1274034 九、發明說明： • 【發明所屬之技術領域】 本發明係有關於一種多向式抓取裝置，尤指一種可於 加工作業過程中，同時進行取料或定位作業之抓取裝置， 可縮短製程時間、提升生產效率，適用於必須重複取料、 加工之製造產業領域，如晶圓製造業者。 【先前技術】 按，依產品特性或加工方式不同，並非所有產品皆可 進行不同製程之連續加工作業，例如晶圓#造，其部分加 工製程必須重複取料、加工之動作，主要包括有下列步驟： 一、 首先藉由機械手臂等抓取裝置將待加工晶圓由儲料匣 中取出； 二、 將待加工晶圓置放於加工機台上進行加工作業； 三、 待加工作業完成後，再由抓取裝置將已加工晶圓由加 工機台上取出； 四、 將已加工晶圓送回至儲料匣儲放； 五、 抓取裝置再抓取另一待加工晶圓以進行加工製程。 如此週而復始地重複上述取料、加工之步驟，另者， 因應不同晶圓加工段所需’部分加工製程於晶圓進入加工 機台前，尚必須進行晶圓定位步驟，以利該段加工作業製 程。 上述動作看似連貫，然實際上卻存在一嚴重缺失，亦 即，當晶圓進行加工作業時，抓取裝置係處於靜止之等候 1274034 .狀態而無任何動作，而當抓取裝置進行由儲料匣取出待加 _ 工晶圓、晶圓定位，或由加工機台取下已加工晶圓、送回 ， 儲料匣、再抓取下一待加工晶圓等一連串動作時，該加工 機台則處於閑置狀態，無形中浪費了許多時間，而一般業 者之改良對策，僅限於如何加快取料、置料動作，或提高 - 機台作業速度，導致生產效率始終無法有效提升。 . 因此，如何能有效利用加工時間，使抓取裝置發揮最 高之機械效率，並能縮短加工製程、提高產能，是相關業 • 者迫切需要解決之一大問題。 【發明内容】 有鑑於習知技術之缺失，本發明之主要目的在於提出 一種多向式抓取裝置，可於加工作業過程中，同時進行取 料或其他所需動作，可縮短製程時間、有效提升產能。 為達到上述目的，本發明提出一種多向式抓取裝置， 其包含： 一抓取主體，其具有一旋轉軸，以該旋轉軸為中心分 朝向不同方向設有抓取臂； 驅動機構，係供驅動抓取主體作垂直、水平位移或旋 轉。 較佳地，其更包括一感測裝置，係用以感測工件位置。 較佳地，該感測裝置係設置於抓取主體上。 較佳地，該感測裝置偵測到工件位置後，可產生偵測 訊號以控制抓取臂抓取所偵測到之工件。 1274034 較佳地，該感測裝置包括兩感測器，該兩感測器之感 測方向係相互直交。 較佳地，該抓取臂係對稱於該抓取主體之旋轉軸，分 朝向相反方向水平設置。 較佳地，該抓取臂係連通真空抽取裝置以產生真空吸 力。 較佳地，該抓取臂用以抓取工件之面上設置至少一孔 洞，該孔洞連通於真空抽取裝置，藉此使該抓取臂與工件 之間具有吸附力。 較佳地，該抓取臂係水平延展呈平板狀。 較佳地，該抓取臂之外側端具有一凹槽，使該抓取臂 之外侧端呈” u”形。 較佳地，該驅動機構包括： 一垂直驅動組，係用以驅動抓取主體垂直線性運動； 一水平驅動組，係用以驅動抓取主體水平線性運動； 一旋轉驅動組，係用以驅動抓取主體旋轉。 較佳地，該垂直驅動組包括： 一滑軌裝置，其係由一垂直設置之滑軌，以及一套設 於該滑執上並可於該滑執上滑行之座體所構成，該滑執頂 端係供設置該抓取主體； 動力裝置，係用以提供動力至前述該滑軌，用以驅動 該滑執可上下移動，進而帶動抓取主體移動。 較佳地，該滑執裝置係為滚珠花鍵（Ball Spline)，該 滑執係為一花鍵軸，該座體則為一花鍵套筒。 1274034 較佳地，該水平驅動組包括： 一螺桿裝置，其係由一水平設置之螺桿，以及一設置 於該螺桿上並可由螺桿驅動而平行螺桿軸向移動之從動件 所構成，該從動件係供抓取主體設置於其上； 驅動馬達，係供驅動該螺桿旋轉並帶動從動件於螺桿 上移動，繼而帶動設置於從動件上之抓取主體移動。 較佳地，該旋轉驅動組包括： 一傳動件，該傳動件係連接抓取主體之旋轉軸； 一動力輸出機構，用以輸出動力至傳動件，再由該傳 動件驅動抓取主體之旋轉軸旋轉。 較佳地，該動力輸出機構係為一馬達減速組。 較佳地，該傳動件係為一皮帶。 為使貴審查委員對於本發明之結構目的和功效有更 進一步之了解與認同，茲配合圖示詳細說明如后。 【實施方式】 以下將參照隨附之圖式來描述本發明為達成目的所使 用的技術手段與功效，而以下圖式所列舉之實施例僅為輔 助說明，以利貴審查委員暸解，但本案之技術手段並不限 於所列舉圖式。 請參閱圖一所示本發明提供之多向式抓取裝置較佳實 施例之立體結構示意圖，其包括一抓取主體1，該抓取主 體1具有一旋轉轴11，於該旋轉軸11上對稱設有兩組呈 平板狀之抓取臂12、13，該兩組抓取臂12、13係以該旋 1274034 轉軸11為中心’分別朝向相反方向水平延伸設置，盆 『：2卜131係可承载工件5 ’於該兩組抓取臂、13遠 離旋轉軸11之外侧端設有# " 臂12、13之外側端呈”丨:匕22 132 ’使該兩組抓取 用，將詳述於後段說日种。 叫122 132之作 ^於該兩組抓取臂12、13之上表面⑵ 於工件5置放位置處設有孔謂、⑼，該孔洞 係用以連通外部之真空抽取裝置(圖 ：： 空抽取裝置使該孔洞123、133具有吸力，使牛 固吸附於該抓取臂12、13之上表面121、ΐ3ι，避免::牛5 =件= 上洞123、133之設置位置及數量可依所抓取 牛卜i尺寸不同而定，並不限於圖示態樣。 其次’再於該抓取域丨上設_縣置14，該 裝f .14包括兩感測器14卜142，且該兩感測器141、U2 之感測方向相互直交，該感測器141具有—水平朝向 取主體1外部之感測方向，#該抓取域丨移. 由:域測請感測其移動方向前方之工件位置：而該J 心142具有—垂直朝向該抓取主體1頂部之感測方^ 當該抓取主體i上下移動時，該感測器142可^㈣ 路徑之上方是否有突出之工件，以避免該抓取主體;= 件產生撞擊，如此’藉由感測器141、142即可偵測出工件 之正確位置，並能產生偵測訊號以控制抓取臂12、13抓取 所偵測到之U於喊測裝置14之種類及其數量^ 所抓取之工件外型尺寸或加工環境之不同而定，已知反射 光學感測器、超音波感測器等等不同類型感測器，均可達 10 1274034 到偵測工件位置之目的，此屬於習知技術之應用’故在此 不予贅述。 請續參閱圖二所示，本發明另包含一驅動機構，該驅 動機構包括一垂直驅動組2、一水平驅動組3及一旋轉驅 動組4，藉以驅動該抓取主體丨可作垂直、水 及旋轉，叫娜放工狀目的。 運動 該垂直驅動組2包括一滑軌裝置21，於本實施例中， 該滑軌裝置21係為一滾珠花鍵〇&11 SpUne)，其包括一 垂直設置之花鍵軸211，以及一套設於該花鍵軸211上並 可=該花鍵軸211上滑行之花鍵套筒212，該花鍵軸2ιι 及花,建套筒212係設置於一機座22上，該抓取主體】則設 置於花鍵軸211頂端，該花鍵軸211係受控於—動力裝置 (圖中未示出）’藉由該動力裝置輸出動力至該花鍵軸21\， 可驅動該花鍵軸211作升降動作，進而帶動該抓取主體工 可=垂直方向之線性位移，必須說明的是，該滑執裝置Μ 態樣並不限於前述花鍵車由2U及花鍵套筒212 構=其他不同型態之滑執、絲桿等裝置配合 孕由承4白知構件亦可達到相同目的。 、查q 9其』欠’該水平驅動組3係由-螺桿裝置31及一驅動馬 達所構成，該螺桿裝置31具有一水平設置螺… 藉由該驅動W竹趴山如丄 十。又置之螺杯31卜 可帶力可驅動該螺桿311轉動，繼而 311之軸向A水平銘私门 (圖中未不出)沿螺桿 件:連:此 勒抓取主體1作水平線性運動。 11 1274034 再茶閱圖二所示該旋轉驅動組並 作為傳動件，該皮帶41套設於一馬達減-皮帶4」 f帶輪43 ’該皮帶輪⑺係連動於抓取主體、j之^' J由該馬達減速組42輸出動力至皮帶4 二 ’ :皮帶輪㈣動’進而可驅動旋轉軸u旋轉由^ 置於旋轉軸11頂部之抓取主體】亦可同步旋轉。