TWI269073B - Sprayer, substrate of color filter and mfg. of electroluminescent display device - Google Patents
Sprayer, substrate of color filter and mfg. of electroluminescent display device Download PDFInfo
- Publication number
- TWI269073B TWI269073B TW093129091A TW93129091A TWI269073B TW I269073 B TWI269073 B TW I269073B TW 093129091 A TW093129091 A TW 093129091A TW 93129091 A TW93129091 A TW 93129091A TW I269073 B TWI269073 B TW I269073B
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- TW
- Taiwan
- Prior art keywords
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- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 156
- 239000000463 material Substances 0.000 claims abstract description 161
- 238000007599 discharging Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 49
- 239000011344 liquid material Substances 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 38
- 239000007921 spray Substances 0.000 claims description 10
- 238000005401 electroluminescence Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 abstract description 22
- 238000000576 coating method Methods 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 76
- 238000005192 partition Methods 0.000 description 43
- 239000011159 matrix material Substances 0.000 description 34
- 238000001035 drying Methods 0.000 description 33
- 239000010408 film Substances 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 16
- 239000010409 thin film Substances 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 11
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 10
- 229910052708 sodium Inorganic materials 0.000 description 10
- 239000011734 sodium Substances 0.000 description 10
- 238000004381 surface treatment Methods 0.000 description 9
- 230000032258 transport Effects 0.000 description 8
- 239000008186 active pharmaceutical agent Substances 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 230000005525 hole transport Effects 0.000 description 6
- 238000009832 plasma treatment Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Coating Apparatus (AREA)
- Optical Filters (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Nozzles (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Electroluminescent Light Sources (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Cold Cathode And The Manufacture (AREA)
Abstract
Description
1269073 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於吐出液狀材料之吐出裝置及吐出方法 具體而言,關於彩色濾光片基板或矩陣型顯示裝置等 適於周期性的配置範圍,塗佈液狀材料工程之吐出裝置 及吐出方法。 【先前技術】 眾所周知有使用噴墨裝置,於畫素化範圍塗佈材料 者。例如,有使用噴墨裝置,有於彩色濾光片基板的濾、 光片元素或矩陣型顯示裝置,形成配置呈矩陣狀之發光 部。(例如參考專利文獻1)。 【專利文獻1】日本特開平2003-127343號公報 【發明內容】 【發明開示】 【爲解決發明之課題】 欲塗佈材料之複數被吐出部的間隔,與噴墨裝置的 噴嘴間隔不一致的情形相當多。被吐出部係例如欲設置 濾光片元素之部位。 爲此,於以往的噴墨裝置,爲使2個被吐出部間的 距離,和2個吐出噴嘴間的距離一致,對於排列被吐出 部之方向,使噴墨頭(或排列吐出噴嘴方向)傾斜。但是, 如此的構成中,2個被吐出部間的距離對於每一彩色濾光 -4- 1269073 頭造頭 墨製噴 噴需架 更生托 變產新 生會裝 產,安 會度新 ,角重 片裝和 光安 , 濾頭煩 色噴麻 彩更之 1 變架 每爲托 於。度 ,煩角 時麻頭 同之噴 } 不度應 (2)所角對 有裝的 片安新 之麻煩。 更且,欲吐出於1個被吐出部之材料體積變大時, 對於1個被吐出部之吐出次數會變多。此時,噴嘴間的 吐出量不均,則易於作爲塗佈之不均而被顯現。 本發明係鑑於上述課題,其目的之一係減少被吐出 咅15之塗佈平均。 台乃 平 群 述頭 前噴 於述 對前 和乃 、 徵 台特 平其 備 , 具置 係裝 ,出 1 置吐 ^]裝的 w出群 之吐頭 題之噴 課明之 決發動 解本移 爲對 ί 巨 由第1之噴頭、和第2之噴頭、和第3之噴頭、和第4 之噴頭所成,各別之前述第1之噴頭、前述第2之噴頭 、前述第3之噴頭、及前述第4之噴頭乃具有P個吐出 噴嘴,各別之前述第1之噴頭、前述第2之噴頭、前述 第3之噴頭、及前述第4之噴頭之X軸方向之噴嘴間隔 成爲第1之長度地,配置前述P個之吐出噴嘴,前述第1 之噴頭和前述第2之噴頭乃相互鄰接於Y軸方向,前述 第3之噴頭和前述第4之噴頭乃相互鄰接於前述Y軸方 向。然後,前述第2之噴頭之基準噴嘴之X座標乃對於 從前述第1之噴頭之基準噴嘴之X座標僅偏移第2之長 度的X座標,更且偏移前述第1之長度之1 /2倍。前述 (3) (3)1269073 第4之噴頭之基準噴嘴之X座標乃對於從前述第3之噴 頭之基準噴嘴之X座標僅偏移前述第2之長度的X座標 ,更且偏移前述第1之長度之1/2倍。然後,前述第3 之噴頭之基準噴嘴之前述X座標乃對於從前述第2之噴 頭之基準噴嘴之前述X座標僅偏移前述第2之長度的X 座標,偏移前述第1之長度之1/4倍或3/4倍,前述第2 之長度乃前述第1之長度的P/4倍,P爲2以上之自然數 ,前述X軸方向和Y軸方向乃相互正交。 根據上述特徵,於每一噴頭之噴嘴之位置,即使噴 嘴的液滴吐出量不同,在於由噴頭群吐出之液滴列,不 易顯現吐出量的差異。此乃由於屬於噴頭各種範圍之噴 嘴在於噴頭群中,鄰接於X軸方向之故,因而可消除吐 出量的差。 較好地,於前述各別4個之噴頭,前述P個之噴嘴 乃排列於前述X軸方向。 根據上述特徵,於X軸方向排列之彈著位置,可同 時吐出液滴。 根據上述特徵,於X軸方向排列有複數的噴嘴。爲 此,對於延伸於X軸方向之標的(被吐出部)5由上述複 數噴嘴,可幾近同時地吐出液狀材料。此結果,將爲吐 出液狀材料之驅動信號,對於複數噴嘴可共通。又,由 排列於一方向之複數噴嘴的吐出時間爲同時之故,不需 要爲遲延驅動信號之電路構成等。結果,產生於驅動信 號之波形訛誤之要因變少,爲此,可使用精密的驅動波 -6- (4) 1269073 形5驅動噴頭。 較佳者,乃前述各別4個之噴頭之前述P 皆成爲向前述X軸方向延伸之第1之列和第2 別之前述第1之列及前述第2之列中’前述複 乃以前述第1之長度之2倍間隔加以排列’前 列乃對於前述第2之列,僅前述第1之長度向 方向偏移。 根據上述特徵,可縮小噴頭X軸方向的噴 爲此,可變大噴頭X軸方向的噴嘴線密度。 根據本發明形態,前述各別之4個之噴頭 個噴嘴乃成爲各別向X軸方向延伸之Μ個之列 之前述Μ個之列中,前述Ρ個之噴嘴乃以前述 度之Μ倍之間隔排列,對於前述Μ個之列之一 其他之(Μ-1)個之列乃僅前述第1之長度之i倍 不重覆地向X軸方向偏移,Μ乃2以上之自然婁 i乃1至(Μ-1)之自然數。 根據上述特徵,可更縮小噴頭的X軸方向 隔。爲此,可更加大噴頭的X軸方向的噴嘴線兹 更佳者,乃前述平台乃保持具有被吐出部之 前述噴頭群對於前述基體,向前述Y軸方 動,前述複數噴嘴之至少一個之噴嘴,重疊至 部之範圍時,從前述至少一個之噴嘴,向前述 吐出液狀之材料。 根據上述特徵,可選擇性地將材料塗佈於 之噴嘴乃 之列,各 數之噴嘴 述第1之 前述X軸 嘴間隔。 之前述ρ ,於各別 第1之長 個而言, 之長度, 的噴嘴間 9 pfe ,度。 基體, 向相對移 前述吐出 被吐出部 被吐出部 (5) (5)1269073 根據本發明其他形態,前述被吐出部之平面像乃以 長邊和短邊所決定之幾近矩形,前述平台乃前述長邊之 方向平行於前述X軸方向的同時,前述短邊之方向平行 於前述Y軸方向地,保持前述基體,前述噴頭群經由對 於前述基體,相對移動於前述Y軸方向,在於前述複數 之噴嘴之至少2個之噴嘴,幾近同時入侵至對應於前述 被吐出部之範圍時,從前述至少2個之吐出噴嘴向前述 被吐出部,幾近同時吐出前述液狀之材料。 根據上述特徵,噴頭群於1次相對移動於Y軸方向 之期間內(1次的掃描期間內),必需的體積液狀材料則可 吐出於1個被吐出部。此乃因複數噴嘴對於1個被吐出 部,可同時吐出液狀材料。 然而,本發明可以種種形態實現,例如,可實現彩 色濾光片的製造裝置,或有機電激顯示裝置的製造裝置, 或,電漿顯示裝置的製造裝置等形態。 本發明的吐出方法,包含將具有被吐出部之基體, 載置於平台上之步驟(a)、和各別之X軸方向之噴嘴間隔 成爲第1之長度地,於各別之中,將配置P個之噴嘴的 第1之噴頭、第2之噴頭、第3之噴頭、及第4之噴頭 ’對於前述基體,相對移動於Y軸方向之步驟(b)之吐出 方法,其特徵乃前述步驟(b)乃包含於1個掃瞄期間,將 前述第2之噴頭之基準噴嘴之X座標,對於從前述第1 之噴頭之基準噴嘴之X座標僅偏移第2之長度之X座標 (6) (6)1269073 ,更偏移前述第1之長度之1/2倍,將前述第4之噴頭 之基準噴嘴之X座標,對於從前述第3之噴頭之基準噴 嘴之X座標僅偏移前述第2之長度之X座標,更偏移前 述第1之長度之1 /2倍,將前述第3之噴頭之基準噴嘴 之前述X座標,對於從前述第2之噴頭之基準噴嘴之前 述X座標僅偏移前述第2之長度之X座標,偏移前述第 1之長度之1/4倍或3/4倍地,將前述第1之噴頭、和前 述第2之噴頭、和前述第3之噴頭、和第4之噴頭,對 於前述基體,相對移動於Y軸方向之步驟(bl);前述步 驟(bl)乃包含將前述第1之噴頭及前述第2之噴頭中之一 方,接續於另一方相對移動的同時,將前述第3之噴頭 及前述第4之噴頭中之一方,接續於另一方相對移動之 步驟;前述P乃2以上之自然數,前述第2之長度乃第1 之長度之P/4倍。 根據上述特徵,於每噴頭之噴嘴位置,從噴嘴的液 滴的吐出量不同,於由噴頭群吐出的液滴列中,難以顯 現吐出量的差異。此乃屬於噴頭的各種範圍之噴嘴在於 噴頭群中,鄰接X軸方向之故,可消除吐出量的差異。 較佳者爲前述步驟(b)乃包含將各別具有排列於前述 X軸方.向之前述P個之噴嘴之前述4個噴頭,對於前述 基體,相對移動於前述Y軸方向的步驟(b2)。 更且,較佳地,前述吐出方法,其中,更包含經由 前述步驟(b),前述複數噴嘴之至少一個之噴嘴,入侵至 對應於前述被吐出部之範圍時,從前述至少一個之噴嘴 -9 - (7) (7)1269073 ’於前述被吐出部吐出液狀之材料的步驟(c)。 根據上述特徵,可選擇材料塗佈於被吐出部。 根據本發明其他的形態有包含前述被吐出部之平面 像乃以長邊和短邊所決定之幾近矩形,前述步驟(a)乃前 述被吐出部之長邊之方向平行於前述X軸方向的同時, 前述短邊之方向平行於前述Y軸方向地,載置前述基體 之步驟(al);前述步驟(c)乃更包含前述複數之噴嘴之至 少2個之噴嘴,幾近同時入侵至對應於前述被吐出部之 範圍時,從前述至少2個之吐出噴嘴向前述被吐出部, 幾近同時吐出之步驟(cl)。 根據上述特徵,於1次掃描期間內,必要的體積液 狀材料可吐出至1個被吐出部。此乃複數噴嘴則對於1 個被吐出部,同時吐出液狀的材料之故。 【實施方式】 【爲實施發明之最佳形態】 [實施例1] 以下之中,沿著下述記載的順序,說明本實施例的 吐出裝置及吐出方法。 A.吐出裝置的全體構成 B·托架 C.噴頭 D•噴頭群 E·控制部 -10- (8) (8)1269073 F .吐出方法之一例 (A. fl土出裝置的全體構成) 如桌1 Η所不,吐出裝置1 〇 〇係具備保持液狀材料 111之墨槽101,和輸送管11〇,和藉由輸送管由墨 槽1 0 1供給液狀材料1 1 1之吐出掃描部1 〇 2。吐出掃描部 102係具備保持複數噴頭114(第2圖)之托架1〇3,和控 制托架1 0 3位置之第1位置控制裝置丨04,和保持後述基 體10A之平台106,和控制平台1()6位置之第2位置控 制裝置108,和控制部1 12。墨槽ιοί和托架1〇3之複數 噴頭1 1 4係以輸送管1 1 〇連結,由各別墨槽丨〇丨,向各複 數噴頭1 1 4,使液狀材料1丨丨經由壓縮空氣加以供給。 第1位置控制裝置1 0 4係對應由控制部1 1 2的信號, 將托架1 03沿X軸方向,及正交於X軸方向之z軸方向 移動。更且,第1位置控制裝置1 〇 4,係有以平行於Z 軸旋轉,使托架1 0 3旋轉之機能。本實施例中,z軸方向 係平行於鉛直方向(即重力加速度的方向)。第2位置控制 裝置1 0 8係對應從控制部u 2的信號,沿著正交X軸方 向及Z軸方向的雙方之γ軸方向,移動平台ι〇6。更且, 第2位置控制裝置丨〇 8係有以平行於z軸旋轉,使平台 1 〇6旋轉之機能。然而,本說明書中,將第1位置控制裝 置104及第2位置控制裝置1〇8,表記爲「掃描部」。 平台1 06係具有平行於X軸方向和γ軸方向的雙方 之平面。又,平台1 06係將具有欲塗佈特定的材料之被 -11 - (9) (9)1269073 吐出部之基體,固定或保持於該平面上地加以構成。然 而,本說明書中,將具有被吐出部之基體,表記爲「受 容基板」。 本說明書之X軸方向,γ軸方向,及Z軸方向,係將 托架103及平台的任一方,乃一致於對於另一方而言, 相對移動之方向。又,規定X軸方向,γ軸方向,及2軸 方向之ΧΥΖ座標系的假想原點,係固定於吐出裝置ι〇〇 的基準部份。於本說明書,X座標,γ座標及Ζ座標係如 此的ΧΥΖ座標系之座標。然而,上述假想的原點,不僅 係基準部份,固定平台106亦可,固定於托架103亦可 〇 如上述,托架103係經由第1位置控制裝置1〇4,向 X軸方向移動。另一方面,平台106係經由第2位置控 制手段1 〇 8,向Υ軸方向移動。即,經由第1位置控制 裝置104及第2位置控制裝置1〇8,變化對於平台ι〇6噴 頭1 1 4的相對位置。更具體而言,經由此等的動作,托 架103,噴頭群114G(第2圖),噴頭114,或噴嘴1〗8(第 3圖),係g於定位於平台1 〇 6上之被吐出部,向ζ軸方 向邊保持特定的距離地,相對移動X軸方向及γ軸方向, 即,相對地掃描。於此,對於静止之被吐出部,托架i 〇3 向Y軸方向移動亦可。 然後,托架1 03沿著Y軸方向,移動特定2點間之 期間內,對於静止之被吐出部,由噴嘴1 1 1吐出材料i j j 亦可。 -12- (10) (10)1269073 所謂「相對移動」或「相對掃描」,係包含將吐出 液狀材料1 1 1側,和此等吐出物彈著側(被吐出部側)之至 少一方,對於另一方加以移動者。 更且,托架103,噴頭群114G(第2圖)5噴頭114, 或噴嘴1 18(第3圖)被相對移對,係有改變對於平台1〇6, 基體,或被吐出部之此等相對位置。爲此,本說明書中, 將托架103,噴頭群114G,噴頭114,或噴嘴118對於 吐出位置1 〇〇加以静止,即使僅移動平台丨〇6時,亦表 記托架103,噴頭群114G,噴頭114,或噴嘴118,對於 平台106,基體,或被吐出部而言相對移動。又,有指爲 相對掃描或相對移動,和材料的吐出,和組合,表記爲 「塗佈掃描」。 托架103及平台106係更具有上述以外的平行移動 及回轉的自由度。但是,本實施例中,關於上述自由度 以外的自由度之記載,爲了簡易說明目的而省略。 控制部U 2,係將顯示欲吐出液狀材料丨丨!之相對位 置之吐出資料,由外部資訊處理裝置接受地加以構成。 控制部1 1 2的詳細構成及機能則如後述。 (B.托架) 第2圖係托架103由平台106側觀察之圖,垂直於 第2圖紙面之方向爲Z軸之方向。又,第2圖的紙面的 左右方向爲X軸方向,紙面的上下方向爲Y軸方向。 如第2圖所示,托架1 〇 3係保持具有幾乎各自相同 -13- (11) 1269073 構造之複數噴頭1 1 4。本實施例中,保持於托架1 〇 3 頭1 1 4的數目,係24個。各自的噴頭丨丨4係具有設 後述複數噴嘴1 1 8之底面。各自噴頭1〗4的底面 係具有2個長邊和2個短邊之多角形。如第2圖 噴頭1 1 4的底面係朝向平台1 〇 6側,更且,噴頭j 長邊方向和短邊方向,係各自平行於X軸方向和γ 向。然而,噴頭1 1 4彼此的相對位置關係的詳細說 如後述。 本說明書中,鄰接Y軸方向之4個噴頭114, 爲「噴頭群1 1 4」。根據此表記,第2圖的托架1 〇3 表記爲保持6個噴頭群1 14G。 (C.噴頭) 第3圖係顯示噴頭114的底面。噴頭114係具 列於X軸方向之複數噴嘴1 1 8。此等複數噴嘴1 1 8, 頭1 14的X軸方向之噴嘴間隔HXP配置呈約70μπι 。於此,「噴頭1 14的X軸方向的噴嘴間隔ΗΧΡ」 當於將所有噴頭114之噴嘴118,沿著Υ軸方向, 於X軸上,所獲得複數噴嘴像間的間隔。 本實施例中,噴頭1 1 4之複數噴嘴1 1 8,皆呈延 X軸方向之噴嘴列1 1 6 A,和噴嘴列1 1 6 Β。噴嘴列: 噴嘴列1 1 6B係排列於Y軸方向。然後,各自於噴 1 1 6 A及噴嘴列〗1 6 B,9 0個噴嘴Π 8於一定間隔, 軸方向排列成一列。本實施例中,此一疋間隔係約 之噴 置如 形狀, 所示, 14的 軸方 明則 表記 係可 有排 係噴 所成 係相 射像 伸於 ί 1 6A, 嘴列 向X 4 0 μ m -14- (12) (12)1269073 。即,噴嘴列1 1 6A的噴嘴間隔LPN及噴嘴列1 1 6B的噴 嘴間隔LPN係約140μηι。 噴嘴列116Β的位置,係對於噴嘴列ιι6Α的位置而 言,僅噴嘴間隔LNP的一半長度(約70μηι),向X軸方向 的正方向(圖3之右方向)偏移。爲此,噴頭1 14的X軸 方向噴嘴間隔ΗΧΡ係噴嘴列116Α(或噴嘴列116Β)的噴 嘴間隔L Ν Ρ的一半長度(約7 0 μ m)。 因此,噴頭1 1 4的X軸方向的噴嘴線密度,係噴嘴 列1 16A(或噴嘴列1 16B)的噴嘴線密度的2倍。然而,於 本說明書,所謂「X軸方向的噴嘴線密度」,係相當於 複數噴嘴沿著Y軸方向,射像於X軸上,所獲得複數噴 嘴像的單位長的數。 當然,包含噴頭1 1 4之噴嘴列數,係未限定於2個 。噴頭1 14係包含Μ個噴嘴列亦可。於此,Μ係1以上 的自然數。此時,於各Μ個噴嘴列,複數噴嘴1 1 8係以 噴嘴間隔ΗΧΡ的Μ倍長度間隔排列。更且,Μ係2以上 的自然數時,對於Μ個噴嘴列的一個,其他(Μ — 1 )個的 噴嘴列,係無重覆噴嘴間隔ΗΧΡ的i倍長度,向偏移X 軸方向。於此,i係1至(Μ - 1 )的自然數。 更且,各自噴嘴列1 16Α及噴嘴列1 16Β係由90個噴 嘴所成之故,1個噴頭1 1 4係具有1 8 0個的噴嘴。但是, 各噴嘴列1 1 6 Α的兩端之5噴嘴係設定作爲「休止噴嘴」 。同樣地,亦將噴嘴列1】6B的兩端之5噴嘴設定作爲「 休止噴嘴」。然後,由此等2 〇個「休止噴嘴」不吐出液 -15- (13) (13)1269073 狀材料 1 1 1。爲此,噴頭 11 4之1 8 0個的噴嘴1 1 8中, 1 60個噴嘴1 1 8作爲吐出液狀材料1 1 1加以工作。本說明 書中,將此等160個的噴嘴1 18表記爲「吐出噴嘴」。 然而,1個噴頭1 1 4之噴嘴1 1 8的數目係並未限定於 180個,。於1個噴嘴1 14設置3 60個噴嘴亦可。此時, 各噴嘴列116Α及116Β,由180個噴嘴118所成即可。 