1285418 ί 4 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種影像感測模組封裝結構，特別是有 .關於一種不需基板與打線的互補式金屬氧化半導體影像感測 模組封裝結構’因此可以有效的降低成本與解決打線製程中 ' 所產生的微塵(particle)問題。 【先前技術】1285418 ί 4 IX. Description of the Invention: [Technical Field] The present invention relates to an image sensing module package structure, and more particularly to a complementary metal oxide semiconductor image sensing mode that does not require a substrate and a wire. The group package structure 'is therefore effective in reducing costs and solving the problem of particle generation in the wire-making process. [Prior Art]
I 隨著數位相機與手機相機的問世與普及化，做為數位相機與手機相 機重要零件之一的影像感測模組(Camera Module)的需求量也隨之日 益增加。一般來說，影像感測模組依其製程的差異可以分為互補式金 屬氧化半導體影像感測模組(COMS Camera Module)與電荷藕合影像感 測模組(CCD Camera Module)兩類。兩種影像感測模組各有其優點， 若單以整會度而言，互補式金屬氧化半導體影像感測模組的整合度較 尚，但是若以影像品質而論，電待藕合影像感測模組則略勝一籌。因 此，互補式金屬氧化半導體影像感測模組通常被使用在對整合度要求 較高的中階數位相機與手機相機中，而電荷藕合影像感測模組則被使 用在對影像品質要求較南的的南階數位相機與手機相機中。 參照第一圖為一傳統互補式金屬氧化半導體影像感測模組封裝結 構10的剖面示意圖。此一互補式金屬氧化半導體影像感測模組封裝 結構10<以下簡稱CMOS影像感測模組封裝結構），包含一基板12、 一晶片14、一鏡片模組18以及一印刷電路軟板26(FlexiWe Printed circuit)。此一晶片u之一面具有一、感光區域15(sens〇r area)，而 以另面與基板12黏結，並且以打線16(wire bonds)電性連接晶片 14與基板12。鏡片模組18設置在基板12上，以其位於中央之透光 區域19對準晶片14上之感光區域15，並且對準透光區域μ上的鏡 ⑧ 5 ‘ 1285418 片20。此外，基板12設置於印刷電路軟板26，並且印刷電路軟板26 上還設置有數個被動元件22、24與連接器（c〇nnector)28。 然而，現今的CMOS影像感測模組不僅僅用於數位相機上也運用於 體積較小的手機械上，並且對於數位相機也逐紐要求要輕、薄、 ί因此’這樣—個傳統刪影像感測模組封裝結 佈 合對蝴卿糊娜、fs 做為::=結構，其，基板 【發明内容】 鐘於上述的問題，本發明之 、、續裝結構，可以有效地降低 =為知供—影像感測模 求 使數位相機與手機相機符合輕：感:則模組的封裝體積，以 / 紐、小而易於攜帶的要 本發明之另一目的為提供一 組封裝結構，因此不但可、用基板的影像感測模 同時可以降低封裝所需的成本。❼像麵模組的封裝製程， 根據上述目的，本發 ί ’包含—晶片與—鏡片模組。此種^像感測模組封裝結 奇面，其中主動面上且有一 曰曰片具有一主動面與一 ;卜：，並且有數個接點設置背面：個接塾配置於感光區 電導貫孔電性連接至主動 外’此-晶片具有數個 之接墊與背面上相對應之接 ⑧ 6 ^1285418 1 i ^ 點。鏡片模組設置於晶片之該主動面上，並且具有一透光區 域對應於晶片之感光區，使得光線可以由此透光區域而到達 晶片的感光區而被感應。此一像感測模組封裝結構可以直接 與印刷電路軟板電性連接，無需在藉由一基板來做為一與外 / . 界電路連結的中介或做為一電路佈局的工具。 因此，利用上述本發明之影像感測模組封裝結構，因為 不需要一基板基板來做為一與外界電路連結的中介或做為一 電路佈局的工具，所以省略了與基板連接與打線的步驟而簡 • 化了封裝製程，同時也節省了成本。此外，因為本發明之像 感測模組封裝結構不需基板，故可以大幅地降低影像感測模. 組的封裝體積。 【實施方式】 本發明的一些實施例詳細描述如下。然而，除了該詳細描 述外，本發明還可以廣泛地在其他的實施例施行。亦即，本 發明的範圍不受已提出之實施例的限制，而以本發明提出之 申請專利範圍為準。其次，當本發明之實施例圖示中的各元 件或結構以單一元件或結構描述說明時，不應以此作為有限 定的認知，即如下之說明未特別強調數目上的限制時本發明 之精神與應用範圍可推及多數個元件或結構並存的結構與方 法上。再者，在本說明書中，各元件之不同部分並沒有完全 依照尺寸繪圖，某些尺度與其他相關尺度相比或有被誇張或 是簡化，以提供更清楚的描述以增進對本發明的理解。而本 發明所沿用的現有技藝，在此僅做重點式的引用，以助本發 明的闡述。 參照第二圖，為本發明之一較佳實施例的影像感測模組 封裝結構100的剖面示意圖。此一影像感測模組封裝結構1〇〇 •1285418 ♦ t 一 包含一晶片102，其具有一主動面104與一對應於主動面ι〇4 的背面106。在主動面104上，設置有一感光區1〇8做為感 測光線之用並且設置有數個接墊110於感光區108外圍，在 背面106上，則設置有數個對應於主動面104上接墊ι10的 • 接點114。此外，藉由數個貫穿晶片102的導電貫孔112電 性連接主動面104上的接墊110與背面106上相對應的接點 • 114，形成一電路可以直接於外界電路連結不需經打線連接至 基板，再以基板為中介重新做一電路佈局而與外界電路連接。 φ 鏡片模組120設置於晶片102之主動面1〇4上，此一鏡 片模組120具有一透光區域117對應於晶片1〇2主動面1〇4 上的感光區108，可供外界光線穿過鏡片模組120而被感光 區108感測。鏡片模組120由一外罩116與套筒118所組成， 此一外罩116有一開口可以與套筒118結合，並且鏡片模組 120的透光區域117設置於外罩116中而對應外罩116的開 口。此外，套筒118具有一中空部位，並且在物中空部位中 設置有一個或是數個透鏡119，使得外界光線得以經套筒118 内鏡片119與外罩116内透光區域117而到達感光區1〇8。鏡 片模組120藉由一膠材115設置於外罩116底部與晶片102 Φ 的主動面204之間，而固定於晶片102之主動面1〇4上。 多晶片背面106的接點114上設置有導電凸塊122用以 與電路板124上電路連接，並且固定於電路板122上。然而 在本發明之另一實施例中’可以以異方性導電膠(Anisotropic Conductive Film; ACF)取代導鼋凸塊122，電性連接晶片1〇2 背面106的接點122與電路板124上的電路（圖中未示），並 且將晶片102固定於電路板122上。此外，如同第二圖所示， 在電路板122上依產品與設計需要可以設置一個或數個被動 元件126 〇 1285418 在本實施例中，其所用之晶片102係為一互補式金屬氧 化半導體晶片（CMOS Image Sensor Chip; CIS Chip)，但不 以此為限，而電路板124為一印刷電路軟板干匕乂丨13丨6?|1"6€1 circuit)，但也不以此為限。此外，在本實施例中，鏡片模組 120之透光區域117係為一玻璃材質或透明樹脂的透光片， 但並不以此為限，在其他實施例中鏡片模組120之透光區域 117可以為一開口。 參照第三圖，為本發明之另一實k例的影像感測模組封 裝結構200的剖面示意圖。影像感測模組封裝結構200與第 一圖所不之影像感測模組封裝結構100大致相同，同樣由一 晶片202、一鏡片模組220以及一電路板224所組成。除了 在晶片202之主動面204上有一感光區208與數個接墊210，· 以及在背面206上接點214外，還有數個導電貫孔212貫穿 晶片202而電性連接接墊210與接點.214，以及數個貫孔211 貫穿晶片202 〇 鏡片模組220同樣由一外罩216與套筒218所組成，此 一外罩116以一開口可以與内含透鏡219之套筒218結合， 並且外罩116中之透光區域217對應外罩216的開口以及套 筒218之透鏡。此外，在外罩216底部有數個插銷221對應 晶片202上之貫孔211，鏡片模組220藉外罩216底部的插 銷221插入貫孔211中，以固定鏡片模組220於晶片202上。 