^ 射知，爪體1# 、水平驅動組3及旋轉驅動組4之驅動 直= 、=移:及旋轉，並可藉由控制程式控制垂直驅動组Γ 體3 ?走轉驅動組4相互配合作動，至於抓取主 之垂，、水平行程及其旋轉角度，可依工件類型、尺 _加工壞境、空間或機台佈置不同而有不同實施態樣， t鍵轴211及螺桿311長度，其為㈣技術手 丰又之轉換應用，仍屬於本發明範疇。 丁 凊參閱圖二及谓二i圖Λ & -放工件之連續作^ί圖八所不，以具體說明本發明取 -奸不之儲料116 ’其具有複數層之插槽61，每 π曰,可供晶圓9水平插入(圖二僅顯示插置一片晶 ^ 71 L 口又有具有吸力之旋轉座71，於該旋轉 =:環繞設有複數之^位座72，該旋㈣7 1 座72可供晶圓9置放於苴μ并_ 加工作業所需之方向料、，^1進行疋位’以使晶圓9具有 係提供晶圓9可置放於盆上:::所示3工機台8,其 、々上以進仃加工作業，該儲料匣6、 12 1274034 定位裝置7及加工機台8係配合該抓取主體1之行程而設 置，於圖三所示實施例中，該儲料匣6、定位裝置7及加 工機台8係環繞該抓取主體1之旋轉軸11外圍設置。 如圖三及圖四所示，首先藉由設置於抓取主體1上之 感測裝置14偵測儲料匣6中所擺放之待加工之晶圓9位 置，而後驅動抓取主體1以旋轉軸11旋轉一定角度（約九 十度），以使抓取臂12朝向儲料匣6,並伸入晶圓9底部（如 圖四所示）。 如圖四及圖五所示，將抓取臂12伸入晶圓9底部並與 晶圓9底部接觸，由於抓取臂12設有連接外部真空抽取裝 置而具有吸力之孔洞123，因此可使晶圓9被吸附於抓取 臂12上，而後驅動抓取主體1後退一定距離，將晶圓9由 儲料匣6中取出（如圖五所示，此時該晶圓9之平切邊91 係呈歪斜狀態），再驅動抓取主體1旋轉一定角度（約九十 度），使抓取臂12位於定位裝置7上方。 如圖五及圖六所示，當抓取臂12旋轉至定位裝置7上 方後，先中斷抓取臂12之孔洞123之真空吸力，再驅動抓 取主體1下降，將抓取臂12上之晶圓9置放於定位裝置7 之定位座72上，即可對該晶圓9進行定位，由於抓取臂 12外側端設有凹槽122,當抓取臂12下降而將晶圓9置放 於旋轉座71及定位座72上時，可避免抓取臂12與旋轉座 71相互干涉，如圖六所示，該定位裝置7可校正晶圓9使 其平切邊91朝向特定之加工方向B，而當抓取臂12旋轉 至定位裝置7上方時，對稱於該抓取臂12設置之抓取臂 13恰可旋轉至加工機台8之晶圓9a下方。 如圖六及圖七所示，當定位裝置7之晶圓9完成定位 13 1274034 . 時，加工機台8之晶圓9a亦完成加工作業，此時驅動抓取 - 主體1上升，抓取臂12、13可同時將晶圓9、9a托起，藉 , 由抓取臂12、13上所設之具有吸力之孔洞123、133可使 晶圓9、9a確實附著於抓取臂12、13上，再驅動抓取主體 1旋轉一定角度，使抓取臂13朝向儲料匣6，並將已加工 • 之晶圓9a插入儲料匣6，如圖七所示。 如圖七及圖八所示，當抓取臂13將已加工之晶圓9a 插入儲料匣6後，再驅動抓取主體1旋轉一定角度，使抓 _ 取臂12將已完成定位之待加工晶圓9放入加工機台8，進 行晶圓9之加工作業，抓取主體1即可再回復到圖三所示 狀態，進行下一待加工晶圓之取料動作，如此週而復始。 - 綜上所述，本發明所提供之多向式抓取裝置，藉由其 不同方位之抓取臂設計，於工件加工作業時，可同時進行 取料或其他所需動作，能有效利用加工時間，使抓取裝置 與機台發揮最高之機械效率，並能縮短加工製程、提高產 能。 惟以上所述者，僅為本發明之最佳實施例而已，當不 能以之限定本發明所實施之範圍。即大凡依本發明申請專 利範圍所作之均等變化與修飾，皆應仍屬於本發明專利涵 蓋之範圍内，謹請貴審查委員明鑑，並祈惠准，是所至 禱。 【圖式簡單說明】 圖一係本發明之抓取主體較佳實施例之立體結構示意 圖。 圖二係本發明之抓取主體較佳實施例配合驅動機構、 14 1274034 ， 儲料匣及定位裝置之立體結構示意圖。 圖三至圖八係本發明較佳實施例取放工件之連續動作 之俯視圖。 【主要元件符號說明】 1-抓取主體 11 -旋轉軸 12、13-抓取臂 121、 131-上表面 122、 132-凹槽 123、 133-孔洞 14-感測裝置 141、142-感測器 2 -垂直驅動組 21-滑軌裝置 211- 花鍵軸 212- 花鍵套筒 2 2 -機座 3- 水平驅動組 31- 螺桿裝置 311-螺桿 32- 驅動馬達 4- 旋轉驅動組1274034 IX. Description of the invention: • Technical field to which the invention pertains The present invention relates to a multi-directional grasping device, and more particularly to a grasping device which can simultaneously perform a reclaiming or positioning operation during a processing operation. Shorten process time and increase production efficiency, which is suitable for manufacturing industries that must repeat reclaiming and processing, such as wafer manufacturers. [Prior Art] According to the product characteristics or processing methods, not all products can be processed continuously in different processes, such as wafer #, the part of the processing must repeat the reclaiming and processing operations, mainly including the following Steps: First, the wafer to be processed is taken out from the storage material by a gripping device such as a robot arm; 2. The wafer to be processed is placed on the processing machine for processing; 3. After the processing is completed Then, the processed wafer is taken out from the processing machine by the grasping device; 4. The processed wafer is sent back to the storage magazine for storage; 5. The grasping device then grabs another wafer to be processed for carrying out Processing process. Repeating the above steps of reclaiming and processing in this way, in addition, in order to meet the different processing stages of the wafer processing section, the wafer positioning step must