1282262 九、發明說明： 【發明所屬之技術領域】 ^本發明係一種中央處理器的遮蔽結構，尤指一種可有效遮 蔽中央處理器組件所發出之電磁波的中央處理器遮蔽結構。 【先前技術】 電腦的中央處理器（CPU)在過去幾年間，由486— Pentium->Pentiumn—PentiumlE依序演進，世代交替極為快 速’其core speed(75 MHz—500 MHz以上）與散熱功率（1〇w^ 28W以上）均不斷增加，CPU之散熱問題因而愈趨嚴重，是以产 低CPU的工作溫度，係一極為重要且關鍵之問題。 降低中央處理器溫度之方法係在其上設置一散熱裝置，如 第ΙΑ、1B圖所示；中央處理器組们！係設置於—主機板1〇上， ^包括一中央處理器111、一基座113，中央處理器丨1丨藉由封 膠層112而翻定在紐113上，巾央處理nln藉由基座】 與主機板10電性連接。 -散熱裝置可如第1A圖所示，係-散熱片12，或如第職 示’係一散熱片和風扇的組件13。 4將散熱裝置12、13設置於中央處理器組件】j上後，從侧面 =’將會如第1C®所*，由於中央處理器⑴係藉由封膠層 112固定於基座113上，是以中央處理器⑴突出於主機板w曰 上，而令散熱裝置12、13與主機板1〇之間產生了一間隙G。 =此間隙G之產生，令中央處理器組件n所發出之電磁 【發明内容】 所、十、irf之目的在於提供—種中央處理器的遮蔽結構，其中 所述中央處理器的遮蔽結構可有效遮蔽中央處理器組件所發 1282262 出的電磁波。 依據上述主要目的，本發 。 用用於主機板上，包括設置於以===敝結構’係適 置於散熱裝，中 處理器組件扣合而· mtt Itti It if?η ^ 處理器的電磁波干擾處為的周邊組件不至於遭受中央 【實施方式】 於-imiWt發ai之中央處理器的遮蔽結構，係適用 蔽構件2板包括—巾央處理11組件2卜散錄置23和遮 中央處理器組件21設置於主機板20上，包括一中央處理器 及承載中英處理器211之基座212。另，基座212之侧邊設g 一凸塊213。 主機板20在中央處理器組件21周圍設有一接地片2〇1，該 接地片201兩側邊緣設有插槽2〇2。 散熱裝置23係設置於中央處理器組件21上，包括一吸熱底 座231及設於吸熱底座231上之風扇232。又，吸熱底座231相對 於中央處理器組件21凸塊213之側邊凸出設有扣具233,而扣具 233末端設有與凸塊213配合之扣孔2331。 如第3圖所示，遮蔽構件22中央部位設有一開孔221，而與 中央處理器組件21凸塊213對應的兩相對侧邊設有供凸塊213 穿出之缺口226，遮蔽構件22的另外兩相對侧邊則向主機板20 凸出設有接腳222。又，所述開孔221周圍設有第一密封彈性元 件223，且遮蔽構件22各侧邊底端除設置缺口226與接腳222之 1282262 部位向内延伸設有底板224’該底板224下側亦設有第二密封彈 性元件225。 如第2、4圖所示，組合時，先將遮蔽構件22套罩於中央處 理器組件21上，兩側之接腳222分別插置於主機板20之插槽202 内，第二密封彈性元件225置於遮蔽構件22底板224及主機板20 的接地片201之間，以將中央處理器組件21產生的電磁波導入 主機板20的接地片201中，而後再將散熱裝置23壓置於遮蔽構 件22上，遮蔽構件22的開孔221可使中央處理器組件21的中央 處理器211與散熱裝置23的吸熱底座231接觸，而所述第一密封 彈性元件223置於遮蔽構件22及散熱裝置23之間，然後施力於 散熱裝置23侧邊上之扣具233，令扣孔2331與凸出遮蔽構件22 側邊缺口 226之中央處理器組件21侧邊上之凸塊213扣合，藉此 迫使第一與第二密封彈性元件223、225產生彈性變形，因是接 地片201與遮蔽構件22以及散熱裝置23緊密貼合，從而消除間 隙，防止電磁波外泄。 如第5圖所示，為本發明另一實施例，與第一實施例不同 ^處在於遮蔽構件32中央部位設有一開孔321，而與中央處理 器組件21凸塊213對應的兩相對侧邊設有供凸塊2丨3穿出之缺 口 326 ’遮蔽構件32的另外兩相對侧邊則向主機板2〇凸出設有 接腳3j2。又，所述開孔321週圍設有第一密封彈性元件兕3， 且遮蔽構件32四條側邊底端除設置缺口 326與接腳微之部位 向下延伸複數彈性彎腳327。 如第6圖所不，組合時，該等彈性彎腳327壓置於主機板2〇 的接地片201上’以將中央處理器組件21產生的電磁波導入主 機板20之接地片201中，且該等彈性彎腳327產生彈性變形，令 接地片201與遮蔽構件&緊密配合。另，裝置於遮蔽構件32及 散熱I置23之間的第一密封彈性元件323亦受力產生彈性變 形’令^4蔽構件32及散熱裝置23緊密配合，以防止電磁波外泄。 是以，藉由遮蔽構件22、32的設置，可有效地遮蔽中央處 1282262 理器組件21所發出的電磁波，使中央處理器 標號)、不致於遭受中央處理器211的電磁組件（未 綜上所述，本發明符合發明專利之要件，^ 申請。惟，以上所述者僅為本發明 ，依，提出專利 發明技藝之人士，爰依太癸昍衅强仏/只施例’與凡熟悉本 應涵蓋於《下之申㈣效修飾或變化，皆 【圖式簡單說明】 葉;=:=理器與散熱裝置之示意圖; 弟1Β圖係白知中央處理器與 明之 第視圖； 圖； 力貝她例之中央處理态的遮蔽構件之立體 ί = 本發_—糊之中蝴_蔽結構組合後 20 21 211 212 213 22、32 23 201 202 【元件符號說明】 主機板 中央處理器組件 中央處理器 基座 凸塊 遮蔽構件 散熱裝置 接地片 插槽 1282262 開孔 22卜 321 接腳 222 、 322 第一密封彈性元件 223 、 323 底板 224 第二密封彈性元件 225 吸熱底座 231 風扇 232 扣具 233 缺口 226 、 326 彈性彎腳 327 扣孔 23311282262 IX. Description of the Invention: [Technical Field] The present invention relates to a shielding structure of a central processing unit, and more particularly to a central processing unit shielding structure that can effectively block electromagnetic waves emitted by a central processing unit assembly. [Prior Art] The central processing unit (CPU) of the computer has evolved in the past few years by 486-Pentium->Pentiumn-PentiumlE, and the generations are extremely fast. Its core speed (75 MHz-500 MHz or more) and heat dissipation power ( 1〇w^ 28W or more) are constantly increasing, and the heat dissipation problem of the CPU is becoming more and more serious. It is an extremely important and critical problem to produce a low CPU operating temperature. The method of lowering the temperature of the central processing unit is to provide a heat sink on it, as shown in Fig. 1 and Fig. 1B; the central processor group! The system is disposed on the motherboard 1 and includes a central processing unit 111 and a pedestal 113. The central processing unit 翻1 is flipped on the button 113 by the sealing layer 112. The base is electrically connected to the motherboard 10. - The heat sink can be as shown in Figure 1A, the heat sink 12, or the assembly 13 of a heat sink and fan as described in the first aspect. 