TWI293444B - Liquid crystal display device - Google Patents
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- 239000004973 liquid crystal related substance Substances 0.000 title claims description 29
- 238000006073 displacement reaction Methods 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 40
- 230000000630 rising effect Effects 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 10
- 230000004044 response Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 230000008439 repair process Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 38
- 230000000052 comparative effect Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000001934 delay Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 102100027992 Casein kinase II subunit beta Human genes 0.000 description 3
- 101100424709 Danio rerio tbxta gene Proteins 0.000 description 3
- 101000858625 Homo sapiens Casein kinase II subunit beta Proteins 0.000 description 3
- 101000912503 Homo sapiens Tyrosine-protein kinase Fgr Proteins 0.000 description 3
- 102100037226 Nuclear receptor coactivator 2 Human genes 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 101000974356 Homo sapiens Nuclear receptor coactivator 3 Proteins 0.000 description 2
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 2
- 102100022883 Nuclear receptor coactivator 3 Human genes 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 102000001332 SRC Human genes 0.000 description 1
- 108060006706 SRC Proteins 0.000 description 1
- 108091005425 Sr-CI Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Liquid Crystal (AREA)
- Shift Register Type Memory (AREA)
- Liquid Crystal Display Device Control (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
1293444 玖、發明說明: 相關申請案之交互參照 本案係基於韓國專利申請案第2002-18942、 P2002-61454及P2002-87104號,申請日分別為2002年4月8 5 日、2002年10月9日及2002年12月30日,各案内容以引用方 式併入此處。 t發明所屬之技術領域3 發明領域 本揭示係有關一種驅動器電路供驅動主動矩陣驅動顯 1〇 示裝置以及一種具有該驅動器電路之主動矩陣驅動顯示裝 置’特別係有關一種可提升顯示裝置顯示品質之驅動器電 路以及一種具有該驅動器電路之液晶顯示裝置。 t先前 發明背景 15 通常複晶液晶顯示器(LCD)裝置操作速率高且耗用電 力低,但複晶LCD裝置之製程複雜。複晶LCD裝置通常係 用於有小型螢幕之顯示裝置。非晶LCD裝置通常係用於大 螢幕顯示裝置例如膝上型電腦(或筆記型電腦)、LCD監視 器、高傳真電視(HDTV,s)。 2〇 晚近,非晶LCD裝置採用成形於LCD面板之玻璃基板 (或薄膜電晶體基板)上之閘極驅動器電路,因而減少LCD 裝置之製造步驟。 一般而言,閘極驅動器電路包括一移位暫存器以及佈 線部分。佈線部分提供帶有複數個信號之移位暫存器。佈 1293444 線w刀包括複數佈線,佈線佈局影響由閘極驅動器電路輸 出的輸出信號。來自閘極驅動器電路之輸出信號可能因彼 此父又的佈線感應電容而失真。如此,LCD裝置之顯示品 質下降。 5 成形於薄膜電晶體(TFT)基板上之習知閘極驅動器電 路於該閘極驅動器電路用於大型螢幕及高解析度非晶LCD 裝置時出現下列問題。 隨著LCD裝置螢幕大小變大以及LCD裝置的解析度變 高,成形於TFT基板上閘線及像素數目增加。如此,隨著閘 10線及像素數目的增加,閘線距閘極驅動器之距離更遠,閘 線之RC延遲加大。最末閘線之時脈信號高位準期比第一閘 線之時脈信號高位準期,前者夠大而造成輸出信號失真。 故顯不品質低劣。 此外’最运離驅動器電路且有大線寬之佈線間產生電 15 容。如此,佈線之RC延遲增加。故需一種佈線結構,其中 傳輸之閘線之閘極驅動信號延遲減至最低。 【發明内容3 發明概要 如此,本發明可實質免除因相關技術之限制及缺點造 2〇 成的一或多項問題。 本發明之第一特性係提供一種用以提升顯示裝置顯示 品質之供驅動主動矩陣型驅動顯示裝置用之驅動器電路。 本發明之第二特色係提供一種具有驅動器電路之顯示 裝置。 1293444 本發明之第三特色係提供一種可提供較高顯示襄置顯 不品質之f有佈線結構之顯示裝置〇 本發明之一方面,提供一種驅動主動矩陣型驅動顯示 裝置之驅動器電路。該驅動器電路包括複數個驅動階段以 5及-虛設階段。驅動階段各自包括一輸出端子及一控制端 子。目前驅動階段之輸出端子係耦合至欲彼此串級之前一 態之控制端子,驅動階段各自經由輸出端子輸出一控制切 換裝置用之驅動信號。切換裝置係設置於主動矩陣型驅動 顯示裝置。虛設階段包括一虛設輸出端子及一虛設控制端 10子。虛設輸出端子係麵合至複數個驅動階段中之最末驅動 階段之控制端子,俾輸出一虛設輸出信號供導通或關斷最 末驅動階段。該虛設控制端子係輕合至欲藉該虛設輸出信 號而被導通或關斷之虛設輸出端子。 於本發明之另一方面,提供一種液晶顯示裝置其包含 b 顯不器部分以及—閘極驅動器。該顯示器部分包括一第 一基板、一面對該第一基板之第二基板,以及一插置於該 第基板與第二基板間之液晶層。該第一基板有複數閘線 連結至成形於一像素上之切換裝置,以及該像素係排列成 矩陣形。該閘極驅動器驅動切換裝置,閘極驅動器包括複 2〇數個驅動階段以及一虛設階段。驅動階段各自包括一輸出 端子及一控制端子。目前驅動階段之輸出端子係耦合至欲 /匕串、、及之則一悲之控制端。驅動階段各自經由輸出端子 輸出一驅動控制信號給各閘線供控制該切換裝置。虛設階 ^又包括-虛讀出端子及—虛設控制端子。虛設輸出端子 1293444 該虛 係耦合至複數個驅動階段中之最末驅動階段之控制端子 俾輸出一虚設輸出信號供導通或關斷最末驅動階段 設控制端子係耦合至欲藉該虛設輸出信號而被導通戈關斷 之虛設輸出端子。 5 10 15 於本發明之又另一方面,提供一種液晶顯示裝置包八 —顯示器部分,一資料驅動器以及一閘極驅動器。該顯八 器部分包括i)一第一基板,其具有一像素、一閘線及_資料 線,該像素具有一切換裝置係連結至該閘線及該資料線, ii)一第二基板其係面對該第一基板;以及出)一液晶層,其 係夾置於該第一基板與第二基板間。該資料驅動器提供帶 有影像之資料線,該資料驅動器係成形毗鄰於該顯示器I 分且係耦合至該資料線。該閘極驅動器驅動切換裝置。閘 極驅動器包括-位移暫存器以及-佈線部分。㈣暫存^ 具有複數個彼此串級的階段。位移暫存器被劃分為第一組 5 3- 1/T' m τκ w〜可力、。外邵信號係經 由佈線部分施加至各階段,驅動階段各自經由—輸出端子 輪出—驅動信號給閘線,供控制該切換裝置。佈線部分包 括一第—時脈U二時脈線、—第三時脈線及-第四 :脈線。一第一時脈信號係經由該第—時脈線供給第一組 :編號階段。第二時脈信號之相位與第一時脈信號差18〇 ^且士係經由第二時脈線供給第―纪之偶編號驅動階段。 =脈信號係經由第三時脈線供給第二乡且之奇編號驅動 ^私第二時脈信號係經由第四時崎供給第二組之㈣ 處驅動階段。 20 1293444 根據本發明,虛設階段之虛設輸出端子係連結至最末 驅動階段之控制端子’也連結至虛設階段之虛設控制端 子。此外,佈線部分除了第一及第二時脈線之外,進一步 包括第三及第四時脈線,經由該第三及第四時脈線而施加 5 第一及第二時脈CK及CKB。LCD裝置可提供較高顯示品 質。 圖式簡單說明 前述及其它發明特色及優點經由參照附圖由較佳具體 實施例之詳細說明將更為彰顯,附圖中: 10 第1圖為示意圖顯示根據本發明之第一具體實施例之 液晶顯不面板, 第2圖為方塊圖顯示第1圖之驅動閘極驅動器電路之位 移暫存器; 第3圖為電路圖顯示第2圖之驅動階段; 15 第4圖為平面圖顯示第3圖之驅動階段之佈局; 第5圖為電路圖顯示第2圖之虛設階段; 第6圖為平面顯示第5圖之虛設階段佈局; 第7圖為線圖顯示虛設階段輸出信號波形,該虛設階段 具有第2圖驅動階段之相同電路; 20 第8圖為線圖顯示第5圖之虛設階段輸出信號波形; 第9圖為電路圖顯示根據本發明之第二具體實施例之 驅動階段及虛設階段; 第10圖為方塊圖顯示根據本發明之第三具體實施例, 供驅動閘極驅動器電路之位移暫存器; 1293444 第11圖為線圖顯示第10圖之閘極驅動器電路之輸出信 號波形; 第12圖為佈局圖顯示第10圖之閘極驅動器電路之第三 及第四時脈線配置; 5 第13圖為佈局圖顯示位移暫存器之第一、第二及第四 時脈線間之連結之另一範例; 第14圖為佈局圖顯示根據本發明之第四具體實施例之 位移暫存器之佈線結構; 第15圖為佈局圖顯示具有第14圖之佈線結構之位移暫 10 存器;以及 第16圖為佈局圖顯示根據本發明之第五具體實施例, 位移暫存器之佈線結構。 L實施方式3 較佳實施例之詳細說明 15 後文將參照附圖說明本發明之較佳具體實施例之細 即0 第1圖為示意圖顯示根據本發明之第一具體實施例之 液晶顯不面板’以及弟2圖為方塊圖顯不弟1圖之驅動間極 驅動器電路之位移暫存器。 20 參照第1圖,根據本發明第一具體實施例之液晶顯示面 板包括一TFT基板100,一濾色片基板(圖中未顯示),以及 一液晶層(圖中未顯示)插置於該TFT基板100與該濾色基板 間。 TFT基板100有一顯示區(DA)以及一周邊區(PA)。複數 10 1293444 個像素呈矩陣形排列於顯示區。各個像素包括一薄膜電晶 體(TFT)llO以及一像素電極120連結至TFT 110。TFT 110係 以資料線(DL)以及一閘線(GL)連結。資料線係於第一方向 延伸,以及閘線係於實質上垂直於第一方向之第二方向延 5 伸。 液晶顯示面板200之解析度係依據像素數目決定。當像 素數目為m*n時,解析度為m*n,TFT基板100具有m條資料 線(DL1,DL2,…,DLm)以及η閘線(GL1,GL2,…,GLn)。 設置資料驅動器電路140於該第一周邊區(PA),其中設 10 置資料線(DL1,DL2,…,DLm)之一端。一閘極驅動器電路 130設置於該第二周邊區(PA),其中設置閘線(GL1,GL2,…, GLn)之一端。閘極驅動器電路可透過像素成形於顯示區 (DA)方法之相同方法製成。閘極驅動器電路13〇包括一位移 暫存器。 15 如第2圖所示,位移暫存器131包括複數個彼此串級連 結的階段(SRC1,…,SRCn+Ι)。詳言之,位移暫存器131包 括η(偶數)驅動階段(SRC1,…,SRCn)以及一虛設階段 (SRCn+Ι)。 η驅動階段(SRC1,…,SRCn)循序輸出閘極驅動信號至 20 11條閘線(0[1,.",01^)。11驅動階段(311(:1,...,811(:11)之輸出 端子各自係連結至前一驅動階段之控制端子(CT)。η驅動階 段(SRC1,…,SRCn)之載流端子(CR)各自係連結至次一驅 動階段之輸入端子(IN)。開始信號(ST)(替代輸出信號)施加 至第一驅動階段(SRC1)之輸入端子(IN)。 1293444 虛設階段(SRCn+l)之輸入端子(IN)係連結至第η個驅 動階段(SRCn)之載流端子(CR)。虛設階段(SRCn+Ι)之輸出 端子(OUT)係連結至第η驅動階段(SRCn)之控制端子(CT), 故虛設階段(SRCn+l)控制第η驅動階段(SRCn)。虛設階段 5 (SRCn+1)之輸出端子(OUT)也連結至虛設階段(SRCn+1)之 控制端子(CT)。如此,虛設階段(SRCn+l)係由虛設階段 (SRCn+l)輸出之輸出信號加以控制。 佈線部分132係設置毗鄰於位移暫存器131。佈線部分 132對移暫存器131提供複數信號。詳言之,佈線部分132包 10 括一開始信號線(STL)、一第一電源線(VDDL)、一第一時 脈線(CKL)、一第二時脈線(CKBL)以及一第二電源線 (VSSL)。 開始信號(ST)係經由開始信號線(STL)而供給第一驅 動階段(SRC1)之輸入端子(IN)。開始信號(ST)為與由外部圖 15 形控制器(圖中未顯示)輸出之垂直同步信號(Vsync)同步之 脈衝信號。第一電源線(VDDL)係連結至η驅動階段 (SRC1,…,SRCn)及該虛設階段(SRCn+l),以及一第一電源 電壓信號(VDD)係經由第一電源線(VDDL)而外加至該η驅 動階段(SRC1,…,SRCn)及該虛設階段(SRCn+l)。第二電源 20 線(VSSL)係連結至η驅動階段(SRC1,·..,SRCn)及該虛設階 段(SRCn+l),以及一第二電源電壓信號(VSS)係經由第二電 源線(VSSL)而外加至η驅動階段(SRC1,…,SRCn)及該虚設 P皆段(SRCn+l) 〇 第一時脈信號(CK)係經由第一時脈線(CKL)而外加至 1293444 奇數驅動階段(SRCl,SRC3,…)及虛設階段(SRCn+l)。第二 時脈信號(CKB)其相對於第一時脈信號(CK)有180度相差, 該第二時脈信號(CKB)係經由第二時脈線(CKBL)而外加至 偶數驅動階段(SRC2,…,SRCn)。 5 如此,因具有激活期(高位準期)之輸出信號(OUT1,..., OUTn)係循序產生,故於輸出信號(OUT1,…,OUTn)之激活 期間,對應各輸出信號(OUT1,…,〇UTn)之各閘線(GL1,…, GLn)被循序選定。 第3圖為顯示第2圖驅動階段之電路圖,第4圖為顯示第 10 3圖驅動階段之佈局之平面圖。第η驅動階段(SRCn)顯示於 第3及4圖,其它驅動階段(SRC1,…,SRCn-Ι)具有第η驅動階 段(SRCn)之相同電路。 參照第3及4圖,位移暫存器131之第η驅動階段(SRCn) 包括一升高部分131a、一下降部分131b、一升高驅動器部 15分131c、一下降驅動器部分131d及一載流輸出部分131e。 第η個驅動階段(SRCn)有一輸入端子(in)、一輸出端子 (OUT)、一控制端子(CT)、一時脈端子(CKT)、一第二電源 線端子(VS ST)、一第一電源線端子(VDDT)以及一載流輸出 端子(CR)。 20 升高部分131a包括一第一NMOS電晶體(NT1)。時脈信 號(CK)外加至該第一 NM0S電晶體(价1)之汲極,第一 NM0S電晶體(NT1)之閘極係連結至一第一節點(N1),以及 該第一 NM0S電晶體(NT1)之源極係連結至該輸出端子 (OUT)。 13 1293444 下降部分131b包括一第二NMOS電晶體(NT2)。第二 NMOS電晶體(NT2)之汲極係連結至該輸出端子(〇υτ),該 第二NMOS電晶體(ΝΤ2)之閘極係連結至一第二節點(Ν2), 以及該第二NMOS電晶體(ΝΤ2)之源極係連結至該第二電 5 源線端子(VSST)。 升高驅動器部分131c包括電容器(C)、NMOS電晶體 (NT3, NT4, NT5, NT6, NT7, NT8及NT9)。電容器係連結於 第一輸入節點(N1)與輸出端子(OUT)間。第三電晶體(NT3) 之汲極係連結至第一電源線端子(VDDT),第三電晶體(NT3) 10之閘極係連結至輸入端子(IN),第三電晶體(NT3)之源極係 連結至第一輸入節點(N1)。第四電晶體(N T 4)之汲極及閘極 係共通連結至第一電源線端子(VDDT),第四電晶體(NT4) 之源極係連結至第四電晶體(NT5)之閘極。第五電晶體(NT5) 之汲極係連結至第一電源線端子(VDDT),第五電晶體(NT5) I5 之閘極係連結至第四電晶體(NT4)之源極,以及第五電晶體 (NT5)之源極係連結至第二節點(NT2)。 第六電晶體(1^6)之汲極係連結至第三電晶體(NT3)之 源極,第六電晶體(NT6)之閘極係連結至第二節點(N2),第 六電晶體(NT6)之源極係連結至第二電源線端子(vsST)。第 20七電晶體⑼丁乃之汲極係連結至輸入端子(IN),第七電晶體 (NT7)之閘極係連結至第二節點(N2),以及第七電晶體(NT7) 之源極係連結至第二電源線端子(VSST)。第八電晶體(NT8) 之汲極係連結至第二節點(N2),第八電晶體(NT8)之閘極係 連結至輸入端子(IN),以及第八電晶體(NT8)之源極係連結 14 1293444 至第二電源線端子(VSST)。 雖然未顯示於第3圖,但第八電晶體(NT8)之源極可連 結至第三電源線端子,經由該第三電源線端子供給第三電 源電壓信號,其具有比第二電源電壓信號(VSS)更低的電源 5 位準。第九電晶體(]^丁9)之汲極係連結至輸出端子(in),第 九電晶體(NT9)之閘極係連結至控制端子(CT),以及第九電 晶體(NT9)之源極係連結至第二電源線(VSST)。 下降驅動器部分包括NMOS電晶體(NT10, NT11,NT12 及NT13)。詳言之,第十電晶體(>^10)之汲極係連結至第二 10節點(N2),第十電晶體(NT10)之閘極係連結至第一節點 (N1),以及第十電晶體(NT10)之源極係連結至第二電源線 端子(VSST)。第十一電晶體…丁丨”之汲極係連結至第四電 晶體(NT4)之源極,第十一電晶體(NT11)之閘極係連結至第 一節點(N1),以及第十一電晶體(NT11)之源極係連結至第 15二電源線(VSST)。第十二電晶體(NT12)之汲極係連結至第 一節點(N1),第十二電晶體(NT12)之閘極係連結至控制端 子(CT),以及第十二電晶體(NT12)之源極係連結至第二電 源線端子(VSST)。 載流輸出部分131e包括一第十四電晶體(NT14)。第十 20四電晶體(NT14)之汲極係連結至時脈端子(CKT),第十四電 晶體(NT14)之閘極係連結至第一節點(N1),以及第十四電 晶體(NT14)之源極係連結至載流輸出端子(CR)。如此,載 流輸出部分131e傳輸時脈信號(CK或CKB)給次一驅動階段 之輸入端子(IN)。 151293444 发明, invention description: Cross-reference of related applications This case is based on Korean Patent Application Nos. 2002-18942, P2002-61454 and P2002-87104, and the filing date is April 85, 2002, October 9, 2002, respectively. On December 30, 2002, the contents of each case are hereby incorporated by reference. TECHNICAL FIELD The present disclosure relates to a driver circuit for driving an active matrix driving display device and an active matrix driving display device having the driver circuit, particularly related to an improved display device display quality A driver circuit and a liquid crystal display device having the driver circuit. BACKGROUND OF THE INVENTION 15 Generally, a polycrystalline liquid crystal display (LCD) device has a high operating rate and low power consumption, but the fabrication process of a polycrystalline LCD device is complicated. A polycrystalline LCD device is usually used for a display device having a small screen. Amorphous LCD devices are commonly used in large screen display devices such as laptops (or laptops), LCD monitors, and high-definition televisions (HDTVs). 2〇 Recently, an amorphous LCD device uses a gate driver circuit formed on a glass substrate (or a thin film transistor substrate) of an LCD panel, thereby reducing the manufacturing steps of the LCD device. In general, the gate driver circuit includes a shift register and a wiring portion. The wiring section provides a shift register with a plurality of signals. The cloth 1293444 line w knife includes a plurality of wirings that affect the output signal output by the gate driver circuit. The output signal from the gate driver circuit may be distorted by the parent's wiring sense capacitance. Thus, the display quality of the LCD device is degraded. 