1288117 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種内嵌式微型通道之形成方法，尤 其關於一種利用嵌入式内嵌式微型通道之形成方法。 【先前技術】 • 微機電系統中包含了許多學科，其中微觀流體的研 究為其中極重要的一環。實際生活之應用譬如：輕巧可 攜式生物醫學檢測儀器、病理分析、藥效評估、化學分 析檢測、DNA分析、以及快速的藥物偵測等。.在微機電 技術的發展下，藉由研發微致動器與感測器等微流體系 統’而得以量測在微觀下流體理論與控制微流體之現象。 微流體（micro fluidics)元件及系統的技術主要在於發展控 制、感測、反應及分析微量流體。關鍵的元件包括有微 閥門（micro valve)、微幫浦（micro pump)、微流量計、微 喷嘴（micro nozzle)、微流道（micro channel)、微混合器 I (micro mixer)等，並可整合為不同功能之智慧化微型流體 系統晶片，對二^^一世紀產品輕、薄、短、小、智慧化、 _ 多樣化的需求產生正面的衝擊。 近年來，微流體系統有朝著分析化學與生命科學發展 的趨勢，主要的應用包括：DNA的排序（sequencing)、血 液與疾病的檢驗、藥品的採樣及分析、與環境檢測等， 利用微機電系統加工技術可把傳統生化分析中所需的微 幫浦、微閥門、微混合器及微感測器（micro sensors)等元 件集中製作在生物晶片上，這樣的微流體生醫晶片又稱 5 l288117 為微型全分把么^ / . 亇系、、充（micro total analysis system， ju TAS)。 由此可知微流體系統（micro_fluidics SyStem)的優點不 僅尺寸微小’更有取樣少、反應時間迅速等，還能有效 - 操作的實驗誤差、提高系統穩定性、減少樣品 用量及縮短檢測時間。若能將樣品前處理、混合、分離及 檢測等功能微小化並整合於晶片中，發展出微型全分析 、、先或稱為晶片實驗室（lab_on-a-chip)，其特點除了上 述之外，還有操作簡單、構造輕巧便於攜帶，而且大大 降低製造成本。從未來朝向整合型晶片發展的角度看來， 鬲效能微混合器的開發具有關鍵性的影響。 ^在近年來的研究當中，對於高分子的製程技術已逐 ，莩握而現今最為人所常用的高分子，即為厚膜 光阻，因其具有良好的化學及機械性質等等，故常被用 來製作微結構所需的高分子材料。然而在微流體系統領 域方面如何製作一密封的微流通道是現今所遇到的最 大課題。 目前，微喷孔的製造方法，主要有分為應用高分子 材料與非高分子材料兩種。以下將先介紹應用非高分子 材料作為喷孔結構的製程方法。 目前主要的喷孔片，就是以矽晶片作為主材料，然 後用乾餘刻（Dry etching)、濕#刻（Wet etching)等製程方 法去做蝕刻，以蝕刻出所要的結構，譬如美國專利第 4，157,935 ; 6,998,062 ; 6,787,051 ; 6,378,995 ; 6,260,960 所揭露者。一般常見的製程步驟如下：首先在矽晶片上 長出二氧化矽或是在矽晶片上塗上一光阻層當作阻擋 6 1288117 » 層，接著利用乾蝕刻或是曝光等方法定義出噴嘴或是微 - 流通道結構，再利用RIE(Reactive Ion Etching，反應性 離子蝕刻）做非等向性蝕刻以將矽晶片蝕刻出微流通道結 構。然而，這個方法往往需要用到的器材設備並不十分 容易取用’譬如欲蝕刻出夠深的結構必須用 ICP(InductiVely Coupled Plasma，感應式耦合電漿），以 及有些基材需要用到S0I(Si on insulat〇r)，其成本皆不 便宜，因此並不十分實用。 籲 $外’美國專利第6,214，192號揭露-種透過黃光微 影技術來在矽晶片上先以光阻定義較喷孔尺寸大的結 構，再以電鑄縮孔的方式製作出漸縮曲線形狀喷孔之鎳 金屬喷孔薄片，而依所需要的噴孔片厚度再將金屬片一 一堆疊起來。然而，此技術在利用光阻定義每個孔洞時 其間距須有一定尺寸之限制，因此使得鎳電鑄技術在製 作更高解析度的噴孔片時其良率將無法大幅提昇。 此外，還有利用微放電加工的方法，或是利用微沖 • 床（PUnCh)的方法等等來將工件材料製作而出一個微喷 ' 孔，譬如美國專利第 7,040，134; 7,021，749; ^ 及6,968,616號所揭露者。 若以高分子材料當作我們為喷孔片的主要材料的 話，目前最普遍的方法敘述如下。 首先，同樣利用黃光微影技術在矽晶片上先以光阻 定義出微喷孔片以及微流通道的結構，再以高分子結構 為基礎在上面鍍上一層金屬當做起始層或種子層（sad layer)，以微電鑄加工的技術長出母模（美國專利第 7 1288117 6,423,476號），或是進而利用微射出成型方法（micro injection)將高分子材料擠壓入模仁中射出成型（美國專利 第 5,925,205 號）。 另種方法即是利用準分子雷射（Excimer Laser)加工 技術’譬如美國專利第5,4〇8,738 ; 5,3〇5,〇15號。於此 技術中’以脈衝光束對具有耐熱性、耐溶劑性佳的高分 子材料（聚亞醯胺薄膜（Polyimide))進行喷孔加工。因為加 t私由雷射光直接對工件材料做消融（ablation)的動作 ® 去吃出微喷孔’而可製作直徑約在10〜50微米的微喷孔。 然而’其缺點在於單一機台造價昂貴且加工速度慢 Throughput) ’而成為此製程的所面臨的最大困難處。 另外’還有使用傳統的黃光微影技術製作出微喷孔 片連結至微流通道的方法，譬如美國專利第0，921，629 ; 6,719,404 ;及6,4〇6,6〇7號所揭露者。於此技術中，利 用部分曝光的方式讓闢如SU-8光阻之高分子材料造成部 刀的光阻結構交連（cross linking)。其製程說明如 |下。首先將矽晶圓塗上一抗反射層再塗上光阻，定義出 '微流通道後再定義出微喷孔結構，即可得到此微喷孔片， 譬如美國專利第6,762,〇12號所揭露者。但是，其缺點在 於=於為部分曝《，在控制#光劑4方面彳能不是那麼 好掌握，而使得微噴孔片的製程會存在有其困難度。 此外，美國專利第6,928,73 1及6,773,869號揭露一 種利用多種材料結合而成之微喷孔片連結微流通道的製 私技術首先，先將石夕晶片做乾餘刻吃出噴孔片幹構 再塗上光阻定義出微流通道結構，進而將此兩處做連結。 8 1288117 另外’還有就是利用Riston^這個材料，首先同樣先將 光阻以黃光微影技術定義出微流通道的結構，然後利用 層壓（lamination)的方法將第二層材料壓上去微流通道再 定義出微喷孔片的結構。然而，此法的缺點在於在層壓 過程中，有可能因為壓力控制的問題造成微流通道結構 的損壞’譬如美國專利第6,902,262所揭露者。 • 然而，在一般的微通道之中，大多皆須再另外黏結 一上蓋層以形成封閉式的流道，因此流體才可在此空間 中流動。 圖1A至1 c顯示第一種傳統之微通道結構之製造過 程的示意圖。首先，先將第一層su_8光阻層12〇旋塗於 基材110上，以第一光源定義出微通道13〇的圖形之後 顯影，以形成圖1A之結構。接著，在微通道13〇的結構 處填充上一層對紫外光（UV)光源不感光的材料14〇之 後，再塗佈上第二層SU-8光阻層150，以形成圖iB之 結構。然後，對整個結構作曝光，最後利用一些有機溶 • 劑將填充材料14〇移除掉後即可得到此嵌入式微通道， ， 如圖1C所示。 . 圖2A至2C顯示第二種傳統之微通道結構之製造過 程的示意圖。首先，先將第一層su_8光阻層12〇旋塗於 基材110上，以光源定義出微通道130的圖形，在顯影 前，濺鍍上一金屬層122以當作之後所要用到的阻擋層^ 再方疋塗上第一層SU-8光阻層1 50，以形成圖2B之纟士構。 