TWI276099B - Substrate molding device, disk substrate and substrate molding method - Google Patents

Abstract

A molding method is disclosed that is capable of making a molding cycle short while maintaining planarity of a disk substrate molded via a separation process. A separation resisting part having a roughened surface is formed on an inner surface of a mold at a position corresponding to an outer circumference of the disk substrate to be molded. The inner surface of the separation resisting part is roughened by distributing dots, or lines, or their combinations on the inner surface of the mold. The separation resisting part generates a resistance on the outer circumference of the disk substrate when separating the disk substrate from a stamper, and thereby maintaining the planarity of the disk substrate, and improves separation ability of the disk substrate when separating the disk substrate from the mold, thereby reducing the time length of the molding cycle.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk-shaped substrate for manufacturing an optical disk by using a synthetic resin, a molding apparatus for forming a disk-shaped substrate, and a method of molding the same. [Prior Art] Generally, a dish-shaped substrate used for manufacturing an optical disk is formed of a synthetic resin such as a polycarbonate resin by using an injection molding apparatus. The injection molding apparatus includes a fixed mold and a movable mold which form a recess conforming to the dish-shaped substrate to be molded. For example, on the surface of the fixed mold defining the recess, a convex and concave pattern of the music signal conforming to other information signals is formed, and this is a so-called printer which is used to form a representative information desired. A pit or pre-pattern of the track of the signal. On the side of the movable mold, a punch is used to pierce the hole for locking the central member at the center of the projection. When the disk substrate is molded using such a mold device, the molten synthetic resin is injected to fill the cavity via the pouring sleeve injection port disposed on the fixed mold. However, after the disc substrate is molded into the recess, the punch is moved to pierce the hole for locking the central member at the center portion, however, pits or pre-forms are formed on the main surface of the disc substrate. With respect to such a disk-shaped substrate mold device, for example, Japanese Patent Laid-Open Publication No. 0 3 0 0 1 0 No. 3 discloses an invention in which the side of the movable mold is formed by the circumferential direction of the movable mold. The point-like projections and the separation resistance caused by the holes or the annular projections and the grooves are provided on the outer surface of the disk substrate or on the convex inner surface of the -4- (2) 1276099 in the center. In the invention shown in the above Japanese Patent Publication No. 0 3 0 1 1 0 3, the molded disk-shaped substrate is easily and reliably separated from the printer (this is a so-called w first separation crucible). . The dish substrate is molded by a printer having a convex and concave pattern for forming pits or pre-patterns as a recording track.

However, if it is desired to shorten the length of the plastic cycle, after the step of separating the disk substrate from the printer, and when separating the disk substrate from the movable mold (this is the so-called 'second separation 〃), The separation resistance caused by the dot-like projections and the holes or the annular projections and the grooves formed along the circumferential direction of the movable mold is increased, and the dish substrate cannot be easily separated from the movable mold. Therefore, as described above, the flatness of the dish substrate is inclined; and mechanical characteristics such as vibration, circumferential tilt, and radial tilt are inclined; the resulting disc substrate cannot be used to manufacture a disc. In particular, recent and ongoing DVDs such as DVD+R/RW are widely used, and DVD discs require (3⁄4 speed recording. In order to achieve speed recording, the flatness of the disc substrate is important, and has the above The problem of the dish-shaped substrate is not suitable. In other words, in the invention shown in the above-mentioned Japanese Patent Publication No. 0 3 0 0 1 0 3, there is a disc-shaped substrate self-printer due to separation of the impedance member. The impedance of the separation, and the invention cannot shorten the length of the plastic cycle, however, it only focuses on the performance (first separation) of separating the disk substrate from the printer. [Summary of the Invention] 1276099 (3) The present invention A general object is to solve one or more problems of the related art. A specific object of the present invention is to provide a method capable of shortening the length of a plastic cycle while maintaining the flatness of a disk-shaped substrate molded via a separation process. An embodiment provides a molding apparatus for forming a disk-shaped substrate from a synthetic resin, comprising: a fixed mold; and a movable mold, the movable mold and the fixed mold forming a plastic dish a cavity in which the substrate is formed, wherein the separation resistance member having a rough surface is disposed on an inner surface of at least one of the fixed mold and the movable mold conforming to the outer peripheral surface of the disk substrate, and the dish substrate is held in the fixed mold And in one of the movable molds. In the present invention, the separation resistance member having a rough surface is provided on the inner surface of the fixed mold or the movable mold which conforms to the outer peripheral surface of the disk substrate. When the synthetic resin of the cavity is formed into a disk-shaped substrate, the separation resistance member generates an impedance on the outer circumference of the disk substrate, and the printer functions as a side surface of the cavity, thereby maintaining the separation of the disk substrate from the printer. The flatness of the dish substrate. When the disc substrate is separated by the mold