TWI270530B - Use of multifunctional Si-based oligomer/polymer for the surface modification of nanoporous silica films - Google Patents
Use of multifunctional Si-based oligomer/polymer for the surface modification of nanoporous silica films Download PDFInfo
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- TWI270530B TWI270530B TW89111054A TW89111054A TWI270530B TW I270530 B TWI270530 B TW I270530B TW 89111054 A TW89111054 A TW 89111054A TW 89111054 A TW89111054 A TW 89111054A TW I270530 B TWI270530 B TW I270530B
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- film
- decane
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- monomer
- reaction
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Landscapes
- Formation Of Insulating Films (AREA)
Abstract
Description
1270530 五、發明說明(1) 請案參考 本專利申請案為申請於1 999年1月26曰臨時申幸 號第60/U 7, 248號之部分延續,其揭示内容全部以炎序 式併於本文。 > 叠明範圍 本發明係關於低介電常數矽石薄膜,及於基材上製造該 薄膜之改良方法,以用於製造半導體裝置,如積體乂 (n ICs,,)。 、 發明背景 由於積體電路(ICs)之部件大小接近及低於〇.丨8微米, 可以相信,層間介電(ILD)及金屬間介電(IMD)應用需要具 介電常數$2· 5之電絕緣層。 '、 矽石簿膜 種具低介電常數(n kπ )之材料為微孔石夕石,該微孔石夕 石可藉引入空氣以相對低^電常數化為丨)製備成具毫微米 大小孔隙。微孔矽石在一般用於玻璃上旋轉("s〇G")及化 學氣相沈積("CVD")矽石(SiOd時,因其利用類似前體而 具吸引力,並包括經有機取代之碎烧,如四甲氧基碎烧 (” TM0S")和/或四乙氧基矽烷("TE0S,1 )及/或曱基三乙氧基 石夕烷。微孔矽石亦因其能夠控制所得薄膜材料之孔隙度、 密度、材料強度及介電常數而具吸引力。除具低介電常數 k外,微孔矽石尚提供其它優點,包括·· 1)熱穩定性達 5 0 〇 °C ; 2)相當小的孔徑大小,至少數值上小於積體電路 之微電子部件尺度;3)如上所述,可以廣泛用於半導體1270530 V. INSTRUCTIONS (1) Please refer to this patent application for the continuation of the application on January 26, 999, the temporary sacred number 60/U 7, 248, the disclosure of which is in the form of In this article. > OVERLAYING Scope The present invention relates to a low dielectric constant vermiculite film and an improved method of making the film on a substrate for use in the fabrication of semiconductor devices, such as integrated devices (n ICs, ). BACKGROUND OF THE INVENTION Since the components of integrated circuits (ICs) are close to and below 〇.丨8 μm, it is believed that interlayer dielectric (ILD) and inter-metal dielectric (IMD) applications require a dielectric constant of $2·5. Electrical insulation layer. ', the sapphire film type material with a low dielectric constant (n kπ ) is a microporous stone, which can be prepared to have a nanometer by introducing air to a relatively low electroconductivity Size pores. Microporous vermiculite is commonly used for glass rotation ("s〇G") and chemical vapor deposition ("CVD") vermiculite (SiOd, which is attractive because it uses a similar precursor, and includes Organically substituted calcined, such as tetramethoxy calcined ("TM0S") and / or tetraethoxydecane ("TE0S,1) and / or mercaptotriethoxy oxalate. It is attractive because it can control the porosity, density, material strength and dielectric constant of the resulting film material. In addition to having a low dielectric constant k, microporous vermiculite provides other advantages, including... 1) Thermal stability Up to 50 °C; 2) a relatively small aperture size, at least numerically smaller than the microelectronic component scale of the integrated circuit; 3) as described above, can be widely used in semiconductors
第5頁 1270530 五、發明說明(2) 之(如)矽石及TE0S材料赞借· ^^ ^ 石夕石介電常數之能力;:5)可 f :上虛:厂微孔 沈積微孔薄膜。 了用與I知500處理類似工具 與微孔矽石薄膜有關的一個 合官能團。先前可利用微孔;;= = ; =存在可聚 醇(咖)、石夕氧炫(Si0Si) m在6團包括石夕烧 種類,如但不限於甲基、乙義H〇R)(其中r為有機 貌(反係如前界定)。特別是=、醇或烧基石夕 積,高聚人效产薛其图/ ^〜構有關的相當大(内部)表面 介電常I:兀%基團之作用導致比所需介電常數更高之 加此類材料團吸附環境水甚至能夠另外希在增 石夕:ίίίίίϊΐ;二㊁ϊ:電薄膜除氣,存在極性 艮此類限制以及使微孔石夕石^失。為克 :,先前利用方法使内表“夕』合性及疏水 括(如)氯劑或封端劑。此類封端劑包 一種有機反i=「盘如石夕^醇基團的一種先前利用方法中,將 内,使之與:面;^、δΛ基二石夕氮燒(_)]弓1入薄膜之孔 基團將矽烷醇封端\:團反應’藉由形成三甲基甲矽烷 有意羲地且有較Τ;ΐϊ經甲矽烷化之基團比最初矽烷醇 甲基甲石夕烧基的一種缺點為對熱不太穩定^=理 第6頁 1270530 五、發明說明(3) IC期間可能脫氣,導致中毒。Page 5 1270530 V. Description of the invention (2) (eg) vermiculite and TE0S materials lend · ^^ ^ Shi Xishi's dielectric constant ability;: 5) can f: Shangxu: factory microporous deposition micropores film. A functional group associated with the microporous vermiculite film was treated with a similar tool as I know 500. Previously available micropores;; = = ; = the presence of polyalcohol (caffe), Shixi oxygen (Si0Si) m in 6 groups including Shi Xi burning species, such as but not limited to methyl, Yiyi H〇R) Where r is the organic appearance (the inverse is as defined above), especially =, alcohol or basestone, high-concentration human effect Xueqitu / ^ ~ structure related to the considerable (internal) surface dielectric often I: 兀% base The role of the group leads to a higher dielectric constant than the required dielectric constant. The adsorption of environmental water can even be added to the environment: ίίίί; 2nd ϊ: the degassing of the electric film, the presence of polar 艮 such restrictions and micropores Shi Xishi ^ Loss. For the gram:, the previous method of use to make the inner surface "night" symmetry and hydrophobic (such as) chlorine agent or blocking agent. Such end-capping agent package an organic anti-i = "disk such as Shi Xi In a previously utilized method of the alcohol group, the inner group is made to: 面, δ Λ 二 二 夕 氮 氮 _ _ 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 入 : : : : : : 'Because of the formation of trimethylformane, it is intentionally and relatively ambiguous; a disadvantage of the alkylation group of the oxime is that it is hotter than the original stanol methyl methacrylate. Too stable physical page ^ = 61270530 V. invention is described in (3) may be degassed, lead poisoning during IC.
微孔石夕石薄膜的另一種關鍵參數為機械強度。材料之機 械強度一般隨材料密度降低而成比例降低。對於用作IC裝 置中介電薄膜之微孔薄膜,機械強度及低介電常數之組合 最佳化亦很重要。對於已給定之介電常數(與折光指數和 密度成比例),其密度至少對明確化學組合物而言固定。 密度固定時,微孔矽石之強度係藉由薄膜骨架内之最大固 體分數最大化,而未由毫微米大小孔隙表面上之附加化學 基團。因而,在另一種缺陷中,反應劑(如HMDZ)將相當量 額外物質(三曱基甲矽烷基)引入至孔隙表面。三甲基甲石夕 烧基之不均衡質量不可用於促進機械強度,但確能增加薄 膜之密度,因此成為取得盡可能最低k值的一個障礙' 由於此等原因以及半導體和/或微處理器或IC製造 之迅速競爭性發展需要,在技術上不斷需要對方法- 進行改良。尤其需要提供具疏水性表面之石夕石薄膜及且^ 疏水性孔隙表面之微孔矽石薄膜,同時理 ^有 疏水薄膜之機械強度。就已給定所需介 處理 題的成功解決將提供更大的材料薄膜強度。 -,該問 本發明之方法出人意料之外地 藝上此等及其它問題,與先前利用修飾劑解決技 較,該表面修飾劑能夠給予經斤 、和用劑或反應劑比 同時亦增加經處理薄膜之钟 夕石”電薄膜疏水性, 啊職強度。 因此,本發明藉適用矽 薄膜,、表面修飾劑反應之步驟 1270530 五、發明說明(4) =新穎方法’於所需基材上形成石〜 該石夕石薄膜係存在於基材上,該反 ,薄膜或塗層。 間下進行,使表面修飾劑在矽石介;二2件及足夠時 反應之寡聚物或聚合物。本發明亦提供c上石夕貌醇 之組合物以及具有至少一種由本發明 夕石介電薄骐 膜之積體電路。本發明之方法 處理矽石介電薄 低所需介雷數佶夕7 W ' 思、’料之外地在不明顯降 低:而"電數值之可取得範圍下提供矽 L頁降 該矽石薄膜視需要用能夠封蓋,溥膜。 中矽烷醇之單體類铟矣而欲故、元化"電薄膜表面 ,_石==::::;;理;在進-步選擇中 物;;:物表面修飾劑和單體類型表面;括寡聚 膜但較佳為在處理 種來源預先製備、貯存及庐、次者了自另一 須,但欲以本發明新/應注意到’雖然不為必 或膠凝化。如果應用老Ιΐί理之石夕石薄膜可視需要老化 修飾處理之前或‘後進行二:可在本發明所述施加表面 老化。 飞後進仃,但較佳在表面修飾之前將薄膜 zrc可視需要以氣相或液相進行。另外,該方 面;飾;^ί劑:戈助溶劑存在下進行,應了解到,當表 $二岭2 =目進行時,該溶劑或助溶劑需有效溶解和/ 或d斤表面修飾劑,而不明顯溶解欲處理之薄膜。 可將任何適用物質用作溶劑或助溶劑,包括酮類及非酮Another key parameter of the microporous Shishi stone film is mechanical strength. The mechanical strength of a material generally decreases proportionally as the density of the material decreases. For microporous films used as dielectric films for IC devices, the combination of mechanical strength and low dielectric constant is also important. For a given dielectric constant (proportional to the refractive index and density), the density is at least fixed for the unambiguous chemical composition. When the density is fixed, the strength of the microporous vermiculite is maximized by the maximum solid fraction in the film skeleton, but not by the additional chemical groups on the surface of the nanometer-sized pores. Thus, in another drawback, the reactant (e.g., HMDZ) introduces a substantial amount of additional material (trimethylformamyl) to the surface of the pores. The unbalanced mass of trimethyl methacrylate is not used to promote mechanical strength, but it does increase the density of the film and is therefore an obstacle to achieving the lowest possible k value. For these reasons and for semiconductor and/or microprocessing The rapid competitive development of the manufacture of ICs or ICs requires technical improvements in methods. In particular, it is desirable to provide a microporous vermiculite film having a hydrophobic surface and a microporous vermiculite film having a hydrophobic pore surface, and at the same time having the mechanical strength of the hydrophobic film. A successful solution to the required treatment will provide greater material film strength. - the method of the present invention is surprisingly unexpected in this and other problems, and the surface modifying agent is capable of imparting a treated film at the same time as the agent or the reactant ratio. "Xi Xi Shi" electric film hydrophobicity, strength. Therefore, the present invention is applied to the ruthenium film, surface modifier reaction step 1270530 V, invention description (4) = novel method 'formed on the desired substrate ~ The Shishi stone film is present on the substrate, the reverse, the film or the coating. The surface modification agent is made in the vermiculite; two or two pieces and enough oligomers or polymers to react. The invention also provides a composition of c-small alcohol and an integrated circuit having at least one dielectric thin film of the present invention. The method of the present invention processes the dielectric thinness of the vermiculite and reduces the number of dielectric peaks. 'Thinking,' is not significantly reduced outside the material: and the "Electrical value of the available range" provides the 矽L page to reduce the meteorite film as needed to cover, enamel film. And want, Yuanhua " Membrane surface, _ stone ==::::;; rational; in the step-by-step selection of the medium;;: surface modifier and monomer type surface; including oligomeric film, but preferably prepared in advance in the treatment source, Storage and sputum, the second one from another, but want to use the invention new / should be noted 'although not necessarily or gelatinized. If the application of the old Ιΐ 理 石 夕 stone film can be seen before the aging modification treatment or ' After the second: the surface aging can be applied in the present invention. After the fly, the film zrc can be preferably carried out in the gas phase or the liquid phase before the surface modification. In addition, the aspect; the decoration; In the presence of a cosolvent, it should be understood that when the table is carried out, the solvent or cosolvent needs to be effectively dissolved and/or d kg of surface modifying agent without significantly dissolving the film to be treated. Applicable substances used as solvents or co-solvents, including ketones and non-ketones
