1271809 九、發明說明： 【發明所屬之技術領域】 本發明係相關於一種基板上錫製程，特別是指一種平面 格形陣列基板的銲墊上錫製程。 【先前技術】 隨著工業技術的發展，對於各式電子產品的性能要求 越來越高，設計趨勢也以輕薄短小為目標。為了達成此一 目標，關鍵的一部份則在於加強電子產品中所使用的各式 積體電路(IntegratedCircuit，以下簡稱ic)的運算速度及處 理功能，並減少1C的體積與重量，以及降低生產的成本。 也因此，1C封裝技術亦隨著1(：設計技術的發展，而走向 微型化、南密度化的目標，而產生了許多種類的封裝結構。 而近來，備受矚目的技術之一，即為平面格形陣列封 裝結構(Land Grid Array Package ;以卞簡稱LGA封裝結 構），其與球形陣列封裝結構(Ball Gridpackage，以下 簡稱bga封裝結構）、針形陣列封裝結構(pinGridAjTay1271809 IX. Description of the Invention: [Technical Field] The present invention relates to a tin process on a substrate, and more particularly to a solder pad process on a planar grid array substrate. [Prior Art] With the development of industrial technology, the performance requirements for various electronic products are getting higher and higher, and the design trend is also aimed at light, thin and short. In order to achieve this goal, a key part is to enhance the computing speed and processing functions of various integrated circuits (IC) used in electronic products, reduce the volume and weight of 1C, and reduce production. the cost of. Therefore, the 1C packaging technology has also become the target of miniaturization and south density with the development of design technology, and has produced many kinds of package structures. Recently, one of the high-profile technologies is Planar grid array package structure (Land Grid Array Package; referred to as LGA package structure), and ball array package structure (Ball Gridpackage, hereinafter referred to as bga package structure), pin array package structure (pinGridAjTay
Package ’以下簡稱pga封裝結構)相似，最大的不同點是 在於’ LGA封裝結構其下表面的鮮墊，不需再加設錫球或 針腳以進行峨傳遞，藉此縮小了封裝結構的厚度並同時 加快了訊號的傳遞速度。 所翔第-圖，其係為—彻打線接合的習知lga 封裝結構的剖面示意圖。如圖所示，此LGA封裝結構主 要包括了基板(SUbstrate)i〇、IC晶粒u、金線12 膠體13。 1271809 基板10 ,具有一上表面101，以及正對於上表面1〇1 的下表面102，上表面ιοί及下表面1〇2 f設有基底金屬 (如銅合金），並經過圖案化之程序，將基底金屬之表面製 成預定之電路佈線’而後再加以塗佈防焊層1〇3(S〇lder Resistant Layer)覆蓋基底金屬，並在防焊層1〇3預定的位 置上加以開口，裸露出基底金屬。 其中，路出在上表面101開口内的基底金屬可稱為打 線手指墊104(BondingFinger)，位於下表面1〇2開口内之 基底金屬則可稱為銲墊105 (SolderPad)。並且，其杯 t 106(Via> ^ 1〇1 1〇2, 以導通打線手指墊104與鋅墊1〇5兩者。 而當晶圓(Wafer)加以切割分離後，即成各自獨立的汇 晶粒(ICDie)l卜可利用銀膠，將IC晶粒u黏貼於基板 1〇的上表面，並以金線接合之方式，以金線12連接IC晶 粒11表面上的輸出/輸入接點U1與墓板上的打線手指墊 104，進而使iC晶粒u與銲墊1〇5產生電性連接。 在完成1C晶粒11的黏貼與金線連接的程序後，為了 防止1C晶粒11與金線《到破壞，並保護不受外界濕氣侵 入，則需進行封膠的製程。 其主要係轉粒加熱驗態後，擠人財紐1〇的模 具中，待熔融的膠液硬化後，即成包覆在基板10上表面， IC晶粒外的封裝膠體13。 β當封膠完成後，_賴板_的方式，觸膏轉印 至銲整105的表面後’再加以迴蟬。待錫f冷卻固化後， 將在銲墊表面形成錫塊14，以作為外部端子（Lands)。 當LGA封裝結構喪入電路板的連結座加㈣時，即 可利用此些錫塊14所形成的外部端子與連接座的端子接 觸’達成電性連結。较欲將LGA封裝結構觸在印刷 電路板時’ 輯加LGA封储職上的可靠度。 而前述以模板印刷設置錫塊14之方式，請參閱第二 圖，其係細模板印式，將基板之銲倾置錫塊的示 意圖。 如圖所不’ 一模板15具有複數個通孔151，每偭通孔 的位置，皆對應於基板1〇 一個銲墊1〇5。係先將模板15 鋪設於基板10上後，以刮刀16及滾輪17配合，將錫膏 (SolderPaste) 18透過通孔151擠出，附著在銲墊1〇5的 表面後，移除模板15。此時基板1〇孓銲墊1〇5黏附有錫 貧18。當基板1〇進行迴焊後，錫膏18在熔融後將附著於 銲墊105表面，並在冷卻固化後形成如第一圖所示之錫塊 14 〇 然而’在基板進行模板印刷之前，基板係已經經過封 膠的步驟，並由於封裝膠體與基板的熱膨脹係數不同，因 此’在封裝膠體逐漸硬化時，基板與封裝膠體之間會隨著 溫度的變化，而產生不同程度的膨脹或收縮，使得基板受 力而發生翹曲。 而當基板以模板進行印刷時，基板的翹曲有可能造成 基板無法與模板均勻的保持接觸，而無法均勻的將錫膏塗 佈在銲墊表面，造成銲塾上黏附的錫膏量不同，而難以控 制基板各處銲墊的錫塊厚度。 換句話說，由於實務製造中，是將複數個1C晶粒黏貼 於同一基板中，而後再分割成複數個封裝結構。因此，即 使基板整體有些微的翹曲，但以封裝結構而言，每一個封 裝結構仍是維持在平整的狀態下，因此，在封膠過程後， 了允吟基板有些微的勉曲。 但在模板印刷過程中，當基板發生翹曲時，則可能發 生其局部位置過高或過低的情況，對於位在此些局部位置 的封裝結構而言，即使其錫塊厚度仍是維持在一定的平整 度下，但卻可能發生錫塊的厚度過高或不足的情況，而影 響封裝結構在焊性與電性上的表現。 。 因此’如何有效解決前述錫膏塗佈不均的問題，係為 熟悉此項技藝者所致力之方向。… .1 4 【發明内容】 為此，本發明目的之一，在於提出一種基板上錫製程， 可有效改善前述錫膏塗佈不均的缺點。 本發明至少包括下列步驟·· 提供一具有複數個通孔之印刷模板。 填滿錫膏於上述通孔内。 