be performed before the wafer enters the processing machine to facilitate the processing operation of the section. Process. The above actions seem to be coherent, but in fact there is a serious lack of, that is, when the wafer is processed, the gripping device is in a stationary waiting 1274034 state without any action, and when the gripping device performs the storage When the material is taken out, the wafer is positioned, the wafer is positioned, or the processed wafer is removed, the material is returned, the stock is stored, and the next wafer to be processed is taken. The station is in an idle state, which wastes a lot of time invisibly. The improvement measures of the general industry are limited to how to speed up the reclaiming and feeding operations, or to improve the speed of the machine, which leads to the inefficiency of production efficiency. Therefore, how to effectively utilize the processing time, maximize the mechanical efficiency of the gripping device, and shorten the processing process and increase the production capacity are urgently needed for the related industry to solve one of the major problems. SUMMARY OF THE INVENTION In view of the lack of the prior art, the main object of the present invention is to provide a multi-directional grasping device, which can simultaneously take out materials or other required actions during the processing operation, thereby shortening the processing time and being effective. Increase production capacity. In order to achieve the above object, the present invention provides a multi-directional gripping device comprising: a gripping body having a rotating shaft with a gripping arm oriented in different directions centered on the rotating shaft; a driving mechanism For driving the grab body for vertical, horizontal displacement or rotation. Preferably, it further comprises a sensing device for sensing the position of the workpiece. Preferably, the sensing device is disposed on the grasping body. Preferably, after detecting the position of the workpiece, the sensing device can generate a detection signal to control the grabbing arm to grasp the detected workpiece. 1274034 Preferably, the sensing device comprises two sensors, and the sensing directions of the two sensors are orthogonal to each other. Preferably, the gripping arms are symmetrical about the axis of rotation of the gripping body and are horizontally disposed in opposite directions. Preferably, the gripping arm is coupled to the vacuum extraction device to create vacuum suction. Preferably, the gripping arm is provided with at least one hole for gripping the surface of the workpiece, the hole communicating with the vacuum extracting device, thereby causing an adsorption force between the grasping arm and the workpiece. Preferably, the grasping arm is horizontally extended in a flat shape. Preferably, the outer side end of the gripping arm has a recess such that the outer end of the gripping arm has a "u" shape. Preferably, the driving mechanism comprises: a vertical driving group for driving the linear motion of the grasping body; a horizontal driving group for driving the horizontal linear motion of the grasping body; and a rotating driving group for driving Grab the body rotation. Preferably, the vertical driving group comprises: a sliding