12808444twf.doc/e 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種音頻電路 防電磁干擾之音頻電路。 【先前技術】12808444twf.doc/e IX. Description of the Invention: [Technical Field] The present invention relates to an audio circuit for preventing electromagnetic interference of an audio circuit. [Prior Art]
主機板（main board)可說是整部電腦之核心元件， ^負責各零件彼此之間訊號與資料的傳遞工作，而目前各 家主機板廠商也針對越來越多元化的使用需求，辦加= 周邊裝置連接埠，例如音頻連接器（audi〇 c〇nne(Jr)、刪 ^面連接埠或〗删腦介面連鱗，喷高產品的應用 。因此，各廠商的品質管制也相當重要，從系統平臺、 ，憶體架構、周邊裝置的相容性，甚至是高速介面的^援 能力等等方©，均全面性考量，以決定往後系統運作是否 穩定與可靠的重要依據。The main board can be said to be the core component of the whole computer. ^Responsible for the transmission of signals and data between the various parts. At present, various motherboard manufacturers are also targeting more and more diversified use requirements. = Peripheral device connection, such as audio connector (audio c〇nne (Jr), delete face connection or 删 脑 介 介 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , From the system platform, the memory structure, the compatibility of peripheral devices, and even the high-speed interface support capabilities, etc., are comprehensive considerations to determine whether the future system operation is stable and reliable.
且特別是有關於一種 第1圖繪示習知一種音頻電路的電路示意圖。請象考 f 1圖，音頻電路100主要包括一基板110、一音頻連接 器120以及—音頻處理晶片13G。基板11G例如為四層蕊 板之主機板，其外層之蕊板上可配置多種電子元件（未繪 示）例如被處理為、糸統晶片以及周邊輸入/輸出連接埠， 以負責各電子元件彼此之間訊號與資料的傳遞工作。此 外曰頻連接為I20與音頻處理晶片130同樣配置於基板 U0之表面（弟一層為板）且兩者彼此電性連接。其中， ^頻連接器120具有多數個訊號端子122a、122b以及多個 音頻接地端子124,而電源訊號端子122&例如由音頻處理 I2808M twf.doc/e 晶片130或主機板來提供一工作電壓v。當麥克風 (microphone )等受話器（未繪示)與音頻連接器12〇之訊號 端子122a、122b連接時，外部的音頻訊號傳送至音頻處理 晶片130，並將音頻訊號轉換成一數位訊號。 請芩考第1圖，值得注意的是，習知為了解決麥克風 的噪音問題’特地在基板11〇上配置一音頻接地線（Agnd trace) 112與一音頻接地區AGND，而音頻接地線112連 接於音頻連接器120之音頻接地端子124與音頻接地區 AGND之間，以使音頻連接器12〇的音頻接地端子124與 音頻處理晶片130的接地接點134連接於同一個音頻接地 區AGND上’以減少雜訊之干擾。其中，音頻接地區agnd 例如位於音頻處理晶片丨3〇所在位置的下方第1層、第2 層、第3層或第4層的蕊板上。 然而，音頻接地線112雖可解決麥克風之噪音問題， =其缺點為當音頻接地線112上有電磁波干擾(歷，More particularly, it relates to a circuit diagram of a conventional audio circuit. The audio circuit 100 mainly includes a substrate 110, an audio connector 120, and an audio processing chip 13G. The substrate 11G is, for example, a motherboard of a four-layer core board, and a plurality of electronic components (not shown) can be disposed on the outer layer of the substrate, for example, processed as a ceremonial wafer and a peripheral input/output connection port to be responsible for each electronic component. The transmission of signals and information between them. Further, the I20 is connected to the surface of the substrate U0 in the same manner as the audio processing chip 130 (the first layer is a board) and the two are electrically connected to each other. The frequency connector 120 has a plurality of signal terminals 122a, 122b and a plurality of audio ground terminals 124, and the power signal terminal 122 & for example, provides an operating voltage v by the audio processing I2808M twf.doc/e chip 130 or the motherboard. . When a receiver (not shown) such as a microphone is connected to the signal terminals 122a, 122b of the audio connector 