1269367 A7 ____ B7 五、發明説明（1 ) 發明領域 (請先閱讀背面之注意事項再填寫本頁) 本發明係相關於一種用來製造例如大型積體電路、超 大型積體電路、或類似電路或液晶顯示面板的半導體之光 罩保護膜，更明確地說，相關於一種適用該曝光方法之光 罩保護膜，該方法使用光線波長爲2 2 〇 n m。 製造一種例如大型積體電路、超大型積體電路或類似 電路、或液晶顯示器的半導體元件之領域中，習知上使用 一波長爲2 4 0 irm或更長的光線，用於照射晶圓或液晶 顯不面板基質，以形成產品圖案，該光線係穿過一^個暴露 於該光線之原始圖案薄板·，例如光罩或光罩板（以下簡稱 爲一原始圖案薄板）。在此情形中，假如灰塵沈積在將形 成產品圖形的原始圖案薄板之表面，則該灰塵將吸收、反 射或偏移用來曝光的光線。因此，該表面之尺寸精確度及 品質將降低而且外觀將變得粗劣的。所以，暴露於光線的 作業程序必須在潔淨室（無塵室）中進行。 然而，欲保持該原始圖案薄板的淸潔是非常困難的。 發明背景 經濟部智慧財產局員工消費合作社印製 爲達到防止微粒堆積在原始圖案薄板的目的，用於曝 光光線的作業過程通常使用一光罩保護膜.加以實施。圖4 係爲顯示一粘貼於原始圖案薄板的習知光罩保護膜，而且 圖5係一個沿著圖4的切線A — A所截取的截面圖。光罩 保護膜1係包括一光罩保護膜框架5及一用於傳送曝光光 線的光罩保護膜薄層2，這些元件係藉由粘著劑4連接該 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -4- 1269367 A7 —B7 五、發明説明（2 ) (請先閱讀背面之注意事項再填寫本頁) 光罩保護膜框架5的中空部分。當實施用於曝光光線的作 業程序時，光罩保護膜1係黏貼至原始圖案薄板7，這係 藉由一粘著劑6與光罩保護膜框架5連接而達成。因爲降 低光線傳送或微粒因素是不可能的，除非光罩保護膜薄層 2或光罩保護膜框架5已經破損，倒此與光罩保護膜1連 接該原始圖案薄板7不永久使用.。 另一方面，根據持續縮小尺寸的需求，使用於例如大 型積體電路、超大型積體電路、或類似電路的半導體元件 的曝光光線波長已經逐漸縮短，而且目前提出一種具有‘ 2 2 0 n m或更短波長及來自F 2雷射光的曝光光線之技術 。當暴露於光線，而且存在於無塵室的有機氣體產生堆積 時，被用於這類曝光方式的原始圖案薄板可能導致減少光 線的傳送。再者，該原始圖案薄板係覆蓋於一以儲存及運 送爲目的之包裝盒中，該包裝盒係由例如聚丙烯酸酯、聚 苯乙烯、聚丙烯、聚乙烯、聚碳酸酯、A B S樹脂或類似 聚合物的合成橡膠所形成。由此可知該包裝盒產生一有機 氣體，而且已產生的氣體堆積在被覆蓋的原始圖案薄板之 表面上，因而降低光線的傳送。 經濟部智慧財產局員工消費合作社印製 因此，一般來說在暴露於光線之前，對於原始圖案薄 板加以淸潔。本發明之發明人提出一種淸潔方法當做移除 的技術，其中例如F 2雷射光或X e 2準分子燈（此後稱爲 '淸潔燈/)的紫外光係輻射光線以分解有機物質（ P C T / J P 0 0 / 0 1 8 6 9 )。該光罩保護膜薄層對 於這類淸潔光線具有充分的耐用性（抗光性）。再者，因 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 5 - 1269367 A7 B7 五、發明説明（） (請先閱讀背面之注意事項再填寫本頁) 爲該淸潔光線係輻射至用來結合光罩保護膜薄層2及光罩 保護膜框架5的粘著劑4，所以粘著劑4也需要具有抗光 性。在習知技術上，聚異丁烯、丙烯酸樹脂、環氧樹脂類 型的粘著劑、矽類型的粘著劑或類似樹脂係當作粘著劑4 。然而，以抗光性的觀點來說，任何粘著材質未必具有充 分抗光性的，而且隨著淸潔光線的輻射次數的增加，該結 合強度卻減少。因此，這產生一個問題，光罩保護膜薄層 係由光罩保護膜框·架所剝離因而產生一間隙，所以抗微粒 能力變得不足，而且粘著劑的已受損部分係變得有微粒， 這些微粒堆積在原始圖案薄板7的寫入圖案表面。 發明之槪述 本發明已經解決上述問題，而且由於暴露於淸潔光線 ，提供一種可以防止粘著劑破壞的光罩保護膜，該粘著劑 係用來結合該光罩保護膜薄層及光罩保護膜框架。 經濟部智慧財產局員工消費合作社印製 根據本發明的內容，提供一個包括光罩保護膜框架及 人造矽玻璃所構成之光罩保護膜薄層的光罩保護膜，該光 罩保護膜薄層藉由粘著劑與光罩保護膜框架相互連結，其 中提供一種用於遮蔽輻射至該粘著劑的紫外線之光線遮蔽 構件。 . 上述光罩保護膜中，較佳的是該光線遮蔽構件係由金 屬或金屬氧化物所組成。再者，較佳的是該光線遮蔽構件 是具有厚度爲5〇nm或更厚的薄層或薄板。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -6 - 1269367 A7 B7 五、發明説明（4 ) _...笔簡要說明 圖1係爲本發明第一實施例的光罩保護膜之立體圖， 其中該光罩保護膜係與原始圖案薄板相連接； 圖2係沿著圖1的線A - A所取出的截面圖； 圖3係爲本發明第二實施例的光罩保護膜之截面圖， 該截面係由圖1的線A - A所取出； 圖4係爲習知光罩保護膜之立體圖，其中該光罩保護 膜係與原始圖案薄板相連接；而且 _ t 圖5係沿著線A - A所取出的截面圖。 主要元件對照表 --------裝！ (請先閲讀背面之注意事項再填寫本頁) 1 光 罩 保 護 膜 2 光 罩 保 護 膜 薄 層 3 光 線 遮 蔽 構 件 4 粘 著 劑 5 光 罩 保 護 膜 框 架 6 粘 著 劑 7 原 始 圖 案 薄 板 .加 經濟部智慧財產局員工消費合作社印製 較佳實施例之詳細描沭 ’ 在下文中，本發明較佳實施例的光罩保護膜將參照圖 式加以描述。 圖1及2係顯示本發明的第一實施例。 在圖1及2中，光罩保護膜1具有一.種光罩保護膜薄 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1269367 A7 B7 五、發明說明（5) -----------裝--- (請先閱讀背面之注咅？事項再填寫本頁) 層2係藉由粘著劑4與光罩保護膜框架5的中空部分相連 接之架構。光罩保護膜薄層2爲已薄化的人造矽玻璃，以 至於這適用於暴露在具有波長2 2 0 n m或更短的光線。 該人造矽玻璃幾乎只由矽氧化物所組成，例如該玻璃係由 包括矽氧化物的多孔性材料所構成，這稱爲~煤灰\。該 多孔性材料係由氣態環境下矽與氧氣相互反應，而且隨後 加以燒結而成。如同粘著劑4 一樣，聚異丁烯樹脂、丙烯 酸樹脂、環氧樹脂、矽類型的粘著劑或類似樹脂與習知技 術相同的方式加以使用。 除了上述本發明的光罩保護膜1的結構之外，光線遮 蔽構件3係以介於光罩保護膜薄層2及粘著劑4間的連接 部分而形成在光罩保護膜薄層2上。也就是說，光線遮蔽 構件係用來覆蓋該粘著劑4所塗覆的部分。有關於光線遮 蔽構件3，當該構件使得淸潔光線無法穿透而且具有足夠 的抗光性時，構件的材質及形狀並沒有特別的限制，因此 可使用形成於薄層或薄板的金屬或金屬氧化物。 經濟部智慧財產局員工消費合作社印製 雖然可使用任何種類的金屬，但是以抗光性及光線遮 蔽性質的觀點來說，較佳的是使用鉻、鋁、鐵、銅或合金 。當形成一金屬薄板，因爲精密處理程序，所以可使用諸 如鋁、鐵或銅的金屬或金屬合金，較佳的是使用具有與粘 著劑4相同熱膨脹係數的鋁。