TWI293512B - Method and package to adjust the lens tilt compensation for an imaging sensor - Google Patents

Description

T293512 . . . . . . '·· . ' ·'.'· : .... ' V . -. ... - ; , :, ' V', ·': . 'Two...: Nine , invention description: • [invented branch of the field] - the invention is a method of adjusting the head deviation of the harsh sensing element and its seal ..... -. - - - - .. . The knot is pushed, especially the singer, and the lens that adjusts the sensor element when the sensor is intercepted. ..... .......... .... , : : ...... : The method of deviation and its seal and blessing: [Prior Art] • ·························································································· ··· • ' ·· · · ' . i : 乂, ....... . 广' _, with the number of Xiang Xiang and other Feng conductors Xu products quickly

In the semiconductor imaging products, the technology of the i-image sensing chip package is also recommended. The image sensing core package of the above-mentioned image processing system includes bottom-up layout.:: - ·; " / . ; - ' ' .·-::'·; :.· ':' ' ' . ·.. ' ; - ' The contact substrate, the light-sensitive wafer and the light-transmitting element are coated on the outside of the component such as || . . . V. : : '· : . ' ;· ·'' ' V; ;;: V/.-· ' ·' Wall. Among them, the photosensitive wafer is fixed '.....................::; ^ Above the optical wafer, the light-transmitting element and the outer periphery of the carrier substrate are connected to each other, and then the earpiece The bearing raft and the side wall form a jinrong--the sensation of the sensation on the sensation of the photographic surface of the photographic board is exemplified by the singularity of the singularity of the singularity of the singularity of the singularity of the singularity. v owed in the manufacture of the image sensing and correcting package structure as described above, for the 1 and _ crystal (four) mutual surface ^ ^ angle 诵 __ wafer parallel or there is a precise reservation. Yuan, in the above _ image sense column #封|__ 1293512 .. . . . Λ.. . ^ class lens and __ have edited ^ ' sidewall ___ difficult miscellaneous music Some twists on the joint surface between these multi-layer structures, it is necessary to set the connection layer of different widths, different thicknesses and different materials. The area of the connection layer by the control edge, thickness Φ «A- shouting solution, _ The formation of the area and the connection material is complicated by the formation of the wall height. • _匕’ How to provide a simple, precise and tunable package structure that is a recipe for the school. Invention ':Content】'...^ ; · . :- :>·. ·' . : : :··:· ''' ":'"·::·"··'" ' ' . . . . . . . . . . . . . . . . . . . . . -.··..··...:···· . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

The structure comprises: a carrier substrate, a surface of the upper surface of the iron; a photosensitive wafer, the solid substrate is disposed on the substrate, and the first bonding layer is _.. ..... ; . . . . .. ' 舍 复 笋 金属 金属 金属 金属 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : · : ' · . Above the crystal 3; participate in the frame 辕-.. .. · · · · · · · · · ······································ The exterior of the rice therapy; its characteristics are in ''V';.' ... ν· . . . ' '';; -'ν''·.'' .;·. · ." ·- ': ' ' '· ν'·'·.'" : : .^ -·: . · Line friend to do the whole line 'to the first. The first bonding area of the self-sensing wafer protrudes upward, the top jj south up The light-transmitting weighing scale is on the surface of the top: _ whole: the line is self-supporting the top line, the top is 蟑 蟑 • 1293512 '. .... ^ . . . ' .- -: / · : , ' ;·, · The lower end is folded and bonded to the second bonding zone of the transferred carrier substrate. Another object of the present invention is a method for adjusting the lens deviation of a cold scale filling member, and the method for adjusting the deviation of the package structure described by the known parameter, comprising the following steps: 彳a· sensitizing The wafer is fixed to the soil surface of the carrier substrate; . :-..·........................* 'r · '* rb·The metal connection front end is bonded to the surface of the photosensitive wafer The first bonding area; c·measuring the optical axis deviation of the surface of the photosensitive wafer; ^ d·fresh light element ί lightly the metal far food _'above the top chain, measuring the optical axis deviation of the surface of the light transmitting element If the two of the light-transmitting elements are offset from the light-sensing element: but are not in the predetermined relative position, the light-transmitting element is removed, and the second bonding area of the receiving substrate is bonded by the connection, and the wire is bonded to the second bonding area of the wearing substrate. The long cold of the metal connection line between the second bonding regions, and thus the height of the top line of the sound absorbing metal, so that the surface of the optical element _ covers the light transmitting element i. ^:丨.. . . . . . . . . . , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , .. - Λ............: :. . . . . . . . . . . . . . . . . . In the above table, A ^3_ is __ end bonded to the first bonding area on the upper surface of the photosensitive wafer; ^293512 Recording ^ • The surface of the partner is offset from the surface of the sensing sheet, then the light-transmitting element is removed. By adjusting the metal bonding wire to the second squaring area of the carrier substrate and adjusting the ninth, the bonding area and the second key length 4' are difficult to adjust the grading of the metal connecting line, thereby The surface of the 透 羌 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ; . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The wire is rotated by the gold of the second bonding zone key g, which is connected to the length of the wire between the first and second bonding zones, the height of the wire is adjusted, and the light-transmitting component is precisely adjusted. And sensitization: the skirt of the wafer on the side of the face. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .泰卜精^ . . . . . . . . - .... - ... - * ..... Adjust the mechanism of lens coma. [Embodiment] ·.':;' ;.: ; : V.';· "· ; ;:;'; •"•': :·'·^^· :; \:.· For details The technical contents of the present invention, the purpose and the efficacy of the present invention will be described in detail below with reference to the embodiments. Please refer to the first figure V for the package junction of the invention of the adjustable mirror element deviation. · · . . . . .

