TWI282427B - Substrate testing apparatus with full contact configuration and testing method using the same - Google Patents

Abstract

A substrate testing apparatus with full contact configuration is disclosed. The apparatus includes a top jig, a full-contact transmission substrate and a lower probe plate. The top jig is configured for fully electrically connecting a plurality of first connecting pads on an upper surface of a substrate strip. The full-contact transmission substrate includes a plurality of conductive bumps on a first surface thereof and a plurality of contact pads on a second surface thereof. The conductive bumps are arranged for individually contacting a plurality of second connecting pads on a lower surface of the substrate strip. The contact pads have a pitch larger than the pitch of the conductive bumps to correspond to a plurality of probe pins of the lower probe board so that the probe pins can individually and electrically connect the contact pads. When the full-contact transmission substrate electrically contacts with the lower probe plate, the conductive bumps can electrically contact the substrate strip to electrically test the substrate strip with full contact configuration.

Description

1282427 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a test apparatus for a double-sided electrically conductive substrate, and more particularly to a full-contact substrate test apparatus and an electrical measurement method thereof. Prior art

2. At present, the method for testing the grid array package substrate strip is to electrically test a substrate strip by using a substrate to detect the electrical properties of the substrate strip. Please refer to FIGS. 1 and 2 at the same time. The conventional substrate strip 200 has a dead surface 210 and a lower surface 22, and the upper surface 21 is formed with a plurality of connecting pads 203 for wire bonding or covering. The crystal bonding method is electrically connected to a wafer (not shown), and the lower surface 22 is formed with a plurality of second connecting ports 240 ′ for external electrical transmission, and the first connecting pads 23 are electrically connected. To the corresponding second connection pads 24, the upper surface 21 defines a plurality of sealing regions 2 11 'each of the adhesive regions 2 11 includes a plurality of substrate units 2 1 2 0 . Referring to FIG. 1 , the substrate testing device 1 is conventionally included.

1 is provided with a conductive adhesive 丨 la upper fixture and a plurality of probes under the dial 12, when the substrate strip 2 is electrically tested, the substrate strip is set at the upper treatment Between the device 11 and the lower dial 12, the probes 12a= individually detect the corresponding second connection pads 240, and the conductive diodes are electrically connected to the substrate strips 2 The two of the adhesive areas 211 are connected to the second connection pad 24, and the electrical connection of the corresponding connection pads 23 0 in each of the adhesive zones 211 is detected one by one. Screening for the second open/break test. Since the substrate test is only one step at a time, it is only a mountain-type sealant area 211, which is quite time consuming. In addition, especially when it is to be tested

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DESCRIPTION OF THE INVENTION (2) Section ____________ ^: 2: ° system, when multiple substrates of the pad are connected, since the connection pads 240 detect the ί: the probe cores of the disk 12 cannot be completely matched - ΐ , a portion of the second connection pad 240 η 必须 must be skipped, thus causing the substrate strip 200 to be at risk of opening/shortning. The board uses Ϊ J : J ; Announcement No. 438053 "for the ball grid array (10)) substrate device; 2" reveals no other test ball array package base board and - guide system ί contains a pumping A space Set, test electric, rubber, 戎 test circuit board is set in the vacuum through the 詈 and the = = has a plurality of holes, by the pumping of the ', then the hole to adsorb the conductive rubber, so that the board is set The conductive rubber on the fish plate can be electrically connected to the test circuit; 匕, :: column substrate, W the ball array substrate is generally used to test the packaged substrate that has been packaged and installed. It is not suitable for testing the package before packaging. [Inventory] The device is to provide a full-contact substrate test contact transfer: ΐϊΐ a full contact adapter plate and a lower dial, the full contact adapter plate: The third surface system 3 is further provided with a plurality of conductive bumps, and the whole disk system is provided with a plurality of guiding pads, the lower pin pads, two; for individually electrically detecting the guiding wires Connect ^ = electric bumps for individual contact - each connection pad of the substrate strip does not Article Test :: = fi '+ avoid visiting skip part Rong Ding judgment, causing the substrate strip has open / short wind

