Ϊ291564 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種低溫測試使用效能佳，並大幅提升作業便 *性及降低成本之I c測試分類機之冷測裝置。 【先前技術】 現今科技不斷研發與創新下，以往必需由許多大型電子電 路^合找完紅X作已完如麵電路（integrated circuit 稱I C)所取代’由於I c在生產過程中乃經過多道的加工 ―序，因此，業者為確保產品品質，於〗C製作完成後，均會進 行電路測試作業，以檢測i C於製作過程中，是否遭受損壞，進 而檢測出不良品；由於部份_之丨C，於實際使用上，係處於 ，溫環境中，故為準確測試丨C，亦必須將〗〇置於低溫環境而 執行測試作業以淘汰出不良品； 睛參’ 1 11輯，係為執行健測試之〗c顺分麵， =有供料裝置11、移載裝2、冷測裝置工3及收料裝置 ii二該供料裝置11係設有至少—盛裝制1 c·^料盤，以供 置1 2之取放11將制1 c取^，該移餘置1 2係將待 測^移載至冷測裝以3處，該冷測裝置i3之測試座即對待 f⑽執行低溫測試，於測試完畢後’該移載裝置12之取放器 Ϊ ifi C移載至收料裝置14處，該收料裝置14係設有至 > 一^裝完測I C之料盤，以供收置完測J ς ; /請參閱第2_示’該職執行低溫職之冷測裝置i 3， 巧有「為封閉空間且具門體之冷測室i 3丄，該冷測室以管路 梭、供應器1 3 2，該冷源供應111 3 2用以供應氮氣， =„人於冷啦1 3 1中’使冷測室1 3 1形成一乾冷 3 „室1 3 i之内部财至少—壓接機構及測試座 ，、、中，该壓接機構係設有一可由驅動源驅動之下壓桿 $11‘^下$桿134之頭端設有下壓治具135，而下壓 〜3 5亦以&路連接冷源供應器丄3 2，該冷源供應器 1291564 13 2俾以將氮氣注入於下壓治具13 5中，而使下壓治具 13 5處於低溫狀態； 請參閱第3圖所示，該冷測裝置13之測試座13 3可供置 入待測IC，並以壓接機構之下壓桿13 4驅動下豪治異13 5 壓抵待測IC，令待測IC確實接觸測試座13 3之探針，由於 下壓治具13 5係呈低溫狀態，於壓抵待測1C時，卽可使符測 IC於下壓治具13 5之低溫傳導下進行測試作業:惟，談冷測 裝置13於使用上具有如下缺失： 1 ·該冷測室131係利用冷源供應器13 2供應氮氣，方可係 持在乾冷空間，而壓接機構之下壓治具13 5亦利用冷源供 應器13 2供應氮氣，而保持在低溫狀態，一旦當冷源供應 器13 2之氮氣耗盡，即必須停止低溫測試，爾等待操作人 員更換新的冷源供應器，方可再次執行低滋測試作業，造戒 冷測裝置之使用效能不佳及耗費作業時間之缺失。 2 ·由於冷源供應器13 2之使用時間有限，一般翁使用數小時 後’操作人員即必須更換新的冷源供應器，以致粍費使用成 本’若同時設置數組壓接機構，則冷蘇供應器之損耗吏快， 而更增加使用成本。 3 ·，於冷源供應器13 2之使用時間有限，一般於使用數小聘 後’操作人員即必須更換新的冷源供應蕤，但該冷源供應器 13 2係為一體積龐大之鋼瓶，以致更換作業上相當不使， 造成冷測裝置使用便利性不佳之缺失。 因此’如何提供一種使用效能佳，並提升作業便利性及大幅 降低成本之冷測裝置，即為業者研發之標的。 【發明内容】 访太日狄目的―，係提供—種1 c賴分賴之冷測裝置， = 置係於機台上設有一具門體之冷測室，該冷測室之内部 —峨座及麟麵，簡接麟財—_動源驅動 之下壓杯，並於下壓桿之下枝有至卜致冷晶片，該致冷晶片 1291564 =面職結下壓治具，俾錢下齡具保雜溫在低溫狀 I;，此’該測試座可供置入待測Ic，並以壓接機構之下壓治 抵待測/1 c，而使待測z c於下壓治具之低溫傳導下進行測 ϋ業，毋須不斷更換冷源供應器及停機，達到大幅提升低溫測 试使用效能之實用效益。 \ 本發明之目的二，該冷測裝置之壓接機構，俾以致冷晶片令 了壓續保持怪溫在低溫狀態，使下壓治具可不斷提供一低 溫測試環境，操作人員毋須不斷更換冷源供應器，達到大幅節省 成本之實用效益。 t發明之目的三，該冷測裝置之壓接機構，俾以致冷晶片令 下壓治具持續保持怪溫在低溫狀態，使下壓治具可不供 溫測試環境，操作人員毋須不斷更換冷源供應器，達到大幅提升 使用便利性之實用效益。 、查拔之，的四，該冷測裝置更包含於冷測室之頂面以管路 你門一ΐΐ乾燥機，以供注入乾燥空氣，而使冷測室形成一乾燥 =二$下壓治具與待測1 者之接觸面保持乾燥，以利 執订低Μ測試作業，進而更加提升使用便利性。 明之目的五，該冷赚4更包含於壓賊構之致冷晶片 熱，，該散熱結構係於—本體之流道兩端連接一 畔备t栈，々本體貼合於致冷晶片之散熱面，而可增加散埶 ，眘土?果’達到提升冷卻τ壓治具之使用效益。 、 【實施方式】 實施審查委員對本發明作更進—步之瞭解，兹舉一較佳 實把例並配合圖式，詳述如后： 2 0、月4、5圖所不’該1 C測試分賴包含有供料裝置 ^ ϋ 3〇、對位裝置4〇、冷測裝置5G及收料裝置 ϋ恭L料裝置2 Q係設有至少—絲待測iC之料盤2 1， 〇係設有二可作第—、二、三方向位移（如χ —γ —Ζ方向）之第—取放器3!及第二取放器3 2，用以移載待/ 1291564 ’―設於供料裝置2⑽方之對錄置·，係設有-Ρ之承座4 1供承置待測I C，俾以導引待測I C位於承 ^ 1之中心位置’而可使賴裝置3 0之第一取放器3 1對位 /艰座41之中心時，相對地，亦對位於待測Ic之中心，而可 吸=於待測〗c之中心位置，以便準確移餅測〗c至預役位置 門一設於供料裝置2 〇後方之冷測裝置5 0，係具有一呈封閉空 士51，該冷測室51之前面係設有一由驅動源511 三方向位移之門體512 ’而頂面以管路連接-空氣乾 :、、b 2 ’並於内部設有至少一測試座5 3及壓接機構，其申， 該壓接機構係設有一由驅動源驅動之下壓捍54,並於下^椁 5 4之下方設有浮動頭5 5及致冷晶片5 6，該致冷晶片5 ^係 具有一放熱端之散熱面及吸熱端之冷卻面，其中，散熱面係連結 一散熱結構，該散熱結構係設有一内具流道5 71及感測考、" ^ 2之本體5 7，其流道5 7 i之兩端分別設有冷If 口 5 7 3及冷源輸出口 5 7 4，並令冷源輸入口 5 7 3及冷源輸出 口 5 7 4以管路連接一冷源機，該冷源機可為一冷卻水循環^ 5 8，俾以供應冷卻水於本體5 7之流道5 7 i中循環流動，而 可輔助致冷晶片5 6散熱，而致冷晶片5 6之冷卻面則連钟一具 感測器5 91之下壓治具59，俾以利用致冷晶片5 6使^壓^ 具5 9保持恆溫在低溫狀態（如一 4 5度低溫），一設於供料穿 2 0側方之收料裝置6 〇，係依測試結果而分類設有數個用以盛 裝完測IC之料盤’各料盤可概分為用以盛裝良品之第一料盤 61，及用以盛裝不同等級之不良品的第二、三料盤6 2、6 3 . 