The structure 1 includes a carrier base 3 from the lower edge of the soil, and a frame 4 that is wrapped around the edge of the edge member. The photosensitive wafer 2 is tamped, and the substrate is mounted. :··... . . : :...;.·:··. ' ..... The peripheral surface of the sheet is provided with a first bond 1293512. The surface is positioned with a second bond. District. The first bonding region Α and the second bonding region B are electrically connected to each other to form a wire IX. Wherein, the top line 211 is from the first bonding area VIII....* . . - , : . . . ; ' - . . . . '. - '* '/·. The lower surface of the upper light-transmissive element paper is offset from the top end of the top line 211 and is bent downwardly to form a second bonding area. .. : ^... ,· . :· ;'; , ; ; -.... . . . . . . . . . . . . . The light image is in the form of a scale and is covered with a photosensitive wafer.. ..... - . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ·· - . :.... . ·.:'+: ... ' . ' .L Λ· belongs to the operation line 21 4 to the top 211 bearing. The top line 211 is coated with an adhesive 25 (shown as an elliptical ring in the figure). The light transmissive element 3 is fixed to the photosensitive wafer 20 by the hardener. '.. . . ' . . . ' ' . . '. V.. ·........ The frame 40 includes a lower bottom plate 41, a middle cover plate 43 and an upper middle cavity sound 45 . The upper end of the bottom plate 4l· is fixed with the upper surface of the double-bearing substrate 1 , and the remaining plates are opposite.......-. . . . . . . . . . . . The end of the sample 43 is then convex upwards. The lower edge of the sample 43 is bonded to the upper edge of the light-transmitting member 30 and is attached to the photosensitive wafer, thereby balancing the light-transmitting member 3〇 with the photosensitive wafer 2. It is located inside the frame 4〇. The upper hollow wall 45 of the frame 4 is electrically formed into a 3⁄4 optical hole, and the hollow wall 45 is provided with a light-transmitting element.. -; . , ........... ..... · '; . With the 30 other than the typical lens (not shown). The optical axes of the lenses are perpendicular to the sheet of light transmissive element 30.

...... :: ......V . . . . . . . . . . . . . . . . . . . . . In the implementation of the invention of Saidong, because of the scale in the cavity wall 45, the fabric between the art and the surface of the _ _ Kang will affect the invention _ sensational ^|| _ 1293512 .. · :' .. · ; .. . . . . : .: ν' +.V'. Λ. , (4) installed structure 1__ learning edge steep 'example ^ 43⁄4 wafer 20 back capsule structure to produce beneficial or broken _ sex Interference. In the cross-sectional view shown in the second figure, located in the first month of the month 20 - tree ^