device, the separation of the impedance member improves the separation ability of the outer peripheral surface of the disc substrate. As a result, even when the length of the plastic period is shortened for the control plastic molding, The disk-shaped substrate can be separated from the mold device while maintaining the flatness of the disk-shaped substrate. In contrast, the above-mentioned Japanese Patent Publication No. 0 3 3 0 1 1 3, the separation impedance portion When the disk substrate is separated from the printer, only the impedance is generated on the outer circumference of the disk substrate. As an embodiment, the rough surface of the separation impedance member has a plurality of dots -6 - (4) 1276099 convex or dot-like concave , or a plurality of linear protrusions or linear recesses, or a combination of dot-like and linear protrusions or recesses are distributed thereon. As an embodiment, the rough surface of the separation impedance component has an impedance of not less than 18 mm 2 . Producing an area; and the rough surface of the separation impedance member includes at least two columns of protrusions or recesses in a direction in which the molded disc substrate is pulled out, and each of the protrusions or recesses has a depth of 3em to 90// More preferably, each of the convex or concave depths on the rough surface of the separation impedance member is in the range of 3/m to 20/m. As an embodiment, the rough surface of the impedance member is separated. Formed on the inner surface of at least one of the fixed mold and the movable mold by roughening. Preferably, the roughening treatment includes WP C (wide hammer and chamfer) treatment, bead blasting treatment, bead blast treatment, dimple treatment, cutting or polishing by using a cutter having a fine rough surface, and use A process that can roughen the chemical elements or solutions on the metal surface. According to a second aspect of the present invention, there is provided a dish-shaped substrate formed of a synthetic resin by using a mold device, comprising: an outer peripheral surface roughened by a separation resistance member having a rough surface of a mold device, the separation resistance member having roughness surface. According to a third aspect of the present invention, there is provided a method of molding a disk substrate by using a mold device including a fixed mold and a movable mold, the method comprising the steps of: filling a plastic cavity with a synthetic resin, the plastic The recess is formed by a fixed mold and a movable mold and has a printer for transfer as a side surface thereof, the plastic recess including at least a fixed mold and a movable mold that conform to an outer peripheral surface of the disc substrate a separation impedance on the inner surface of one - 7 - (5) 1276099 component having a rough surface; separating a disk-shaped substrate formed of synthetic resin from the printer into the cavity; and separating the dish from the mold device Substrate. In the step of filling the pocket, the mold device includes a separation resistance member disposed on an inner surface of at least one of the fixed mold and the movable mold conforming to the outer peripheral surface of the disk-shaped substrate, and the separation resistance member has a rough surface.

As an embodiment, the rough surface of the separation impedance component includes a plurality of point-like protrusions or point-like recesses, or a plurality of linear protrusions or linear recesses, or a combined distribution of points and linear protrusions or depressions. On the surface of the separation impedance component. As an embodiment, the rough surface of the separation impedance component includes an impedance generation area of not less than 18 mm 2 ; and the rough surface of the separation impedance component includes at least two columns of protrusions or recesses in a direction in which the plastic disk substrate is pulled out, Also, each of the convex or concave depths is in the range of 3/m to 90/m. Preferably, each of the convex or concave depths on the rough surface of the separation resistive member is in the range of 3 // m to 2 0 // m.

These and other objects, features and advantages of the present invention will become more apparent from the <RTIgt; [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Hereinafter, a mold device for forming a disk-shaped substrate for use in manufacturing a disc such as a DVD-related disc (DVD + R or the like), and a method of molding a disc-shaped substrate by using a mold device will be described as an example. 1A and 1B are side cross-sectional views showing an example structure of a molding apparatus 3 for forming a dish-shaped base (6) 1276099 panel according to an embodiment of the present invention, wherein FIG. 1a shows the opening of the mold apparatus. 'Fig. 1 The closed state of the B-mode device. As shown in FIG. 1A, the mold device includes a fixed mold 1 and a movable mold 2, and the movable mold 2 is movably supported by a hydraulic mechanism (not shown), and is movable to approach and move away from the fixed mold 1. The direction of the fixed die 1. Between the fixed mold 1 and the movable mold 2, a recess 5 of the plastic disk substrate 4 is formed. On the side of the fixed mold 1, a casting sleeve 6 is provided in the center of the pocket 5, and a synthetic resin such as molten polycarbonate resin supplied from an injection molding apparatus (not shown) flows through the casting sleeve 6. In the center of the casting sleeve 6, there is a nozzle 6a for injecting resin, and the synthetic resin supplied from the injection molding apparatus is injected into the pocket 5 via the nozzle 6a. A bracket (not shown) is provided near the outer circumference of the casting sleeve 6, and an inner printer holder (not shown) is fitted into the bracket to support the inside of the printer 7 (described below). The printer 7 is mounted on the surface of the fixed mold 1 defining the pocket 5, and the printer 7 is used to mold the convex and concave patterns conforming to the information signals recorded on the optical disc, and the convex and concave patterns include the