提供一表面具有複數個銲墊之基板。 將該印刷模板與該基板蓋合，且該等通孔係正對於該 等銲墊。 對蓋合後之該印刷模板及該基板進行迴焊，使該等通 孔内之錫膏附著於該基板之銲墊表面。 移除該印刷模板。 在填滿錫膏於印刷模板之通孔的步驟中，由於印刷模 板中每一通孔具有相同孔徑及深度，因此，在印刷模板的 每一通孔中，係填入了等量的錫膏。 當印刷模板與基板蓋合後，基板上每一銲墊上將附著 等量的錫膏，而後再加以迴焊。藉此，而可有效解決習知 錫膏塗佈不均所造成的問題。 為使本發明之優點及精神能更進一步的被揭示，茲配 合圖式作一詳細說明如後。 【實施方式】 本發明在此所揭露之基板上錫製程，係可運用在各式 基板之知墊的上錫製程中，諸如印刷電路板的銲塾上鍚製 程，或是運用在球形陣列封裝結構(BallGridAITay Package，以下簡稱BGA)基板的鲜塾上锡，以在後續製_ 形成錫球，又或是運用在針形陣列封裝結構卿㈣如砂 Package)銲墊上錫。 而由於一般使用在平面格形陣列封裝 Array，以下簡稱LGA)結構中的lga基板，較前述的bga 基板或印猶路板厚度㈣，當其完賴賴程後，所產 生的變形1更為嚴重’並且在LGA^裝結射，所需之 錫塊厚度又極薄(如2〇//m〜80//m之間）。因此，本發明之 基板上錫製程，又更特別適於運用在lGA基板的銲墊上 錫過程巾。在此即以—LGA基板之實施例予以說明。 π參閱第二® ’其係為本發明所揭露之基板上锡製程 一實施例之流程圖。 本發明包括下列步驟： 501 :提供一具有複數個通孔之印刷模板。 502 :填滿鍚膏於上述通孔内。 503 :提供一表面具有複數個銲墊之基板。 504 ··將該印刷模板蓋合於該基板上，且該等通孔係 正對於該等銲墊。 505 :對蓋合後之該印刷模板及該基板進行迴焊，使 該等通孔内之錫膏附著於該基板之銲墊表面。 506 :移除該印刷模板。 為使前述之步驟更易瞭解，在此即以每一步驟之干音 圖顯示說明〇 如第四圖所示’在提供一具有複數個通孔201之印刷 模板20之步驟中，此印刷模板2〇之材料，係可為耐高溫， 且不易與錫膏軸的金屬所製成，如鋼材。其中，印 板20所具有的複數個通孔201，係具有相同的孔獲。並且: 該印刷模板20之厚度，係配合所欲形成之锡塊厚二度所設 1271809 計’例如當印刷模組之厚度為0.05mm時，附著在銲藝上 的錫塊厚度則可達50/zm。 、而如第五圖所示者，係將錫膏21填入於前述之複數個 通孔201中。此填入錫膏21之方法，係可透過刮刀印刷之 方式，將錫膏21填滿該等通孔内，使印刷模板中，每一通 孔201中裝填有等量的錫膏2卜 而如第六圖所示，係提供一表面具有複數個銲墊221 之基板22，此基板22可為佈有電路之各式基板，更進一 步的說’ f實侧巾，絲板22係為-1^基板，基板 表面已黏著了複數顆Ic晶粒並已完成封膠製程。為便於檢 視在本圖中係僅繪示基板22及其具有婷塾如之下表面 處，而未示出1C晶粒及封裝膠體。Package 'hereinafter referred to as pga package structure' is similar. The biggest difference is that the 'LGA package structure has a fresh pad on the lower surface. No need to add solder balls or pins for 峨 transfer, thereby reducing the thickness of the package structure and At the same time, the speed of signal transmission is accelerated. The figure is a cross-sectional view of a conventional lga package structure in which the wire bonding is performed. As shown, the LGA package structure mainly includes a substrate (SUbstrate), an IC die u, and a gold wire 12 colloid 13. 1271809 The substrate 10 has an upper surface 101, and a lower surface 102 facing the upper surface 1〇1, the upper surface ιοί and the lower surface 1〇2 f are provided with a base metal (such as a copper alloy), and are patterned. The surface of the base metal is made into a predetermined circuit wiring' and then coated with a solder resist layer 1〇3 (S〇lder Resistant Layer) to cover the base metal, and the opening is fixed at a predetermined position of the solder resist layer 1〇3, exposed Out of the base metal. The base metal which is located in the opening of the upper surface 101 may be referred to as a bonding finger pad 104 (Bonding Finger), and the base metal located in the opening of the lower surface 1 2 may be referred to as a pad 105 (SolderPad). Moreover, the cup t 106 (Via> ^ 1〇1 1〇2 is used to turn on both the finger pad 104 and the zinc pad 1〇5. When the wafers are cut and separated, they become separate sinks. The die (ICDie) can use the silver paste to adhere the IC die u to the upper surface of the substrate 1 and connect the output/input on the surface of the IC die 11 with the gold wire 12 by gold wire bonding. Point U1 and the finger pad 104 on the tomb, and then electrically connect the iC die u to the pad 1〇5. After completing the procedure of bonding the 1C die 11 to the gold wire, in order to prevent the 1C die 11 and the gold line "to the destruction, and protection from external moisture intrusion, it is necessary