The top surface of the f-light wafer 20 is disposed on the other side of the optical line 20, and the plane of the optical element 30 is parallel to the plane of the wafer 2, or a predetermined angle is maintained between the two planes. There is a predetermined degree between the planes g of the wafer 2: technology:: and: can be: .:. ..:.. • . _ .. ..... · .... . _ ' . Sound; A and the third slave are the bonding techniques of the present invention using wire ball bonding in the metal connection green 91, Vertical, the top line 211 adjusts the front and rear multi-state indication 舄, ^ 舄 % mode, the key contains the technology is the use of wire ball bonding technology ^,:. In the private use, the present invention uses the trowel of the wire tying machine to pull the metal from the f _ wire to the drug A bonding zone, and the wilting is all about the top line 2 _ _ The relative positional relationship between the photosensitive wafers 20 at the bottom end of the top line 211 of the metal 逹 wiring 21 is the same as that of the photosensitive wafer 20 including the light-transmitting dragon 30. . - . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The height of 211 is . Is connected to i 1 of 12,935,112. . : , ;, . - . '. .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... This day (four) top line 211 3 degrees is up" from the adjustment before: the state of the latter can be known as the upper sense. Know the metal __. The angle between the plane of the plane (four) light crystal _ It is adjusted. Thus, by hitting the _ 劈 埽 埽 埽 埽 2 2 2 2 2 2 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 即可 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 In addition, the present invention can also use other keys to lie on the first key, and the ruthenium metal connects the red and long ache to change the metal connection line. _ Please line • ' · · · _. .. '.. · - _. , . . . . ' . . . . . . . : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : . '-.;:. & at the bottom of the optical wafer: 2 填充 bottom filled with filler to fix the photosensitive wafer 2 to the upper surface of the carrier substrate 10 high b by wire bonding · metal connection wire ^ front end known to wire Mode bonding to the sense • Light a cymbal 2 bauxite surface local sound bonding area A 'and Jin Wenlian area A upward convex shape The top line 211 breaks into the ] 抵 抵 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ · ;., ^·.; . . .... ... .................. 2. d甩 collimator (key to C0llimator) collapse The photosensitive wafer 20铪襄1293512 converges the light-transmitting element with the top 绫21丨 of the metal remote wire 21

Νι - π 兀兀仟 的 的 由 由 由 由 - - - - - ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片·/ with the lower light transmissive element 30, by bonding the metal connecting wire 21 to . . . . . . . . . . . . . . . . . . The 10 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Angle;:^ .···· . . . . . . . . . . . . . . . . . . . . . . . . f f f f f f f f f f f f f f f f On the substrate 10, at the same time, the cover 40 is covered with a transparent key. The package structure that can adjust the artifact of the sensing element is sealed. Off: After the member 30 is overlaid on the top 211 of the metal wire 21, the optical axis deviation of the surface of the light-sensing element f 20 and the surface of the light-transmitting element 30 is measured. In the step A food, the adhesive 25 can be stepped into a loop and frozen. The first part 30* is used to prevent foreign dust and other impurities from entering the photosensitive crystal.

I 1293512 affects the photosensitive wafer 2. Image-aged age ^^ Closed space 23 inside and outside the air pressure is balanced, for example, the hole. In this way, when the adhesive 25 is solidified, the air bubble inside the closed space 23 can be closed from the airtightness: The visible light transmittance is very low and the pain intensity material is manufactured, such as glass fiber or ceramic material. Frame 々Ο .... ...: ...——' .; 1 . , . '. .. ..·...' ..... ..:.· · Polycarbonate _yca hemp ate, Jane _^

Ctystal Mymer's LCP material, its temperature expansion strip ^

..... .... .. . . . . . . . . . . . . . . . . . . . . . . J J J J J J J J J J J J J J J J J J J J J J J J J 。 , · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · The bottom plate 41 of frame 40: can be connected to the carrier substrate 10 inch.赛义····. , ... · · ' ..... . . . . . . . . . . . . . . . . . . . . . . . . . . . .·;· ...:

Made of Type 7 or other optically characteristic materials, it may be covered by a photosensitive material V or any suitable type of lens. According to the comprehensive soil, the "sealing and structure of the lens tomb of the adjustable sensing" of the present invention is disclosed by the method and the method disclosed in the above ii, to achieve _ ..... · . '.;· '··λ · '·. ;···';;··· . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .... ' ..................................... The exposer is only a preferred embodiment of the present invention, Take the ring: '-... ·-- · . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..,·· '.'··· · Benefit range. As for the other equivalent of the invention, you should cover the case of the 俺 爵 : : : : : : : : : : 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 , , , , , , , , , :: ....... . ' ' ' ' ' ·', ' : "; ' V ^ V. ' . 1293512 : . . Ί'... . . . V. . ... .. .. ...'ν'..., ... .. ...ι . . . . . . . . The second figure is the light-transmitting element and the photosensitive crystal : There is an angular deviation between the surface of the sheet.义* · 1 ...'....ν';-.-.......-... • The third A is the metal connection image in the $ diagram. The main B diagram is a schematic diagram of the metal connection line 顼 调节 调节 ι & & 【 【 【 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主Anti-tilt line V ................... 211 Adjustment line ................................... 212 Confined space: 丄, · · * 23 Adhesive 25 Translucent element 30 . · · ..... Frame 40 Base plate ......... 41 Cover plate Wall: 45 File 50 First bonding area... .... ' . .: - A No.; Key area B to the top line 庠hi, h2

