TWI290429B - Method for inspecting laser marks on IC packages - Google Patents

Abstract

A method for inspecting laser marks on integrated circuit packages is disclosed. One of the steps is to photograph laser mark(s) on at least an IC package. The image including the laser mark can be transform into a plurality of characters by optical character recognition (OCR), then compared with characters of standard laser mark. The method solves manual miscarriage by conventional visual inspection. On another aspect, coordinate value of a registration point can be found out from the image including the laser mark, and then will be confirmed if it is ranged within acceptance region of standard registration point or not. Accordingly the location correctness of the laser mark can be distinguished rapidly.

Description

1290429 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for detecting a type of circuit package on an integrated circuit package, and the special purpose is related to the laser marking of the dragon circuit seal 2 A method of automatic detection and statistics. [Prior Art] After the package protection, the conventional integrated circuit product is printed with a laser mark on the surface of one of the packages to indicate the lot number and the product name. However, there may be character errors and positional shifts in the laser markings, such as human factors: data input errors or excessive alignment errors caused by the old system. The method of detecting the laser marking on the integrated circuit package is to manually read the characters of the laser marking twice, even if there is an error, and the effect table is presented. In addition, in order to prevent the positional deviation of the laser marking from being undetectable, the current detection method is to manually measure the stamping position using the microscope, and adjust and measure the time after the origin adjustment. About 10 minutes, quite time consuming. And different measurement personnel have different measurement results, and the reproducibility is not good. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for detecting a laser marking on an integrated circuit package, which is to capture at least one laser marking of an integrated circuit package to be tested, and The image of the laser marking is converted into a character by optical character recognition (OCR), and then compared with the character of the standard laser marking, and the human error caused by the visual comparison is solved. . 1290429 The second aspect of the present invention is to provide a method for detecting a laser marking on an integrated circuit package. Each laser marking system includes an positioning point, and the positioning point can be found by the image of the laser marking. The coordinate value is confirmed by a detection program whether it is within the tolerance of the standard positioning point (4) to quickly determine the correctness of the position of the laser marking.

The method for detecting a laser marking on an integrated circuit package according to the present invention comprises the steps of: establishing a standard laser marking file with a plurality of standard characters; carrying the file to the detection a program, the detection program S has an optical sub-component identification system; the image captures at least one laser marking to be tested of the integrated circuit package to be tested; and the laser marking is detected by the optical character identification method The image is converted into a plurality of first characters and compared with the standard characters. [Embodiment] In an embodiment of the present invention, as shown in FIG. 1, a method for detecting a laser marking on an integrated circuit package mainly includes "building".

Set up a standard laser marking file" Step 1, "Load this file to a detection rank" Step 2, "Image capture on the test circuit package to be tested" Step 3 , "Converting the image of the laser to be detected into a character by optical character recognition, and performing character matching" Step 4, "Confirming the coordinate value of the positioning point of the laser marking to be tested" 5. Step 6 of “Statistical Analysis of the Detection Results of the Laser Marks to Be Measured on the Whole Batch of Packages to Be Measured”.

First, in step 1, a file of various types of integrated circuit and assembly laser markings (not shown) is built in a database, which can be turned on by a VI 8 1290429 detection program. In addition, referring to Fig. 2, the VI detection program is installed in a window operating system, and its illustration is represented by the figure number 1〇〇. Generally, the vi detection program 100 includes an optical character recognition (〇CR) system, wherein the optical character recognition system includes a CCD camera and an identification service software (not shown). After clicking and executing the VI test program, the main face is shown in Figure 3. Please refer to Fig. 4. The main screen of the vi detection program has a “Tools” button 101. After pressing, you can select the working mode. Tick the “'Operator” field and enter the correct password. Performing the front-end inspection of the laser marking. The VI detection program 1 further includes a Barcode System to connect to the database, and can bring out the batch number of the integrated circuit package to be tested. Basic information. , the VI detection program