請參閱第4、6圖所示，於執行I c低溫測試作業時，誃 測裝置5 0可利用空氣乾燥機5 2經管路將乾燥空氣注入於= 室5 1中，使冷測室5 1形成一乾燥空間，以利執行 而後可控制冷測室51之驅動源511驅動門體512作第 向位移，而開啟冷測室51，以供預先於測試座5 3内置入^測 1291564 IC，再控制門體512反向位移以關閉冷測室5 i，彳免冷測室 51形成一封閉乾燥空間； 請參閱第4、7圖所示，當測試座5 3置入待測Ί (：後，該 壓接機構係以驅動源驅動下壓桿5 4作第三方向位移，而使下塵 治具5 9壓抵制I C，令待測ί c確實與測試座53之探卿 接觸，由於致冷晶片5 6之冷卻面係接觸於下壓治具5 9，而可 使下壓治具5 9保持恆溫在一4 5度低溫狀態，當下壓治直5 9 壓抵待測IC時，即可使待測〗c受下壓治具5 9之低&導而 處於低溫環境中，並糊下壓治具5 9之感· 5 9 !感測待測 I C之溫度，再將感測訊息回授至控制器（圖未示出），以確保 待測I C處於預設之低溫環境中，進而測試座5 3即可對待測 I C執行低溫測試作業，又由於致冷晶片5 6之冷卻面係會將吸 收之熱能料至餘面，該散編即可_義於本體5 7流道 ^ 71内之冷卻水作一冷熱交換，以辅助散熱，並利用感測器 5 7 2感測水溫，且將感測訊息回授至控制器（圖未示出），以 ，控，冷财之水溫，猶升溫之冷卻賴棘體5 7之冷雜 接口 * I 4細於冷卻水循環機5 8，經冷卻水循環機5 8降溫 循_=7之冷稀人口5 7 3流人於流道5 71中以供 該銘ϊΐ閱第8圖所示，當冷測裝置5 Q執行低溫職作業時， ΐίΐΐί3Ό可驅動第—取放器31作第—、二方向位移至供 移而崎===第一取放器31作第三方向位 过炎Ζ ί中待取出’以便移載至對位裝置4 〇處； 非位二m，由於1 c置入於料盤21之承槽時，並Ϊ 291564 IX. Description of the Invention: [Technical Field of the Invention] The present invention provides a cold measuring device for an Ic test sorting machine which is excellent in low-temperature test performance and which greatly improves workability and cost. [Prior Art] Nowadays, with the continuous development and innovation of technology, it has to be replaced by many large electronic circuits to find the red X as the integrated circuit (IC). Because I c is in the production process. The processing of the road is ordered. Therefore, in order to ensure the quality of the products, after the completion of the production, the circuit test operation will be carried out to detect whether the i C is damaged during the production process, and then the defective products are detected; _ 丨C, in actual use, is in a warm environment, so in order to accurately test 丨C, it is also necessary to put the 〇 〇 in a low temperature environment and perform test operations to eliminate defective products; 参参' 1 11 series, It is the c-segment surface for performing the health test, = the feeding device 11, the transfer device 2, the cold measuring device 3, and the receiving device ii. The feeding device 11 is provided with at least a packaging system 1 c· ^Tray, for the 1 2 pick and place 11 will be 1 c take ^, the shifting 1 2 is the test to be transferred to the cold test to 3, the test stand of the cold test device i3 Perform a low temperature test on f(10), and after the test is completed, 'the pick and place device of the transfer device 12Ϊ The ifi C is transferred to the receiving device 14, and the receiving device 14 is provided with a tray for loading and testing the IC for the completion of the measurement J ς; / please refer to the second _ Performing the cold test device i 3 of the low temperature service, there is a "cooling room i 3丄 for the enclosed space and the door body, the cold test room is a pipe shuttle, the supply 1 32, the cold source supply 111 3 2 is used to supply nitrogen, = „人在冷啦1 3 1 ', so that the cold test chamber 1 3 1 forms a dry cold 3 „room 1 3 i internal wealth at least — crimping mechanism and test seat,,,, The crimping mechanism is provided with a pressing rod which can be driven by the driving source, and the lower end of the rod 134 is provided with a pressing fixture 135, and the pressing pressure is 3-5, and the cold source supplier is connected