TWI293547B - Circuit substrate and method of fabricating the same - Google Patents
Circuit substrate and method of fabricating the same Download PDFInfo
- Publication number
- TWI293547B TWI293547B TW95100422A TW95100422A TWI293547B TW I293547 B TWI293547 B TW I293547B TW 95100422 A TW95100422 A TW 95100422A TW 95100422 A TW95100422 A TW 95100422A TW I293547 B TWI293547 B TW I293547B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- fabricating
- same
- circuit substrate
- composite conductive
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title description 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002131 composite material Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000003064 anti-oxidating effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
1293547 99-4-8 向該介電層，而壓合該第一複合導電層、該介電層盘 二複合導電層； 、Λ 形成至少-導電通孔於該第一複合導電層'該介電居 ，二複合導電層之間，以藉由該導電通孔導通該‘ 圖案化線f與該第二圖案化線路 成圖ί二第二Γ案化線路觸二圖案化線路上分別形 成圖案化之-弟一抗氧化層與圖案化之一第二抗 該第一抗氧化層與該第 ;別 在該第-複合導電層之該第二金屬芦以;別 些第二金屬層與該些化該 第二:;層介電:::;，別形ί-第-銲罩層與― 層，並暴露出該第一抗&銲罩層覆盍該第一圖案化線路 二圖案化線路層，並暴層而該第二銲罩層覆蓋該第 5. 如申請專利範圍第該第二抗氧化層。 法，其中該第一複合導電屉項所述之線路基板的製作方 銅，而該第一複合導電層層之;該第一金屬層的材質包括 6. 如申請專利範圍第第一金屬層的材質包括鎖。 法，其中該第二複合導曹二項所述之線路基板的製作方 銅，而該第二複合導電岸'之該第一金屬層的材質包括 曰之該第二金屬層的材質包括鎳。 291293547 99-4-8 to the dielectric layer, press-bonding the first composite conductive layer, the dielectric layer disk two composite conductive layer; Λ forming at least - conductive vias in the first composite conductive layer The second composite conductive layer is electrically connected to the second patterned conductive line to form a pattern on the second patterned circuit contact pattern line. a second anti-oxidation layer and one of the patterned second anti-oxidation layer and the second; the second metal reed in the first-composite conductive layer; and the second metal layer Forming the second:; layer dielectric:::;, the shape of the ί-the-welding layer and the layer, and exposing the first anti-amplifier layer covering the first patterned line pattern The circuit layer is layered, and the second solder mask layer covers the fifth. The second anti-oxidation layer is as claimed in the patent application. The method of the first composite conductive drawer item of the circuit substrate is made of copper, and the first composite conductive layer; the material of the first metal layer comprises 6. The first metal layer of the patent application scope Materials include locks. The method of claim 2, wherein the second composite conductive substrate of the second substrate is made of copper, and the material of the first metal layer of the second composite conductive land comprises: the material of the second metal layer comprises nickel. 29
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95100422A TWI293547B (en) | 2006-01-05 | 2006-01-05 | Circuit substrate and method of fabricating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95100422A TWI293547B (en) | 2006-01-05 | 2006-01-05 | Circuit substrate and method of fabricating the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200727760A TW200727760A (en) | 2007-07-16 |
| TWI293547B true TWI293547B (en) | 2008-02-11 |
Family
ID=45067879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95100422A TWI293547B (en) | 2006-01-05 | 2006-01-05 | Circuit substrate and method of fabricating the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI293547B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8450621B2 (en) | 2008-09-16 | 2013-05-28 | Unimicron Technology Corp. | Wiring board and process for fabricating the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI425898B (en) * | 2007-11-22 | 2014-02-01 | Unimicron Technology Corp | Method for fabricating wiring structure of circuit board |
| TWI425896B (en) * | 2008-06-11 | 2014-02-01 | 日月光半導體製造股份有限公司 | Circuit board with embedded conductive circuit and manufacturing method thereof |
-
2006
- 2006-01-05 TW TW95100422A patent/TWI293547B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8450621B2 (en) | 2008-09-16 | 2013-05-28 | Unimicron Technology Corp. | Wiring board and process for fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200727760A (en) | 2007-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MC4A | Revocation of granted patent |