After that, please refer to Fig. 5. In step 2, there is a “Load” button 1 in the main screen. In 1290429 TAIWAN 0417A9K2N-5B", it is different from "DD2508AMTA TAIWAN 0417A9K2N-6B" shown in the laser marking 211 of Fig. 6, but it may be the same. At the same time of downloading, in the allowable range XY axis upper and lower limit value display area 115, the X-axis upper limit value and the X-axis lower limit value of the standard positioning point 212 are displayed in the "X-Offset" field, respectively, and The Y-Offset" display shows the Y-axis upper limit and the Y-axis lower limit of the standard set point 212. In this embodiment, the upper limit of the X axis is 2.100, the lower limit of the X axis is 1.500, the upper limit of the Y axis is 2.100, and the lower limit of the Y axis is 1.500. At the beginning of the inspection operation, please refer to Figure 7, where an appropriate production machine number can be selected in a selection field 104. After that, the integrated circuit package to be tested is placed in a buffer (which can be called a buffer or a kit), and as shown in FIG. 8, in the main screen of the VI detection program 100, a batch of number display area is selected. 105 and the batch number can be read by the computer barcode system, and the basic data of the batch number (ie, the standard character of the standard laser mark DD2508AMTA TAIWAN 0417A9K2N-5B") can be automatically brought out and displayed in a standard character display. Area 106. Alternatively, when the computer barcode system cannot be used, does not exist, or the VI detection program 100 is not connected to the computer barcode system, you can manually key-in the standard character of the standard laser mark and press "Enter" ”, that is, the standard character can be input to the VI detection program 100. In the third step of performing the above-mentioned “image capture of the laser mark to be tested on the integrated circuit package to be tested”, please refer to FIG. 9 first. In the main screen of the VI detection program 100, the "RunLive" button 107 is selected to dynamically capture the image (Live screen), and a first integrated circuit package 220 1290429 j is taken in the frame. Image capture, after the image capture is completed, it will be checked

The Llve button 107 is cancelled. At this time, a first laser marking 221 to be tested is formed on the first electrical component to be tested 220, and preferably, the first laser marking 221 to be tested should include a plurality of laser markings 221 The first character and a first to-be-determined site 222. After step 4 of the optical character recognition and comparison, please refer to the figure. Pressing the main surface of the Hai VI detection program 100, 0CR, and button 08 as shown in Fig. 10, the secondary image of the optical character recognition system is turned on, and the image of the first-to-be-measured laser marking 221 is Automatic character recognition. When the character recognition is completed, the character recognition display window 109 in the secondary screen displays the identification knot|, that is, the image of the first to-be-detected laser target 221 is converted into a plurality of first characters. In this embodiment, the first characters are "DD2508AMTATAIWAN0417A9K2N-5B". Then, by pressing an "OCR Close" button 110, the secondary screen of the optical character recognition system can be exited and returned to the main screen of the VI detection program. After that, referring to FIG. 11, in the main screen of the VI detection program, a character display area 111 to be tested displays the first characters after the character recognition operation, and The standard characters of the standard laser mark on the standard character display area 1〇6 are compared by a character. As shown in Fig. 12, the detection result of the character recognition is displayed in the character recognition result display area 112 in the main surface of the VI detection program, where "0CR Pass," indicates the first laser to be detected. The first character to be tested of the label 221 is the same as the standard character of the standard laser mark, so it is detected by the word comparison. Conversely, if displayed, 〇CRFaii" indicates that there is an error character. After 1290429, step 5 of confirming the coordinates of the anchor point can be performed. As shown in Figure 12, in the main screen of the VI detection program, click FmdEageCenter ’, button 113, then “Mark〇ffsetX”

And the "Mark ffsetY" block is shown in the following - the measured - χ 座 coordinate value and a γ axis coordinate value respectively represent the first to-be-measured site 222 to the first to-be-tested integrated circuit package 220 The distance between the edges of the x-axis and the distance between the first to-be-determined site 222 and the γ-axis edge of the first-to-be-tested integrated circuit package 22〇. In this embodiment, in "Mark〇ffsetx,, the measured value is 1.771, and the measured value of "Mark0ffsetY," is 丨882, which falls on the X-axis upper and lower limits of the target m point 212 (2.1004. 500) and the γ-axis upper and lower limit value ακκχ·), that is, the first detected laser marking 221 line including the first to-be-measured site 222 is correctly formed on the first to-be-tested integrated circuit. On the package 220.