composition. A pit or pre-print of a recording track on a signal recording area of a disc. The inner circumference of the central opening of the printer 7 is supported by an inner printer holder (not shown), and the inner printer holder is fitted into a bracket (not shown), and the outer periphery of the central opening of the printer 7 is borrowed. It is fixed by the inhalation of air from a suction port (not shown). The recess 9 is provided at the center of the surface of the movable die 2 defining the recess 5 together with the solid mold 1 to form a projection on the other main surface of the disk substrate 4 -9 - 1276099 (7). In the center of the recess 9, the punching mechanism 10 is used to pierce the hole for locking the centering member in the center of the projection. The punching mechanism 10 is disposed in the movable mold 2 and is movable in the sleeve 11. The ejector 14 is supported by the sleeve 11 to be movable relative to the movable die 2 to protrude and separate the disk substrate 4 after molding. A pocket ring 12 is provided on the outer surface of the movable die 2, the pocket ring 12 defines a pocket 5, and the outer circumference of the disk-shaped substrate 4 to be molded is molded. The front end surface of the pocket ring 12 acts as a flat impact surface and is configured to be capable of contacting the periphery of the printer 7 attached to the fixed mold 1. When the movable mold 2 is moved to come into contact with the fixed mold 1 to bring the mold unit 3 into a closed state, as shown in Fig. 1B, the flat impact surface is brought into contact with the printer 7 to form a closed recess 5. The plastic surface of the movable mold 2 is used to form the other main surface of the disk substrate 4, which functions as a precise flat surface of the incident surface of the laser beam of the disk substrate 4. Therefore, the plastic surface of the movable mold 2 is also a precisely flat surface, for example, the mirror surface 13. After the dish substrate 4 is molded, and when the movable mold 2 is moved away from the fixed mold 1 (first separation), the dish substrate 4 is held on the side of the movable mold 2, and then, in the movable mold 2 The injector 14 is protruded to separate the disk substrate 4 (second separation) from the movable mold 2. With the above basic structure of the mold device 3, when the disk-shaped substrate 4 is molded, the movable mold 2 is moved and brought into contact with the fixed mold 1, and the mold device 3 is in a closed state as shown in Fig. 1B. In this state, a synthetic resin such as a molten polycarbonate resin supplied from the injection molding apparatus is injected into the pocket 5 via the nozzle -10 - 1276099 (8) 6 a. Then, the punching mechanism 10 is moved to pierce the hole for locking the centering member at the center of the projection of the disk substrate. Thereafter, the movable mold 2 is further moved toward the fixed mold 1 to compress the synthetic resin of the recess 5 for filling. Therefore, the dish substrate 4 conforming to the pocket 5 is molded, and after the dish substrate 4 is molded, the movable mold 2 is moved away from the fixed mold 1 (first separation), and therefore, the dish substrate 4 is self-printing. 7 and separated. At this time, the dish substrate 4 is held on the side of the movable mold 2. Next, the ejector I4 in the movable mold 2 is protruded to separate the disk substrate 4 (second separation) from the movable mold 2. In the present embodiment, the separation resistance member 15 having a rough surface is formed on the inner surface of the pocket ring 12 which conforms to the outer circumference of the disk substrate 4. The inner surface of the separation resistive member 15 is roughened on the inner surface of the pocket ring 12 by a distribution point or line or a combination thereof, in particular, by scattering small dots and recesses in the recess. The inner surface of the ring 12, or the convex and concave lines that are interspersed or intersect each other, are on the inner surface of the pocket ring 12, or a combination thereof. For example, the separation resistance member 15 has a rough surface of an area of 18 m 2 or more to generate a direction in which the impedance is drawn out of the disk substrate 4, and the size of the roughness is 3//m to 90//m. When the disc-shaped substrate 4 formed of the synthetic resin filled with the recess 5 is separated from the printer 7, the separation resistive member 15 generates an impedance at the outer periphery of the disc substrate 4 and 'when the disc substrate is separated from the movable mold 2 At 4 o'clock, the separation ability of the outer circumference of the disk substrate 4 is shown. By providing the separation impedance member 15 on the inner surface of the pocket ring 12, -11 - 1276099 (9)

When the disk substrate 4 is molded, the outer periphery of the disk substrate 4 is roughened to produce a rough portion 4a conforming to the roughness of the separation resistance member 15. Then, when the molded disk substrate 4 is separated from the printer 7, the separation resisting member 15 generates a rough portion 4a having an impedance on the outer periphery of the disk substrate 4 to keep the disk substrate 4 held by the movable die 2 status. Thereby, the dish substrate 4 is reliably separated from the printer 7 without variations in vertical vibration, peripheral tilt, and radial tilt characteristics, thereby sufficiently maintaining high flatness, and thus, the synthetic disc substrate is reliably transferred. To movable mode 2 (first separation). Furthermore, when the disc substrate 4 is separated from the movable mold 2 (second separation), since the roughness of the separation resistance member 15 shows the ability to separate from the rough portion 4a of the outer circumference of the disc substrate 4, even the dish substrate 4 The contraction time is not so long, in other words, even if the length of the plastic cycle is shortened by rapid plastic molding, the disk substrate 4 can be easily separated by the outer end surface of the disk substrate 4 without being trapped by the pocket ring 12, and charged. Maintain a high degree of flatness.