5 The conventional gate driver circuit formed on a thin film transistor (TFT) substrate has the following problems when the gate driver circuit is used for a large screen and a high resolution amorphous LCD device. As the screen size of the LCD device becomes larger and the resolution of the LCD device becomes higher, the number of gate lines and pixels formed on the TFT substrate increases. Thus, as the gate 10 line and the number of pixels increase, the gate line is farther away from the gate driver, and the RC delay of the gate line is increased. The clock signal of the last gate line has a higher level than the clock signal of the first gate, and the former is large enough to cause distortion of the output signal. Therefore, it is not good quality. In addition, the power is generated between the wirings that are most transported away from the driver circuit and have a large line width. As such, the RC delay of the wiring increases. Therefore, a wiring structure is required in which the gate drive signal delay of the transmitted gate line is minimized. SUMMARY OF THE INVENTION The present invention is substantially free from the problems of the related art. A first feature of the present invention is to provide a driver circuit for driving an active matrix type drive display device for improving the display quality of a display device. A second feature of the present invention is to provide a display device having a driver circuit. 1293444 A third feature of the present invention is to provide a display device capable of providing a display structure having a higher display level and having a quality. In one aspect of the present invention, a driver circuit for driving an active matrix type drive display device is provided. The driver circuit includes a plurality of drive stages to the 5 and - dummy stages. The drive phases each include an output terminal and a control terminal. The output terminals of the current driving stage are coupled to control terminals that are to be cascaded to each other, and the drive stages each output a drive signal for controlling the switching device via the output terminals. The switching device is provided in an active matrix type drive display device. The dummy phase includes a dummy output terminal and a dummy control terminal 10. The dummy output terminal is coupled to the control terminal of the last drive stage of the plurality of drive stages, and outputs a dummy output signal for turning on or off the last drive stage. The dummy control terminal is lightly coupled to a dummy output terminal to be turned on or off by the dummy output signal. In another aspect of the invention, a liquid crystal display device is provided which includes a b-display portion and a gate driver. The display portion includes a first substrate, a second substrate facing the first substrate, and a liquid crystal layer interposed between the first substrate and the second substrate. The first substrate has a plurality of gate lines connected to switching devices formed on a pixel, and the pixel lines are arranged in a matrix shape. The gate driver drives the switching device, and the gate driver includes a plurality of driving stages and a dummy stage. The drive phases each include an output terminal and a control terminal. At present, the output terminals of the driving phase are coupled to the desired/snap string, and the sorrowful control terminal. The drive phases each output a drive control signal to each of the brake lines via the output terminal for controlling the switching device. The dummy stage ^ includes a virtual readout terminal and a dummy control terminal. The dummy output terminal 1293444 is coupled to the control terminal of the last driving stage of the plurality of driving stages, and outputs a dummy output signal for turning on or off. The last driving stage is configured to be coupled to the dummy output signal. The dummy output terminal that is turned off by the turn-on. 5 10 15 In another aspect of the present invention, a liquid crystal display device includes a display portion, a data driver, and a gate driver. The display portion includes i) a first substrate having a pixel, a gate line and a data line, the pixel having a switching device coupled to the gate line and the data line, and ii) a second substrate Facing the first substrate; and a liquid crystal layer sandwiched between the first substrate and the second substrate. The data driver provides a data line with an image that is shaped adjacent to the display and coupled to the data line. The gate driver drives the switching device. The gate driver includes a -displacement register and a wiring portion. (4) Temporary storage ^ There are multiple stages of cascading each other. The displacement register is divided into the first group 5 3- 1/T' m τκ w~ force. The external signal is applied to each stage via the wiring portion, and the driving stages are each rotated via the -output terminal to drive the signal to the gate for controlling the switching device. The wiring portion includes a first-clock U-second pulse line, a third clock line, and a fourth: pulse line. A first clock signal is supplied to the first group via the first-clock line: a numbering phase. The phase of the second clock signal is different from the first clock signal by 18 〇 ^ and the priest is supplied to the No. 1 even number driving phase via the second clock line. The pulse signal is supplied to the second town via the third clock line and is driven by the odd number. The private second clock signal is supplied to the driving stage of the second group (four) via the fourth time street. 20 1293444 According to the present invention, the dummy output terminal of the dummy stage is connected to the control terminal ' of the last driving stage and is also connected to the dummy control terminal of the dummy stage. In addition, the wiring portion further includes third and fourth clock lines in addition to the first and second clock lines, and the first and second clocks CK and CKB are applied via the third and fourth clock lines. . LCD devices provide high display quality. BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and other features and advantages of the invention will be more apparent from the detailed description of the preferred embodiments. The liquid crystal display panel is not shown in Fig. 2, the block diagram shows the displacement register of the driving gate driver circuit of Fig. 1; the third figure shows the driving phase of the circuit diagram of Fig. 2; 15 Fig. 4 is a plan view showing Fig. 3 The layout of the driving stage; Figure 5 is a circuit diagram showing the dummy phase of Figure 2; Figure 6 is a layout showing the layout of the dummy phase of Figure 5; Figure 7 is a line diagram showing the output signal waveform of the dummy phase, the dummy phase has Figure 2 is the same circuit in the driving phase; 20 Figure 8 is a line diagram showing the output signal waveform of the dummy phase of Figure 5; Figure 9 is a circuit diagram showing the driving phase and the dummy phase according to the second embodiment of the present invention; 10 is a block diagram showing a displacement register for driving a gate driver circuit in accordance with a third embodiment of the present invention; 1293444 FIG. 11 is a line diagram showing the gate drive of FIG. The output signal waveform of the circuit; FIG. 12 is a layout diagram showing the third and fourth clock line configurations of the gate driver circuit of FIG. 10; 5 FIG. 13 is a layout diagram showing the first and second of the displacement register And another example of the connection between the fourth clock line; FIG. 14 is a layout diagram showing the wiring structure of the displacement register according to the fourth embodiment of the present invention; FIG. 15 is a layout diagram showing the fourth picture The displacement of the wiring structure is temporarily stored; and FIG. 16 is a layout diagram showing the wiring structure of the displacement register according to the fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 3 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a schematic view showing a liquid crystal display according to a first embodiment of the present invention. The panel 'and the brother 2' is a block diagram showing the displacement register of the driver circuit between the driver and the driver. 20, a liquid crystal display panel according to a first embodiment of the present invention includes a TFT substrate 100, a color filter substrate (not shown), and a liquid crystal layer (not shown) interposed therebetween. The TFT substrate 100 is interposed between the color filter substrate. The TFT substrate 100 has a display area (DA) and a peripheral area (PA). Complex 10 1293444 pixels are arranged in a matrix in the display area. Each of the pixels includes a thin film transistor (TFT) 110 and a pixel electrode 120 coupled to the TFT 110. The TFT 110 is connected by a data line (DL) and a gate line (GL). The data line extends in a first direction and the brake line extends in a second direction that is substantially perpendicular to the first direction. The resolution of the liquid crystal display panel 200 is determined according to the number of pixels. When the number of pixels is m*n, the resolution is m*n, and the TFT substrate 100 has m data lines (DL1, DL2, ..., DLm) and η gate lines (GL1, GL2, ..., GLn). The data driver circuit 140 is disposed in the first peripheral area (PA), wherein one of the data lines (DL1, DL2, ..., DLm) is disposed. A gate driver circuit 130 is disposed in the second peripheral region (PA), wherein one end of the gate lines (GL1, GL2, ..., GLn) is disposed. The gate driver circuit can be fabricated by the same method of pixel formation in the display area (DA) method. The gate driver circuit 13A includes a shift register. As shown in Fig. 2, the shift register 131 includes a plurality of stages (SRC1, ..., SRCn + Ι) which are cascaded to each other. In detail, the shift register 131 includes an η (even) drive phase (SRC1, ..., SRCn) and a dummy phase (SRCn + Ι). The η drive phase (SRC1,...,SRCn) sequentially outputs the gate drive signal to 20 11 gate lines (0[1,.", 01^). 11 drive stage (311 (:1,...,811 (:11) output terminals are each connected to the control terminal (CT) of the previous drive stage. Current-carrying terminals of the η drive stage (SRC1,...,SRCn) (CR) is each connected to the input terminal (IN) of the next drive stage. The start signal (ST) (instead of the output signal) is applied to the input terminal (IN) of the first drive phase (SRC1). 