4 After the heat sinks 12, 13 are disposed on the central processing unit assembly j, the side = 'will be as shown in the 1C®*, since the central processing unit (1) is fixed to the base 113 by the sealing layer 112, The central processor (1) protrudes from the motherboard w曰, and a gap G is generated between the heat sinks 12, 13 and the motherboard 1. The generation of the gap G causes the electromagnetic device to be emitted by the central processing unit n. The purpose of the present invention is to provide a shielding structure for the central processing unit, wherein the shielding structure of the central processing unit is effective. The electromagnetic waves emitted by the 1282262 from the central processing unit are shielded. According to the above main purpose, the present invention. Used for the motherboard, including the structure set in the ===敝 structure, the system component is fastened, and the peripheral components of the mtt Itti It if? η ^ processor are not As for the shielding structure of the central processing unit which is subjected to the central [embodiment] in the -imiWt transmission, the shielding member 2 board includes a towel processing unit 11 assembly 2 and the central processing unit assembly 21 is disposed on the main board. 20 includes a central processing unit and a base 212 carrying a Chinese-English processor 211. In addition, a side of the susceptor 212 is provided with a bump 213. The motherboard 20 is provided with a grounding strip 2〇1 around the central processing unit 21, and the grounding strip 201 has slots 2〇2 on both sides. The heat sink 23 is disposed on the central processing unit assembly 21 and includes a heat absorbing base 231 and a fan 232 disposed on the heat absorbing base 231. Moreover, the heat-absorbing base 231 is provided with a buckle 233 protruding from the side of the protrusion 213 of the central processing unit assembly 21, and the end of the buckle 233 is provided with a button hole 2331 that cooperates with the protrusion 213. As shown in FIG. 3, an opening 221 is defined in a central portion of the shielding member 22, and two opposite sides of the convex portion 213 of the central processing unit assembly 21 are provided with a notch 226 through which the protruding piece 213 passes, and the shielding member 22 is disposed. The other two opposite sides protrude from the motherboard 20 and are provided with pins 222. In addition, a first sealing elastic member 223 is disposed around the opening 221, and a bottom portion of each of the side edges of the shielding member 22 is provided with a bottom plate 224', and a lower portion of the bottom plate 224, except for a notch 226 and a portion 12822262 of the pin 222. A second sealing elastic element 225 is also provided. As shown in the second and fourth embodiments, in combination, the shielding member 22 is first sleeved on the central processing unit assembly 21, and the pins 222 on both sides are respectively inserted into the slots 202 of the motherboard 20, and the second sealing is elastic. The component 225 is disposed between the bottom plate 224 of the shielding member 22 and the grounding strip 201 of the motherboard 20 to introduce electromagnetic waves generated by the central processing unit 21 into the grounding strip 201 