It should be noted that although the rough portion 4a is formed on the outer end surface of the dish substrate 4 conforming to the separation resistance member 15, since the information signal is not recorded on the outer end surface of the dish substrate 4, the roughness portion 4a does not Affects the signal recording area on the dish substrate. As described above, although the printer 7 is mounted on the fixed mold 1 and the punching mechanism 10 is disposed on the movable mold 2, an arrangement of the opposite manner can also be employed. Hereinafter, the method of manufacturing the separation impedance member 15 and the quantitative characteristic of the roughness of the separation impedance member 15 will be described with respect to the related art. For the purpose of comparison, the mold samples of Nos. 1, 2, and 3 are produced in accordance with the above-mentioned Japanese Patent Publication No. 0-13060099 (10), and the mold samples of the fourth and fifth. It is made according to this embodiment. The characteristics of these mode samples are summarized in the table in Figure 2. Fig. 2 is a comparison table showing the characteristics of the sample of the separation impedance member 15 of the present embodiment and the related art. Fig. 3 is a comparison table showing the shape and characteristics of the separation impedance member 15 of the present embodiment and related art. As shown in the table in Fig. 2, in the first sample, 24 square recesses each having an area of 〇.2 X 0 . 2 m m2 are uniformly arranged in a row along the circumference of the pocket ring. On the inner surface of the pocket ring. The total length of the recess is 4.8 mm along the circumference of the pocket ring, and the depth b of the recess is 0.2 mm, thus contributing to the total area of the recessed by the impedance (hereinafter referred to as ''impedance area 〃) A total of 96.96mm2. In the second sample, an annular recess having a square cross section of 〇·1 X 〇. imm (refer to Fig. 3) is formed on the inner surface of the pocket ring along the circumference of the pocket ring. Along the circumference of the pocket ring is 3 76.99 mm 'and the depth of the recess b is 〇.lmm, so the total area of the annular recess (i.e., the impedance area) contributing to the generation of the impedance is 3 7.7 0 mm 2 . In the third sample, an annular recess having a square cross section of 0.05 x 〇.05 min (refer to Fig. 3) is formed along the circumference of the pocket ring on the inner surface of the pocket ring. The circumference of the pocket ring is 3 76.9 9 mm, and the depth of the recess b is 〇.〇5 mm, so the total area of the annular recess (i.e., the impedance area) contributing to the generation of the impedance is -13 - 1276099 (11) 18.85mm2. In the fourth sample, as the separation resistance member 15, the entire inner surface of the pocket ring 12 is roughened along the circumference of the pocket ring 12, and the roughness of the rough surface (protruding or concave portion) Average depth) 〇. 0 2 0 mm. The length of the separation impedance member 15 is 376.99 mm along the circumference of the pocket ring 12, the average depth b of the protrusion or the recess is 0.02 mm, and there are twelve columns of protrusions in the direction in which the dish substrate 4 is pulled out or The concave portion; therefore, the total area (i.e., the impedance area) of the rough surface of the separation impedance member 15 is 45.24 mm 2 in total. In the fifth sample, as the separation resistance member 15, the entire inner surface of the pocket ring 12 is roughened along the circumference of the pocket ring 12 (refer to FIG. 3), and the roughness of the rough surface (projection) Or the average depth of the recess is 0.0 120 mm. The length of the separation impedance member 15 is along the circumferential system of the pocket ring 12 by 76.9. 9 mm, the average depth b of the projection or the recess is 0.014 mm, and there are about 13 columns along the direction in which the dish substrate 4 is pulled out. The convex or concave portion; therefore, the total area (i.e., the impedance area) of the rough surface of the separation impedance member 15 is 29.41 mm 2 . When estimating the impedance areas of the fourth sample and the fifth sample, since the cross section of each of the concave portions on the inner surface of the pocket ring 12 can be approximately equal to a triangle, the impedance area d of each concave portion is determined by using a formula Calculated by d= (axb) / 2xc. The above surface cake was measured by using a Form Taly-Surf S6 surface rough gauge measuring instrument (manufactured by T a y 1 〇 r Η 〇 b s ο η). Figures 4A and 4B show examples of measured surface roughness. -14 - (12) 1276099 Figures 4A and 4B show the surface roughness of the sample position of the separation impedance component 15, and the data shown in Figure 4A is obtained by measuring each 3 mm, however, Figure 4B The data shown is obtained by showing the surface roughness more succinctly by means of a measurement per 1 mm. The number of columns in the fourth sample and the fifth sample (the table shown in Fig. 2) was obtained by assuming that the thickness of the disk substrate was calculated on the actual measurement pattern for the calculation of 〇.6 mm. Hereinafter, based on the above results of the fifth sample, the evaluation is made on the relationship between the time of the sample and the plastic cycle, and on the mechanical properties of the sample. As for the evaluation of the mechanical properties, as shown in Fig. 3, the length of the plastic cycle, the peripheral axial acceleration, the peripheral radial tilt, and the circumferential inclination of the circumference were measured, and the mechanical properties were evaluated based on these measurements. Here, the 'around radial tilt 〃 indicates the radial bending of the disk substrate in an angle. The radial tilt around the small turns is preferred because if the surrounding radial tilt becomes too large, it affects the offset and amplitude of the