另外在外罩216底部與晶片202的主動面204之間設置有一 膠材215，用以更加固家鏡片模組220於晶片202上。然而， 此一膠材215不僅僅可以設置於外罩216底部與晶片202的 主動面204之間，在本發明之其它實施例中，更可以將膠材 215設置於貫孔211與插銷221之間，或是晶片202的背面206 * 1285418 « - t 與凸出背面206的插銷221部份之間。 晶片202藉由背面206的接點214上之導電凸塊222固 定於一設置有被動元件之電路板224上，並且電路板124上 - 電路（圖中未示）做一電性連接。然而，在其他實施例中，同 樣可以以異方性導電膠取代導電凸塊222來達到相同的效 ’ 果。. 晶片202與電路板224分別為一互補式金屬氧化半導體 晶片與印刷電路軟板，但不以此為限。此外，在本實施例中， 雖然鏡片模組220之透光區域217係為一玻璃材質或透明樹 脂的透光片，但並不以此為限，在其他實施例中鏡片模組220 之透光區域217可以為一開口。 參照第四圖，為本發明之另一實施例的影像感測模組封 裝結構300的剖面示意圖。影像感測模組封裝結構300與第 三圖所示之影像感測模組封裝結構100大致相同，同樣由一 晶片202、一鏡片模組220以及一電路板224所組成，並且 同樣藉由外罩216底部的插銷221插入貫孔211中，以固定 鏡片模組220於晶片202上。然而，與第三圖不同的僅僅是 在本實施例中，以貫孔211取代第三圖中影像感測模組封裝 結構200的導電貫孔212而與晶片202主動面204上的接墊 210連接，並且以插銷221接近晶片202背面206之一端做 為接點214，而以插銷221電性連接接墊210與接點214，因 此’不需再製作導電貫孔而可以簡化製程。在本實施例中， 晶片202藉由一異方性導電膠223而固定於電路板224上， 同時藉由此異方性導電膠223電性連接晶片202背面206上 之接點214，即插銷221接近晶片202背面2〇6之一端，與 電路板224上之電路（圖中未示）。 1285418 此外，雖然於本實施例中，插銷221之一端貫穿晶片202 而與晶片202之背面206切齊而裸露於外以做為接點214， 但是在其他實施例中，插銷221之一端貫穿晶片2〇2而凸出 於晶片202之背面206，或内縮於晶片202之背面206，再以 異方性導電膠223電性連接電路板224上之電路（圖中未示）。 再者，在本發明之其它實施例中，仍然可以於晶片2〇2之背 面206上設置與貫孔211連接之接點，再以插銷221插入貫 ^ 孔211而電性連接主動面204上之接墊與背面206之接點， • 並且以導電凸塊或是異方性導電膠電性連接電路板224上之 電路（圖中未示）。 上述之各個實施例中所述之導電貫孔與貫孔係以蝕刻、 鑽孔或是雷射鑽孔等方式貫穿整個晶片所形成的，並且貫孔 形成的區域為晶片的周邊無電路區域如切割道等。 由上述實施例可知，本發明之影像感測模組封裝結構利 用導電貫孔將主動面之電路做一電路的重佈於背面，而直接 • 利用導電凸塊或異方性導電膠與電路板電路連結並固定其 上。因此，無需使用基板而可以節省成本，並且因為少了占 空間的基板使得封裝體積得以大幅縮小，另外，無須晶片與 基板電路連結以及固定於基板等製程，因而簡化了影像感測 模組封裝製程。 〔圖式簡單說明】 第一圖為傳統之影像感測模組封裝結構的剖面示意圖。 第二圖為本發明之一實施例的影像感測模組封裝結構的剖面 示意圖。 ⑧ 11 1285418 第三圖為本發明之另一實施例影像感測模組封裝結構的剖面 示意圖。 * 第四圖為本發明之又一實施例影像感測模組封裝結構的剖面 \ 示意圖。 .【主要元件符號說明】 ίο傳統影像感測模組封裝結構 12基板 14晶片 15感光區 Ιό打線 18鏡片模組 19透光區域 20鏡片 22、24被動元件 26印刷電路軟板 28連接器 100影像感測模組封裝結構 102晶片 104主動面 106背面 108感光區 12 ⑧ 1285418I With the advent and popularity of digital cameras and mobile phone cameras, the demand for the Camera Module, which is one of the important components of digital cameras and mobile phones, has also increased. Generally, the image sensing module can be classified into a complementary metal oxide semiconductor image sensing module (COMS Camera Module) and a charge coupled image sensing module (CCD Camera Module) according to the difference in the manufacturing process. The two image sensing modules have their own advantages. If the degree of integration is sufficient, the integration of the complementary metal oxide semiconductor image sensing module is better, but if the image quality is used, the image is to be combined. The sensing module is slightly better. Therefore, the complementary metal oxide semiconductor image sensing module is usually used in mid-range digital cameras and mobile phone cameras that require high integration, while the charge-coupled image sensing module is used in image quality requirements. South's southern-order digital camera with a mobile phone camera. Referring to the first figure, a cross-sectional view of a conventional complementary metal oxide semiconductor image sensing module package structure 10 is shown. The complementary metal oxide semiconductor image sensing module package structure 10 < hereinafter referred to as CMOS image sensing module package structure comprises a substrate 12 , a wafer 14 , a lens module 18 and a printed circuit board 26 ( FlexiWe Printed circuit). One of the masks of the wafer u has a photosensitive region 15 and is bonded to the substrate 12 on the other side, and the wafer 14 and the substrate 12 are electrically connected by wire bonds 16 . The lens module 18 is disposed on the substrate 12 with its centrally located light transmissive region 19 aligned with the photosensitive region 15 on the wafer 14 and aligned with the mirror 8 5 ' 1285418 sheet 20 on the light transmissive region μ. Further, the substrate 