TWI288978B - Manufacturing method of electronic light emitting device - Google Patents

Abstract

There is provided a manufacturing method of electronic light emitting device, which includes: forming plural through holes in a substrate; forming a copper covering layer on the surface of the substrate; forming a silver covering layer on the copper covering layer; removing the copper covering layer and silver covering layer on a predefined surface area of the substrate, so as to form a conductive metal laminate with a predefined pattern on the surface of the substrate; attaching plural light emitting diode dies on the surface of the metal laminate; using a metal wire to electrically connect each light emitting diode die to the conductive metal laminate; using encapsulating material to package the light emitting diode dies and the metal wires on the substrate; and dicing the substrate to form plural light emitting devices.

Description

1288978 V. INSTRUCTIONS (i) The technical field of the invention belongs to the \^y ο 6 C method • 1 - IV side 6 d (the device optoelectronics of the workpiece, the two kinds of light of the moon) The application of the ancestors in the month aw rrr'-v has been widely used in the prior art luminescent diode devices, for example, it can be applied to optical display devices, traffic signs, data storage devices, communication devices, lighting. Devices and medical devices. How to improve the brightness of light-emitting diodes in a cost-effective and modern environmental protection manner is an important issue for researchers. The most common method for manufacturing light-emitting diode devices includes the following. Each step: 1. Preparing a substrate made of glass epoxy resin (G 1 ass Ε ρ ο X y) or the like, 2. Forming a predetermined pattern (p a. 11 er η) in the substrate a plurality of through holes, 3. a copper coating layer is formed on the surface of the substrate (including the inner surface of the plurality of through holes), 4. a nickel coating layer is formed on the surface of the substrate, and the substrate is formed. Surface forming box_covered a cover layer, a '''''''''''''''''''''''''''''' The light-emitting diode crystal grains are respectively attached to the surface of the gold-plated metal of the conductive metal layer at a plurality of predetermined positions, and a metal wire is disposed between each of the light-emitting diode grains and the conductive metal layer. Establishing appropriate electrical connections, 9. encapsulating each of the light-emitting diode dies and associated metal lines on the substrate with a suitable encapsulating material (eg, epoxy), 1 1. cutting the substrate to form a plurality of luminescent layers Diode device.

Page 4 1288978 V. DESCRIPTION OF THE INVENTION (2) The light-emitting diode device fabricated by the prior art method for fabricating a light-emitting diode device has several disadvantages: 1. Reflection of a gold-plated surface for short-wavelength light (such as blue light) The rate is low, for example, the reflectance of blue light is only about 40%, so that the light emitted by the short-wavelength light-emitting diode crystal grains cannot be effectively reflected, 2. Before the gold-plated copper plate used in general printed circuit boards is plated with gold In order to avoid the phenomenon of migration between gold and copper, it is necessary to first coat a layer of nickel on the surface of the copper foil as a barrier layer, resulting in a high manufacturing cost and 3. Nickel is a harmful health substance (please Refer to the Announcement of the Water Quality Department of the Environmental Protection Department of the Executive Yuan, August 30, 2011, and the material cost of gold. · The inventor of the present invention has long conceived how to balance the environmental protection and cost-effectively improve the brightness of the light-emitting diode device. Those skilled in the art believe that in the process of manufacturing the light-emitting diode, in the copper plate-surface-plating-silver , it is plated ^, it is not feasible. However, the inventor of this case, in the way of reverse thinking, thinks on the concept that everyone is not feasible, and through the real thing, it is in the process of manufacturing a light-emitting diode. 'In the predetermined surface area of the printed circuit board, the silver has a higher reflectivity for short-wavelength light (for example, the reflectance of blue light is about 97%), instead of the gold plating of the prior art, even the electric material is ground, It is possible to avoid the aforementioned shortcomings of the prior art and achieve the advantages and advantages of environmentally friendly and cost-effectively improving the brightness of the light-emitting diode device. SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturer of an electronic light emitting device