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Claims (1)

1293512, Patent Application Park: Τ·'--Package structure for adjusting the lens deviation of the sensing component, including: ι a carrier substrate, a second bonding region is disposed at a peripheral position of the surface of the crucible; a photosensitive wafer is fixed to Carrying the upper surface of the substrate, the circumference of the upper surface of the photosensitive wafer.•' --- ... ... - _ . '·..... ..' . Side position: set with the first Bonding]I, the first key 襄直友 between the second bonding area ... ' . ' ' . . , ... * .... sexual bonding a plurality of metal wires; _; . . . . . . : V ........ _ A light-transmissive component, as a lens cover for the lens, above the photosensitive wafer; and .. . . . . . ,.. . . .. ::..... Pivot, the bottom end is fixed on the upper surface of the carrier substrate and covered on the i-ray wafer and transparent: the optical element is accompanied by the external 丨. The lip line of the kettle includes the top line and the adjustment line, and the top line. - ·. - . : , ·. ' ..... .-·,············ ' . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The transparent component The lower surface is abutted against the top, that is, the entire line is inclined downwardly from the top end of the top line: Yuyue is bonded to the completion bonding area of the carrier substrate. If the paraplegia is as described in the application for patent paradigm i, the sensation of the sensation of the sensor can be determined as the scope of the patent application. The structure of the 1293512 is 'reading the empty space'. The component class _ body is covered and covered above the photosensitive wafer. At present, the method is as follows: Step 1 (4) of the application for patents: . . . . . . , . . . . . . . . . . . . Measuring the optical axis deviation of the surface of the photosensitive wafer; the optical axis deviation of the surface of the component ^ • In the deviation without the _predetermined ^, is the connection of the wire bonding _ the first continuation of the clock - the metal connection between the first bonding zone The length of the line, the height of the top line of the surface, so that the surface of the light-transmitting element 预定 the predetermined relative position of the photosensitive wafer is leaked; and 丨--- " . : ·; / ' . ':-.: ;; - · . '. ".;,:'· 1: 'V'::' ·. · ' '';'V;:;:Λ'V^^V^/'y^;^V ·;;^ '; e. Place the frame on each of the green substrates and cover the light-transmitting elements with:::::::: photosensitive crystal: chip-in • .... -: . . . · · ·· . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ·······.· :.; ;': ::· ;; . ;\,:^·,.;;'· .:.;:.. . .: . ·\:·;: , ·ν;;;:Α·.:.;; .'":,^'·ν'>^;:. :';ΐ.:·;::· 7. The circumference of the Tang patent of six mirror elements of the sensing section may sense _ Yasushi biased metal cleaver provision migration first bonding wire connecting region is connected to two bond pads _. .;;:;- ';; •^.:;·;:Λ;Λ:ν;:;^^ ' ..._ ';;; '';;'|,::V:;· ;'·,·:· ' v ;·::'· ·;;'·^^ f If applying for a patented medicine, please _, the soft table suppresses the surface of the light-transmitting element and the surface of the photosensitive wafer to be required. angle. ^ .. . , .- , .·.+ .'" .··. " : ... · .._... .':·.. . ·. ·. ····.. · · · ... . . ;;'.·· .... .... . . . . . . . . . . . . . . . . . . . . . . . . . ...... _.' · , . . . ' . . . . . . . . . . . . . . , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The photosensitive wafer is tightly bonded and formed in a ring shape in the '.., . . . : ' ' : ".;. 1 ' . . ' , between the optical element and the photosensitive wafer, the inside of the drying agent is formed and sealed space. 11. A method for adjusting the lens coma of a sensing element, the method being the continuation of the mirror deviation of the package structure as described in the scope of the patent scope of the Shenjing patent, the following steps: ' ' . ......t ......... . 匕...... . ::,,;. . . . : . a. The first wafer is solidified on the upper surface of the carrier substrate. b· bonding the front end of the metal connecting wire to the first bonding area of the main surface of the photosensitive wafer; c· capping the transparent connecting element to the top line of the metal connecting line;:, ., . . . ' ... ! ..... ·················································································· When it is in the opposite position, the light transmissive element is removed, and the metal connection line is adjusted between the first bonding area and the second bonding area by preparing the second bonding area of the substrate. The length of the metal twisted wire, and then the height of the top line of the metal connecting wire - ^^^ surface 舆: the surface of the photosensitive wafer is at a predetermined relative position; and e· assembling the frame minus the substrate The (four) test covers the Thai light Components and ' . . . .. ..... '·· .· ' .' . . , . 1293512 Photosensitive wafer