本發明中，金屬薄板係包括 金箔。再者，當使用金屬氧化物薄層時，以抗光性及光線 遮蔽性質的觀點來說，較佳的是使用由氧化鉻（C r〇x ) 、矽土（ S 1〇2 )、氧化鋁（A 1 2〇3 )或類似氧化物 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1269367 A7 B7 五、發明說明（6) -ml —------ I I (請先閱讀背面之注意事項再填寫本頁) 所製成的薄層。雖然薄板厚度係依照所使用的材質而定， 而且應該具有足夠的光線遮蔽性質，該厚度爲5 0 n m或 更厚，較佳的爲50nm至l〇〇〇nm，更好的是 1〇〇11171至1〇〇〇11111。 如圖2所示，光線遮蔽構件必須形成在光罩保護膜薄 層2上，或者如圖3所示，光線遮蔽扁件可設置於光罩保 護膜薄層2與光罩保護膜框架5間以便包圍粘著劑4。 在形成上述金屬薄板或金屬氧化物薄板的情形中，假 如考慮用於光罩保護膜薄層的薄層及粘著性質之材質種類 ，可選擇諸如濺鍍法、氣體沉積法、C V D法、印刷法（ printing method )等已知方式。另一方面，在金屬薄板的 情形中，金屬薄板可使用適合的黏著層以固定於光罩保護 膜薄層2的表面，或者固定於光罩保護膜薄層2與光罩保 護膜框架5之間。 、· 使用與習知技術相同的技術，經由粘著於光罩保護膜 框架5下表面的粘著劑6將光罩保護膜1粘著於原始圖案 薄板7。 經濟部智慧財產局員工消費合作社印製 較佳實施例 本發明將關於實施例（Example )及比較實施例（ Comparative Example )加以詳細描述。然而，應當瞭解本 發明不爲這些特殊實施例所侷限。 光罩保護膜A係按照下列步驟加以使用。光罩保護膜 薄層是一種拋光至厚度爲0 · 3 m m的人造矽玻璃薄板； 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 1269367 A7 B7 五、發明說明（A ) 藉由聚異丁烯粘著劑將光罩保護膜薄層與光罩保護膜框架 相互連接，而且藉由濺鍍的方式形成一具有與光罩保護膜 框架的寬度相同之厚度1 0 0 n m的C r薄膜，該光罩保 護膜框架在人造砂玻璃薄板的前方表面（實施例1 )。再 者，光罩保護膜B係按照下列步驟加以使用。藉由濺·鍍的 方式形成一具有與光罩保護膜框架的寬度相同之厚度爲 1〇〇 n m的C r薄膜，該光罩保護膜框架係與位於具有 相同厚度的（1 〇 〇 n m )人造矽玻璃薄板後方表面；塗 覆一聚異丁烯類型的粘著劑在C r薄膜，而且將C r薄膜 與光罩保護膜框架相互連接（實施例2 )。再進一步，光 罩保護膜C係按照下列步驟加以使用。將承受烘烤處理的 鋁箔加以黏貼，而不是使用於光罩保護膜A的C r薄膜（ 實施例3 )。再進一步，光罩保護膜D係按照下列步驟加 以使用。這使用相同種類的人造矽玻璃薄板而且藉由聚異 丁烯類型的粘著劑將該薄板連接在光罩保護膜框架（比較 實施例）。 在無塵室中，光罩保護膜A - D係分別黏貼在個別原 始圖案薄板。在原始圖案薄板的外來物質數目（例如微粒 )可由P I — 1 0 0 0所測量（由QC Optics，USA所製造 )。因此，來自X e 2準分子燈（由Usio，Inc.所製造的 U E R - 1 7 2 )的光線之輻射持續6 0分鐘。在輻射過 程後，原始圖案薄板係分別地固定至包裝盒。該包裝盒下 降高度6 0 c m，而且原始圖案薄板係由包裝盒取出。在 原始圖案薄板的表面之外來物質由P I - 1 0 0 0來測量 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） · — — — I —丨 — 丨 I — 丨 I (請先閱讀背面之注意事項再填寫本頁)1269367 A7 ____ B7 V. INSTRUCTIONS (1) Field of the Invention (Please read the note on the back and then fill out this page) The present invention relates to a method for manufacturing, for example, a large integrated circuit, a very large integrated circuit, or the like. Or a semiconductor photomask protective film of a liquid crystal display panel, more specifically, a photomask protective film suitable for the exposure method, which uses a light wavelength of 2 2 〇 nm. In the field of manufacturing a semiconductor element such as a large integrated circuit, a very large integrated circuit or the like, or a liquid crystal display, it is conventionally used to use a light having a wavelength of 240 μm or longer for illuminating a wafer or The liquid crystal displays a panel substrate to form a product pattern that passes through an original pattern sheet exposed to the light, such as a reticle or a reticle (hereinafter simply referred to as an original pattern sheet). In this case, if dust is deposited on the surface of the original pattern sheet which will form the product pattern, the dust will absorb, reflect or deflect the light used for exposure. Therefore, the dimensional accuracy and quality of the surface will be reduced and the appearance will become poor. Therefore, the operating procedures exposed to light must be carried out in a clean room (clean room). However, it is very difficult to keep the original pattern sheet clean. BACKGROUND OF THE