Page 5 1288978 V. Description of Invention (3) The light-emitting diode device manufactured by this method can produce higher brightness. Another object of the present invention is to provide a method of manufacturing an electron-emitting device which is simple in manufacturing process and thus can reduce manufacturing costs. It is still another object of the present invention to provide a method of manufacturing an electroluminescent device in which a relatively inexpensive electroplated reflective metal material is used, thereby reducing material cost. Still another object of the present invention is to provide a method of manufacturing an electroluminescent device in which a harmful health substance, nickel, which is used in the prior art, is dispensed with, thereby being able to meet modern environmental requirements. In order to achieve the above objects, a method for fabricating an electronic light-emitting device according to a preferred embodiment of the present invention comprises the steps of: forming a plurality of through holes in a substrate according to a predetermined pattern; on the surface of the substrate Forming a copper cap layer on the copper cap layer; forming a silver cap layer on the copper cap layer; removing the copper cap layer on the predetermined surface of the substrate surface and the silver by exposure and development techniques a cover layer, thereby forming a conductive metal stack having a predetermined pattern on the surface of the substrate; and dicing the plurality of light-emitting diodes on the surface of the conductive metal laminate respectively at a plurality of predetermined positions; A suitable electrical connection is established between each of the plurality of light-emitting diode crystal grains and the conductive metal layer by a metal wire; and the light-emitting diode die is formed by a packaging material The metal line is packaged on the substrate; and the substrate is diced to form a plurality of light emitting diode devices.

Page 6 1288978 V. DESCRIPTION OF THE INVENTION (4) Embodiments The present invention will be described in detail with reference to the accompanying drawings.

A method of manufacturing an electronic light-emitting device according to a preferred embodiment of the present invention comprises the following steps: 1. preparing a substrate, 2. forming a plurality of through holes in the substrate according to a predetermined pattern (pa 11 er η), Forming a copper coating on the surface of the substrate, so that the inner surfaces of the plurality of through holes are covered with a layer of copper material, 4. The surface of the substrate is silvered at a degree of 1. 5, by exposure and development techniques, the surface of the substrate is removed. a metal on the predetermined area, thereby forming a conductive metal stack having a predetermined pattern on the surface of the substrate, 6. Having a plurality of light-emitting diode dies in a corresponding plurality of predetermined positions, respectively attached to the conductive metal stack On the silver-plated surface, between each of the light-emitting diode dies and the conductive metal stack, a suitable electrical connection is established by a metal wire, and each illuminating is performed with a suitable encapsulating material (such as an epoxy resin). A diode die and associated metal lines are packaged on the substrate, and the substrate is diced to form a plurality of light emitting diode devices. Those skilled in the art will appreciate that any other step or steps may be added between any two adjacent steps above. According to a manufacturing method of a preferred embodiment of the present invention, the substrate 11 after the completion of the foregoing step 6 is shown in FIG. 1 and includes a plurality of through holes 20 and a plurality of conductive regions 30, each of which

After completing the foregoing step 9, a conductive region 30 forms a plurality of conductive regions 12 and a plurality of conductive regions 13 as shown in FIG. Referring to FIG. 2, a light-emitting diode device 1 manufactured by the above manufacturing method of the present invention includes, for example, a substrate 1 1 , two conductive regions 12 and 13 , and a light-emitting diode die 14 . Metal wire 15 (for example made of gold), and one

1288978 V. INSTRUCTION DESCRIPTION (5) 'Packaging material 1 6, wherein the substrate 1 1 is, for example, a general glass epoxy substrate for manufacturing a printed circuit board, and the conductive regions 12 and 1 3 are predetermined on the substrate 1 1 - one _______________________ - one ________ - one by one