to carry out the process of sealing. It is mainly after the rotating grain heating test, the mold is squeezed into the mold, the glue to be melted After hardening, it is coated on the upper surface of the substrate 10, and the encapsulation colloid 13 outside the IC die. β When the encapsulation is completed, the way of the paste is transferred to the surface of the soldered 105, and then After the tin f is cooled and solidified, a tin block 14 is formed on the surface of the pad to serve as an external terminal (Lands). When the LGA package structure is lost to the circuit board When the junction is added (4), the external terminals formed by the tin blocks 14 can be electrically contacted with the terminals of the connector. When the LGA package structure is to be touched on the printed circuit board, the LGA package is added. The reliability of the above. For the manner of stencil printing the tin block 14, please refer to the second figure, which is a schematic diagram of the thin template printing, which is used to dump the soldering of the substrate into the tin block. A plurality of through holes 151, each of which corresponds to a pad 1 〇 5 of the substrate 1. After the template 15 is laid on the substrate 10, the blade 16 and the roller 17 are used to match the solder paste. (SolderPaste) 18 is extruded through the through hole 151, adhered to the surface of the pad 1〇5, and the template 15 is removed. At this time, the substrate 1〇孓 pad 1〇5 adheres to the tin depletion 18. When the substrate 1〇 is returned After soldering, the solder paste 18 will adhere to the surface of the pad 105 after melting, and after cooling and solidification, form the tin block 14 as shown in the first figure. However, before the substrate is subjected to stencil printing, the substrate system has been sealed. Step, and because the thermal expansion coefficient of the encapsulant and the substrate are different, therefore' When the encapsulant colloid is gradually hardened, the substrate and the encapsulant may change or contract with different degrees of temperature, causing the substrate to be warped and warped. When the substrate is printed by the template, the substrate is warped. The curvature may cause the substrate to be in uniform contact with the template, and the solder paste may not be uniformly applied to the surface of the pad, resulting in different amounts of solder paste adhering to the solder bump, and it is difficult to control the thickness of the solder bumps of the pads throughout the substrate. In other words, in practical manufacturing, a plurality of 1C crystal grains are adhered to the same substrate and then divided into a plurality of package structures. Therefore, even if the substrate as a whole has slight warpage, in terms of package structure, Each package structure is still maintained in a flat state. Therefore, after the sealing process, the substrate is allowed to be slightly distorted. However, in the stencil printing process, when the substrate is warped, the local position may be too high or too low. For the package structure located at these local positions, even if the thickness of the tin block is maintained. Under a certain degree of flatness, but the thickness of the tin block may be too high or insufficient, and