rail device, which is composed of a vertically disposed sliding rail, and a set of a seat body disposed on the sliding handle and slidable on the sliding handle, the sliding The top end is configured to provide the grasping body; the power unit is configured to provide power to the slide rail for driving the slide to move up and down, thereby driving the grab body to move. Preferably, the sliding device is a Ball Spline, the sliding mechanism is a splined shaft, and the seat is a splined sleeve. Preferably, the horizontal drive group comprises: a screw device consisting of a horizontally disposed screw and a follower disposed on the screw and driven by a screw and axially moving parallel to the screw, the slave The moving member is disposed on the grasping body; the driving motor is configured to drive the screw to rotate and drive the follower to move on the screw, and then drive the grasping body disposed on the driven member to move. Preferably, the rotary drive group comprises: a transmission member connected to the rotating shaft of the grasping body; a power output mechanism for outputting power to the transmission member, and then the transmission member drives the rotation of the grasping body The axis rotates. Preferably, the power take-off mechanism is a motor speed reduction group. Preferably, the transmission member is a belt. In order to enable the reviewing committee to have a better understanding and approval of the structural purpose and efficacy of the present invention, the detailed description is as follows. [Embodiment] Hereinafter, the technical means and effects of the present invention for achieving the object will be described with reference to the accompanying drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, so that the reviewer understands, but the case Technical means are not limited to the illustrated figures. Referring to FIG. 1 , a perspective view of a preferred embodiment of a multi-directional grasping device according to the present invention includes a grasping body 1 having a rotating shaft 11 on which the rotating shaft 11 is mounted. Symmetrically, two sets of gripping arms 12 and 13 are formed in a flat shape, and the two sets of gripping arms 12 and 13 are horizontally extended in opposite directions with the rotating 1274043 rotating shaft 11 as the center, respectively. The loadable workpiece 5' is disposed at the outer side of the two sets of grab arms, 13 away from the rotating shaft 11, and the outer ends of the arms 12, 13 are "丨: 匕 22 132 ' for the two groups to be grasped, In the following paragraph, it is said that the day of the day is called 122 132. The upper surface of the two sets of grab arms 12, 13 (2) is provided with a hole, (9) at the position where the workpiece 5 is placed, and the hole is used to connect the outside. Vacuum extraction device (Fig.:: The empty extraction device makes the holes 123, 133 have suction force, so that the cattle solid is adsorbed on the upper surface 121, ΐ3ι of the grasping arms 12, 13, avoiding:: 5 = = upper hole 123, The position and number of 133 can be determined according to the size of the captured cow, not limited to the picture. The capture field _ is set to the county level 14, the device f. 14 includes two sensors 14 142, and the sensing directions