1282427 V. Description of invention (3) Insurance. The system is based on the provision of a substrate electrical measurement method, a series package:: board Γ 'device test - substrate strip' the substrate strip I 3 on a top surface of a number of first - connection The two connection pads, the substrate testing device comprises: ... each contact with the second connection of the substrate strip ==; = 夕 pr〇e Ρ 1 η) 'Individually electrically contacting the full contact adapter plate: The conductive pads are tested in a one-time full contact manner with a 2 - US board 2 "4 ί Γ contact substrate test device for electrical testing; = = ; = : on the f-face, 塾And a plurality of first connection pads to the library. The substrate test device is used to test the inclusion-upper fixture, the full contact adapter plate, and the lower needle connector. The first connected yoke plate of the substrate strip has a first surface and a second surface, and the other surface is electrically connected to the second connecting pad. The pads are electrically connected to the corresponding two electric bumps, and the lower dial includes a plurality of probes (probe page 9 1282427). 4) p i η ) ' is used to connect the pads from the two pads. And electrically contacting the guides of the full-contact adapter plate. [Embodiment] A substrate test device according to one of the inventions is provided. ^^ ', Qing, see Figure 3, a fully connected substrate strip 200 has a top surface to test a substrate strip 2 一, the strip 200 contains a plurality of lower surfaces 220, the substrate and a plurality of upper surfaces on the $ τ main μ. The first connection pad 230 of 10, the f: of the first connection ports 230, the pad 240. In this embodiment, ί, the first connection pad 23° can be a line-up front pad or a flip-chip on a dry pad. The two second connection pads 2 4 〇俜 乂 乂 乂 乂 m m 系The ball mats arranged in a matrix. Referring to FIG. 2 again, in the embodiment, the 21-inch system defines a plurality of sealing regions 211, and each of the plurality of matrix units 212 arranged on the upper surface is arranged. In the case of the 11th package of the package, the substrate test can be used to test the first connection of the substrate strip 20 in a full-touch manner. Correspondingly, whether the electrical connection path of the second connection pads 240 is a human path, the substrate testing device 1 includes a top, a Δ-na plate 120 and a lower dial 130, and the upper jig 1 () ^ is used to fully contact the substrate strips 200 of the first connection pads 23 () the king of the electrical guide text UU. In the present embodiment, the upper fixture 110 is provided with a plurality of conductive rubber blocks m, each of which corresponds to each of the rubber strips 211 of the substrate strip 20 for the electrical conductivity of the surface. The first connection ports 23 connected to each of the glue zones 211 are discharged. The full contact adapter plate 120 has a first surface 121

Page 10 1282427 V. Inventive Description (5) Surface 122, and the full contact adapter plate 120 includes a plurality of conductive bumps 123 and a plurality of conductive pads 123, the conductive bumps 123 are disposed on the first a surface 121, and the first surface 121 is oriented toward the upper fixture ,, such that each of the conductive bumps 1 23 can individually contact each of the corresponding second connection pads 240, and the conductive pads 24 are formed on The second surface 122 is electrically connected to the corresponding conductive bumps 123. The pitch of the conductive pads 124 is greater than the pitch of the conductive bumps 123. In this embodiment, the whole The contact adapter plate 120 can be a multilayer printed circuit board, such as a 2, 4 or 6-layer board having a thickness of about 0.5 to Ιππη, and the height of the conductive bumps 123 is 50 to 100 //m. The contact adapter plate 120 is disposed on the lower dial 13A, and the lower tray 130 includes a plurality of probes 131 (pr〇be ριη), and the lower dial can be transferred by the full contact The fan-out design of the board 12 , causes the probes Mi 旎 to be electrically connected to the full contact adapter board 124 2〇, respectively. The 丨3丨 can be designed for a large size. The V-pad is the pitch of the conductive pads 124 of the full-contact adapter plate 120, and the pitch of the conductive bumps 123, and the conductive pads The 124 series can be designed to match the positions of the probes 131 of the lower dial 130. Therefore, the conductive bumps 23 of the full-contact adapter plate 120 can individually correspond to the second connection pads 24Q. And the lower dial 13 (the board of the strip) the probe 133 individually electrically contacts the one of the full contact adapter plates 2 to reach the lower surface of the substrate strip 20 0 And the plurality of electrically conductive rubber blocks of the upper jig 11 are fully contacted with the first connection pads 23Q of the substrate strip 2GG at a time, so that the base does not need to be moved.