然後，對整個結構作曝光，由於有金屬阻擋層做遮罩， 因此下面未曝過光的光阻部分不會因第二次的曝光而交 9 1288117 連（cr〇ss-nnkingm去做顯影時即可得到—喪入式的 微通道，如圖2C所示。由於此金屬層122與剛光阻 層120的材料性質不同，不但可能會影響通過微通道之 液體產生不同的表面物理或化學的作用，而且此金屬層 122與SU-8光阻層12〇的連結特性，亦不若使用同—^ 料容易控制’所以使得該微通道之應用大幅受到限制。1288117 IX. Description of the Invention: [Technical Field] The present invention relates to a method of forming an in-line microchannel, and more particularly to a method of forming an embedded in-cell microchannel. [Prior Art] • There are many disciplines in MEMS, and the study of microfluidics is a very important part. Practical applications such as lightweight portable biomedical testing instruments, pathology analysis, efficacy evaluation, chemical analysis, DNA analysis, and rapid drug detection. Under the development of microelectromechanical technology, the theory of microfluids and the control of microfluidics can be measured by developing microfluidic systems such as microactuators and sensors. The technology of microfluidics components and systems is primarily to develop control, sensing, reaction, and analysis of trace fluids. The key components include a micro valve, a micro pump, a micro flow meter, a micro nozzle, a micro channel, a micro mixer, etc. The intelligent microfluidic system chip that can be integrated into different functions has a positive impact on the demand for light, thin, short, small, intelligent and _ diversified products. In recent years, microfluidic systems have evolved toward analytical chemistry and life sciences. The main applications include: DNA sequencing, blood and disease testing, drug sampling and analysis, and environmental testing. System processing technology can concentrate the components such as micro-pumps, micro-valves, micro-mixers and micro sensors required in traditional biochemical analysis on bio-discs. Such micro-fluid biomedical wafers are also called 5 L288117 is a micro total distribution system ^ / . micro total analysis system (ju TAS). It can be seen that the advantages of the microfluidics system (micro_fluidics SyStem) are not only small size, but also less sampling, rapid reaction time, etc., and can be effective - experimental errors in operation, improved system stability, reduced sample usage and reduced detection time. If the functions of sample preparation, mixing, separation and detection can be miniaturized and integrated into the wafer, a micro-analysis, first or called lab-on-a-chip, is developed, which is characterized by the above. It is also simple to operate, lightweight and easy to carry, and greatly reduces manufacturing costs. From the perspective of the future development towards integrated wafers, the development of the 鬲 performance micro-mixer has a critical impact. ^ In recent years, the process technology of polymer has been used, and the most commonly used polymer is thick film photoresist. Because of its good chemical and mechanical properties, it is often The polymer material used to make the microstructure. However, how to make a sealed microfluidic channel in the field of microfluidic systems is the biggest problem encountered today. At present, the manufacturing method of micro-injection holes is mainly divided into two types: application of polymer materials and non-polymer materials. The process of applying a non-polymer material as a nozzle structure will be described below. At present, the main orifice sheet is made by using a tantalum wafer as a main material, and then etching is performed by a dry etching method such as Dry etching or Wet etching to etch the desired structure, such as the US patent. 