1282155 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種膠體封裝構件（Molding compound Package)，特別是指具有一種用以處理頻率信號之表面聲波 晶片（Surface Acoustic Wave Chip，SAW Chip)的膠體封 裝構件。 【先前技術】 自西元1965年起，加州大學柏克萊分校的教授r.μ White與F_ W. Voltmer提出在壓電材料上可藉由指又狀換能 器（Inter-digital transducer，IDT)來有效激發及接收表面聲 波（Surface acoustic wave，SAW)之後，使得表面聲波元件開 始引起眾人注目，因而開啟了表面聲波元件應用的大門。 表面聲波元件本身具有以下幾點特性： 1·操作頻率可由數KHz至數GHz，頻寬也可由數KHz至 數MHz，所以適合許多現代通訊和航空工業要求。 2.操作頻率變化皆在數百Hz至數百KHz間，所以具高靈 敏度，及高訊號/雜訊比（S/N ratio)，因此在訊號處理時 不需要多添加額外昂貴的數位類比轉換器。 3·在設計製造上，可以利用半導體工業開發的光蝕刻技術 (Lithography)與沉積技術（Deposition)，一次大量製造、 減少製作成本。 4·體積小，且與1C技術具有相容性、較佳的再現性、高靈 敏性和可靠性，使得信號截取容易，反應時間快速，適 合與現代的微電子電路系統相互整合。 1282155 近年來ik著科學技術的演變，行動通訊發展一日千里 通戒產品已經演變成人類的生活必需品。今日搭載使用 、聲波元件的各式電子產品，已由過去大尺寸、粗链不 ί用逐步改良成為工業化與個人化商品，並朝向低價格 、小尺寸、多附加功能、低消耗功率及高靈敏度邁進。 、^表面卑波7L件大致分為表面聲波共振器和表面聲波濾 ' 類其中，表面聲波共振器大部分是應用於表面聲 波振i $電路上’尤其以—些低功率的通訊器材為主，如 無，遙控器、電動遙控鎖及保全監視系統等。表面聲波振 ^亦可被用來取代鎖相迴路(Phase L。咖d ，PLL)， s 電壓控制振盪器（偏tage contn)10seillatGr，vco)，其 不4不亞於由RLC製成的傳統鎖相迴路，而且明顯縮 各、、電路的X寸。A外表面聲波共振器也可做成表面聲波 感測裔’由於表面聲波共振器其頻率響應相當靈敏，所以 對於置放在共振器上之感測物，可經由儀器觀察振盪頻率 的不同，以達到對感測物的分析。 而表面聲波濾波器則由 的干擾有相當的抑制性，因 濾波器使用，再加上其具有 等多項優點，所以被廣泛應 中頻電路中。 於本身頻寬極窄，所以對雜訊 而適用於電子通信產品中作為 小尺寸、價袼低廉，及高性能 用於例如行動電話中之射頻及 1參_卜上述的表面聲波元件是以_封裝構们的型 =呈現’是可電性連接於—通信產品例如手機的電路板（圖 未不出）上’經由電路板向外傳遞—經過處理後之預定頻寬 1282155 的頻率信號或特定頻率的共振信號。該封裝構件丨包含一 封裟喊11、一表面聲波晶片12，及複數電性連接件13。 封裝殼11包含一基板m、一環圍基板U1的周壁112 、-頂蓋113，及複數電性接腳114，頂蓋113連結於周壁 ⑴的頂緣，而與周壁112共同界定出一將基板iu界限於 =而與外界隔絕的感應空腔117，每—電性接腳ιΐ4間隔地 穿伸過周壁112設置，而被周冑112區分成一内連接部ιΐ5 及一外連接部116，外連接部116與電路板相互電性連接。 表面聲波晶片12承置連結於基板⑴±，而限制於感 應空腔117中並與外界相隔絕，表面聲波晶# 12包含-基 材121、一形成於基材121表面的指叉狀換能器122，及複 數與指又狀換能器122電性連接的連接墊125，基材⑵一 般是選用具麼電性之單晶材料’例如石英、鈮酸鐘、组酸 鐘等，並配合藝—不具M電性的f極形成指叉狀換能器 U2 ’指又狀換能n 122具有相間隔之一輸入璋⑵與一輸 出琿124，且輸入埠123、輸出埠124呈指叉狀，由輸入埠 接收頻率後轉換成表面聲波經由部份基材⑵表面 向輸出埠124傳遞，而將輸入琿123處理過之對應預定頻 寬之/貝率U或特定頻率之共振信號的表面聲波傳至指叉 狀換能器122之輸出琿124後’由輸出埠124將此處理完 成之表面聲波轉換成預定頻寬之頻率信號或特定頻率之共 振信號再向外輸出。 、電性連接件13 (本例與圖示中均以金線說明）分別電 性連接連接墊125與電性接腳114之内連接部ιΐ5,而可將 1282155 經表面聲波晶片12處理後之預定頻寬的頻率信號或特定頻 率的共振信號經由電性連接件13、電性接腳ιΐ4、電路板向 外傳遞，以提昇通信電子產品的通信品質。 表面聲波晶片12處理信號的基本原理，是運用基材 121與形成在基材121表面之指叉狀換能^ 122才目互配合以 壓電效應效應傳送表面聲波，因此必需有一自纟空間（即 感應空腔m)供其振動形變傳遞，才可以進行信號處理及 產生預定頻寬之頻率信號或特㈣率之共振信號。因此， 上述表面聲波元们必須以封裝殼㈣表面聲波晶片_ 裝在封裝㉟11所界定的感應空腔117巾，而使表 片12有空間可以振動形變傳遞、進行頻率信號處理。 然而，由於目前絕大多數晶片的封裝方式都利用膠體 (molding compound)以膠體封裝的方式進行封裝。因此， 此等必須以封裝殼u將表面聲波晶片12封裝成封裝構们 的封裝方式’-來由於封裝方式不同，表面聲波晶片匕無 法與其他種類的晶片或元件共同採取同—類的膠體封裝進 行裸晶電路板構裝（ehip Gn bQa⑷的整合研究發展，二來 由於此等封裝方式並非市場主流，材料成本居高不下，且 由少數業者㈣斷；此外，封裝殼U本歧有體積縮減的 限制。 因此，如何研究改善目前封裝有表面聲波晶片的封裝 構件之結構，是業界與學界努力的方向之一。 【發明内容】 因此，本發明之目的，即在提供—種以膠體進行膠體 1282155 封裝而成的具有表面聲波晶片之膠體封裝構件。 於疋’本發明之一種具有表面聲波晶片之膠體封裝構 件，可電性連接於一電路板上，用以將一接收到的頻率信 號轉換處理成一預定信號，該具有表面聲波晶片的膠體封 裝構件包含一基板、一表面聲波晶片、複數電性接腳、複 數電性連接件，及一封裝膠體。 違表面聲波晶片承置連結於該基板上，包含一基材、 一形成於該基材表面的指叉狀換能器、複數與該指又狀換 能器電性連接的連接墊’及—自該基材表面更向上形成的 罩覆殼，該指又狀換能器接收該頻率信號後以表面聲波轉 換f理成該預定信號，該罩覆殼與該基材表面共同界定出 -谷置該指又狀換能器而使其與外界相隔絕的感應空腔。 複數電性接腳間隔地環繞該基板設置，每一電性接腳 具有-連接部與-相反於該連接部的裸露部，該裸露部是 可對應地與該電路板相互電性連接。 複數電性連接件分別對應地電性連接該表面聲波晶片1282155 IX. Description of the Invention: [Technical Field] The present invention relates to a Molding Compound Package, and more particularly to a Surface Acoustic Wave Chip (SAW Chip) for processing a frequency signal. Colloidal package member. [Prior Art] Since 1965, professors of the University of California at Berkeley, r. μ White and F_W. Voltmer, have proposed inter-digital transducers (IDT) on piezoelectric materials. After effectively exciting and receiving the surface acoustic wave (SAW), the surface acoustic wave component begins to attract attention, thus opening the door to the application of the surface acoustic wave component. The surface acoustic wave element itself has the following characteristics: 1. The operating frequency can be from several KHz to several GHz, and the bandwidth can be from several KHz to several MHz, so it is suitable for many modern communication and aerospace industry requirements. 2. The operating frequency varies from hundreds of Hz to several hundred KHz, so it has high sensitivity and high signal/noise ratio (S/N ratio), so there is no need to add extra expensive digital analog conversion in signal processing. Device. 3. In the design and manufacture, the photolithography technology (Lithography) and deposition technology (Deposition) developed by the semiconductor industry can be used to mass-produce and reduce the production cost. 4. Small size, compatibility with 1C technology, better reproducibility, high sensitivity and reliability, making signal interception easy, fast response time, suitable for integration with modern microelectronic circuit systems. 