affect the performance of the package structure in terms of solderability and electrical properties. . Therefore, how to effectively solve the problem of uneven coating of the aforementioned solder paste is the direction in which the skilled person is familiar with the art. [1] [Invention] Therefore, one of the objects of the present invention is to provide a soldering process on a substrate, which can effectively improve the disadvantage of coating unevenness of the solder paste. The present invention includes at least the following steps: Providing a print template having a plurality of through holes. Fill the solder paste in the above through hole. A substrate having a plurality of pads on the surface is provided. The print stencil is capped to the substrate and the through holes are aligned with the pads. The printed template and the substrate are reflowed after the cover, so that the solder paste in the through holes is attached to the surface of the pad of the substrate. Remove the print template. In the step of filling the through-hole of the solder paste in the printing template, since each of the through holes in the printing template has the same aperture and depth, an equal amount of solder paste is filled in each of the through holes of the printing template. After the printing template is covered with the substrate, an equal amount of solder paste is attached to each of the pads on the substrate, and then re-welded. Thereby, the problems caused by the uneven coating of the solder paste can be effectively solved. In order to further disclose the advantages and spirit of the present invention, a detailed description will be given below. [Embodiment] The tin process on the substrate disclosed in the present invention can be applied to the soldering process of the various substrates, such as the soldering process of the printed circuit board, or the ball array package. Structure (BallGrid AITay Package, hereinafter referred to as BGA) substrate of the bismuth on the tin, in order to form a solder ball in the subsequent process, or in the needle array package structure (4) such as sand package) solder pad. Since the LG substrate in the planar lattice array package Array, hereinafter referred to as LGA) structure, is more than the thickness of the bga substrate or the ink plate (4), when the lag is completed, the deformation 1 is more Severe 'and in the LGA ^ mount, the required tin block thickness is extremely thin (such as between 2 〇 / / m ~ 80 / / m). Therefore, the tin process on the substrate of the present invention is more particularly suitable for use in solder pads on lGA substrates. Here, an embodiment of the -LGA substrate will be described. π Referring to the second ® ' is a flow chart of an embodiment of the tin-on-board process disclosed in the present invention. The invention comprises the following steps: 501: providing a printing template having a plurality of through holes. 502: filling the paste into the through hole. 503: providing a substrate having a plurality of pads on the surface. 504 · The printing template is capped on the substrate, and the through holes are aligned with the pads. 505: re-welding the printed template and the substrate after the cover, so that the solder paste in the through holes adheres to the surface of the pad of the substrate. 