1293444 Dummy phase (SRCn+ l) The input terminal (IN) is connected to the current-carrying terminal (CR) of the nth drive phase (SRCn). The output terminal (OUT) of the dummy phase (SRCn+Ι) is connected to the nth drive phase (SRCn) The control terminal (CT), the dummy phase (SRCn+l) controls the nth drive phase (SRCn). The output terminal (OUT) of the dummy phase 5 (SRCn+1) is also connected to the control of the dummy phase (SRCn+1). Terminal (CT). Thus, the dummy phase (SRCn+1) is controlled by the output signal output from the dummy phase (SRCn+1). The wiring portion 132 is disposed adjacent to the shift register 131. The wiring portion 132 is temporarily stored. The device 131 provides a complex signal. In detail, the wiring portion 132 includes a start signal line (STL), a first power supply line (VDDL), and a first clock. a line (CKL), a second clock line (CKBL), and a second power line (VSSL). The start signal (ST) is supplied to the input terminal of the first driving stage (SRC1) via the start signal line (STL) ( IN) The start signal (ST) is a pulse signal synchronized with a vertical sync signal (Vsync) output from an external figure 15-shaped controller (not shown). The first power line (VDDL) is coupled to the η drive stage ( SRC1, ..., SRCn) and the dummy phase (SRCn+1), and a first power supply voltage signal (VDD) is applied to the η driving phase (SRC1, ..., SRCn) via the first power supply line (VDDL) and The dummy phase (SRCn+1). The second power supply 20 line (VSSL) is coupled to the η drive phase (SRC1, . . . , SRCn) and the dummy phase (SRCn+1), and a second power supply voltage signal ( VSS) is applied to the η driving phase (SRC1, . . . , SRCn) and the dummy P segment (SRCn+1) via the second power line (VSSL). The first clock signal (CK) is transmitted through the first time. The pulse line (CKL) is added to the 1293444 odd drive phase (SRCl, SRC3, ...) and the dummy phase (SRCn+1). The second clock signal (CKB) has 180 relative to the first clock signal (CK). Phase difference, the second clock signal (CKB) is applied to the even-numbered lines and a second driving phase via a clock line (CKBL) (SRC2, ..., SRCn). 5 In this way, since the output signals (OUT1, ..., OUTn) with the active period (high level period) are generated sequentially, during the activation of the output signals (OUT1, ..., OUTn), corresponding to the output signals (OUT1, ..., 〇UTn) The gate lines (GL1,..., GLn) are sequentially selected. Fig. 3 is a circuit diagram showing the driving phase of Fig. 2, and Fig. 4 is a plan view showing the layout of the driving phase of Fig. 103. The nth driving phase (SRCn) is shown in Figures 3 and 4, and the other driving phases (SRC1, ..., SRCn-Ι) have the same circuit of the nth driving phase (SRCn). Referring to Figures 3 and 4, the nth driving phase (SRCn) of the shift register 131 includes a rising portion 131a, a falling portion 131b, a rising driver portion 15 minute 131c, a falling driver portion 131d, and a current carrying current. The output portion 131e. The nth driving stage (SRCn) has an input terminal (in), an output terminal (OUT), a control terminal (CT), a clock terminal (CKT), a second power line terminal (VS ST), and a first Power line terminal (VDDT) and a current-carrying output terminal (CR). The rising portion 131a includes a first NMOS transistor (NT1). a clock signal (CK) is applied to the drain of the first NMOS transistor (valence 1), the gate of the first NMOS transistor (NT1) is coupled to a first node (N1), and the first NMOS is electrically The source of the crystal (NT1) is coupled to the output terminal (OUT). 13 1293444 The falling portion 131b includes a second NMOS transistor (NT2). a drain of the second NMOS transistor (NT2) is coupled to the output terminal (〇υτ), a gate of the second NMOS transistor (ΝΤ2) is coupled to a second node (Ν2), and the second NMOS The source of the transistor (ΝΤ2) is coupled to the second electrical 5 source line terminal (VSST). The boost driver portion 131c includes a capacitor (C), NMOS transistors (NT3, NT4, NT5, NT6, NT7, NT8, and NT9). The capacitor is coupled between the first input node (N1) and the output terminal (OUT). The drain of the third transistor (NT3) is coupled to the first power line terminal (VDDT), the gate of the third transistor (NT3) 10 is coupled to the input terminal (IN), and the third transistor (NT3) The source is coupled to the first input node (N1). The drain and the gate of the fourth transistor (NT 4) are commonly connected to the first power line terminal (VDDT), and the source of the fourth transistor (NT4) is coupled to the gate of the fourth transistor (NT5). . The drain of the fifth transistor (NT5) is coupled to the first power line terminal (VDDT), the gate of the fifth transistor (NT5) I5 is coupled to the source of the fourth transistor (NT4), and the fifth The source of the transistor (NT5) is coupled to the second node (NT2). The drain of the sixth transistor (1^6) is connected to the source of the third transistor (NT3), and the gate of the sixth transistor (NT6) is coupled to the second node (N2), the sixth transistor The source of (NT6) is connected to the second power line terminal (vsST). The twenty-seventh transistor (9) is the connection of the drain to the input terminal (IN), the gate of the seventh transistor (NT7) is connected to the second node (N2), and the source of the seventh transistor (NT7) Connect to the second power line terminal (VSST). The drain of the eighth transistor (NT8) is coupled to the second node (N2), the gate of the eighth transistor (NT8) is coupled to the input terminal (IN), and the source of the eighth transistor (NT8) Connect 14 1293444 to the second power line terminal (VSST). Although not shown in FIG. 3, the source of the eighth transistor (NT8) may be coupled to the third power line terminal, via which the third power supply voltage signal is supplied, which has a second power supply voltage signal (VSS) Lower power supply 5 level. The ninth transistor (?) is connected to the output terminal (in), the gate of the ninth transistor (NT9) is connected to the control terminal (CT), and the ninth transistor (NT9) The source is connected to the second power line (VSST). The drop driver section includes NMOS transistors (NT10, NT11, NT12, and NT13). In detail, the drain of the tenth transistor (>^10) is connected to the second 10 node (N2), and the gate of the tenth transistor (NT10) is connected to the first node (N1), and The source of the ten transistor (NT10) is connected to the second power line terminal (VSST). The eleventh transistor...the gate of the eleventh transistor is connected to the source of the fourth transistor (NT4), the gate of the eleventh transistor (NT11) is connected to the first node (N1), and the tenth The source of one transistor (NT11) is connected to the 15th power supply line (VSST). The drain of the twelfth transistor (NT12) is connected to the first node (N1), and the twelfth transistor (NT12) The gate is connected to the control terminal (CT), and the source of the twelfth transistor (NT12) is coupled to the second power line terminal (VSST). The current-carrying output portion 131e includes a fourteenth transistor (NT14). The tenth 20th transistor (NT14) has a drain connected to the clock terminal (CKT), and the fourteenth transistor (NT14) is connected to the first node (N1), and the fourteenth The source of the crystal (NT14) is coupled to the current-carrying output terminal (CR). Thus, the current-carrying output portion 131e transmits the clock signal (CK or CKB) to the input terminal (IN) of the next driving stage.
π修(.更)正替鏡頁 1293444 於第η驅動階段(SRCn),由前一階段輸出之載流信號 (CR)係輸入第n驅動階段(SRCn)之輸入端子(IN),第三電晶 體(NT3)藉載流信號(CR)導通。第一節點(N1)電位由第二電 源電壓位準(VSS)改成第一電源電壓位準(VDD)。然後,當 5第四電晶體(NT4)、第五電晶體(NT5)及第一節點(N1)電位 升咼時,第十電晶體(NT10)被導通。當第十電晶體(NT1〇) 被導通時,第二節點(N2)電位改成第二電源電壓位準 (VSS)。如此,第二電晶體(NT2)被關閉。π repair (.more) replaces the mirror page 1293444 in the ηth drive phase (SRCn), the current-carrying signal (CR) output from the previous stage is input to the input terminal (IN) of the nth drive phase (SRCn), and the third The transistor (NT3) is turned on by the current carrying signal (CR). The first node (N1) potential is changed from the second supply voltage level (VSS) to the first supply voltage level (VDD). Then, when the potential of the fifth transistor (NT4), the fifth transistor (NT5), and the first node (N1) is raised, the tenth transistor (NT10) is turned on. When the tenth transistor (NT1〇) is turned on, the potential of the second node (N2) is changed to the second power supply voltage level (VSS). As such, the second transistor (NT2) is turned off.
當第一節點(N1)之電位升高時,第一電晶體(NT1)被導 10通,具有高電壓位準之時脈信號(CK)被傳輸至輸出端子 (OUT)。輸出端子(OUT)輸出電壓充電於啟動電容器(C),第 一電晶體(NT1)之閘極電壓升高超過第一電源電壓位準。如 此,第一電晶體(NT1)維持導通態。 當具有高電壓位準之虛設階段(SRCn+Ι)之輸出信號輸 15出至第η驅動階段之控制端子(CT)時,第十二電晶體及第十 三電晶體(ΝΤ12,ΝΤ13)被導通。When the potential of the first node (N1) rises, the first transistor (NT1) is turned on, and the clock signal (CK) having a high voltage level is transmitted to the output terminal (OUT). The output terminal (OUT) output voltage is charged to the boot capacitor (C), and the gate voltage of the first transistor (NT1) rises above the first supply voltage level. Thus, the first transistor (NT1) maintains an on state. When the output signal of the dummy phase (SRCn+Ι) having the high voltage level is output 15 to the control terminal (CT) of the nth driving phase, the twelfth transistor and the thirteenth transistor (ΝΤ12, ΝΤ13) are Turn on.
當第十二電晶體(ΝΤ12)被導通時,第一節點(Ν1)電位 由第一電源電壓位準(VDD)改成第二電源電壓位準 (VSS)。然後第十電晶體(ΝΤ10)被關閉。如此,第二節點(Ν2) 20電位藉第四及第五電晶體(ΝΤ4, ΝΤ5)而由第二電源電壓位 準(VSS)被改成第一電源電壓位準(VDD)。 由控制端子(CT)輸出之虛設階段輸出信號導通第十三 電晶體(ΝΤ13),第十三電晶體(ΝΤ13)及第二電晶體(ΝΤ2) 輸出第二電源電壓信號(VSS)給輸出端子(OUT)。 16 1293444When the twelfth transistor (ΝΤ12) is turned on, the potential of the first node (Ν1) is changed from the first power supply voltage level (VDD) to the second power supply voltage level (VSS). Then the tenth transistor (ΝΤ10) is turned off. Thus, the second node (Ν2) 20 potential is changed to the first supply voltage level (VDD) by the second supply voltage level (VSS) by the fourth and fifth transistors (ΝΤ4, ΝΤ5). The dummy phase output signal outputted by the control terminal (CT) turns on the thirteenth transistor (ΝΤ13), and the thirteenth transistor (ΝΤ13) and the second transistor (ΝΤ2) output the second power supply voltage signal (VSS) to the output terminal. (OUT). 16 1293444
當第二電源電壓信號(VSS)輸出至輸出端子(OUT)時, 第七電晶體及第八電晶體(NT7,NT8)被導通,外加至第η驅 動階段輸入端子(IN)之第(η_1)驅動階段輸出信號被改成高 電壓位準。 5 特別,當第二電源電壓信號(VSS)輸出至輸出端子 (OUT),由第(η-1)驅動階段輸出之高位準輸出信號提供給輸 入節點(IN)時,第八電晶體(ΝΤ8)被導通。如此,由(η-1)驅 動階段輸出之輸出信號放電至第二電源線端子(VSST)。When the second power supply voltage signal (VSS) is output to the output terminal (OUT), the seventh transistor and the eighth transistor (NT7, NT8) are turned on, and applied to the nth driving stage input terminal (IN) (n_1) The drive stage output signal is changed to a high voltage level. 5 In particular, when the second power supply voltage signal (VSS) is output to the output terminal (OUT) and the high level output signal output by the (n-1)th drive stage is supplied to the input node (IN), the eighth transistor (ΝΤ8) ) is turned on. Thus, the output signal output from the (η-1) drive phase is discharged to the second power supply line terminal (VSST).
此外,第九電晶體(ΝΤ9)係藉由控制端子(CT)外加至虛 10 設階段(SRCn+Ι)輸出信號而被導通,放電提供給輸入節點 (IN)之(n_l)驅動階段之高位準輸出信號,因而防止第一電 晶體(NT1)被導通。In addition, the ninth transistor (ΝΤ9) is turned on by the control terminal (CT) applied to the dummy 10 stage (SRCn+Ι) output signal, and the discharge is supplied to the high level of the (n_l) drive stage of the input node (IN). The output signal is quasi-output, thus preventing the first transistor (NT1) from being turned on.