1282155 In recent years, with the evolution of science and technology, the development of mobile communication has become a necessity for human beings. Today, various electronic products equipped with acoustic wave components have been gradually improved from industrial large-scale and thick-chain to industrialized and personalized products, and are oriented toward low price, small size, multiple additional functions, low power consumption and high sensitivity. Step forward. The surface acoustic wave 7L is roughly divided into a surface acoustic wave resonator and a surface acoustic wave filter. Among them, the surface acoustic wave resonator is mostly applied to the surface acoustic wave vibration i $ circuit, especially with some low-power communication equipment. , if not, remote control, electric remote control lock and security monitoring system. The surface acoustic wave can also be used to replace the phase-locked loop (Phase L. PLL), s voltage-controlled oscillator (top contn) 10seillatGr, vco), which is no less than the tradition made by RLC. The phase-locked loop, and the X-inch of the circuit is significantly reduced. A external surface acoustic wave resonator can also be made into surface acoustic wave sensing. Because the surface acoustic wave resonator has a very sensitive frequency response, the sensory object placed on the resonator can be observed by the instrument to observe the difference in oscillation frequency. Achieve analysis of the sensing object. The surface acoustic wave filter is quite restrained by the interference, and is widely used in the intermediate frequency circuit due to the use of the filter and its advantages. It has a very narrow bandwidth, so it is suitable for use in electronic communication products as a small size, low price, and high performance for use in, for example, a radio frequency in a mobile phone, and a surface acoustic wave component is _ The type of package = present is 'electrically connected to a communication device, such as a mobile phone's circuit board (not shown), 'passing through the board' - a processed frequency band of 1282155 or a specific frequency The resonant signal of the frequency. The package member 丨 includes a shout 11, a surface acoustic wave chip 12, and a plurality of electrical connectors 13. The package body 11 includes a substrate m, a peripheral wall 112 of the surrounding substrate U1, a top cover 113, and a plurality of electrical pins 114. The top cover 113 is coupled to the top edge of the peripheral wall (1), and together with the peripheral wall 112 defines a substrate. The sensing cavity 117, which is separated from the outside by the iu, is disposed through the peripheral wall 112 at intervals of each of the electrical pins 1-4, and is divided into an inner connecting portion ι5 and an outer connecting portion 116 by the outer circumference 112, and the outer connecting portion The portion 116 is electrically connected to the circuit board. The surface acoustic wave wafer 12 is attached to the substrate (1) ± and is confined in the sensing cavity 117 and is isolated from the outside. The surface acoustic wave crystal 12 includes a substrate 121 and a finger-like transducer formed on the surface of the substrate 121. The device 122, and the plurality of connection pads 125 electrically connected to the finger transducer 122, the substrate (2) is generally selected as an electrical single crystal material such as quartz, bismuth clock, acid clock, etc. Art-f-electrode-free f-pole forming the fork-shaped transducer U2' refers to the re-transformation n 122 having one of the input 璋(2) and one output 珲124, and the input 埠123 and the output 埠124 are the fingers The surface is converted from the input 埠 to the surface acoustic wave and transmitted to the output 埠124 via the surface of the partial substrate (2), and the input 珲123 is processed to a surface corresponding to a predetermined bandwidth/bei rate U or a resonance signal of a specific frequency. After the sound wave is transmitted to the output 珲124 of the interdigital transducer 122, the surface acoustic wave completed by the processing is converted into a frequency signal of a predetermined bandwidth or a resonance signal of a specific frequency and output to the outside. The electrical connector 13 (in this example and the illustration is illustrated by a gold wire) electrically connects the connection pad 125 and the inner connection portion ι 5 of the electrical pin 114, respectively, and the 1282155 can be processed