12, the external audio signal is transmitted to the audio processing chip 130, and the audio signal is converted into a digital signal. Please refer to FIG. 1 , it is worth noting that in order to solve the noise problem of the microphone, an audio ground line (Agnd trace) 112 and an audio connection area AGND are arranged on the substrate 11 , and the audio ground line 112 is connected. Between the audio ground terminal 124 of the audio connector 120 and the audio connection area AGND, the audio ground terminal 124 of the audio connector 12A and the ground contact 134 of the audio processing chip 130 are connected to the same audio connection area AGND. To reduce the interference of noise. The audio connection area agnd is, for example, located on the first layer, the second layer, the third layer or the fourth layer of the audio processing chip 丨3〇. However, although the audio ground line 112 can solve the noise problem of the microphone, the disadvantage is that when there is electromagnetic interference on the audio ground line 112 (calendar,
Interferenee)之雜訊時，因音頻接地線ιΐ2 ，長度過長㈣發的天線效應，容易導致顧 證明，在進行防制EMI雜訊娜; 時測得其雜訊值超出標準⑽:的;二二= 在防制EMI㈣祕t 據可知1知音頻電路綱 【發的作法上，必須尋求其他解決之道。 6 1280844 '4twf.doc/e 因此，本發明的目的就是在提供—種防電磁 頻電路，以解決電磁干擾的問題。 义之音Interferenee's noise, due to the audio grounding line ιΐ2, the length of the antenna is too long (four), it is easy to lead to the proof, in the prevention of EMI noise; when the noise value exceeds the standard (10): Second = in the prevention of EMI (four) secret t According to the knowledge of the audio circuit, you must seek other solutions. 6 1280844 '4twf.doc/e Therefore, the object of the present invention is to provide an anti-electromagnetic frequency circuit to solve the problem of electromagnetic interference. Sound of righteousness
為達本發明之上述目的，本發明提出一種防 之音頻電路，主要包括一基板、—音頻連接器、一土干擾 理晶片以及-接地電容。音頻連接器與音頻處理S =員處 於基板上且兩者電性連接，而音頻連接器適於接收=置 -音頻訊號，並將音頻訊號傳制音頻處理晶片之。，丨之 轉換成-數位訊號。此外，基板具有—音頻接地區、二 頻接地線與-接地端，而音頻連接器具有—音 二 子，其藉由音頻接地線而連接至音頻接地區。另外， 電容配置於基板上，並鄰近於音頻連脑、，接地 -端以及-第二端’而第—端電性連接音頻接地線有 且弟-端f性連接於接地端，以消除電磁干擾之雜訊。In order to achieve the above object of the present invention, the present invention provides an audio circuit for protection, which mainly includes a substrate, an audio connector, a ground interference chip, and a grounding capacitor. The audio connector and audio processing S = the member is on the substrate and the two are electrically connected, and the audio connector is adapted to receive the = audio signal and pass the audio signal to the audio processing chip. , 丨 convert to a digital signal. In addition, the substrate has an audio-connected area, a two-frequency ground line and a grounded end, and the audio connector has a tone-two, which is connected to the audio-connected area by an audio ground. In addition, the capacitor is disposed on the substrate, adjacent to the audio brain, the ground-end and the second end, and the first end is electrically connected to the audio ground wire and the other end is connected to the ground end to eliminate the electromagnetic Interference noise.
