TWI288449B - Semiconductor wafer inspection apparatus - Google Patents

Abstract

The present invention relates to the observation system of the wafer semi-conductor. It possesses spinning table that provides absorption maintenance, the illumination system and the filming device which lights and recording the edge of the wafer semi-conductor. Moreover, it has image disposable mechanism that reduces the size of edge cutting, detects the crack on images and displays the disposed parts showed from the filming device.

Description

The first month ίί technology general defect inspection wafer (with C SiO ^ connected to the wafer table next on the dicing wafer to connect the semiconductor resistance material; followed by the dissolution sample. Continued continuous selection of membrane and niobium nitrogen A Ssing's Cheng Ru: shown in 'and will be implemented in each process, the conductor's mounting process, first of all, on the surface of the semi-guided invitation, referred to as "wafer"), the formation of an oxide film, followed by A tantalum nitride film is deposited on the oxide film. Into the photolithography project, and coated photoresist film (photoresist; photosensitive film) film. 2 Place an appropriate amount of rinsing agent on the edge of the round, and then define the photoresist material at the edge of the wide handle. On the exposure machine such as stepper, through the formation of a mask (mwU, the ultraviolet light is irradiated onto the coated surface: the semiconductor circuit pattern is copied to the photoresist material 1 and the image is processed. For example, the photoresist of the exposed portion is dissolved, so that the photoresist of the unexposed portion is left wide to mask the photoresist pattern remaining on the surface of the wafer, and the pattern is removed (remaining ( Etching)) on the surface of the wafer, the etching pattern on the surface of the wafer, the etching pattern on the surface of the sun circle is transmitted to remove (peeling the photoresist); then the wafer is washed to 4 1288449 _ case number 921Q5600__ Japanese Revision 5, Invention Description (2) Except for impurities. In the above semiconductor manufacturing process, each process has a defect inspection; the main cause of this defect inspection is, for example, inspection of scratches and adhesions on the surface of the semiconductor wafer. Defects such as cracks, dirt, warpage, etc.; recently, it is required to observe the width and distribution of the edge of the wafer; especially if the wafer is damaged by cracks, it is best to detect it as early as possible in the project. Wafer out There is no crack on the edge to determine the quality of the wafer. The inspection technology of the edge of the wafer is, for example, published in the special publication 9 - 2 6 9 2 9 8; this technique is a collection of elliptical mirrors. The parallel light after the light is irradiated on the edge of the wafer, and then the low-order diffracted light in the diffraction light has been blocked to collect the high-order diffracted light by the elliptical mirror, and the intensity of the diffracted light and/or therefrom Or the frequency component, the defect and the trait of the edge of the wafer are locked; in addition, as described in the Japanese Patent Publication No. 2000- 4 6 5 3 7 , the focus position is also gathered inside the wafer to detect Scattered light inside the wafer; in addition, a, as shown in the Japanese Patent Laid-Open Publication No. 2000-136, also has an infrared laser irradiation on the edge of the wafer to allow the wafer to be thundered. The beam is tilted, "the technique of checking one camera is less. With the above techniques, the edge of the wafer can be detected, and the defect is detected at the edge of the wafer." Department (especially the edge cutting line is wide; j, and is here) If the process after applying the photoresist material is processed, it is a problem of creating a defective wafer. In addition, in the defect inspection, it is necessary to obtain the wafer peripheral material (edge image), but each of the above The technology did not achieve full-circumference, image imagery, and did not detect the edge shadow of the second part of the edge of the semiconductor wafer.