by the surface acoustic wave chip 12 The frequency signal of the predetermined bandwidth or the resonance signal of the specific frequency is transmitted outward through the electrical connector 13, the electrical pin 4, and the circuit board to improve the communication quality of the communication electronic product. The basic principle of the surface acoustic wave wafer 12 for processing signals is to use the substrate 121 and the interdigital transducers formed on the surface of the substrate 121 to interact with each other to transmit surface acoustic waves by the piezoelectric effect effect, and therefore it is necessary to have a self-sufficient space ( That is, the sensing cavity m) is used for the vibration deformation transmission, and the signal processing and the generation of the frequency signal of the predetermined bandwidth or the resonance signal of the special (four) rate can be performed. Therefore, the surface acoustic wave elements described above must be packaged with a packaged shell (4) surface acoustic wave wafer _ mounted on the induction cavity 117 defined by the package 3511, so that the surface of the surface 12 can be vibrated and transmitted for frequency signal processing. However, since most of the current wafer packaging methods are encapsulated by a colloidal package using a molding compound. Therefore, these must be packaged in the package u to encapsulate the surface acoustic wave chip 12 into a packaging structure of the package. - Due to the different packaging methods, the surface acoustic wave wafer can not be used in the same type of colloidal package as other types of wafers or components. Conducting the research and development of bare-chip circuit board (ehip Gn bQa (4), secondly, because these packaging methods are not the mainstream of the market, the material cost is high, and it is broken by a few operators (four); in addition, the package shell U has a volume reduction. Therefore, how to study the structure of a package member that is currently packaged with a surface acoustic wave wafer is one of the directions of the industry and the academic community. [Invention] Therefore, the object of the present invention is to provide a colloid for colloid 1282155 A packaged colloidal package member having a surface acoustic wave chip. The invention relates to a colloidal package member having a surface acoustic wave chip electrically connected to a circuit board for converting a received frequency signal Processing a predetermined signal, the colloidal package member having a surface acoustic wave wafer comprises a substrate, a a surface acoustic wave chip, a plurality of electrical pins, a plurality of electrical connectors, and an encapsulant. The surface acoustic wave chip is mounted on the substrate, and comprises a substrate and an interdigitated shape formed on the surface of the substrate. The connector, the plurality of connection pads electrically connected to the finger transducer, and a cover shell formed upward from the surface of the substrate, the finger transducer is received by the surface acoustic wave after receiving the frequency signal f is configured to form the predetermined signal, the cover shell and the surface of the substrate together define an induction cavity in which the finger is shaped to be insulated from the outside. The plurality of electrical pins are circumferentially spaced apart. The substrate is disposed, each of the electrical pins has a connection portion and a bare portion opposite to the connection portion, and the exposed portion is electrically connected to the circuit board correspondingly. The plurality of electrical connectors are respectively electrically connected Connecting the surface acoustic wave chip
性接腳之連接部，而使該預定信 該等電性接腳、該電路板向外傳 表面聲波晶片、每一電性接腳The connection portion of the pin, so that the predetermined signal is electrically connected to the board, the circuit board transmits the surface acoustic wave chip, and each electrical pin