ϋϋ 第8頁 1270530 五、發明說明(5) ,但此類溶劑或助溶劑較佳選自由_ 類,但此類溶劑或助 >谷劑較佳選自由醚、酯、酮、二醇鍵 、經氯化之溶劑、低黏度碎氧烧及其適用混合物組成之群 雖然 隹為具 飾方法 表面, 胰。該 自約1 0 該欲 圓片上 本發 製造之 為主之 3200 至 因此 方法比 或寡聚 之優勢 應劑特 劑如何 石薄m 。因而 欲處理之石夕石薄膜不必為孔性,但欲處理之薄膜較 高表面積孔隙結構之微孔介電薄膜,而且該表面修 較佳進行足夠時間,使表面修飾劑有效塗覆薄膜之 以製造具约3或更小介電常數之經處理微孔矽石薄 表面修飾反應較佳自約1 〇秒至約i小時進㈤ °C 至約 3 0 0 °C。 lx 處理薄膜係較佳於基材上,如,製造積體電路之晶 明亦提供 介電薄膜 介電薄膜 約3 7 0 0厘 ’與先前 較,本發 物為基礎 。使用以 別提供經 作用的任 精細結構 可以相信 介電薄膜以及包括至少一種由本發明方法 ,積體電路。經本發明方法製造之以矽石 之傅里葉(F〇Urier)變換紅外光譜下於約 只波長範圍未顯示明顯矽烷醇吸收。 輕佳具It眘始,1列詳诚 =的給予以介電薄膜及材料疏水性之 ^供表面修飾處理所用之以聚合物和/ =劑。該方法具有多種超過先前方法 物為基礎之反應劑相對於先前利用反 =機械強I。雖然不㉟受本發明反應 的县HE ? 制,但可以相信,微孔矽 ㈣表面上之聚合物塗層(特別為毫微Ϋϋ P.8 1270530 V. Inventive Note (5), but such a solvent or co-solvent is preferably selected from the group, but such a solvent or co-solvent is preferably selected from the group consisting of ethers, esters, ketones, and glycols. The group consisting of a chlorinated solvent, a low-viscosity oxy-combustion and a suitable mixture thereof, although it is a decorative method surface, pancreas. The self-contained 10 0 on the wafer is mainly produced by the hair of the 3200 to the method of the method or the oligomerization of the agent agent is how thin the stone m. Therefore, the stone film to be treated does not have to be porous, but the microporous dielectric film of the film having a higher surface area pore structure to be treated, and the surface is preferably subjected to a sufficient time for the surface modifier to effectively coat the film. The thin surface modification of the treated microporous vermiculite having a dielectric constant of about 3 or less is preferably from about 1 sec to about i hr (5) ° C to about 30,000 ° C. The lx treated film is preferably formed on a substrate. For example, the crystal of the integrated circuit is also provided with a dielectric thin film dielectric film of about 370 % as compared to the prior art, based on the present invention. It is believed that the dielectric film can be used as well as at least one integrated circuit comprising the method of the present invention. The F〇Urier converted infrared spectrum produced by the method of the present invention showed no significant stanol absorption in the approximate wavelength range under the infrared spectrum. The light fittings are carefully started, and the first column is given the polymer and/or agent for the surface modification treatment of the dielectric film and the hydrophobicity of the material. This method has a variety of reactants based on previous methods compared to the previous use of reverse = mechanical strength I. Although not 35 by the county of the invention, it is believed that the polymer coating on the surface of the microporous (four) (especially nano
第9頁 的$弱部分為薄膜顆粒和晶粒間之接觸點 1270530The weak part of page 9 is the contact point between the film particles and the grain. 1270530
米大小孔隙表面之塗層)消除吸濕問題,且由覆蓋和黏合 組成薄膜之精細顆粒或晶粒增強薄膜之機械性能。對薄膜 機械強度之積極作用無論出於何種原因,以下提供實例均 證實,本發明之方法及反應劑能實際提供經增強之薄膜強 度。 、 本發明之方法及反應劑係用於矽石介電薄膜。於基材上 製備微孔石夕石薄膜之數種方法為技藝上所熟悉。如以上 "發明背景π所概述。另外,對此等製備微孔薄膜一般已知 方法的變化及改良教示於,同為承認的美國專利申請案序 號第09/046, 475號及第09/046, 473號,二者均申請於U98 年3月25日;美國專利申請案序號第〇9/〇54,262號,申靖 於1 998年4月3日;和美國專利申請案序號第〇9/〇55,244°號 及弟09/055, 5 1 6號,二者申請於1 9 98年4月6日;及美國專 利申請案序號第〇9/379,484號,申請於1 999年8月23、日, 第09/392, 41 3號,申請於1 999年9月9日, 之方式併於本文。無㈣’技術人員IK; 二發明之方法及材料易於應用至多種技藝上已知 包括有機基礎介電材料),較佳應用於以矽石 h電材料’最佳應用於微孔介電矽石材 " 之強度及/或保護性疏水塗層。 才枓’以提供經增強 為較佳理解本發明之範圍,應懂得,在應 時’除非明確指明S i 〇2官能團,本文所用夕 盥八命β 叮用之矽石丨丨(例如 壤::薄膜有關)意指藉本發明方法自有 填材枓(即任何適用的以石夕為基礎之材料)製備之介電薄膜The coating of the meter-sized pore surface) eliminates the problem of moisture absorption and the mechanical properties of the fine particles or grain-enhancing film composed of the film covering and bonding. Positive Effects on Mechanical Strength of Films For whatever reason, the following examples demonstrate that the methods and reactants of the present invention can actually provide enhanced film strength. The method and reactant of the present invention are used in a vermiculite dielectric film. Several methods for preparing microporous Shishi stone films on substrates are well known in the art. As outlined above, "Invention Background π. In addition, variations and modifications of the generally known methods for preparing microporous films are also disclosed in U.S. Patent Application Serial Nos. 09/046,475 and No. 09/046,473, both of which are incorporated herein by reference. March 25, U98; U.S. Patent Application Serial No. 9/54,262, Shen Jing, April 3, 998; and U.S. Patent Application Serial No. 9/〇55,244° and brother 09/055 , 5 1 6 , both of which were filed on April 6, 1999; and US Patent Application Serial No. 9/379,484, filed on August 23, 999, dated 09/392, 41 3 No., applied for September 9, 1999, and the method is here. No (4) 'Technician IK; 2 methods and materials of the invention are easy to apply to a variety of techniques known to include organic basic dielectric materials), preferably applied to the use of vermiculite h electrical material 'optimized for microporous dielectric 矽 stone " Strength and / or protective hydrophobic coating. In order to provide a better understanding of the scope of the present invention, it should be understood that, unless the S i 〇2 functional group is clearly indicated, the scorpion 丨丨 叮 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨 丨丨(film-related) means a dielectric film prepared by the method of the present invention from its own filler material (ie, any suitable material based on Shixia).
第10頁 1270530 五、發明說明(7) 。另外應懂得,本文使用之單數術語不受此類限制,在適 當時,亦包括複數,即本發明之示範方法可描述為應用及 產生一種,1薄膜",但亦視需要用所述、示範及申請專利範 圍方法製造多重薄膜。 除非另作指明,本文所用其它術語”劑”可認為與"反應 劑"同義。除非另外明確,π積體電路”或"1C”意欲代表^ 何使用本發明方法及組合物之半導體產品。 再者,雖然本文所作說明一瓶Ί王彻逆爽理微孔介電材料 之方法’但技術人員將易於了解本文所提供方法及組合物 亦可應用於非孔性介電矽石薄膜。因而,應用於適用基材 (如下述適於製造積體電路之半導體晶圓片)之非孔性薄膜 亦得益於本發明提供之方法及材料。例如,製造積體電路 之絕緣體及類似物所用之親水性石夕石薄膜上 ,生以下問題,如過高介電常數、電流漏匕W ,。此等額外問題係由本發明之方法及組合物解決。 薄2 ί /而+&,本文所述π基材”包括在應用本發明微孔矽石 形成於彼組合物上之前形成之任何適用組合物 孔石夕石蓮^材一般為適於製造積體電路之矽晶圓,形成微 上,i勺乜所用之基底材料係由任何適用方法塗覆於基材 技藝:^ 於旋塗、化學氣相沈積績D及浸塗之 ,視需要:法。在用基底材料形成微孔矽石薄膜之前 面而要由標準技藝上已知之方法製備塗層所用之基材表Page 10 1270530 V. Description of invention (7). In addition, it should be understood that the singular terms used herein are not to be construed as being limited to the singular singular, and, as appropriate, the exemplified method of the invention may be described as the application and the production of a film " Exemplary and patented methods of making multiple films. Other term "agent" as used herein may be considered synonymous with "reactant" unless otherwise indicated. Unless otherwise stated, a π-integrated circuit or "1C" is intended to mean a semiconductor product using the methods and compositions of the present invention. Furthermore, although a method of resolving a microporous dielectric material is described herein, it will be readily apparent to those skilled in the art that the methods and compositions provided herein can also be applied to non-porous dielectric vermiculite films. Thus, non-porous films applied to a suitable substrate (such as the semiconductor wafer described below suitable for making integrated circuits) also benefit from the methods and materials provided by the present invention. For example, on the hydrophilic stone film used for the manufacture of insulators and the like of integrated circuits, the following problems occur, such as excessive dielectric constant and current leakage. These additional problems are addressed by the methods and compositions of the present invention. Thin 2 ί / and + & π substrate as described herein includes any suitable composition formed prior to the application of the microporous vermiculite of the present invention to the composition, which is generally suitable for manufacture. The base wafer of the integrated circuit is formed on the micro, and the substrate material used for the i scoop is applied to the substrate by any suitable method: ^ in spin coating, chemical vapor deposition D and dip coating, if necessary: Method of preparing a substrate for coating prior to forming a microporous vermiculite film from a substrate material by methods known in the art
第11頁 1270530 五、發明說明(8) 發明之基材非唯一性包括半導體材料,如砷化鎵 石夕、外 矽和含矽之組合物[如結晶矽、多晶矽、非晶 。其;取向生長)矽和二氧化矽(,,Si(V)]及其混合物 成之凸線圖形,::屬…刻平板印刷技術形 線用材料包括石h ^ 物、氮化物或氧氮化物線。 金、_、 虱化矽、氮化鈦、氮化钽、鋁、鋁合 路t^脚合金、鈕、鎢及氧氮化矽。此等線形成積體電 距離略料八2絕緣體。此類線一般彼此以約20微米或更小Page 11 1270530 V. INSTRUCTIONS (8) The non-uniqueness of the substrate of the invention includes semiconductor materials such as gallium arsenide, outer bismuth and bismuth-containing compositions [such as crystalline germanium, polycrystalline germanium, amorphous. Its orientation-oriented growth of yttrium and cerium oxide (,, Si(V)] and its mixture into a convex line pattern, :: genus...printing technology, the material for the shape line includes stone, nitride or oxygen Chemical line. Gold, _, bismuth telluride, titanium nitride, tantalum nitride, aluminum, aluminum alloy t^ foot alloy, button, tungsten and bismuth oxynitride. These lines form the integrated electrical distance slightly 8 2 Insulators. These wires are generally about 20 microns or less in each other.
佳。適用:鉍志較佳1微米或更小,自約〇·05至約1微米更 石夕石介電ig。φ之其它視需要特徵包括先前形成之微孔 材發明製程之起始材料亦包括由施加矽石前體於基 孔石夕石薄膜,如以玻璃上旋轉式組合物應用 釗二IΛα後視需要使薄膜老化。如果應用老化步驟, 、=由(如)氨和水蒸氣處理促進膠凝化。 蓮ί I、隹本發明之製程在老化後直接於尚為濕薄膜之微孔 ^進订。在另一個可替代具體實施例中,本發明之製 Γί:::尚老化成經乾燥之微孔薄膜以及在完成老 化裟耘後鉍一段時間貯存之微孔矽石薄膜上進行。 在本發明之方法中,雖然已知對技藝有數種替代性老化 方法,但較佳藉氫氧化銨處理老化該薄膜。如 為靜態老化該薄膜’在有限室中使支樓薄膜之基材2和 擴:入薄膜之時間及有效條件暴露於15Μ氫氧 及水秦氣中。good. Applicable: 铋志 is preferably 1 micron or less, from about 〇·05 to about 1 micron. Other optional features of φ include the previously formed microporous material. The starting material of the inventive process also includes the application of a vermiculite precursor to the base pore stone, such as a glass-on-rotary composition. The film is aged. If an aging step is applied, = by (for example) ammonia and steam treatment promote gelation. Lotus I I, 隹 The process of the present invention is directly applied to the micropores of the wet film after aging. In another alternative embodiment, the process of the present invention is aged as a dried microporous film and on a microporous vermiculite film that has been stored for a period of time after completion of aging. In the process of the present invention, although several alternative aging methods are known for the art, it is preferred to age the film by ammonium hydroxide treatment. If the film is statically aged, the substrate 2 of the branch film and the time and effective conditions for expanding into the film are exposed to 15 Torr of hydrogen and water in the finite chamber.
