1274605 九、發明說明： 【發明所屬之技術領域】 本發明係提供-種塗佈裝置與方法，尤指—種具有振動器的 塗佈裝置與其塗佈方法。 【先前技術】 一般而言，一個印刷電路板（printedcircuitb〇ard，pCB)上都1274605 IX. Description of the Invention: [Technical Field] The present invention provides a coating apparatus and method, and more particularly to a coating apparatus having a vibrator and a coating method therefor. [Prior Art] In general, a printed circuit board (printed circuitb〇ard, pCB)
有一特定功能的·，因此，印猶路板上會因應元件的配置位 置而設置許多焊接點，用來安裝所需的電路元件，為了要增強焊 接的效果以及提升焊接效率，通f在焊接之前會在印刷電路板的 焊接點上塗佈某種能促轉接效果晴料，其巾最常見的塗佈材 料為錫貧。 ’ 一般較u財歧先根據印There is a specific function. Therefore, many welding points are set on the printed circuit board depending on the position of the components, which are used to install the required circuit components. In order to enhance the welding effect and improve the welding efficiency, before the welding A certain kind of transfer effect can be applied to the solder joints of the printed circuit board, and the most common coating material for the towel is tin lean. ‘Generally
在印刷電路板上塗佈錫膏時，一身 刷電路板上焊接點的位置來製做模板， 因此一般稱這種模板為刷錫鋼板，完成 接點。於進行齡塗佈作_，將·鋼板置 觸錫_上__準印刷電路板上的谭接 1274605 "、、後將錫胃放置在稿峨上，湘彻在麵酿上來回 刮動。§錫賞通過刷錫鋼板上的孔洞時，便會穿過孔洞而落在印 刷兒路板的焊接點上。制時參閱第〗圖與第2圖，第1圖是習 ~知錫貧塗佈裝置的第一操作示意圖，而第2圖是習知錫膏塗佈裝 置的第一操作不思圖。在塗佈時，先將刷錫鋼板GO準確地放置 在印㈣路板110上，使得觸峨12()上的孔㈣準印刷電路 φ板110上的輝接點，然後，當鋼刀組130欲沿著方向A來進行錫 τ塗佈作鱗，如第丨_示，鋼刀131會升起以離卿錫鋼板 120，而鋼刀132則會降下以接觸刷錫鋼板12〇，此時，當鋼刀⑶ 著方向A移動時，其便可將錫膏刚刷入刷錫鋼板⑽上的孔 同X使錫Θ 140月匕夠牙過刷錫鋼板120上的孔洞而落在印刷電 路板110的焊接點上。如業界所習知，於進行錫膏塗佈作業時， 鋼刀組130會在刷錫鋼板12〇上來回到動錫膏14〇，因此，當鋼刀 •、、且130於苐1圖中石者方向a而由右侧移動至左側後，鋼刀⑶ 會升起以賴麵峨12〇, _刀131齡降下雌_錫鋼板 120 (如第2圖所示），接著，當鋼刀131沿著方向B移動時，其 便可同樣地將錫膏140刷入刷錫鋼板12〇上的孔洞，以使錫膏14〇 能夠穿過刷錫鋼板120上的孔洞而落在印刷電路板11()的焊接點 上。經由鋼刀組130反覆地沿著方向a與方向B移動後，便可確 保印刷電路板110的所有焊接點上均沾有錫膏14〇。 1274605 如上所述’鋼刀組13G的動作方式是交換地綱鋼刀⑶和 鋼刀132在刷錫鋼板120來回到動錫膏當鋼刀組130由右往 左刮動時（如第1圖所示）’鋼刀m會落下，鋼刀m會升起， …由鋼刀m負貝刮動錫嘗M〇;當鋼刀組⑽由左往右刮動時（如 f2騎朴鋼刀131會落下，編m會聽，由鋼刀⑶負 責刮動錫膏14G。然而當鋼刀131或是鋼刀132於升起的過財， # f會使得錫膏140黏附在鋼刀⑶、132上，因此在如果在鋼刀 131、132升起的位置上有桿接點時，該焊接點上的錫膏叫艮容 易因為錫膏M0與鋼刀⑶、132之間附著力的關係，而被鋼刀 13=32帶上來’往往造顧焊接點上沒祕膏附著或者錫膏的 附著里不足；再者’錫膏14G與鋼刀⑶、132之_附著力也會 使得鋼刀131、132在刮過刷錫鋼板12Q上的孔洞時’或多或少會 有些锡膏140黏附在鋼刀13卜132上，而造成錫膏塗佈不均勾。 【發明内容】 本發明的目的之一在於提供一種具有振動器的塗佈裝置與塗 佈方法，以解決上述問題。 根據本發明的實施例，其係揭露一種塗佈裝置。該裝置包含 有·—模板，具有至少一孔洞，該模板上係承载一待塗佈物質； 一刮刀模組，用來在該模板上刮動該待塗佈物質；以及一振動器， 1274605 連接於該模板或該刮刀模組上，用來使該模板或該刮刀模組產生 振動。 根據本發明的實施例，其亦揭露一種塗佈方法。該方法包含 有··將一待塗佈物質置於一模板上；以及振動該模板或一刮刀模 組’並使用該刮刀模組在該模板上刮動該待塗佈物質。 本發明藉由在鋼刀或刷錫鋼板上裝設振動器，因此可以增加 塗佈錫膏的效率，使得錫膏能夠均勻地塗佈在印刷電路板上，並 且因為鋼刀振動的關係，錫貧便不容易殘留在鋼刀上，使塗佈的 過程中可以大幅地節省錫膏的使用量。 【實施方式】When solder paste is applied on a printed circuit board, the position of the solder joint on the circuit board is used to form a template. Therefore, the template is generally referred to as a brushed steel plate to complete the joint. In the ageing coating _, the steel plate is placed on the tin _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ . § When the tin is brushed through the hole in the tin plate, it will pass through the hole and land on the solder joint of the printed circuit board. Referring to Fig. 2 and Fig. 2, Fig. 1 is a first operation diagram of a conventional tin-poor coating apparatus, and Fig. 2 is a first operation of a conventional solder paste coating apparatus. When coating, the brushed steel plate GO is accurately placed on the printing (four) way board 110, so that the hole on the touch 12 () (four) quasi-printed the junction of the circuit φ board 110, and