Referring again to Fig. 12, the final detection result of the character recognition and the positioning point confirmation is displayed on a screen which is located in one of the final detection result display areas 116 in the main picture of the νι detection program. Wherein "PASS" indicates that the first-to-be-tested laser mark 221 is formed on the first integrated circuit package 22b to be tested with the correct character and without offset. The display color can be green, and the result can be easily identified by color. Repeat steps 3 to 5 above to continuously detect a plurality of integrated circuit packages to be tested. Referring to FIG. 13, detecting a second to-be-detected laser mark 231 on a second in-process integrated circuit to seal the element 230. The second to-be-tested & 231 may include a second Site 232 to be determined. In the step q, 'check the "RunLive" button 1〇7, the second to-be- 8 10 Γ 290429. The integrated circuit package 230 includes the image of the second to-be-detected laser mark 231 displayed in the VI detection program. In the main screen of 100; then in step 4, the second character of the second laser mark 231 to be tested is identified by the optical character and is displayed as "DD2508AMTATAIWAN0417A9K2N-6B" and displayed in the character display area 110, different The standard character of the standard laser mark is displayed, and "OCR Fail" is displayed in the character recognition result display area 112. Then, in step 5, in the positioning point XY-axis coordinate value display area 114, the X-axis coordinate value of the second to-be-determined site 232 is 2.040, which is displayed in the "MarkOffsetX" field, the second waiting The Y-axis coordinate value of the measurement site 232 is 2.054, which is displayed in the "MarkOffsetY" field, and both are within the acceptable range. Therefore, "Mark Fail" is displayed in the final detection result display area 116, indicating the second The laser mark 231 to be tested has an error character but the position is not offset. Further, when detecting the third laser mark 241 to be tested which is one of the third integrated circuit package packages 240 to be tested, the above steps 3 to 5 are also performed. Referring to Figure 14, the third laser marking 241 to be tested may include a third location to be determined 242. In step 3, the image system of the third to-be-tested integrated circuit package 240 including the third to-be-detected laser mark 241 is displayed in the main screen of the VI detection program 100; then in step 4, the first The three laser markings to be detected 231 are converted into a plurality of third characters by the optical character recognition and are "DD2508AMTA TAIWAN 0417A9K2N-5B", which is displayed in the character display area 110, and the standard laser marking The standard characters are the same, so "0CR Pass" is displayed in the character recognition result display area 112. Then, in step 5, in the positioning point XY axis coordinate value display area 114, 11 Γ 290429, the third axis to be measured 242 has an X-axis coordinate value of 2.160, which is displayed in the "MarkOffsetX" field, exceeding The allowable range XY axis upper and lower limit display area 115 has a 2.100 X axis upper limit value (in the X_Offset field Max); the third to-be-determined position 242 has a Y-axis coordinate value of 1.879, which is displayed in the "MarkOffsetY" column. The bit is within the qualified range. Therefore, "Tx/Ty Fail" is displayed in the final detection result display area 116, indicating that the third to-be-detected laser mark 241 has no error character but the position is shifted. Equivalent Measurement One of the fourth to-be-tested integrated circuit package 250 is a fourth to be tested > When the laser marking 251 is performed, the above steps 3 to 5 are also performed. Referring to Figure 15, the fourth laser marking 251 to be tested may include a fourth location to be determined 252. In step 3, the image system of the fourth to-be-tested integrated circuit package 250 including the fourth to-be-detected laser mark 251 is displayed in the main screen of the VI detection program 100; then in step 4, the first The four laser markings to be detected 251 are converted into a plurality of fourth characters by the optical character recognition and are "DD2508AMTA TAIWAN 0417A9K2N-6B", which is displayed in the _ character display area 110, and the standard laser marking The standard characters are not the same, so "0CR Fail" is displayed in the character recognition result display area 112. Then, in step 5, in the positioning point XY-axis coordinate value display area 114, the X-axis coordinate value of the fourth to-be-determined site 252 is 2.438, which is displayed in the "MarkOffsetX" field, exceeding the tolerance. The range of the XY axis upper and lower limit display area 115 is 2·100 X axis upper limit value; the fourth axis to be measured 252 has a Y axis coordinate value of 2.054, which is displayed in the “MarkOffsetY” field, which is in the qualified range. Therefore, "Fail" is displayed in the final detection result display area 116, indicating that the fourth to-be-detected laser mark 251 has the error word 12 1290429 and the position is shifted. Finally, after the laser marking on the entire batch of integrated circuit packages is detected, the above step 6 is performed. Referring to FIG. 16, in the main screen of the detection program _, press - "0CRClear,, 117, to clear the data", for example, delete the batch number display area (10), the standard character display area 106, and the anchor point. The XY axis coordinate value displays the character or value in the area 114. At the same time, as shown in the figure η, statistics and analysis can be used to obtain the whole batch of integrated electricity: the total number of measurements of the package after laser marking, good product Quantity, number of defective products, yield rate, and time spent on testing, etc. The protection of the righteousness (4) is subject to the definition of the attached material (4). Anyone who is familiar with the technology (4) J does not deviate from the spirit of the present invention. Any changes and modifications made in the surroundings are the protection of the present invention. [Simplified description of the drawings] Fig. 1 2nd 3rd, 4th, 4th, 5th, according to an embodiment of the present invention, an integrated body A flow chart of a method for detecting a laser mark on a circuit or a package. According to the present invention, a diagram of a test program is a schematic diagram of a face view of a work window. A body is green and green. (4) Schematic diagram of the screen after the start of the test flight. According to the present invention, a schematic diagram of the login surface is provided. | According to one of the present inventions, a scheme is applied, and a shot is loaded. The picture of the 荦 雷 雷 由 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 Laser Marking Diagram According to a specific embodiment of the present invention, a schematic diagram of the screen at the time of:: ^. Number 8 of the production machine. According to an embodiment of the present invention, the batch number and basic of the road package are displayed. The data of the data is not stored in the ninth figure: according to a specific embodiment of the present invention; the second is to take a picture of the circuit package of the test object to be measured / take a first 10th figure · according to one of the specific Embodiments, a schematic diagram of a first laser to be measured on the integrated circuit package of the diagnostics:: optical optical character recognition. 仃11.. according to an embodiment of the present invention, displayed in optical A schematic diagram of the character after the word is recognized Figure 12 is a schematic view showing the coordinate value of the positioning point to be confirmed and displaying the determination result according to an embodiment of the present invention. A screen diagram showing the determination result of a second laser mark to be tested. FIG. 14 is a schematic diagram showing the determination result of a third laser mark to be tested according to an embodiment of the present invention. Figure 15 is a schematic diagram showing the determination result of a fourth laser mark to be tested according to an embodiment of the present invention. Figure 16: A batch of mines to be tested according to an embodiment of the present invention A schematic diagram of the clearing of the data after the marking is detected. 14 8