Page 6 1288449 _ Case No. 92105600_年月日日__ V. Description of the Invention (3) The object of the present invention is to provide a semiconductor wafer on the periphery of a semiconductor wafer that can be easily inspected in a semiconductor manufacturing inspection process in a short time. Check the device. [Invention] The semiconductor wafer inspection apparatus of the present invention includes a rotating table for adsorbing and supporting a semiconductor wafer, and at least illuminating an illumination device for illuminating an edge portion of the semiconductor wafer supported by the rotation, and photographing An imaging device for detecting an edge portion of the semiconductor wafer illuminated by the illumination device, and an image processing device for detecting at least an edge cutting line width or a crack to obtain an output of the image of the edge portion captured by the imaging device a display unit of the edge image processed by the image processing device. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of an invention will be described with reference to the drawings. 1 is a view showing a configuration of a line aligner (a igner) suitable for use in a related semiconductor wafer inspection apparatus according to an embodiment of the present invention; the function of the aligner 1 is to form a semiconductor wafer 2 (hereinafter referred to as "crystal" The round") can be used to perform an alignment function before being delivered to the defect inspection device main body 3. The defect inspection device main body 3 accepts the aligned semiconductor wafer 2, and then uses macro or precision ( The micro) method is used to inspect various defects on the surface or inside of the semiconductor wafer 2. The two cassettes 4 and 5 contain the unchecked or inspected wafer 2; between the cassettes 4 and 5 and the linear aligner 1, there is a transport robot 6

1288449

曰 f f ^ is to let the wafer in the cassette 4 pass through the linear aligner to carry the hopper to the rotor of the concentrating body 3. The robot 6 has two telescopic machines ι〇·8 on the upper and lower sections, and these robot arms ί, 8 each have a hand 隹, and then, the gripper 9, 1 0 is the same, and only one is shown on the drawing, and the transport robot 6 is placed on the moving mechanism. The mechanism 1 1 is provided with a rail parallel to the cassettes 4 and 5, and the robot 6 moves toward the arrow direction a, and is stopped according to each position of each of the cassettes 4 and b. The function of the aligner 1 is to detect the wafer 2 by assembling the wafer 2 to the rotating rotor 2 at a constant rotation speed of the rotating cathode 2; the detection result is 2^2) or 0rientati 〇n Fiat direction, based on the alignment function of wafer 2 not being executed. The drawing diagram shows that the schematic structure m of the defect inspection apparatus main body 3 of the present embodiment can be directed upwards: a two-stage stage 3° (motorized stage), and the moving stage 32 is moved. The movement is from the Y to the movable stage 31a and the X to the object stage 3 1 a, then pull & \, and further, the configuration is such that the moving direction is shifted to the driving unit 32. The moving stage 32a is moved by the X direction by the side of the moving stage 32a; the rotating mechanism driving part of the 'US crystal garden is rotated by 2° on the 2-axis moving stage 30, and the arrangement is not visible through the microscope. Objective lens 6°, on the icon