push-pull signal (push - p U 11 signa 1 ) obtained from the optical disk made of the target substrate. . ''The circumference of the circumference is inclined 〃 to indicate the curvature of the disk substrate at the circumference. Similarly, the inclination of the circumference of the small cymbal is preferred. ''Axis axial acceleration 〃 indicates the acceleration of the recording layer in the direction perpendicular to the reference plane when the rotational speed is 16 Hz (960 rpm, CAV control). If the surrounding axial acceleration becomes too large due to the unevenness of the disc surface, the response performance, tracking performance and stability of the focus servo or tracking servo may affect the disc manufactured on the target substrate. Recently and in the process of continuing, in the need for high-speed recording of DVD discs, the quality associated with the surrounding axial acceleration is attracting increasing attention. For example, according to -15-1276099 (13) according to the Orange Book. In DVD+R/RW, residual focus/tracking error is defined; this 値 is converted to ambient axial acceleration, with the result that ambient axial acceleration of less than 2.1 m / s2 is necessary. In the present embodiment, the mechanical characteristics were evaluated as good when the peripheral axial acceleration system was less than 2.1 m / s2. As for the length of the '\plastic cycle, the target is set at 5 · 5 seconds

The above mechanical properties were measured by using an instrument called "'Brief-126P&quot; manufactured by Dr. Schenk. First, it was found that when the speed of the mold opening is constant, the reference for determining whether the impedance is generated when the disc substrate is separated from the printer (the first separation) is that the impedance area in the direction in which the disc substrate is pulled out is greater than 1. 8 m m2. In the first separation, if the impedance area in the direction in which the disk substrate is pulled out is less than 18 mm2, it is found that the dish substrate cannot be properly separated from the printer.

Therefore, the impedance area of the first sample is less than 18 mm 2 in the direction in which the disk substrate is pulled out. When the plastic sample is used, the length of the plastic cycle is not large, and it is determined that the first plastic sample cannot meet the predetermined necessity. Conditional dish-shaped substrate. As for the second sample, as shown in Fig. 3, if the plastic cycle time is 9.6 seconds, the surrounding axial acceleration is 1.4 m/s2. As for the third sample, as shown in Fig. 3, if the plastic cycle time is 8.4 seconds, the surrounding axial acceleration is 1.6 m/s2. In contrast, if the length of the plastic cycle is shortened to 6.7 seconds, the surrounding axial acceleration becomes 4.7 m/s2; moreover, the bending (tilt) occurs on the surface of the dish-shaped substrate - 16 - (14) 1276099 The zone having the disk radius R in the range of 50 mm to 57 mm, and therefore, the mechanical properties of the third sample were evaluated as bad. On the other hand, in the example of the fifth sample, as shown in Fig. 3, even when the length of the plastic cycle is shortened to 5.7 seconds (the target 値), the surrounding axial acceleration becomes 1.7 m/s2. Moreover, the circumferential radial inclination and the circumferential inclination of the circumference are also sufficiently small; therefore, the mechanical properties of the fifth sample are evaluated as good. Figure 5 shows the relationship between the shape of the rough surface and the length of the plastic cycle. According to the above description and as illustrated in FIG. 5, it is necessary to provide a plurality of protrusions or depressions (unevenness) along the direction in which the disk substrate is pulled out; moreover, when the depth of the unevenness is 〇·〇 When the thickness is about 9 mm, the length of the plastic cycle can be shortened to 9 seconds. When the depth of the unevenness is about mm5mm, the length of the plastic cycle can be shortened to 7 seconds, and when the unevenness is When the depth is about 0.02 mm, the length of the plastic cycle can be shortened to 5.5 seconds (the target 値). In other words, with a fine rough surface, such as the rough surfaces of the fourth sample and the fifth sample, the impedance area increases, and thus, the impedance increases. On the other hand, shallow unevenness results in good mechanical properties. When the disc substrate is separated from the printer (first separation), a large impedance area is preferable in the direction in which the disc substrate is pulled out. When the disc substrate is taken out from the mold device 3 (second separation), especially when the length of the plastic cycle is shortened in order to achieve radial molding, the shallow unevenness is better, and there is not enough time for the disc to be The substrate is cooled and shrunk. -17- 1276099 (15) Since the shallow unevenness causes a small impedance, it is easy to pull out the dish substrate. In contrast to the mold described in Japanese Patent Laid-Open Publication No. 303301, the prior art includes a separate separation impedance member having only one row of annular unevenness in the direction in which the disk substrate is pulled out. , as shown in the second and third samples in the table of Fig. 2, even when the length of the plastic cycle is as long as 6.7 seconds, as in the case of the third sample, the quality of the mechanical properties is skewed to the surrounding radial direction. Occurs due to the impedance in the second separation. Since the dish substrate is pulled out by the pressing of the end surface of the disk substrate, the bending (tilting) occurs on the surface of the disk substrate in a region having a disk radius R of 50 mm to 57 mm. Conversely, in the case of a fine rough surface, such as the rough surface of the fifth sample, the impedance area is increased in the direction in which the disk substrate is pulled out. Further, in terms of shallow unevenness, good