506: Remove the print template. In order to make the foregoing steps easier to understand, the dry sound map display description of each step is as shown in the fourth figure. In the step of providing a printing template 20 having a plurality of through holes 201, the printing template 2 The material of the crucible can be made of metal that is resistant to high temperatures and is not easily compatible with the solder paste shaft, such as steel. Among them, the plurality of through holes 201 of the printing plate 20 have the same holes. And: the thickness of the printing template 20 is set to be 1,271,809 in accordance with the thickness of the tin to be formed. For example, when the thickness of the printing module is 0.05 mm, the thickness of the tin attached to the soldering art can reach 50. /zm. As shown in the fifth figure, the solder paste 21 is filled in the plurality of through holes 201 described above. The method of filling the solder paste 21 is to fill the solder paste 21 into the through holes by means of a doctor blade printing, so that each through hole 201 is filled with an equal amount of solder paste 2 in the printing template. As shown in the sixth figure, a substrate 22 having a plurality of pads 221 on the surface is provided. The substrate 22 can be various substrates with circuits, and further, the 'f real side towel, the wire plate 22 is -1 ^ Substrate, a plurality of Ic crystal grains have been adhered to the surface of the substrate and the encapsulation process has been completed. For ease of inspection, only the substrate 22 and its underlying surface are shown in this figure, and the 1C die and encapsulant are not shown.
而如第七_示，雜_模板20與基板22蓋合。更具 體的說’係當印刷模板2〇之通孔皆已填滿錫膏21後，方 才將印刷模板Μ與基板Μ蓋合，且使印刷模板如的每一 m懷每—銲墊22。如第爛所示，糊模板2〇蓋 口 土 22上方，使錫膏21位於與銲墊221對應之位置。 令，在較佳之情況下’基板20與印刷模板22蓋合 < 匕 固疋程序（例如透過各式夾具、冶具等等）， 使印刷模板20與基柘乃哆〜扑入、人/、 口八寻寺」 ^ ^ . 、暴板22緊岔貼合，防止印刷模板20與基 Α可此的相對移動，使錫膏21附著於銲墊221的 12 1271809 位置產生偏移。 而如第八圖所示，將前述蓋合後之印刷模板邡及基板 、 同，進仃迴焊。藉由迴焊使錫膏21熔融，由於印刷模 板係採用鋼材所製成，因此錫膏21並不易黏附在印刷模板 20之通孔中，而是僅固著於基板22之銲塾221表面。 而如第九圖所示’當前述熔融的錫膏冷卻固化後，將 • 印刷模板20移除，而在銲墊221表面留下均勻厚度之錫 塊。〇 在前述之製程中，由於前述之印刷模板2〇中每一通孔 201係已預先填入等量的錫膏，才蓋合於基板22上。因此， 當印刷模板20移除後，基板22之每一銲墊221表面，可 附著有等厚之錫塊。 ： • 換句話說，即使基板20發生翹曲，但仍然可以確保每 一封裝結構的銲墊表面，皆具有足夠的錫塊厚度，而不致 ， 影響了焊性與電性上的表現。 而為了更加容易暸解前述填入錫膏21於印刷模板2〇 之通孔201的方法，以及印刷模板20與基板22的蓋合方 法’（第五圖〜第七圖所示者），本發明在此，更特別舉其 中的一較佳實施方式為例，加以詳細說明，請參閱第十A 圖〜第十F圖。 如第十A圖所不者’在别述填滿錫膏於該等通孔之步 13 1271809 驟中’更可包含提供一固定板23結合於該印刷模板2〇。 如圖所tf ’固定板23，係具有平坦之表面，印刷模板2〇 係疊置於固定板23的上方。 如第十B圖所示，可利用刮刀印刷之方式將錫膏21 、 填滿該等通孔201内，由於印刷模板20下方設有固定板 • 23 ,可防止錫膏21自通孔2〇1中掉落。 而如第十c圖所示，提供一表面具有複數個銲墊221， • 已完成封膠之基板22。On the other hand, as shown in the seventh example, the stencil 20 is covered with the substrate 22. More specifically, when the through-holes of the printing template 2 are filled with the solder paste 21, the printing template Μ is covered with the substrate ,, and the printing template is, for example, each of the pads 22. As shown in the second, the paste template 2 is over the cover 22 so that the solder paste 21 is located at a position corresponding to the pad 221 . Therefore, in the preferred case, the substrate 20 is covered with the printing template 22 < 匕 疋 ( program (for example, through various types of jigs, tools, etc.), so that the