INVENTION Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives. In order to prevent the accumulation of particles on the original pattern sheet, the operation for exposing the light is usually carried out using a mask protective film. Fig. 4 is a view showing a conventional photomask protective film attached to an original pattern sheet, and Fig. 5 is a cross-sectional view taken along line A - A of Fig. 4. The reticle protective film 1 includes a reticle protective film frame 5 and a reticle protective film thin layer 2 for transmitting exposure light, and these elements are connected to the paper by the adhesive 4 for the Chinese national standard (CNS) A4 size (210 X 297 mm) -4- 1269367 A7 - B7 V. Description of invention (2) (Please read the note on the back side and fill out this page) The hollow part of the mask protective film frame 5. When a job procedure for exposing light is carried out, the reticle protective film 1 is adhered to the original pattern sheet 7, which is achieved by attaching an adhesive 6 to the reticle protective film frame 5. Since it is impossible to reduce the light transmission or the particulate factor, unless the reticle protective film layer 2 or the reticle protective film frame 5 has been broken, the original pattern sheet 7 is not permanently used in connection with the reticle protective film 1. On the other hand, according to the demand for continuous downsizing, the wavelength of exposure light used for a semiconductor element such as a large integrated circuit, a very large integrated circuit, or the like has been gradually shortened, and a type of '2 2 0 nm or Techniques for shorter wavelengths and exposure light from F 2 laser light. When exposed to light and the accumulation of organic gases present in the clean room, the original patterned sheet used in this type of exposure may result in reduced light transmission. Furthermore, the original patterned sheet is covered in a package for storage and transportation, such as polyacrylate, polystyrene, polypropylene, polyethylene, polycarbonate, ABS resin or the like. A synthetic rubber of a polymer is formed. From this, it is understood that the package generates an organic gas, and the generated gas is deposited on the surface of the original pattern sheet to be covered, thereby reducing the transmission of light. Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives. Therefore, the original patterned sheets are generally cleaned before being exposed to light. The inventors of the present invention have proposed a cleaning method as a technique for removing, in which ultraviolet light such as F 2 laser light or X e 2 excimer lamp (hereinafter referred to as 'defect lamp/) is used to decompose organic matter ( PCT / JP 0 0 / 0 1 8 6 9 ). The thin layer of the reticle protective film has sufficient durability (light resistance) for such sleek light. Furthermore, because of the paper size, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied. _ 5 - 1269367 A7 B7 V. Invention description () (Please read the note on the back and fill out this page) The light is radiated to the adhesive 