When it is set to the side of the wafer, if you want to check the edge of the wafer, you can use the -_^ edge to observe the Μ type to control the Υ to move the stage 31 iodine X to π 昼 2105600 _ raw ~ ^ month Japanese revision 5, invention description (5) '^ -- g movable stage 32a, and then adsorbed and supported under the wafer matching objective lens 6 〇 of the rotating table 21, thus belonging to the edge of the wafer to be photographed, A method of photographing with a photographing device; with this type of photographing body, the image of the edge portion is analyzed by the image processing unit. When the semiconductor wafer inspection device is operated outside, the GUI (image use interface) displayed on the computer display unit is used as the 'edge observation/general observation switcher 4', which is used to switch between points and points. Device 〇 〇 旋转 旋转 旋转 机构 ____ 〃 〃 〃 〃 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 指示 指示 指示 指示 指示 指示 指示 ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ The pointing device 50 can also pass through the rotating table 21, := the direction of rotation of the wafer and the speed of rotation = the edge portion (outer circumference), the position of the wafer can be fine-tuned, and then, the following is performed: Description. For the semiconductor wafer inspection device of the above configuration, the flow chart of the related semiconductor wafer inspection device of the present embodiment is performed by the operator from the inspection/inspection device to check the wafer edge portion and the first game day. The defect of the sun surface is changed to, for example, the edge movement on the operation panel - the rotation button, the rotation rotation button, the switching position movement, and the like are displayed on the display device, and pressing = display = edge μDo not 镜 置 置 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , V. INSTRUCTIONS (6) After the display of the displayed body button, the operation can be performed. 3〇 ΐ ΐ ΐ ΐ 动 动 / / / / / / / / / = = = = = = = = = Moving the stage 32 螭垧 moving; step turret object: the edge of the wafer, moving below the objective lens 60, the edge portion: near: detailed image; _ this wafer = object; 6 ° and can not focus The problem, therefore, after the +, ', \ work, move the edge of the wafer to Under the objective lens 60, the main signal is returned to the end signal of the stage, and the person is on the operation panel; next, the operation is required to recognize the image displayed on the display device, and the edge portion is finished ^^5 In the operation indicator device 5〇, in order to make the wafer fine-tuning soft and private, in the range, in the step (SteP) 6 from = 3〇; then in the step (Step) 7 returning the player in the step H To the end signal of the drive unit 32, the operator confirms (tep) 8 to confirm the image displayed on the display device. Up, select i family ίί: (step) 9 after the operator presses the rotation, / this Rotate the wafer 2 by rotation. 2 1 Rotate the rotation a 2 Step (step) u from the rotating mechanism drive unit 2 σ Under: = Spin 1 Return to the operation screen/operation surface until operation = In front of the object, the rotary table 21 is rotated all the time, and the edge portion of the circle 2 taken by the rotary table 21 is displayed on the display device by the photographing device ί = ; step 12 is observed by the operator. The image of the edge of the wafer; in addition, start to rotate ^^J2105600 1288449 Correction 曰5, invention description 7) After the [II I through the operator's instruction, the edge observation / general view ^ 〇 ' is switched to the edge observation mode, the pointing device 50 can pass the suspect turntable 21 to adjust the rotation speed. 4L wants to start observing the wafer In front of the edge portion, the position of the 2 load port 30 is controlled by the pointing device 50, and the observation of the edge portion of the wafer can be finely adjusted to the center of the field of view of the objective lens 6〇; The round edge ' "\ ^ controls the rotation speed of the rotary table 2 1 by means of the device 50, m: adjusts the observation speed according to personal preference; this control method helps to improve the operability. . After the observation of the edge portion of the wafer is finished, the rotation button is stopped by the operator at step l3, and the step (printing) 14 stops the rotation of the rotary table 21 after the signal transmission mechanism driving portion 20 is stopped (rotating the wafer 7) (Step) 15 returns the stop rotation/U from the rotation/rotation mechanism drive unit 2〇; furthermore, when the wafer 2 is rotated/stopped, if a defect such as a bad cut or a crack is found, The operator regards the need to wash the rotary knob to stop the rotation of the rotary table 21, and then through the image of the rounded edge portion, the image processing portion is used to analyze the image data; In the constant period, the image of the observation portion is obtained, and the image processing unit analyzes the defects such as the cleaning amount, the crack, and the wafer defect J to calculate the number of defects, the coordinate position, the defect, and the like of each defect portion. J. The image processing unit is provided with an automatic defect classification software. When the predetermined value of the cutting amount is removed, or when it is a defect such as a crack or a wafer defect, the wafer 2 is judged to be defective; when the image processing unit determines the cleaning Cutting does not / time 'the wafer 2, then return to remove the photoresist project' when it is judged that the crack is bad

Page 11 1288449 _ Case No. 92105600_年月曰 修正 Amendment _ V. Invention Note (8) 晶圆 When wafer 2 may break in the post-engineering, it is subject to discard. Step 16 is to determine that the edge of the wafer has been finished. Step 17 is pressed by the operator to press the reset button (of f set); after pressing the reset button, the step is Step 18 controls the rotating mechanism driving unit 20 to return the rotating table 21 to the angle before the observation (initial state); in other words, the notch of the wafer 2 adsorbed and supported on the rotating table 21 returns to the original standard position. For example, in order to conform to the 0° position, the wafer angle (rotation angle) is restored to the original position; the step 19 returns the end signal from the stage, and the step 20 is confirmed by the operator on the display unit. The displayed image. 4A and 4B show an enlarged display example of the edge portion of the wafer; when the edge portion of the wafer is observed by the low-magnification objective lens 60, when an abnormality such as the crack in Fig. 4A is found, the objective lens is changed to high. The magnification is magnified as shown in Fig. 4B. When the magnification is changed, the operator can find the abnormality that is difficult to observe by visual observation through the lens of the microscope, or can be judged by the image processing automatic defect classification software. Whether the image captured by the camera is abnormal. Switching to the high-magnification objective lens 60 to magnify the abnormal portion, you can easily determine whether it is a defect; for example, observe the low-magnification at 5 times and change it to 1 〇, 2 when the abnormality is present. 0x, 50x, or even 100x high-magnification objective lens to perform defect inspection in detail to magnify the abnormal part; in addition, if it is determined that the abnormality is a defect, it is better to log in the defect data and image data; First, the defect data and image data can be effectively used in subsequent inspections.