of the motherboard 20, and then press the heat sink 23 against the shielding. On the member 22, the opening 221 of the shielding member 22 can contact the central processing unit 211 of the central processing unit assembly 21 with the heat absorption base 231 of the heat sink 23, and the first sealing elastic member 223 is placed on the shielding member 22 and the heat sink. Between the 23, the fastener 233 is applied to the side of the heat sink 23, so that the button hole 2331 is fastened to the protrusion 213 on the side of the central processor unit 21 of the side cover 226 of the protruding shielding member 22, This forces the first and second sealing elastic members 223, 225 to be elastically deformed because the grounding piece 201 is closely attached to the shielding member 22 and the heat sink 23, thereby eliminating the gap and preventing electromagnetic waves from leaking out. As shown in FIG. 5, another embodiment of the present invention is different from the first embodiment in that a central portion of the shielding member 32 is provided with an opening 321 and two opposite sides corresponding to the convex portion 213 of the central processing unit assembly 21. The other two opposite sides of the shielding member 32 are provided with the notches 326 for the projections 2 丨 3 to be protruded from the main plate 2 to be provided with the pins 3j2. Further, a first sealing elastic member 兕3 is disposed around the opening 321 , and the bottom end of the four side edges of the shielding member 32 extends downwardly from the plurality of elastic bending legs 327 except for the portion where the notch 326 and the pin are provided. As shown in FIG. 6, when combined, the elastic bending legs 327 are pressed onto the grounding strip 201 of the motherboard 2' to introduce the electromagnetic waves generated by the central processing unit 21 into the grounding strip 201 of the motherboard 20, and The elastic bending legs 327 are elastically deformed to closely match the grounding piece 201 with the shielding member & Further, the first sealing elastic member 323 which is disposed between the shielding member 32 and the heat dissipation I 23 is also elastically deformed to closely match the heat dissipating member 32 to prevent electromagnetic waves from leaking out. Therefore, by the arrangement of the shielding members 22, 32, the electromagnetic waves emitted by the central 12822262 processor assembly 21 can be effectively shielded, so that the central processing unit is labeled, and the electromagnetic components of the central processing unit 211 are not damaged. The invention is in accordance with the requirements of the invention patent, and is applied for. However, the above is only the invention, and the person who proposes the patented invention skill is too strong and only applies to the case. This should be covered in the following application (four) effect modification or change, are [simplified description of the diagram] leaf; =: = schematic diagram of the processor and the heat sink; brother 1 map is the first view of the central processor and the Ming; The stereo of the shielding member of the central processing state of Libei ί = _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Central processor base bump shielding member heat sink grounding plate slot 1282262 opening 22 321 pin 222, 322 first sealing elastic member 223, 323 bottom plate 224 second sealing elastic member 225 heat absorbing base 231 Fan 232 clip 233 notch 226, 326 elastic bending 327 buttonhole 2331