4 for bonding the reticle protective film sheet 2 and the reticle protective film frame 5, so the adhesive 4 also needs to have light resistance. In the prior art, a polyisobutylene, an acrylic resin, an epoxy resin type adhesive, a ruthenium type adhesive or the like is used as the adhesive 4 . However, from the viewpoint of light resistance, any adhesive material is not necessarily sufficiently light-resistant, and the bonding strength is reduced as the number of times of the ray light is increased. Therefore, this causes a problem that the thin layer of the reticle protective film is peeled off by the reticle protective film frame and thus creates a gap, so that the anti-particle ability becomes insufficient, and the damaged portion of the adhesive becomes Fine particles, which are deposited on the surface of the write pattern of the original pattern sheet 7. SUMMARY OF THE INVENTION The present invention has solved the above problems, and provides a reticle protective film capable of preventing the destruction of an adhesive due to exposure to smeared light, which is used to bond the reticle protective film and light. Cover protective film frame. According to the content of the present invention, the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives, provide a reticle protective film comprising a reticle protective film frame and a thin layer of a reticle protective film composed of artificial bismuth glass, the reticle protective film thin layer The adhesive film and the reticle protective film frame are joined to each other by an adhesive, wherein a light shielding member for shielding ultraviolet rays radiated to the adhesive is provided. In the above photomask protective film, it is preferable that the light shielding member is composed of a metal or a metal oxide. Further, it is preferable that the light shielding member is a thin layer or a thin plate having a thickness of 5 〇 nm or more. This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -6 - 1269367 A7 B7 V. Inventive Note (4) _... Brief Description of the Drawing Figure 1 is a reticle of the first embodiment of the present invention A perspective view of the protective film, wherein the photomask protective film is connected to the original patterned thin plate; FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1; and FIG. 3 is a photomask according to a second embodiment of the present invention. A cross-sectional view of the protective film taken out from line A-A of FIG. 1; FIG. 4 is a perspective view of a conventional photomask protective film in which the photomask protective film is attached to the original patterned thin plate; and FIG. A cross-sectional view taken along line A - A. The main component comparison table -------- installed! (Please read the note on the back and fill out this page) 1 Mask protective film 2 Mask protective film thin layer 3 Light shielding member 4 Adhesive 5 Photomask protective film frame 6 Adhesive 7 Original pattern sheet. Add economic DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INTELLIGENT INTELLECTUAL PROPERTY AGENCY WORKING COOPERATION CO., LTD. Hereinafter, the reticle protective film of the preferred embodiment of the present invention will be described with reference to the drawings. 