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12705301270530
物/券聚物良組合物 為使密度/介電常數參數^ ’本發明用能夠於矽石薄膜 面薄膜之一種或多種聚合物 表面修飾方法。因而,在此 包括一種或多種於組合物中 能约形成與矽石介電薄膜接 為自單體製備表面修飾劑 該單體前體與自身或反應混 合及父聯,從而形成表面修 (例如)包括募聚物(如100或 聚合物(如100或更多重複單 將該表面修飾劑隨處理需要 其上之相當比例的矽烷醇基 性塗層。該表面修飾劑可自 與石夕烧醇反應生成聚合物之 基矽烷、叁(二甲胺基)甲基 每所需足夠機械強度達到最佳 之含石夕烧醇表面上形成疏水表 /养聚物表面修飾組合物提供 等寬參數内,表面修飾組合物 製備之表面修飾劑,該組合物 觸之疏水性塗層。 ’如以單體前體製備,可促使 合物中存在的其它類型單體聚 飾劑。所形成表面修飾劑為 更少.重複單元之多聚物)和/或 元之多5^物)之混合物。然後 塗覆於矽石介電薄膜,在此將 團封端,反應生成所需之疏水 適用單體聚合製備,包括能夠 有機矽單體,如甲基三乙醯氧 石夕烷及叁(二乙胺基)曱基矽烷Material/Voice Polymer Composition For the purpose of making the density/dielectric constant parameter, the present invention uses a method of modifying one or more polymers of a vermiculite film. Thus, it is included herein that one or more of the composition is capable of forming a surface modifying agent from a monomer to form a surface modifying agent from the monomer, and the monomer precursor is mixed with itself or reacted to form a surface repair (eg, Include a polymer (such as 100 or a polymer (such as 100 or more repeats of the surface modifier required to handle a considerable proportion of the stanol-based coating on the surface. The surface modifier can be self-contained with Shi Xi Alcohol reaction to form a polymer of decane, decyl (dimethylamino) methyl group to achieve a sufficient mechanical strength to achieve the optimal surface composition of the hydrophobic surface/energetic surface to provide a uniform parameter A surface modifying agent prepared by a surface modifying composition which is in contact with a hydrophobic coating. 'When prepared as a monomer precursor, it can promote other types of monomeric coloring agents present in the composition. Surface modification A mixture of less than a repeating unit of a polymer) and/or a plurality of elements. Then, it is coated on a vermiculite dielectric film, where the group is blocked and reacted to form a desired hydrophobically suitable monomer for polymerization, including organic oxime monomers such as methyltriethoxysulfoxide and ruthenium (II). Ethylamino)decyl decane
人=表面修飾劑更典型自以矽為基礎之單體藉由水解/縮 二或^它類型聚合/反應製備,如以矽氧烷、矽氮烷、矽 2奴矽烷和類似物及其混合物製備。簡單作為實例且不 乍任何限制,此類反應如下進行。Human = surface modifiers are more typically prepared from hydrazine-based monomers by hydrolysis/reduction or type-polymerization/reaction, such as decane, decazane, decane, and the like, and mixtures thereof. preparation. Simple as an example and without any limitation, such a reaction proceeds as follows.
CH3Si(0C0CH3) + H20~>[-0-Si(CH3)(0C0CH3)-]n + CH3C00H 其中"代象聚合之進行(此時為水解/縮合),"n"為自CH3Si(0C0CH3) + H20~>[-0-Si(CH3)(0C0CH3)-]n + CH3C00H where "has the polymerization of the image (in this case, hydrolysis/condensation), "n"
1270530 五、發明說明(10) 2至約10, 〇〇〇或更大數值的一個整數。 反應混合物中水與單體之莫耳比易於根據特定產物气# 。在較佳具體實施例中,反應期間水與單體之比例自^節 〇·50:1·5至約1·5:0·5莫耳/莫耳。 約1270530 V. INSTRUCTIONS (10) An integer from 2 to about 10, 〇〇〇 or greater. The molar ratio of water to monomer in the reaction mixture is readily dependent on the specific product gas #. In a preferred embodiment, the ratio of water to monomer during the reaction is from 节·50:1·5 to about 1.7:0·5 mol/mole. approximately
雖然不願受本發明反應劑如何以該說明性方案為夷 行作用的假說理論限制,但可以相信,聚合物^⑶^1進 分為與多孔矽石表面上矽烷醇(Si—0H)反應之官能團二 管我們相信該表面修飾反應劑主要連接表面矽燒醇,但m 可設想在某些視需要選擇之具體實施例中,所得疏水^ = 内有相當量交聯在生成塗層期間發生。 Θ 因而,能夠與矽烷醇(Si-ΟΗ)反應的具多個官能團之血 型石夕氧烧聚合物/寡聚物具有以下通式: (-S i XR-〇— )n j 其中R可為Η、燒基或芳基’义係(如)選自一種或多種下 列部分:Η、乙酿氧基(_%)、稀氧基⑽2 = g(ch3)_〇_ Si)、肟U2C = N-〇s-Si)、烷氧基(R〇_Si)、胺(R2N_si)及/ ,石夕烧醇(S^OH),n為(例如)自2至約1〇〇〇〇或更大數值 範圍的一個整數。在進一步 tJh ^ ^ ^ 7選擇中,η為自約2至約1〇〇〇數 值对圍的-個整數。亦應懂得,在已 成寡聚物和/或聚合物種類之士 ⑺ ^ χ ^ 物禋頰之大小及其η值一般在一數值範 圍内分布。 $種μ θ般#種類適用表面修飾劑包括能夠與石夕烧醇(Si — 、^ 個官能團之矽氮烷聚合物/寡聚物,其通式 為:While not wishing to be bound by the hypothesis theory of how the reactants of the present invention act as a derogatory effect of this illustrative scheme, it is believed that the polymer ^(3)^1 fraction is reacted with stanol (Si-OH) on the surface of porous vermiculite. Functional Group II We believe that the surface modification reagent is primarily attached to the surface oxime alcohol, but m is envisaged that in certain embodiments as desired, the resulting hydrophobic ^ = has a considerable amount of cross-linking that occurs during the formation of the coating. . Θ Thus, a blood-type oxy-oxygenated polymer/oligomer having a plurality of functional groups capable of reacting with stanol (Si-germanium) has the following formula: (-S i XR-〇— )nj where R can be Η The alkyl or aryl 'sense (eg) is selected from one or more of the following: oxime, ethoxylated (_%), dilute oxy (10) 2 = g(ch3)_〇_Si), 肟U2C = N -〇s-Si), alkoxy (R〇_Si), amine (R2N_si) and /, shool (S^OH), n is (for example) from 2 to about 1 Torr or more An integer in the range of large values. In further tJh ^ ^ ^ 7 selection, η is an integer from about 2 to about 1 对. It should also be understood that the size of the cheeks and the η values of the worms and the polymer species (7) ^ χ ^ are generally distributed over a range of values. The type of surface structuring agent includes a sulfonium alkane polymer/oligomer capable of reacting with a sulphuric acid (Si-, ^ functional group), which has the formula:
1270530 五、發明說明(11)1270530 V. Description of invention (11)
(-S i XRi -NR2- ) η II 其中匕和匕獨立為Η、烷基和/或芳基,χ係(如)選自一種 二多種下列部分:乙醯氧基(〇c〇CH3)、烯氧基(叫―— ΓΡ Μ 3 —〇 — Sl )、肟(R2C = N —〇S —Si )、烷氧基(R0_Si )及胺 Si),n係如式!界定。 應^解,由於矽氮烷聚合物之骨架為31"^,該基團可 二形提供額外官能團和衍生及交聯。適用矽氮烷反應劑 ^括溶於甲苯之聚(1,2—二甲基矽氮烷),(1,2一二甲基矽 二,)〇-甲基矽氮烷)共聚物—甲基矽氮烷樹脂。此等 氮烷聚合物可由適合胺或nij3與所需矽烷反應劑反應合 另一類適用表面修飾劑包括能夠與矽烷醇(si—0H)反應 、具多個官能團之矽烷聚合物/寡聚物,其具以下通式: (-Si XR-)n i 11 f中R可為H、烷基或芳基,x係(如)選自一種或多種以 下部分:Η、乙醯氧基(〇c〇CH3)、烯氧基(ch2 = C(CH3)_0-))、肟(R2C = N-Os-Si)、烷氧基(R〇 —Si)、胺(R2N-Si),n 係如式I界定。亦應瞭解,由於矽烷聚合物之骨架為s i 一 S1 ’該基團可視情形提供額外官能團和衍生及交聯。可用 2此類應用之一般石夕烷反應劑包括(如)聚二曱基矽烷、聚 笨基甲基矽烷和類似物及其混合物。 另一類適用表面修飾包括能夠與矽烷醇(Si-0H)反應的 具多個官能團之碳矽烷聚合物/募聚物,其具通式:(-S i XRi -NR2- ) η II wherein 匕 and 匕 are independently Η, alkyl and/or aryl, and lanthanide (for example) is selected from one or more of the following: ethoxycarbonyl (〇c〇CH3) ), alkenyloxy (called "- ΓΡ Μ 3 - 〇 - Sl ), 肟 (R2C = N - 〇S - Si), alkoxy (R0_Si) and amine Si), n is like! Defined. It should be understood that since the skeleton of the indazane polymer is 31 ", the group can provide additional functional groups and derivatization and crosslinking. Suitable for hydrazine alkane reactants: poly(1,2-dimethylazane), (1,2-dimethyl oxime), fluorene-methyl decazane copolymer A quinone alkane resin. These azaxane polymers may be reacted with a suitable amine or nij3 in combination with a desired decane reactant. Another suitable surface modifying agent comprises a decane polymer/oligomer having a plurality of functional groups capable of reacting with stanol (si-OH). It has the general formula: (-Si XR-)ni 11 f wherein R can be H, alkyl or aryl, and x is, for example, selected from one or more of the following moieties: hydrazine, acetoxy (〇c〇) CH3), alkenyloxy group (ch2 = C(CH3)_0-)), ruthenium (R2C = N-Os-Si), alkoxy group (R〇-Si), amine (R2N-Si), n-form I defined. It will also be appreciated that since the backbone of the decane polymer is s i - S1 ' this group may optionally provide additional functional groups and derivatization and crosslinking. Useful general anthracycline reactants for such applications include, for example, polydidecyl decane, polyphenylmethyl decane, and the like, and mixtures thereof. Another type of suitable surface modification includes a carbon hydride polymer/polymer having a plurality of functional groups capable of reacting with a stanol (Si-0H) having the formula:
(-S i K R2 - R3 - ) η IV(-S i K R2 - R3 - ) η IV
第15頁 1270530 五、發明說明(12) 其中h和1?2可獨立為Η、烷基、芳基、乙醯氧基(〇c〇CH3) 、烯氧基(CH2 = C(CH3)-〇-Si)、Os-Si)、烧氧基 (R〇-Si)或胺(R2N-Si),R3可為經取代或無取代之亞烷基或 亞芳基。 亦可自商業上獲得具多個官能團及矽烷醇基團之適用矽 氧烷聚合物。例如,技術人員所熟悉的T-1 1矽氧烷反應劑 系列’該系列自哈尼威爾,高級微電子材料分公司獲得 (Advanced Microelectronic Materials division of Honeywell)(薩尼威爾,加利福尼亞)(Sunnyvale,Page 15 1270530 V. Description of the invention (12) wherein h and 1?2 are independently oxime, alkyl, aryl, ethoxylated (〇c〇CH3), alkenyloxy (CH2 = C(CH3)- 〇-Si), Os-Si), alkoxy groups (R〇-Si) or amines (R2N-Si), and R3 may be substituted or unsubstituted alkylene or arylene. Commercially available oxane polymers having a plurality of functional groups and stanol groups are also commercially available. For example, the T-1 1 decane reactant series familiar to the skilled person is available from Advanced Microelectronic Materials division of Honeywell (Sunyvale, California). ,
Cal if or ni a)。多種適用矽烷及矽氮烷聚合物亦可自(如) 聯合化學技術公司獲得(United Chemical Technology) [賓夕法尼亞,布里斯托(Bristol,PA)]。 由式I、I I、11 I和/或I V之聚合物和/或共聚物混合代表 之一種或多種上述反應劑混合物亦可用於本發明之方法及 組合物。 該表面修飾劑較佳為玻璃上旋轉類型矽石反應劑[如, 曱基三乙醯氧基矽烷("MTAS”)]之水解/縮合產^。心“之 水解/縮合產物具伴有乙醯氧基多官能團之矽氧烷骨架結 構,該骨架結構係在適宜條件下經由混合適用溶液與 預定比例水生成。 ^ 莖石介電薄墨與表面修劑反應之方法 雖然矽石薄膜與表面修飾劑反應之示範方法係於液相中 進行,但技術人員應瞭解,表面修飾劑可於液相(不具或 具有選用之助溶劑)或氣相(不具或具有選用之助溶劑')與Cal if or ni a). A wide variety of suitable decane and decane polymers are also available from, for example, United Chemical Technology [Bristol, PA]. One or more of the above reactant mixtures represented by a mixture of polymers and/or copolymers of formula I, I I, 11 I and/or IV may also be used in the methods and compositions of the present invention. The surface modifying agent is preferably a hydrolysis/condensation product of a rotating type vermiculite reactant [eg, mercaptotriethoxymethoxydecane ("MTAS") on glass. The "hydrolysis/condensation product of the heart" is accompanied by An ethoxylated polyfunctional oxetane skeleton structure which is formed under suitable conditions via mixing of a suitable solution with a predetermined ratio of water. ^ Method for reacting thin stone dielectric ink with surface repair agent Although the exemplary method for reacting vermiculite film with surface modifier is carried out in liquid phase, the skilled person should understand that the surface modifier can be in the liquid phase (not available or optional) Cosolvent) or gas phase (without or with optional cosolvent')