該封裝膠體將該基板 之連接部，及該複數電性i 1282155 封裝構件包含-基板、_表面聲波晶片、複數電性連接件 、複數電性連接單元，及一封裝膠體。 該基板具有複數電路及複數電性接點，該複數電性接 點分別設置於該基板表面與基板底面，且與該複數電路相 互電性連接。 5亥表面聲波晶片承置連結於該基板上，包含一基材、 一形成於該基材表面的指叉狀換能器、複數與該指叉狀換 能器電性連接的連接墊，及一自該基材表面更向上形成的 罩覆殼，該指又狀換能器接收該頻率信號後以表面聲波轉 換處理成該預定信號，該罩覆殼與該基材表面共同界定出 一容置該指叉狀換能器而使其與外界相隔絕的感應空腔。 複數電性連接件分別對應地電性連接該表面聲波晶片 之複數連接墊與該基板表面之複數電性接點。 複數電性連接單元分別對應地電性連接該基板底面之 複數電性接點與該電路板，而使該預定信號經由該複數電 性連接件、該基板之複數電性接點與該電路、該複數電性 連接單元，及該電路板向外傳遞。 該封裝膠體自該基板表面向上形成，將該表面聲波晶 片、複數電性連接件包覆而不與外界接觸。 本發明之功效在於提供一種以膠體進行膠體封裝而成 的具有表面聲波晶片的膠體封裝構件，由於膠體封裝是目 前最通用的封裝方式，因此可以有效降低生產成本，避免 少數業者壟斷市場。 【實施方式】 10 1282155 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之四個較佳實施例的詳細說明 清楚的呈現。 /閱圖2’本發明具有表面聲波晶片之膠體封裝構件的 -第-較佳實施例，是可電性連接於—通信產品例如手機 的電路板（圖未示出）± ’而可濾除不需要之頻帶的頻率 信號或產生特定之共振頻率後’經由電路板向外傳遞此一 經過處理之it波或共振信號，以提昇通信電子產品的通信 品質。該膠體封裝構件2包含—基板21、_表面聲波曰片 3、複數電性接腳22、複數電性連接件23，及一封裝S體 24 ° 基板2i供表面聲波晶片3承置連結，表面聲波晶片3 包含-基材31、-指叉狀換能器32、複數連接墊％，及一 罩覆殼34。 指叉狀換能器32與基材31才目配合，並形成於基材31 表面’具有相間隔之-輸入璋321與一輸出璋奶，且輸入 埠321、輸出槔322呈指叉狀，由輸入土車321接收一頻率信 號後轉換成表面聲波’經由部份基材31表面向輸出蜂322 傳遞’而將輸人埠321轉換處理後之預定頻寬的頻率信號 或特定頻率的共振信號的表®聲波傳至指又狀換能器32之 輸出埠322,再由輸出埠322將此處理轉換完成之表面聲波 轉換成預定頻寬之頻率信號或特錢率之共振信號再向外 輸出。 由則述表面聲波晶片3基本作動原理可知，基材3 1是 1282155 由例如石英、銳酸鐘、纽酸鐘、删酸鐘、Langasite等具遷 電性之單晶材料，或於非壓電性枋料上成長氧化辞、氧化 PZT等具壓電性之薄膜材料所構成；而指叉狀換能器 32則疋-不具屬電性的電極。由於基材31與指叉狀換能器 I2的相互選擇搭配’必須視表面聲波晶片3的應用，例如 而傳遞的模態、待處理的信號頻絲s等等，再依基材Η =機電輕合係數、介電常數、溫度係數、結晶方向、成本 價格等等來選擇搭配應用，故在此不再多加舉例基材Η可 選用：種類與指又狀換能器32搭配形成之相關模態。 π每連接塾33形成在基材31表面，並與指又狀換能 器32電性連接，在本例及圖示令，以四連接塾33，且兩兩 相對分別電性連接輸入埠321、輸出埠322設置為例說明， 該四連接墊33是供電性連接件23電性連接時所用，形成 電導通後，@可將表面聲波晶片處理之預定頻寬之頻率信 號或特定頻率之共振信號向外傳輸。 、，罩覆殼34是以微影與侧製程，應用化學乾膜，例如 光阻、環氧樹脂、聚亞醯胺（p〇lyimide)、苯環丁烯 (BenZ〇cyclc)butene，BCB)、壓克力等為材料所製成，包含 一自基材31表面向上形成的周壁341，及一連結周壁341 魏的頂壁342，周壁341、頂壁342與基材31表面共同 =出-容置指又狀換能器32且使其與外界相隔絕的感應 二I 35頂壁342與指叉狀換能器32相間隔一預定距離。 每一電性接腳22間隔地環繞基板21設置，在本例中 以呈Z」子型態樣為例說明，每一電性接腳具有一連 12 l282l55 *疋可對應地與電路板相互電性連接。熟悉IC封裝人士 白知，電性接腳的態樣種類繁多，—般需視後續電性連接 反的種類、連接方式而有所不同，在此不再多加舉 母-電性連接件23是—可導電之金屬線，例如金線或 每—電性連接件23 S端分別對應地電性連接表面聲 波，片3其中之—連接塾33與其中之-電性接腳22的連 接口Ρ 221 ’而使表面聲波晶片3轉換處理後的預定頻寬之頻 率信號或特定頻率之共振信號經由電性連接件U、電性接 腳22、電路板向外傳遞。 封裝Μ 24是由高分子聚合物所形成（例如環氧樹脂 泣)，將基板2〗、表面聲波晶片3、每一電性接腳22之連接 部221，及每一電性連接件23包覆而不與外界接觸。 由於上述表面聲波晶片3本身已由罩覆殼34與基材Μ 表面界定出感應空Μ 35,而可供界限於内的指又狀換能器 32與部份基材31有足夠的空間相互配合以壓電效應方式傳 送表面聲波，所以本發明具有表面聲波晶片3之膠體封裝 構件2可以封裝膠體24包覆保護表面聲波晶片3，同時^ 並不影響表面聲波晶片3進行濾波或產生共振頻率信號的 功能。 參閱圖3,本發明具有表面聲波晶片之膠體封裝構件的 一第二較佳實施例，是與上述第一較佳實施例所述的膠體 封裝構件2相似，其不同處僅在於電性連接的方式。在本 13 1282155 例中表面聲波晶片4是以覆晶（flip-chip )封裝的概念， 藉由夕數可導電之金屬凸塊41 (bumping)代替可導電之金 屬線23，分別與電性接腳22相互電性連接，而經由電路板 向外傳遞轉換處理完成的預定頻寬之頻率信號或特定頻率 之共振信號。由於此等覆晶封裝的技術已為業界所周知， 在此不再多加贅述。 卢參閲圖4，本發明具有表面聲波晶片之膠體封裝構件的 一第二較佳實施例，是與上述二例相似，電性連接於一通 信產品例如手機的電路板（圖未示出）上，而可將轉換處 理成的預定頻寬之頻率信號或特定頻率之共振信號，經由 電路板向外傳遞，以提昇通信電子產品的通信品質。 、該朦體封裝構件5包含—基板51、—表面聲波晶片3 、複數電性連接件52、複數電性連接單元53,及—封裝膠 體51 。 、少 基板5丨具有複數電路（圖未示出），及複數電性接點 5U，該些電性接點511分別設置於基板51表面與基板51 底面，且與複數電路相互電性連接。 表面聲波晶片3與第-較佳實施例所述的表面聲波晶 片相似，在此不再重複累述。 每-電性連接件52是-可導電之金屬線，例如金線， 每-電性連接件52兩端分別對應地電性連接表面聲波晶片 3其中之-連接墊33與基板51表面之一電性接點5ιι。 地 每一電性連接單元53是 電性連接基板51底面之一 一可導電之金屬球，分別對應 電性接點511與電路板，而使 14 1282155 表面聲波晶片3轉換處理後之預定頻寬的頻率信號或特定 頻率的共振信號可經由電性連接件52、基板51之複數電性 接點511與電路、複數電性連接單元53,及電路板向外傳 遞。 封裝膠體54是由高分子聚合物所形成，自基板表 面向上形成，將表面聲波晶片3、複數電性連接件52包覆 而不與外界接觸。 與上述本發明表面聲波元件之第一、二較佳實施例相 似，由於上述表面聲波晶片3本身已由罩覆殼34與基材31 表面界定出感應空腔35，而可供界限於内的指又狀換能器 32與部份基材31有足夠的空間相互配合以壓電效應方式傳 送表面聲波，所以本發明具有表面聲波晶片3之膠體封裝 構件5可以封裝膠體54包覆保護表面聲波晶片3，而並不 影響表面聲波晶片3進行濾波或產生共振頻率信號的功能 〇 參閱圖5,本發明具有表面聲波晶片之膠體封裝構件的 一第四較佳實施例，是與上述第三較佳實施例所述的膠體 封袭構件5相似，其不同處僅在於電性連接的方式。在本 例中，表面聲波晶片6是以覆晶（flip-chip)封裝的概念， 藉由夕數可導電之金屬凸塊61 ( bumping )代替可導電之金 屬線52，分別與基板51的電性接點511相互電性連接，而 經由電路板向外傳遞轉換處理後之預定頻寬的頻率信號或 特疋頻率的共振信號。由於此等覆晶封裝的技術已為業界 所周知，在此不再多加贅述。 15 1282155 由於本發明膠體職構件2、5之表面聲波晶片3、4、 6’已由罩覆殼34與基材31表面界定出感應空腔％，而可 供界限於内的指又狀換能器32與部份基材Η有足夠的空 間相互配合以壓電效應方式轉換處理接收到的頻率信號， 所以本發明膠體封裝構件2、5可以封裝膠體方式包覆保護 表面聲波晶片3、4、6’因此’可以簡單的經由電路板、基 板21、51電路設計，將其他主動元件_、被動元件_ 與本發明膠體封裝構件2、5整合，形成例如圖6、圖7所 示的膠體封裝構件7、7，（圖示中分別以第三、四較佳實 施例所述之膠體封裝構件5為例說明），達到系統整合、縮 減電子產品體積的目的。 由上述說明可知，本發明具有表面聲波晶片之膠體封 衣構件2、5疋在表面聲波晶片3、4、6上，形成_可將指 又狀換能器32限制於内而與外界隔絕的罩覆殼％，藉由罩 ，殼34的保護’以及共同與基材31界定出供指叉狀換能 器32與晶基材3 i轉換處理接收到的頻率信號的感應空 腔35,而可以膠體封裝方式將此表面聲波晶片3、4、6封 裝成取體封^構件2、5，不但可與其他種類的主動元件 _、被動元件900纟同往系統晶片的方向整合研究發展， 同時，因為採用目前最多晶片所採用的膠體封裝方式封裝 ’、不但使膠體封裝構件2、5有多種態樣可以因應電性連接 於各式不同的電路板’同時也可以進_步降低材料成本， 避免業者的壟斷，確實達到本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 16 1282155 能以此限定本發明實施之範圍，即大凡依本發明申請專利 耗圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一側視圖，說明習知封裝構件之結構； 圖2疋一侧視圖，說明本發明具有表面聲波晶片之膠 體封哀構件的-第-較佳實施例的結構； 圖3疋一侧視圖，說明本發明具有表面聲波晶片之膠 體封裝構件的-第二較佳實施例的結構； 圖 4 9 / »、 疋一側視圖，說明本發明具有表面聲波晶片之膠 體封裝構件的-第三較佳實施例的結構； 圖 5 曰 ，》、 疋一側視圖，說明本發明具有表面聲波晶片之膠 體封虞構件的_第四較佳實施例的結構； " 圖 6 ® ^ 疋—側視圖，說明一被動元件及一主動元件整合 成本發明證一 俨㈣姓二較佳實施例所說明之具有表面聲波晶片之膠 體封裝構件的結構態樣；及 圖 7 θ 成本發明第視圖，說明一被動元件及-主動元件整合 體封裳構：佳實施例所說明之具有表面聲波晶片之膠 偁件的結構態樣。 