依照本發_較佳實施綱述，上述之訊號端子例如 匕括-電源訊號端+，而音頻處理晶片卩有—電源 端，其連接於上述之電源訊號端子。另外，音頻處理晶片 例如具有-接地接點，其與音親接器連接於同—音頻接 地區。 本發關制接地餘（eapadtGf)來賴電磁干擾 的雜訊i使其第—猶接於音頻接地線，而第二端則連接 ^妾也鈿口此日頻接地線因天線效應所產生電磁干擾的 雜Λ、^大中田降低，以符合防制謝工雜訊之測試標準。 ，讓本U之上述和其他目的、特徵、和優點能更明 …、重下文特舉一較佳實施例，並配合所附圖式，作詳 7 12808444twf.d〇c/e 細說明如下： 【實施方式】 。、凊芩考第2圖，其繪示本發明一較佳實施例之一種防 電磁干擾之音頻電路的電路示意圖。防電磁干擾之音頻電 路=00主要包括一基板21〇、一音頻連接器22〇、一音頻處 理曰日片幻〇以及一接地電容240。基板210例如為四層蕊 板^主機板，其外層之蕊板上可配置多種電子元件（未繪 不）’，如微處理器、系統晶片以及周邊輸入/輸出連接埠， 以負f各電子元件彼此之間訊號與資料的傳遞工作。此 外，音頻連接器220與音頻處理晶片23〇同樣配置於基板 =〇之表面（第一層的蕊板）且兩者彼此電性連接。其中， 曰頻連接器220具有多數個訊號端子222a、222b以及多個 音頻接地端子224，而一訊號端子222a(即電源訊號端子） 例如由音頻處理晶片23〇或主機板之電源輸出端來提 供一工作電壓V，且另一訊號端子222b則傳輸一類比訊號 MIC田麥克風荨受話器（未繪示）與音頻連接器220之 訊號端子222a、222b連接時，外部的音頻訊號可由訊號端 子222b傳送至音頻處理晶片23〇，並將音頻訊號轉換成一 數位訊號。 睛芩考第2圖，基板21〇上配置有一音頻接地區AGND $一音頻接地線212，而音頻接地線212連接於音頻連接 态220之音頻接地端子224與音頻接地區AGND之間，以 使音頻連接器220的音頻接地端子224與音頻處理晶片 \ 230的接地接點234連接於同一個音頻接地區AGND上， 128084^ twf.doc/e 以減少雜訊之干擾。其+，音麵地區AGND例如位於音 頻處理晶片230所在位置的下方第1層、第2層、第3層 或第4層的蕊板上。 9 值得注意的是，為了解決習知音頻接地線212的長度 過長而引發的天線效應’特別配置—接地電容·於基板 210上，並且接地電容240鄰近於音頻連接器22〇，而接地 電谷240具有一第一端242以及一第二端244，第一端242 連接音頻接地線212 ,而第二端244則連接基板21〇之一 接地端GND。此接地# GND例如為數位訊號之接地端， 其與類比訊號的音頻接地區AGND不同，兩者例如位於不 同層的蕊板或同一層但有相互隔離的蕊板上，以使基板 210上的數位訊號與類比訊號不共用同一個接地端。 由於接地電容240可過濾電磁干擾的雜訊，使得音頻 接地線212上之雜訊可經由接地電容24〇流通至接地端 GND，因此音頻接地線212因天線效應所產生電磁干擾的 雜訊，將大幅降低，以符合防制EMI雜訊之測試標準。 經由實驗證明，當配置一 〇 〇1法拉的接地電容24〇於 基板210上，而音頻處理晶片23〇的工作頻率設定在 24·57ΜΗζ時，最後在147·48ΜΗζ時測得其雜訊值低於標 準12.86dB，明顯比未配置接地電容24〇時所測得之數據 (超出標準6.95dB)改善許多，故本發明之音頻電路在防 制EMI雜訊的作法上，確實能得到有效的功效，並符合國 際上防制EMI雜訊之測試標準。 另外，為使原先的音頻接地線212同樣具有消除麥克 9 128084^4twf.doc/e 風的噪音的功能，音頻接地線212還可配置一短路設定 (jumper setting)元件25〇，其連接於音頻接地區agnd 與接地電容240之第一端242之間 並可以軟體設定其功According to the preferred embodiment of the present invention, the signal terminal includes, for example, a power signal terminal +, and the audio processing chip has a power supply terminal connected to the power signal terminal. In addition, the audio processing chip has, for example, a grounding contact that is connected to the audio-communication area. The power-off system grounding (eapadtGf) relies on the electromagnetic interference of the noise i to be connected to the audio ground wire, and the second end is connected to the 妾 妾 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此The interference of the chowder, ^ Dazhongtian is reduced to meet the test standards for the prevention of Xiegong noise. The above and other objects, features, and advantages of the present invention will become more apparent. The following detailed description of the preferred embodiments and the accompanying drawings, the details of which are described in the following paragraphs: 12 12808444 twf.d〇c/e [Embodiment] 2 is a circuit diagram of an audio circuit for preventing electromagnetic interference according to a preferred embodiment of the present invention. The anti-electromagnetic interference audio circuit = 00 mainly includes a substrate 21 〇, an audio connector 22 〇, an audio processing 曰 〇 〇 and a grounding capacitor 240. The substrate 210 is, for example, a four-layer core board, and the outer layer of the core board can be configured with various electronic components (not shown), such as a microprocessor, a system chip, and a peripheral input/output port, to negatively The transmission of signals and data between components. In addition, the audio connector 