1275764 九、發明說明： 1發明所屬之技術領域】 ~ ^ 本發明係關於一種散熱裝置，尤指一種用於冷卻電子元件 之熱管散熱裝置。 【先前技術】 隨著電腦技術不斷發展，電子元件（尤其係中央處理 器）之運行速度不斷提升，其發熱量越來越大，若不及時 ®排除，將使熱量累積引起溫度升高，影響電子元件之正常 運行。 通常業界在電子元件上安裝散熱器輔助其散熱，在散 熱器上安裝風扇，由風扇提供強制氣流使散熱器之熱量快 速散發，從而能夠對電子元件進行更為有效之散熱。 一種習知熱管散熱裝置如中國專利公告第 CN2620928Y號揭示，其包括與電子元件接觸之第一基板、 ||與第一基板平行之第二基板、夾置於第一及第二基板中間 之複數散熱鰭片及多個熱管，該等熱管兩端分別插置於第 一及第二基板中。與電子元件接觸之第一基板從電子元件 吸收之熱量一部分直接傳向散熱鰭片，另一部分由熱管傳 至第二基板，再由第二基板傳向散熱鰭片，並通過散熱鰭 片一侧之風扇將冷氣流吹入散熱鰭片之流道内，帶走散熱 縛片之熱量，而達到散熱之功效。另外，由於第一基板中 央位置處與電子元件接觸，其為高發熱量區域，從電子元 件吸收之熱量由此擴散，那麼，如果將該區域之熱量快速 1275764 傳導至其它區域以降低其熱密度，對整個熱管散熱裝置性 熊提升之作用效果將更明顯，因此若能據此加以改進則將 ^ $適用于高功率之電子元件。 【發明内容】 有鑒於此，本發明旨在提供一種散熱性能佳之熱管散 熱裝置。 —種熱官散熱裝置包括一基座、一蓋板、夾置於基座 二蓋板之間之複數散熱鰭片及一連接該基座與蓋板之熱 ^該基座包括一朝向蓋板凸出之凸起部，該凸起部較基 座/、匕區域厚；該蓋板包括一朝向基座凸出之凸起部，該蓋 ^之凸起與基座之凸起部平行之方向縱長延伸；該熱 B端連接於該基座之凸起部，另一端與該蓋板之凸起部連 接。 該熱官散熱裝置與現有技術相比具有如下優點：由於 肇基座朝向蓋板形成有凸起部，可增大基座與散熱縛片之接 觸面積，提高基座與散熱縛片之傳熱效率；而且，將熱管 $吸熱Ut置於基座之凸起部，將基座之熱源密集處之熱 里j速傳輸至熱官並向蓋板擴散，使整個熱管散熱農置之 熱量分佈均句，從而有效提高整個熱管散熱裝置之散熱性 能。 作為上述熱管散熱裝置進一步改進，在蓋板朝向基座 有凸起部，在氣流流量—定之情況下，由於基座 〃反之凸起邛使中間流道面積收縮，氣流流速會相應提 1275764 高，可提高中間熱量之散發。 _ . 更進一步之改進，係將熱管之放熱段插置該蓋板之凸 .起部，更利於提高蓋板與散熱鰭片之間傳熱效率，增加了 整個熱管散熱裝置之散熱效果。 【實施方式】 請參閱圖1，本發明實施例之熱管散熱裝置用於冷卻電 子元件，其包括一基座10、一蓋板14、複數散熱鰭片20、 馨二連接該基座10、蓋板14及散熱鰭片20之熱管30、及一 直立安裝於散熱鰭片20 —侧之散熱風扇40。 請參閱圖2至圖3，基座10之中間部分為一縱長延伸 之凸起部12，該凸起部12二側為矩形平板狀體，該凸起部 12朝向蓋板14凸出，其上表面由兩個相交斜面構成，使基 座10在兩斜面相交處具有最大之厚度。該凸起部12内設 有一對相互平行之穿槽150,該凸起部12之長度較基座10 沿凸起部12延伸方向之長度短，從而於基座10侧向形成 一缺口，以供熱管30從該缺口插入穿槽150。蓋板14位於 基座10上方且大致平行於基座10，該蓋板14中間部分為 一朝向基座10凸出之凸起部142，該凸起部142二侧為矩 形平板狀體，該凸起部142與基座10凸起部12沿縱長方 向上平行，該蓋板14於臨近凸起部142表面設有一凹槽 144，該凹槽144沿凸起部12縱長方向延伸。該凹槽144 靠近該蓋板14之凸起部142並與基座10之穿槽150之一 上下對應，蓋板14下表面離凸起部142較遠處設有一凹槽 1275764 148，該凹槽148平行於凹槽144延伸。 * _ 散熱鰭片20平行直立夾置於基座10與蓋板14之間以 形成複數散熱氣流流道，該等散熱鰭片20底部及頂部設有 橫截面為三角狀之凹口 22、24，與基座10、蓋板14之凸 起部12、142配合，以增加散熱鰭片20與基座10及蓋板 14之接觸面積，提高散熱效率。該散熱鰭片20頂部設有一 與蓋板14之凹槽148相對應之凹槽280。 φ 二熱管30均呈U形設置，其包括吸熱段350、平行吸 熱段350之放熱段380及連接吸熱段350與放熱段380之 連接段330。該二熱管吸熱段350均插置於基座10凸起部 12之穿槽150中；其中一熱管放熱段380插置蓋板14之凹 槽144中與散熱鰭片20之凹口 24處接觸，另一熱管放熱 段380插置於凹槽148與散熱鰭片20頂部之凹槽280形成 之穿槽中；二熱管連接段330位於該等散熱鰭片20之一侧。 風扇40直立安裝於散熱鰭片20之一側並靠近散熱鰭 參片20形成之上述流道之一端口，以持續排出散熱鰭片20 上之熱量，提高熱管散熱裝置之散熱效率。風扇40與散熱 鰭片20之間設置一固定架50，該固定架50用以將該風扇 40固定至基座10及蓋板14上。 該熱管散熱裝置工作時，基座10中部之凸起部12吸 收電子元件產生之熱量，其中一部分熱量直接傳遞至散熱 鰭片20，另一部分熱量由基座10凸起部12傳至熱管30 之吸熱段350，通過連接段330傳至放熱段380，進而再傳 至蓋板14，再由蓋板14向下傳至散熱鰭片20，通過散熱 1275764 鰭片20將熱量散發至周圍空間。基座ίο中間部分之熱量 • _齊集處具有凸起部12,提供了足夠之厚度，以保證該基座 i〇熱量密集處與熱管30之吸熱段350之間熱量之充分傳 遞，提高熱量之傳遞效率，該凸起部12也增大了基座10 與散熱鰭片20之傳熱面積。最後，風扇40提供之氣流吹 向散熱鰭片20，將散熱鰭片20之熱量帶走。 請參閱圖4，風扇40提供之氣流經過基板10與蓋板 • 14之中間凸起部12、142時，由於基座10之凸起部12與 蓋板14之凸起部142距離較該基座10之其它區域與蓋板 14之距離要小，使流道面積收窄，氣流流速相應提高，可 加快散發鰭片20中部、基板10之高熱區（凸起部12)以及 蓋板14上連接熱管30之凸起部142之熱量，提高整體熱 管散熱裝置散熱效率。 不難看出，上述熱管散熱裝置之凸起部之設置大大降 低了高熱區之熱密度，使熱量快速擴散，進而使整個熱管 籲散熱裝置散熱性能得以提升。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例熱管散熱裝置之立體組合圖。 圖2係圖1之立體分解圖。 1275764 圖3係圖1中蓋板另一角度之示意圖。 . 圖4係沿圖1 III-III線之剖視圖。 【主要元件符號說明】 基座 10 基座凸起部 12 盖板 14 蓋板凸起部 142 蓋板凹槽 144 ^ 148 穿槽 150 散熱鰭片 20 凹口 22 > 24 散熱鰭片凹槽 280 熱管 30 連接段 330 吸熱段 350 放熱段 380 風扇 40 固定架 50 111275764 IX. INSTRUCTIONS: 1 TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat dissipating device, and more particularly to a heat pipe heat dissipating device for cooling electronic components. [Prior Art] With the continuous development of computer technology, the operating speed of electronic components (especially the central processing unit) is increasing, and the heat generation is getting larger and larger. If it is not eliminated in time, the heat accumulation will cause the temperature to rise, affecting The normal operation of electronic components. Generally, the industry installs a heat sink on the electronic components to assist in heat dissipation. A fan is installed on the heat sink, and a forced air flow is provided by the fan to quickly dissipate the heat of the heat sink, thereby enabling more efficient heat dissipation of the electronic components. A conventional heat pipe heat dissipating device, as disclosed in Chinese Patent Publication No. CN2620928Y, includes a first substrate in contact with an electronic component, a second substrate parallel to the first substrate, and a plurality of sandwiched between the first and second substrates. The heat dissipating fins and the plurality of heat pipes are respectively inserted into the first and second substrates. The first substrate in contact with the electronic component is directly transferred from the electronic component to the heat sink fin, and the other portion is transferred from the heat pipe to the second substrate, and then the second substrate is transferred to the heat sink fin and passes through the heat sink fin side. The fan blows the cold air into the flow passage of the heat dissipation fin, and takes away the heat of the heat dissipation block to achieve the heat dissipation effect. In addition, since the central portion of the first substrate is in contact with the electronic component, which is a high heat generating region, the heat absorbed from the electronic component is thereby diffused, and if the heat of the region is quickly transferred to other regions to reduce the heat density, The effect of the heat dissipation device on the entire heat pipe will be more obvious, so if it can be improved accordingly, it will be applied to high-power electronic components. SUMMARY OF THE INVENTION In view of the above, the present invention is directed to a heat pipe heat dissipating device having excellent heat dissipation performance. The heat-dissipating heat-dissipating device comprises a base, a cover plate, a plurality of heat-dissipating fins sandwiched between the two cover plates of the base, and a heat connecting the base and the cover plate. The base comprises a facing cover plate a protruding portion that is thicker than the base/the cymbal region; the cover plate includes a convex portion that protrudes toward the base, and the protrusion of the cover is parallel to the convex portion of the base The direction extends longitudinally; the hot B end is connected to the convex portion of the base, and the other end is connected to the convex portion of the cover. Compared with the prior art, the heat dissipation device has the following advantages: since the 肇 base is formed with a convex portion toward the cover plate, the contact area between the susceptor and the heat dissipation slab can be increased, and the heat transfer between the susceptor and the heat dissipation splicing plate can be improved. Efficiency; moreover, the heat pipe $heat-absorbing Ut is placed in the convex portion of the base, and the heat transfer in the dense place of the heat source of the base is transmitted to the heat officer and diffused to the cover plate, so that the heat distribution of the heat pipe of the entire heat pipe is distributed. Sentence, thus effectively improving the heat dissipation performance of the entire heat pipe heat sink. Further, as the heat pipe heat dissipating device is further improved, the cover plate has a convex portion facing the base, and in the case of the air flow rate, the air flow velocity will be correspondingly increased by 1275764 due to the base 〃 and the convex 邛, the intermediate flow path area is contracted. It can increase the emission of intermediate heat. _ . Further improvement is to insert the heat release section of the heat pipe into the convex portion of the cover plate, which is more advantageous for improving the heat transfer efficiency between the cover plate and the heat dissipation fin, and increasing the heat dissipation effect of the entire heat pipe heat dissipation device. Embodiments Referring to FIG. 1 , a heat pipe heat dissipation device according to an embodiment of the present invention is used for cooling electronic components, and includes a base 10 , a cover plate 14 , a plurality of heat dissipation fins 20 , and a second connection of the base 10 and the cover. The heat pipe 30 of the plate 14 and the heat dissipation fins 20 and the heat dissipation fan 40 that is vertically mounted on the side of the heat dissipation fins 20 are provided. Referring to FIG. 2 to FIG. 3 , the middle portion of the base 10 is a longitudinally extending convex portion 12 . The convex portion 12 has a rectangular flat plate on both sides, and the convex portion 12 protrudes toward the cover plate 14 . The upper surface is formed by two intersecting bevels such that the base 10 has the greatest thickness at the intersection of the two bevels. The protrusion 12 is provided with a pair of mutually parallel through slots 150. The length of the protrusions 12 is shorter than the length of the base 10 in the direction in which the protrusions 12 extend, so that a gap is formed laterally on the base 10 to The heat supply tube 30 is inserted into the through groove 150 from the notch. The cover plate 14 is located above the base 10 and is substantially parallel to the base 10. The middle portion of the cover plate 14 is a convex portion 142 protruding toward the base 10. The convex portion 142 has a rectangular flat plate on both sides. The convex portion 142 is parallel to the convex portion 12 of the base 10 in the longitudinal direction. The cover plate 14 is provided with a groove 144 adjacent to the surface of the convex portion 142. The groove 144 extends along the longitudinal direction of the convex portion 12. The recess 144 is adjacent to the convex portion 142 of the cover plate 14 and corresponding to one of the through slots 150 of the base 10. The lower surface of the cover plate 14 is provided with a recess 1275764 148 at a distance from the convex portion 142. The groove 148 extends parallel to the groove 144. * _ The heat sink fins 20 are placed in parallel between the base 10 and the cover plate 14 to form a plurality of heat dissipation air flow passages. The bottom and top portions of the heat dissipation fins 20 are provided with notches 22 and 24 having a triangular cross section. The protrusions 12 and 142 of the base 10 and the cover 14 cooperate to increase the contact area between the heat dissipation fins 20 and the base 10 and the cover 14 to improve heat dissipation efficiency. A recess 280 corresponding to the recess 148 of the cover plate 14 is disposed on the top of the heat dissipation fin 20. The φ two heat pipes 30 are all disposed in a U shape, and include an heat absorbing section 350, a heat releasing section 380 of the parallel heat absorbing section 350, and a connecting section 330 connecting the heat absorbing section 350 and the heat releasing section 380. The heat pipe segment 350 of the two heat pipes is inserted into the through groove 150 of the boss portion 12 of the base 10; wherein a heat pipe segment 380 is inserted into the groove 144 of the cover plate 14 and contacts the recess 24 of the heat sink fin 20. The other heat pipe exothermic section 380 is inserted into the groove formed by the groove 280 at the top of the groove 148 and the heat dissipating fin 20; the two heat pipe connecting section 330 is located on one side of the heat dissipating fins 20. The fan 40 is erected on one side of the heat dissipation fins 20 and adjacent to one of the flow channels formed by the heat dissipation fins 20 to continuously discharge heat from the heat dissipation fins 20, thereby improving the heat dissipation efficiency of the heat pipe heat dissipation device. A fixing frame 50 is disposed between the fan 40 and the heat dissipating fins 20 for fixing the fan 40 to the base 10 and the cover plate 14. When the heat pipe heat dissipating device is in operation, the convex portion 12 in the middle of the base 10 absorbs heat generated by the electronic component, and a part of the heat is directly transmitted to the heat radiating fin 20, and the other heat is transferred from the convex portion 12 of the base 10 to the heat pipe 30. The heat absorption section 350 is transmitted to the heat release section 380 through the connecting section 330, and then transferred to the cover plate 14, and then passed down to the heat dissipation fins 20 by the cover plate 14, and the heat is radiated to the surrounding space by the heat dissipation 1275764. The heat of the middle portion of the base ίο• has a raised portion 12 at a uniform level to provide sufficient thickness to ensure sufficient heat transfer between the heat sink portion of the base and the heat absorption portion 350 of the heat pipe 30 to improve heat. The transfer portion 12 also increases the heat transfer area of the susceptor 10 and the heat sink fins 20. Finally, the air flow provided by the fan 40 is blown toward the heat dissipation fins 20 to carry away the heat of the heat dissipation fins 20. Referring to FIG. 4, when the airflow provided by the fan 40 passes through the intermediate protrusions 12 and 142 of the substrate 10 and the cover plate 14, the convex portion 12 of the base 10 and the convex portion 142 of the cover plate 14 are spaced apart from each other. The other area of the seat 10 is smaller than the cover 14 to narrow the flow path area, and the air flow rate is correspondingly increased, so that the middle portion of the fin 20 can be accelerated, the high heat region of the substrate 10 (the raised portion 12), and the cover plate 14 can be accelerated. The heat of the convex portion 142 of the heat pipe 30 is connected to improve the heat dissipation efficiency of the heat pipe heat dissipation device. It is not difficult to see that the arrangement of the protrusions of the heat pipe heat dissipating device greatly reduces the heat density of the high heat zone, so that the heat is rapidly diffused, thereby further improving the heat dissipation performance of the entire heat pipe. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat pipe heat dissipating device according to an embodiment of the present invention. 2 is an exploded perspective view of FIG. 1. 1275764 Figure 3 is a schematic view of another angle of the cover of Figure 1. Figure 4 is a cross-sectional view taken along line III-III of Figure 1. [Main component symbol description] Base 10 Base boss 12 Cover plate 14 Cover boss 142 Cover groove 144 ^ 148 Through slot 150 Heat sink fin 20 Notch 22 > 24 Heat sink fin groove 280 Heat pipe 30 connecting section 330 heat absorbing section 350 heat releasing section 380 fan 40 fixing frame 50 11