then, when the steel knife set 130 wants to apply tin tau coating along the direction A. As shown in the third figure, the steel knife 131 will rise to separate from the tin tin plate 120, and the steel knife 132 will be lowered to contact the brush tin plate 12〇. When the steel knife (3) moves in the direction A, it can just apply the solder paste to the hole on the brushed steel plate (10) and X to make the tin crucible fill the hole on the tinned steel plate 120 for 140 months and land on the printing. The soldering point of the circuit board 110. As is well known in the art, in the solder paste coating operation, the steel knife set 130 will return to the movable solder paste 14 在 on the 12-turn tinned steel plate, so when the steel knife •, and 130 in the 苐 1 map stone After the direction a moves from the right side to the left side, the steel knife (3) will rise to 赖12〇, _ knife 131 age down female _ tin plate 120 (as shown in Figure 2), then, when the steel knife 131 When moving along the direction B, the solder paste 140 can be similarly brushed into the hole in the tin plate 12, so that the solder paste 14 can pass through the hole in the brushed steel plate 120 and land on the printed circuit board 11. () on the solder joint. After the steel blade set 130 is repeatedly moved along the direction a and the direction B, it is ensured that the solder paste 14 is adhered to all the solder joints of the printed circuit board 110. 1274605 As described above, the operation mode of the steel knife set 13G is to exchange the steel plate (3) and the steel knife 132 to return to the dynamic solder paste when the steel plate 120 is turned back. When the steel knife set 130 is swung from right to left (as shown in Fig. 1) Shown) 'The steel knife m will fall, the steel knife m will rise, ...by the steel knife m negative shell to scrape the tin taste M〇; when the steel knife set (10) is scraped from left to right (such as f2 riding a steel knife 131 will fall, the m will listen, and the steel knife (3) will be responsible for scraping the solder paste 14G. However, when the steel knife 131 or the steel knife 132 rises, the # f will cause the solder paste 140 to adhere to the steel knife (3), 132, so if there is a rod contact at the position where the steel knives 131, 132 are raised, the solder paste on the solder joint is easily licked because of the adhesion between the solder paste M0 and the steel knives (3), 132. And it is brought up by the steel knife 13=32. 'There is not enough adhesion on the soldering point or the adhesion of the solder paste. In addition, the adhesion of the solder paste 14G and the steel knife (3), 132 will also make the steel knife 131, 132 when the hole in the brushed tin steel plate 12Q is scraped, 'more or less some solder paste 140 adheres to the steel knife 13 132, causing the solder paste to be unevenly coated. [Invention] One of the objects is to provide a coating device and a coating method with a vibrator to solve the above problems. According to an embodiment of the present invention, a coating device is disclosed, which comprises a template having at least one hole The template carries a substance to be coated; a doctor blade module for scraping the material to be coated on the template; and a vibrator 1274605 connected to the template or the blade module for The