of the two sensors 141, U2 are orthogonal to each other, and the sensor 141 has a horizontal orientation Taking the sensing direction outside the main body 1 , the grabbing domain is shifted. By: the field measurement senses the position of the workpiece in front of the moving direction: and the J core 142 has a sensing direction perpendicular to the top of the grasping body 1 When the grasping body i moves up and down, the sensor 142 can detect whether there is a protruding workpiece above the path to avoid the grasping body; = the piece generates an impact, such that by the sensor 141, 142 can detect the correct position of the workpiece, and can generate a detection signal to control the grasping arm 12, 13 to grasp the detected U and the number of the detecting device 14 and the number of the workpiece Depending on the size or processing environment, it is known that different types of sensors, such as reflective optical sensors, ultrasonic sensors, etc., can reach 10 1274034 to detect the position of the workpiece. Application 'will not be repeated here. Please refer to FIG. 2 again, the present invention further includes a driving mechanism The driving mechanism comprises a vertical driving group 2, a horizontal driving group 3 and a rotating driving group 4, so as to drive the grasping body 丨 for vertical, water and rotation, and the purpose of moving the vertical driving group 2 is included. a rail device 21, in the embodiment, the rail device 21 is a ball spline 〇 & 11 SpUne), comprising a vertically arranged spline shaft 211, and a set of the spline shaft 211 and can be a spline sleeve 212 sliding on the spline shaft 211, the spline shaft 2 ιι and the flower, the sleeve 212 is disposed on a base 22, and the gripping body is disposed on the spline a top end of the shaft 211, the spline shaft 211 is controlled by a power device (not shown) to output power to the spline shaft 21\, and the spline shaft 211 can be driven to move up and down. In turn, the grasping body can be linearly displaced in the vertical direction. It must be noted that the sliding device is not limited to the above-mentioned spline car by 2U and splined sleeve 212 structure = other different types of sliding The device, the screw and other devices can be used for the same purpose. The horizontal drive group 3 is composed of a screw device 31 and a drive motor, and the screw device 31 has a horizontal setting screw... by the drive W. The screw cup 31 can be driven to drive the screw 311 to rotate, and then the axial direction A of the 311 is inscribed (not shown) along the screw member: even: the main body 1 is horizontally moved. . 11 1274034 The tea is shown in Figure 2 as the transmission member, and the belt 41 is sleeved on a motor minus-belt 4" f pulley 43'. The pulley (7) is linked to the gripping body, j' J is outputted by the motor reduction group 42 to the belt 4'': the pulley (four) moves 'and can drive the rotary shaft u to rotate by the grip body placed on the top of the rotary shaft 11] and can also rotate synchronously. ^ Shooting, the driving of the claw body 1#, the horizontal driving group 3 and the rotary driving group 4 is straight = , = shifting: and rotating, and the vertical driving group body 3 can be controlled by the control program. The running driving group 4 cooperates with each other. Actuation, as for grasping the main sag, horizontal stroke and its rotation angle, depending on the type of workpiece, the size of the processing environment, the space or the layout of the machine, there are different implementations, the length of the t-key 211 and the screw 311, It is (4) the application of the technology hand and the conversion, still belongs to the scope of the invention.