17 1282155 【主要元件符號說明】 1 封裝構件 3 表面聲波晶片 11 封裝殼 31 基材 111 基板 32 指叉狀換能器 112 周壁 321 輸入埠 113 頂蓋 322 輸出埠 114 電性接腳 33 連接墊 115 内連接部 34 罩覆殼 116 外連接部 341 周壁 117 感應空腔 342 頂壁 12 表面聲波晶片 35 感應空腔 121 基材 4 表面聲波晶片 122 指叉狀換能器 41 金屬凸塊 123 輸入埠 5 膠體封裝構件 124 輸出埠 51 基板 125 連接墊 511 電性接點 13 電性連接件 52 電性連接件 2 膠體封裝構件 53 電性連接單元 21 基板 54 封裝膠體 22 電性接腳 6 表面聲波晶片 221 連接部 61 金屬凸塊 222 裸露部 7、7, 膠體封裝構件 23 電性連接件 800 主動元件 24 封裝膠體 900 被動元件 18The encapsulant colloids the connection portion of the substrate, and the plurality of electrical i 1282155 package members include a substrate, a surface acoustic wave wafer, a plurality of electrical connectors, a plurality of electrical connection units, and an encapsulant. The substrate has a plurality of circuits and a plurality of electrical contacts. The plurality of electrical contacts are respectively disposed on the surface of the substrate and the bottom surface of the substrate, and are electrically connected to the plurality of circuits. The surface acoustic wave wafer is mounted on the substrate, and comprises a substrate, a fork-shaped transducer formed on the surface of the substrate, and a plurality of connection pads electrically connected to the interdigitated transducer, and a cover shell formed from the surface of the substrate, the finger-shaped transducer receives the frequency signal and is subjected to surface acoustic wave conversion processing to form the predetermined signal, and the cover shell and the surface of the substrate together define a capacitance The interdigital transducer is placed to isolate the sensing cavity from the outside. The plurality of electrical connectors are respectively electrically connected to the plurality of electrical pads of the surface acoustic wave chip and the plurality of electrical contacts of the surface of the substrate. The plurality of electrical connection units are respectively electrically connected to the plurality of electrical contacts on the bottom surface of the substrate and the circuit board, and the predetermined signal is passed through the plurality of electrical connectors, the plurality of electrical contacts of the substrate, and the circuit, The plurality of electrical connection units and the circuit board are externally transferred. The encapsulant is formed upward from the surface of the substrate, and the surface acoustic wave crystal chip and the plurality of electrical connectors are covered without being in contact with the outside. The effect of the present invention is to provide a colloidal package member having a surface acoustic wave wafer which is colloidally encapsulated by a colloid. Since the colloidal package is currently the most versatile packaging method, the production cost can be effectively reduced, and a few industries are allowed to monopolize the market. [Embodiment] 10 1282155 The foregoing and other technical contents, features and advantages of the present invention are apparent from the following detailed description of the preferred embodiments of the invention. / 2] The preferred embodiment of the present invention has a colloidal package member for a surface acoustic wave wafer, which is electrically connectable to a circuit board (not shown) of a communication product such as a mobile phone. The frequency signal of the unwanted frequency band or the generation of a specific resonant frequency 'passes the processed it wave or resonance signal through the circuit board to improve the communication quality of the communication electronic product. The colloidal package member 2 includes a substrate 21, a surface acoustic wave plate 3, a plurality of electrical pins 22, a plurality of electrical connectors 23, and a package S body 24°. The substrate 2i is used for mounting the surface acoustic wave chip 3, the surface The acoustic wave wafer 3 includes a substrate 31, a finger transducer 32, a plurality of connection pads %, and a cover shell 34. The interdigitated transducer 32 is matched with the substrate 31 and formed on the surface of the substrate 31 with a spacing input 321 and an output nipple, and the input 埠321 and the output 槔322 are forked. After receiving a frequency signal from the input vehicle 321 and converting it into a surface acoustic wave 'passing through the surface of the partial substrate 31 to the output bee 322', the frequency signal of the predetermined bandwidth or the resonance signal of the specific frequency after converting the input 321 is processed. The surface of the sound is transmitted to the output 埠 322 of the transducer 32, and the surface acoustic wave converted by the processing is converted into a frequency signal of a predetermined bandwidth or a resonance signal of a specific money rate and then output to the external sound. . According to the basic operation principle of the surface acoustic wave wafer 3, the substrate 31 is 1282155 by a single crystal material such as quartz, a sharp acid clock, a neo acid clock, an acid clock, a