12 is disposed on the printed circuit board 26, and the printed circuit board 26 is further provided with a plurality of passive components 22, 24 and a connector 28. However, today's CMOS image sensing modules are not only used on digital cameras but also on smaller hand-held machines, and for digital cameras, they are also required to be light, thin, and oh. The sensor module package is bonded to the butterfly, fs as::=structure, its, the substrate [invention] The problem of the above, the continuation structure of the invention can be effectively reduced = Knowing that the image-sensing model makes the digital camera and the mobile phone camera lighter: Sense: the package size of the module is easy to carry with /, small, and small. Another object of the present invention is to provide a set of package structures, Not only can the image sensing mode of the substrate be used, but also the cost required for the package can be reduced. In the packaging process of the image surface module, according to the above object, the present invention includes a wafer and a lens module. The ^ image sensing module package has a strange surface, wherein the active surface has a cymbal having an active surface and a; a: and a plurality of contacts are provided on the back surface: one of the contacts is disposed in the photosensitive region through the conductive hole Electrically connected to the active external 'this-wafer has a number of pads corresponding to the 8 6 ^ 1285418 1 i ^ point corresponding to the back. The lens module is disposed on the active surface of the wafer and has a light transmissive region corresponding to the photosensitive region of the wafer such that light can be induced by the light transmitting region to reach the photosensitive region of the wafer. The image sensing module package structure can be directly electrically connected to the printed circuit board, and does not need to be used as an intermediary for external circuit connection or as a circuit layout tool by a substrate. Therefore, by using the image sensing module package structure of the present invention, since a substrate substrate is not required as an intermediary for connecting with an external circuit or as a circuit layout tool, the steps of connecting and wiring the substrate are omitted. Jane has simplified the packaging process while also saving costs. In addition, since the image sensing module package structure of the present invention does not require a substrate, the package volume of the image sensing mode group can be greatly reduced. [Embodiment] Some embodiments of the present invention are described in detail below. However, the present invention may be widely practiced in other embodiments in addition to the detailed description. That is, the scope of the present invention is not limited by the embodiments which have been proposed, and the scope of the patent application of the present invention shall prevail. In the following, when the elements or structures in the embodiments of the present invention are described in terms of a single element or structure, the present invention should not be construed as limited. The spirit and scope of application can be derived from the structure and method in which many components or structures coexist. Furthermore, in the present specification, various parts of the various elements are not drawn in full size, and certain dimensions may be exaggerated or simplified in comparison with other related dimensions to provide a clearer description to enhance the understanding of the present invention. The prior art, which is used in the present invention, is only referred to herein by reference to the present invention. Referring to