Page 12

If you look at the edge of the circle, it will happen when you look at the wafer 2, and it is best to base it on this. The pulse of the edge moving portion 20 is driven toward the driving portion 3, the driving portion 32, and the rotating mechanism, and is operated at: ^4 to determine the coordinates of the observation position and the rotation angle of which wafer 2 (or the operation panel) shows that it is currently being viewed (Qing) 2, for example, 'Figure 5 shows the wafer mapping

In addition, in the wafer 1 screen, the wafer map 2' shows that each defect portion is distinguished from the K-ray 2', and any defect position detected by the image processing unit is colored by color: 1J ' can also be used to display images that are slightly displayed. In addition, ί ^ shows the wafer shadow VJ that is enlarged by the defect specified by the indicator: 昼=61 will be displayed for Classification observation circle ~ like classification button of defect type 6 2, like: deposit 63: and use for login defect data entry: two missing "21 rotation Ϊ 不: not moving the stage from 2 axes 3 The rotating table configured on the crucible will detect the concentric circles of the radius of the wafer 2 and the radius of the wafer 2, and the alignment mechanism with the sensor = sensor arranged at 3; the alignment machine jj 3 points In the edge coordinate data, the center of the wafer is determined, and the center of the circle 2 is the center of rotation, and the rotary table 2 1 is continuously driven to automatically control the 2-axis moving stage 30; In the center of the wafer 2 which is supported by the adsorption, in order to become the center of rotation, the position of the wafer 2 is repaired so that the semiconductor can be correctly observed at any time. Near the edge of the next day. According to the present embodiment, it is known that the objective lens is changed from a low magnification to a high magnification, and the defective portion can be enlarged for detailed inspection. Further, it is not necessary to specially set the wafer edge inspection portion as long as the microscopic- --------

Page 13 J288449

The precise viewing function of the mirror allows the microscopy to be shoveled on the edge of the wafer on the rotating table. · Under the objective lens of the brother, the observation is loaded, and defects such as semiconductor crystal, patching, cracking, edge marks on the edge of the perimeter, and lithography width after the photoresist material of the wafer are detected. The reason for making a bad wafer. In the S〇 engineering process, it is detected that the defect is displayed on the wafer map to classify the defects, and the position information can be trapped by the position of the image. Identify which way on the wafer

Further, the present invention is not limited to the scope, and an appropriate variable embodiment may be implemented. When the edge is not changed, the carrier 2 is moved through the two axes, for example, the d-axis direction is started to be observed. In the vertical χ-γ plane; thirsty ^ moves the edge of the light circle of the precision observation optical system to the objective lens: also the V conductor wafer 'to facilitate the upper side of the crystal. Ren can also move the objective lens to the edge of the wafer to warn [the production process. The possibility of utilizing the industry] The present invention is to provide r Μ ^ # , 轫i彡烚 apricot sitting in a short time in the semiconductor manufacturing inspection quarterly I check the semiconductor a circle

In the semiconductor wafer inspection of the outer peripheral portion of the body, it is possible to observe the edge portion of the semiconductor wafer according to the present invention; the device seeks to check the efficiency of the project; and the smooth operation is possible. By using a precision inspection optical system, it is possible to manufacture in semiconductors, and it is easy to observe the edge portion, and the semiconductor inspection engineering can improve production.

Page 14 1288449 _ Case No. 92105600_年月曰 修正 Revision _ V. INSTRUCTION DESCRIPTION (11) Further, according to the present invention, the defective portion of the entire periphery of the edge portion of the semiconductor wafer can be determined.

ΙΙΙΙΙΗ page 15 1288449 _ case number 92105600_year month 曰 correction _ simple description of the drawing. [Simplified description of the drawings] Figure 1 is a linear aligner (a 1 igner) suitable for the relevant semiconductor wafer inspection device A configuration diagram of an embodiment. - Figure 2 is a schematic configuration diagram of the defect inspection device of the present invention. Figure 3 is a flow chart showing the operation of an embodiment of the semiconductor wafer inspection apparatus of the present invention. Fig. 4A is an enlarged schematic view showing the edge portion of the wafer in the embodiment of the present invention. Fig. 4B is an enlarged schematic view showing the edge portion of the wafer in the embodiment of the present invention. Figure 5 is a diagram showing an example of the edge portion of the wafer in the embodiment of the present invention.