with the & 2, the cold source supply 1291564 13 2俾 to inject nitrogen into the lower pressing fixture 13 5, so that the lower pressing fixture 13 5 is in a low temperature state; see Figure 3, the cold measuring device 13 The test socket 13 3 can be placed in the IC to be tested, and is driven by the pressing rod 13 4 under the pressure-bonding mechanism to press the IC to be tested, so that the IC to be tested does contact the probe of the test seat 13 3 . Due to the lower pressure fixture, the 13 5 series is low temperature State, when pressed against the 1C to be tested, 卽 can make the test IC perform the test operation under the low temperature conduction of the lower pressure fixture 13 5: However, the cold test device 13 has the following defects in use: 1 · The cold test The chamber 131 is supplied with nitrogen by the cold source supplier 13 2 to be held in the dry cooling space, and the pressing fixture 13 5 is also supplied with nitrogen by the cold source supply 13 2 while maintaining the low temperature state. When the nitrogen supply of the cold source supply 13 2 is exhausted, the low temperature test must be stopped, and the operator is required to replace the new cold source supply before the low-test test operation can be performed again, and the use of the cold test device is poor. The lack of operating time is missing. 2 · Due to the limited use time of the cold source supply 13 2, after the use of the general Weng for several hours, the operator must replace the new cold source supply, so that the cost of use is reduced. If the array crimping mechanism is set at the same time, the cold The loss of the supply is fast, and the cost of use is increased. 3 · The use of the cold source supply 13 2 is limited, generally after the use of a small number of 'operators must replace the new cold source supply, but the cold source supply 13 2 is a large cylinder As a result, the replacement work is quite unsatisfactory, resulting in the lack of convenience of the use of the cold test device. Therefore, how to provide a cold-testing device that is highly efficient in use, improves the convenience of operation, and greatly reduces the cost is the standard developed by the industry. [Summary of the Invention] Visiting Tairi Di's purpose is to provide a cold measuring device with 1 c lyrics, = a cold measuring room with a door on the machine, the inside of the cold measuring room - 峨Block and lining, simply connected to Lincai-_the driving force under the pressure cup, and under the lower pressure bar, there is a cooling chip, the cold wafer 1291564 = face job under the pressure fixture, save money The age of the tool is kept at a low temperature. I, the test stand can be placed in the Ic to be tested, and pressed under the crimping mechanism to reach the test/1c, so that the zc to be tested is pressed down. In the test industry under low temperature conduction, it is not necessary to continuously replace the cold source supply and stop the machine, so as to achieve the practical benefit of