template or the doctor blade module is caused to vibrate. According to an embodiment of the invention, a coating method is also disclosed, the method comprising: placing a substance to be coated on a template; and vibrating the template or a The doctor blade module 'and uses the doctor blade module to scrape the material to be coated on the template. The present invention can increase the efficiency of coating the solder paste by installing a vibrator on the steel knife or the brushed steel plate. The solder paste can be uniformly coated on the printed circuit board, and because of the vibration of the steel knife, the tin deficiency is not easily left on the steel knife, so that the amount of the solder paste can be greatly saved during the coating process. Embodiment
請參閱第3圖，第3圖為本發明第一實施例之錫膏塗佈農置 的第一操作示意圖。在本實施例中，鋼刀131與鋼刀132上分別 裝置振動器210以及振動器22〇,振動器21()以及振動器22〇可以 是任何種_鶴器，畔魏_定地絲在_ 131與鋼刀 132上，-般而言，較常使用的振動器種類為超音波振動器 (ultraSonievib愈)，因為超纽振_的體積不大，適合安裝 ;鋼刀131與鋼刀132’而且超音波振動器可以提供較高的振動頻 率，其所產生雜舰果亦難。細数⑽麵沿著方向A !274605 來進行錫膏塗佈作業時，鋼π 131會升起以離開刷錫鋼板i2〇，而 另鋼刀131則會降下以接觸刷錫鋼板12〇,同時振動器Μ。會啟 動’因此，當鋼刀組130由右往左刮動錫膏14〇的同時，鋼刀132 會因為振動器220而維持在振動的狀態、，由於鋼力说振動的關 係，所以當錫膏140通過刷錫鋼板12〇上的孔洞時，會受到鋼刀 132振動的影響，而均勻地穿過鋼板12〇上的孔洞，並且附著在印 刷電路板no的焊接點上，由於振動器220會振動鋼刀132，因此 當鋼刀132橫向移動而離開鋼板12〇上的孔洞時，孔洞中已刷入 的錫膏140便不易被鋼刀132所帶離。鋼刀132持續一邊振動一 邊刮動錫膏140，直到鋼刀組130移動到刷錫鋼板12〇的最左側。 明參閱弟4圖’弟4圖為本發明第一實施例之錫膏塗佈裝置的 第二操作示意圖。當鋼刀組130移動到刷錫鋼板12〇最左側時， 鋼刀132會升起以便離開刷錫鋼板120，另一方面，鋼刀131則會 落下以便接觸刷錫鋼板120。請注意，當鋼刀132升起時，振動器 220仍會持續振動，因為鋼刀132振動的關係，錫膏14〇就不容易 隨著鋼刀132的上升而被鋼刀132帶離刷錫鋼板120 ,因此，若鋼 刀132停駐於刷錫鋼板120的位置係具有一孔洞，則當鋼刀132 上升日卞’其便不致於影響該孔洞中原本刷入的錫膏14〇而造成習 知塗佈不均勻的問題。本實施例中，當鋼刀132完全升起，且鋼 刀131完全下降之後’振動器220便停止，而同時振動器21〇便 1274605 會啟動。之後’如第4圖所示，當鋼刀ι31沿著方向b而由左往 右刮動錫賞140時，振動器21〇會使鋼刀131產生振動，同樣地， 當鋼刀131刮動錫膏的同時，鋼刀131會維持在振動的狀態，由 - 於鋼刀131振動的關係，所以當錫膏14〇通過刷錫鋼板12〇上的 孔洞時’會受到鋼刀131振動的影響，而均勻地穿過鋼板12〇上 的孔洞’並且附著在印刷電路板11〇的焊接點上，由於振動器21〇 鲁會振_刀131，因此當鋼刀m橫向雜而侧織120上的孔 洞柃，孔洞中已刷入的錫膏14〇便不易被鋼刀131所帶離 。鋼刀 131持績-邊振動—邊觸料14()，直細刀組⑽目刺錫鋼 板120的最右侧。 同理，當鋼刀組130移動到刷錫鋼板12〇最右側時，鋼刀131 會升起以便離開刷錫鋼板12〇，另一方面，鋼刀132則會落下以便 •接觸刷錫鋼板120。請注意’當鋼刀131升起時，振動器210仍會 持續振動’因為鋼刀131振動的關係，錫膏140就不容易隨著鋼 =131的上升而被鋼刀131帶離刷錫鋼板，因此，若鋼刀⑶ 2駐於刷锡鋼板12G驗㈣具有—孔洞，則當細⑶上升時， "不致於衫響s亥孔洞中原本刷入的錫膏⑽而造成習知塗佈不 均勻的問題。 總之’藉由在鋼刀組130上加裝振動器21〇、22〇，鋼刀13卜 1274605 132便可以在刮動錫膏140的過程中持續振動，讓錫膏14〇能均勻 地透過刷錫鋼板120流入印刷電路板11〇的焊接點上，而且錫膏 140也因為振動的關係，變得不容易附著在鋼刀131、说上。因 此當鋼刀131、132升起時，錫膏140便不會被帶上來。 另外，本發明亦可以藉由在刷錫鋼板12〇上設置振動器的方 式，來使得錫膏能夠均勻地塗佈在印刷電路板上，均屬本發明之 範疇。請參閱第5圖，第5圖為本發明第二實施例之錫膏塗佈裝 置的操作不意圖。如圖所示，在刷錫鋼板12〇上加裝振動器31〇 即可在塗佈錫貧140的過程中，藉由振動刷錫鋼板12〇而非振動 鋼刀131或鋼刀132，來使錫膏14〇能均勻地分佈在印刷電路板 110上’換句話說，本實施例係經由刷錫鋼板12〇上的振動器31〇 來提供鋼刀131、132與錫膏140之間所需的振動，亦可達到避免 錫T 140沾附於鋼刀13卜132的目的。同樣地，較常使用的振動 器種類為超音波振動器，因為超音波振動器的體積不大，重量也 車父輕’所以適合安裝於刷錫鋼板120上，而且超音波振動器可以 提供較高的振動頻率，其所產生的振動效果亦較佳。 請參閱第6圖，第6圖為本發明第三實施例之錫膏塗佈裝置 的操作示意圖。在此一實施例中，同時在鋼刀13卜鋼刀132以及 刷锡鋼板120分別加裝振動器210、振動器220以及振動器310， 11 1274605 當鋼刀132由右往左刮時，振動器22〇以及振動器31〇會同時啟Please refer to Fig. 3. Fig. 3 is a first schematic view showing the operation of the solder paste coated agricultural device according to the first embodiment of the present invention. In the present embodiment, the steel knife 131 and the steel knife 132 are respectively provided with the vibrator 210 and the vibrator 22 〇, and the vibrator 21 () and the vibrator 22 〇 can be any kind of _ _ _ _ _ _ _ _ _ 131 and steel knife 132, in general, the type of vibrator used more commonly is ultrasonic vibrator (ultraSonievib), because