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The slats 2 Ο 0 series can fully guide the slanting, stenciling + gans to test the substrate strip '2;!; ί; Γ ° upper surface 21 〇, the electrical connection of the two connecting sides; =:=23° and the corresponding conductive 卩7 ^ and , sweat = road of the corresponding first touch panel 1 20 . Using the full bucket - 屯 1 block 1 丄 3 and the guiding potentials 1 2 / 1, # # 得 仞咢 丁 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针-, _ u can be disposed without corresponding to the substrate pull & connection pad 24 以, in order to achieve full contact with the micro-pitch of the connection pad of the substrate strip 200. In addition, the full contact turn The guiding pad 120 is still too small at the guiding pad 1 24 of the second surface 122, so that the γ 兮Ί is paid in the opposite direction of the sputum dial 1 130.

The needle cannot be implanted, and the bump pads 24 of the full-contact adapter plate 120 are implanted with bumps (not shown) on the guide pads 24 of the full-contact adapter plate 110, Directly connected to a measuring instrument. A substrate electrical measuring method using the above-described full-contact substrate testing device 丨〇 Q, as follows:

Referring to FIGS. 2 and 3, first, a substrate strip 2 to be tested is provided. The substrate strip 200 has an upper surface 21〇 and a lower surface 22〇, and the substrate strip 200 includes a plurality of first Connecting the 塾2 3 〇 and the plurality of second connecting pads 240, the first connecting pads 305 are formed on the upper surface 2 ί, and the connecting pads 240 are formed on the lower surface 2 2 0. In this embodiment, the upper surface 210 of the substrate strip 200 defines a plurality of sealing regions. 1 ί, each of the glue zones 2 11 includes a plurality of matrix units 2丨2 arranged in a matrix, and the first connection pads 203 are formed in the sealants 2 11 . Next, a substrate testing device 1 提供 包含 is provided, the substrate testing device 1 包含 包含 comprising a fixture 1 1 0 , a full contact adapter plate 丨 2 〇 and a lower dial

1282427

The upper fixture 1 1 0 can be provided with a plurality of conductive rubber blocks 1 1 1 , and the ten electrical hearing blocks 1 1 1 correspond to the sealing strips 2 1 1 of the substrate strip 200, γ = contact The adapter plate].20 has a first surface 121 and a second surface 〜4 full contact adapter plate 120 includes a plurality of conductive bumps 23 on the first surface j and a plurality of The guiding surface 1 of the second surface 1 is electrically connected to the corresponding conductive bumps ... and the pitch of the guiding pads 1 24 is greater than the conductive bumps Π 23 βΠ lYH 〇

Secondly, the full-contact adapter plate 120 is disposed on the lower dial 13A, and the conductive pads 1 24 of the adapter plate 1 2 are electrically connected to the ship's individually. Pasting, and the conductive bumps T 110 盥 入 〇 〇 110 , , , , , , , 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 The first and second connecting pads 23 of the substrate are electrically connected to the first and second connecting pads 23 of the substrate. And the pair; = electric J raw test the substrate strip 2 〇. Whether the path of the connection (4)/short circuit Mm2 is connected to the 塾 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Any changes and spirits of the invention and the scope of the invention are within the scope of the invention. 1282427 Simple illustration of the drawing [Simple description of the drawing] Figure 1: Conventional substrate: Test setup. A schematic diagram of a substrate strip for electrical testing, Figure 2: Known to be tested: Under the substrate strip Surface schematic, and Figure 3: According to the hairpin month, - a full-contact substrate test device for electrical test substrate strip - section 〖 schematic. Component symbol simple description I 10 substrate test device 11 Upper fixture 11a conductive adhesive 12 lower dial 12a probe 100 substrate detecting device 110 upper fixture 111 conductive rubber block 120 full contact adapter plate 121 first surface 122 second surface 123 conductive bump 124 conductive pad 130 Lower dial 131 Probe 200 Substrate strip 210 Upper surface 211 Sealing area 212 Substrate Early 220 Lower surface 230 First connection pad 240 Second connection pad