1290429 Fig. 17 is a schematic diagram showing the statistical and analytical values of the entire batch of laser markings to be tested in accordance with one of the present inventions. [Description of main component symbols] 1Create a standard laser marking file 2 Load the file into a detection program 3 Image capture in the integrated circuit package 4 to be tested by the optical sub-component identification method Yuan' and carry on the character comparison, the image of the laser marking mark is converted into 5, confirm the positioning point of the laser marking to be tested, and analyze and analyze the detection result of the whole batch of circuit printed circuit The icon of the laser to be tested on the coordinate value package 100 VI detection program 101 "Tools" button 102 "Load" button 103 file name display area 105 batch number display area 104 select 襕 106 standard character display area 1 〇 7 "RunLive" button 108 "OCR," New 109 sub-ID recognition display window 110 "OCR Close" button 111 to be tested character display area 112 character recognition result display area 113 "FindEageCenter" button 114 positioning point XY axis coordinate value display Zone 115 allowable range XY axis upper and lower limit value display area 116 Final detection result display area 117 "OCRClear" button 15 1290429 210 Standard integrated circuit package 211 Laser mark 212 Standard position 220 First test integrated circuit package 221 First waiting Laser marking 222 first to be determined position 230 second to be tested integrated circuit package 231 second to be tested laser marking 232 second to be determined position 240 third to be measured integrated circuit package 241 Three to be tested laser marking 242 third to be determined position 250 fourth to be measured integrated circuit package 251 fourth to be detected laser marking 252 fourth to be determined

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Claims (1)

1290429 #»月15曰修(^) is replacing page ten. Patent application scope: ^ A--1 . Bu-type detection method for laser marking on integrated circuit package, including: . Standard laser marking, which includes a plurality of standard characters; .. 4 people; ^ quasi-character to - detection process ^, the detection program contains - optical character recognition (0ptical Character Recogniti〇n, • 〇CR) system's system includes - CCD camera and a recognition 'software; Lu image captures the laser mark to be tested on at least one integrated circuit package; and T is identified by optical word recognition The image of the laser mark to be tested converts a plurality of characters to be tested, and performs character matching with the standard characters; wherein the detection program further comprises a computer bar code system (Buade System) to link to A database, which can bring out the batch number basic data of the integrated circuit package to be tested. 2 The method for detecting a lightning mark on an integrated circuit package as described in claim 1 of the patent application scope, wherein the result of the above character comparison is displayed on a screen. 3. The method for detecting a laser marking on an integrated circuit package as described in the scope of the patent application, wherein the standard laser marking system comprises a standard positioning point, and the laser marking to be tested The printing system comprises a site to be determined, and the detecting method further comprises: confirming whether the seatpost value of the site to be determined is within an allowable range of the standard positioning point. 4. A method for detecting a laser marking on an integrated circuit package, comprising: establishing a file of a standard laser marking, wherein the standard laser marking system is 17 1290429, El El, ""沾瓦ί 9fl fi ts "Γ1 folder is formed on the standard integrated circuit package and includes _standard positioning point; loading the file to a detection program; image capturing on at least one integrated circuit package The laser marking to be tested, wherein the laser marking to be tested includes a to-be-determined site; and the detection program determines whether the coordinate value of the to-be-determined site is within the allowable range of the standard positioning point. The method for detecting a laser marking on an integrated circuit package as described in claim 4, wherein the file system includes an X-axis upper limit value, an X-axis lower limit value, and a ¥ axis of the standard positioning point. The upper limit value and the lower limit value of the Y axis, when the value of the χ γ coordinate of the point to be measured does not exceed the upper limit value of the X axis, the lower limit value of the X axis, the upper limit value of the γ axis, and the lower limit value of the γ axis When it is judged to be qualified. 6. As stated in the fourth paragraph of the patent application scope The method for detecting a laser marking on a body circuit package, wherein the detection program further comprises a Barcode System to connect to a database, and the batch number of the integrated circuit package to be tested can be taken out Basic information. 18