1270530 --—·—--- 五、發明說明(13) 欲處理薄膜接觸,如於1 998年 號所述,其内容:部月以號第 但其條件限制該反應用有考^方式併於本文, 理想範圍之介電常數和機械強表面修飾劑提供具 基材上產生適用之積體=強度之經處理介電薄膜,以於 在本發明的一個且薇杂A 相物料中,該氣相物石薄膜係暴露於氣 表面修飾劑之單體,且聚合物/寡聚物 有效條件將薄膜表面 二虱此口,以某一用量及 應瞭解,產生聚合物/之石夕炫二部分封端。 體應顯示有滿意沸點/墓氣J物娜 ;:,r,,, τ ^ 疏水表面。理想於氣 秀效及熱穩疋之 進行表面修飾處理之溫成表面修飾劑之單體應在 作為實例且不作任何二耗圍内具有適合之蒸氣壓。簡單 約5。〇托。適用表面:限:,適用單體之蒸氣-應自約!至 (t〇rr)範圍内。單體^飾之蒸氣壓較佳自約5至約100托 表面修飾劑所用單體壓自約5至約100托更佳。形成 作為本文之4體;f:壓自約10至約5。托最佳。 混合。適用助溶劑為::f係於液相與適用溶劑/助溶劑 任何其它選用材料Y 心劑,其中可溶解表面修飾劑及 處理表面上之矽烷醇溶解欲處理之介電材料或干擾經 易於藉蒸氣和/或加敎力而,且能夠在完成表面修飾反應後 此類助溶劑包括醚、…示。作為實例且不作任何限制, 8曰、酮、二醇醚、經氯化之溶劑、低 第17頁 1270530 五、發明說明(14) 黏度矽氧烷、及此等溶劑種類成分之適合混合物。技術人 員應瞭解,對於矽氧烷應用之π低黏度π為技藝上所熟悉, 較佳自約1至約1 0 0厘斯(c e n t i s t 〇 k e s ),較佳具有自約1 6 0 至約3 8 0 0道爾頓(D a 1 t ο n s )範圍之分子量。本發明方法所 用之典型低黏度矽氧烷商業上(如)自道·科寧(Dow C 〇 r n i n g )公司獲得。1270530 ---·---- V. Description of invention (13) To deal with film contact, as described in the year of 1998, its content: the Ministry of the Ministry of the number is limited, but its conditions are limited by the method and As used herein, a desirable range of dielectric constants and mechanically strong surface modifying agents provide a treated dielectric film having a suitable integrator=strength on a substrate for use in a material of the present invention. The gas phase stone film is exposed to the monomer of the gas surface modifier, and the polymer/oligomer effective condition is to lick the surface of the film to a certain amount, and it should be understood that the polymer/Shi Xi Xuan Partially terminated. The body should show a satisfactory boiling point / tomb gas J. Na; :, r,,, τ ^ hydrophobic surface. The monomer of the warm surface modifier which is ideal for gas-enhanced and heat-stable surface modification should have a suitable vapor pressure as an example and without any two-consumption. Simple about 5. 〇托. Applicable surface: Limit: Suitable for the vapor of the monomer - should be from about ! to (t〇rr). The vapor pressure of the monomer is preferably from about 5 to about 100 Torr. The monomer used for the surface modifier is preferably from about 5 to about 100 Torr. Formed as the body of the present invention; f: pressed from about 10 to about 5. The best. mixing. The applicable co-solvent is: f is in the liquid phase and the applicable solvent/cosolvent. Any other selected material Y core agent, in which the surface modifying agent can be dissolved and the stanol dissolved on the surface is treated to dissolve the dielectric material or the interference is easy to borrow. Vapor and/or hydration, and such co-solvents include ethers, after completion of the surface modification reaction. As an example and without any limitation, 8 hydrazine, ketone, glycol ether, chlorinated solvent, low on page 17, 1270530, invention, (14) viscosity oxirane, and suitable mixtures of such solvent species. The skilled person will appreciate that the π low viscosity π for oxane applications is well known in the art, preferably from about 1 to about 10 centistokes, preferably from about 160 to about 3. Molecular weight in the range of 80 Daltons (D a 1 t ο ns ). Typical low viscosity alkane used in the process of the invention is commercially available, for example, from Dow C 〇 r n i n g.
以總溶液重量計,適用溶劑/助溶劑一般以自約0 . 5至約 9 9重量%或更高範圍濃度使用。本發明方法所用典型醚包 括乙醚、異丙醚、丁醚及其混合物。本發明方法所用典型 酯包括乙酸乙酯、乙酸異丙酯、乙酸正丁酯及其混合物。 本發明方法所用典型烴包括正己烷、正庚烷、環己烷、甲 苯及其混合物。本發明方法所用典型酮包括丙酮、3 -戊酮 、曱基- 丁基酮及其混合物。本發明方法所用典型二醇 醚包括三(乙二醇)二曱基醚、四(乙二醇)二曱基醚、三 (丙二醇)二曱基醚其混合物。本發明方法所用典型氯化溶 劑包括1,2 -二氯乙烧、四氯化碳、氯仿及其混合物。如以 下實例所示,3 -戊酿I為較佳助溶劑,以總溶液重量計,3 -戊酮係以自約0 . 5至約9 9或更大之重量百分數使用,自約 5 0至8 0重量%更佳。 在本發明的一個典型具體實施例中,該單體係與含水之 溶劑或助溶劑混合,該表面修飾劑為在水存在下形成之水 解/縮合產物。助溶劑之水含量自約0 . 0 5 %或更大。溶劑或 助溶劑之水含量較佳自約0 . 0 5 %至約1 0 %或更高。溶劑或助 溶劑之水含量自約0 . 5 %至約4 %更佳。Suitable solvent/cosolvents are generally employed at a concentration ranging from about 0.5 to about 99% by weight or more, based on the total solution weight. Typical ethers used in the process of the invention include diethyl ether, diisopropyl ether, dibutyl ether, and mixtures thereof. Typical esters used in the process of the invention include ethyl acetate, isopropyl acetate, n-butyl acetate, and mixtures thereof. Typical hydrocarbons used in the process of the invention include n-hexane, n-heptane, cyclohexane, toluene, and mixtures thereof. Typical ketones used in the process of the invention include acetone, 3-pentanone, decyl-butyl ketone, and mixtures thereof. Typical glycol ethers useful in the process of the invention include tris(ethylene glycol) dimethyl ether, tetra(ethylene glycol) dimethyl ether, and tris(propylene glycol) dimethyl ether. Typical chlorinated solvents for use in the process of the invention include 1,2-dichloroethene, carbon tetrachloride, chloroform and mixtures thereof. As shown in the following examples, 3-pentane I is a preferred cosolvent, and the 3-pentanone is used in a weight percentage of from about 0.5 to about 9 9 or more, based on the total solution weight, from about 5 0 More preferably 80% by weight. In a typical embodiment of the invention, the single system is mixed with an aqueous solvent or co-solvent which is a hydrolyzed/condensed product formed in the presence of water. The water content of the co-solvent is from about 0.05% or more. The water content of the solvent or co-solvent is preferably from about 0.05% to about 10% or more. The water content of the solvent or cosolvent is preferably from about 0.5% to about 4%.
O:\62\62459.ptd 第18頁 1270530O:\62\62459.ptd Page 18 1270530
五、發明說明(15) 溶液與不同預定比例助溶劑溶液混合,且 人彦:方法塗覆至基材上之介電薄膜’如將含水解/縮 二=之溶液或懸洋液旋轉至各種試驗薄膜上 3水助溶劑以自約5至約9〇或更大百分數濃 =^ :)二合。單體於助溶劑中之濃度較佳自約5又至約5。%。單谷 體於助溶劑中之濃度自約1Q至糊%更佳 = 例自約〇.5G:1至約1:G.5G莫耳/莫耳。單體與水 :S7A5:/l至約1:〇.75更佳。在以下實例中,該單體係以 MTAS為例。 隨後,將基材和經處理薄膜加熱至足夠溫度及時 去除剩留之表面修飾劑及溶劑。在一個較佳具體實施 ,隨後將薄膜固化。可視情形以多個階段進行加熱步 各階段利用相似或不同時間及溫度,或合併為單一處理步 驟。例如,在空氣中分別於175或32〇。〇進行加熱處理。$ 後將經處理薄膜固化,如於4〇〇 °c固化。 與其它方涂一尽反應劑二單體麵一型表面修飭劊夕知仓 如發明背景中所述,封蓋介電薄膜孔隙表面上二烷醇某 團的一種先前利用方法使用引入薄膜孔隙之有機反庫劑^ 體[如六甲基二矽氮烷(HMDZ)],使之與表面矽烷醇基團反 應。該反應由形成疏水性三甲基甲矽烷基團將矽烷醇封端 。如上所述,使用三甲基甲矽烷基團的一個缺點為對埶不 太穩定,在進一步處理1C期間可能排氣,並導致中毒;; 然而,本發明的一個選用具體實施例將此其它方法與本 發明之方法及組合物組合,如,用本發明方法及組合物產V. INSTRUCTIONS (15) The solution is mixed with different predetermined proportions of the cosolvent solution, and the method of applying the method to the dielectric film on the substrate is as follows: rotating the solution containing the hydrolysis/condensation solution or the suspension liquid to various The 3 water co-solvent on the test film was dichotomized from about 5 to about 9 Torr or greater percent by weight. The concentration of the monomer in the co-solvent is preferably from about 5 to about 5. %. The concentration of the monolayer in the co-solvent is preferably from about 1Q to the paste% = from about 55. 5G:1 to about 1: G.5G mole/mole. Monomer and water: S7A5: / l to about 1: 〇. 75 is better. In the following examples, the single system is exemplified by MTAS. Subsequently, the substrate and treated film are heated to a sufficient temperature to remove the remaining surface modifying agent and solvent in time. In a preferred embodiment, the film is subsequently cured. Heating steps in multiple stages as appropriate Each stage utilizes similar or different times and temperatures, or combined into a single processing step. For example, in air, at 175 or 32 分别, respectively. 〇 Heat treatment. The treated film is cured after $, such as curing at 4 ° C. Surface treatment with other parties, one monomer surface, one surface modification, as described in the background of the invention, a previously utilized method of capping a certain group of dialkyl alcohol on the pore surface of a dielectric film using introduced film pores An organic anti-depot compound [such as hexamethyldioxane (HMDZ)] is allowed to react with a surface stanol group. The reaction is terminated by the formation of a hydrophobic trimethylformamidine alkyl group. As noted above, one disadvantage of using a trimethylmethanyl group is that it is less stable to hydrazine, may vent during further processing of 1C, and cause poisoning; however, an alternative embodiment of the present invention uses this alternative method. In combination with the methods and compositions of the present invention, for example, using the methods and compositions of the present invention
第 19 ![19th![
修正 1270530 案號 89Π1054 五、發明說明(16) 生疏水表面之單體將矽烷醇基團封端。組合處理有益提供 内部矽烷醇之額外封端,如將位於微孔薄膜孔隙結構内部 之薄膜表面上之石夕院醇封端,可相信這將進一步減小薄膜 之介電常數。另外,本發明之寡聚物或共聚物表面修飾劑 能夠封閉薄膜表面,增加機械強度和改良疏水性,且在處 理期間抑制氣體脫出。 組合方法可按次序進行,即首先使薄膜與單體類型表面 修飾劑反應,隨後與本發明之寡聚物或共聚物表面修飾劑 反應。該反應較佳同時進行,即(1)形成寡聚物或聚合物 表面修飾劑之溶液,隨後(2 )加入額外量所選擇之單體劑 至該溶液。隨後,將混合溶液塗覆於欲以前述方法處理之 介電薄膜上。 頃描述數種製造疏水,低介電微孔矽石薄膜之單體類型 表面修飾劑及方法,例如同為許可的美國申請案序號第 60/098, 068 號及 09/140, 855 號,二者申請於 1998 年8 月 27 日;第09/234, 609號及09/235, 186號,二者申請於1999年 1月21 ,其揭示内容全部以參考之方式併於本文。 較佳單體類型表面修飾劑為具選自式V ( 1 )至(6 )及其混 合組成之群之化合物: (1 ) R3SiNHSiR3,(2) RxSiCly,(3) RxSi (OH)y, (4) R3 S1OS1R3 ,(5) RxSi (〇R)y 及/ 或(6) RxSi (OC〇CH3)y , 其中x為自1至3之整數,y為自1至3且使y = 4 - x之整數,各R 係獨立選自氫及疏水有機部分。R基團較佳獨立選自由烷 基、芳基及其混合物組成之有機部分之Amendment 1270530 Case No. 89Π1054 V. INSTRUCTIONS (16) The monomer of the hydrophobic surface caps the stanol group. The combination treatment advantageously provides additional capping of the internal stanol, such as the capping of the ceramsite on the surface of the film inside the pore structure of the microporous film, which is believed to further reduce the dielectric constant of the film. Further, the oligomer or copolymer surface modifier of the present invention is capable of blocking the surface of the film, increasing mechanical strength and improving hydrophobicity, and suppressing gas evolution during the treatment. The combination process can be carried out in order, i.e., the film is first reacted with a monomer type surface modifying agent and subsequently reacted with the oligomer or copolymer surface modifying agent of the present invention. Preferably, the reaction is carried out simultaneously, i.e., (1) forming a solution of the oligomer or polymer surface modifier, and then (2) adding an additional amount of the selected monomer to the solution. Subsequently, the mixed solution is applied onto the dielectric film to be treated by the aforementioned method. A number of monomer type surface modifiers and methods for making hydrophobic, low dielectric microporous vermiculite films are described, for example, in the U.S. Serial Nos. 60/098,068 and 09/140,855, both of which are incorporated herein by reference. Applicants apply on August 27, 1998; Nos. 09/234, 609 and 09/235, No. 186, both of which are incorporated herein by reference. Preferred monomer type surface modifiers are compounds having a group selected from the group consisting of Formulas V(1) to (6) and mixtures thereof: (1) R3SiNHSiR3, (2) RxSiCly, (3) RxSi (OH)y, ( 4) R3 S1OS1R3, (5) RxSi (〇R)y and / or (6) RxSi (OC〇CH3)y, where x is an integer from 1 to 3, y is from 1 to 3 and y = 4 - An integer of x, each R is independently selected from the group consisting of hydrogen and a hydrophobic organic moiety. Preferably, the R group is independently selected from the group consisting of an alkyl group, an aryl group, and a mixture thereof.