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Claims (1)

1282427 VI. Scope of Application for Patent Application [Scope of Application] j. A full-contact substrate test device for electrical testing - the strip/忒 substrate strip has an upper surface and a lower surface, and the base The first test fixture includes: an upper fixture for fully electrically connecting the first connection fixture and the plurality of first connection ports on the surface of the μ F, the surface The first punch pads of the substrate strips; and the full contact of the first ones for individually placing the guides to include the Pin) pads. Apply for the special equipment in these special applications, the above-mentioned application for the base, the block system with the block, and 2, such as set, its (probe some guide 3, such as set, one湏J 4 , for example, a conductive guide 5 , such as a set, an adapter plate having a first surface and a second surface is provided with a plurality of conductive bumps, each of the conductive bumps Contacting each of the corresponding second connection pads, the pitch of the conductive bumps is greater than the pitch of the conductive bumps in the second plurality of conductive pads. The full-contact substrate test of claim 1 is provided with a lower dial comprising a plurality of probes for individually electrically contacting the full-contact adapter plate. The full-contact substrate test mounting pad is provided with a plurality of bumps for direct connection with the magnetic device. The full-contact substrate test fixture of the first item is provided with at least one conductive a rubber block, which is used for an electric connection pad. The full contact type substrate according to item 1 of the scope The pitch of the first connection pads of the test strip is less than the first Page 15 --- -- VI. Patent application scope 2 Connection pad section 6. If the application is specific, then the whole is 7. If the application is specific, the size of the full fixture. 8. A substrate electrical test method package provides a surface to be treated, and pads and a plurality of distances. The first contact adapter plate is a second contact adapter plate electrical measuring method, comprising: measuring the substrate strip, the substrate strip is in the lower table test device full contact adapter plate and providing a substrate system having a The first surface has a plurality of conductive pads, and the guiding portions of the guiding pads comprise a plurality of full-contact adapter plates disposed to electrically connect the plurality of contacts to the processing bumps, and the pads are electrically connected The distance is greater than the probe (the conductive contact adapter plate of the probe is connected to the lower needle; the full-contact substrate test device described in the item is a multilayer printed circuit board. The substrate test package and the lower dial are both larger than the size of the substrate for electrically testing a substrate strip. The substrate strip has an upper surface and a plurality of first layers on the upper surface. The second connection pad of the surface; the substrate testing device comprises an upper treatment: a lower dial, wherein the full contact turns: = ~ surface, and the first surface system is provided with a plurality of guides 2 corresponding to the conductive bumps, and the The pitch of the V-electrode bumps, the lower dials are used to individually electrically connect the pads; the pins on the dials to make the probes of the conductive pads i, and the The conductive bumps are disposed on the substrate strip between the each of the full-contact adapter plates and the full-contact adapter plate, so that the conductive bumps individually contact each of the corresponding ones 1282427. The second connection pad of the patent application scope, and the upper fixture is electrically connected to the first connection ports of the substrate strip; and electrically testing the first connection pads and corresponding to the second connection pads The electrical connection path of the connection pad. 9. The substrate electrical measurement method according to claim 8, wherein the upper fixture is provided with at least one conductive rubber block for electrically guiding the first connection ports. The substrate electrical measuring method according to claim 8, wherein the pitch of the first connecting ports of the substrate strip is smaller than the pitch of the second connecting ports. 11. The substrate electrical test method of claim 8, wherein the full contact adapter plate is a multilayer printed circuit board. 1 . The substrate electrical measurement method according to claim 8 , wherein the size of the full contact adapter plate and the lower dial is greater than the size of the upper fixture. Page 17