greatly improving the performance of the low temperature test. The object of the invention is that the crimping mechanism of the cold measuring device causes the cold chip to keep the strange temperature at a low temperature, so that the pressing tool can continuously provide a low temperature test environment, and the operator does not need to continuously replace the cold. Source supply to achieve significant cost savings. The purpose of the invention is that the crimping mechanism of the cold measuring device causes the cold pressing die to keep the temperature of the pressing device at a low temperature, so that the pressing device can not be used for the temperature test environment, and the operator does not need to continuously replace the cold source. The supplier achieves the practical benefits of greatly improving the convenience of use. Fourth, the cold test device is included in the top surface of the cold test chamber to pipe your door to a dryer for injecting dry air, so that the cold test chamber forms a dry = two $ press The contact surface of the fixture and the one to be tested is kept dry, so as to facilitate the low-lying test operation, thereby further improving the convenience of use. The purpose of the fifth is that the cold earning 4 is further included in the cold chip heat of the thief structure, and the heat dissipating structure is connected to the two sides of the flow channel of the main body to prepare a stack, and the body of the crucible is attached to the heat dissipation of the cold chip. Face, but can increase the divergence, careful soil? Fruit 'to achieve the benefits of cooling the pressure gauge. [Embodiment] The implementation review committee will make a more in-depth understanding of the present invention. Let's take a better example and cooperate with the diagram. The details are as follows: 2 0, 4, 5, and 5 are not the 1 C The test includes a feeding device ^ ϋ 3 〇, a aligning device 4 〇, a cold measuring device 5G, and a receiving device ϋ L L material device 2 Q system is provided with at least a wire to be tested iC tray 2 1, 〇 It is provided with a first pick-and-placer 3! and a second pick-and-placer 3 2 for shifting in the first, second and third directions (for example, χ-γ-Ζ direction) for transferring/to be 1291564' In the feeding device 2 (10), the pair is placed, and the socket 4 1 is provided for the IC to be tested, and the IC to be tested is located at the center position of the bearing 1 to make the device 3 0 of the first pick-and-placer 3 1 alignment / the center of the hard 41, relatively, also located at the center of the Ic to be tested, and can be sucked = at the center of the test to be tested, in order to accurately transfer the cake test c to the pre-service position door, the cold measuring device 50 disposed behind the feeding device 2, has a closed air shovel 51, and the cold measuring chamber 51 is provided with a door displaced by the driving source 511 in three directions. Body 512 'and top The surface is connected by a pipe-air