the second figure, a cross-sectional view of an image sensing module package structure 100 in accordance with a preferred embodiment of the present invention. The image sensing module package structure 1 1285418 ♦ t includes a wafer 102 having an active surface 104 and a back surface 106 corresponding to the active surface 〇4. On the active surface 104, a photosensitive area 1 〇 8 is provided for sensing light and a plurality of pads 110 are disposed on the periphery of the photosensitive area 108. On the back surface 106, a plurality of pads corresponding to the active surface 104 are disposed. Ι10 • Contact 114. In addition, the plurality of conductive vias 112 extending through the wafer 102 are electrically connected to the pads 110 on the active surface 104 and the corresponding contacts on the back surface 106 to form a circuit that can be directly connected to the external circuit without wiring. Connected to the substrate, and then re-made a circuit layout with the substrate as the medium to connect with the external circuit. The φ lens module 120 is disposed on the active surface 1〇4 of the wafer 102. The lens module 120 has a light-transmissive region 117 corresponding to the photosensitive region 108 on the active surface 1〇4 of the wafer 1 2 for external light. It is sensed by the photosensitive region 108 through the lens module 120. The lens module 120 is composed of a cover 116 and a sleeve 118. The cover 116 has an opening for engaging with the sleeve 118, and the light-transmissive region 117 of the lens module 120 is disposed in the cover 116 to correspond to the opening of the cover 116. In addition, the sleeve 118 has a hollow portion, and one or a plurality of lenses 119 are disposed in the hollow portion of the object, so that external light can reach the photosensitive region 1 through the lens 119 and the light-transmitting region 117 in the outer cover 116 of the sleeve 118. 〇 8. The lens module 120 is disposed on the active surface 1〇4 of the wafer 102 by a glue 115 disposed between the bottom of the cover 116 and the active surface 204 of the wafer 102 Φ. Conductive bumps 122 are disposed on the contacts 114 of the polysilicon back side 106 for electrical connection to the circuit board 124 and to the circuit board 122. However, in another embodiment of the present invention, the conductive bumps 122 may be replaced by an anisotropic conductive film (ACF), and the contacts 122 on the back surface 106 of the wafer 1 2 are electrically connected to the circuit board 124. The circuit (not shown) and the wafer 102 are attached to the circuit board 122. In addition, as shown in the second figure, one or several passive components 126 854 1285418 may be disposed on the circuit board 122 according to product and design requirements. In this embodiment, the wafer 102 used is a complementary metal oxide semiconductor wafer. (CMOS Image Sensor Chip; CIS Chip), but not limited to this, and the circuit board 124 is a printed circuit board dry 13丨6?|1"6€1 circuit), but it is not limit. In addition, in the present embodiment, the light-transmitting region 117 of the lens module 120 is a light-transmissive sheet of glass material or transparent resin, but is not limited thereto. In other embodiments, the light-transmitting lens module 120 is transparent. Region 117 can be an opening. Referring to the third figure, a cross-sectional view of an image sensing module package structure 200 of another embodiment of the present invention is shown. The image sensing module package structure 200 is substantially the same as the image sensing module package structure 100 of the first embodiment, and is also composed of a chip 202, a lens module 220, and a circuit