1 and 2 show a first embodiment of the present invention. In Figures 1 and 2, the reticle protective film 1 has a reticle protective film. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). 1269367 A7 B7 5. Invention Description (5) -- ---------装--- (Please read the note on the back first? Then fill out this page) Layer 2 is connected to the hollow part of the reticle protective film frame 5 by the adhesive 4. Architecture. The reticle protective film layer 2 is a thinned artificial bismuth glass, so that this is suitable for exposure to light having a wavelength of 2 2 n n or less. The artificial bismuth glass is composed almost exclusively of cerium oxide, for example, the glass is composed of a porous material including cerium oxide, which is called ~ coal ash. The porous material is formed by reacting ruthenium with oxygen in a gaseous environment and then sintering it. As the adhesive 4, a polyisobutylene resin, an acrylic resin, an epoxy resin, a ruthenium type adhesive or the like is used in the same manner as in the prior art. In addition to the above-described structure of the photomask protective film 1 of the present invention, the light shielding member 3 is formed on the thin film 2 of the photomask protective film with a connection portion between the thin film 2 and the adhesive 4 of the photomask. . That is, the light shielding member is used to cover the portion to which the adhesive 4 is applied. Regarding the light shielding member 3, when the member makes the chaffable light impenetrable and has sufficient light resistance, the material and shape of the member are not particularly limited, and therefore metal or metal formed on the thin layer or the thin plate can be used. Oxide. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives. Although any kind of metal can be used, it is preferable to use chromium, aluminum, iron, copper or alloy from the viewpoints of light resistance and light shielding properties. When a thin metal plate is formed, a metal such as aluminum, iron or copper or a metal alloy can be used because of a precise processing procedure, and aluminum having the same thermal expansion coefficient as that of the adhesive 4 is preferably used. In the present invention, the metal thin plate comprises a gold foil. Further, when a thin metal oxide layer is used, it is preferable to use chromium oxide (C r〇x ), alumina (S 1〇2 ), and oxidation from the viewpoints of light resistance and light shielding properties. Aluminum (A 1 2〇3 ) or similar oxide This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 1269367 A7 B7 V. Description of invention (6) -ml —------ II (Please read the note on the back and fill out this page) The thin layer made. Although the thickness of the sheet depends on the material used, and it should have sufficient light shielding properties, the thickness is 50 nm or more, preferably 50 nm to 1 nm, and more preferably 1 inch. 11171 to 1〇〇〇11111. As shown