mechanical properties are obtained even when the length of the plastic cycle is shortened to 5.5 seconds. The depth of the unevenness is further examined as follows. When the depth of the unevenness is in the range of 3 // m to 9 # m, preferably 3 // m to 2 0 // m, the separation impedance component 15 shows sufficient good performance. For example, the depth of the unevenness is 1 2 // m in the fifth sample. If the depth of the unevenness is less than 3 // m, the bulging of the rough surface is so fine that they are not strong enough and can be crushed. For this reason, when the disc substrate is separated from the printer, a sufficiently large impedance cannot be obtained. Conversely, if the depth of the unevenness is not less than 3 // m, a sufficiently large impedance can be generated when the disc substrate is separated from the printer. If the depth of the unevenness is greater than 90 μm, the impedance is too large for a short plastic cycle, that is, when the disc substrate is separated from the movable mold, -18-(16) 1276099, separated The ability is too low. However, if the depth of the unevenness is not more than 90 /im, even if the plastic cycle is shortened, a sufficiently large separation ability can be obtained. Fig. 6 shows the depth of the unevenness on the rough surface and the length of the plastic cycle. The relationship, which illustrates the efficacy of the second separation, where the abscissa indicates the length of the plastic cycle and the ordinate indicates the depth of the unevenness. In the example shown in FIG. 6, it is assumed that when the length of the plastic cycle is 9 seconds, the disk substrate shrinks by 90 μm, and when the plastic cycle time is 7 seconds, the disk substrate shrinks up to 5 0 # m, and, when the length of the plastic cycle is 5.2 seconds, the dish substrate shrinks to 20 @ m. As shown in FIG. 6, when the impedance area is not less than 18 mm2 and there are more than two columns of convex or concave (unevenness) in the direction in which the disk substrate is pulled out, when the depth of the unevenness is reduced, even When the length of the plastic cycle is shortened and there is not enough time for the disk substrate to cool and contract, it is easy to pull the disk substrate out of the second separation because of the small impedance due to the shallow unevenness. In Figure 6, zones X, Y and Z are preferably used for plastic molding. Even so, the zones X and Y are preferably shortened in the plastic cycle because in the zones X and Y, the depth of the unevenness is in the range of 3//m to 20/m, which is suitable for the shortened plastic. The cycle, in particular, the plastic cycle of the target of less than 5.5 seconds. Moreover, the zone X is a preferred zone because in the zone X, the impedance area which is important for the first separation is not less than 18 mm2, and the depth of the unevenness is 12/m to 20/zm. Within the scope. The separation of the impedance component including the fourth sample of the rough surface and the fifth sample -19- 1276099 (17) 15 can be formed by various roughening treatments. In the present embodiment, the (wide hammering and chastity) process is used to form the separation resistance member 15. In the present embodiment, in order to obtain a desired surface roughness, the coarse seam is made of materials having different roughness and shape. It is implemented through two steps. For example, in the first step, a material made of square tin oxide having an average size of 300 @ m is used, whereas in the second step, a sphere having an average grain size of 4 5 // m is used. The squeezing pressure of the ceramic beads is 4.0 gf / cm 2 in the first step and the second step. The jetting distance of the nozzle (i.e., the distance to the target to be processed is 7 cm. As for the processing time, the target is rotated twice so that each of them is processed for 30 seconds. Although sufficiently rough to be obtained in the first rotation, Stabilization to the second rotation is achieved. By this WP C treatment, uniform roughness can be easily obtained. Figure 7 is a perspective view of the pocket ring 12. Figure 8 is taken by the WPC and is taken along the arrow A in Figure 7 A cross-sectional view of the rough surface of the impedance member 15. In Fig. 8, a point-like convex and concave rough surface is formed by, and a square material is used for WP C. The rough surface of the separation stopper 15 along the arrow B of Fig. 7 has the same cross section as in Fig. 8. The method for forming the separation resistance member 15 is not limited to WP C, for example, bead blasting, spraying The beading treatment, the dimple treatment, the cutting or polishing with a cutter having a rough surface, or the use of a granular material that can be roughened by a rough metal watch WPC) is a sub-WPC resistance portion of the rough surface. Example Fine surface -20-1276099 (18) Any of the treatment of chemical elements or solutions. The bead blasting, bead blasting and dimple treatment of the air spray on the mold are substantially the same as the WPC described above, and the injection pressure, material and treatment process are also the same as W P C. In WPC, bead pressure treatment, dimple treatment, and bead blasting, if a square material is used to impact a metal surface at a high speed to form a rough surface having a point convex and concave, the separation impedance along the arrow A of FIG. The resulting roughened surface of component 15 has the same cross-section as in Figure 8, i.e., the same rough surface as produced by WP C. Figure 9 is a cross-sectional view of the rough surface of the separation impedance member 15 taken along the arrow a in Figure 7 when a spherical metal is used. That is, in WP C, bead pressure treatment, dimple treatment, and bead blasting, if a spherical material is used at a high speed impact metal surface to form a rough surface having punctiform projections and depressions, along the arrow of FIG. The obtained rough surface of the separation impedance member 15 