又,於本發明,吐出噴嘴列的數目,係未限定於1 60個 。於1個噴嘴1 14,爲?個吐出噴嘴亦可。於此,?係2 以上的自然數,爲噴頭1 14之全噴嘴數以下即可。 本說明書中,以說明噴頭1 1 4彼此相對位置關係爲 目的,包含於噴嘴列1 16Α之90個的噴嘴1 18中,由左 邊第6號的噴嘴1 1 8則表記爲噴頭1 14的「基準噴嘴 118R」。即,噴嘴列116Α之80個的吐出噴嘴中,最左 側吐出噴嘴爲噴頭1 1 4的「基準噴嘴1 1 8 R」。然而,對 於所有的噴頭1 1 4, 「基準噴嘴1 1 8 R」的指定方向爲相 同的話亦可,「基準噴嘴1 1 8 R」的位置,非上記位置亦 可 ° 如第4(a)及(b)圖所示,各噴頭114係噴墨頭。更具 體而言,各噴墨頭1 1 4係具備振動板1 2 6,和噴嘴板1 2 8 。振動板1 2 6和噴嘴板1 2 6間,由墨槽1 0 1藉由孔1 3 1 供給液狀材料1 1 1,則位有經常塡充液貯留處1 29。 又,振動板126和噴嘴板128間,位有複數間隔壁 122。然後5經由振動板126,和噴嘴板128,和〗對間 隔壁]22包圍部份,爲腔室120。腔室120係對應噴嘴 -16- (14) (14)1269073 118加以設置,腔室U0的數目和噴嘴U8的數目爲相同 。於腔室丨2〇,藉由位於1對間隔壁1S2間之供給口 13 0,由液貯留處129供給液狀的材料u j。 振動板丨26上,各對應腔室120,位於振動子ι24。 振動子124係包含挟持壓電元件l24c,和壓電元件i24C 之一對電極124A,U4B。於此:[對電極ι24α,ι24Β間, 給與驅動電壓,由對應噴嘴1 1 8吐出液狀材料1丨丨。然而 ,由噴嘴1 1 8於Z軸方向,吐出液狀材料,調整噴嘴i 1 8 的形狀。 於此,於本說明書所謂「液狀的材料」,係具有由 噴嘴吐出粘度之材料。此時,材料不論及其爲水性或油 性。具備可吐出噴嘴之流動性(粘度)即可,混入固體物暂 時,就全體而言,爲流動性即可。 控制部112(第1圖)係於各複數振動子124,給予相 互獨立信號地加以構成亦可。即,由噴嘴i丨8吐出材料 1 1 1的體積,對應控制部1 1 2之信號,於每一噴嘴i〗8加 以控制亦可。如此之時,由各噴嘴1 1 8吐出的材料丨1 j 的體積,係於Opl〜42(pico升)間變化。又,控制部112 係如後述,設定可於塗佈掃描間,進行吐出動作之噴嘴 1 1 8,和未進行吐出動作之噴嘴丨丨8。 本說明書中,將包含對應1個噴嘴1 1 8 5和對應於噴 嘴之托架1 2 0,和對應托架1 2 0之振動子1 2 4之部份,表 記爲「吐出部1 2 7」。根據此表記,1個噴頭1 I 4係具有 與噴嘴1 1 8數目相同的數之吐出部1 2 7。吐出部1 2 7係具 -17- (15) (15)1269073 有代替壓電元件之電性熱變換元件。即,吐出部127係 具有經由電性熱變換元件利用材料的熱膨脹,吐出材料 之構成亦可。 (D.噴頭群) 其次,說明噴頭群1 1 4G之4個噴頭1 1 4的相對位置 關係。第5圖中,於第2圖的托架〗03,顯示鄰接γ軸 方向之2個噴頭群1 1 4 G ° 如第5圖所示,各噴頭群1 1 4 G係由4個噴頭1 1 4所 成。然後,噴頭群1 I4的X軸方向的噴嘴間隔GXP,係 成爲噴頭1 14的X軸方向噴嘴間隔HXP的1 Μ倍長地5 於噴頭群1 1 4 5配置4個噴頭1 14。本實施例中,噴頭 的X軸方向噴嘴間隔ΗΧΡ約 之故5噴頭群 1 14G的X軸方向噴嘴間隔GXP,係該1/4倍之約1 7.5μπι 。於此,「噴頭群1 1 4 G的X軸方向噴嘴間隔G Χ Ρ」, 係相當於將所有噴頭群Π 4 G之噴嘴1 1 8,沿著Υ軸方向 ,射像於X軸上,獲得複數噴嘴像間的間隔。 當然,包含噴頭群1 1 4 G之噴頭1 1 4的數目,係未限 定4個。噴頭群1 1 4 G即使由N個噴頭1 1 4所成亦可。 於此5 N係2以上的自然數。此時,噴嘴間隔GXP係成 爲噴嘴間隔HXP的1/N倍長地,於噴頭群1 1 4G,配置N 個噴頭〗1 4亦可。 在以下中,將本實施例的噴頭11 4的相對位置關係 更具體地說明。 -18- (16) (16)1269073 首先,以平易方式說明爲目的,將包含第5圖左上 的噴頭群1 1 4 G之4個噴頭1 1 4,由上各表記爲噴頭 1141,噴頭1142,噴頭1143,噴頭1144。同樣地,將第 5圖右下的噴頭群114G之4個噴頭114,由上各表記爲 噴頭1145,噴頭1146,噴頭1丨47,噴頭1148。 然後,將噴頭1 1 4 1之噴嘴列1 1 6 A,1 1 6 B,表記爲噴 嘴列1 A,1 B,將噴頭1 1 4 2之噴嘴列1 1 6 A,1 1 6 B,表記 爲噴嘴列2A5 2B,將噴嘴1 143之噴嘴列1 16A,1 16B表 記爲噴嘴列3 A,3 B,將噴頭1 1 4 4之噴嘴列1 1 6 A,1 1 6 B 表記爲噴嘴列4 A,4 B。同樣地,將噴頭1 1 4 5之噴嘴列 116A,116B表記爲噴嘴列5A,5B,將噴頭1146之噴嘴 列1 1 6 A,1 1 6 B表記爲噴嘴列6 A,6 B,將噴頭1 1 4 7之噴 嘴列116A,116B表記爲噴嘴列7A,7B5將噴頭1W8之噴 嘴列1 16A,1 16B,表記爲噴嘴列8A,8B。 此等各噴嘴列1 A〜8 B實際上由9 0個噴嘴1 1 8所成。 然後,如上述,於各噴嘴列1 A〜8 B,此等9 0個噴嘴係排 列於X軸方向。但是,第5圖中,爲了說明上的方便5 各噴嘴列1A〜8B由4個吐出噴嘴(噴嘴118)所成。更且, 第5圖中,噴嘴列1A的最左噴嘴1 1 8爲噴頭1 141的基 準噴嘴1 1 8R,噴嘴列2A最左噴嘴1 1 8爲噴頭1 142基準 晴嘴1 1 8 R,噴嘴列3 A最左噴嘴1 1 8爲噴頭1 1 4 3的基準 噴嘴1 1 8R,噴嘴列4A最左的噴嘴列1 1 8爲噴頭1 144基 準噴嘴118R,噴嘴列5A最左噴嘴118爲噴頭1145基準 噴嘴1 1 8R。 -19- (17) (17)1269073 本實施例中,將噴頭1 14的X軸方向噴嘴間隔HXP, 和噴頭1 1 4之吐出噴嘴數之積,表記爲「噴頭有效長hl 」。第5圖的例子中,噴嘴間隔HXP爲70μπι之同時, 吐出噴嘴的數爲8之故,噴頭有效長H L爲5 6 0 μ m。又, 本實施例中,1個噴頭1 14由連續4個副範圍S R所成。 各副範圍SR的X軸方向的長度DL,係噴頭有效長HL 的1 /4倍。以下中,說明的便利上,將噴頭1 14的4個 副範圍S R,朝向X軸方向的正方向(圖面右),表記爲副 範圍 SRI,SR2,SR3,SR4。 根據以上的表記,各噴頭114的基準噴嘴U8R的X 座標係如以下表現。 噴頭1 142的基準噴嘴1 18R的X座標,係對應僅偏 移由噴頭1141的基準噴嘴118R的X座標長度之X座標, 更偏移噴嘴間隔ΗΧΡ的1/2倍。第5圖的例子中,噴嘴 1 1 4 2的基準噴嘴1 1 8 R的X座標,係對於噴頭1 1 4 1的基 準噴嘴1 18R的X座標,長度DL中,僅向X軸方向的正 方向(第5圖中的右方向),偏移增加噴嘴間隔ΗΧΡ的1/2 倍長度,。 噴頭1 1 44的基準噴嘴1 1 8R的X座標,係對於僅偏 移噴頭1143的基準噴嘴11811的X座標長度DL之X座 標,更偏移噴嘴間隔HXP的1 /2倍。第5圖的例子中, 噴頭1 1 4 4的基準噴嘴1 1 8 R的X座標,係對於噴頭1 1 4 3 的基準噴嘴1 1 8 R的X座標,長度D L中,僅向X軸方向 的正方向(第5圖的右方向)’偏移增加噴嘴間隔H Xp的 -20- (18) 1269073 1/2倍長度。 噴頭1 143的基準噴嘴1 18R的X座標5 移噴頭1 1 4 2的基準噴嘴1 1 8 R的X座標長度 標,更偏移噴嘴間隔HXP的1/4倍或3/4倍 例子中,噴頭143的基準噴嘴1 1 8R的位置, 1 1 4 3的基準噴嘴1 1 8 R之X座標,僅向X軺 向(第5圖的右方向),偏移由長度Dl除上噴 的1/2倍之長度,。然而,「偏移X軸方向」 不僅包含向X軸方向的正方向偏移,亦包含 的負方向偏移。 又,本實施例中,朝向Y軸方向的負方 方向),噴頭1141,1142,1143,1144依順序 向Y軸方向排列之此等4個噴頭1 14的順序 例的順序亦可。具體而言,噴頭1 1 4 1和噴頭 鄰接於Y軸方向之同時,噴頭1143和噴頭 接於Υ軸方向時,任何排列皆可。 第5圖右下噴頭群U4G之噴頭1145, 1148的配置,即架構上與噴頭1141,1142,1: 配置相同。 將相互鄰接於X軸方向之2個噴頭群1 位置關係,根據噴頭1 1 4 5和噴頭1 I 4 1間的 係,進行說明。 噴頭1 1 4 5的基準噴嘴1 1 8 R的X座標, 的基準噴嘴1 1 8 R的X座標;僅向噴頭1 1 4 | 係對於僅偏 DL之X座 。第5圖的 係對於噴頭 丨方向的正方 嘴間隔ΗΧΡ 的記載,係 向X軸方向 向(圖面的下 排列。但是, ,非本實施 ί 1 142相互 1 144相互鄰 1146, 1147, 143,1 144 的 1 4間的相對 相對位置關 由噴頭1 1 4 1 的X軸方向 -21 - (19) (19)1269073 的噴嘴間隔HXP,和噴頭114之吐出噴嘴數之積的長度 之X軸方向的正方向偏移。本實施例中,噴嘴間隔HXP 係約70 μιη之同時,1個噴頭之吐出噴嘴的數目,係160 個之故,噴頭1 4 5的基準噴嘴11 8 R的X座標,係由噴頭 1141的基準噴嘴U8R的X座標,僅向X軸方向之正方 向偏移11·2Γηιη(70μΓηχ160)。但是,第5圖中,爲說明上 之方便,噴頭1 1 4 1之吐出噴嘴數係8個之故,噴頭1 1 4 5 的基準噴嘴1 18R的X座標,則描繪成由噴頭1 141的基準 噴嘴1 141的X座標,僅偏移5 60μιη(70μπιχ8)。 噴頭1 1 4 1和噴頭1 1 4 5配置如上述之故,噴嘴列1 A 的最右吐出噴嘴之X座標,和噴嘴列5 A最左吐出噴嘴之 X座標,係僅偏移噴嘴間隔LNP。爲此,2個噴頭U4G 的整體X軸方向的噴嘴間隔爲噴頭1 1 4之X軸方向之噴 嘴間隔HXP的1/4倍。 作爲托架1 03的整體之X軸方向的噴嘴間隔亦爲 1 7.5 μιη5即,爲成爲噴嘴114的X軸方向的噴嘴間隔 ΗΧΡ的1/4倍長度,配置6個噴頭群114G。 然而,本說明書中,將噴頭1Μ1,噴頭1144,噴頭 1 1 4 5等,1個噴頭群1 1 4 G之兩端的噴頭1 1 4 4表記爲「 基準噴頭」。 本實施例中,將於沿著X軸方向1之噴嘴間隔ΗΧΡ 的長度範圍內,收入4個噴嘴1 1 8的X軸座標部份,表 記爲重疊部G(第5圖中G1〜G 7)。例如,於第5圖:於重 疊部G 1,包含噴嘴列1 Α最右的噴嘴1 1 8,和自噴嘴列 -22- (20) (20)1269073 2A之右側第3個的噴嘴1 1 8,和自噴嘴列3 A左側第2個 噴嘴1 1 8,和噴嘴列4A最左的噴嘴1 1 8。同樣地,於重 疊部G 2,包含噴嘴列1 B最右的噴嘴11 8,和自噴嘴列 2B右側第2個的噴嘴1 1 8,和自噴嘴列3 B左側第2個噴 嘴1 1 8,和噴嘴列4 B最左的噴嘴1 1 8。又,重疊部G 3, 包含噴嘴列2 A最右的噴嘴1 1 8,和噴嘴列3 A最右的噴 嘴1 1 8,和噴嘴列4 A最右的噴嘴1 1 8,和噴嘴列5 A最左 的噴嘴1 1 8。 根據本實施例的噴頭配置,於重疊部G 1〜G 7的任一 個,包含附屬副範圍S R 1之噴嘴1 1 8,和附屬副範圍S R2 之噴嘴1 1 8 ,和附屬副範圍S R 3之噴嘴1 1 8,和附屬副範 圍S R4之噴嘴1 1 8。但是,包含於1個重疊部(例如重疊 部G1)之副範圍SR1的噴嘴數,和副範圍SR2的噴嘴數, 和副範圍SR3的噴嘴數,和副範圍SR4的噴嘴數係相同 。例如,第5圖中,於重疊部G1,包含副範圍SR4的附 屬噴嘴1 1 8,和附屬副範圍SR3之噴嘴1 1 8,和附屬副範 圍SR2之噴嘴1 1 8,和附屬副範圍SR1之噴嘴1 1 8則各 含有1個。[Technical Field] The present invention relates to a discharge device and a discharge method for discharging a liquid material, and more particularly to a color filter substrate or a matrix display device, which is suitable for periodicity. The scope of the configuration, the discharge device for discharging the liquid material project, and the discharge method. [Prior Art] It is known that an inkjet device is used to coat a material in a pixelization range. For example, there is a filter, a light sheet element or a matrix type display device using an ink jet device, a color filter substrate, and a light-emitting portion arranged in a matrix. (For example, refer to Patent Document 1). [Explanation of the Invention] [Invention of the Invention] [In order to solve the problem of the invention] The interval between the plurality of portions to be coated of the material to be coated is different from the nozzle interval of the ink jet device. very much. The portion to be spouted is, for example, a portion where a filter element is to be provided. Therefore, in the conventional inkjet apparatus, in order to make the distance between the two discharged portions coincide with the distance between the two discharge nozzles, the ink jet head (or the discharge nozzle direction) is arranged in the direction in which the discharge portion is arranged. tilt. However, in such a configuration, the distance between the two spouted parts is more suitable for each color filter -4- 1269073 head-head ink-spraying spray-removing spray, and the new degree will be installed. The film pack and the light security, the filter head is troublesome, and the spray rack is even more. Degree, trouble when the head of the same head with the spray } not to respond (2) the corner of the pair of installed pieces of new trouble. Further, when the volume of the material to be discharged from one of the spouted portions is increased, the number of discharges to one spouted portion is increased. At this time, when the discharge amount between the nozzles is uneven, it is easy to be revealed as unevenness in coating. The present invention has been made in view of the above problems, and an object thereof is to reduce the coating average of the discharged crucible 15. Before the Tai Nai Ping group, it was sprayed on the front and the other, and the Taiping Teping prepared it, and it was equipped with a tie, and the 1 set of spit ^] For the first nozzle, the second nozzle, the third nozzle, and the fourth nozzle, each of the first nozzle, the second nozzle, and the third nozzle And the fourth nozzle has a P discharge nozzle, and the nozzle spacing in the X-axis direction of each of the first nozzle, the second nozzle, the third nozzle, and the fourth nozzle is the same. The P nozzles are disposed in a length of one, and the first nozzle and the second nozzle are adjacent to each other in the Y-axis direction, and the third nozzle and the fourth nozzle are adjacent to each other in the Y-axis. direction. Then, the X coordinate of the reference nozzle of the second nozzle is shifted to the X coordinate of the second length from the X coordinate of the reference nozzle of the first nozzle, and is further shifted by 1 of the length of the first 2 times. The X coordinate of the reference nozzle of the fourth nozzle of the above (3) (3) 1269073 is offset from the X coordinate of the second length from the X coordinate of the reference nozzle of the third nozzle, and is further offset by the foregoing 1/2 times the length of 1. Then, the X coordinate of the reference nozzle of the third nozzle is offset from the X coordinate of the second length from the X coordinate of the reference nozzle of the second nozzle, and is shifted by 1 of the length of the first /4 times or 3/4 times, the second length is P/4 times the length of the first length, P is a natural number of 2 or more, and the X-axis direction and the Y-axis direction are orthogonal to each other. According to the above feature, even if the droplet discharge amount of the nozzle is different at the position of the nozzle of each head, the difference in the discharge amount is less likely to occur in the droplet array discharged from the head group. This is because the nozzles belonging to various ranges of the head