雖然當由控制端子(CT)供給的虛設階段(SRCn+Ι)之輸 出信號電位改成關掉電壓位準時,第十二電晶體(NT12)被 15 關掉,但第二節點(N2)藉第四及第五電晶體(NT4, NT5)維持 第一電源電壓位準。如此,第二電晶體(NT2)維持導通態, 第二電源信號(VSS)輸出至輸出端子(OUT)。 第5圖為電路圖顯示第2圖之虛設階段,以及第6圖為平 面圖顯示第5圖虛設P皆段之佈局。第5及6圖中,相同參考編 2〇 號表示第1圖之第η驅動階段(SCRn)之相同元件 ,如此將刪除相同元件之細節說明。 參照第5及6圖,虛設階段(SRCn+Ι)包括一升高部分 131a、一下降部分131b、一升高驅動器部分131c、一下降 驅動器部分131d以及一載流輸出部分131e。虛設階段 17 1293444 (SRCn+l)之控制端子係連結至該虛設階段(SRCn+l)之輸出 端子。如此,虛設階段(SRCn+Ι)係由虛設階段(SRCn+Ι)之 輸出信號控制。 連結至虛設階段(SRCn+l)控制端子之電晶體(NT12,) 5 之電晶體大小比起第η驅動階段(SRCn)之電晶體(NT12)大 小有所改變,故可維持虛設階段(SRCn+l)之輸出信號經歷 一段預定時間。後文中,電晶體大小係表示電晶體通道寬 度(W)對電晶體通道長度(L)之比(W/L)。 例如虛設階段(S R C η +1)之電晶體(N T12 ’)之電晶體大 10 小約比第η驅動階段(SRCn)之電晶體(NT 12)之電晶體大小 小10倍。 通常電晶體大小係依據通道寬度(W)決定。例如虛設階 段(SRCn+l)之電晶體(NT12,)之通道寬度(w,)約比第η驅動 階段(SRCn)之電晶體(ΝΤ12)之通道寬度(W)小10倍。如第4 15 及第6圖所示,第6圖電晶體(NT12)之通道寬度(W,)約比第4 圖之電晶體(NT12)之通道寬度(W)小10倍。 雖然虛設階段(SRCn+l)之高位準輸出信號饋回虛設階 段(SRCn+l)之控制端子(CT),但依據電晶體(NT12)之電晶 體大小而定,經一段預定時間後第十二電晶體(NT12,)被導 20 通。如此,因虛設階段(SRCn+l)之高位準輸出信號回授至 虛設階段(SRCn+l)之控制端子(CT)後不久,第十電晶體 (NT10)未被關掉,故第二節點(N2)可維持第二電源電壓位 準(VSS)經歷一段預定時間。因此,虛設階段(SRCn+i)之輸 出端子可維持高電壓位準經歷一段預定時間。 1293444 於一段預定時間後,當第十二電晶體(NT12,)被導通 時,第十電晶體(NT10)被關掉,以及第二節點(N2)電位由 第二電源電壓位準(vss)改成第一電源電壓位準(VDD)。當 第二節點(N2)之電位改成第一電源電壓位準(VDD)時,電晶 5體(NT2)被導通,故第二電源電壓(VSS)輸出至虛設階段 (SCRn+Ι)之輸出端子(OUT)。 此外’連結至控制端子(CT)之第化驅動階段(sRCn)之第 十二電晶體(NT 13)於虛設階段(SRCn+Ι)被去除。於第6圖所 示,第4圖之第十三電晶體(NT13)於虛設階段(SRCn+1}被去 10除。如此,因唯有第二電晶體(NT2)輸出第二電源電壓(vss) 給輸出端子(OUT),故於一段預定延遲後,第二電源電壓 (VSS)輸出至輸出端子(OUT)。 第7圖為線圖顯示具有第2圖驅動階段相同電路之虛設 階段輸出# 5虎波形’第8圖為線圖顯示第5圖之虛設階段之 15 輸出信號波形。X軸表示時間(微分)中,y軸表示電壓(伏特)。 參照第7圖,於驅動階段循序輸出具高電壓位準之輸出 信號(OUTn-1,OUTn),虛設階段(SRCn+Ι)操作而輸出該輸 出電壓(OUTn+Γ)。第7圖中,虛設階段(SRCn+Ι)具有驅動 階段之相同電路,虛設階段(SRCn+Ι)之輸出端子係連結至 2〇 虛設階段(SRCn+Ι)之控制端子。一旦由虛設階段(sRCn+1) 之輸出端子輸出之信號(0 U T η +1 ’)電位經由第n驅動階段 (SRCn)之輸出信號(OUTn)而改變成高電壓位準時,具有高 電壓位準之輸出信號(OUTn+ Γ)施加至第η驅動階段(SRCn) 之控制端子及虛設階段(SRCn+1)之控制端子。 19 1293444 由虛設階段(SRCn+l)之輸出端子輸出之輸出信號 (OUTn+Γ)電位藉回授至虛設階段(SRCn+Ι)之控制端子之 輸出信號(OUTn+1 ’)而改變成關斷電壓位準(或低電壓位 準)。如此,輸出信號(OUTn+1’)確實維持高電壓位準經歷 5 —段預定持間,且下降至關斷電壓位準。輸出信號 (OUTn+1 ’)之最大電壓位準係遠小於輸出信號(〇UTn)之最 大電壓位準。 但當虛設階段(SRCn+l)具有第5圖之電路時,如第8圖 所示,輸出信號(OUTn+1)具有比輸出信號(OUTn+Γ)更穩 10 定的波形。於驅動階段循序輸出具有高電壓位準之輸出信 號(OUTn-l,OUTn)後,虛設階段(SRCn+l)被操作而輸出輸 出信號(OUTn+1)。 一旦由虛設階段(SRCn+l)之輸出端子輸出的輸出信號 (OUTn+1)之電位,藉第η驅動階段(SRCn)之輸出信號(OUTn) 15 而改變成導通電壓位準(或高電壓位準)時,具有導通電壓位 準之輸出信號(〇UTn+1)外加至該第η驅動階段(SRCn)之控 制端子及該虛設階段(SRCn+l)之控制端子。 然後,雖然輸出信號(OUTn+1)外加至虛設階段 (SRCn+l)之控制端子,但由虛設階段(SRCn+l)之輸出端子 20 輸出的輸出信號(0UTn+l)並未瞬間改變成關斷電源位 準,反而由虛設階段(SRCn+l)之輸出端子輸出之輸出信號 (OUTn+1)係於一段預定時間後而變成關斷電源位準。因 此,之輸出信號(0UTn+l)可維持高電壓位準經歷一段預定 時間。 20 1293444 產生輸出信號(〇UTn+1)其具有幾乎與輸出信號(〇UTn) _ 相等的電壓位準。因此,第η驅動階段(SRCn)可藉虛設階段 (SRCn+Ι)之輸出信號(〇υΤη+1)而穩定驅動。 < 爾_ 第9圖為電路圖顯示根據本發明之第二具體實施例之 - 5 驅動階段及虛設階段。 _ 參照第9圖,根據本發明之第二具體實施例之位移暫存 器133包括η驅動階段(SRC1,…,SRCn)及一虛設階段 (SRCn+Ι)。該第n驅動階段(SRCn)包括一升高部分133a、一 下降部分133b、一升高驅動器部分133c及一下降驅動器部 · 10 分133d 〇 升高部分133a包括一第一NMOS電晶體(NTla)。時脈信 號(CK)係外加至第一 NMOS電晶體(1^1&)之汲極,第一 NM0S電晶體(NTla)之閘極係連結至第一節點(Nla),以及 第一 NMOS電晶體(NTla)之源極係連結至該輸出端子 15 (OUTn) 〇 下降部分133b包括一第二NMOS電晶體(NT2a)。第二 NMOS電晶體(]^2&)之汲極係連結至該輸出端子(OUTn), ® 第二NMOS電晶體(NT2a)之閘極係連結至第二節點(N2a), 以及第二NMOS電晶體(NT2a)之源極係連結至第二電源線 20 端子(VSST)。 升高驅動器部分133c包括一電容器(C)、NMOS電晶體 (NT3a、NT4a、NT5a)。第三電晶體"丁3&)之汲極係連結至 第一電源線端子(VDDT),第三電晶體(NT3a)之閘極係連結 至輸入端子(IN),以及第三電晶體(NT3a)之源極係連結至第 21 1293444 一節點(Nla)。第四電晶體(NT4a)之汲極係連結至第一節點 (Nla) ’第四電晶體(NT4a)之閘極係連結至控制端子(ct), 以及弟四電晶體(NT4a)之源極係連結至第二電源線端子 (VSST)。弟五電晶體(NT5a)之沒極係連結至第一節點 5 (Nla) ’第五電晶體(NT5a)之閘極係連結至第二節點(N2a), 以及第五電晶體(NT5a)之源極係連結至第二電源線端子 (VSST)。第三電晶體(NT3a)之電晶體大小約比第五電晶體 (NT5a)之電晶體大小大2倍。 下降驅動器部分133d包括NMOS電晶體(NT6a, 10 NT7a)。詳言之,第六電晶體(>〇^)之汲極及閘極係共通連 結至第二電源線端子(VDDT),以及第六電晶體(]^丁6〇之源 極係連結至第二節點(N2a)。第七電晶體(1^丁7&)之汲極係連 結至第二節點(N2a),第七電晶體(NT7a)之閘極係連結至第 一節點(N21),以及第七電晶體(NT7a)之源極係連結至第二 15電源線端子(VSST)。第六電晶體(NT6a)之電晶體大小約比 第七電晶體(NT7a)之電晶體大小大16倍。 當第(n-1)個驅動階段(SRCn-Ι)之輸出信號輸出至第η 驅動階段(SRCn)之輸入端子(IN)時,第七電晶體(NT7a)被導 通。當第七電晶體(NT7a)被導通時,第二節點(N2a)電位由 20第一電源電壓位準(VDD)改變成第二電源電壓位準 (VSS)。然後即使第七電晶體(NT7a)被導通,因第六電晶體 (NT6a)電晶體大小比第七電晶體(NT7a)之電晶體大小約大 6倍,第二節點(N2a)仍然維持第二電源電壓位準(vss)。 當具有高電壓位準之虛設階段(SRCn+Ι)之輸出信號 22 1293444 (OUTn+1)經由第n驅動階段(SRCn)之控制端子(CT)回收 時,第七電晶體(NT7a)被關斷。如此,第二節點(N2a)電位 藉第六電晶體(NT6a),而由第二電源電壓位準(VSS)改成第 一電源電壓位準(VDD)。 5 即使當經由第η驅動階段(SRCn)之控制端子(CT)外加 的虛設階段(SRCn+Ι)之輸出信號電位被改成關斷電壓位 準,且第四電晶體(NT4a)被關斷時,第二節點因第六電晶 體(NT6a)而維持第一電源電壓位準(VDD)。如此,第二電晶 體(NT2a)維持導通態,輸出端子(0UTn)具有第二電源電壓 W 位準(VSS)。 如第9圖所示,虛設階段(SRCn+Ι)包括一升高部分 133a、一下降部分133b、一升高驅動器部分133c及一下降 驅動器部分133d。虛設階段(SRCn+Ι)之控制端子係連結至 虛設階段(SRCn+Ι)之輸出端子。如此,虛設階段(SRCn+1) 15 係由虛設階段(SRCn+Ι)之輸出信號控制。 連結至虛設階段(SRCn+Ι)之控制端子之電晶體之電晶 體大小比起連結至第η驅動階段(SRCn)控制端子之電晶體 之電晶體大小有所改變,故維持虛設階段(SRCn+Ι)之輸出 信號經歷一段預定時間。 20 例如虛設階段(SRCn+1)之電晶體(NT4,)之電晶體大小 約比第η驅動階段(SRCn)之電晶體(NT4)之電晶體大小小10 倍。如此,因虛設階段(SRCn+Ι)之高位準輸出信號回授至 虛設階段(SRCn+Ι)之控制端子(CT)後不久,因第四電晶體 (NT4’)未被關掉,故第七電晶體⑼丁叫未即刻被導通。第 23 1293444 四節點(N4)維持第二電源電壓位準(VSS)經歷一段預定時 間。因此虛設階段(SRCn+Ι)之輸出端子維持高電壓位準經 歷一段預定時間。 於一段預定時間後,當第四電晶體(NT4,)被導通時, 5第七電晶體(NT7a)被關掉,且第四節點(N4)電位由第二電 源電壓位準(VSS)改變成第一電源電壓位準(VDD)。如此當 第四節點(N4)之電位改成第一電源電壓位準(VDD)時,第二 電晶體(NT2a)被導通,故第二電源電壓位準(VSS)被輸出至 虛設階段(SRCn+Ι)之輸出端子(OUT)。 10 虛設階段(SRCn+Ι)之控制端子(CT)係連結至虛設階段 (SRCn+1)之輸出端子(〇UTn+1),故虛設階段(SRCn+1)可維 持穩定操作。此外,閘極驅動器電路無需另一外部佈線, 經由該佈線控制信號被外加至虛設階段(SRCn+Ι)之控制端 子(CT)。 15 如此,可防止外部佈線與其它佈線間之電容,外加至 閘極驅動器電路之信號可未延遲。 第10圖為方塊圖顯示根據本發明之第三具體實施例, 驅動閘極驅動器電路用之位移暫存器,以及第丨丨圖為線圖 顯示第10圖之閘極驅動器電路之輸出信號波形。後文r i」 20 為小於「η」之偶數。 參照第1〇圖’根據本發明第三具體實施例之閘極驅動 器電路150包括一位移暫存器151。位移暫存器151被劃分為 第一組G1及第二組G2。第一組及第二組G1及G2各自包括 複數個階段。佈線部分152係設置她鄰該位移暫存器15ι。 24 1293444 佈線部分152對位移暫存器151提供複數個信號。詳言之, 佈線部分152包括一開始信號線(STL)、一第一電源線 (VDDL)、-第-時脈線(CKL1)、_第二時脈線(ckbli)、 一第二電源線(VSSL)、一第三時脈線(CKL2)及第四時脈線 5 (CKBL2)。 一第一時脈信號(ck)係經由第一時脈線(CKL1)而外加 至第一組G1之驅動階段(SRC1,· ” SRCi_1}之奇數驅動階段 (SRC1,…,SRC3)。第-時脈信號(CK)係經由第三時脈線 (CKL2)外加至第二組G2之驅動階段(SRCi,…,SRCn)之奇 10數驅動階段(SRCi+1)。相對於第一時脈信號(CK)有18〇度相 差的第二時脈信號(CKB)經由第二時脈線(CKBL丨),外加至 第一組gi之驅動階段(SRC1,…,sRCi—Di偶數驅動階段 (SRC2,…)。第二時脈信號(CKB)係經由第四時脈信號 (CKBL2)而外加至第二組02驅動階段(SRCi,…,级㈤之偶 15 數驅動階段(SRCi,...,SRCn)。 如此,η驅動階段(SRC1,···,SRCn)之若干部分係回應 於第及第一日守脈h號CK及CKB,第一及第二時脈信號CK 及C K B係分別經由第一及第二時脈線c K L丨及c κ B L丨而外 加至該η驅動階段(SRC1,…,驅動階段^化^,…, 20 SRCn)之其它部分係回應於第一及第二時脈信號CK及 CKB,第一及第二時脈信號CK&CKB係分別經由第三及第 四時脈線CKL2及CKBL2而外加至該n驅動階段(SRC1,…,Although the twelfth transistor (NT12) is turned off by 15 when the output signal potential of the dummy phase (SRCn+Ι) supplied from the control terminal (CT) is changed to the off voltage level, the second node (N2) borrows The fourth and fifth transistors (NT4, NT5) maintain the first supply voltage level. Thus, the second transistor (NT2) maintains an on state, and the second power signal (VSS) is output to the output terminal (OUT). Fig. 5 is a circuit diagram showing the dummy phase of Fig. 2, and Fig. 6 is a plan view showing the layout of the dummy P segments of Fig. 5. In the fifth and sixth figures, the same reference numerals indicate the same elements of the nth driving stage (SCRn) of Fig. 1, and thus the detailed description of the same elements will be deleted. Referring to Figures 5 and 6, the dummy phase (SRCn + Ι) includes a raised portion 131a, a falling portion 131b, a raised driver portion 131c, a falling driver portion 131d, and a current carrying output portion 131e. The control terminal of the dummy phase 17 1293444 (SRCn+1) is connected to the output terminal of the dummy phase (SRCn+1). Thus, the dummy phase (SRCn+Ι) is controlled by the output signal of the dummy phase (SRCn+Ι). The transistor size of the transistor (NT12,) 5 connected to the dummy terminal (SRCn+1) control terminal is changed from that of the transistor (NT12) in the ηth driving phase (SRCn), so that the dummy phase can be maintained (SRCn The output signal of +l) goes through a predetermined period of time. Hereinafter, the transistor size indicates the ratio (W/L) of the transistor channel width (W) to the transistor channel length (L). For example, the transistor of the dummy phase (S R C η +1) of the transistor (N T12 ') has a size larger than that of the transistor of the transistor (NT 12) of the nth driving phase (SRCn) by 10 times. Usually the transistor size is determined by the channel width (W). For example, the channel width (w,) of the transistor (NT12,) of the dummy phase (SRCn+1) is about 10 times smaller than the channel width (W) of the transistor (ΝΤ12) of the nth driving phase (SRCn). As shown in Figs. 4 15 and 6, the channel width (W,) of the transistor (NT12) of Fig. 6 is approximately 10 times smaller than the channel width (W) of the transistor (NT12) of Fig. 4. Although the high level output signal of the dummy phase (SRCn+l) is fed back to the control terminal (CT) of the dummy phase (SRCn+1), it depends on the transistor size of the transistor (NT12), after a predetermined period of time tenth The two transistors (NT12,) are turned 20 through. Thus, after the high level output signal of the dummy phase (SRCn+1) is fed back to the control terminal (CT) of the dummy phase (SRCn+1), the tenth transistor (NT10) is not turned off, so the second node (N2) The second supply voltage level (VSS) can be maintained for a predetermined period of time. Therefore, the output terminal of the dummy phase (SRCn+i) can maintain a high voltage level for a predetermined period of time. 1293444 After a predetermined period of time, when the twelfth transistor (NT12) is turned on, the tenth transistor (NT10) is turned off, and the second node (N2) potential is from the second power voltage level (vss). Change to the first supply voltage level (VDD). When the potential of the second node (N2) is changed to the first power supply voltage level (VDD), the transistor 5 (NT2) is turned on, so the second power supply voltage (VSS) is output to the dummy phase (SCRn+Ι). Output terminal (OUT). Further, the twelfth transistor (NT 13) connected to the gradation driving phase (sRCn) of the control terminal (CT) is removed in the dummy phase (SRCn + Ι). As shown in Fig. 6, the thirteenth transistor (NT13) of Fig. 4 is divided by 10 in the dummy phase (SRCn+1}. Thus, since only the second transistor (NT2) outputs the second power supply voltage ( Vss) to the output terminal (OUT), so after a predetermined delay, the second power supply voltage (VSS) is output to the output terminal (OUT). Figure 7 is a line diagram showing the dummy phase output of the same circuit with the driving phase of Figure 2. #5虎 waveform' Figure 8 is a line graph showing the output signal waveform of the dummy phase of Figure 5. The X axis represents time (differential) and the y axis represents voltage (volts). Refer to Figure 7 to sequence in the drive phase. The output signal (OUTn-1, OUTn) with high voltage level is output, and the output voltage (OUTn+Γ) is output during the dummy phase (SRCn+Ι) operation. In the seventh figure, the dummy phase (SRCn+Ι) has a drive. In the same circuit of the phase, the output terminal of the dummy phase (SRCn+Ι) is connected to the control terminal of the 2〇 dummy phase (SRCn+Ι). Once the signal is output from the output terminal of the dummy phase (sRCn+1) (0 UT η +1 ') when the potential is changed to a high voltage level via the output signal (OUTn) of the nth driving phase (SRCn), The voltage level output signal (OUTn+ Γ) is applied to the control terminal of the nth drive stage (SRCn) and the control terminal of the dummy stage (SRCn+1). 