in FIG. 2, the light shielding member must be formed on the reticle protective film layer 2, or as shown in FIG. 3, the light shielding flat member can be disposed between the reticle protective film layer 2 and the reticle protective film frame 5. In order to surround the adhesive 4. In the case of forming the above-mentioned metal thin plate or metal oxide thin plate, if considering the kinds of materials for the thin layer and the adhesive property of the thin film of the protective cover film, for example, sputtering, gas deposition, CVD, printing can be selected. Known methods such as printing method. On the other hand, in the case of a thin metal plate, the metal thin plate may be fixed to the surface of the thin film 2 of the photomask protective film using a suitable adhesive layer, or may be fixed to the thin film 2 of the photomask protective film and the photomask protective film frame 5. between. The visor protective film 1 is adhered to the original pattern sheet 7 via the adhesive 6 adhered to the lower surface of the reticle protective film frame 5 by the same technique as the conventional technique. INTELLIGENT INTELLECTUAL PROPERTY AGENCY Employees' Consumer Cooperative Printed Preferred Embodiments The present invention will be described in detail with respect to Examples and Comparative Examples. However, it should be understood that the invention is not limited by these particular embodiments. The mask protective film A was used in the following procedure. The thin film of the reticle protective film is a kind of artificial bismuth glass sheet polished to a thickness of 0 · 3 mm; the paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 1269367 A7 B7 V. INSTRUCTION DESCRIPTION (A) The thin film of the protective film of the mask is connected to the frame of the protective film of the mask by a polyisobutylene adhesive, and a frame having a protective film with the mask is formed by sputtering. The Cr film having the same width of 1 0 0 nm, the reticle protective film frame is on the front surface of the artificial sand glass sheet (Example 1). Further, the mask protective film B was used in the following procedure. Forming a Cr film having a thickness of 1 〇〇 nm which is the same as the width of the reticle protective film frame by sputtering/plating, and the reticle protective film frame is located at the same thickness (1 〇〇 nm) The rear surface of the artificial bismuth glass sheet; a polyisobutylene type adhesive is applied to the C r film, and the C r film and the reticle protective film frame are connected to each other (Example 2). Further, the mask protective film C was used in the following procedure. The baking foil-treated aluminum foil was pasted instead of the Cur film used in the mask protective film A (Example 3). Further, the mask protective film D is used in accordance with the following procedure. This uses the same kind of artificial bismuth glass sheet and the sheet is attached to the reticle protective film frame by a polyisobutylene type adhesive (Comparative Example). In the clean room, the mask protective films A - D