O:\62\62459-930730.ptc 第20頁 1270530 五、發明說明(17) 群,其中該烷基部分係經取代或未經取代,且、琴 烷基、分支烷基、環烷基及其混合物組成之群^复2鏈 基部分自c〗至約c18大小範圍内。該芳基部分係經取、= 經取代’其大小自c5至約C18範圍變化。單體類型 二 劑較佳為,乙醯氧基矽烷、如乙醯氧基三甲某 二飾 酿氧基二甲基矽烷、甲基三乙酿氧基石夕烷、J基2 基矽烷、二苯基二乙醯氧基矽烷;和/或 土 乳 三甲基乙氧基石夕炫、三甲基甲氧基石夕烧小三甲夕如 基-2-戊燦-4-酮、正-(三甲基甲矽烷基)乙醯土 ^ 種或多種下列物質:2-(三甲基甲矽烷基)乙酸、’正及或— 基甲矽院基)味唑、三甲基甲矽烷基丙炔酸醋 (二甲 矽烧基(二曱基石夕氧基)-乙酸醋、九甲基三 : 基二石夕氛院、六甲基二石夕氧燒、三甲基石夕燒醇:二 烧醇、三苯基石夕燒醇、第三__丁基二甲—乙基石夕 烷二醇及其混合物。 叶一本基矽 ,將單體類型表面修飾與適合溶劑(如丙酮)混 氣或液,形式應用於微孔氧化石夕表面,然後乾燥I 乂療 其匕早體類型表面修飾劑包括多官能表面修飾劑 ϊίΠΠί序列號第。9/235,186號,其全部内容以 液體形式應用,且視情形具有或不具有助溶劑了 劑包括,,,如丙嗣、3_戊_、二異 谷 如1 998年7月„7日中請的美國專利中請案序列號Γ物質’ 09/111,G84#u,其揭示内容全部以參考之方式併於本文。O:\62\62459-930730.ptc Page 20 1270530 V. INSTRUCTIONS (17) Groups wherein the alkyl moiety is substituted or unsubstituted, and alkoxy, branched alkyl, cycloalkyl and The group consisting of the mixture is composed of a portion from 2 c to about c18. The aryl moiety is taken from, = substituted, and its size varies from c5 to about C18. The monomer type two agent is preferably ethoxylated decane, such as ethoxylated succinyl succinyl oxy dimethyl decane, methyl triethyl ethoxy oxane, J yl 2 decane, diphenyl Ethyl ethoxy decane; and/or trimethyl ethoxy sulphate, trimethyl methoxy sulphur, sulphur, sylvestre, ketone, ketone, ketone, ketone矽 ) ) ) ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Vinegar (dimethyl dimethyl ketone (dimethyl fluorenyloxy)-acetic acid vinegar, hexamethyl sulphate: ke sigma kimono, hexamethyl bismuth oxide, trimethyl sulphate: dicohol, Triphenyl zephyrol, third __butyl dimethyl-ethyl oxalate diol and mixtures thereof. The leaf-based oxime, the surface modification of the monomer type is mixed with a suitable solvent (such as acetone) or a liquid, The form is applied to the surface of the microporous oxidized stone, and then dried. The surface modification agent of the 匕 early type includes polyfunctional surface modifier ϊίΠΠί SEQ ID NO: 9/235, 186, all of which It can be applied in liquid form, and if necessary, with or without a solvent-assisting agent, such as, for example, propionate, 3_penta, and diiso-valley, as described in the US Patent of July 7 The serial number Γ substance ' 09/111, G84 #u, the disclosure of which is incorporated herein by reference.
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IH 1270530 五、發明說明(18) 例如,如以參考方式併於本文之美國專利序列號第 09/235, 186號所述,某些較佳表面修飾劑具有兩個或多個 g月b團,在與表面矽烷醇官能團反應的同時將薄膜結構框 架外存在之物質減至最小,其包括如下式之矽烷醇:IH 1270530 V. INSTRUCTIONS (18) For example, certain preferred surface modifying agents have two or more g-b groups as described in U.S. Patent Serial No. 09/235,186, the disclosure of which is incorporated herein by reference. Minimizing the presence of materials outside the framework of the film structure while reacting with surface stanol functional groups, including stanols of the formula:
Ri S i (〇R2 )3 VI 其:r,r2為獨立選擇之部分,如…或有機部分(如烷 基、方基或此等之衍生物)。當、或1為烷基時,該烷基部 分係視情形取代或非取代,I可為直鏈、分枝或環系,其 大小較佳自Ci至約Cls或更高範圍變化,自q至約Q更佳。 田h 為芳基時,該芳基部分較佳由視需要取代或非取 代之單個芳環組成,其大小自Cs至約〜或更高範圍變化, 自C:5至、、々(:8更佳。在進一步選擇中,該芳基部分非為雜芳 基。 因而,心或1係獨立選自H、甲基、乙基、丙基、苯基和 /或其何生物,但其條件限制h或匕之至少一個為有機性。 在一個具體實施例中,&和1均為甲基,式VI之多官能表 面修飾劑為曱基三甲氧基矽烷。 在另一個具體實施例中,本發明之適用矽烷具有以下通 式:Ri S i (〇R2 )3 VI It is: r, r2 is an independently selected moiety such as ... or an organic moiety (such as an alkyl group, a square group or a derivative thereof). When or 1 is an alkyl group, the alkyl moiety is optionally substituted or unsubstituted, and I may be a straight chain, a branched or a ring system, and its size preferably varies from Ci to about Cls or higher, from q. It is better to about Q. When the field h is an aryl group, the aryl moiety is preferably composed of a single aromatic ring which is optionally substituted or unsubstituted, and has a size ranging from Cs to about ~ or higher, from C: 5 to , 々 (: 8) More preferably, in further selection, the aryl moiety is not a heteroaryl group. Thus, the heart or the 1 line is independently selected from the group consisting of H, methyl, ethyl, propyl, phenyl, and/or its organism, but the conditions thereof Limiting at least one of h or hydrazine is organic. In one particular embodiment, & and 1 are both methyl, and the multifunctional surface modifying agent of formula VI is decyltrimethoxydecane. In another embodiment The applicable decane of the present invention has the following formula:
RiSi (NR2R3)3 VII 其中Rl、/2和心獨立為Η、烷基和/或芳基。當、r,r3 之任二種為烷基和/或芳基時,其界定如以上式VI對心和心 之界疋。在式VI1之較佳具體實施例中,R!係選自Η、CH3和 CeH5,&和A均為甲基。因而,該式π之三官能單體類型表RiSi(NR2R3)3 VII wherein R1, /2 and the card are independently oxime, alkyl and/or aryl. When either of r, r3 is an alkyl group and/or an aryl group, it defines a boundary between the heart and the heart as in the above formula VI. In a preferred embodiment of formula VI1, R! is selected from the group consisting of ruthenium, CH3, and CeH5, and both & A are methyl. Thus, the formula of the trifunctional monomer type of the formula π
第22頁Page 22
IM 1270530 五、發明說明(19) 面修飾劑包括(如)叁(二甲胺基)曱基矽烷、叁(二 笨基矽烷及/或叁(二甲胺基)矽烷。 —甲胺基) 在另一個具體實施例中,本發明之適用矽烷IM 1270530 V. INSTRUCTIONS (19) Surface modifiers include, for example, hydrazine (dimethylamino) decyl decane, hydrazine (diphenyl decane and/or decyl (dimethylamino) decane. - methylamino) In another embodiment, the present invention is applicable to decane
R1Si(〇N = CR2R3)3 VIII 其中R〗和R3獨立為Η、烷基和/或芳基。當R 之任一種為烷基和/或芳基時,其如以上對式jR3 界J。在一個較佳具體實施例中’Μ均 :2之 HCH因,’該式νπ之三官能單體類型表面“為 (如)甲基叁(甲基乙基酮肟)矽烷。 T W已括 在另一個具體實施例中,本發明之適用矽烷且 R^iCla Ιχ ^ · Π”、烷基或芳基。當心為烧基或芳基時 包括…甲基三氣石夕烧。 …體類型表面修都劑 在一個更佳具體實施例中,該封端劑包括— 以下通式之有機乙醯氧基矽烷, 裡或多種具R1Si(〇N = CR2R3)3 VIII wherein R and R3 are independently oxime, alkyl and/or aryl. When any of R is an alkyl group and/or an aryl group, it is as defined above for the formula jR3. In a preferred embodiment, 'ΜH: 2HCH, 'the surface of the trifunctional monomer type of the formula νπ is (eg, methyl ketone (methyl ethyl ketone oxime) decane. TW is included in In another embodiment, the invention is applicable to decane and R^iCla Ιχ ^ · Π", alkyl or aryl. When the heart is a burnt or aryl group, include... methyl three gas stone. Body Type Surface Conditioning Agent In a more preferred embodiment, the blocking agent comprises - an organic ethoxylated decane of the formula:
(R1)xSi(0C0R2)y X X較佳為數值自1至2範圍之整數,可相 為數值自約2至約3或更大之整數。 S不同,y 所用包括多官能烷基乙醯氧基矽烷和/或 石夕烧化合物之有機乙酿氧基石夕燒作為實例而/酿氣基 (_AS)、苯基三乙醯氧基石夕烧和—/笨土基一二氧基石夕燒 及其混合物。 氧基矽烷(R1)xSi(0C0R2)y X X is preferably an integer having a value ranging from 1 to 2, and may be an integer ranging from about 2 to about 3 or more. S is different, y is used as an example of a polyfunctional alkyl ethoxy decane and/or a smelting compound of the organic ethoxylates as an example / a gas base (_AS), phenyl triethoxy oxime And - / stupid base - a dioxygen stone and its mixture. Oxydecane
12705301270530
五、發明說明(20) 製造微孔介電簿膜之 或= 材上形成之微孔石夕石薄膜-般以約2°% -:大孔^、度形纟’孔徑大小自約i毫微米至約i 〇〇 ’自約2宅微米至約3〇毫微米更佳’最佳自約3毫微米至: ° Γ" ?L ^:) ^ ^ ^ ^ ^0-1 ;V. INSTRUCTIONS (20) The microporous dielectric film formed on the microporous dielectric film is formed as follows: about 2%% -: large pores, and the shape of the pores is about 1 millimeter. Micron to about i 〇〇 'from about 2 house micron to about 3 〇 nanometer better 'best from about 3 nm to: ° Γ" ?L ^:) ^ ^ ^ ^ ^ 0-1 ;
St 克 3之因晶而穩^^發^丨法製造之微切石薄膜較佳具小於約 3?辱穩:介電常數。本發明之微孔介電薄膜具自約 jUh電常數更佳,自約13至約2 最 自約1 · 7至約2。 隹王文住被佳 座孔性石夕石薄膜 ,瞭解,在本發m步有益結果中,可 : : t應用於微電子和/或積體電路產品中之非 .^ "電材料(該非孔性介電材料可理相用於不兩搞 低介電常數及/或孔隙痄夕妒人)竹 '理心用於不需極 和類似之作用藉—、又^ ,使此類材料對環境濕度 包括(例如)由;;技非孔性石夕石為基礎之介電材料 ("_")、、浸^或嗔塗1==,膜[如化學氣相沈積 封端之類似材料。、何其匕具有期望使表面矽烷醇 薄方法形成。然而,所產生之 而,應用本發明之方=吸收環境水分之游離石夕垸醇。因 對於非孔性石夕石介電s盈將此等游離石夕炫醇封端,甚至The micro-cut stone film produced by St. gram 3 is preferably less than about 3. Insult: dielectric constant. The microporous dielectric film of the present invention has a higher electrical constant from about jUh, from about 13 to about 2 and most from about 1.7 to about 2. Yan Wangwen lived in the film of the stone-shaped stone stone of the seat, understand that in the beneficial results of the m step, can: : t applied to microelectronics and / or integrated circuit products in the non-^ ^ "electric materials (the non-porous interface The electrical material can be used to phase out the low dielectric constant and/or the pores of the bamboo. The bamboo heart is used for the non-polar and similar functions to borrow, and to make such materials include environmental humidity. (for example) by:; non-porous Shishishi-based dielectric material ("_"), dip or 嗔 coating 1 ==, film [such as chemical vapor deposition end capping similar materials. , He Qichen has the desire to form a thin method of surface stanol. However, what is produced, the side to which the present invention is applied = free sulphate which absorbs environmental moisture. Because of the non-porous Shi Xishi dielectric s surplus, this free Shishi Hyun alcohol is capped, even
第24頁 1270530Page 24 1270530
以下非限制實例對本發明作出進一步解釋和說明 」ί 5% MMTAS衍生之矽氧烷聚合物之溶液處 ,裏備"電薄膜,且該經町…衍生之矽氧烷聚合物每重複 早7G含平均1 · 5個反應性官能團。The following non-limiting examples further explain and explain the present invention. ί 5% MMTAS-derived a solution of a siloxane polymer, which is provided with an electric film, and the methoxide-derived siloxane polymer is 7G per repetition. Contains an average of 1.5 reactive functional groups.