drying:, b 2 ', and at least one test seat 53 and a crimping mechanism are disposed inside, and the crimping mechanism is provided with a pressing device 54 driven by a driving source. A floating head 5 5 and a cooling fin 5 6 are disposed under the lower surface 5 4 , and the cooling fin 5 5 has a cooling surface of the heat releasing end and a cooling surface of the heat absorption end, wherein the heat dissipating surface is coupled to the cooling surface a heat dissipation structure, the heat dissipation structure is provided with a flow path 5 71 and a sensing test, &2; The output port is 5 7 4, and the cold source input port 5 7 3 and the cold source output port 5 7 4 are connected to a cold source machine by a pipeline, and the cold source machine can be a cooling water circuit to supply cooling water. Circulating flow in the flow channel 5 7 i of the body 57, and assisting the cooling of the cooling chip 56, while the cooling surface of the cooling chip 56 is connected to the pressing device 59 under the sensor 5 91.俾Using the refrigerating wafer 56 to keep the thermostat 5 9 at a low temperature (such as a low temperature of 45 degrees), and a receiving device 6 设 disposed on the side of the feeding through the 20 side, according to the test result Minute There are several trays for holding the ICs. The trays can be divided into a first tray 61 for containing good products and a second tray 3 for containing different grades of defective products. 6 3. Please refer to Figures 4 and 6. When performing the I c low temperature test operation, the test device 50 can use the air dryer 52 to inject dry air into the chamber 5 1 through the pipeline to make the cold test. The chamber 51 forms a dry space for performing and then controls the driving source 511 of the cold measuring chamber 51 to drive the door body 512 for the first displacement, and opens the cold measuring chamber 51 for pre-injection into the test seat 53. 1291564 IC, and then control the reverse displacement of the door body 512 to close the cold test chamber 5 i, and the cold test chamber 51 is formed to form a closed dry space; please refer to the figures 4 and 7 when the test stand 5 3 is placed in the test. Ί (: After the crimping mechanism is driven by the driving source, the lower pressing rod 5 4 is displaced in the third direction, and the dusting fixture is pressed against the IC, so that the test piece is indeed tested with the test seat 53 In contact, since the cooling surface of the cooling wafer 56 is in contact with the pressing fixture 5 9, the lower pressing fixture 59 can be kept at a constant temperature of 45 degrees. When the pressure is pressed against the IC to be tested, the test can be tested to be lower than the lower pressure of the fixture, and it is in a low temperature environment, and the pressure is lowered. 