On the surface of the CH, a copper coating layer and a silver coating are formed according to the above method. The cathode is formed, and the cathode of the LED diode 14 is electrically connected to the conductive region 12, metal. The anode of the light-emitting diode die 1.4 is electrically connected to the anode of the light-emitting diode. The encapsulating material 166 is formed, for example, of a high temperature resistant silicone or epoxy resin, and the luminescent diode die 14 and the metal line 15 are encapsulated on the conductive regions 12 and 13 and the substrate 11. The silver-plated surface of the conductive regions 1 2 and 1 3 sealed by the encapsulating material 16 is "one violent" from the air - therefore - anaerobic, chemical-transformed, black, and the like -1. It has been experimentally confirmed that the brightness of the light-emitting diode device 1 according to the present invention is about 140% of the brightness produced by the prior art blue light-emitting diode device, that is, the brightness can be increased by about 40%. Improve efficacy. In addition, since the copper material of the substrate 1 1 and the silver plated on it are born, one --------------------------- --------............... One to one migration phenomenon, so it can be directly on the copper material of the substrate 1 1 without silver, without the prior art The diode device requires a layer of nickel to be used as a barrier layer to prevent the migration phenomenon, so that the light-emitting diode device 1 according to the present invention can achieve the advantages of simplifying the production process and taking into consideration modern environmental protection requirements. The above is only a preferred embodiment for facilitating the description of the present invention, and the scope of the present invention is not limited to the preferred embodiment, and any changes made in accordance with the present invention are claimed in the present invention. range. For example, the replacement of silver with a silver alloy as a reflective material for the surfaces of the conductive regions 12 and 13 does not clearly depart from the spirit and scope of the present invention.

1288978

Claims (1)

1288978 6. Patent application scope 1. A method for manufacturing an electronic light-emitting device, comprising the steps of: forming a plurality of through holes in a substrate according to a first predetermined pattern; on a surface of the substrate (including the plurality of through-the-holes) The inner surface of the hole is formed by a layer in the conductive layer and the second layer is attached to the second conductive portion in the second portion of the conductive portion. 4. According to the application method, the surface of the κ 依 申 substrate is the first conductive material, the first conductive layer, the second pre-conducting current, the second, the second plurality of layers, and the electron emitting the substrate, the second at 70%. The third layer of the conductive layer is formed by a conductive material, and the first conductive layer is formed of a conductive material; and a second case formed of a second conductive material is formed thereon, and the surface of the substrate is removed. The first conductive layer light unit is respectively disposed on the respective plurality of predetermined positions; each of the sub-light emitting units is electrically connected to the first appropriate; the metal and the metal line are packaged on the substrate; and a plurality of An electron-emitting diode device, the layer of which is opposite to the light emitted by the electron-emitting unit. The second conductive material of the electron-emitting device comprises silver. In the manufacturing method of an electronic light-emitting device of the first aspect of the patent, there is no migration between the first conductive layer and the second conductive layer, and the manufacture of an electronic light-emitting device of the first application of the electronic patent application scope is disclosed in the patent scope. The square light unit is a light-emitting diode crystal. The manufacturer of an electronic light-emitting device of item 1 Page 10 1288978 6. The patent application scope method, wherein the first conductive layer has a reflectance higher than 90% for the light emitted by the electronic light-emitting unit. The manufacturing method of the electronic light-emitting device according to a predetermined pattern includes The following steps are: forming a plurality of through holes in the substrate; forming a copper cover layer on the surface of the substrate (including the inner surface of the plurality of through holes), in the case of the cap layer, a copper-clad exposure display is attached to the plurality of conductive conductive gold-on-package plates; the base cover layer is covered with a metal-emitting conductive conductive material and a plate, a topography, a layer, and a stack Between the layer of the two-layer metal light-emitting layer, the silver-clad layer is removed to remove the substrate surface, and the copper-clad surface on the predetermined area of the substrate surface is formed to have a predetermined pattern of crystal grains at a plurality of predetermined positions, and the surface is laminated. Each of the light-emitting diode grains in the diode grains establishes an appropriate electrical connection by a metal line; the light-emitting diode crystal grains and the metal The wire is sealed to form a plurality of light emitting diode devices