19 1293444 Output output by the output terminal of the dummy stage (SRCn+1) The signal (OUTn+Γ) potential is changed to the off voltage level (or low voltage level) by the output signal (OUTn+1 ') of the control terminal of the dummy stage (SRCn+Ι). Thus, the output signal (OUTn+1') does maintain the high voltage level through the 5 segment predetermined hold and drops to the turn-off voltage level. The maximum voltage level of the output signal (OUTn+1 ') is much smaller than the output signal (〇UTn) The maximum voltage level. However, when the dummy phase (SRCn+l) has the circuit of Figure 5, as shown in Figure 8, the output signal (OUTn+1) has a more stable output signal (OUTn+Γ). The waveform is set. After the output signal (OUTn-l, OUTn) with high voltage level is sequentially output in the driving phase, the dummy phase (SRCn+l) is operated to output the output signal (OUTn+1). The potential of the output signal (OUTn+1) output from the output terminal of SRCn+l) is output by the η drive stage (SRCn) When the number (OUTn) 15 is changed to the on voltage level (or the high voltage level), the output signal having the on voltage level (〇UTn+1) is applied to the control terminal of the nth driving stage (SRCn) and the control terminal Control terminal of the dummy phase (SRCn+1). Then, although the output signal (OUTn+1) is applied to the control terminal of the dummy phase (SRCn+1), the output output from the output terminal 20 of the dummy phase (SRCn+1) The signal (0UTn+l) is not instantaneously changed to the power-off level. Instead, the output signal (OUTn+1) output from the output terminal of the dummy stage (SRCn+1) is turned off after a predetermined period of time. quasi. Therefore, the output signal (0UTn+l) can maintain a high voltage level for a predetermined period of time. 20 1293444 produces an output signal (〇UTn+1) that has a voltage level that is almost equal to the output signal (〇UTn) _. Therefore, the nth driving phase (SRCn) can be stably driven by the output signal (?n+1) of the dummy phase (SRCn+Ι). < ER_ Figure 9 is a circuit diagram showing a -5 driving phase and a dummy phase in accordance with a second embodiment of the present invention. Referring to Fig. 9, the shift register 133 according to the second embodiment of the present invention includes an η driving phase (SRC1, ..., SRCn) and a dummy phase (SRCn + Ι). The nth driving stage (SRCn) includes a rising portion 133a, a falling portion 133b, a rising driver portion 133c, and a lowering driver portion 10 minutes 133d. The rising portion 133a includes a first NMOS transistor (NTla). . The clock signal (CK) is applied to the drain of the first NMOS transistor (1^1&), the gate of the first NMOS transistor (NTla) is coupled to the first node (Nla), and the first NMOS device The source of the crystal (NTla) is coupled to the output terminal 15 (OUTn). The falling portion 133b includes a second NMOS transistor (NT2a). The drain of the second NMOS transistor (?^2&) is coupled to the output terminal (OUTn), the gate of the second NMOS transistor (NT2a) is coupled to the second node (N2a), and the second NMOS The source of the transistor (NT2a) is coupled to the second power line 20 terminal (VSST). The boost driver portion 133c includes a capacitor (C), NMOS transistors (NT3a, NT4a, NT5a). The third transistor of the third transistor < D 3 & is connected to the first power line terminal (VDDT), the gate of the third transistor (NT3a) is coupled to the input terminal (IN), and the third transistor ( The source of NT3a) is linked to the 21st 1293444 node (Nla). The drain of the fourth transistor (NT4a) is connected to the first node (Nla). The gate of the fourth transistor (NT4a) is connected to the control terminal (ct), and the source of the fourth transistor (NT4a). It is connected to the second power line terminal (VSST). The immersion of the fifth transistor (NT5a) is connected to the first node 5 (Nla). The gate of the fifth transistor (NT5a) is connected to the second node (N2a), and the fifth transistor (NT5a) The source is connected to the second power line terminal (VSST). The transistor size of the third transistor (NT3a) is approximately twice the size of the transistor of the fifth transistor (NT5a). The drop driver portion 133d includes an NMOS transistor (NT6a, 10 NT7a). In detail, the drain and the gate of the sixth transistor (>〇^) are commonly connected to the second power line terminal (VDDT), and the source of the sixth transistor is connected to a second node (N2a). The gate of the seventh transistor (1^丁7&) is connected to the second node (N2a), and the gate of the seventh transistor (NT7a) is connected to the first node (N21) And the source of the seventh transistor (NT7a) is coupled to the second 15 power line terminal (VSST). The transistor size of the sixth transistor (NT6a) is about larger than the transistor size of the seventh transistor (NT7a). When the output signal of the (n-1)th drive phase (SRCn-Ι) is output to the input terminal (IN) of the nth drive phase (SRCn), the seventh transistor (NT7a) is turned on. When the seven transistor (NT7a) is turned on, the potential of the second node (N2a) is changed from the first power supply voltage level (VDD) to the second power supply voltage level (VSS). Then even the seventh transistor (NT7a) is turned on. Conduction, because the sixth transistor (NT6a) transistor size is about 6 times larger than the transistor size of the seventh transistor (NT7a), and the second node (N2a) still maintains the second power supply voltage level (VSs). High voltage bit When the output signal 22 1293444 (OUTn+1) of the dummy phase (SRCn+Ι) is recovered via the control terminal (CT) of the nth driving phase (SRCn), the seventh transistor (NT7a) is turned off. Thus, the second The node (N2a) potential is changed to the first power supply voltage level (VDD) by the second power supply voltage level (VSS) by the sixth transistor (NT6a). 5 Even when controlled via the ηth drive stage (SRCn) When the output signal potential of the dummy phase (SRCn+Ι) applied to the terminal (CT) is changed to the turn-off voltage level, and the fourth transistor (NT4a) is turned off, the second node is caused by the sixth transistor (NT6a). The first power supply voltage level (VDD) is maintained. Thus, the second transistor (NT2a) maintains an on state, and the output terminal (OUTT) has a second power supply voltage level (VSS). As shown in FIG. 9, dummy The stage (SRCn+Ι) includes a rising portion 133a, a falling portion 133b, a rising driver portion 133c and a lowering driver portion 133d. The control terminals of the dummy phase (SRCn+Ι) are connected to the dummy phase (SRCn+Ι) The output terminal. Thus, the dummy phase (SRCn+1) 15 is controlled by the output signal of the dummy phase (SRCn+Ι). The transistor size of the transistor to the control terminal of the dummy phase (SRCn+Ι) is changed from the transistor size of the transistor connected to the control terminal of the ηth driving stage (SRCn), so the dummy phase is maintained (SRCn+Ι) The output signal goes through a predetermined period of time. 20 For example, the transistor of the dummy phase (SRCn+1) has a transistor size approximately 10 times smaller than that of the transistor of the nth driving phase (SRCn) (NT4). Thus, shortly after the high level output signal of the dummy phase (SRCn+Ι) is fed back to the control terminal (CT) of the dummy phase (SRCn+Ι), since the fourth transistor (NT4') is not turned off, the first The seven transistors (9) are not immediately turned on. 23rd 1293444 The four node (N4) maintains the second supply voltage level (VSS) for a predetermined period of time. Therefore, the output terminal of the dummy phase (SRCn+Ι) maintains the high voltage level for a predetermined period of time. After a predetermined period of time, when the fourth transistor (NT4,) is turned on, the fifth seventh transistor (NT7a) is turned off, and the fourth node (N4) potential is changed by the second power supply voltage level (VSS). At the first supply voltage level (VDD). When the potential of the fourth node (N4) is changed to the first power supply voltage level (VDD), the second transistor (NT2a) is turned on, so the second power supply voltage level (VSS) is output to the dummy stage (SRCn). +Ι) Output terminal (OUT). 10 The control terminal (CT) of the dummy phase (SRCn+Ι) is connected to the output terminal (〇UTn+1) of the dummy phase (SRCn+1), so the dummy phase (SRCn+1) can maintain stable operation. In addition, the gate driver circuit does not require another external wiring, via which the control signal is applied to the control terminal (CT) of the dummy phase (SRCn + Ι). 15 This prevents the capacitance between the external wiring and the other wiring, and the signal applied to the gate driver circuit can be undelayed. 10 is a block diagram showing a displacement register for driving a gate driver circuit according to a third embodiment of the present invention, and a second diagram showing a waveform of an output signal of the gate driver circuit of FIG. . The following r i" 20 is an even number smaller than "η". Referring to Figure 1 , a gate driver circuit 150 in accordance with a third embodiment of the present invention includes a shift register 151. The shift register 151 is divided into a first group G1 and a second group G2. The first group and the second group G1 and G2 each comprise a plurality of stages. The wiring portion 152 is disposed adjacent to the displacement register 15ι. 24 1293444 The wiring portion 152 provides a plurality of signals to the shift register 151. In detail, the wiring portion 152 includes a start signal line (STL), a first power line (VDDL), a -th clock line (CKL1), a second clock line (ckbli), and a second power line. (VSSL), a third clock line (CKL2), and a fourth clock line 5 (CKBL2). A first clock signal (ck) is applied to the odd drive phase (SRC1, ..., SRC3) of the drive phase (SRC1, · "SRCi_1}) of the first group G1 via the first clock line (CKL1). The clock signal (CK) is applied to the odd-numbered driving phase (SRCi+1) of the driving phase (SRCi, ..., SRCn) of the second group G2 via the third clock line (CKL2). Relative to the first clock The signal (CK) has a second clock signal (CKB) with a phase difference of 18 degrees via the second clock line (CKBL丨), applied to the driving phase of the first group gi (SRC1, ..., sRCi-Di even drive stage ( SRC2, ...). The second clock signal (CKB) is added to the second group 02 drive phase (SRCi, ..., stage (f) even 15 drive stage (SRCi, via the fourth clock signal (CKBL2). Thus, SRCn). Some parts of the η-drive phase (SRC1, . . . , SRCn) are in response to the first and second day sigma h CK and CKB, the first and second clock signals CK and CKB The other portions of the η driving phase (SRC1, ..., driving phase ^, ..., 20 SRCn) are respectively applied to the first and second clock lines c KL 丨 and c κ BL 回应 in response to the first second The clock signal CK and CKB, the first and the second clock signal CK & CKB line and are applied to the n-th driving stage (SRCl via the third and the second clock line CKL2 and seasons CKBL2, ...,