printing template 20 and the 模板 柘 扑 扑 扑 扑 扑 扑 扑 扑 扑 扑 扑 扑The mouth of the eight-question temple ^ ^ . , the storm board 22 close to fit, to prevent the relative movement of the printing template 20 and the base, so that the solder paste 21 attached to the pad 221 12 1271809 position offset. As shown in the eighth figure, the printed template 邡 and the substrate which have been covered as described above are reflowed. Since the solder paste 21 is melted by reflow, since the printing mask is made of steel, the solder paste 21 does not easily adhere to the through holes of the printing template 20, but is fixed only to the surface of the bonding pad 221 of the substrate 22. As shown in the ninth figure, when the molten solder paste is cooled and solidified, the printing template 20 is removed, and a tin block of uniform thickness is left on the surface of the bonding pad 221. 〇 In the foregoing process, since each of the through-holes 201 of the printing template 2 is pre-filled with an equal amount of solder paste, it is covered on the substrate 22. Therefore, when the printing template 20 is removed, the surface of each of the pads 221 of the substrate 22 may be attached with a solder block of equal thickness. • In other words, even if the substrate 20 is warped, it is ensured that the surface of the pad of each package structure has sufficient tin thickness to affect the solderability and electrical performance. In order to more easily understand the method of filling the solder paste 21 into the through hole 201 of the printing template 2, and the method of covering the printing template 20 and the substrate 22 (the fifth to seventh figures), the present invention Here, one of the preferred embodiments is taken as an example, and is described in detail. Please refer to the tenth to tenth Fth drawings. As shown in Fig. A, the step of filling the solder paste in the through holes 13 1271809 may further include providing a fixing plate 23 to be bonded to the printing template 2''. As shown in Fig. tf', the fixing plate 23 has a flat surface, and the printing template 2 is slidably placed above the fixing plate 23. As shown in FIG. 10B, the solder paste 21 can be filled into the through holes 201 by means of doctor blade printing. Since the fixing plate 23 is provided under the printing template 20, the solder paste 21 can be prevented from passing through the through holes 2 Dropped in 1 As shown in the tenth c-figure, a plurality of pads 221 are provided on one surface, and the substrate 22 having been sealed is provided.
W 如第十D圖所示，將基板22置於印刷模板2〇之上方， 並將基板22設有銲墊221之表面，朝向印刷模板2〇，加 以對位，使通孔之錫膏21係正對於該等銲墊221後，將基 板22蓋合於印刷模板2〇上並加0固定。 而如第十E圖所示，將基板22與印刷模板20反置， 而使印刷模板20在反置後，位於基板22之上方。 並如第十F圖所示，將固定板23於印刷模板上2〇移 _ 除，而可進行後續迴焊之步驟。 ， 在此特別說明的是，前述利用固定板進行填入錫膏以 及基板蓋合之步驟，係僅為本發明一較佳之實施例，在此 - 步驟中，係可依實務製程中之不同需求，以其他方式進行 填入錫膏以及基板蓋合之步驟，非以前述固定板之方式完 成者為限。 綜觀上述說明可知，本發明揭露了一基板上錫之製 程，藉由其中填滿錫霄於印刷模板通孔之步驟，在印刷模 1271809 板的，一通孔中’預先填置了等量的錫膏。當印刷模板與 ，板，合後，一同進行迴焊時，可使基板上每一銲墊上附 著了等量轉f ’亦即使每—封裝結翻銲虹，具有均 勻厚度的錫塊，有效解決習知錫膏塗佈不均所造成的問 題。因此’本㈣實具有長足之進步。而熟知本技術者更 可在閱讀本朗書及以上各實補後，更加了解本發明之 精神及其所具有之各項優點或功能運用。 以上所述係利用一較佳實施例以詳細說明本發明，其 並非用以關本發明之實施顧，並且熟⑽項技藝者^ 能明瞭，適當做些微的修改仍不麟本發明之精神及範圍。 【圖式簡單說明】 k 第一圖，係為一習知lga封裝結構之剖視示意圖。 第二圖，係為一習知的模板印刷方式示意圖。 第三圖’係為本發明之基板上錫製程-實施例之流程圖。 第四圖〜第九圖，係為第三睛示之流程财各步驟之 示意圖。 第十A圖〜第十F圖，係為前述第五圖〜第七圖所示之 步驟，其中較佳實施方式之示意圖。 