are in the nozzle group and are adjacent to the X-axis direction, so that the difference in the discharge amount can be eliminated. Preferably, in each of the four nozzles, the P nozzles are arranged in the X-axis direction. According to the above feature, the ejection position arranged in the X-axis direction can simultaneously eject the liquid droplets. According to the above feature, a plurality of nozzles are arranged in the X-axis direction. For this reason, the liquid material can be discharged almost simultaneously from the above-mentioned plurality of nozzles for the target (discharged portion) 5 extending in the X-axis direction. This result will be the drive signal for the discharge of the liquid material, which is common to the multiple nozzles. Further, since the discharge time of the plurality of nozzles arranged in one direction is simultaneous, it is not necessary to constitute a circuit for delaying the drive signal. As a result, the cause of the waveform error caused by the drive signal is reduced, and for this purpose, a precision drive wave -6-(4) 1269073-shaped 5 drive head can be used. Preferably, the P of each of the four nozzles is the first row extending in the X-axis direction and the second column and the second column. The first length is doubled at intervals of two. The front row is the second row, and only the first length is shifted in the direction. According to the above feature, it is possible to reduce the spray in the X-axis direction of the head in order to change the nozzle line density in the X-axis direction of the large head. According to the aspect of the invention, the nozzles of the four nozzles are each of the plurality of nozzles extending in the X-axis direction, and the nozzles of the plurality of nozzles are twice as long as the aforementioned ones. In the interval arrangement, one of the other ones (Μ-1) is only offset by the i-th dimension of the first length, and is shifted to the X-axis direction. It is the natural number of 1 to (Μ-1). According to the above feature, the X-axis direction of the head can be further reduced. For this reason, it is preferable that the nozzle line in the X-axis direction of the nozzle is more large, and the stage is such that the head group having the discharge portion holds the base body toward the Y-axis, and at least one of the plurality of nozzles When the nozzle is overlapped to the range of the portion, the liquid material is discharged from the at least one nozzle. According to the above feature, the material can be selectively applied to the nozzles, and the nozzles of the first plurality are spaced apart from each other by the first X-axis nozzle. The above ρ is the length of each of the first lengths, 9 pfe between the nozzles. According to another aspect of the present invention, the planar image of the spouted portion is a rectangular shape determined by a long side and a short side, and the platform is The direction of the long side is parallel to the X-axis direction, and the direction of the short side is parallel to the Y-axis direction, and the base body is held. The head group is relatively moved in the Y-axis direction with respect to the base body, and is in the plural When at least two nozzles of the nozzles invade the range corresponding to the discharged portion, the liquid material is discharged from the discharge nozzles to the discharge portion. According to the above feature, in the period in which the head group is relatively moved in the Y-axis direction (within one scanning period), the necessary volume of liquid material can be discharged to one of the discharged portions. This is because the plurality of nozzles can simultaneously eject the liquid material for one spouted portion. However, the present invention can be realized in various forms, for example, a device for manufacturing a color filter, a device for manufacturing an organic electro-optic display device, or a device for manufacturing a plasma display device. In the discharge method of the present invention, the step (a) of placing the substrate having the discharged portion on the stage and the nozzle interval in the respective X-axis directions are the first length, and in each case, The discharge method of the step (b) in which the first nozzle, the second nozzle, the third nozzle, and the fourth nozzle of the P nozzles are moved relative to the substrate in the Y-axis direction is characterized by the foregoing Step (b) is included in one scanning period, and the X coordinate of the reference nozzle of the second nozzle is shifted from the X coordinate of the second length to the X coordinate of the reference nozzle of the first nozzle ( 6) (6) 1269073, which is further shifted by 1/2 times the length of the first one, and the X coordinate of the reference nozzle of the fourth nozzle is offset only from the X coordinate of the reference nozzle of the third nozzle. The X coordinate of the second length is further shifted by 1 / 2 times the length of the first one, and the X coordinate of the reference nozzle of the third nozzle is the X of the reference nozzle from the second nozzle The coordinates are only offset by the X coordinate of the length of the second, offset by 1/4 or 3/4 of the length of the first The first nozzle, the second nozzle, the third nozzle, and the fourth nozzle are relatively moved in the Y-axis direction (bl) with respect to the substrate; the foregoing step (bl) The method further comprises: moving one of the first nozzle and the second nozzle to the other side, and simultaneously moving one of the third nozzle and the fourth nozzle to the other side. Step; the P is a natural number of 2 or more, and the length of the second is P/4 times the length of the first. According to the above feature, the discharge amount of the liquid droplets from the nozzle is different at the nozzle position of each head, and it is difficult to show the difference in the discharge amount in the droplet array discharged from the head group. This is a nozzle of various ranges belonging to the head in the nozzle group, which is adjacent to the X-axis direction, and can eliminate the difference in the amount of discharge. Preferably, the step (b) includes the step of separately moving the four nozzles arranged in the X-axis to the P nozzles, and moving the substrate relative to the Y-axis direction (b2) ). Furthermore, preferably, the discharging method further includes, via the step (b), at least one of the nozzles of the plurality of nozzles invades to a range corresponding to the portion to be discharged, from the at least one nozzle- 9 - (7) (7) 1269073 "Step (c) of discharging the liquid material in the spouted portion. According to the above feature, the selectable material is applied to the spouted portion. According to another aspect of the present invention, the planar image including the spouted portion has a nearly rectangular shape determined by a long side and a short side, and the step (a) is a direction in which the long side of the spouted portion is parallel to the X-axis direction. At the same time, the direction of the short side is parallel to the Y-axis direction, and the step (al) of placing the substrate; the step (c) further includes at least two nozzles of the plurality of nozzles When it corresponds to the range of the spouted portion, the step (cl) is discharged from the at least two discharge nozzles to the spouted portion. According to the above feature, the necessary volume of the liquid material can be discharged to one of the discharged portions during one scanning period. In this case, the plurality of nozzles discharge a liquid material for one of the discharged portions. [Embodiment] [Best Mode for Carrying Out the Invention] [Embodiment 1] Hereinafter, a discharge device and a discharge method of the present embodiment will be described in the order described below. A. The whole configuration of the discharge device B. The carriage C. The nozzle D • The nozzle group E and the control unit-10- (8) (8) 1269073 F. An example of the discharge method (the overall configuration of the A. fl earth removal device) The table 1 is not provided, and the discharge device 1 is provided with an ink tank 101 for holding the liquid material 111, and a transfer tube 11A, and a discharge scan for supplying the liquid material 1 1 1 from the ink tank 1 0 1 through the transfer tube. Department 1 〇 2. The discharge scanning unit 102 includes a holder 1〇3 for holding the plurality of heads 114 (second drawing), a first position control device 丨04 for controlling the position of the cradle 110, and a stage 106 for holding the base 10A to be described later, and control The second position control device 108 at the position of the platform 1 () 6 and the control unit 112. The plurality of nozzles 1 1 4 of the ink tank ιοί and the bracket 1〇4 are connected by the conveying pipe 1 1 ,, and the respective ink nozzles 向, to the respective plurality of nozzles 1 1 4, the liquid material 1丨丨 is compressed. Air is supplied. The first position control device 104 moves the carriage 103 in the X-axis direction and the z-axis direction orthogonal to the X-axis direction in response to the signal from the control unit 1 1 2 . Further, the first position control device 1 〇 4 has a function of rotating the carriage 1 0 3 by rotating in parallel with the Z axis. In this embodiment, the