SRCn)。因此,具有導通電壓位準且循序外加至第一閘線、 第一閘線、…、第n閘線之第一及第二時脈信號CK及CKB 1293444 之延遲減至最低,因此可防止由各階段輸出之輸出信號的 失真。 第三及第四時脈線CKL2及CKBL2未交叉其它佈線 (VSSL、VDDL、STL等),故連結至n驅動階段⑽^,…, 5 SRCn)之各個驅動階段。第三及第四時脈線CKL2&CKBL2 各自係連結至第一及第二時脈線CKL1&CKBL1之末端,該 第一及第二時脈線CKL1及CKBL1欲連結至n驅動階段 (SRC1,…,SRCn)之各驅動階段。 特別’其中輸入第一時脈信號CK至第三時脈線CKL2 10之第一端係設置晚鄰於,其中輸入第一時脈信號CK至第一 時脈線CKL1之第一端。(其中輸入第二時脈信號CKB之)第 二時脈信號CKBL1之第一端係設置毗鄰於(其中輸入第二 時脈信號CKB之)第四時脈線CKBL2之第一端。換言之,第 一、第二、第三及第四時脈線(CKL1、CKB1、CKL2、ckbl幻 15之輸入端係設置毗鄰於該第一驅動階段(SRC1)。 第一時脈線CKL1之第二端係於虛設階段(SRCn+1)附 近,連結至第三時脈線CKL2之第二端。 第三及第四時脈線CKL2及CKBL2非直連結至位移暫 存斋151 ’且未父又其它佈線。如此,第一及第二時脈信號 20 CK及CKB可比行進通過第一及第二時脈線CKu及 CKBL1,更快速行進通過第三及第四時脈線CKL2及 CKBL2。 此外,佈線寬度愈窄,則位移暫存器151愈毗鄰於佈線。 特別,開始信號線STL設置最接近於位移暫存器151, 26 1293444 開始#號線STL後其次設置第一電源線VDDL。第一電源線 VDDL之後,循序設置第一及第二時脈線CK1&CKBL1。第 一時脈線CKL1之後設置第二電源線VSSL。第二電源線 VSSL之後,没置第二時脈線CKL2。第三時脈線CKL2之後 5 設置第四時脈線CKBL2。 因佈線部分152之佈線係以前述順序設置,故lcd裝置 可提供較高顯示品質。佈線設置較為毗鄰於位移暫存器 151,則佈線間之總接觸面積較大,以及佈線間彼此接觸電 容較大。因此,佈線受佈線間電容的影響較小,則位移暫 10存器151设置車父為接近佈線。因此,LCD裝置可提供較高顯 不品質。 參照第11圖,第一及第二時脈信號CK及CKB係經由第 一及第二時脈線CKL1及CKBL1,而供給位移暫存器151至 第一組G1。當開始信號ST外加至第一組之第一驅動階段 15 SRC1時,第-驅動階段SRC1回應於開始信號ST,而輸出 第一輸出信號oim其具有高第一時脈信$CK之高電壓位 準。然後,第二驅動階段SRC2回應於第一驅動階段SRC1 之第一輸出信號OUT1,而輸出第二輸出信號〇UT2,其具 有高第二時脈信號CKB之高電壓位準。 20 當第一及第二時脈信號CK及CKB經由第三及第四時 脈線CKL2及CKBL2,供給位移暫存器151至第二組〇2時, 第1驅動階段S R C1亦即第二組G 2之第一.驅動階段,回應於第 (1-1)驅動階段SRCi_l之第(i_i)輸出信號〇υτΜ,而輸出第⑴ 輸出#號OUTi,其具有第二時脈信號CKB之高電壓位準。 27 1293444 然後’第(i+l)驅動階段SRCi+l回應於第(i)驅動階段SRCi 之第(Ο輪出信號OUTi,而輸出第(i+i)輸出信號〇UT+i,其 具有第一時脈信號CK之高電壓位準。 如前文說明,第一、第二…及第(n)輸出信號(0UT1、 5 QUT2 ' ··_、〇UTn)循序輸出,於各驅動階段輸出之輸出端 子具有高電壓位準。SRCn). Therefore, the delay of the first and second clock signals CK and CKB 1293444 having the on-voltage level and sequentially applied to the first gate line, the first gate line, ..., the n-th gate line is minimized, thereby preventing Distortion of the output signal output at each stage. Since the third and fourth clock lines CKL2 and CKBL2 do not cross other wirings (VSSL, VDDL, STL, etc.), they are connected to the respective driving stages of the n driving stages (10), ..., 5 SRCn). The third and fourth clock lines CKL2 & CKBL2 are respectively connected to the ends of the first and second clock lines CKL1 & CKBL1, and the first and second clock lines CKL1 and CKBL1 are to be connected to the n-drive phase (SRC1, ..., SRCn) each drive stage. Specifically, the first end of the input first clock signal CK to the third clock line CKL2 10 is set to be adjacent, wherein the first clock signal CK is input to the first end of the first clock line CKL1. The first end of the second clock signal CKBL1 (in which the second clock signal CKB is input) is disposed adjacent to the first end of the fourth clock line CKBL2 (where the second clock signal CKB is input). In other words, the input terminals of the first, second, third, and fourth clock lines (CKL1, CKB1, CKL2, and ckbl are set to be adjacent to the first driving phase (SRC1). The first clock line CKL1 The two ends are in the vicinity of the dummy phase (SRCn+1) and are connected to the second end of the third clock line CKL2. The third and fourth clock lines CKL2 and CKBL2 are not directly connected to the displacement temporary storage 151' and are not the parent In addition, the first and second clock signals 20 CK and CKB can travel faster through the third and fourth clock lines CKL2 and CKBL2 than the first and second clock lines CKu and CKBL1. The narrower the wiring width, the closer the displacement register 151 is to the wiring. In particular, the start signal line STL is set to be closest to the displacement register 151, 26 1293444, and the first power line VDDL is set after the # line STL is started. After the power line VDDL, the first and second clock lines CK1 & CKBL1 are sequentially set. The second power line VSSL is disposed after the first clock line CKL1. After the second power line VSSL, the second clock line CKL2 is not set. The fourth clock line CKBL2 is set after the third clock line CKL2. The wiring of 2 is arranged in the foregoing order, so that the lcd device can provide higher display quality. The wiring arrangement is adjacent to the displacement register 151, the total contact area between the wirings is large, and the contact capacitance between the wirings is large. The wiring is less affected by the capacitance between the wirings, and the displacement temporary storage 151 sets the parent to be close to the wiring. Therefore, the LCD device can provide higher quality. Referring to FIG. 11, the first and second clock signals are provided. CK and CKB are supplied to the shift register 151 to the first group G1 via the first and second clock lines CKL1 and CKBL1. When the start signal ST is applied to the first drive stage 15 SRC1 of the first group, the first - The driving phase SRC1 outputs a first output signal oim having a high voltage level of the first first clock signal $CK in response to the start signal ST. Then, the second driving phase SRC2 is responsive to the first output of the first driving phase SRC1 The signal OUT1 outputs a second output signal 〇UT2 having a high voltage level of the second second clock signal CKB. 20 When the first and second clock signals CK and CKB are passed through the third and fourth clock lines CKL2 And CKBL2, supply displacement temporary storage 151 to the second group 〇2, the first driving phase SR C1, that is, the first driving phase of the second group G 2 , in response to the (i_i)th output signal 〇υτΜ of the (1-1) driving phase SRCi_1, And output (1) output ##OUTi, which has the high voltage level of the second clock signal CKB. 27 1293444 Then the '(i+l) drive stage SRCi+1 responds to the (i)th drive stage SRCi ( The signal OUTi is rotated and the (i+i)th output signal 〇UT+i is output, which has a high voltage level of the first clock signal CK. As explained above, the first, second, and (n)th output signals (0UT1, 5QUT2 '··_, 〇UTn) are sequentially output, and the output terminals outputted at the respective driving stages have a high voltage level.
第12圖為佈局圖顯示第1〇圖之閘極驅動電路之第三及 第四時脈線配置,以及第13圖為佈局圖顯示位移暫存器之 第一、第三、第二及第四時脈線間之另一連結範例。 10 . 參照第12圖,開始信號線STL、第一電源線VDDL、第Figure 12 is a layout diagram showing the third and fourth clock line configurations of the gate drive circuit of Figure 1, and Figure 13 is a layout diagram showing the first, third, second, and third of the displacement registers. Another example of a link between four clock lines. 10. Referring to Figure 12, the start signal line STL, the first power line VDDL, the first
一及第二時脈線CKL1及CKBL1、第二電源線VSSL、第三 及第四時脈線CKL2及CKBL2係循序設置於位移暫存器151 旁。各佈線寬度愈窄,則位移暫存器151設置愈毗鄰於佈 線。換言之,遠離位移暫存器151之佈線寬度不小於設置接 15近位移暫存器丨51之佈線寬度。佈線設置愈毗鄰於位移暫存 器’則佈線間之總接觸面積愈大,且彼此接觸之佈線間之 電容愈大。因此,佈線受佈線間電容影響較小,佈線設置 較接近於位移暫存器151。 特別,開始信號線STL設置最接近於位移暫存器151, 20開始信號線STL後其次設置第一電源線VDDL。第一電源線 VDDL之後,猶序設置第一及第二時脈線CK1及CKBL1。第 二時脈線⑶1^1設置於比第一時脈線CKL1更接近位移暫存 器151。第一時脈線CKL1後其次設置第二電源線VSSL。因 此’可減少佈線與連結線[供連結該佈線至各階段(SRC1,... 28 1293444 SRCn+1)]間之電容造成的信號延遲減少。第三及第四時脈 線CKL2及CKBL2未交叉其它佈線(VSSL、VDDL、STL等), 故連結至位移暫存器151。因第三及第四時脈線CKL2及 CKBL2末端分別係連結至欲連結至位移暫存器之第一及第 5二時脈線CKL1及CKBL1末端,故第三及第四時脈線CKL2 及CKBL2設置成比第二電源線VSSL更遠離位移暫存器。換 言之,第三及第四時脈線CKL2及CKBL2係設置於第二電源 線VSSL外側。如第12圖所示,第三及第四時脈線CKL2及 CKBL2成形於TFT基板300之封合線區(SA)。 1〇 TFT基板300被劃分為一顯示區(DA)以及一環繞該顯 示(DA)之周邊區(PA)。閘線(圖中未顯示)、資料線(圖中未 顯示)及像素(圖中未顯示)係形成於顯示區(DA)。 周邊區(PA)被劃分為閘極驅動區(GA)及封合線區 (SA)。位移暫存器151及各佈線係形成於閘極驅動區(GA)。 15供接合TFT基板與濾色片基板(圖中未顯示)之封合劑(圖中 未顯示)係形成於封合線區(SA)。部分封合線區(SA)與部分 閘極驅動區(GA)彼此重疊。封合線區(SA)被劃分為第一區 及第二區。液晶層係形成於封合線區(SA)之第一區,液晶 層未形成於封合線區(SA)之第二區。閘極驅動區(GA)包括 20 第一區。 第三及第四時脈線CKL2及CKBL2以及部分第二電源 線VSSL係形成於該封合線(SA)。第二電源線VSSL、第一及 第二時脈線CKL1及CKBL1及開始信號線STL之其它部分 係形成於閘極驅動區(GA)。 29 1293444 部分第二電源線VSSL、第一及第二時脈線CKL1及 CKBL1、第一電源線VDDL及開始信號線STL接觸部分連結 線。如此,於製程過程中,當第二電源線VSSL、第一及第 二時脈線CKL1及CKBL卜第一電源線VDDL及開始信號線 5 STL形成於封合線(SA)時,TFT基板300於高溫及高壓下組 合渡色片基板之製程,可能出現接觸失敗。 接觸部分連結線之佈線形成於閘極驅動區(GA),未接 觸連結線之佈線形成於封合線區(SA)。因此,可防止LCD 裝置整體尺寸的加大。特別,因第二電源線VSSL、第三及 10第四時脈線CKL2及CKBL2其它部分未接觸連結線,故第二 電源線VSSL及第三及第四時脈線CKL2及CKBL2其它部分 可形成於封合線區(SA)。 即使第三及第四時脈線CKL2及CKBL2進一步形成於 周邊區(PA),LCD裝置之全部大小也不會增加。此外,因 15第三及第四時脈線CKL2及CKBL2係形成於封合線區(SA, 於該封合線區未形成液晶層,故不存在有因第三及第四時 脈線CKL2及CKBL2所致之電容。因此第一及第二時脈信號 CK及CKB之延遲比第一及第二時脈線CKU&CKBLi之延 遲遠更降低。 2〇 #照第13圖,第-時脈線Cm-端係連結至第三時脈 線CKL2-端,第三時脈線CKBU一端係連結至第四時脈線 CKBL2-端。如此’第-時脈信號⑶經由第三時脈線⑽】 而供給位移暫存器之各階段,以及第二時脈信號ck係經由 第四時脈線CKBL2而供給位移暫存器之各階段。 30 1293444 如弟12及13圖所示,第三及第四時脈線CKL2及CKBL2 未直接連接至位移暫存器151,且未交又其它佈線。如此, 第一及第二時脈信號CK及CKB比較行進通過第一及第二 時脈線CKL1及CKBL1,可更快速行進通過第三及第四時脈 5 線 CKL2及 CKBL2。 若干階段(SRC1,…,SRCn+Ι)係藉經由第一及第二時 脈線CKL1及CKBL1而施加至第一及第二時脈信號ck及 CKB操作,以及其它階段(SRC1,…,SRCn+1)係藉經由第三 及第四時脈線CKL2及CKBL2施加至第一及第二時脈線 10 CKL1及CKBL1而操作。 因此,具有高電壓位準且係循序施加至第一閘線、第 一閘線、…及第η閘線之第一及第二時脈信號CK及CKB之延 遲可最小化,故可防止由位移暫存器各階段輸出之輪出信 號的失真。 15 第14圖為佈局圖’顯示根據本發明之第四具體實施例 之位移暫存器佈線結構,以及第15圖為佈線圖,顯示具有 第14圖之佈線結構之位移暫存器。 參照第14及15圖,供連結第二電源線VSSL至各階段之 第一連結線VS SLc係設置於第二電源線vs SL與位移暫存器 20 (圖中未顯示)間。並聯第二電源線VSSL及第一及第二時脈 線CKL1及CKBL1係設置於第二電源線VSSL與位移暫存器 間。 第一連結線VSSLc交叉第一及第二時脈線^^“及 CKBL1。第一及第二時脈線CKL1及cKBLa自具有第一寬 31 1293444 度W1於(第一連結線VSSLc未交叉之)其第一部分,以及具 , 有寬度W2於(第一連結線VSSLc未交又之)其第二部分。第 ' 二寬度W2係小於第一寬度W1。 特別,第一時脈線CKL1具有第一凹部C1,係對應於第 ? 5 一連結線乂“1^之其第二部分。第二時脈線CKLB1具有第 . 二凹部C2,其係對應於第一連結線VSSLc交叉之第二部分。 弟時脈線CKL1具有第一及第二側壁“οι及1402於 縱向延伸,以及第二時脈線CKBL1具有第三及第四側壁 1403及1404於縱向延伸。第一時脈線CKU之第二側壁14〇2 · 1〇面對第二時脈線CKLB1之第三側壁1403。第一凹部〇係形 成於第一側壁1401,第二凹部C2係形成於第四側壁14〇4。 如第14及15圖所示’對各階段提供第一時脈信號(cKL) 之苐一日^脈連結線CKLc係設置於第一時脈線CKL1與位移 暫存器151間。對各階段提供第二時脈信號(CLB)之第二時 15脈連結線CKBLc係設置於第二時脈線CKBL1與位移暫存器 151間。弟一時脈連結線CKLc接觸第一時脈線CKL1於第一 時脈線CKL1之第二側壁1402附近。第二時脈連結線CKBU · 接觸第二時脈線CKBL1於第二時脈線CKBL1之第三側壁 1403附近。例如第一及第二凹部(::1及(:2係形成於第一及第 20 二時脈線CKL1及CKBL1部分,於該部分第一及第二時脈線 CKL1及CKBL1未重疊弟一及第二時脈線cklc及CKBLc。 可減少於弟一及弟一時脈線CK1及CKB1重疊第一連 結線VSSLc部分產生的電容。因此可減少經由第一及第二 時脈線CKL1及CKBL1施加至位移暫存器之第一及第-時 32 1293444 脈號CK及CKB之延遲。此外,可減少經由第一連結線 VSSLc施加至位移暫存器之第二電源電壓信號vss之延遲。 因第一及第二時脈線CKL1及CKBL1之若干部分之寬 度窄(W2),故第一及第二時脈線CK1及CKB1重疊第一連結 5線VSSLc該部分產生之電阻增高。但因信號延遲受電容影 響比受電阻影響更大,故可減少信號的延遲。 後文中,隨電阻及電容改變之RC延遲顯示於表丨實施 例及比較例。實施例中,第一及第二時脈線CKL1及CKBL1 各自第一寬度為70微米,第一及第二時脈線ckl1&ckbL1 10各自第^一寬度(W2)為45微米。比較例中,第一及第二時脈 線CKL1及CKBL1各自之第一及第二寬度(W1、贾)為7〇微 米0 <表1> CKLl(CKBLl) W1 W2 C R 比較例 70微米 70微米 385pF 457Ω 實施例 70微米 ^45微米 344.5pF 489Ω 如表1所示,比較例中,第一及第二時脈線(CKL1、 15 CKBL1)與第一連結線VSSLc間之第一電容為385pF。實施 例中,第一及第二時脈線(CKL1、CKBL1)與第二連結線 VSSLc間之第二電容為344.5pF實施例之第二電容比比較例 之第一電容降低約10.5%。 比較例中,第一及第二時脈線(CKL1、CKBL1)之第一 20 電阻為457歐姆。實施例中,第一及第二時脈線(CKL1、 CKBL1)之第二電阻為489歐姆。實施例之第二電阻比比較 例之第一電阻增高約7%。但因第二電容之增加比係大於第 33 1293444 二電阻之增加比,故RC延遲減少。 第16圖為佈局圖顯示根據本發明之第五具體實施例之 位移暫存器之佈線結構。 參照第14及15圖,供連結第二電源線VSSL至各階段之 5第一連結線VSSLc係設置於第二電源線VSSL與該位移暫存 器(圖中未顯示)間。並聯第二電源線VSSL及第一及第二時 脈線CKL1及CKBL1係設置於第二電源線VSSL與位移暫存 器間。 第一連結線VSSLc交叉第一及第二時脈線CKL1及 10 CKBL1。第一連結線VSSLc有第三凹部C3,其係對應於第 一及時脈線CKL1交叉之其第三部分。第一連結線 有第四凹部C4,其係對應於第二時脈線CKBL1與其交又之 其第四部分。第一連結線VSSLc具有第三寬度W3於(第一及 弟一時脈線CKL1及CKBL1並未交又之)其部分,且且有第 15四寬度W4於(第一及第二時脈線CKL1及CKBL1交叉之)其 另一部分。第四寬度W4係小於第三寬度W3。 因第一連結線VSSLc具狹窄寬度,對應第一及第二時 脈線CKL1及CKBL1與其交又之部分,故可降低第一及第二 時脈線(CKL1、CKBL1)與第一連結線VSSLc間之電容。因 20此,可減少經由第一及第二時脈線CKL1及CKBL卜施加至 位移暫存器之第一及第二時脈線CK及CKB之延遲。此外, 可減少經由第一連結線VSSLc施加至位移暫存器之第二電 源電壓信號VSS之延遲。 根據前述閘極驅動器電路,因虛設階段(SRCn+1)之虛 1293444 設輪出端子係連結至最末驅動階段(SRCn)之控制端子,也 連結至虛設階段(SRCn+Ι)之虛設控制端子,故可防止外加 至閘極驅動器電路之信號的延遲。 此外,因連結至虛設階段(SRCn+Ι)之控制端子之電晶 5 體結構改變,故虛設階段(SRCn+Ι)之輸出信號可正常輸 出,LCD裝置可提供較高顯示品質。 此外,因除了第一及第二時脈線之外,佈線部分進一 步包括第三及第四時脈線,經由該時脈線施加第一及第二 時脈CK及CKB,故循序施加至第一、第二、…、第最末閘 10線之欲具有高電壓位準之第一及第二時脈信號CK及CKB 之延遲可最小化,LCD裝置可提供較佳顯示品質。 雖然已經說明本發明之具體實施例及其優點之細節, 但須了解可未悖離如隨附之申請專利範圍界定之本發明之 精髓及範圍,於此處做出多種變化、修改及變更。 