Langasite, or the like, or a non-piezoelectric material. The conductive material is composed of a piezoelectric film material such as a growth oxidized word or an oxidized PZT; and the interdigitated transducer 32 is a non-electrical electrode. Since the mutual selection of the substrate 31 and the interdigitated transducer I2 must be based on the application of the surface acoustic wave wafer 3, for example, the modality to be transmitted, the signal frequency to be processed, etc., according to the substrate Η = electromechanical The light combination coefficient, dielectric constant, temperature coefficient, crystal direction, cost price, etc. are selected to match the application, so no more examples of the substrate can be used here: the type and the related mode formed by the combination of the fingers and the transducer 32 state. π is formed on the surface of the substrate 31, and is electrically connected to the finger-like transducer 32. In this example and the illustration, the connection port 33 is connected, and the two electrodes are electrically connected to the input port 321 respectively. The output port 322 is set as an example. The four connection pads 33 are used when the power supply connector 23 is electrically connected. After the electrical conduction is formed, the frequency signal of the predetermined bandwidth or the resonance of the specific frequency can be processed by the surface acoustic wave wafer. The signal is transmitted out. The cover shell 34 is a lithography and side process, using a chemical dry film such as photoresist, epoxy resin, p〇lyimide, BenZ〇cyclc butene, BCB) , acryl or the like is made of a material, comprising a peripheral wall 341 formed upward from the surface of the substrate 31, and a top wall 342 connecting the peripheral wall 341, the peripheral wall 341, the top wall 342 and the surface of the substrate 31 together = out - The sensing diode 35, which houses the transducer 32 and is isolated from the outside, is spaced from the interdigitated transducer 32 by a predetermined distance. Each of the electrical pins 22 is disposed around the substrate 21 at intervals. In this example, the Z" sub-type is taken as an example. Each of the electrical pins has a connection of 12 l282l55 * 疋 which can be electrically connected to the circuit board correspondingly. Sexual connection. Familiar with the IC package, Bai Zhi, the variety of electrical pin types, generally need to be different depending on the type and connection method of the subsequent electrical connection, no longer the parent-electrical connector 23 is The conductive metal wire, for example, the gold wire or the S-terminal of each of the electrical connectors 23 is electrically connected to the surface acoustic wave, respectively, and the connection port 33 of the wire 3 and the electrical pin 22 therein is connected. The frequency signal of the predetermined bandwidth or the resonance signal of the specific frequency after the surface acoustic wave wafer 3 is converted and processed is transmitted to the outside through the electrical connector U, the electrical pin 22, and the circuit board. The package Μ 24 is formed of a polymer (for example, epoxy resin), the substrate 2, the surface acoustic wave chip 3, the connection portion 221 of each of the electrical pins 22, and each of the electrical connectors 23 Covered without contact with the outside world. Since the surface acoustic wave wafer 3 itself has defined the induction space 35 by the cover shell 34 and the substrate Μ surface, the finger-like transducer 32 and the partial substrate 31 which are available for the inner space have sufficient space for each other. In combination with the piezoelectric effect, the surface acoustic wave is transmitted. Therefore, the colloidal package member 2 having the surface acoustic wave wafer 3 can be coated with the colloid 24 to protect the surface acoustic wave wafer 3, and does not affect the surface acoustic wave wafer 3 for filtering or generating a resonance frequency. The function of the signal. Referring to FIG. 3, a second preferred embodiment of the colloidal package member having a surface acoustic wave wafer is similar to the colloidal package member 2 of the first preferred embodiment described above, except that the electrical connection is only the way. In the case of the present invention, the surface acoustic wave wafer 4 is in the form of a flip-chip package, and the electrically conductive metal wires 23 are replaced by