凊 凊 图 凊 及 及 及 及 及 及 及 及 及 Λ Λ Λ Λ Λ Λ Λ 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件 工件π曰, the wafer 9 can be horizontally inserted (Fig. 2 only shows the insertion of a piece of crystal ^ 71 L port and a rotating rotating seat 71, in which the rotation =: surrounds a plurality of seats 72, the rotation (four) 7 A holder 72 can be placed on the wafer 9 and placed in the direction required for the processing operation, and ^1 is clamped to enable the wafer 9 to have the wafer 9 to be placed on the basin::: The 3 machine table 8 is shown, and the loading device 6 and 12 1274034 positioning device 7 and the processing machine 8 are arranged to match the stroke of the grasping body 1, as shown in FIG. In the embodiment, the magazine 6, the positioning device 7, and the processing machine 8 are disposed around the periphery of the rotating shaft 11 of the grasping body 1. As shown in FIG. 3 and FIG. The sensing device 14 on the first detecting device 14 detects the position of the wafer 9 to be processed placed in the magazine 6 and then drives the gripping body 1 to rotate by a certain angle (about ninety degrees) with the rotating shaft 11 to The grab arm 12 faces the magazine 6 and extends into the bottom of the wafer 9 (as shown in Figure 4). As shown in Figures 4 and 5, the grab arm 12 is extended into the bottom of the wafer 9 and to the wafer 9 At the bottom contact, since the gripping arm 12 is provided with a hole 123 for suctioning the external vacuum extracting device, the wafer 9 can be adsorbed on the gripping arm 12, and then the gripping body 1 is driven back by a certain distance to the wafer. 9 is taken out from the storage hopper 6 (as shown in Fig. 5, at this time, the flat cut edge 91 of the wafer 9 is skewed), and then the grasping body 1 is rotated by a certain angle (about ninety degrees) to make The arm 12 is located above the positioning device 7. As shown in Fig. 5 and Fig. 6, when the gripping arm 12 is rotated above the positioning device 7, the vacuum suction of the hole 123 of the gripping arm 12 is interrupted, and then the gripping body 1 is driven. The wafer 9 on the grabbing arm 12 is placed on the positioning seat 72 of the positioning device 7, and the wafer 9 can be positioned. Since the outer end of the gripping arm 12 is provided with a groove 122, when grasping When the arm 12 is lowered to place the wafer 9 on the rotating base 71 and the positioning seat 72, the grabbing arm 12 and the rotating base 71 can be prevented from interfering with each other, as shown in FIG. As shown, the positioning device 7 can correct the wafer 9 with its flattened edge 91 toward a particular machine direction B, and when the gripper arm 12 is rotated over the positioning device 7, it is symmetrical with respect to the grasping arm 12 The arm 13 can be rotated just below the wafer 9a of the processing