220 is disposed on the substrate = the surface of the substrate (the core of the first layer) and the two are electrically connected to each other. The frequency connector 220 has a plurality of signal terminals 222a, 222b and a plurality of audio ground terminals 224, and a signal terminal 222a (ie, a power signal terminal) is provided, for example, by an audio processing chip 23 or a power output of the motherboard. When the operating voltage V and the other signal terminal 222b transmit a analog signal MIC field microphone (not shown) and the signal terminals 222a, 222b of the audio connector 220, the external audio signal can be transmitted to the signal terminal 222b to The audio processing chip 23〇 converts the audio signal into a digital signal. In the second drawing, an audio connection area AGND $ an audio ground line 212 is disposed on the substrate 21, and the audio ground line 212 is connected between the audio ground terminal 224 of the audio connection state 220 and the audio connection area AGND, so that The audio ground terminal 224 of the audio connector 220 and the ground contact 234 of the audio processing chip \ 230 are connected to the same audio connection area AGND, 128084^twf.doc/e to reduce noise interference. The +, sound plane area AGND is, for example, located on the first, second, third or fourth layer of the lower layer of the audio processing wafer 230. 9 It is worth noting that in order to solve the antenna effect caused by the length of the conventional audio ground line 212 being too long, the special configuration - the grounding capacitance is on the substrate 210, and the grounding capacitor 240 is adjacent to the audio connector 22, and the grounding is The valley 240 has a first end 242 and a second end 244. The first end 242 is connected to the audio ground line 212, and the second end 244 is connected to one of the grounding ends GND of the substrate 21. The ground # GND is, for example, the ground of the digital signal, which is different from the audio connection area AGND of the analog signal, for example, on the core plate of the different layers or the same layer but separated from each other to make the substrate 210 The digital signal and the analog signal do not share the same ground. Since the grounding capacitor 240 can filter the electromagnetic interference noise, the noise on the audio ground line 212 can flow to the ground GND via the grounding capacitor 24, so the audio grounding line 212 generates electromagnetic interference noise due to the antenna effect. Significantly reduced to meet the test standards for EMI noise prevention. It has been experimentally proved that when the grounding capacitor 24 of the 法1 Farad is disposed on the substrate 210, and the operating frequency of the audio processing chip 23〇 is set at 24·57ΜΗζ, the noise value is finally measured at 147·48ΜΗζ. At the standard 12.86dB, it is obviously much better than the data measured when the grounding capacitor is not configured 24〇 (beyond the standard 6.95dB). Therefore, the audio circuit of the present invention can effectively achieve the effect of preventing EMI noise. And in line with the international standards for the prevention of EMI noise. In addition, in order to make the original audio ground line 212 also have the function of eliminating the noise of the microphone 9 128084^4twf.doc/e wind, the audio ground line 212 can also be configured with a jumper setting element 25, which is connected to the audio. Between the area agnd and the first end 242 of the grounding capacitor 240, the work can be set in software