【圖式簡單說明】 第1圖為示意圖顯示根據本發明之第一具體實施例之 液晶顯示面板; 第2圖為方塊圖顯示第1圖之驅動閘極驅動器電路之位 移暫存器; 第3圖為電路圖顯示第2圖之驅動階段; 第4圖為平面圖顯示第3圖之驅動階段之佈局; 第5圖為電路圖顯示第2圖之虛設階段; 第6圖為平面顯示第5圖之虛設階段佈局; 第7圖為線圖顯示虛設階段輸出信號波形,該虛設階段 1293444 具有第2圖驅動階段之相同電路; 第8圖為線圖顯示第5圖之虛設階段輸出信號波形; 第9圖為電路圖顯示根據本發明之第二具體實施例之 驅動階段及虛設階段; 5 第圖為方塊圖顯示根據本發明之第三具體實施例 供驅動閘極驅動器電路之位移暫存器; 第11圖為線圖顯示第10圖之閘極驅動器電路之輪出俨 號波形; σ 器電路之第三 、弟一及第四 10 15 第12圖為佈局圖顯示第1〇圖之閘極驅動 及第四時脈線配置; 第13圖為佈局圖顯不位移暫存哭之第一 時脈線間之連結之另一範例; 第14圖為佈局圖顯示根據本發明之第四具體實施例之 位移暫存器之佈線結構; 苐15圖為佈局圖顯示1古 存器;以及 Τ4川圖之佈線結構之位移暫 弟16圖為佈局圖顯示根據本發明之第五具 位移暫存器之佈線結構。 、e例 l〇〇"_TFT 基板 110…薄膜電晶體 120···像素電極 130···閘極驅動器電路 131…位移暫存器 【圖二之主要元件代表符號表】 131a.··升南部分 131b…下降部分 131c···升高驅動器部分 131d···下降驅動器部分 131e···載流輸出部分 36 1293444 132.. .佈線部分 133a...升高部分 133b...下降部分 133c...升高驅動器部分 133d...下降驅動器部分 133e...載流輸出部分 140…資料驅動器電路 150.. .閘極驅動器電路 151.. .位移暫存器 152.. .佈線部分 200.. .液晶顯不面板 DA...顯不區 PA...周邊區 SA...封合線區 GA…閘極驅動區 DL...資料線 GL...閘線 CT...控制端子 SRC...驅動階段 CR...載流端子 IN...輸入端子 ST...開始信號 OUT...輸出端子 STL...開始信號線 VDDL...第一電源線 CKL...第一時脈線 CKBL...第二時脈線 VSSL...第二電源線 VDD...第一電源電壓信號 VSS...第二電源電壓信號 CK...第一時脈信號 CKB…第二時脈信號 CKT...時脈端子 VDDT...第一電源線端子 VSST...第二電源線端子 N...節點 NT...NMOS電晶體 G···組The first and second clock lines CKL1 and CKBL1, the second power line VSSL, and the third and fourth clock lines CKL2 and CKBL2 are sequentially disposed beside the shift register 151. The narrower the width of each wiring, the closer the displacement register 151 is disposed adjacent to the wiring. In other words, the wiring width away from the displacement register 151 is not less than the wiring width of the proximity register 丨51. The closer the wiring arrangement is to the displacement register, the larger the total contact area between the wirings and the greater the capacitance between the wirings that are in contact with each other. Therefore, the wiring is less affected by the capacitance between the wirings, and the wiring arrangement is closer to the displacement register 151. Specifically, the start signal line STL is set closest to the shift register 151, and the first power supply line VDDL is set second after the start signal line STL. After the first power line VDDL, the first and second clock lines CK1 and CKBL1 are set. The second clock line (3) 1^1 is disposed closer to the displacement register 151 than the first clock line CKL1. The second power line VSSL is next set after the first clock line CKL1. Therefore, the signal delay caused by the capacitance between the wiring and the connecting line [to connect the wiring to each stage (SRC1, ... 28 1293444 SRCn+1)] can be reduced. The third and fourth clock lines CKL2 and CKBL2 are not connected to the other wirings (VSSL, VDDL, STL, etc.), and are connected to the shift register 151. Since the ends of the third and fourth clock lines CKL2 and CKBL2 are respectively connected to the ends of the first and fifth clock lines CKL1 and CKBL1 to be connected to the shift register, the third and fourth clock lines CKL2 and CKBL2 is set further away from the shift register than the second power line VSSL. In other words, the third and fourth clock lines CKL2 and CKBL2 are disposed outside the second power line VSSL. As shown in Fig. 12, the third and fourth clock lines CKL2 and CKBL2 are formed in the sealing line region (SA) of the TFT substrate 300. The TFT substrate 300 is divided into a display area (DA) and a peripheral area (PA) surrounding the display (DA). A gate line (not shown), a data line (not shown), and a pixel (not shown) are formed in the display area (DA). The peripheral area (PA) is divided into a gate drive area (GA) and a seal line area (SA). The shift register 151 and each wiring system are formed in a gate driving region (GA). A sealing agent (not shown) for bonding the TFT substrate and the color filter substrate (not shown) is formed in the sealing line region (SA). The partial seal line area (SA) and the partial gate drive area (GA) overlap each other. The seal line area (SA) is divided into a first zone and a second zone. The liquid crystal layer is formed in the first region of the seal line region (SA), and the liquid crystal layer is not formed in the second region of the seal line region (SA). The gate drive region (GA) includes 20 first regions. The third and fourth clock lines CKL2 and CKBL2 and a part of the second power supply line VSSL are formed on the sealing line (SA). The second power supply line VSSL, the first and second clock lines CKL1 and CKBL1, and other portions of the start signal line STL are formed in the gate driving region (GA). 29 1293444 Part of the second power line VSSL, the first and second clock lines CKL1 and CKBL1, the first power line VDDL, and the start signal line STL contact the partial connection line. As such, during the process, when the second power line VSSL, the first and second clock lines CKL1 and CKBL, the first power line VDDL, and the start signal line 5 STL are formed on the sealing line (SA), the TFT substrate 300 is formed. In the process of combining the color transfer substrate under high temperature and high pressure, contact failure may occur. The wiring of the contact portion connecting line is formed in the gate driving region (GA), and the wiring not contacting the connecting line is formed in the sealing line region (SA). Therefore, it is possible to prevent an increase in the overall size of the LCD device. In particular, since the second power line VSSL, the third and fourth fourth clock lines CKL2, and other portions of the CKBL2 are not in contact with the connecting line, the second power line VSSL and the third and fourth clock lines CKL2 and CKBL2 may be formed. In the sealing line area (SA). Even if the third and fourth clock lines CKL2 and CKBL2 are further formed in the peripheral area (PA), the overall size of the LCD device does not increase. In addition, since the third and fourth clock lines CKL2 and CKBL2 are formed in the sealing line region (SA, no liquid crystal layer is formed in the sealing line region, there is no third and fourth clock line CKL2. And the capacitance caused by CKBL2. Therefore, the delays of the first and second clock signals CK and CKB are much lower than the delays of the first and second clock lines CKU&CKBLi. 2〇#照第13图,第时The pulse line Cm-end is connected to the third clock line CKL2-terminal, and the third clock line CKBU is connected to the fourth clock line CKBL2- terminal at one end. Thus the 'first-clock signal (3) is via the third clock line (10)] The stages of the supply of the shift register and the second clock signal ck are supplied to the stages of the shift register via the fourth clock line CKBL2. 30 1293444 As shown in the figures 12 and 13, the third And the fourth clock lines CKL2 and CKBL2 are not directly connected to the shift register 151, and no other wiring is left. Thus, the first and second clock signals CK and CKB are relatively traveled through the first and second clock lines. CKL1 and CKBL1 can travel faster through the third and fourth clocks 5 lines CKL2 and CKBL2. Several stages (SRC1,...,SRCn+Ι) are borrowed. The first and second clock lines CKL1 and CKBL1 are applied to the first and second clock signals ck and CKB, and the other phases (SRC1, . . . , SRCn+1) are passed through the third and fourth clocks. The lines CKL2 and CKBL2 are applied to the first and second clock lines 10 CKL1 and CKBL1 to operate. Therefore, the high voltage level is applied to the first gate line, the first gate line, ... and the ηth gate line. The delays of the first and second clock signals CK and CKB can be minimized, so that the distortion of the round-out signal outputted by the stages of the shift register can be prevented. 15 Figure 14 is a layout diagram showing the fourth according to the present invention. The displacement register wiring structure of the specific embodiment, and Fig. 15 is a wiring diagram showing the displacement register having the wiring structure of Fig. 14. Referring to Figs. 14 and 15, the second power supply line VSSL is connected to each stage. The first connection line VS SLc is disposed between the second power line vs SL and the displacement register 20 (not shown). The parallel second power line VSSL and the first and second clock lines CKL1 and CKBL1 are set. Between the second power line VSSL and the displacement register. The first connection line VSSLc crosses the first and The second clock line ^^" and CKBL1. The first and second clock lines CKL1 and cKBLa have a first width 31 1293444 degrees W1 (the first connecting line VSSLc does not cross) the first part thereof, and have a width The second portion W2 is smaller than the first width W1. In particular, the first clock line CCL1 has a first recess C1 corresponding to the fifth A link line 乂 "1^ of its second part. The second clock line CKLB1 has a second recess C2 corresponding to the second portion where the first connecting line VSSLc intersects. The clock line CKL1 has first and second side walls "οι and 1402 extending in the longitudinal direction, and the second clock line CKBL1 has third and fourth side walls 1403 and 1404 extending in the longitudinal direction. The second clock line CKU is second. The side wall 14〇2·1〇 faces the third side wall 1403 of the second clock line CKLB1. The first recess is formed on the first side wall 1401, and the second recess C2 is formed on the fourth side wall 14〇4. And Fig. 15 shows that the first clock signal (cKL) for each stage is provided between the first clock line CKL1 and the displacement register 151. The second stage is provided for each stage. The second pulse line CKBLc of the clock signal (CLB) is disposed between the second clock line CKBL1 and the displacement register 151. The first clock line CKLc contacts the first clock line CKL1 at the first clock line. The second clock line CKBU is in contact with the second clock line CKBL1 in the vicinity of the third side wall 1403 of the second clock line CKBL1. For example, the first and second recesses (:: 1 and (: 2 is formed in the first and 20th clock lines CKL1 and CKBL1, in the first and second clock lines CKL1 and CKBL1 The overlap of the first and second clock lines cklc and CKBLc can reduce the capacitance generated by the first line and the second line of the VSSLc of the first line and the second line of the line CK1 and CKB1. Therefore, the first and second clock lines CKL1 can be reduced. And the delay of CKBL1 applied to the first and third time slots of the shift register, 1293444, pulse number CK and CKB. Furthermore, the delay of the second power supply voltage signal vss applied to the displacement register via the first connection line VSSLc can be reduced. Since the widths of the portions of the first and second clock lines CKL1 and CKBL1 are narrow (W2), the resistance generated by the first and second clock lines CK1 and CKB1 overlapping the first connected 5-line VSSLc is increased. Since the signal delay is more affected by the capacitance than by the resistance, the delay of the signal can be reduced. In the following, the RC delay as a function of resistance and capacitance is shown in the embodiment and the comparative example. In the embodiment, the first and second Each of the first and second clock lines ckl1 & ckbL1 10 has a first width (W2) of 45 μm. In the comparative example, the first and second clock lines First and second widths of CKL1 and CKBL1 (W1, Jia) 7 〇 micron 0 <Table 1> CKLl (CKBLl) W1 W2 CR Comparative Example 70 μm 70 μm 385 pF 457 Ω Example 70 μm 45 μm 