【主要元件符號說明】 23固定板 15 1271809 11積體電路晶粒 12金線 13封裝膠體 14錫塊 15模板 16刮刀 17滾輪 18錫膏 20印刷模板 21錫膏 22基板 101上表面 102下表面 103防焊層 104打線手指墊 105銲墊 106導通孔 111輸出/輸入接點 151通孔 201通孔 221銲墊W, as shown in the tenth D, the substrate 22 is placed above the printing template 2, and the substrate 22 is provided with the surface of the bonding pad 221, facing the printing template 2, and aligned, so that the solder paste of the through hole 21 After the pads 221 are applied, the substrate 22 is overlaid on the print template 2 and fixed by 0. On the other hand, as shown in FIG. E, the substrate 22 is placed opposite to the printing template 20, and the printing template 20 is placed above the substrate 22 after being reversed. And as shown in the tenth F, the fixing plate 23 is moved on the printing template 2, and the subsequent reflowing step can be performed. Specifically, the steps of filling the solder paste and the substrate cover by using the fixing plate are only a preferred embodiment of the present invention. In this step, the requirements can be different according to the actual process. The step of filling the solder paste and the substrate cover by other means is not limited to the completion of the above-mentioned fixing plate. As can be seen from the above description, the present invention discloses a process for tin on a substrate. By filling the tin plate in the through hole of the printing template, an equal amount of tin is pre-filled in a through hole of the printing plate 1271809. paste. When the printing template and the plate are combined and re-welded together, an equal amount of f' can be attached to each pad on the substrate, and even if each package is soldered, a tin block having a uniform thickness is effectively solved. The problem caused by the uneven coating of the solder paste. Therefore, this (four) has made great progress. Those skilled in the art will be able to better understand the spirit of the present invention and its various advantages or functions after reading the book and the above. The above description is based on a preferred embodiment to explain the present invention in detail, and it is not intended to be used in the practice of the present invention, and it will be apparent to those skilled in the art (10) that it is not necessary to make minor modifications as appropriate. range. [Simple diagram of the figure] k The first figure is a schematic cross-sectional view of a conventional lga package structure. The second figure is a schematic diagram of a conventional stencil printing method. The third figure is a flow chart of a substrate process on the substrate of the present invention. The fourth to the ninth diagrams are schematic diagrams showing the steps of the process of the third aspect. The tenth to tenth Fth drawings are the steps shown in the above fifth to seventh embodiments, and are schematic views of preferred embodiments. [Main component symbol description] 23 fixing plate 15 1271809 11 integrated circuit die 12 gold wire 13 encapsulant 14 tin block 15 template 16 blade 17 roller 18 solder paste 20 printing template 21 solder paste 22 substrate 101 upper surface 102 lower surface 103 Solder mask 104 line finger pad 105 pad 106 via 111 output / input contact 151 through hole 201 through hole 221 pad