9 ! Sensing the temperature of the IC to be tested, and then feeding back the sensing information to the controller (not shown) to ensure that the IC to be tested is in the preset low temperature environment, and then the test socket 5 can be tested IC Performing the low temperature test operation, and because the cooling surface of the cooling wafer 56 will absorb the absorbed thermal energy to the remaining surface, the bulking can be exchanged for cooling and cooling in the cooling water in the main body 57 7 channel 71. To assist the heat dissipation, and use the sensor 572 to sense the water temperature, and feedback the sensing information to the controller (not shown), to control, the temperature of the cold water, and the cooling of the cooling Body 5 7 cold interface * I 4 is finer than the cooling water circulation machine 5 8, through the cooling water circulation machine 5 8 cooling _ = 7 cold and thin population 5 7 3 flow in the flow channel 5 71 for the reading As shown in Fig. 8, when the cold measuring device 5 Q performs a low temperature job, the 取ίΐΐί3 Ό can drive the first pick-and-placer 31 to perform the first- and second-direction displacements to the shifting position and the bottom=== the first pick-and-placer 31 The third direction is in the vicinity of the Ζ ί 以便 to be transferred to the alignment device 4 ;; non-position two m, since 1 c is placed in the groove of the tray 21, and
取放器3 1可先將待測1 C放置於對位裝置J 之承座4 1内’林座4 i導引待測〗c滑置 H 1291564 測IC與承座41二者之中心相對位，而後第一取放器31再對 位於承座41之中心，即可吸附於待測IC之中心位置，以便準 確將待測I C置入於冷測裝置5 〇之測試座5 3中； 請參閱第10、11圖所示，當冷測裝置5 〇之測試座5 3 執行低溫測試作業完畢後，該冷測室51可開啟門體512，供 移載裝置3 0之第一取放器31及第二取放器3 2進入於内，該 第二取放器3 2即可將測試座5 3内之完測IC取出，並令第一 取放器31將待測IC置入於測試座5 3内以供測試；The pick-and-placer 3 1 can first place the 1 C to be tested in the socket 4 1 of the aligning device J. 'The pedestal 4 i guides the test to be tested 〗 c slid H 1291564 The center of the test IC and the socket 41 are opposite Position, and then the first pick-and-place device 31 is located at the center of the socket 41, and can be adsorbed to the center of the IC to be tested, so as to accurately place the IC to be tested into the test seat 53 of the cold measuring device 5; Referring to Figures 10 and 11, after the cold test device 5 is tested and the low temperature test operation is completed, the cold test chamber 51 can open the door body 512 for the first pick and place of the transfer device 30. The device 31 and the second pick-and-place device 32 are inserted therein, and the second pick-and-place device 3 2 can take out the test IC in the test socket 5 3 and let the first pick-and-place device 31 insert the IC to be tested. Tested in test stand 5 3 for testing;
^請參閱第11、12圖所示，該第一取放器31及第二取放 器22再退出冷測室51，該冷測室51即關閉門體512，而 使室内形成-封社間，以供戦座5 3再次執行低溫測試作業 ，此時，該移載裝置3 〇之第二取放器3 £係位移至收料裝置 6 0處，並依測試結果狀完測！ c，如完測j c為良品，則放 料盤6 1 ’若為不良品，則放置於第二料盤6 2或第三 枓盤6 3，以便收置Ic。 个㈣以、蝶置可_致冷日日日肢 =在低溫狀態’以大幅提升低溫職制效能，且=更1 冷源供^，而可增加作業便雛及降減本。、、，ι更換 【圖式簡單說明】 第2圖 第3圖 第4圖 第5圖 第6圖 第7圖 第1圖· ’I式I (：測試分類機之各裝置示意圖。 習式冷測裝置之示意圖。 f式冷測裝置執行低溫測試之使騎意圖。 f發明IC测試分類機之各裝置示意圖。 本發明冷測裝置之示意圖。 t發明冷測裝置之測試座供置 本發明冷測裝置之钏^之不意圖。 第8圖：本發明移健之示意圖。 =··本發明移载C之示意圖。 第10圖：本發明移载裝置之第二取放器取出完示J圖。 又不意圖。 1291564 第1 1圖：本發明移載裝置之第一取放器置入待測I c之示意圖。 第12圖：本發明移載裝置將完測I c移載至收料裝置處收置之 示意圖。 