皇備表面用之水解化MTAS 將甲基三乙醯氧基矽烷[”MTAS,,;購自賓夕法尼亞,布 里斯托,聯合化學技術公司(United ChemicalHydrolyzed MTAS for the surface of the huangbei will be methyltriethoxy decane ["MTAS,;; purchased from United Chemicals, Pennsylvania, United Chemical Technology Corporation (United Chemical)
c、hnol〇gies,Brist〇1,pA)]在使用前由真空蒸餾提純 。並應用具低含水量(< 250 PPM)23—戊酮[帕斯非克,帕 克公司(Pacific Pac)]。將116克3—戊酮加入内含178克 水之5 0 0毫升燒瓶中,放入磁性攪拌棒。然後在適當攪拌 下將29克MTAS加入至上述3-戊酮/水混合物,繼續於室溫 攪拌過夜,生成一種澄清、無色溶液。用氣相色譜-質譜 法分析該產物,發現在該產物中沒有耵“存在遂象,意味 MTAS已全部反應。隨後使該溶液通過〇· 2微米特氟隆 (Tef Ion(商標))濾器過濾,以供下述表面處理使用。 製備微孔薄膜c, hnol〇gies, Brist〇1, pA)] was purified by vacuum distillation before use. A low water content (< 250 PPM) 23-pentanone [Pasfac, Pacific Pac] was applied. 116 g of 3-pentanone was placed in a 500 ml flask containing 178 g of water and placed in a magnetic stir bar. Then 29 grams of MTAS was added to the above 3-pentanone/water mixture with appropriate stirring and stirring was continued at room temperature overnight to yield a clear, colorless solution. The product was analyzed by gas chromatography-mass spectrometry and found to have no hydrazine in the product, meaning that the MTAS had all reacted. The solution was then filtered through a 微米·2 μm Teflon (trademark) filter. For use in the following surface treatments. Preparation of microporous film
在一個圓底燒瓶中加入208毫升四乙氧基矽烷、94毫升 三乙二醇單曱醚(TIEGMME)、16·8毫升去離子水及0.68毫 升1 Ν硝酸,以合成微孔矽石前體。在劇烈攪拌下將該溶液 加熱至約8 0 C (加熱和授拌同時開始),且回流1 · 5小時, 從而形成澄清溶液。將所得溶液冷卻至室溫,然後用乙醇 稀釋為25重量%,且通過〇·;[微米Tef 1〇η(商標)濾器過濾。A micronized vermiculite precursor was synthesized by adding 208 ml of tetraethoxysilane, 94 ml of triethylene glycol monoterpene ether (TIEGMME), 16.8 ml of deionized water and 0.68 ml of 1 nitric acid in a round bottom flask. . The solution was heated to about 80 C with vigorous stirring (starting with heating and mixing) and refluxed for 1.5 hours to form a clear solution. The resulting solution was cooled to room temperature, then diluted to 25% by weight with ethanol, and filtered through a micron Tef 1 〇 (trademark) filter.
1270530 五、發明說明(22) 使約2毫升微孔矽石前體沈積於4英寸矽晶圓上,接著以 250 0轉/分鐘旋轉3〇秒。隨後使所得薄膜於真空室中以如 下方法膠凝/老化。 1·將室抽空至250托。 —2·將15莫耳/升(μ)氫氧化銨加熱及平衡於45 π,引入至 室中,壓力經1〇分鐘增加至66〇托。 3·重新用空氣填充該室,自該室移出薄膜,以進行下一 步驟表面處理/溶劑交換。 遵躁表面之寡聚物/聚合物處理 用以下條件進行薄膜之表面處理/溶劑交換: 1 ·如上述製備表面處理所用之反應劑。 :經老化薄膜置於旋轉夾盤上;以250轉/分鐘旋轉。 旋轉ί =薄膜乾燥下使約30毫升上述而溶液於薄膜上 移4出:ί =膜:25°°轉/分旋轉乾燥10秒鐘,隨後自夾盤 移出該薄膜,進行加熱處理。 加熱處理1270530 V. INSTRUCTIONS (22) Approximately 2 ml of the microporous vermiculite precursor was deposited on a 4 inch tantalum wafer and then spun at 250 0 revolutions per minute for 3 seconds. The resulting film was then gelled/aged in a vacuum chamber in the following manner. 1. Drain the chamber to 250 Torr. - 2· 15 m/liter (μ) ammonium hydroxide was heated and equilibrated at 45 π, introduced into the chamber, and the pressure was increased to 66 Torr over 1 Torr. 3. Refill the chamber with air and remove the film from the chamber for the next step of surface treatment/solvent exchange. Surface-Offected Oligomer/Polymer Treatment The surface treatment/solvent exchange of the film was carried out under the following conditions: 1. A reagent for surface treatment was prepared as described above. : The aged film was placed on a rotating chuck; rotated at 250 rpm. Rotate ί = about 30 ml of the above solution was dried while the film was dried and the solution was transferred 4 times out of the film: ί = film: 25 ° ° rpm / spin drying for 10 seconds, then the film was removed from the chuck and heat treated. Heat treatment
然後將得自以上製程之薄膜在空氣中分別以 進打兩個60秒鐘加熱步驟。鈇德 及3 20C t:加熱爐内固化3。分鐘 後在亂氣下將該薄膜於· 所得薄膜之折光指數及厚度係 (Wool lam)橢圓偏振測厚儀測量'、。不準方法以伍萊姆 測定介電當數 介電常數係用如下之㈣ς雷& 下之M〇S電合^("MOSCAP")結構由標準 1270530 五、發明說明(23) CV(電流-電壓)曲線方法測量。為形成M〇SCAp結構,使鋁 通過圓形點式掩模_至薄膜上,且將紹層薄膜錢至晶 圓片之背側。對該M0SCAP施加適當偏壓,然後百萬赫 兹測量電容量。在所有以後實例中均用該方法測定介電常 數。 測定薄膜之機械強麼 破壞薄膜所需力係由技藝上之標準栓拉方法測量。將欲 測薄膜佈置於基質晶圓i ’於薄祺之上部佈置鋁層,以 止^施加環氧樹脂穿透孔隙結構。然後使環氧:脂 栓環氧化至經鋁化之薄膜上部。—旦曰“ β 測試力將該栓自薄膜拉離,直至一' :口 : ’即用 壞前瞬間測得之拉力作為栓拉強度;m二恰於: 例,該栓係界定為機械破壞瞬間對 ^以下實 磅/平方英寸("KPSI")測定。 件之作用力,且以千 所測薄膜性能摘要於下表中:The film from the above process was then heated in air for two 60 second heating steps. Jude and 3 20C t: curing in the furnace 3. After a minute, the film was measured by a refractive index and thickness system (Wool lam) ellipsometer in the obtained film. The method is not to use the Wuleym to measure the dielectric constant. The dielectric constant is as follows: (4) ς雷 & M 〇 S 电 ^ ("MOSCAP") structure by standard 1270530 V, invention description (23) CV ( Current-voltage) curve method measurement. To form the M〇SCAp structure, aluminum is passed through a circular dot mask _ to the film, and the film is deposited on the back side of the wafer. Appropriate bias is applied to the MOSPCAP and then the capacitance is measured in megahertz. This method was used to determine the dielectric constant in all subsequent examples. Determining the mechanical strength of the film The force required to break the film is measured by standard method of plugging. The film to be tested is placed on the substrate wafer i' to lay an aluminum layer on top of the thin layer to prevent the epoxy from penetrating the pore structure. The epoxy:lip plug is then epoxidized to the upper portion of the aluminized film. - 曰 "β test force pulls the plug away from the film until a ': mouth: 'that is, the tensile force measured immediately before the bad as the bolting strength; m two is exactly as: For example, the tether is defined as mechanical damage The instantaneous force is measured in the following pounds per square inch ("KPSI"). The force of the piece and the measured film properties in thousands are summarized in the table below:
實例2 該實例說明用3〇uMTAS衍生之矽 製備介電薄膜,且該經簡衍生物:^液處理 疋含1個反應性官能團。 兀t 口物母重複單 羞備表面之水解化ΜΤΑ ς 如以上實例1獲得及製備ΜΤ 傷 又行汉I備MIAS及3〜戊酮。將76 3克3〜戊 1270530 五、發明說明(24) 酮加入至含2· 67克水之25〇毫升燒瓶中,放入磁性攪拌棒 。然後在適當攪拌下將32· 7 *MTAS加至上述戊酮/水^ 合物,繼續於室溫攪拌過夜,產生澄清、無色溶液。用&氣 相色譜-質譜法分析該產物,未發現在產物中存在耵…,' 意味MTAS均已反應。使該溶液通過〇· 2微米特氟隆(商標) 濾、器過濾、,供下述表面處理使用。 製備微孔薄膜 使约2宅升上述實例丨製備之微孔矽石前體沈積於4英寸 矽晶圓上,然後以2500轉/分旋轉30秒。然後在真空室中 用以上實例1所述之三步驟方法使該薄膜膠凝/老化。 用實例1所述四步驟方法以上述表面修飾反應劑進行薄 膜之表面處理/溶劑交換。 然後以兩步驟方法加熱自以上方法獲得之薄膜,且如以 上實例1所述在氮氣下固化。折光指數、介電常數及拴拉 檢驗均如實例1進行。所測薄膜性能顯示於下表中。 表2 折光指數 薄膜厚度(A) 介電常數 拴拉(千磅/平方英寸) 1.3144 6115 ~~「13 __3. 96 實例3 ^實例說明用2〇%經訂心衍生之矽氧烷聚合物溶液處理 ^備介電薄膜,該經MTAS衍生之矽氧烷聚合物每重複單元 B 1個反應性官能團。Example 2 This example illustrates the preparation of a dielectric film from 3 〇u MTAS-derived ruthenium, and the simplification derivative: 液 liquid treatment 疋 contains 1 reactive functional group.兀 口 物 重复 重复 羞 羞 羞 羞 羞 羞 羞 羞 羞 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 水解 ς ς ς ς ς ς ς 76 3 g 3~ pent 1270530 V. Inventive Note (24) The ketone was added to a 25 〇 ml flask containing 2.67 g of water and placed in a magnetic stir bar. Then 32.7 *MTAS was added to the above pentanone/water compound with appropriate stirring and stirring was continued at room temperature overnight to yield a clear, colorless solution. The product was analyzed by & gas chromatography-mass spectrometry, and no enthalpy was found in the product. 'It means that MTAS has reacted. This solution was filtered through a 〇·2 μm Teflon (trademark) filter and used for the following surface treatment. Preparation of a microporous film A microporous vermiculite precursor prepared in the above example was deposited on a 4 inch tantalum wafer and then rotated at 2500 rpm for 30 seconds. The film was then gelled/aged in a vacuum chamber using the three-step process described in Example 1 above. The surface treatment/solvent exchange of the film was carried out by the four-step method described in Example 1 using the above surface modification reagent. The film obtained from the above method was then heated in a two-step process and cured under nitrogen as described in Example 1. The refractive index, dielectric constant and pull test were carried out as in Example 1. The measured film properties are shown in the table below. Table 2 Refractive Index Film Thickness (A) Dielectric Constant Pull (kilograms per square inch) 1.3144 6115 ~~"13 __3. 96 Example 3 ^Example Description 2%% core-derived alkane polymer solution The dielectric film is treated, and the MTAS-derived siloxane polymer has a reactive functional group per unit B.