board 224. In addition to a photosensitive region 208 and a plurality of pads 210 on the active surface 204 of the chip 202, and a contact 214 on the back surface 206, a plurality of conductive vias 212 extend through the chip 202 and electrically connect the pads 210 to the interface. Point 214, and a plurality of through holes 211 extending through the wafer 202. The lens module 220 is also composed of a cover 216 and a sleeve 218. The cover 116 is coupled to the sleeve 218 containing the lens 219 by an opening, and The light transmissive region 217 in the outer cover 116 corresponds to the opening of the outer cover 216 and the lens of the sleeve 218. In addition, a plurality of pins 221 are formed on the bottom of the cover 216 to correspond to the through holes 211 of the chip 202. The lens module 220 is inserted into the through holes 211 through the pins 221 at the bottom of the cover 216 to fix the lens module 220 on the wafer 202. Additionally, a glue 215 is disposed between the bottom of the cover 216 and the active surface 204 of the wafer 202 for further securing the lens module 220 to the wafer 202. However, the adhesive 215 can be disposed between the bottom of the outer cover 216 and the active surface 204 of the wafer 202. In other embodiments of the present invention, the adhesive 215 can be disposed between the through hole 211 and the pin 221. Or, the back side of the wafer 202 206 * 1285418 « - t is between the portion of the pin 221 that protrudes from the back side 206. The chip 202 is fixed on a circuit board 224 provided with a passive component by a conductive bump 222 on the contact 214 of the back surface 206, and an electrical connection is made on the circuit board 124 (not shown). However, in other embodiments, the conductive bumps 222 may be replaced with an anisotropic conductive paste to achieve the same effect. The chip 202 and the circuit board 224 are respectively a complementary metal oxide semiconductor wafer and a printed circuit board, but are not limited thereto. In addition, in this embodiment, although the light-transmitting region 217 of the lens module 220 is a transparent material of a glass material or a transparent resin, it is not limited thereto. In other embodiments, the lens module 220 is transparent. The light area 217 can be an opening. Referring to the fourth figure, a cross-sectional view of an image sensing module package structure 300 according to another embodiment of the present invention is shown. The image sensing module package structure 300 is substantially the same as the image sensing module package structure 100 shown in the third figure, and is also composed of a chip 202, a lens module 220 and a circuit board 224, and is also provided by a cover. A pin 221 at the bottom of the 216 is inserted into the through hole 211 to fix the lens module 220 on the wafer 202. However, in the embodiment, the conductive vias 212 of the image sensing module package structure 200 in the third embodiment are replaced with the vias 211 and the pads 210 on the active surface 204 of the wafer 202. The connection is made, and one end of the back surface 206 of the chip 202 is used as the contact 214 by the pin 221, and the pad 210 and the contact 214 are electrically connected by the pin 221, so that the process can be simplified without making a conductive through hole. In this embodiment, the wafer 202 is fixed on the circuit board 224 by an anisotropic conductive paste 223, and the contact 214 on the back surface 206 of the wafer 202 is electrically connected by the anisotropic conductive adhesive 223, that is, the latch. 221 is adjacent to one end of the back surface 2 of the wafer 202, and the circuit on the circuit board 224 (not shown). 