the volume of the super-vibration _ is not large, suitable for installation; steel knife 131 and steel knife 132 'And the ultrasonic vibrator can provide a higher vibration frequency, and the resulting miscellaneous ship is also difficult. When the fine number (10) plane is applied along the direction A !274605 for the solder paste coating, the steel π 131 will rise to leave the brushed tin steel plate i2〇, and the other steel knife 131 will be lowered to contact the brushed tin steel plate 12〇, Vibrator Μ. It will start. Therefore, while the steel knife set 130 scrapes the solder paste 14 右 from right to left, the steel knife 132 is maintained in a vibrating state due to the vibrator 220, and because of the relationship between the steel force and the vibration, when tin When the paste 140 passes through the hole in the tin plate 12, it is affected by the vibration of the steel blade 132, and uniformly passes through the hole in the steel plate 12, and adheres to the soldering point of the printed circuit board no, due to the vibrator 220. The steel knife 132 is vibrated, so that when the steel knife 132 moves laterally away from the hole in the steel plate 12, the solder paste 140 that has been brushed in the hole is not easily carried away by the steel knife 132. The steel knife 132 continues to scrape the solder paste 140 while vibrating until the steel knife set 130 moves to the leftmost side of the tin plated steel plate 12〇. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a second schematic view of a solder paste coating apparatus according to a first embodiment of the present invention. When the steel knife set 130 is moved to the leftmost side of the brushed steel sheet 12, the steel knife 132 is raised to leave the brushed steel sheet 120, and on the other hand, the steel knife 131 is dropped to contact the brushed steel sheet 120. Please note that when the steel knife 132 is raised, the vibrator 220 will continue to vibrate. Because of the vibration of the steel knife 132, the solder paste 14〇 is not easily taken away by the steel knife 132 as the steel cutter 132 rises. The steel plate 120, therefore, if the steel knife 132 is parked at the position of the brushed steel plate 120 has a hole, when the steel knife 132 rises, it does not affect the originally applied solder paste 14〇 in the hole. The problem of uneven coating is known. In this embodiment, when the steel knife 132 is fully raised and the steel knife 131 is completely lowered, the vibrator 220 is stopped, and at the same time, the vibrator 21 squat 1274605 is activated. Then, as shown in Fig. 4, when the steel knife ι 31 scrapes the tin shovel 140 from left to right along the direction b, the vibrator 21 〇 causes the steel knives 131 to vibrate, and similarly, when the steel knives 131 are scraped At the same time as the solder paste, the steel knife 131 is maintained in a vibrating state, and the vibration of the steel knife 131 is caused by the vibration of the steel knife 131 when the solder paste 14 is passed through the hole in the 12-turned steel plate. And uniformly passing through the hole ' on the steel plate 12'' and attached to the soldering point of the printed circuit board 11〇, since the vibrator 21 is oscillating and oscillating, the steel knife m is laterally mixed and the side weave 120 The hole