z-axis direction is parallel to the vertical direction (i.e., the direction of gravitational acceleration). The second position control device 1 0 8 moves the stage ι 6 in accordance with the signal from the control unit u 2 in the γ-axis direction of both the orthogonal X-axis direction and the Z-axis direction. Further, the second position control device 丨〇 8 has a function of rotating the platform 1 〇 6 in parallel with the z-axis. However, in the present specification, the first position control device 104 and the second position control device 1A are referred to as "scanning portions". The platform 106 has a plane parallel to both the X-axis direction and the γ-axis direction. Further, the platform 106 is formed by fixing or holding the substrate of the discharge portion of the -11 - (9) (9) 1269073 which is to be coated with a specific material. However, in the present specification, the substrate having the discharge portion is referred to as a "receptive substrate". In the X-axis direction, the γ-axis direction, and the Z-axis direction of the present specification, either one of the bracket 103 and the platform is aligned with the other direction of relative movement. Further, the virtual origin of the coordinate system in the X-axis direction, the γ-axis direction, and the 2-axis direction is fixed to the reference portion of the discharge device ι. In this specification, the coordinates of the X coordinate, the γ coordinate and the Ζ coordinate system are the coordinates of the ΧΥΖ coordinate system. However, the imaginary origin is not only the reference portion, but also the fixed platform 106. The bracket 103 may be fixed to the bracket 103 as described above, and the bracket 103 is moved in the X-axis direction via the first position control device 1〇4. . On the other hand, the stage 106 is moved in the x-axis direction via the second position control means 1 〇8. In other words, the relative position of the nozzle 1 1 4 to the stage 〇6 is changed via the first position control device 104 and the second position control device 1〇8. More specifically, via these operations, the carriage 103, the head group 114G (Fig. 2), the head 114, or the nozzle 1 8 (Fig. 3) are attached to the platform 1 〇6. The discharge portion is relatively scanned in the X-axis direction and the γ-axis direction while maintaining a specific distance in the z-axis direction. Here, the bracket i 〇3 may be moved in the Y-axis direction with respect to the stationary discharge portion. Then, in the period in which the carriage 103 moves between the two points in the Y-axis direction, the material i j j may be ejected from the nozzle 1 1 1 during the stationary discharge portion. -12- (10) (10) 1269073 The "relative movement" or "relative scanning" includes at least one side of the discharge liquid material 11 1 side and the discharge side (the discharge side). For the other party to move. Moreover, the carriage 103, the head group 114G (Fig. 2) 5 head 114, or the nozzle 1 18 (Fig. 3) are relatively moved, and are changed for the platform 1〇6, the base body, or the spouted portion. Wait for relative position. Therefore, in the present specification, the tray 103, the head group 114G, the head 114, or the nozzle 118 is stationary with respect to the discharge position 1 ,, and even when only the stage 丨〇6 is moved, the tray 103 and the head group 114G are also indicated. The showerhead 114, or nozzle 118, moves relatively relative to the platform 106, the substrate, or the spewed portion. Further, there are indications of relative scanning or relative movement, and discharge and combination of materials, and are referred to as "coating scanning". The bracket 103 and the platform 106 have more freedom of parallel movement and rotation than the above. However, in the present embodiment, the description of the degrees of freedom other than the above-described degrees of freedom is omitted for the sake of simplicity of explanation. The control unit U 2 will display the liquid material to be discharged! The spitting data of the relative position is configured by an external information processing device. The detailed configuration and function of the control unit 1 1 2 will be described later. (B. Bracket) Fig. 2 is a view of the bracket 103 viewed from the side of the stage 106, and the direction perpendicular to the second drawing plane is the direction of the Z-axis. Further, the left-right direction of the paper surface in Fig. 2 is the X-axis direction, and the vertical direction of the paper surface is the Y-axis direction. As shown in Fig. 2, the carriage 1 〇 3 holds a plurality of nozzles 1 1 4 having configurations of almost the same -13-(11) 1269073. In the present embodiment, the number of the heads 1 1 4 held in the bracket 1 , 3 is 24 pieces. Each of the nozzles 4 has a bottom surface of a plurality of nozzles 1 1 8 described later. The bottom surface of each nozzle 1 is a polygonal shape having two long sides and two short sides. As shown in Fig. 2, the bottom surface of the head 1 1 4 faces the platform 1 〇 6 side, and the longitudinal direction and the short side direction of the head j are parallel to the X-axis direction and the γ direction, respectively. However, the details of the relative positional relationship between the heads 1 14 and 4 will be described later. In the present specification, the four heads 114 adjacent to the Y-axis direction are "head group 1 1 4". According to this expression, the bracket 1 〇3 of Fig. 2 is denoted as holding six nozzle groups 1 14G. (C. Nozzle) Fig. 3 shows the bottom surface of the head 114. The head 114 is provided with a plurality of nozzles 1 1 8 listed in the X-axis direction. The nozzles HXP of the plurality of nozzles 1 18 and the heads 1 14 in the X-axis direction are disposed at about 70 μm. Here, the "nozzle interval X in the X-axis direction of the head 1 14" is obtained by dividing the nozzles 118 of all the heads 114 along the x-axis direction on the X-axis to obtain the interval between the plurality of nozzle images. In this embodiment, the plurality of nozzles 1 1 8 of the nozzles 1 14 are both nozzle rows 1 1 6 A extending in the X-axis direction, and nozzle rows 1 1 6 Β. Nozzle row: Nozzle row 1 1 6B is arranged in the Y-axis direction. Then, each of the spray nozzles 1 1 6 A and the nozzle rows 〖1 6 B, 90 nozzles Π 8 are arranged at a certain interval in the axial direction. In this embodiment, the spacing of the 疋 is about the shape of the spray, and the axis of the 14 is indicated by the ray spray system. The image of the ray is extended to ί 1 6A, and the mouth is aligned to X 4 0 μ. m -14- (12) (12)1269073. That is, the nozzle interval LPN of the nozzle row 1 16A and the nozzle interval LPN of the nozzle row 1 16B are about 140 μm. The position of the nozzle row 116A is a half-length (about 70 μm) of the nozzle interval LNP with respect to the position of the nozzle row 116 ,, and is shifted in the positive direction (the right direction in Fig. 3) in the X-axis direction. To this end, the nozzles in the X-axis direction of the head 1 14 are spaced apart by half the length (about 70 μm) of the nozzle spacing L Ν 喷嘴 of the nozzle row 116 Α (or the nozzle row 116 Β). Therefore, the nozzle line density in the X-axis direction of the head 1 14 is twice the nozzle line density of the nozzle row 1 16A (or the nozzle row 1 16B). However, in the present specification, the "nozzle line density in the X-axis direction" corresponds to the number of unit lengths of the plurality of nozzle images obtained by the plurality of nozzles on the X-axis in the Y-axis direction. Of course, the number of nozzle rows including the nozzles 1 14 is not limited to two. The nozzle 1 14 may include one nozzle row. Here, the 自然 is a natural number of 1 or more. At this time, in each of the nozzle rows, the plurality of nozzles 1 18 are arranged at intervals of a length of the nozzle interval Μ. Further, in the case of a natural number of 2 or more, for one nozzle row, the other (Μ - 1) nozzle rows are not i times longer than the overlap nozzle interval ,, and are shifted in the X-axis direction. Here, i is a natural number of 1 to (Μ - 1 ). Further, each of the nozzle rows 1 16 Α and the nozzle rows 1 16 由 is formed by 90 nozzles, and one nozzle 1 14 has 190 nozzles. However, the five nozzles at both ends of each nozzle row 1 16 Α are set as "resting nozzles". Similarly, the five nozzles at both ends of the nozzle row 1 6B are also set as "resting nozzles". Then, wait for 2 "stop nozzles" to discharge liquid -15- (13) (13) 1269073 material 1 1 1. For this purpose, among the nozzles 1 1 8 of the nozzles 112, 1 60 nozzles 1 18 are operated as the discharge liquid material 1 1 1 . In the present specification, the 160 nozzles 18 are denoted as "discharge nozzles". However, the number of nozzles 1 1 8 of one nozzle 1 14 is not limited to 180. It is also possible to provide 3 60 nozzles in one nozzle 1 14 . At this time, each of the nozzle rows 116A and 116B may be formed by 180 nozzles 118. Further, in the present invention, the number of discharge nozzle rows is not limited to 1 60. For 1 nozzle 1 14, for? A spit out nozzle is also available. herein,? The natural number of 2 or more may be equal to or less than the total number of nozzles of the head 1 14 . In the present specification, for the purpose of explaining the relative