1285418 In addition, in the present embodiment, one end of the pin 221 extends through the wafer 202 and is aligned with the back surface 206 of the wafer 202 to be exposed as a contact 214. However, in other embodiments, one end of the pin 221 extends through the wafer. 2 〇 2 protrudes from the back surface 206 of the wafer 202, or shrinks into the back surface 206 of the wafer 202, and then electrically connected to the circuit (not shown) on the circuit board 224 by the anisotropic conductive adhesive 223. Furthermore, in other embodiments of the present invention, the contacts connected to the through holes 211 can be disposed on the back surface 206 of the wafer 2〇2, and then the pins 221 are inserted into the through holes 211 to be electrically connected to the active surface 204. The pads are connected to the back surface 206, and electrically connected to the circuit board 224 by a conductive bump or an anisotropic conductive paste (not shown). The conductive through holes and the through holes described in the above embodiments are formed by etching, drilling or laser drilling, etc., and the through holes are formed in a peripheral circuit-free area such as a wafer. Cutting the road, etc. It can be seen from the above embodiments that the image sensing module package structure of the present invention utilizes a conductive via hole to re-distribute the circuit of the active surface to the back surface, and directly utilizes the conductive bump or the anisotropic conductive paste and the circuit board. The circuit is connected and fixed to it. Therefore, the substrate can be saved without using the substrate, and the package volume can be greatly reduced because the substrate is small in space, and the process of the image sensing module is simplified without the need for the wafer to be connected to the substrate circuit and fixed to the substrate. . [Simple description of the drawings] The first figure is a schematic cross-sectional view of a conventional image sensing module package structure. The second figure is a schematic cross-sectional view of a package structure of an image sensing module according to an embodiment of the present invention. 8 11 1285418 is a cross-sectional view showing a package structure of an image sensing module according to another embodiment of the present invention. The fourth figure is a cross-sectional view of a package structure of an image sensing module according to still another embodiment of the present invention. [Main component symbol description] ίο Traditional image sensing module package structure 12 substrate 14 wafer 15 photosensitive area tapping line 18 lens module 19 light transmitting area 20 lens 22, 24 passive component 26 printed circuit board 28 connector 100 image Sensing module package structure 102 wafer 104 active surface 106 back 108 photosensitive area 12 8 1285418
110接墊 112導電貫孔 114接點 116外罩 117透光區域 118套筒 119透鏡 120鏡片模組 122導電凸塊 124電路板 126被動元件 200影像感測模組封裝結構 202晶片 204主動面 206背面 208感光區 210接墊 211貫孔 212導電貫孔 214接點 216外罩 13 1285418 217透光區域 218套筒 219透鏡 220鏡片模組 221插銷 222導電凸塊 223異方性導電膠 224電路板 226被動元件 300影像感測模組封裝結構110 pad 112 conductive through hole 114 contact 116 cover 117 light transmission area 118 sleeve 119 lens 120 lens module 122 conductive bump 124 circuit board 126 passive component 200 image sensing module package structure 202 wafer 204 active surface 206 back 208 photosensitive area 210 pad 211 through hole 212 conductive through hole 214 contact 216 cover 13 1285418 217 light transmission area 218 sleeve 219 lens 220 lens module 221 pin 222 conductive bump 223 anisotropic conductive adhesive 224 circuit board 226 passive Component 300 image sensing module package structure