electrically conductive metal bumps 41, respectively, and electrically connected. The legs 22 are electrically connected to each other, and the frequency signal of a predetermined bandwidth or the resonance signal of a specific frequency that is converted and processed is transferred outward through the circuit board. Since the technology of such flip chip packaging is well known in the industry, it will not be repeated here. Referring to FIG. 4, a second preferred embodiment of a colloidal package member having a surface acoustic wave chip is similar to the above two examples, and is electrically connected to a circuit board of a communication product such as a mobile phone (not shown). In the above, the frequency signal of the predetermined bandwidth or the resonance signal of the specific frequency can be transmitted to the outside through the circuit board to improve the communication quality of the communication electronic product. The body package member 5 includes a substrate 51, a surface acoustic wave chip 3, a plurality of electrical connectors 52, a plurality of electrical connection units 53, and an encapsulant 51. The substrate 5 has a plurality of circuits (not shown) and a plurality of electrical contacts 5U. The electrical contacts 511 are respectively disposed on the surface of the substrate 51 and the bottom surface of the substrate 51, and are electrically connected to the plurality of circuits. The surface acoustic wave wafer 3 is similar to the surface acoustic wave crystal described in the first preferred embodiment, and the description thereof will not be repeated here. Each of the electrical connectors 52 is a conductive metal wire, such as a gold wire, and each of the two ends of the electrical connector 52 is electrically connected to one of the surfaces of the surface acoustic wave chip 3 and the surface of the substrate 51. Electrical contact 5 ιι. Each of the electrical connection units 53 is electrically conductively connected to one of the bottom surfaces of the substrate 51, and is electrically conductive, corresponding to the electrical contacts 511 and the circuit board, and the predetermined bandwidth of the 14 1282155 surface acoustic wave wafer 3 is converted. The frequency signal or the resonance signal of the specific frequency can be transmitted outward through the electrical connection member 52, the plurality of electrical contacts 511 of the substrate 51 and the circuit, the plurality of electrical connection units 53, and the circuit board. The encapsulant 54 is formed of a high molecular polymer and is formed upward from the surface of the substrate, and covers the surface acoustic wave crystal 3 and the plurality of electrical connectors 52 without coming into contact with the outside. Similar to the first and second preferred embodiments of the surface acoustic wave device of the present invention described above, since the surface acoustic wave wafer 3 itself has been defined by the cover shell 34 and the surface of the substrate 31, the sensing cavity 35 is available for the inner limit. The capacitive transducer 32 and the partial substrate 31 have sufficient space to cooperate to transmit the surface acoustic wave in a piezoelectric effect manner. Therefore, the colloidal package member 5 having the surface acoustic wave wafer 3 of the present invention can be encapsulated to protect the surface acoustic wave. The wafer 3 does not affect the function of the surface acoustic wave wafer 3 for filtering or generating a resonance frequency signal. Referring to FIG. 5, a fourth preferred embodiment of the colloidal package member having a surface acoustic wave wafer is compared with the third The colloidal encapsulation member 5 described in the preferred embodiment is similar except that it is electrically connected. In this example, the surface acoustic wave wafer 6 is in the form of a flip-chip package, in which the electrically conductive metal wires 52 are replaced by the conductive conductive metal bumps 61, respectively, with the substrate 51. The sexual contacts 511 are electrically connected to each other, and the frequency signal of the predetermined bandwidth or the resonance signal of the characteristic frequency is converted and transmitted via the circuit board. Since the techniques of such flip chip packages are well known in the art, they will not be repeated here. 15 1282155 Since the surface acoustic wave wafers 3, 4, 6' of the colloidal members 2, 5 of the present invention have defined the