飾用之水解化MTAS 如實例1獲得及製備MTAS和3-戊胸 將122克3-戊酮加入Hydrolyzed MTAS for use as in Example 1 Obtained and prepared MTAS and 3-pentacral. Add 122 g of 3-pentanone.
1270530 五、發明說明(25) ΐ2产5姓克水之500毫升燒瓶中,放入磁性攪拌棒。然後在適 ^择下將30.5克MTAS加至以上3_戊網/水混合物,繼續 =溫攪拌過夜’得到澄清、無色溶液。用氣相色譜_質 析該產# ’產物中未發現存在Mm,意味題均已 反^。然後使該溶液通過0.2微米TeflQn(商標)濾器過遽 ’供下述表面處理使用。 1備微孔簿膜 =2毫升如上述實備之微孔石夕石前體沈積於以 =石夕晶圓上’然後以2500轉/分旋轉3〇秒。隨後在真空室 用以上實例1所述之三步驟方法使薄膜膠凝/老化。 用實例1所述四步驟方法以卜# I^ 表面處理/溶劑交換表面修飾劑進行薄膜之 然後以二步驟方法加熱自以上製程得之薄膜,在氮氣下 實例1所述固化。折光指數、介電常數及栓拉檢驗 均如實例1所述進行。所測薄膜性能顯示於下表中。1270530 V. INSTRUCTIONS (25) Place a magnetic stir bar in a 500 ml flask of 5 liters of water. Then, 30.5 g of MTAS was added to the above 3_pentane/water mixture, and continued = warm stirring overnight to give a clear, colorless solution. No gas was found in the product produced by gas chromatography _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ This solution was then passed through a 0.2 micron TeflQn (trademark) filter for use in the following surface treatment. 1 Preparation of microporous film = 2 ml of the microporous stone precursor prepared as described above was deposited on the = Shihwa wafer and then rotated at 2500 rpm for 3 sec. The film was then gelled/aged in a vacuum chamber using the three-step process described in Example 1 above. The film was subjected to a four-step method as described in Example 1 by a surface treatment/solvent exchange surface modifier, and then the film obtained from the above process was heated in a two-step process and cured as described in Example 1. The refractive index, dielectric constant and plug test were carried out as described in Example 1. The measured film properties are shown in the table below.
實例4 該實例說明用1〇%經MTAS衍生之石夕氧烷聚合物溶液處理 製備介電薄膜。Example 4 This example illustrates the preparation of a dielectric film by treatment with 1% by weight of a MTAS-derived oxalate polymer solution.
麗備表面絛飾用之水解化MTAS 如以上實例1獲得及製備MTAS和3-戊酮。將1 85 4克3_ 酮加入至含1.68克水之500毫升燒瓶中,放入磁性攪拌棒Hydrolyzed MTAS for surface preparations. MTAS and 3-pentanone were obtained and prepared as in Example 1 above. Add 1 85 4 g of 3-ketone to a 500 ml flask containing 1.68 g of water and place the magnetic stir bar
第29頁 1270530 五、發明說明(26) ;然後在適當授拌下將20.6克訂“力口至上述3_戊萌/水混 合物,繼縯於室溫攪拌過夜,產生澄清、&色溶液。用氣 相色譜-質譜法分析該產物,未在該產物中發現Mm,意 味MTAS均已反應。然後使該溶液通過〇 2微米Ten〇n(商 標)遽器過濾、’供下述表面處理使用。 羞備微孔薄膜 使+約2毫升如以上實例!所述製備之微孔矽石前體沈積於 1 央—寸/夕晶圓上,然後以250 0轉/分旋轉秒鐘。隨後在直 工::用以上實例1所述三步驟方法使該薄膜膠凝/老化:、 用只例1所述四步驟方法以上述表面修 表面處理/溶劑交換。 …延仃潯膘之 然後以二步驟方法加熱自以上製程獲 ^實船所述在氮氣中固化。折光指數、介/膜數及且如以 檢驗均如實例W述進行。所測薄媒性能顯示於下表:拉 表4 折光指數 [•1933 數 實例5 ^膜厚度(A) —~587Ϊ 本實例說明以109^.MTAS衍生之矽氧 製備介雷锋脫 礼反I合物溶液處理 備,丨電薄膜,該經MTAS衍生之矽氧烷聚 a31.5個反應性官能團。 初母室複早兀 之水解化MTAS 如以上實例!獲得及製備mtas*3_ 詞加至内含“2克水之5。。毫升燒瓶中,放:2磁Page 29 1270530 V. Inventive Note (26); then, under appropriate mixing, 20.6 grams of "force to the above 3_ pentane / water mixture, followed by stirring at room temperature overnight, resulting in a clear, & color solution The product was analyzed by gas chromatography-mass spectrometry, and Mm was not found in the product, meaning that MTAS was reacted. The solution was then filtered through a 微米2 μm Ten〇n (trademark) vessel, and the following surface treatment was performed. Use a microporous film to make + about 2 ml of the above example! The prepared microporous vermiculite precursor is deposited on a 1 inch/inch wafer, and then rotated at 250 0 rpm for a second. In the direct work:: The film was gelled/aged by the three-step method described in Example 1 above: the surface treatment/solvent exchange was carried out by the four-step method described in Example 1 only. The two-step method is heated and solidified in the nitrogen gas from the above process. The refractive index, the number of media/film and the test are carried out as described in the example. The measured properties of the thin media are shown in the following table: Refractive index [•1933 number example 5^ film thickness (A) —~587Ϊ 109^.MTAS-derived 矽Oxygen preparation is prepared by the solution of the leaching solution of the ruthenium, and the ruthenium film, the MTAS-derived oxirane polya31.5 reactive functional groups. The MTAS is as in the above example! Obtain and prepare the mtas*3_ word to add 5 grams of water containing 2 grams. . In a milliliter flask, put: 2 magnetic
第30頁 1270530 五、發明說明(27) 。然後在適當授摔下將24.8克Μ T A S加至上述3 -戊酮/水混 合物,繼續於室溫攪拌過夜,生成澄清、無色溶液。用氣 相色譜-質譜法分析該產物,在該產物中未發現……,意 味MTAS均已反應。然後使該溶液通過〇· 2微米Tefl〇n(商 標)濾器過濾,供下述表面處理使用。 製備微孔簿膜 使約2毫升如以上實例1所述製備之微孔石夕石前體沈積於 4英寸矽晶圓上,然後以2500轉/分旋轉3〇秒。隨後用以上 實例1所述三步驟方法在真空室中使該薄膜膠凝/老化。 用實例1所述四步驟方法以上述表面修飾劑進行薄膜之 表面處理/溶劑交換。 然後以二步驟方法加熱自以上製程獲得之薄膜,折光指 數、介電常數及栓拉檢驗均如實例丨所述進行。所測薄膜 性能顯示於下表中。 、 、 折光指數 度(A) 1·1766 6694 實致g 體處理製備介電薄Page 30 1270530 V. Description of invention (27). Then, 24.8 g of Μ T A S was added to the above 3-pentanone/water mixture under appropriate dropping, and stirring was continued at room temperature overnight to give a clear, colorless solution. The product was analyzed by gas chromatography-mass spectrometry, and no product was found in the product, meaning that MTAS had reacted. This solution was then filtered through a 微米 2 μm Tefl〇n (trademark) filter for use in the following surface treatment. Preparation of microporous film Approximately 2 ml of the microporous smectite precursor prepared as described in Example 1 above was deposited on a 4 inch tantalum wafer and then spun at 2500 rpm for 3 seconds. The film was then gelled/aged in a vacuum chamber using the three-step process described in Example 1 above. The surface treatment/solvent exchange of the film was carried out by the above-described surface modifying agent by the four-step method described in Example 1. The film obtained from the above process was then heated in a two-step process, and the refractive index, dielectric constant, and plug test were carried out as described in Example 。. The measured film properties are shown in the table below. , , and refractive index (A) 1·1766 6694
本實例係用於比較及說明僅以訂as單 膜。此等薄膜未應用聚合物/募聚物。 复A微孔薄膜 使約2毫升如以上實例丨所述製備之微孔矽石 夬^矽晶圓上,然後以2500轉/分旋轉3〇秒鐘。隨後用」 a實例1之二步驟方法於真空室中使該薄膜膠凝/老化。This example is for comparison and explanation only for ordering a single film. These films are not coated with a polymer/polymer. The complex A microporous film was subjected to about 2 ml of a microporous vermiculite wafer prepared as described in the above Example, and then rotated at 2,500 rpm for 3 seconds. The film was subsequently gelled/aged in a vacuum chamber using the procedure of Example 1 bis.
第31頁 1270530 五、發明說明(28) 根據實例1之方法進行薄膜之表面處理/溶劑交換,但製 備表面修飾用反應劑時,混合5克MTAS與95克3 -戊酮(分別 如實例1所述獲得),以形成澄清、無色溶液。 然後以二步驟方法加熱自以上製程得之薄膜,如上述實 例1在氮氣下固化。折光指數、介電常數及栓拉檢驗均如 實例1所述進行。所測薄膜性能顯示於下表中。 表6Page 31 1270530 V. INSTRUCTIONS (28) The surface treatment/solvent exchange of the film was carried out according to the method of Example 1, but when preparing the surface modification reagent, 5 g of MTAS and 95 g of 3-pentanone were mixed (Example 1, respectively) Said) to form a clear, colorless solution. The film obtained from the above process was then heated in a two-step process, as in Example 1 above, under nitrogen. The refractive index, dielectric constant and plug test were carried out as described in Example 1. The measured film properties are shown in the table below. Table 6
實例7Example 7
*本實例說明用(單體)甲矽烷化表面反應劑處理製備介$ 薄膜,隨後用25%經MTAS衍生之矽氧烷聚合物溶液處理,* This example illustrates the preparation of a thin film by treatment with a (monomer) formamidine surface reactant followed by treatment with 25% MTAS-derived alumoxane polymer solution.
且該經Μ T A S衍生之石夕夤ψ ^ ifn ^ ^ ^ w A 7軋沉汆合物母重複單元含平均1 5個And the Μ T A S derived Shi Xi 夤ψ ^ ifn ^ ^ ^ w A 7 rolling sedimentation compound repeat unit contains an average of 15
反應性官能團。 J · 〇個 里備表面修能用之水鲺化MTAS 如以上實例1獲得及製備MTAS和3〜 . urp 解於15。克3-戊_中。然後在適當捷二;將3將 以上溶液。使包括經水解MTAs ,. 7加Reactive functional group. J · 〇 表面 表面 修 MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT MT Gram 3 - _ _. Then in the appropriate Jieji; will 3 above the solution. To include hydrolyzed MTAs, 7 plus
處理前通過0.2微米遽器過濾。斤侍從^無色溶液在名 复微孔薄巧 使約4毫升如以上實例丨所 8英寸石夕晶圓上,然後以25〇〇 ^,,微孔石夕石前體沈彩 使經旋轉薄膜膠凝/老化: 刀旋轉30秒。用以下僻 1·將室吸空至250托。Filter through a 0.2 micron buffer before processing.斤 侍 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Gel/Aging: The knife is rotated for 30 seconds. Use the following secluded room to evacuate the chamber to 250 Torr.
第32頁 1270530Page 32 1270530
五、發明說明(29) 2·將15莫耳/升氫氧化銨加熱及平衡於45艺, 入至該室,使壓力增加至66〇托。 、、工5刀鐘引 3·將該室吸空至250托。 4·將15莫耳/升氫氧化錢加熱及平衡於45。〇 入至該室,使壓力增加至66〇托。 、士5分鐘引 5·重新用空氣填充該室,將經老化薄膜自該 至移出。 然後使經老化薄膜經過表面處理/溶劑交換。 面處理/溶劑交換所用之溶液1如實例i所述製為製備表 之MTAS溶解於3-戊酮,以產生5重量% mtas之弘:、顧 。用以下條件進行薄膜之表面處理/溶劑交換。戍調>谷液 y二經老化薄膜置於旋轉失盤上,且以25〇轉/ 不使薄膜乾燥下,使約30毫升以上MTAS溶液;^膜 上旋轉20秒鐘。 各履於溥膜 2 轉/分㈣乾燥1〇秒鐘’自夹盤移出,在 工氣中分別以175和在 之薄膜。 C加熱處理60秒鐘,以產生經烘乾 基合物/券聚物之表兩處理 溶得之經烘乾薄膜用所述之水解化題 1將自以上匍兹表面處理/溶劑處理使用以下條件: 25二= 之經烘乾薄膜置於旋轉夾盤上,以 250轉/分旋轉。 二Si燥下,使約3〇毫升上述水解化訂仏溶液 於溥膜上旋轉2 0秒鐘。V. INSTRUCTIONS (29) 2. Heat and equilibrate 15 mol/L ammonium hydroxide to the chamber and increase the pressure to 66 Torr. 5, knife 5 lead 3 · The chamber is sucked to 250 Torr. 4. Heat and balance 15 moles/liter of hydroxide. 〇 Into the chamber to increase the pressure to 66 Torr. 5 minutes, 5 minutes, refill the chamber with air, and remove the aged film from there. The aged film is then subjected to surface treatment/solvent exchange. The solution 1 used for the surface treatment/solvent exchange was prepared as described in Example i. The MTAS prepared as a table was dissolved in 3-pentanone to give 5% by weight of mtas: The surface treatment/solvent exchange of the film was carried out under the following conditions.戍 & 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Each film was transferred to the enamel film at 2 rpm (4) and dried for 1 〇 second, and was removed from the chuck, and 175 and the film were respectively placed in the process gas. C heat treatment for 60 seconds to produce a dried film obtained by drying the dried matrix/valency polymer. The hydrolyzed film 1 is used for the surface treatment/solvent treatment from the above Conditions: 25 2 = The dried film was placed on a rotating chuck and rotated at 250 rpm. Under two Si drying, about 3 ml of the above hydrolyzed fission solution was spun on the diaphragm for 20 seconds.
ΗΒ 第33頁 1270530ΗΒ page 33 1270530
五、發明說明(30) + 3·然後使該薄膜以2500轉/分旋轉乾燥1〇秒鐘,隨後自 夾盤移出該薄膜,並經過加熱處理。 隨後在线中將自以上製程得之薄膜分別於175及32〇 0〇 加熱處理60秒鐘。然後在氮氣下於加熱爐内以4〇〇固化 30分鐘。所得薄膜之折光指數和厚度係由伍萊姆 (Woo 11 am)橢圓偏振測厚儀測量。 介電常數測量 介電常數係如以上實例1所述由標準cv(電流_電壓)曲線 技術測定。 薄膜機械強度測量 薄膜之内聚強度係如以上實例丨所述由栓拉檢驗測量。 所製備薄膜之模量係用χρ型納式硬度計(Nan〇 Indenter XP)測量[MTS系統公司,奥克雷(〇ak Ridge),tn 3783〇] 。該測量以千兆帕(1〇6牛頓/米2)提供薄膜之模量。 表75. Description of the Invention (30) + 3· The film was then spin-dried at 2,500 rpm for 1 Torr, and then the film was removed from the chuck and subjected to heat treatment. Subsequently, the film obtained from the above process was heat-treated at 175 and 32 〇 0 Torr for 60 seconds. It was then cured in a heating oven at 4 Torr for 30 minutes under nitrogen. The refractive index and thickness of the resulting film were measured by a Woo 11 am ellipsometer. Dielectric Constant Measurement The dielectric constant was determined by the standard cv (current_voltage) curve technique as described in Example 1 above. Film Mechanical Strength Measurement The cohesive strength of the film was measured by a plug test as described in the Examples above. The modulus of the prepared film was measured by a χρ-type nano hardness tester (Nan〇 Indenter XP) [MTS Systems, 〇ak Ridge, tn 3783〇]. The measurement provides the modulus of the film in gigapascals (1 〇 6 Newtons per square meter). Table 7
折光指數 薄膜厚度 (A) 介電常數 内聚強度 (千磅/平方英寸) 模量 (千兆帕) 营例7數據 (多官能聚合物 處理) L2565 7823 2.4 8.3 6.3 膏例6數據 (以不具水之 MTAS單體處理) 1.1665 7518 1.98 1.5 N/ARefractive index film thickness (A) Dielectric constant Cohesive strength (thousand pounds per square inch) Modulus (gigapascals) Case 7 data (multifunctional polymer treatment) L2565 7823 2.4 8.3 6.3 Paste 6 data (without MTAS monomer treatment of water) 1.1665 7518 1.98 1.5 N/A
自以上表7可以瞭解’以典型多官能聚合物/寡聚物對照 處理薄膜之性能相對於只以MTAS單體處理薄膜之性能有相 當改良。其内聚強度增加5倍,而且介電常數具有適度增It can be understood from Table 7 above that the performance of a film treated with a typical polyfunctional polymer/oligomer control is relatively improved over that of a film treated with only a MTAS monomer. Its cohesive strength is increased by 5 times, and the dielectric constant is moderately increased.
第34頁 1270530 五、發明說明(31) 加。 實例8 本實例說明用5%單體性甲矽烷化反應劑(MTAS單體)及 2 5%於經MTAS衍生之矽氧烷聚合物二者處理製備介電薄膜 ’且該經MTAS衍生之矽氧烷聚合物每重複單元含平均1. 5 個反應性官能團。 复表面修飾用之水解化MT AS:Page 34 1270530 V. Description of invention (31) Plus. EXAMPLE 8 This example illustrates the preparation of a dielectric film using a 5% monomeric methylation reaction (MTAS monomer) and 25% of a MTAS-derived alkoxylate polymer and the MTAS derived oxime The oxyalkylene polymer has an average of 1.5 reactive functional groups per repeating unit. Hydrolyzed MT AS for complex surface modification:
如以上實例1獲得及製備MTAS和3—戊酮。將25〇克訂43與 750克3-戊酮混合,然後加入丨5· 3克水,同時將該溶液適 當授拌。然後將該溶液攪拌過夜。將15· 4克MTAS加入至自 以則步驟得之1 8 5克澄清溶液。在表面處理前將所得澄清 無色溶液通過0 · 2微米濾器過渡。 I備微孔薄膜 ,合成微孔矽石前體,且旋轉沈積於8英寸矽晶圓上,然 後如以上實例7所述於真空室中膠凝/老化。 t金物/寡聚物之表面虛g 所軸3之水解化MTAS聚合物溶液處 薄膜之表面處理/溶劑交換係使用以下條件: J轉將程得之經老化薄膜置於旋轉夹盤上 且MTAS and 3-pentanone were obtained and prepared as in Example 1 above. 25 g of order 43 was mixed with 750 g of 3-pentanone, and then 5.3 g of water was added while the solution was properly mixed. The solution was then stirred overnight. 5.4 g of MTAS was added to the 8.5 5 gram clear solution obtained from the subsequent steps. The resulting clear, colorless solution was passed through a 0.2 micron filter prior to surface treatment. A microporous film was prepared, a microporous vermiculite precursor was synthesized, and sputter deposited on an 8 inch tantalum wafer and then gelled/aged in a vacuum chamber as described in Example 7 above. The surface of the gold/oligomer is decomposed into the MTAS polymer solution of the axis 3. The surface treatment/solvent exchange of the film uses the following conditions: J turns the aged film onto the rotating chuck and
2·在不使薄膜乾燥下使約q 於薄膜上旋轉20秒鐘。3() 毫升以上水解化之MTAS溶液 然後使該薄膜以25〇〇轉/ 分旋轉乾燥1 〇秒鐘,隨後2. Rotate about q on the film for 20 seconds without drying the film. 3 () ml of the hydrolyzed MTAS solution and then spin-dry the film at 25 rpm for 1 , second, then
第35頁 1270530Page 35 1270530
夾盤移出薄 隨後將自 加熱6 0秒鐘 。所得薄膜 測量。 膜,並進行加熱處理。 以上,釭=之薄膜在空氣中分別以丨7 5及3 2 〇 。接著在氮氣中於400 °C加熱爐内固化3〇分鐘 之折光指數及厚度係由伍萊姆橢圓偏振測厚儀The chuck is removed and thinned and then self-heated for 60 seconds. The resulting film was measured. The membrane is heat treated. Above, the film of 釭 = 丨 7 5 and 3 2 在 in the air. Then, it is cured in a heating furnace at 400 ° C for 5 minutes in nitrogen. The refractive index and thickness are obtained by the Woolham ellipsometer.
該方法說明由MTAS單體及水解化MTAS聚合物组人物二 使表面矽烷醇曱矽烷化之簡化共處理方法(與實例;比車I 。結果為,薄膜所具之物理性能(介電常數,内 / 由實例7之方法獲得之薄膜性能相似。 又^ 實例9 本實例說明用曱矽烷化反應劑(MTAS單體)處理掣 薄膜,隨後用25%經MTAS衍生之矽氧烷聚合物溶液\理1冤 且該經MTAS衍生之矽氧烷聚合物每重複單元含 加 反應性官能團。 、、、J i · 5個This method illustrates a simplified co-processing method for the sulfonation of surface stanols from MTAS monomers and hydrolyzed MTAS polymer groups (with examples; compared to vehicle I. The result is the physical properties of the film (dielectric constant, The film properties obtained by the method of Example 7 were similar. Further Example 9 This example illustrates the treatment of a ruthenium film with a decaneization reagent (MTAS monomer) followed by a 25% MTAS-derived oxirane polymer solution\ And the MTAS-derived methoxyalkane polymer contains a reactive functional group per repeating unit. , , , J i · 5
皇備表面修飾用之太蟀化MTAS 將2 5 0克MTAS與7 5 0克3-戊酮混合,然後加入1 5· 3克水, 同k適▲稅拌 >谷液。隨後將該溶液攪拌過夜。在用於表面 處理前將所得澄清無色溶液通過〇 · 2微米濾器過減。又 製備微孔薄膜 合成微孔石夕石前體,旋轉沈積於8英寸矽晶圓上,然後 如以上實例7所述於真空室中膠凝/老化。 、For the surface modification of the huangbei, the MTAS is used to mix 250 mM MTAS with 750 g of 3-pentanone, then add 1 5 · 3 g of water, and the same k ▲ tax mix > The solution was then stirred overnight. The resulting clear, colorless solution was passed through a 〇 2 μm filter prior to use in the surface treatment. Further, a microporous film was prepared to synthesize a microporous stone precursor, which was spin-deposited on an 8-inch tantalum wafer and then gelled/aged in a vacuum chamber as described in Example 7 above. ,
O:\62\62459.ptd 第36頁 1270530 五、發明說明(33) 里.金—兔丄募聚表面處理 a I ΐ述貫例8之方法以所用本實例之水解化MTAS聚人物 組合物進行薄膜之表面處理/溶劑交換f解化MTAS “物 °c加H自I、t t ί ί獲7,薄膜* 2氣下分別以1 7 5及3 2 〇 鐘。;得於4 0 0 °c加熱爐内固化30分 萊姆搞圓】及厚度係如以上實例1所述由伍 555¾- 1.2826 6439 表9 強度(千磅寸) — 8729 ^ ___2Λ^ 該方法顯示一 @ f、+ γ -一 --—— 似物理性能之薄=電方當法*與實例8比較),且提供具類 雖然現已描述明電乂數、.内聚強度)。 應認識可在不離開^發明具體實施例,但熟於此藝者 此類變化及改進岣應^於^旨下作出變化及改進。所欲 用多種參考,发揭Γ肉二 I明之範圍。本文說明書中引 /、揭-内各全部以參考之方式併於本;了引O:\62\62459.ptd Page 36 1270530 V. Inventive Note (33) Lijin-Rabbit Reclamation Surface Treatment a I The method of Example 8 is used to hydrolyze the MTAS polyant composition of the present example. Perform surface treatment/solvent exchange of the film to decompose MTAS “Material °c plus H from I, tt ί ί, 7, film * 2 gas at 175 and 3 2 〇 respectively;; c. Curing in the furnace for 30 minutes, and the thickness is as described in Example 1 above. 5553⁄4-1.2826 6439 Table 9 Strength (thousand pounds) — 8729 ^ ___2 Λ ^ This method shows a @ f, + γ - One --- thin like physical properties = electric method * compared with example 8), and provide a class although it has been described that the number of electric enthalpy, cohesive strength). should be recognized without leaving the invention The examples, but those skilled in the art, such changes and improvements are subject to change and improvement. The various references are intended to be used to disclose the scope of the meat. All of them are referred to in this way;
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