machine 8. As shown in Fig. 6 and Fig. 7, when the wafer 9 of the positioning device 7 completes the positioning 13 1274034, the wafer 9a of the processing machine 8 is also completed. The machining operation, at this time, drives the gripping - the main body 1 rises, and the gripping arms 12, 13 can simultaneously lift the wafers 9, 9a, and the suction holes 123, 133 provided by the gripping arms 12, 13 are provided. The wafers 9, 9a can be surely attached to the gripping arms 12, 13, and then the gripping body 1 is rotated by a certain angle so that the gripping arms 13 are directed toward the magazine 6, and the processed wafer 9a is inserted into the reservoir. Item 6, as shown in Figure 7. As shown in FIG. 7 and FIG. 8 , when the grabbing arm 13 inserts the processed wafer 9a into the magazine 6 , the driving body 1 is driven to rotate by a certain angle, so that the grabbing arm 12 will be positioned. The processing wafer 9 is placed in the processing machine 8 to perform the processing operation of the wafer 9. The main body 1 can be grasped and then returned to the state shown in FIG. 3, and the take-out operation of the next wafer to be processed is performed, so as to repeat. - In summary, the multi-directional grasping device provided by the present invention can simultaneously take out materials or other required actions during the workpiece processing operation by using the gripping arm design of different orientations, and can effectively utilize the processing. Time, the gripping device and the machine can achieve the highest mechanical efficiency, and can shorten the processing process and increase the production capacity. However, the above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto. That is to say, the equivalent changes and modifications made by the applicants in accordance with the scope of the patent application of the present invention should still fall within the scope of the patents of the present invention. I would like to ask your review committee to give a clear explanation and pray for the best. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a preferred embodiment of a grasping body of the present invention. 2 is a schematic perspective view of a preferred embodiment of the grasping body of the present invention, which cooperates with a driving mechanism, 14 1274034, a magazine and a positioning device. Figures 3 through 8 are top views of successive operations of picking and placing workpieces in accordance with a preferred embodiment of the present invention. [Description of main component symbols] 1- Grasping body 11 - Rotating shaft 12, 13 - Grab arms 121, 131 - Upper surface 122, 132 - Groove 123, 133 - Hole 14 - Sensing means 141, 142 - Sensing 2 - Vertical drive group 21 - Rail assembly 211 - Spline shaft 212 - Spline sleeve 2 2 - Base 3 - Horizontal drive set 31 - Screw unit 311 - Screw 32 - Drive motor 4 - Rotary drive unit
15 1274034 41- 皮帶 42- 馬達減速組 43- 皮帶輪 5- 工件 6- 儲料匣 61-插槽 7- 定位裝置 71-旋轉座 7 2 -定位座 8 -加工機台 9、9a-晶圓 91 -平切邊 A-螺桿之軸向 B -加工方向15 1274034 41- Belt 42- Motor deceleration set 43- Pulley 5 - Workpiece 6 - Storage magazine 61 - Slot 7 - Positioning device 71 - Rotating base 7 2 - Positioning seat 8 - Processing machine 9, 9a - Wafer 91 - Flat cutting edge A-screw axial B - machining direction