induction cavity % by the cover shell 34 and the surface of the substrate 31, the fingers for the boundary are changed. The energy collector 32 and the partial substrate have sufficient space to cooperate to convert and process the received frequency signal in a piezoelectric effect manner, so the colloidal package members 2, 5 of the present invention can be encapsulated and coated to protect the surface acoustic wave wafer 3, 4 6' can therefore be simply integrated via the circuit board, substrate 21, 51 circuit design, and other active components, passive components _, and the inventive colloidal package members 2, 5 to form a colloid such as shown in Figures 6 and 7. The package members 7 and 7 are illustrated by taking the colloidal package member 5 described in the third and fourth preferred embodiments as an example to achieve system integration and reduce the volume of the electronic product. As can be seen from the above description, the colloidal sealing members 2, 5 having the surface acoustic wave wafer of the present invention are formed on the surface acoustic wave wafers 3, 4, 6 so as to be able to confine the finger-like transducer 32 to the outside. The cover case %, by means of the cover, the protection of the case 34, and together with the substrate 31 define an induction cavity 35 for converting the received frequency signal by the interdigitated transducer 32 and the crystal substrate 3 i, The surface acoustic wave wafers 3, 4, and 6 can be packaged into the body sealing members 2, 5 in a colloidal package manner, and can be integrated with other types of active components, passive components, and the direction of the system wafer. Because it adopts the current package packing method of the most wafers, not only the colloidal package members 2, 5 can be electrically connected to different circuit boards, but also can reduce the material cost. Avoiding the monopoly of the operator does achieve the object of the present invention. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the scope of the present invention, that is, the simple equivalent of the patent application and the description of the invention according to the present invention. Variations and modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view showing the structure of a conventional package member; FIG. 2 is a side view showing the structure of a first preferred embodiment of the colloidal sealing member having a surface acoustic wave wafer of the present invention. Figure 3 is a side elevational view showing the structure of the second preferred embodiment of the colloidal package member of the surface acoustic wave wafer of the present invention; Figure 4 9 / », a side view illustrating the colloid of the surface acoustic wave wafer of the present invention The structure of the third preferred embodiment of the package member; Fig. 5 is a side view showing the structure of the fourth preferred embodiment of the colloidal sealing member of the surface acoustic wave wafer of the present invention; " 6 ® ^ 疋 - side view, illustrating a passive component and an active component integration cost invention certificate (4) the structural aspect of the colloidal package member having the surface acoustic wave chip described in the preferred embodiment; and Figure 7 θ cost DETAILED DESCRIPTION OF THE INVENTION A passive component and an active component are integrated to illustrate the structural aspects of a capsule having a surface acoustic wave chip as described in the preferred embodiment. 17 1282155 [Description of main component symbols] 1 Package member 3 Surface acoustic wave wafer 11 Package case 31 Substrate 111 Substrate 32 Interdigital transducer 112 Peripheral wall 321 Input 埠 113 Top cover 322 Output 埠 114 Electrical pin 33 Connection pad 115 Inner connecting portion 34 Covering shell 116 Outer connecting portion 341 Peripheral wall 117 Inductive cavity 342 Top wall 12 Surface acoustic wave wafer 35 Induction cavity 121 Substrate 4 Surface acoustic wave wafer 122 Interdigitated transducer 41 Metal bump 123 Input 埠 5 Colloidal package member 124 output 埠51 substrate 125 connection pad 511 electrical contact 13 electrical connector 52 electrical connector 2 colloidal package member 53 electrical connection unit 21 substrate 54 package colloid 22 electrical pin 6 surface acoustic wave wafer 221 Connection portion 61 metal bump 222 bare portion 7, 7 , colloidal package member 23 electrical connector 800 active device 24 encapsulant 900 passive component 18