in the hole, the solder paste 14 that has been brushed in the hole is not easily taken away by the steel knife 131. The steel knife 131 has a performance - side vibration - 14 (), and the straight knife group (10) is the right side of the tin plate 120. Similarly, when the steel knife set 130 is moved to the rightmost side of the brushed steel plate 12〇, the steel knife 131 will rise to leave the brushed steel plate 12〇, and on the other hand, the steel knife 132 will fall to contact the brushed steel plate 120. . Please note that when the steel knife 131 is raised, the vibrator 210 will continue to vibrate. Because of the vibration of the steel knife 131, the solder paste 140 is not easily taken away from the brush steel plate by the steel knife 131 as the steel = 131 rises. Therefore, if the steel knife (3) 2 is stationed on the brushed steel plate 12G (4) has a hole, when the thin (3) rises, " does not cause the solder paste (10) originally brushed in the hole of the hole to cause the conventional coating Uneven problem. In short, by adding vibrators 21〇, 22〇 to the steel knife set 130, the steel knife 13 1287605 132 can continuously vibrate during the process of scraping the solder paste 140, so that the solder paste 14 can pass through the brush evenly. The tin steel plate 120 flows into the solder joints of the printed circuit board 11A, and the solder paste 140 also becomes less likely to adhere to the steel blade 131 due to the vibration. Therefore, when the steel knives 131, 132 are raised, the solder paste 140 is not brought up. Further, the present invention is also capable of uniformly coating a solder paste on a printed circuit board by providing a vibrator on the brushed steel plate 12, which is within the scope of the present invention. Referring to Fig. 5, Fig. 5 is a schematic view showing the operation of the solder paste applying apparatus of the second embodiment of the present invention. As shown in the figure, by adding a vibrator 31 on the tin plate 12, it is possible to vibrate the tin plate 12 instead of vibrating the steel knife 131 or the steel knife 132 during the application of the tin lean 140. The solder paste 14 〇 can be evenly distributed on the printed circuit board 110. In other words, the present embodiment provides the between the steel knives 131 and 132 and the solder paste 140 via the vibrator 31 〇 on the brushed steel plate 12 〇. The required vibration can also achieve the purpose of avoiding the adhesion of the tin T 140 to the steel knife 13 132. Similarly, the type of vibrator that is more commonly used is an ultrasonic vibrator, because the ultrasonic vibrator is small in size and light in weight, so it is suitable for mounting on the tin-plated steel plate 120, and the ultrasonic vibrator can provide a comparison. The high vibration frequency also produces better vibration effects. Please refer to Fig. 6, which is a schematic view showing the operation of the solder paste applicator of the third embodiment of the present invention. In this embodiment, the vibrator 210, the vibrator 220, and the vibrator 310 are respectively added to the steel knife 13 and the brushed steel plate 120, 11 1274605. When the steel knife 132 is scraped from right to left, the vibration is vibrated. 22〇 and vibrator 31〇 will be activated simultaneously