positional relationship of the heads 1 14 , the nozzles 1 18 of the nozzle rows 1 16 包含 are included, and the nozzles 1 1 8 of the left side are denoted by the heads 1 14 . Reference nozzle 118R". That is, among the 80 discharge nozzles of the nozzle row 116, the leftmost discharge nozzle is the "reference nozzle 1 18 R" of the head 1 14 . However, for all the nozzles 1 1 4, the specified direction of the "reference nozzle 1 1 8 R" may be the same, and the position of the "reference nozzle 1 1 8 R" may be a non-upper position as in the fourth (a) As shown in (b), each of the heads 114 is an ink jet head. More specifically, each of the ink jet heads 1 1 4 is provided with a vibrating plate 1 2 6 and a nozzle plate 1 2 8 . Between the vibrating plate 1 2 6 and the nozzle plate 1 2 6 , the liquid material 1 1 1 is supplied from the ink tank 1 0 1 through the hole 1 3 1 , and the liquid filling place 1 29 is often located. Further, between the diaphragm 126 and the nozzle plate 128, a plurality of partition walls 122 are formed. Then, the portion 5 is surrounded by the vibrating plate 126, and the nozzle plate 128, and the partition wall 22, and is the chamber 120. The chamber 120 is provided corresponding to the nozzles -16-(14)(14)1269073 118, and the number of chambers U0 and the number of nozzles U8 are the same. In the chamber 丨2, the liquid material uj is supplied from the liquid storage portion 129 by the supply port 130 located between the pair of partition walls 1S2. On the vibrating plate 丨 26, each corresponding chamber 120 is located at the vibrator ι24. The vibrator 124 includes a holding piezoelectric element 1224c and one of the piezoelectric elements i24C opposite electrodes 124A, U4B. Here: [For the electrode ι24α, ι24Β, the driving voltage is applied, and the liquid material 1 8 is discharged from the corresponding nozzle 1 1 8 . However, the liquid material is discharged from the nozzle 1 18 in the Z-axis direction, and the shape of the nozzle i 18 is adjusted. Here, the term "liquid material" as used herein means a material which discharges viscosity from a nozzle. At this time, the material is either water-based or oily. The fluidity (viscosity) of the discharge nozzle may be sufficient, and the solid matter may be temporarily mixed, and fluidity may be used as a whole. The control unit 112 (Fig. 1) may be configured by providing the respective complex vibrators 124 with independent signals. That is, the volume of the material 1 1 1 discharged from the nozzle i 8 is controlled by the signal of the control unit 1 1 2 in each nozzle i 8 . In this case, the volume of the material 丨1 j discharged from each of the nozzles 1 1 8 changes between Opl and 42 (pico liter). Further, the control unit 112 sets a nozzle 1 1 8 that can perform a discharge operation between coating scans, and a nozzle 丨丨 8 that does not perform a discharge operation, as will be described later. In the present specification, a portion corresponding to one nozzle 1 1 8 5 and a bracket 1 2 0 corresponding to the nozzle, and a vibrator 1 2 4 corresponding to the bracket 1 2 0 will be included as "discharge portion 1 2 7". "." According to this expression, one nozzle 1 I 4 has a discharge portion 1 27 having the same number as the number of nozzles 1 18 . Discharge part 1 2 7 ties -17- (15) (15) 1269073 There are electrothermal conversion elements instead of piezoelectric elements. In other words, the discharge unit 127 may have a thermal expansion of the material by the electric heat conversion element, and the discharge material may be configured. (D. Head group) Next, the relative positional relationship of the four heads 1 14 of the head group 1 1 4G will be described. In Fig. 5, in the tray 03 of Fig. 2, two head groups 1 1 4 G ° adjacent to the γ-axis direction are displayed. As shown in Fig. 5, each head group 1 1 4 G is composed of 4 heads 1 1 4 made. Then, the nozzle interval GXP in the X-axis direction of the head group 1 I4 is 1 Μ times longer than the nozzle interval HXP in the X-axis direction of the head 1 14 , and 4 heads 1 14 are disposed in the head group 1 1 4 5 . In the present embodiment, the nozzle spacing in the X-axis direction of the head is narrow. Therefore, the nozzle spacing GXP in the X-axis direction of the head group 1 14G is about 1 7.5 μm. Here, the "nozzle interval G Χ X in the X-axis direction of the head group 1 1 4 G" corresponds to the nozzle 1 1 8 of all the head groups Π 4 G being imaged on the X-axis along the z-axis direction. Obtain the interval between the complex nozzle images. Of course, the number of the heads 1 1 4 including the head group 1 1 4 G is not limited to four. The head group 1 1 4 G may be formed by N heads 1 14 . Here, the 5 N is a natural number of 2 or more. At this time, the nozzle interval GXP is 1/N times longer than the nozzle interval HXP, and N nozzles 14 may be disposed in the head group 1 1 4G. In the following, the relative positional relationship of the heads 11 4 of the present embodiment will be more specifically described. -18- (16) (16) 1269073 First, for the purpose of the description of the easy way, the four nozzles 1 1 4 including the head group 1 1 4 G on the upper left of Fig. 5 are recorded as the head 1141 and the head 1142. , the nozzle 1143, the nozzle 1144. Similarly, the four heads 114 of the head group 114G at the lower right of Fig. 5 are referred to as a head 1145, a head 1146, a head 1 47, and a head 1148. Then, the nozzle row 1 1 6 A, 1 1 6 B of the nozzle 1 1 4 1 is denoted as nozzle row 1 A, 1 B, and the nozzle row 1 1 6 A, 1 1 6 B of the nozzle 1 1 4 2 is The nozzle row 2A5 2B is denoted by the nozzle row 1 16A, 1 16B of the nozzle 1 143 as the nozzle row 3 A, 3 B , and the nozzle row 1 1 6 A, 1 1 6 B of the nozzle 1 14 4 is denoted as a nozzle Column 4 A, 4 B. Similarly, the nozzle rows 116A, 116B of the nozzles 1 14 5 are denoted as nozzle rows 5A, 5B, and the nozzle rows 1 1 6 A, 1 1 6 B of the nozzles 1146 are denoted as nozzle rows 6 A, 6 B, and the nozzles are The nozzle rows 116A, 116B of 1 1 4 7 are denoted as nozzle rows 7A, 7B5, and the nozzle rows 1 16A, 1 16B of the head 1W8 are denoted as nozzle rows 8A, 8B. Each of the nozzle rows 1 A to 8 B is actually formed by 90 nozzles 1 18 . Then, as described above, in each of the nozzle rows 1 A to 8 B, these 90 nozzle systems are arranged in the X-axis direction. However, in Fig. 5, for convenience of explanation 5, each of the nozzle rows 1A to 8B is formed by four discharge nozzles (nozzles 118). Further, in FIG. 5, the leftmost nozzle 1 18 of the nozzle row 1A is the reference nozzle 1 18R of the head 1 141, and the leftmost nozzle 1 18 of the nozzle row 2A is the head 1 142 of the nozzle 1 142. Nozzle row 3 A The leftmost nozzle 1 18 is the reference nozzle 1 18R of the head 1 1 4 3 , the leftmost nozzle row 1 18 of the nozzle row 4A is the head 1 144 reference nozzle 118R, and the nozzle column 5A is the leftmost nozzle 118 Nozzle 1145 reference nozzle 1 1 8R. -19- (17) (17) 1269073 In the present embodiment, the product of the nozzle interval HXP in the X-axis direction of the head 1 14 and the number of discharge nozzles of the head 1 1 4 is expressed as "the effective length hl of the head". In the example of Fig. 5, the nozzle interval HXP is 70 μm and the number of ejection nozzles is 8, so that the effective length H L of the nozzle is 560 μm. Further, in the present embodiment, one head 1 14 is formed by four consecutive sub ranges S R . The length DL of the sub-range SR in the X-axis direction is 1/4 times the effective length HL of the head. In the following description, the four sub-ranges S R of the head 1 14 are oriented in the positive direction (the right side of the drawing) in the X-axis direction, and are referred to as the sub-ranges SRI, SR2, SR3, and SR4. According to the above description, the X coordinate of the reference nozzle U8R of each of the heads 114 is expressed as follows. The X coordinate of the reference nozzle 1 18R of the head 1 142 corresponds to the X coordinate which is only shifted by the X coordinate length of the reference nozzle 118R of the head 1141, and is further shifted by 1/2 times the nozzle interval ΗΧΡ. In the example of Fig. 5, the X coordinate of the reference nozzle 1 1 8 R of the nozzle 1 1 4 2 is the X coordinate of the reference nozzle 1 18R of the head 1 1 4 1 , and the length DL is only positive in the X-axis direction. The direction (the right direction in Fig. 5), the offset increases the length of the nozzle interval ΗΧΡ 1/2 times. The X coordinate of the reference nozzle 1 1 8R of the head 1 1 44 is 1 /2 times the X-coordinate length DL of the reference nozzle 11811 which is only offset from the head 1143. In the example of Fig. 5, the X coordinate of the reference nozzle 1 1 8 R of the head 1 1 4 4 is the X coordinate of the reference nozzle 1 1 8 R of the head 1 1 4 3 , and the length DL is only in the X-axis direction. The positive direction (the right direction of Fig. 5) 'offset increases the nozzle spacing H Xp by -20-(18) 1269073 1/2 times the length. Reference nozzle 1 of nozzle 1 143 X coordinate 5 of 18R shifting nozzle 1 1 4 2 reference nozzle 1 1 8 R X coordinate length mark, more offset 1/4 times or 3/4 times of nozzle interval HXP, The position of the reference nozzle 1 1 8R of the nozzle 143, the X coordinate of the reference nozzle 1 1 8 R of 1 1 4 3 is only directed to the X direction (the right direction of FIG. 5), and the offset is divided by the length D1. /2 times the length,. However, the "offset X-axis direction" includes not only the positive direction shift in the X-axis direction but also the negative direction offset. Further, in the present embodiment, the order of the order of the four heads 1 14 in which the heads 1141, 1142, 1143, and 1144 are sequentially arranged in the Y-axis direction may be in the negative direction of the Y-axis direction. Specifically, when the head 1 1 4 1 and the head are adjacent to the Y-axis direction, any arrangement is possible when the head 1143 and the head are connected to the x-axis direction. Figure 5 shows the configuration of the nozzles 1145, 1148 of the lower right nozzle group U4G, that is, the same configuration as the nozzles 1141, 1142, 1:. The positional relationship between the two head groups 1 adjacent to each other in the X-axis direction will be described based on the relationship between the head 1 1 4 5 and the head 1 I 4 1 . The X-coordinate of the reference nozzle 1 1 8 R of the nozzle 1 1 4 5 , the X coordinate of the reference nozzle 1 1 8 R; only the nozzle 1 1 4 | is for the X-seat only DL. In Fig. 5, the description of the square mouth gap 丨 in the direction of the nozzle is in the direction of the X-axis (the bottom of the drawing is arranged. However, the non-implementation ί 1 142 is adjacent to each other 1146, 1147, 143, The relative position of 14 of 1 144 is closed by the X-axis direction of the head 1 1 4 1 - 21 - (19) (19) 1269073, the nozzle interval HXP, and the length of the product of the nozzle 114. The positive direction of the direction is offset. In the present embodiment, the nozzle spacing HXP is about 70 μm, and the number of ejection nozzles of one nozzle is 160, and the X coordinate of the reference nozzle 11 8 R of the nozzle 1 4 5 The X coordinate of the reference nozzle U8R of the head 1141 is shifted by only 11·2Γηηη (70μΓηχ160) in the positive direction of the X-axis direction. However, in the fifth figure, the discharge of the head 1 1 4 1 is illustrated for convenience. The number of nozzles is eight, and the X coordinate of the reference nozzle 1 18R of the head 1 1 4 5 is drawn as the X coordinate of the reference nozzle 1 141 of the head 1 141, and is shifted by only 5 60 μm (70 μπι 8). 4 1 and the head 1 1 4 5 are arranged as described above, the X seat of the rightmost discharge nozzle of the nozzle row 1 A The X coordinate of the leftmost discharge nozzle of the nozzle row 5 A is only offset from the nozzle interval LNP. To this end, the nozzle spacing of the two nozzles U4G in the overall X-axis direction is the nozzle spacing of the nozzle 1 1 4 in the X-axis direction. The nozzle interval in the X-axis direction of the entire bracket 1300 is also 1 7.5 μm 5 , that is, 1/4 times the nozzle interval X in the X-axis direction of the nozzle 114, and 6 nozzles are arranged. The head group 114G. However, in the present specification, the heads 1Μ1, the heads 1144, the heads 1 1 4 5, and the like, and the heads 1 1 4 4 at both ends of one head group 1 1 4 G are referred to as “reference heads”. In the length range of the nozzle spacing 沿着 along the X-axis direction 1, the X-axis coordinate portion of the four nozzles 1 18 is included, and is referred to as the overlapping portion G (G1 to G7 in Fig. 5). In Fig. 5, in the overlapping portion G 1, the nozzle 1 1 of the nozzle row 1 8, is included, and the nozzle 1 1 8 of the right side of the nozzle row -22- (20) (20) 1269073 2A And the second nozzle 1 1 8 on the left side of the nozzle row 3 A and the leftmost nozzle 1 18 of the nozzle row 4A. Similarly, the rightmost nozzle of the nozzle row 1 B is included in the overlap portion G 2 . 11 8 and the second nozzle 1 1 8 on the right side of the nozzle row 2B and the second nozzle 1 1 8 on the left side from the nozzle row 3 B and the leftmost nozzle 1 18 of the nozzle row 4 B. Further, the overlapping portion G 3, the rightmost nozzle 1 1 8 including the nozzle row 2 A and the rightmost nozzle 1 1 8 of the nozzle row 3 A and the rightmost nozzle 1 1 8 of the nozzle row 4 A and the leftmost of the nozzle row 5 A Nozzle 1 1 8. According to the head configuration of the present embodiment, at any one of the overlapping portions G1 to G7, the nozzle 1 1 8 of the subsidiary sub-range SR 1 and the nozzle 1 1 8 of the subsidiary sub-range S R2 , and the subsidiary sub-range SR 3 are included. The nozzle 1 18, and the nozzle 1 1 8 of the sub-range S R4. However, the number of nozzles included in the sub-range SR1 of one overlapping portion (for example, the overlapping portion G1), the number of nozzles in the sub-range SR2, and the number of nozzles in the sub-range SR3 are the same as the number of nozzles in the sub-range SR4. For example, in the fifth figure, the superimposed portion G1 includes the sub-nozzle 1 1 8 of the sub-range SR4 and the nozzle 1 1 8 of the sub-sub-range SR3, and the nozzle 1 1 8 of the sub-sub-range SR2, and the sub-range SR1 The nozzles 1 1 8 each contain one.
更且,根據本實施例的噴頭配置,噴嘴列1 B的最右 噴嘴列1 1 8的X座標,係幾近一致於噴嘴列1 A最右噴嘴 1 1 8的X座標,和噴嘴列5 A最左的噴嘴1 1 8的X座標的 中間。然後,由噴嘴列2 A的右邊第2個噴嘴1 1 8的X座 標係幾近一致於噴嘴列1 B的最右噴嘴Π 8的X座標和噴 嘴列I B的最右噴嘴1 1 8的X座標的中間。由噴嘴列2 A •23- (21) (21)1269073 左邊第2個噴嘴1 1 8的X座標,係幾近一致於噴嘴列1 A 最右的噴嘴1 1 8的X座標,和由噴嘴列2A右邊第2個的 噴嘴1 1 8的X座標的中間。由噴嘴列3 A第2個噴嘴1 1 8 的X座標,係幾近一致於噴嘴列1 A最右噴嘴1 1 8的X 座標,和由噴嘴列2A右邊第2個的噴嘴1 1 8的x座標的 中間。噴嘴列4 A的最左的噴嘴1 1 8的X座標,係幾近一 致於由噴嘴列2A右邊第2個噴嘴U 8的X座標,和噴嘴 列1 B最右噴嘴1 1 8的X座標的中間。 (E.控制部) 其次,説明控制部1 1 2的構成。如第6圖所示,控 制部1 1 2係具備輸入緩衝器記憶體200,和記憶手段 202,處理部204,和掃描驅動部206,和噴頭驅動部208 。緩衝器記憶體2 0 2和處理部2 0 4係可相互通信加以連 接。處理部204和記憶手段202係可相互通信加以連接 。處理部204和掃描驅動部206係可互相通信加以連接 。處理部204和噴頭驅動部20係可相互通信加以連接。 又,掃描驅動部206係可相互通信第1位置控制手段i 04 和第2位置控制手段1 08加以連接。同樣地,噴頭驅動 部2 0 8係可各相互可通信連接複數噴頭1 1 4。 輸入緩衝器記憶體200係接受由外部資訊處理裝置 進行液狀材料1 1 1的液滴吐出之吐出資料。吐出資料係 包含顯示基體上所有被吐出部的相對位置之資料,和顯 不於所有的被吐出部,將液狀的材料]1 1塗佈至期望的 -24- (22) (22)1269073 厚度所需相對掃描次數資料,和指定作爲開啓噴嘴丨〗8 A 工作之噴嘴1 1 8之資料,和指定作爲關閉噴嘴π 8B工作 噴嘴1 1 8之資料。開啓噴嘴1〗8 a及關閉噴嘴1 1 8B的說 明則如後述。輸入緩衝器記憶體2 0 0,係將吐出資料供給 至處理部204,處理部204係將吐出資料收容至記憶手段 2 02。第6圖中,記憶手段202係RAM。 處理部2 0 4係根據記憶手段2 0 2內的吐出資料,將 顯示對於被吐出部之噴嘴1 1 8的相對位置之資料,給予 掃描驅動部206。掃描驅動部206係將對應此資料,和後 述周期EP(第7圖)之驅動信號,給予第i位置控制手段 1 〇4及第2位置控制手段丨08。此結果,對於被吐出部相 而言’相對掃描噴頭1 1 4。另一方面5處理部204係根據 記憶於記憶手段202之吐出資料,和吐出周期EP,將指 定每一吐出時間的噴嘴1 1 8的開□關之選擇信號s c,給 予至噴頭驅動部208。噴頭驅動部20 8,係根據選擇信號 sc,將於液狀材料111的吐出所需之吐出信號ES,給予 至噴頭1 1 4。此結果,由於對應噴頭〗〗4之噴嘴丨〗8,液 狀的材料1 1 1作爲液滴加以吐出。 控制部1 12係包含CPU, ROM,RAM之電腦。此時, ^ @部1 1 2的上述機能係經由電腦實行軟體程式加以實 ^ °當然,控制部1 1 2係可經由專用的電路(硬體)加以實 現。 其次,說明控制部1 1 2之噴頭驅動部208的構成和 機能。 -25- (23) (23)1269073 圖7(a)所示,噴頭驅動部2 0 8乃具有1個之驅動信 號生成部203,和複數之類比開關AS。如圖7(b)所示, 驅動信號生成部2 0 3乃生成驅動信號DS。驅動信號DS 之電位乃對於基準電位L而言,時間性變化。具體而言 ,驅動信號D S乃含以吐出周期EP重覆複數之吐出波形 P。在此,吐出波形P乃從噴嘴1 1 8吐出1個之液滴之故 ,對應於欲施加於振動子1 24之一對之電極間之驅動電 壓波形。 驅動信號DS乃供予各類比開關AS之輸入端子。各 類比開關AS乃對應於各位址電極1 27加以設置。即,與 類比開關AS之數目和位址電極127之數目(即噴嘴1 18 之數目)相同。 處理部204乃將顯示噴嘴118之開啓·關閉的選擇 信號SC(圖7中SCI、SCI…),供予各類比開關AS。在 此,選擇信號SC乃於每類比開關AS,獨立地取得高位 準及低位準之任一狀態。 另一方面,類比開關AS乃對應於驅動信號DS和選 擇信號SC,於振動子124之電極124A,供給吐出信號 ES(圖7中之ESI、ES2…)。具體而言,選擇信號SC於 高位準時,類比開關AS乃於電極124A做爲吐出信號ES 傳播驅動信號DS。另一方面,選擇信號SC爲低位準時 ,類比開關A S輸出之吐出信號E S之電位乃呈基準電位 L。於振動子1 2 4之電極1 2 4 A,供予驅動信號D S時,從 對應該振動子1 2 4之噴嘴1 1 8,吐出液狀之材料1 1丨。然 •26- (24) 1269073 而,於各振動子124之電極124B,供予基準電位L。 圖7(b)所示之例中,於各2個吐出信號ESI、ES2中 ,以吐出周期EP之2倍之周期2EP,顯現吐出波形P地 ,於各2個之選擇信號SCI、SC2中,設定高位準之期 間和低位準之期間。由此,由各對應之2個之噴嘴1 1 8, 以周期2EP,吐出液狀之材料1 1 1。又,各對應此等2個 之噴嘴1 1 8之振動子1 24中,供予從共通之驅動信號生 成部203之共通之驅動信號DS。爲此,從2個之噴嘴 1 1 8,以幾近相同1之時間,吐出液狀之材料1 1 1。 經由以上構成,吐出裝置1 00乃對應於供予控制部 1 1 2之吐出資料,進行液狀之材料1 1 1之塗佈掃瞄。 (F·吐出方法之一例) 參照圖8(a)及(b),說明對於平行於X軸方向之條紋 狀之標靶,即對於被吐出部1 8 L,吐出裝置1 〇 0吐出液 狀之材料111之方法。然而,圖8 (a)所示例中,經由托 架1 0 3之Y軸方向之相對移動,於圖5說明之噴頭1 1 4 1 、1 1 4 2、1 1 4 3、1 1 4 4、1 1 4 5、1 1 4 6、1 1 4 7 則以此順序, 與被吐出部18L重合。又,於圖8中,亦顯示圖5之重 豐部G1〜G7。 如圖8(a)所示,首先,托架103則對於平台106,向 Y軸方向開始相對移動。然後,噴嘴列1 A重疊於被吐出 • 部H L時,噴嘴列1 A之噴嘴1 1 8中,從含於重疊部G1 之噴嘴1 1 8,對於被吐出部1 8 L吐出材料111。圖8 (b)之 -27- (25) 1269073 標籤「1 A」之右側中,噴嘴列1 B之吐出所成彈著位B 以黑圈加以描繪,又,先行於噴嘴列1 B之噴嘴列之吐 所成彈著位置則以白圈描繪。 噴嘴列1 B之下一個中,噴嘴列2A重疊於被吐辻 18L。噴嘴列2A重疊於被吐出部18L時,噴嘴列2A 噴嘴1 1 8中,由含於重疊部G丨之噴嘴1 1 8,和含於重 部G2之噴嘴1 1 8,和含於重疊部G3之噴嘴1 1 8,和 於重疊部G4之噴嘴1 1 8,對於被吐出部1 8L同時吐出 狀之材料1 1 1。於圖8(b)之標籤「2A」之右側,噴嘴 2A之吐出所成彈著位置則以黑圈加以描繪’又,先行 噴嘴列2A之噴嘴列之吐出所成彈著位置則以白圈描繪 噴嘴列2A之下一個中,噴嘴列2B重疊於被吐出 1 8 L。噴嘴列2 B重疊於被吐出部1 8 L時,噴嘴列2 B 噴嘴1 1 8中,由含於重疊部G 1之噴嘴1 1 8,和含於重 部G 2之噴嘴1 1 8,和含於重疊部G 3之噴嘴1 1 8,和 於重疊部G4之噴嘴1 1 8,對於被吐出部1 8L同時吐出 狀之材料1 1 1。於圖8(b)之標籤「2B」之右側,噴嘴 2B之吐出所成彈著位置則以黑圏加以描繪’又’先行 噴嘴列2 B之噴嘴列之吐出所成彈著位置則以白圈描繪 之後,噴嘴列 3A、3B、4A、4B、5A、5B、6A、 、7 A、7 B則以此順序,重疊於被吐出部〗8 L ’從各噴 列 3A、3B、4A、4B、5A、5B、6A、6B、7A、7B’ 對 被吐出部18L·,與噴嘴列1A、IB、2A、2B同樣之地 吐出液狀之材料111。結果’噴頭群11 4 G則對於被吐 則 出 部 之 疊 含 液 列 於 〇 部 之 疊 含 液 列 於 〇 6B 嘴 於 5 出 -28 - (26) (26)1269073 部1 8 L,向Y軸方向僅1次相對移動之期間,以噴頭1 1 4 之X軸方向之噴嘴間隔ΗΧΡ之1/4倍之長度,即以17.5 μπι之間隔,彈著液狀之材料1 1 1。 上述條紋狀之被吐出部1 8 L之一例乃爲形成金屬配 線之部分。因此,本實施例之吐出裝置1 0 0乃經由吐出 液狀之配線材料,適用於製造金屬配線之配線製造裝置 。例如,可適用於後述電漿顯示裝置50之(圖20〜22)之 支持基板52上,形成位址電極54之配線製造裝置。 圖3 0(a)乃模式性顯示沿X軸方向之噴頭1 14之吐出 量之外觀之圖表。另一方面,圖30(b)乃模式性顯示沿X 軸方向之重疊部 G1〜G7之吐出量之外觀之圖表。圖 3 0(a)及(b)之2個圖表之橫軸乃平行於X軸方向之軸的同 時,對應於噴頭1 1 4之噴嘴1 1 8之位置。另一方面,圖 3 0(a)及(b)之2個圖表之縱軸乃表示從噴嘴1 18之吐出量 。又,吐出量之外觀乃於以圖5所說明之噴頭之有效長 HL之範圍,內插實測値加以描繪。 如圖30(a)所示,從噴頭1 14之兩端之噴嘴1 18之吐 出量爲最多,從噴頭1141之近中央之噴嘴118的吐出量 最少。然後,沿X軸方向之噴嘴1 1 8之吐出量之外觀形 狀乃關於噴頭之中央,呈幾近對稱之形狀。圖3 0之外觀 採用此形狀之理由雖關連於噴頭1 1 4之製造工程上之理 由,在此省略此理由的說明。 另一方面,如圖30(b)所示,沿X軸方向之重疊部 G1〜G7之吐出輪廓乃具有幾近以噴頭之有效長HL之長 -29- (27) (27)1269073 度的1/4倍(即長度DL)之周期重覆之形狀。該理由爲如 下所述。 如圖5所示說明,對於排列於Y方向之4個噴頭 1 1 4之1個之基準噴嘴1 1 8 R的X座標而言,其他之3個 之噴頭1 1 4之基準噴嘴1 1 8R之X座標則以幾近長度 DL之整倍數程度地,不重複地向X軸方向偏移。 而且,根據本實施例之噴頭配置時,於任一重疊部 G(圖5中爲G1〜G7)中,包含屬於副範圍SR1之噴嘴118 、和屬於副範圍SR4之噴嘴1 1 8。爲此,屬於噴頭1 1 4 之種種副範圍SR之噴嘴1 1 8,鄰接於X軸方向。更且, 含於1個重疊部G之副範圍SR1之噴嘴1 1 8之數、和副 範圍SR2之噴嘴1 18之數、和副範圍SR3之噴嘴1 18之 數、和副範圍SR4之噴嘴118之數爲相同。因此,於X 軸方向,對於平行之線,例如對於1個條紋狀之被吐出 部18L而言,從重疊部G1〜G7吐出之液滴之總體積乃, 不論爲何皆爲幾近相同。 因此,沿重疊部G1 · G2之X軸方向之吐出量之外 觀、和沿重疊部G3 · G4之X軸方向之吐出量之外觀、 和沿重疊部G5 . G6之X軸方向之吐出量之外觀、和沿 重疊部G7· G8之X軸方向之吐出量之外觀乃皆爲幾近 相同形狀。然而,對應於相互鄰接之2個之重疊部G的 X軸方向之長度乃相等於DL。 如此地,根據本實施例中,如圖3 0 (b)所示,於每噴 頭1 1 4之噴嘴1 1 8之位置,從噴嘴〗1 8之液滴之吐出量 -30- (28) (28)1269073 爲不同時,於從/1 1 4 g吐出之液滴之列,難以顯現吐出量 之差。此乃屬於各種副範圍SR之噴嘴1 1 8,噴頭群 1 1 4 G中,鄰接於X軸方向,抵銷爲此之吐出量之差。更 且,於噴頭之有效長HL之範圍內,上述重疊部G則排 列有8個。因此,沿噴頭1 14之有效長HL之範圍之X 軸方向的吐出量差亦爲更小。 在此,對於噴頭群114G相對移動之方向,基準噴頭 1 1 4於位在最前頭之位置的重疊部G,液狀之材料之液滴 之彈著順序如下所述。首先,在於方向間隔特定距離之2 個位置之中間位置,彈著液滴。然後,於已被液滴被覆 之此2個位置之中間位置,彈著下個液滴。然後,重覆 如此彈著位置之圖案。例如,經由圖8之重疊部G1及 G2,首先於X軸方向,在僅離開噴嘴間隔HXP之P1和 P 2,彈著各液滴。接著,在位於p 1和p 2之中間之P 3, 彈著液滴。然後,更且於位於P 1和P 3之中間之P 4,彈 著液滴。然後位於P3和P2之中間之p5,彈著液滴。 如此’根據本實施例之噴頭配置時,液滴乃對於本 身之?早者位置而曰封柄之 2個位置中,可先與彈著之 2 個之液滴接觸。爲此,後彈著之液滴中,作用有向相反 之方向的力’結果’之後彈著之液滴乃擴展至從該彈著 位置對稱之形狀。由於此理由,根據本實施例之吐出方 法時,難以產生液狀之材料的塗佈不均。 然而,噴頭1 1 4乃即使不具有如圖3 〇所示之形狀之 吐出外觀’亦可適用本發明。具體而言,即使爲關於噴 -31 - (29) 1269073 頭之有效長HL之中心非對稱之形狀,亦可適用本發明。 從重疊部G之吐出量之合計爲使任一者皆爲相同,於各 重璺邰G含有副範圍SR時,可得上述效果。 又’根據本實施例時,於吐出裝置丨〇 〇中,噴頭群 1 1 4G之X軸方向之噴嘴間隔乃噴頭之χ軸方向之噴嘴間 隔之1/Ν倍長度。在此,ν乃含於噴頭群1 14G之噴頭 1 1 4之數目。爲此,吐出裝置! 〇 〇之χ軸方向之噴嘴線 密度好通常之噴墨裝置之X軸方向之噴嘴線密度爲高。 結果,僅將托架1 03向Υ軸方向進行1次枏對移動的期 間內,可沿X軸方向,形成更緇密之彈著圖案。 【實施例2】 將本發明適用於彩色濾光片基板之製造裝置之例, 進行說明。 圖9(a)及(b)所示基體10Α乃經過後述之製造裝置1( 圖1 0)之處理,成爲彩色濾光片基板1 〇之基板。基體 10A乃具有配置呈矩陣狀之複數之被吐出部18R、18G、 1 8B。 具體而言,基體10A乃包含具有光透過性之支持基 板1 2、和形成於支持基板1 2上之黑矩陣1 4、和形成於 黑矩陣1 4之間隔壁1 6。黑矩陣1 4乃以具有遮光性之材 料加以形成。然後,黑矩陣14和黑矩陣1 4上之間隔壁 1 6乃於支持基板1 2上’規定矩陣狀之複數之光透過部分 、即規定矩陣狀之複數之畫素範圍地加以定位。 -32- (30) (30)1269073 各畫素範圍中,以支持基板1 2、黑矩陣1 4、及間隔 壁1 6所規定之凹部乃對應於被吐出部1 8R、被吐出部 18G、被吐出部18B。被吐出部18R乃欲形成僅透過紅色 之波長域之光線的濾光片層1 Π F R的範圍,被吐出部 1 8G乃欲形成僅透過綠色之波長域之光線的濾光片層 1 1 1FG的範圍、被吐出部1 8b乃欲形成僅透過藍色之波 長域之光線的濾光片層1 1 1 FB的範圍。 圖9(b)所示之基體10A乃位於於X軸方向和Y軸方 向之雙方,平行之假想平面上。然後,形成複數之被吐 出部18R、18G、18B之矩陣之行方向及列方向乃各與X 軸方向及Y軸方向平行。於基體10A中,被吐出部18R 、被吐出部1 8 G、及被吐出部1 8 B乃於Y軸方向,以此 順序周期性排列。另一方面,被吐出部1 8 R間乃於X軸 方向,隔著特定之一定間隔,排列呈一列,然後,被吐 出部1 8 B彼此乃於X軸方向,隔著特定之一定間隔,排 列呈一列。然而,X軸方向乃Y軸方向則相互正交。Moreover, according to the head configuration of the present embodiment, the X coordinate of the rightmost nozzle row 1 18 of the nozzle row 1 B is nearly identical to the X coordinate of the rightmost nozzle 1 18 of the nozzle row 1 A, and the nozzle row 5 A is the middle of the X coordinate of the leftmost nozzle 1 1 8 . Then, the X coordinate system of the second nozzle 1 1 8 on the right side of the nozzle row 2 A is nearly identical to the X coordinate of the rightmost nozzle Π 8 of the nozzle row 1 B and the X of the rightmost nozzle 1 1 8 of the nozzle column IB. In the middle of the coordinates. The X coordinate of the second nozzle 1 1 8 on the left by the nozzle row 2 A • 23- (21) (21) 12279073 is nearly identical to the X coordinate of the rightmost nozzle 1 1 8 of the nozzle row 1 A, and the nozzle In the middle of the X coordinate of the second nozzle 1 1 8 on the right side of column 2A. The X coordinate of the second nozzle 1 1 8 of the nozzle row 3 A is nearly identical to the X coordinate of the rightmost nozzle 1 1 8 of the nozzle row 1 A, and the second nozzle 1 1 8 of the right side of the nozzle row 2A The middle of the x coordinate. The X coordinate of the leftmost nozzle 1 18 of the nozzle row 4 A is nearly identical to the X coordinate of the second nozzle U 8 from the right side of the nozzle row 2A, and the X coordinate of the rightmost nozzle 1 18 of the nozzle row 1 B in the middle. (E. Control Unit) Next, the configuration of the control unit 1 1 2 will be described. As shown in Fig. 6, the control unit 1 1 2 includes an input buffer memory 200, a memory means 202, a processing unit 204, a scan drive unit 206, and a head drive unit 208. The buffer memory 2 0 2 and the processing unit 2 0 4 are communicably connected to each other. The processing unit 204 and the memory means 202 are communicably connected to each other. The processing unit 204 and the scan driving unit 206 are communicably connected to each other. The processing unit 204 and the head drive unit 20 are communicably connected to each other. Further, the scan driving unit 206 can communicate with each other by communicating the first position control means i 04 and the second position control means 108. Similarly, the head drive unit 208 can be communicably coupled to the plurality of heads 1 14 . The input buffer memory 200 receives the discharge data from which the liquid material 11 1 1 is discharged by the external information processing device. The spit data includes information showing the relative positions of all the spouted parts on the substrate, and the unexposed part is not applied, and the liquid material]1 1 is applied to the desired -24-(22) (22)1269073 The relative scan count data required for the thickness, and the information designated as the nozzle 1 1 8 for opening the nozzle 8 8 A, and the data designated as the closing nozzle π 8B working nozzle 1 18 . The description of opening the nozzle 1 8a and closing the nozzle 1 1 8B will be described later. The input buffer memory 200 is supplied with the discharge data to the processing unit 204, and the processing unit 204 stores the discharge data to the memory means 02. In Fig. 6, the memory means 202 is a RAM. The processing unit 205 displays the data indicating the relative position of the nozzle 1 18 of the spouted portion based on the discharge data in the memory means 208, and supplies the data to the scan driving unit 206. The scan driving unit 206 supplies the driving signals corresponding to the data and the period EP (Fig. 7) to the i-th position control means 1 〇 4 and the second position control means 丨 08. This result is relative to the scanning head 1 14 for the portion to be ejected. On the other hand, the processing unit 204 supplies the selection signal s c indicating the opening and closing of the nozzles 1 18 for each discharge time to the head driving unit 208 based on the discharge data stored in the memory means 202 and the discharge period EP. The head driving unit 208 gives a discharge signal ES required for discharging the liquid material 111 to the head 1 1 4 based on the selection signal sc. As a result, the liquid material 11 1 is discharged as a liquid droplet due to the nozzle 丨 8 corresponding to the nozzle 4. The control unit 1 12 is a computer including a CPU, a ROM, and a RAM. At this time, the above-mentioned functions of the ^@1 1 2 are implemented by a software program via a computer. Of course, the control unit 1 1 2 can be realized by a dedicated circuit (hardware). Next, the configuration and function of the head driving unit 208 of the control unit 112 will be described. Further, as shown in Fig. 7(a), the head driving unit 208 has one driving signal generating unit 203 and a plurality of analog switches AS. As shown in FIG. 7(b), the drive signal generating unit 203 generates a drive signal DS. The potential of the drive signal DS changes temporally with respect to the reference potential L. Specifically, the drive signal D S includes a discharge waveform P which is repeated with a plurality of discharge periods EP. Here, the discharge waveform P is discharged from the nozzles 1 1 8 and corresponds to the drive voltage waveform to be applied between the electrodes of one pair of the vibrators 1 24 . The drive signal DS is supplied to the input terminals of the various types of ratio switches AS. Each analog switch AS is provided corresponding to the address electrode 1 27 . That is, it is the same as the number of analog switches AS and the number of address electrodes 127 (i.e., the number of nozzles 1 18). The processing unit 204 supplies the selection signal SC (SCI, SCI, ... in Fig. 7) for displaying the opening and closing of the nozzle 118 to the various types of ratio switches AS. Here, the selection signal SC is independent of the analog switch AS, and independently obtains either of the high level and the low level. On the other hand, the analog switch AS corresponds to the drive signal DS and the selection signal SC, and the discharge signal ES (ESI, ES2, ... in Fig. 7) is supplied to the electrode 124A of the vibrator 124. Specifically, when the selection signal SC is at a high level, the analog switch AS uses the electrode 124A as the discharge signal ES to propagate the drive signal DS. On the other hand, when the selection signal SC is at the low level, the potential of the discharge signal E S output from the analog switch A S is the reference potential L. When the electrode 1 2 4 A of the vibrator 1 2 4 is supplied with the drive signal D S , the liquid material 1 1 吐 is discharged from the nozzle 1 1 8 corresponding to the vibrator 1 24 . However, 26-(24) 1269073 is supplied to the reference potential L at the electrode 124B of each vibrator 124. In the example shown in FIG. 7(b), in each of the two discharge signals ESI and ES2, the discharge waveform P is expressed in a period 2EP of twice the discharge period EP, and is selected in each of the two selection signals SCI and SC2. , set the period of high level and the period of low level. Thereby, the liquid material 1 1 1 is discharged by the nozzles 1 1 8 corresponding to each of the two nozzles at a period of 2 EP. Further, among the vibrators 1 24 corresponding to the two nozzles 1 18, the common drive signals DS from the common drive signal generating portion 203 are supplied. For this reason, the liquid material 1 1 1 is discharged from the two nozzles 1 18 and at approximately the same time. With the above configuration, the discharge device 100 performs the coating scan of the liquid material 1 1 1 in accordance with the discharge data supplied from the control unit 1 1 2 . (F. Example of F. Discharge Method) Referring to Figs. 8(a) and 8(b), the stripe-shaped target parallel to the X-axis direction, that is, the discharge device 1 L0, the discharge device 1 〇0 discharges liquid. The method of material 111. However, in the example shown in Fig. 8(a), the nozzles 1 1 4 1 , 1 1 4 2, 1 1 4 3, 1 1 4 4 illustrated in Fig. 5 are relatively moved in the Y-axis direction of the carriage 103. 