标上所連，本發明之防電磁干擾的音頻電路，主要包 ^-基板、-音頻連接器、—音頻處理晶片以及一接地電 谷曰頻連接為與音頻處理晶片配置於基板上且兩者電性 連接’而音頻連接&適於接收外部之—音頻訊號，並將音 頻訊號傳_音頻處理晶片之中，以轉換成—數位訊號。 此外’基板具有一音頻接地區、一音頻接地線與一接地端， =音頻連接器具有-音頻接地端子，其藉由音頻接地線而 、、接至音賴地區。另外，接地電容配置於基板上，並鄰 近於9頻連接态，接地電容具有一第一端以及一第二端， :第了端紐連接音頻接地線，且第二端電性連接於接地 知以’肖除曰頻接地線上之電磁干擾的雜訊。 、，然本發明已以一較佳實施例揭露如上，然其並非用 =限疋本發明，任何熟習此技藝者，在不脫離本發明之精 當可作些許之”與潤飾，因此本發明之保 圍萄視後附之申请專利範圍所界定者為準。 【圖式簡單說明】 ，1圖繪示習知一種音頻電路的電路示意圖。 ^ 2崎示本發明—較佳實_之—種防電磁干擾之 曰，頁電路的電路示意圖。 【主要元件符號說明】 twf.doc/e 100 ： 音頻電路 110 ： 基板 112 ： 音頻接地線 120 ： 音頻連接器 122a 、122b :訊號端子 12808444 124 :音頻接地端子 130 ··音頻處理晶片 134 :接地接點As shown in the figure, the anti-electromagnetic interference audio circuit of the present invention mainly comprises a substrate, an audio connector, an audio processing chip, and a grounded electrical grid connection for being disposed on the substrate with the audio processing chip and both The electrical connection 'and the audio connection' is adapted to receive an external audio signal and to transmit the audio signal to the audio processing chip for conversion to a digital signal. In addition, the substrate has an audio connection area, an audio ground line and a ground terminal, and the audio connector has an audio ground terminal that is connected to the sound area by the audio ground line. In addition, the grounding capacitor is disposed on the substrate and adjacent to the 9-frequency connection state, the grounding capacitor has a first end and a second end, the first end is connected to the audio grounding wire, and the second end is electrically connected to the grounding To eliminate the noise of electromagnetic interference on the grounding line. The present invention has been disclosed in a preferred embodiment as above, but it is not intended to limit the invention, and anyone skilled in the art can make some modifications and refinements without departing from the spirit of the invention, and thus the present invention. The definition of the scope of the patent application attached to the warranty is subject to the terms of the patent application. [Simple diagram of the diagram], Figure 1 shows a schematic circuit diagram of a conventional audio circuit. ^ 2 shows the invention - better _ - Circuit diagram of anti-electromagnetic interference, circuit diagram of page circuit [Description of main component symbols] twf.doc/e 100 : Audio circuit 110 : Substrate 112 : Audio ground wire 120 : Audio connector 122a , 122b : Signal terminal 12808444 124 : Audio Ground Terminal 130 ··Audio Processing Wafer 134: Ground Contact
200 :防電磁干擾之音頻電路 210 :基板 212 :音頻接地線 220 :音頻連接器 222a、222b :訊號端子 224 :音頻接地端子 230 :音頻處理晶片 232 :電源輸出端 234 :接地接點 240 :接地電容 242 ··第一端 244 ··第二端 250 :短路設定元件 11200: Anti-electromagnetic interference audio circuit 210: Substrate 212: Audio ground wire 220: Audio connector 222a, 222b: Signal terminal 224: Audio ground terminal 230: Audio processing chip 232: Power output terminal 234: Ground contact 240: Ground Capacitor 242 ··First end 244 ··Second end 250: Short circuit setting element 11