[Description of symbols] 1 ............ Straight line to the device la...........Rotary table 2 ...........Semiconductor crystal Circle 2 '............ wafer mapping 3............ defect inspection device body 4............ card 5 ............ • Card

6 ............ • Handling robot 7 ............ • Robot arm 8 ............ • Robot arm 9 ............ •Pinch 10 ............Pinch · 11 ............Moving mechanism 2 0.. .........Rotary machine drive unit

Page 16 1288449 _ Case No. 92105600_ Year Month Day Correction Diagram Brief Description < 21............ Rotary Drive Rotation Stage 30............ Moving stage 31............Y-direction drive unit 31a...............Y-direction drive stage 32 .......... .. X-direction drive unit 32a......... X-direction drive stage 40............ • Switching machine 50 ......... ......... indicating device 60.................object lens 51 ..... • Step one 52 ...... ... • Step 2 · 53 ......... • Step 3 54 ......... • Step 4 S 5......... • Step 5 S 6. ........ •Step 6 S 7......... •Step 7 S 8......... •Step 8 S 9......... • Step 9 S1 0......... • Step 10 S1 1......... • Step 11 S1 2...... • Step 12 S1 3. ........ • Step 10. Three S1 4......... • Step Fourteen S1 5......... • Step 15 S1 6.... ..... steps sixteen

Page 17 1288449 Case No. 92105600 曰Revision diagram simple description S 1 7......... • Step 17 S1 8......... • Step 18 S1 9.... ..... • Step 19 S20......... • Step 20

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Claims (1)

The grain 8 §4+9 repair (more) original 曰 correction has the illuminating device for absorbing and supporting the upper edge of the rotating table, and photographing the edge of the front edge of the conductor wafer The edge device processed by the image processing and processing device of the shadow portion of the portion is provided with a predetermined magnification objective lens; the edge portion of the semiconductor wafer is moved to rotate the rotating table, and the edge portion of the semiconductor wafer is six. Patent Scope 1 A semiconductor wafer inspection device that rotates the back surface of a semiconductor wafer. A semiconductor of the Lanshou Building: a circle J. The illuminating device is illuminated by the Yu-Yue yoke half-shadow device, and the aforementioned photographic equipment is obtained. For example, a display portion for detecting an image of the image at the edge of the image is displayed, wherein the camera 2 is enlarged by the camera 2, and the rotary table is disposed at a position of the second axis under the objective lens. In the above, one of the above features is photographed by the aforementioned photographing device. 2. The semiconductor wafer inspection apparatus according to claim 1, wherein the image processing apparatus includes a function of determining that the semiconductor wafer is defective when the width of the edge cutting line is out of a predetermined value. By. 3. The semiconductor wafer inspection apparatus according to claim 2, wherein the image processing apparatus is provided with at least a defect that is determined to be defective and whose edge cutting line width or crack is automatically classified. 4. The semiconductor wafer inspection apparatus according to claim 1, wherein Page 19 1288449 Correction 曰 -, Application - Describe the 2-axis moving stage, ;:=, so the material rotates to the χ-γ direction and controls it as its characteristic. The above-mentioned 2 special axis t-enclosed ^ f U "body wafer inspection device, which allows the aforementioned semi-circular circle: the center deviation amount, so as to move inside, and move to Χ-υΛ ρ 'time to enter the objective lens to move to the X The gamma direction is controlled by the gamma direction. In the center of the wafer inspection, the center of the field of view, A - 丄疋 allows the edge portion to be located in the objective lens. Fine tuning by the pointing device into the XY direction is characterized by: The first item is characterized by the semiconductor wafer inspection apparatus described above, and the semiconductor wafer inspection apparatus according to the means for adjusting the rotation speed, the stage is set to start. The function is to rotate the aforementioned rotating focus function as its characteristic ί. When the body is round, the above automatic will be released. Page 20 1288449 Page 21