of A has the same cross section as in FIG. Any of the separate impedance components 15 of Figures 8 or 9 is acceptable as long as the impedance area is not less than 18 mm2. In Fig. 8, since each concave cross section can be approximated by a simple triangle, each concave impedance area d can be simply calculated by using the formula d = (axb) / 2 X c , where a is uneven The average depth, b is the circumference of the rough surface, and c is the number of rows of the unevenness in the direction in which the disk substrate 4 is pulled out. Figure 10 A to 10D is a cross-sectional view of the rough surface of the separation impedance section 21 - 1276099 (19) of the arrow B in Figure 7, which illustrates the separation impedance processed by cutting or polishing. An example of the shape of the rough surface of the component 15. During the cutting or polishing process, the inner surface of the recess ring 12 is cut when the pocket ring 12 is being rotated, thus forming a rough surface having the same shape as the cutter. In Figure 1 〇 A and 1 0 B, the cutter has a fine coarse surface. Any one of the rough surfaces in Figs. 10A to 10C is acceptable as long as the impedance area is not less than 18 mm2. However, the rough surface in Fig. 1 〇D is unusable because the dish substrate cannot be separated even after the dish substrate is cooled and shrunk. Similarly, in the process of using a chemical element or a solution capable of roughening a metal surface, the impedance area can be obtained in the following manner. First, the area of the impedance generated by the chemical element or solution per unit is determined, and this 乘 is multiplied by the circumference b of the rough surface and the number of columns (c) of the unevenness of the direction in which the substrate 4 is pulled out. Depending on the impedance area obtained, it can be determined whether the obtained rough surface is usable. Although the present invention has been described with reference to the specific embodiments selected for the purpose of illustration, the present invention is not limited by the embodiments. However, those skilled in the art can make many modifications to the present invention without exceeding the present invention. The basic spirit and scope of the invention. According to the present invention, the separation resistance member having a rough surface is provided on the inner surface of the fixed mold or the movable mold which conforms to the outer peripheral surface of the disk substrate. When the disc-shaped substrate formed of the synthetic resin filled with the recess is separated from the printer, the printer acts as a side surface of the recess, and the separation resisting member generates an impedance on the outer circumference of the -22-1276099 (20) disc substrate. Therefore, when the flatness of the dish-shaped substrate is separated from the printer. When the disc-shaped base member is separated from the printer to improve the separation ability of the outer peripheral surface of the disc substrate, the length of the plastic period is shortened for the radial molding to be separated from the mold device while maintaining the plane of the disc substrate to the plastic The length of the cycle is such that it is possible to manufacture a disk having a face that is used as a high-speed DVD disc. Furthermore, the surface of the raw sugar of the separation component has a number of point-like recesses, or a plurality of linear protrusions or linear recesses, or a combination of protrusions or recesses, which are distributed in the surface of the impedance component. The rough surface has a product of not less than 18 mm 2 . The rough surface of the separating resist/L member includes at least two rows of the direction in which the disk substrate is pulled out, and each of the protrusions or recesses is in the range of 3/zm to 90/m, more preferably 3// m. The separation of the impedance component can reliably produce the separation capability of the impedance of the second dish to the second separation. In particular, the depth of the unevenness is less than 3 // m, which is so fine that they do not have sufficient strength and can be obtained sufficiently large when the disc substrate is separated from the printing benefit. Conversely, if the depth of the unevenness is not less than 3 when the printer separates the disk substrate, a sufficiently large impedance can be obtained if the depth of the unevenness is greater than 90%, and the impedance is too large, that is, when self-printing When the plate is held while the disk-shaped base substrate is separated, the resistance is separated. The result 'even, the dish-shaped substrate degree. Therefore, when it is shortened, the flat shape of the dish-shaped substrate is convex or point-like and linear convex, and the depth of the sub-impedance surface is convex or concave to the depth of 2 0 // m. Since a separation, and the convexity of the roughened surface is easily crushed, the impedance cannot be generated by y m when it is self-generated. The separation of -23-(21) 1276099 is too low for a short plastic cycle. Conversely, if the depth of the unevenness is not more than 90 / z m, even when the plastic cycle is shortened, a sufficiently large separation ability can be obtained. The rough surface of the separation impedance component can be formed by roughening treatment, such as 'WP C (wide hammer and chast) treatment, bead blasting treatment, bead pressure treatment, dimple treatment, by using a cut having a fine rough surface The cutting or polishing of the knife and the treatment by the use of chemical elements or solutions capable of roughening the metal surface. By these treatment methods, it is possible to obtain the uniformity of the first separation and to improve the separation ability of the disk substrate in the second separation. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A and 1B are side cross-sectional views showing an example structure of a mold apparatus for forming a disk substrate according to an embodiment of the present invention, wherein FIG. 1A shows an open state of the mold device, and Fig. 1 shows the closed state of the B-mode device; Fig. 2 shows the characteristics of the sample for explaining the comparison table of the separation impedance component 15 of the present embodiment and the related art; and Fig. 3 shows the separation impedance component of the present embodiment. Figure 2A and 4B show examples of measured surface roughness; Figure 5 shows the relationship between the shape of the rough surface and the length of the plastic cycle; Figure 6 shows the rough surface The relationship between the depth of the unevenness and the length of the plastic cycle, which illustrates the effect of the second separation; Figure 7 is a perspective view of the pocket ring 12; -24-1276099 (22) Figure 8 is by use Cross-sectional view of the rough surface of the separation resistance member 15 processed along the arrow A in FIG. 7 processed by the WPC of the square material. FIG. 9 is processed by the WP C of the spherical material used. The rough surface of the separation impedance component 15 of the arrow A Cross-sectional view of FIG. 1A to 1D is a cross-sectional view of the rough surface of the separation impedance member 15 along arrow B in FIG. 7, which illustrates the separation of the impedance component 15 processed by cutting or polishing. An example of the shape of a rough surface. C $ required component symbol description]

Wpc wide hammer and chastity 1 fixed mold 2 movable mold 3 mold device 4 dish substrate 4 a rough portion 5 pocket 6 casting sleeve 6a nozzle 7 printer 9 recess 10 punching mechanism 11 sleeve -25 - 1276099 (23) 12 Pocket ring 13 Mirror surface 14 Ejector 15 Separation of impedance components -26

Claims (1)

(1) 1276099 X. Patent Application No. 1 · A molding apparatus for forming a disc-shaped substrate from synthetic resin, comprising: a fixed mold; and a movable mold formed by molding a disc-shaped substrate therein a recessed portion, wherein the separated impedance member having a rough surface is disposed on an inner surface of at least one of the fixed mold and the movable mold conforming to the outer peripheral surface of the disk substrate. The dish substrate is held in the fixed mold and movable One of the models. 2. The apparatus of claim 1, wherein the rough surface of the separation impedance component is distributed with a plurality of dot-like protrusions or point-like recesses, or a plurality of linear protrusions or linear recesses, or dots. And a linear convex or concave combination 〇 3. The molding apparatus according to claim 1, wherein the rough surface of the separation impedance member has an impedance generation area of not less than 18 mm 2 ; and the rough surface of the separation impedance component is pulled The direction in which the disc-shaped substrate is molded includes at least two columns of protrusions or recesses, and each of the protrusions or recesses has a depth ranging from 3 // m to 90 μm. 4. The apparatus of claim 1, wherein each of the convex or concave depths on the rough surface of the separation impedance component is in the range of 3 // m to 2 0 // m. 5. The mold apparatus according to any one of claims 1 to 4, wherein the rough surface of the separation resistance member is formed on the inner surface of at least one of the fixed mold and the movable mold by roughening treatment. -27- (2) 1276099 6. The apparatus of claim 5, wherein the roughening treatment includes WPC Wide Bonding and Cleaning. 7. A molding apparatus according to claim 5, wherein the roughening treatment comprises a bead Blast treatment. 8. The mold apparatus of claim 5, wherein the roughening treatment comprises a Shot Peening treatment. 9. The mold apparatus of claim 5, wherein the roughening treatment comprises a Micro Dimple treatment. 1 〇. The molding apparatus of claim 5, wherein the roughening treatment comprises cutting or polishing using a cutter having a fine rough surface. 11. The mold apparatus according to claim 5, wherein the roughening treatment comprises a treatment using a chemical element or a solution capable of roughening the metal surface, and a dish-shaped substrate formed of a synthetic resin using a mold device, including : The outer peripheral surface is roughened by a separate impedance member having a rough surface of the mold device. A method of molding a disk-shaped substrate by using a mold device comprising a fixed mold and a movable mold, the method comprising the steps of: filling a plastic cavity with a synthetic resin, the plastic cavity system Formed by a fixed mold and a movable mold and having a printer for transferring as a side surface thereof, the plastic pocket including at least one of a fixed mold and a movable mold that conform to an outer peripheral surface of the disk substrate On the surface of the separated impedance member, the sub--28-(3) 1276099 has a rough surface from the resistive member; the disc-shaped substrate formed of synthetic resin in the recess is separated from the printer; and the disc-shaped substrate is separated from the mold device. 1 4 The method of claim 13, wherein the rough surface of the separation impedance component comprises a plurality of dot-like protrusions or point-like recesses, or a plurality of linear protrusions or linear recesses, or dots. And a combination of linear protrusions or recesses is distributed on the surface of the separation impedance component. The method of claim 13 or claim 4, wherein the rough surface of the separation impedance component comprises an impedance generation area of not less than 18 mm 2 ; and the rough surface of the separation impedance component is pulled out of the molded disk substrate The direction includes at least two columns of protrusions or recesses, and each of the protrusions or recesses has a depth ranging from 3 #m to 9 0 // m. The method of claim 15, wherein each of the convex or concave depths on the rough surface of the separation impedance component is in the range of 3 v m to 20 // m. -29-