are adhered to the individual original pattern sheets, respectively. The number of foreign substances (e.g., microparticles) in the original patterned sheet can be measured by P I - 1000 (manufactured by QC Optics, USA). Therefore, the radiation from the X e 2 excimer lamp (U E R - 17 2 manufactured by Usio, Inc.) was irradiated for 60 minutes. After the irradiation, the original pattern sheets are separately fixed to the package. The package has a lowered height of 60 cm and the original patterned sheet is taken out of the package. The material outside the surface of the original pattern sheet is measured by PI - 1 0 0 0. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) · — — — I —丨 — 丨I — 丨I (Please read the notes on the back and fill out this page)
i^J p_ -10- 1269367 A7 「 _一 _^_____ 五、發明說明（8 ) 。表1係顯示輻射前及下降後，外來物質的堆積數目。 表1 比較實施例1 實施例1 實施例2 實施例3 光線遮蔽構件 Μ j \ \\ Cr 100nm Cr lOOnm 鋁 外來物質的數目 照射前 4.6顆/表面 5.2顆/表面 4.3顆/表面 6.2顆/表面 照射後 121顆/表面 7.9顆/表面 7.3顆/表面 12.2顆/表面 由表1可發現，帶有本發明的光線遮蔽構件之光罩保 護膜由於該粘著劑變質而出現一些外來物質的情況，而且 該光罩保護膜對於淸潔光線具有高度耐用性。 經濟部智慧財產局員工消費合作社印製 如上所述，根據本發明該光線遮蔽構件的前提係防止 (1 )將光罩保護膜薄層連結至光罩保護膜框架的粘著劑 變質惡化，該變質係由淸潔光線所導致，（2 )外來物質 堆積係來自於原始圖案薄板的已變質粘著劑，及（3 )光 罩保護膜薄層的剝離。因此，光罩保護膜可令人滿意地維 持一段長的時間。這類粘著劑的防止變質的效果提供明顯 的成果，特別在使用波長2 2 Ο η m或更短的光線加以曝 光之技術時具有效果，這種技術在精細處理過程技術領域 中將變成主流。 在2 0 0 0年6月1日申請的日本專利申請案之全部 揭示內容，包括說明書、申請專利範圍及發明之槪述將完 全地合倂至參考文獻中。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）i^J p_ -10- 1269367 A7 " _一_^_____ V. Description of the invention (8). Table 1 shows the number of foreign substances accumulated before and after the radiation. Table 1 Comparative Example 1 Example 1 Example 2 Example 3 Light shielding member Μ j \ \\ Cr 100nm Cr lOOnm The number of aluminum foreign substances before irradiation 4.6 / surface 5.2 / surface 4.3 / surface 6.2 / after surface irradiation 121 / surface 7.9 / surface 7.3 The particle/surface 12.2/surface can be found in Table 1. The reticle protective film with the light shielding member of the present invention has some foreign substances due to the deterioration of the adhesive, and the reticle protective film is suitable for cleaning light. Highly durable. Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, as described above, the premise of the light shielding member according to the present invention prevents (1) bonding the thin film of the protective film of the mask to the adhesive film frame. The deterioration of the agent is deteriorated, the deterioration is caused by the sleek light, (2) the foreign matter is deposited from the original patterned sheet, and (3) the thin layer of the reticle protective film is peeled off. Protective film Satisfactory for a long period of time. The anti-deterioration effect of this type of adhesive provides significant results, especially when exposed to light with a wavelength of 2 2 η η m or less. In the field of fine processing technology, it will become the mainstream. The entire disclosure of the Japanese Patent Application, filed on Jun. 1, 2000, including the specification, the patent application, In the literature. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm).