink 12 is improved. It can be understood that the flow guiding portion 122 and the body portion 123 can be connected to each other by overlapping bonding, and it is only necessary to ensure that the guiding portion 122 and the body portion 123 are at an angle. It can be seen from the above that the flow direction of the cooling airflow 16 can be smoothly transitioned by the arrangement of the flow guiding portion 122 and the main body portion 123 8 1296369, reducing the flow resistance of the heat sink 12 and increasing the heat dissipation area of the heat sink 12. Therefore, the heat sink 10 has the advantage of high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a heat sink according to an embodiment of the present invention. Fig. 2 shows the heat dissipation shown in detail 1; the top view after the upper cover is removed. Figure 3 is a top view of the conventional heat sink after removing the upper cover. [Main component symbol description]
<本發明> 散熱裝置 10 散熱器 12 散熱片 121 導流部 122 折邊 122a 本體部 123 折邊 I23a 散熱風扇 14 殼體 141 轉子 142 扇葉 142a 上蓋 144 進風孔 144a 底蓋 146 進風孔 146a 側壁 147 出風口 148 流道 149 冷卻氣流 16 <習知> 散熱裝置 20 散熱風扇 22 出風口 221 殻體 222 轉子 223 散熱器 24 散熱鰭片 242 冷卻氣流 26 馨 9<The present invention> Heat sink 10 Heat sink 12 Heat sink 121 Flow guiding portion 122 Folding 122a Main body portion 123 Folding I23a Cooling fan 14 Housing 141 Rotor 142 Blade 142a Upper cover 144 Air inlet hole 144a Bottom cover 146 Air inlet Hole 146a Side wall 147 Air outlet 148 Flow path 149 Cooling airflow 16 <General> Heat sink 20 Cooling fan 22 Air outlet 221 Housing 222 Rotor 223 Radiator 24 Heat sink fin 242 Cooling airflow 26 Xin 9