動’使得鋼刀132與刷錫鋼板12〇同時產生振動，並使錫膏HO 能夠順利通過刷錫鋼板120上的孔洞而均勻附著在印刷電路板no 的焊接點上^所以，由於振動器22〇會振動鋼刀132以及振動器 310會振動刷錫鋼板12〇,因此當鋼刀132橫向移動而離開鋼板12〇 上的孔洞時，孔洞中已刷入的錫膏14〇便不易被鋼刀132所帶離。 另外，當鋼刀131由左往右刮時，振動器21〇以及振動器31〇會 同時啟動，使得鋼刀131與刷錫鋼板12〇同時產生振動，使錫膏 140此夠順利通過刷錫鋼板丨2〇上的孔洞而均勻附著在印刷電路 板no的焊接點上，所以，由於振動器210會振動鋼刀131以及 振動為310會振動刷錫鋼板12〇，因此當鋼刀131橫向移動而離開 鋼板120上的孔洞時，孔洞中已刷入的錫膏14〇便不易被鋼刀 所帶離。 綜上所述，本發明藉由在鋼刀或刷錫鋼板上裝設振動器，因 此可以增加塗佈錫膏的效率，使得錫膏能夠均勻地塗佈在印刷電 路板上，並且因為鋼刀振動的關係，錫膏便不容易殘留在鋼刀上， 使塗佈的過程中可以大幅地節省錫膏的使用量。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範 圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 12 1274605 【圖式簡單說明】 =1圖為習知錫㈣職置的第—操作示意圖。 第2圖是f知錫膏塗佈裝置咐二操作示賴。 “圖為本發明第—實施例之錫f塗佈裝置的第—操作示音圖 ，4圖是本發明第—實施例之錫f塗佈裝置的第二操作示意圖 =5圖為本發明第二實施例之錫膏塗佈裝置的操作示意圖: 第6圖為本發明第三實施例之騎塗佈裝置的操作示意圖。 【主要元件符號說明】 110 印刷電路板 120 刷錫鋼板 130 鋼刀組 131、132 鋼刀 140 錫膏 210、220、310 振動器At the same time, the steel knife 132 and the brushed steel plate 12 are simultaneously vibrated, and the solder paste HO can be smoothly adhered to the soldering point of the printed circuit board no through the holes in the brushed steel plate 120. Therefore, due to the vibrator 22 The vibrating steel knife 132 and the vibrator 310 vibrate the tin steel plate 12〇, so when the steel knife 132 moves laterally away from the hole in the steel plate 12, the solder paste 14 that has been brushed in the hole is not easily scratched by the steel knife. 132 were taken away. In addition, when the steel knife 131 is scraped from left to right, the vibrator 21 〇 and the vibrator 31 启动 are simultaneously activated, so that the steel knife 131 and the brushed steel plate 12 〇 simultaneously vibrate, so that the solder paste 140 is smoothly passed through the brush tin. The hole on the steel plate 2 is evenly attached to the soldering point of the printed circuit board no. Therefore, since the vibrator 210 vibrates the steel blade 131 and the vibration is 310, the brushed steel plate 12 is vibrated, so that the steel blade 131 moves laterally. When leaving the hole in the steel plate 120, the solder paste 14 which has been brushed in the hole is not easily taken away by the steel knife. In summary, the present invention can increase the efficiency of coating the solder paste by mounting the vibrator on the steel knife or the brushed steel plate, so that the solder paste can be uniformly coated on the printed circuit board, and because the steel knife In the relationship of vibration, the solder paste is not easily left on the steel knife, so that the amount of solder paste can be greatly reduced during the coating process. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should fall within the scope of the present invention. 12 1274605 [Simple description of the figure] =1 The picture shows the first operation of Xizhixi (4). Fig. 2 is a schematic diagram of the operation of the solder paste coating device. The figure is a first operation diagram of the tin f coating apparatus of the first embodiment of the present invention, and 4 is a second operation diagram of the tin f coating apparatus of the first embodiment of the present invention. 2 is a schematic view showing the operation of the solder coating apparatus according to the third embodiment of the present invention. [Main component symbol description] 110 printed circuit board 120 brushed steel plate 130 steel knife set 131,132 steel knife 140 solder paste 210, 220, 310 vibrator