4,157,935; 6,998,062; 6,787,051; 6,378,995; 6,260,960. The common process steps are as follows: firstly, bismuth dioxide is grown on the ruthenium wafer or a photoresist layer is coated on the ruthenium wafer to block the 6 1288117 layer, and then the nozzle is defined by dry etching or exposure. The micro-flow channel structure is further anisotropically etched by RIE (Reactive Ion Etching) to etch the germanium wafer out of the microfluidic channel structure. However, the equipment that is often used in this method is not very easy to use. 'If you want to etch a deep enough structure, you must use ICP (InductiVely Coupled Plasma), and some substrates need to use SOI ( Si on insulat〇r), its cost is not cheap, so it is not very practical. U.S. Patent No. 6,214,192 discloses a structure in which a yellow light lithography technique is used to define a structure having a larger size than a nozzle on a germanium wafer, and a tapered shape is formed by electroforming shrinkage. The nickel metal orifice sheets of the orifices are stacked, and the metal sheets are stacked one by one according to the required thickness of the orifice sheets. However, this technique requires a certain size limitation when defining each hole by means of photoresist, so that the yield of nickel electroforming technology in the production of higher resolution orifices cannot be greatly improved. In addition, there is a method of using micro-discharge machining, or a micro-injection bed (PUnCh) method or the like to produce a micro-spray hole, such as U.S. Patent No. 7,040,134; 7,021,749; ^ and those disclosed in 6,968,616. If polymer materials are used as the main material for orifices, the most common methods are described below. Firstly, the structure of the micro-spray hole and the micro-flow channel is first defined by the photoresist on the germanium wafer by the yellow light lithography technique, and then a layer of metal is plated on the polymer structure as a starting layer or a seed layer (sad). Layer), using a micro-electroforming process to grow a master mold (US Patent No. 7 1288117 6,423,476), or in turn using a micro injection to squeeze a polymer material into a mold core for injection molding (USA) Patent No. 5,925,205). Another approach is to use Excimer Laser processing techniques such as U.S. Patent No. 5,4,8,738; 5,3,5, 〇15. In this technique, a high molecular material (polyimide film) having excellent heat resistance and solvent resistance is subjected to orifice processing by a pulsed beam. Because the action of ablation is directly performed on the workpiece material by laser light, the micro-nozzle having a diameter of about 10 to 50 micrometers can be produced by taking the micro-aperture. However, the shortcoming is that the cost of a single machine is expensive and the processing speed is slow. The cost is the biggest difficulty for this process. In addition, there is a method of using a conventional yellow lithography technique to fabricate a micro-spray sheet to a microfluidic channel, such as those disclosed in U.S. Patent Nos. 0,921,629, 6,719,404, and 6, 4, 6,6,7. . In this technique, a partial exposure method is used to cause a cross-linking of a photoresist structure of a SU-8 photoresist. The process description is as follows. First, the anti-reflection layer is coated with a photoresist, and the micro-flow channel structure is defined after the micro-flow channel is defined, so that the micro-perforation film can be obtained, for example, in US Pat. No. 6,762, No. 12 Revealed. However, its shortcoming is that it is a part of the exposure, and it is not so good to control the light agent 4, and the process of the micro-spray film has its difficulty. In addition, U.S. Patent Nos. 6,928,73, and 6,773, 869 disclose a technique for making a micro-flow channel using a plurality of materials to join a microfluidic channel. First, the stone slab wafer is used as a dry film to make a dry film. The structure is recoated with photoresist to define the structure of the microfluidic channel, and then the two places are connected. 8 1288117 In addition, there is also the use of Riston^ material. First, the photoresist is first defined by the yellow light lithography technique, and then the second layer of material is pressed onto the microfluidic channel by lamination. Then define the structure of the micro-spray sheet. However, a disadvantage of this method is that during the lamination process, it is possible to cause damage to the microfluidic channel structure due to problems with pressure control, as disclosed in U.S. Patent No. 6,902,262. • However, in general microchannels, most of the additional layers must be bonded to form a closed flow path so that fluid can flow in this space. Figures 1A through 1c show schematic views of the fabrication process of a first conventional microchannel structure. First, the first layer of the su_8 photoresist layer 12 is spin-coated on the substrate 110, and the pattern of the microchannels 13 is defined by the first light source to be developed to form the structure of Fig. 1A. Next, after the structure of the microchannel 13A is filled with a material 14 which is not sensitized to the ultraviolet (UV) light source, a second layer of the SU-8 photoresist layer 150 is applied to form the structure of Fig. iB. Then, the entire structure is exposed, and finally the embedded microchannel is obtained by removing the filling material 14〇 with some organic solvent, as shown in Fig. 1C. Figures 2A through 2C show schematic views of the fabrication process of a second conventional microchannel structure. First, the first layer of the su_8 photoresist layer 12 is spin-coated on the substrate 110, and the pattern of the microchannels 130 is defined by the light source. Before the development, a metal layer 122 is sputtered to be used later. The barrier layer is further coated with a first layer of SU-8 photoresist layer 150 to form the gentleman structure of FIG. 2B. Then, the entire structure is exposed. Since the metal barrier layer is used as a mask, the photoresist portion that has not been exposed to light below will not be connected to the second exposure (cr〇ss-nnkingm for development). The microchannels can be obtained as shown in Fig. 2C. Since the material properties of the metal layer 122 and the photoresist layer 120 are different, it may not only affect the surface physical or chemical properties of the liquid passing through the microchannel. The function of the metal layer 122 and the SU-8 photoresist layer 12 is not easily controlled by using the same material, so that the application of the microchannel is greatly limited.
圖3A至3C顯示第三種傳統之微通道結構之製造過 程的示意圖。首先，先將第一層购光阻層12〇旋塗於 基材110上’ ^義出微通道13Q的圖形之後顯影，以形 成圖3A之結構。接著，如圖3B所示，利用一 或層壓lamination)-層薄臈材料的機胃16〇將一種^ 光阻材料（如RiW，壓在微通道上面形成上蓋的結 構:再曝光顯影’即可定義出一嵌入式微通道，如圖3C 所不。然而’此種微通道結構，不但上蓋容易剝離，而 且在疊層期間’貞器間接施加於基材上之堡力彳可能破 壞基材上所形成之元件。 胃中華民國專利TW593 128揭露一種利用調整曝光劑 量（曝光時間及強度）及抗反射層來形成内崁式微通道之 方法其中，基板與SU-8光阻層之間需要形成有一抗反 射層，以確保微流通中間的光阻層不會交連，可以於顯 &夺移除由於，在形成此微通道結構中必須使用此抗 反射層而此抗反射層與SU-8光阻層的材料性質不同， 不但可能會影響通過微通道之液體產生不同的表面物理 或化學的作用，而且此此抗反射層與su_8的連結特性， 亦不若使用同一材料容易控制，所以使得該微通道之應 10 1288117 用範圍受到相當大之侷限。 【發明内容】 因此，本發明之一個目 道之形成方法，藉由控制曝 微型通道可以一體成形，且 通道中。 的係提供一種内嵌式微型通 光光源之波長，使得内搬式 不需利用中間產物存在於微Figures 3A through 3C show schematic views of the fabrication process of a third conventional microchannel structure. First, the first layer of the photoresist layer 12 is spin-coated on the substrate 110 to develop the pattern of the microchannel 13Q to form the structure of Fig. 3A. Next, as shown in FIG. 3B, a photoresist material (such as RiW, which is formed on the microchannel to form an upper cover: re-exposure development) is used by laminating or laminating a thin layer of material. An embedded microchannel can be defined, as shown in Figure 3C. However, 'this microchannel structure not only allows the upper cover to be easily peeled off, but also during the lamination, the indirect application of the device to the substrate may damage the substrate. The formed component. Stomach Republic of China Patent TW593 128 discloses a method for forming an intrinsic microchannel by adjusting an exposure dose (exposure time and intensity) and an anti-reflection layer, wherein a need exists between the substrate and the SU-8 photoresist layer. The anti-reflection layer ensures that the photoresist layer in the middle of the micro-flow does not cross-link, and can be removed and removed. In the formation of the micro-channel structure, the anti-reflection layer and the SU-8 light must be used. The material properties of the resist layer are different, which may not only affect the physical or chemical effects of different surfaces of the liquid passing through the microchannel, but also the connection characteristics of the anti-reflective layer and su_8, and the use of the same material. The material is easy to control, so that the range of the 10 1288117 of the microchannel is considerably limited. [Invention] Therefore, a method for forming the invention can be integrally formed by controlling the exposure microchannel, and in the channel The system provides a wavelength of an in-line micro-light source, so that the internal moving type does not need to use intermediate products in the micro
/為讓本發明之上述目的、特徵、和優點能更明顯易 懂，下文特舉數個較佳實施例，並配合所附圖式，作詳 細說明如下。 _ :達上述目的’本發明提供一種内嵌式微型通道之 形成方法，包含以下步驟一 1厂、基材上形成一負光阻 =一Γ—第—光源透過H罩層對負光阻層曝光 、 一深度以形成一第一感光部分；（C)以一第二光 過-第二光罩層對負光阻層曝光至一第二深度以形 成、-第二感光部分，第二深度小於第一深度，第二光源 之波長小於第一光源之波長；及⑷移除第一感光部分與 第二感光部分以外之負光阻層，以形成一微通道。 【實施方式】 圖4顯示光源波長與su_8之光吸收率之曲線圖。本 案發明人於研究過程中，發現811_8材料在受到波長35叱瓜 或以上的紫外光照射時，其光線吸收率相當小，以至於 曝光的能量可以直達光阻層的底部，使整層的su_s光阻 1288117 均可交聯。然而，當使用波長在254nm左右或以下的紫 外光光源知射時’由於SU-8對此光線吸收率相當大，使 得上層的光阻層會因此吸收大部分的光源能量，使下層 的SU-8因無法獲得足夠的光源能量而保持未曝光前的未 交聯狀態。 本案發明人經實驗證明，藉由波長約254nm的紫外 光來照射SU-8,可以控制su_8交連（cr〇ss_Hnking)的深 度，藉以形成内嵌式微型通道之上蓋。 籲 圖5 A至5D顯示依據本發明較佳實施例之内嵌式微 型通道之製造過程的示意圖。本發明之内嵌式微型通道 之形成方法，包含以下步驟。首先，於一基材1〇上形成 一負光阻層20，如圖5A所示。基材係由石英、玻璃、 南分子材料、環狀烯烴類聚合物（c〇c)或矽所製成。負光 阻層20係由SU-8所製成。 、 然後，以一第一光源3〇透過一第一光罩層4〇對負 光阻層20 #光到達一第―⑨度m α形成一第一感光部 • 分22，如圖5Β所示。第一光罩層40可以包含一玻璃42 ， 及用以遮光之一金屬層（譬如鉻層）44。接著，以一第二 • 光源50透過一第二光罩層60對負光阻層20曝光至一第 二深度D2以形成一第二感光部分24，如圖5C所示。第 一感光部分22與第二感光部分24互相連接，特別是呈 現一種無縫連接之狀態。第二光罩層6〇係類似於第一光 罩層40，只是具有不同的圖案。第二光源5〇之波長小 於第一光源30之波長，而第二深度D2小於第一深度Di。 最後，移除第一感光部分22與第二感光部分24以 12 1288117 外之負光阻層20，以形成_ 影而達成。 微通道46。此步驟可藉由顯The above described objects, features and advantages of the present invention will become more apparent and understood. _: to achieve the above purpose 'The present invention provides a method for forming an in-line microchannel, comprising the following steps: 1, a negative photoresist is formed on the substrate, and the first light source is transmitted through the H cover layer to the negative photoresist layer. Exposing, a depth to form a first photosensitive portion; (C) exposing the negative photoresist layer to a second depth by a second light-to-second mask layer to form, - a second photosensitive portion, a second depth Less than the first depth, the wavelength of the second light source is less than the wavelength of the first light source; and (4) removing the negative photoresist layer other than the first photosensitive portion and the second photosensitive portion to form a microchannel. [Embodiment] FIG. 4 is a graph showing the wavelength of a light source and the light absorptance of su_8. During the research, the inventor of the present invention found that the light absorption rate of 811_8 material when irradiated by ultraviolet light with a wavelength of 35 叱 or more is so small that the energy of exposure can reach the bottom of the photoresist layer, so that the whole layer of su_s The photoresist 1288117 can be crosslinked. However, when using an ultraviolet light source with a wavelength of about 254 nm or less, the light absorption rate of SU-8 is quite large, so that the upper photoresist layer absorbs most of the light source energy, so that the lower layer SU- 8 The uncrosslinked state before unexposed is maintained because sufficient light source energy cannot be obtained. The inventors of the present invention have experimentally proved that by irradiating SU-8 with ultraviolet light having a wavelength of about 254 nm, the depth of su_8 cross-linking (cr〇ss_Hnking) can be controlled, thereby forming an in-cell microchannel upper cover. 5A to 5D are views showing a manufacturing process of an in-line microchannel in accordance with a preferred embodiment of the present invention. The method of forming the in-line microchannel of the present invention comprises the following steps. First, a negative photoresist layer 20 is formed on a substrate 1 as shown in Fig. 5A. The substrate is made of quartz, glass, a south molecular material, a cyclic olefin polymer (c〇c) or ruthenium. The negative photoresist layer 20 is made of SU-8. Then, a first light source 3 〇 is passed through a first mask layer 4 〇 to the negative photoresist layer 20 to reach a 9th degree α α to form a first photosensitive portion • 22, as shown in FIG. . The first mask layer 40 may include a glass 42 and a light shielding layer of a metal layer (such as a chrome layer) 44. Next, a second light source 50 is exposed through a second mask layer 60 to the second photoresist layer 20 to a second depth D2 to form a second photosensitive portion 24, as shown in FIG. 5C. The first photosensitive portion 22 and the second photosensitive portion 24 are connected to each other, in particular, in a state of seamless connection. The second mask layer 6 is similar to the first mask layer 40 except that it has a different pattern. The second source 5 〇 has a wavelength less than the wavelength of the first source 30 and the second depth D2 is less than the first depth Di. Finally, the first photosensitive portion 22 and the second photosensitive portion 24 are removed by the negative photoresist layer 20 outside the 12 1288117 to form a shadow. Microchannel 46. This step can be shown by
於上述實施例中，复φ笛 一中第一光源及第一光源之光線 輸出方向垂直於基材。於另一 力貫施例中，弟一光源及第 二光源之光線輸出方向亦可不垂直於基材。 圖6A至6D顯示依據本發明另-實施例之内嵌式微 型通道之製造過程的示意圖。本實施例之㈣式微型通 道係應用於喷墨印表頭之嘴孔結構。首先，於-基材10 上形成-負光阻層20,如圖6A所示。基材係由石英、 玻璃、高分子材料、環狀烯烴類聚合物（c〇c)或矽所製成。 負光阻層20係由SU-8所製成。 然後，以一第一光源3〇透過一第一光罩層4〇對負 光阻層20曝光到達一第一深度D1 _一第一感光部 分22,如圖6B所示。第一光罩層利可以包含一玻璃ο 及用以遮光之一金屬層（譬如鉻層）44。接著，以一第二 光源50透過一第二光罩層6〇對負光阻層川曝光至一= 二深度D2以形成一第二感光部分24，如圖6(：所示。第 二光罩層60係類似於第一光罩層4〇，只是具有不同的 圖案。第二光源50之波長小於第一光源3〇之波長，而 第二深度D2小於第一深度〇 1。 最後，移除第一感光部分22與第二感光部分24以 外之負光阻層20，以形成一微通道46。此步驟可藉由顯 〜而達成。微通道46具有較大部分46A以供液體流動， 並具有較小部分46B以供液體喷出。 表τ、上所述，本發明提出一種利用SU-8厚膜光阻之新 13 1288117 的製程’用以一體形成内嵌式微型通道，而不需要利用 黏貼製程來將内嵌式微型通道予以蓋合。因此，本發明 之内嵌式微型通道不會有上蓋剝離的現象，且基板上所 形成之元件亦不會在製造過程中受到壓力而損壞。 在較佳實施例之詳細說明中所提出之具體實施例僅 用以方便㉟明本發明之技術内纟，而非將本發明狹義地 限制於上述實施例，在不超出本發明之精神及以下申技 專利範圍之情況’所做之種種變化實施，皆屬於本發 之範圍。 14 1288117 【圖式簡單說明】 圖1A至ic顯示第一種傳統之微通道結構之製造過 程的示意圖。 圖2A至2C顯示第二種傳統之微通道結構之製造過 程的示意圖。 圖3A至3C顯示第三種傳統之微通道結構之製造過 各的不意圖。 圖4顯示光源波長與su_8之光吸收率之曲線圖。 圖5A至5D顯示依據本發明較佳實施例之内嵌式微 型通道之製造過程的示意圖。 圖6 A至6D顯示依據本發明另一實施例之内嵌式微 型通道之製造過程的示意圖。 120〜SU-8光阻層 130〜微通道 150〜第二層SU-8光阻層 160〜機器 主要元件符號說明】 D1〜第一深度 10〜基材 22〜第一感光部分 30〜第一光源 42〜玻璃 46〜微通道 60〜第二光罩層 D2〜第二深度 2〇〜負光阻層 24〜第二感光部分 4〇〜第一光罩層 44〜金屬層 5 0〜第二光源 〜基材 122〜金屬層 140〜材料 15In the above embodiment, the light output direction of the first light source and the first light source in the complex φ flute is perpendicular to the substrate. In another embodiment, the light output direction of the light source and the second light source may not be perpendicular to the substrate. Figures 6A through 6D are schematic views showing the manufacturing process of the in-line microchannel in accordance with another embodiment of the present invention. The microchannel of the (4) type of the present embodiment is applied to the nozzle hole structure of the ink jet printer head. First, a negative photoresist layer 20 is formed on the substrate 10 as shown in Fig. 6A. The substrate is made of quartz, glass, a polymer material, a cyclic olefin polymer (c〇c) or ruthenium. The negative photoresist layer 20 is made of SU-8. Then, the negative photoresist layer 20 is exposed to a first depth D1_a first photosensitive portion 22 by a first light source 3'' through a first mask layer 4'', as shown in FIG. 6B. The first mask layer may comprise a glass ο and a light shielding layer (such as a chrome layer) 44. Then, a second light source 50 is exposed through a second mask layer 6 to expose the negative photoresist layer to a second depth D2 to form a second photosensitive portion 24, as shown in FIG. 6 (: second light). The cover layer 60 is similar to the first mask layer 4〇 except that it has a different pattern. The second source 50 has a wavelength smaller than the wavelength of the first source 3〇, and the second depth D2 is smaller than the first depth 〇 1. Finally, shift The negative photoresist layer 20 except the first photosensitive portion 22 and the second photosensitive portion 24 is formed to form a microchannel 46. This step can be achieved by displaying the microchannel 46 having a larger portion 46A for liquid to flow. And having a smaller portion 46B for liquid ejection. Table τ, supra, the present invention proposes a process for using the SU-8 thick film photoresist of the new 13 1288117 to integrally form an in-line microchannel without It is necessary to use an adhesive process to cover the in-line microchannel. Therefore, the in-line microchannel of the present invention does not have the phenomenon that the upper cover is peeled off, and the components formed on the substrate are not subjected to pressure during the manufacturing process. Damaged. As mentioned in the detailed description of the preferred embodiment The specific embodiments are merely used to clarify the technical scope of the present invention, and the present invention is not limited to the above embodiments, and various types are made without departing from the spirit of the present invention and the scope of the following claims. The implementation of the changes is within the scope of the present invention. 14 1288117 [Simple Description of the Drawings] Figures 1A to ic show schematic views of the manufacturing process of the first conventional microchannel structure. Figs. 2A to 2C show the second conventional microchannel structure. Figure 3A to 3C show the manufacture of a third conventional microchannel structure. Figure 4 shows a plot of the source wavelength and the light absorptivity of su_8. Figures 5A through 5D show the invention in accordance with the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6A to 6D are diagrams showing a manufacturing process of an in-cell microchannel according to another embodiment of the present invention. 120~SU-8 photoresist layer 130 ~ micro channel 150 ~ second layer SU-8 photoresist layer 160 ~ machine main component symbol description] D1 ~ first depth 10 ~ substrate 22 ~ first photosensitive portion 30 ~ first light source 42 ~ glass 46 ~ micro channel 60~second mask layer D2~second depth 2〇~negative photoresist layer 24~second photosensitive portion 4〇~first mask layer 44~metal layer 5 0~second light source~substrate 122~metal layer 140 ~ material 15