【主要元件符號說明】 〔習式〕 供料裝置：11 冷測裝置：1 3 冷源供應器：13 2 下壓桿：1 3 4 收料裝置：1 4 〔本發明〕 供料裝置：2 0 移載裝置：3 0 第二取放器：3 2 對位裝置：4 0 冷測裝置：5 0 驅動源：511 空氣乾燥機：5 2 下壓桿：5 4 致冷晶片：5 6 流道：5 7 1 冷源輸入口 ： 5 7 3 冷卻水循環機：5 8 感測器：5 91 第一料盤6 1 第三料盤：6 3 移載裝置：12 冷測室：131 測試座：13 3 下壓治具：13 5 料盤：2 1 第一取放器：31 承座：4 1 冷測室：51 門體：512 測試座：5 3 浮動頭：5 5 本體：5 7 感測器：5 7 2 冷源輸出口 ： 5 7 4 下壓治具：5 9 收料裝置：6 0 第二料盤：6 2^ Please refer to the figures 11 and 12, the first pick-and-placer 31 and the second pick-and-placer 22 are then exited from the cold test chamber 51, and the cold test chamber 51 closes the door body 512, so that the interior is formed. In the meantime, the low temperature test operation is performed again by the squatting seat 5 3 . At this time, the second pick-and-place device 3 of the transfer device 3 is displaced to the receiving device 60, and is completed according to the test result! c. If the test j c is a good product, if the discharge tray 6 1 ' is a defective product, it is placed on the second tray 6 2 or the third tray 6 3 to collect Ic. (4), butterfly can be _ cold day and day limb = in the low temperature state to significantly improve the low temperature performance, and = 1 more cold source for ^, and can increase the operation of the chicks and reduce the cost. ,,, ι Replacement [Simple description of the drawing] Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 1 'I type I (: schematic diagram of each device Schematic diagram of the measuring device f-type cold measuring device performs the low-temperature test to make the riding intention. f Invented the schematic diagram of each device of the IC test sorting machine. The schematic diagram of the cold measuring device of the present invention. The cold test device is not intended. Figure 8: Schematic diagram of the transfer of the present invention. The schematic diagram of the transfer of the present invention C. Figure 10: The second pick and place device of the transfer device of the present invention is taken out Figure 9 is a schematic view of the first pick-and-place device of the transfer device of the present invention placed in the I c to be tested. Figure 12: The transfer device of the present invention transfers the completed I c to Schematic diagram of the collection at the receiving device. [Main component symbol description] [Learning] Feeding device: 11 Cold measuring device: 1 3 Cold source supply: 13 2 Lower pressure bar: 1 3 4 Receiving device: 1 4 [Invention] Feeding device: 2 0 Transfer device: 3 0 Second pick and place device: 3 2 Registration device: 4 0 Cold measurement :5 0 Drive source: 511 Air dryer: 5 2 Lower lever: 5 4 Cooling wafer: 5 6 Flow path: 5 7 1 Cool source input: 5 7 3 Cooling water circulation machine: 5 8 Sensor: 5 91 First tray 6 1 Third tray: 6 3 Transfer device: 12 Cold chamber: 131 Test socket: 13 3 Pressing fixture: 13 5 Tray: 2 1 First pick-and-place: 31 Seat :4 1 Cold room: 51 Door: 512 Test stand: 5 3 Floating head: 5 5 Body: 5 7 Sensor: 5 7 2 Cool source outlet: 5 7 4 Pressing fixture: 5 9 Receiving Device: 6 0 Second tray: 6 2