344.5 pF 489 Ω As shown in Table 1, in the comparative example, first and second The first capacitance between the clock line (CKL1, 15 CKBL1) and the first connection line VSSLc is 385 pF. In the embodiment, the second capacitance between the first and second clock lines (CKL1, CKBL1) and the second connection line VSSLc is 344.5 pF. The second capacitance of the embodiment is reduced by about 10.5% from the first capacitance of the comparative example. In the comparative example, the first 20th resistance of the first and second clock lines (CKL1, CKBL1) is 457 ohms. In an embodiment, the second resistance of the first and second clock lines (CKL1, CKBL1) is 489 ohms. The second resistance of the example was increased by about 7% compared to the first resistance of the comparative example. However, since the increase ratio of the second capacitance is greater than the increase ratio of the second resistor of 33 1293444, the RC delay is reduced. Fig. 16 is a plan view showing the wiring structure of the displacement register in accordance with the fifth embodiment of the present invention. Referring to Figures 14 and 15, the first connection line VSSLc for connecting the second power line VSSL to each stage is disposed between the second power line VSSL and the shift register (not shown). The parallel second power line VSSL and the first and second clock lines CKL1 and CKBL1 are disposed between the second power line VSSL and the shift register. The first connection line VSSLc intersects the first and second clock lines CKL1 and CKBL1. The first connecting line VSSLc has a third recess C3 corresponding to the third portion where the first timely pulse line CKL1 intersects. The first connecting line has a fourth recess C4 corresponding to the fourth portion of the second clock line CKBL1. The first connecting line VSSLc has a third width W3 (the first and the first clock lines CKL1 and CKBL1 are not intersected), and has a 15th fourth width W4 (the first and second clock lines CKL1) And CKBL1 cross) another part of it. The fourth width W4 is smaller than the third width W3. Since the first connecting line VSSLc has a narrow width and corresponds to the first and second clock lines CKL1 and CKBL1, the first and second clock lines (CKL1, CKBL1) and the first connecting line VSSLc can be lowered. Capacitance between. As a result, the delays applied to the first and second clock lines CK and CKB of the shift register via the first and second clock lines CKL1 and CKBL can be reduced. Further, the delay of the second power source voltage signal VSS applied to the shift register via the first connection line VSSLc can be reduced. According to the gate driver circuit, the dummy terminal of the dummy phase (SRCn+1) is set to the control terminal of the last drive phase (SRCn), and is also connected to the dummy control terminal of the dummy phase (SRCn+Ι). Therefore, the delay of the signal applied to the gate driver circuit can be prevented. In addition, since the structure of the transistor 5 connected to the control terminal of the dummy phase (SRCn+Ι) is changed, the output signal of the dummy phase (SRCn+Ι) can be normally output, and the LCD device can provide higher display quality. In addition, the wiring portion further includes third and fourth clock lines in addition to the first and second clock lines, and the first and second clocks CK and CKB are applied via the clock line, so that the sequence is applied to the first The delays of the first and second clock signals CK and CKB of the first, second, ..., and the last gate 10 lines having high voltage levels can be minimized, and the LCD device can provide better display quality. Having described the specific embodiments of the present invention and the advantages thereof, it is to be understood that various changes, modifications and changes may be made herein without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a liquid crystal display panel according to a first embodiment of the present invention; FIG. 2 is a block diagram showing a displacement register of a driving gate driver circuit of FIG. 1; The figure shows the driving phase of the second figure in the circuit diagram; the fourth figure shows the layout of the driving phase of the third figure in plan view; the fifth figure shows the dummy phase of the second figure in the circuit diagram; and the dummy drawing in the fifth figure in the sixth figure Stage layout; Figure 7 is a line diagram showing the output signal waveform of the dummy stage. The dummy stage 1293444 has the same circuit as the driving stage of Figure 2; Figure 8 is the line diagram showing the output signal waveform of the dummy stage of Figure 5; The driving phase and the dummy phase according to the second embodiment of the present invention are shown in a circuit diagram; 5 is a block diagram showing a displacement register for driving a gate driver circuit according to a third embodiment of the present invention; For the line graph, the wheel semaphore waveform of the gate driver circuit of Fig. 10 is shown; the third, the first and the fourth 10 of the σ circuit are shown in Fig. 12, and the gate diagram of the first diagram is shown in the layout diagram. And a fourth clock line configuration; FIG. 13 is another example of the connection between the first clock lines of the layout map display displacement; and FIG. 14 is a layout diagram showing the fourth embodiment according to the present invention. The wiring structure of the displacement register; 苐15 is a layout diagram showing the 1 memory; and the displacement of the wiring structure of the Τ4chuan diagram is shown as a layout diagram showing the fifth displacement register according to the present invention. Wiring structure. e example l〇〇"_TFT substrate 110...film transistor 120···pixel electrode 130···gate driver circuit 131...displacement register [Figure 2 main component representative symbol table] 131a.·· The south portion 131b...the descending portion 131c···uplifting driver portion 131d···the descending driver portion 131e···the current-carrying output portion 36 1293444 132..the wiring portion 133a...the rising portion 133b...the falling portion 133c...rise driver portion 133d...drop driver portion 133e...carrier output portion 140...data driver circuit 150..gate driver circuit 151..displacement register 152.. wiring portion 200.. . LCD display panel DA... display area PA... peripheral area SA... sealing line area GA... gate drive area DL... data line GL... brake line CT.. Control terminal SRC... drive phase CR... current-carrying terminal IN... input terminal ST... start signal OUT... output terminal STL... start signal line VDDL... first power supply line CKL ...first clock line CKBL...second clock line VSSL...second power line VDD...first power supply voltage signal VSS...second power supply voltage signal CK...first time Pulse signal CKB... Second clock signal CKT...clock terminal VDDT...first power line terminal VSST...second power line terminal N...node NT...NMOS transistor G··· group
3737
Claims (1)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20020018924 | 2002-04-08 | ||
| KR1020020061454A KR100860239B1 (en) | 2002-04-08 | 2002-10-09 | Liquid crystal display apparatus |
| KR1020020087014A KR100902068B1 (en) | 2002-12-30 | 2002-12-30 | Gate driving circuit and liquid crystal display device having the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200305848A TW200305848A (en) | 2003-11-01 |
| TWI293444B true TWI293444B (en) | 2008-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92107914A TWI293444B (en) | 2002-04-08 | 2003-04-07 | Liquid crystal display device |
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|---|---|
| JP (1) | JP4991775B2 (en) |
| TW (1) | TWI293444B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI409785B (en) * | 2008-08-12 | 2013-09-21 | Innolux Corp | Display device |
| TWI567723B (en) * | 2009-01-16 | 2017-01-21 | 半導體能源研究所股份有限公司 | Liquid crystal display device and electronic device thereof |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7443202B2 (en) * | 2006-06-02 | 2008-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic apparatus having the same |
| EP1895545B1 (en) | 2006-08-31 | 2014-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| TWI642043B (en) * | 2009-09-10 | 2018-11-21 | 日商半導體能源研究所股份有限公司 | Semiconductor device and display device |
| TWI420452B (en) * | 2009-09-22 | 2013-12-21 | Hannstar Display Corp | Shift register for display panel |
| TWI515707B (en) | 2011-04-25 | 2016-01-01 | 群創光電股份有限公司 | Image display system, shift register and a method for controlling a shift register |
| TWI419142B (en) * | 2011-05-06 | 2013-12-11 | Darfon Electronics Corp | Lcd driver circuit |
| KR101983976B1 (en) | 2011-05-13 | 2019-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device |
| CN113808517B (en) * | 2018-10-18 | 2023-08-08 | 武汉天马微电子有限公司 | Display panel and display device |
| CN113066414B (en) * | 2021-02-20 | 2023-03-10 | 上海中航光电子有限公司 | Display panel and display device |
| CN116312242B (en) * | 2021-09-10 | 2025-06-06 | 厦门天马显示科技有限公司 | Display panel and display device |
| KR102780206B1 (en) * | 2021-12-31 | 2025-03-11 | 엘지디스플레이 주식회사 | Gate driving circuit and display device including gate driving circuit |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3311835B2 (en) * | 1993-10-19 | 2002-08-05 | 株式会社東芝 | Display device drive circuit and liquid crystal display device using the same |
| JP2001134247A (en) * | 1998-11-04 | 2001-05-18 | Matsushita Electric Ind Co Ltd | Built-in drive circuit for liquid crystal display panel |
| JP3588033B2 (en) * | 2000-04-18 | 2004-11-10 | シャープ株式会社 | Shift register and image display device having the same |
| JP4506026B2 (en) * | 2000-05-31 | 2010-07-21 | カシオ計算機株式会社 | Shift register, display device, and image sensor |
| JP4609970B2 (en) * | 2001-01-17 | 2011-01-12 | カシオ計算機株式会社 | Liquid crystal display device |
| JP4439761B2 (en) * | 2001-05-11 | 2010-03-24 | 株式会社半導体エネルギー研究所 | Liquid crystal display device, electronic equipment |
-
2003
- 2003-04-07 TW TW92107914A patent/TWI293444B/en not_active IP Right Cessation
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2009
- 2009-02-25 JP JP2009041646A patent/JP4991775B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI409785B (en) * | 2008-08-12 | 2013-09-21 | Innolux Corp | Display device |
| TWI567723B (en) * | 2009-01-16 | 2017-01-21 | 半導體能源研究所股份有限公司 | Liquid crystal display device and electronic device thereof |
| US10332610B2 (en) | 2009-01-16 | 2019-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| US10741138B2 (en) | 2009-01-16 | 2020-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| US11151953B2 (en) | 2009-01-16 | 2021-10-19 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| US11468857B2 (en) | 2009-01-16 | 2022-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| US11735133B2 (en) | 2009-01-16 | 2023-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| US12027133B2 (en) | 2009-01-16 | 2024-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4991775B2 (en) | 2012-08-01 |
| JP2009122695A (en) | 2009-06-04 |
| TW200305848A (en) | 2003-11-01 |
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