1 1 4 5, 1 1 4 6 , 1 1 4 7 is in this order, and overlaps with the spouted portion 18L. Further, in Fig. 8, the divergent portions G1 to G7 of Fig. 5 are also displayed. As shown in Fig. 8(a), first, the carriage 103 starts to move relative to the stage 106 in the Y-axis direction. Then, when the nozzle row 1 A is overlapped with the discharge portion H L , the nozzle 1 1 8 of the nozzle row 1 A discharges the material 111 from the nozzle 1 1 8 included in the overlapping portion G1. Figure 8 (b) -27- (25) 1269073 In the right side of the label "1 A", the ejection position B of the nozzle row 1 B is drawn in a black circle, and the nozzle in the nozzle row 1 B is first. The position of the column is reflected in a white circle. In the lower one of the nozzle rows 1 B, the nozzle row 2A is overlapped with the spouted 18L. When the nozzle row 2A is overlapped with the discharge portion 18L, the nozzle row 2A is in the nozzle 1 18, and the nozzle 1 1 8 included in the overlapping portion G 和 and the nozzle 1 1 8 included in the heavy portion G 2 are included in the overlapping portion. The nozzle 1 18 of G3 and the nozzle 1 1 8 of the overlapping portion G4 simultaneously discharge the material 1 1 1 into the discharged portion 1 8L. On the right side of the label "2A" of Fig. 8(b), the position at which the nozzle 2A is ejected is drawn in a black circle. Further, the ejection position of the nozzle row of the preceding nozzle row 2A is a white circle. In the lower one of the nozzle row 2A, the nozzle row 2B is superposed on the discharged 18 L. When the nozzle row 2 B is overlapped with the discharge portion 1 8 L, the nozzle row 2 B is in the nozzle 1 18, and the nozzle 1 1 8 included in the overlapping portion G 1 and the nozzle 1 1 8 included in the heavy portion G 2 The nozzle 1 1 8 included in the overlapping portion G 3 and the nozzle 1 1 8 in the overlapping portion G4 simultaneously discharge the material 1 1 1 in the form of the discharged portion 1 8L. On the right side of the label "2B" in Fig. 8(b), the position at which the nozzle 2B is ejected is marked with a black cymbal, and the ejection position of the nozzle row of the nozzle row 2B is white. After the circle is drawn, the nozzle rows 3A, 3B, 4A, 4B, 5A, 5B, 6A, 7A, 7B are superimposed on the ejection portion 8L' from the respective ejection rows 3A, 3B, 4A in this order. 4B, 5A, 5B, 6A, 6B, 7A, and 7B' The liquid material 111 is discharged to the discharged portion 18L· in the same manner as the nozzle rows 1A, IB, 2A, and 2B. RESULTS: 'The nozzle group 11 4 G is the stack of liquid contained in the crotch portion of the spouted part. The stack is listed in the 〇6B mouth at 5 out -28 - (26) (26) 1227073 part 1 8 L, In the period in which the Y-axis direction is relatively moved only once, the liquid material 1 1 1 is bucked by a length of 1/4 of the nozzle interval X in the X-axis direction of the head 1 1 4 , that is, at intervals of 17.5 μm. An example of the strip-shaped discharge portion 18L is a portion where a metal wiring is formed. Therefore, the discharge device 100 of the present embodiment is applied to a wiring manufacturing apparatus for manufacturing metal wiring by discharging a liquid wiring material. For example, the wiring manufacturing apparatus for forming the address electrode 54 can be applied to the support substrate 52 of the plasma display device 50 (Figs. 20 to 22) which will be described later. Fig. 30(a) is a graph schematically showing the appearance of the discharge amount of the head 1 14 along the X-axis direction. On the other hand, Fig. 30 (b) is a graph schematically showing the appearance of the discharge amount of the overlapping portions G1 to G7 in the X-axis direction. The horizontal axis of the two graphs of Figs. 3(a) and (b) is parallel to the axis of the X-axis direction, and corresponds to the position of the nozzle 1 18 of the head 112. On the other hand, the vertical axes of the two graphs of Figs. 30(a) and (b) indicate the discharge amount from the nozzles 1 18 . Further, the appearance of the discharge amount is plotted by interpolating the actual length HL of the head described with reference to Fig. 5. As shown in Fig. 30 (a), the discharge amount from the nozzles 1 18 at both ends of the head 1 14 is the largest, and the discharge amount from the nozzle 118 near the center of the head 1141 is the smallest. Then, the appearance of the discharge amount of the nozzle 1 18 in the X-axis direction is a nearly symmetrical shape with respect to the center of the head. Appearance of Fig. 30 The reason for adopting this shape is related to the reason for the manufacturing process of the head 112, and the explanation of the reason is omitted here. On the other hand, as shown in Fig. 30 (b), the discharge contours of the overlapping portions G1 to G7 in the X-axis direction have a length -29 - (27) (27) 1227073 degrees which is close to the effective length HL of the head. The shape of the period of 1/4 times (ie, length DL) is repeated. The reason is as follows. As shown in FIG. 5, for the X coordinate of the reference nozzle 1 1 8 R of one of the four nozzles 1 1 4 arranged in the Y direction, the other three nozzles 1 1 4 of the reference nozzle 1 1 8R The X coordinate is offset to the X-axis direction by an integral multiple of the near-length DL. Further, according to the head arrangement of the present embodiment, the nozzles 118 belonging to the sub-range SR1 and the nozzles 1 1 8 belonging to the sub-range SR4 are included in any of the overlapping portions G (G1 to G7 in Fig. 5). To this end, the nozzles 1 1 8 belonging to the various sub-ranges SR of the heads 1 14 are adjacent to the X-axis direction. Further, the number of the nozzles 1 1 8 included in the sub-range SR1 of the one overlapping portion G, the number of the nozzles 1 18 of the sub-range SR2, the number of the nozzles 1 18 of the sub-range SR3, and the nozzle of the sub-range SR4 The number of 118 is the same. Therefore, in the X-axis direction, for the parallel line, for example, for one stripe-shaped discharge portion 18L, the total volume of the liquid droplets discharged from the overlapping portions G1 to G7 is almost the same regardless of the total. Therefore, the appearance of the discharge amount in the X-axis direction along the overlapping portions G1 and G2, the appearance of the discharge amount in the X-axis direction along the overlapping portions G3 and G4, and the discharge amount in the X-axis direction along the overlapping portion G5 and G6. The appearance and the appearance of the discharge amount along the X-axis direction of the overlapping portions G7·G8 are almost the same shape. However, the length in the X-axis direction corresponding to the two overlapping portions G adjacent to each other is equal to DL. Thus, according to the present embodiment, as shown in FIG. 30(b), at the position of the nozzle 1 18 of each nozzle 1 14 , the discharge amount of the droplet from the nozzle 18 - 30 - (28) (28) 12279073 It is difficult to show the difference in the amount of discharge when the droplets are discharged from /1 1 4 g. This is the nozzle 1 1 8 of the various sub-ranges SR, and the head group 1 1 4 G is adjacent to the X-axis direction to offset the difference in the amount of discharge. Further, in the range of the effective length HL of the head, the overlapping portion G is arranged in eight. Therefore, the difference in the discharge amount in the X-axis direction along the effective length HL of the head 1 14 is also smaller. Here, in the direction in which the head group 114G relatively moves, the reference head 114 is placed at the overlap portion G at the foremost position, and the ejection order of the droplets of the liquid material is as follows. First, the droplets are played in the middle of the two positions at a certain distance from the direction. Then, the next drop is played at the middle of the two positions where the droplet has been covered. Then, repeat the pattern of the position of the bullet. For example, via the overlapping portions G1 and G2 of Fig. 8, first, in the X-axis direction, each of the droplets is bounced only at P1 and P2 which are separated from the nozzle interval HXP. Next, at P 3 located between the middle of p 1 and p 2 , the droplets are bombarded. Then, more than the P 4 located between P 1 and P 3 , the droplets are bombarded. Then p5, located between the middle of P3 and P2, bounces the droplet. Thus, according to the nozzle configuration of the present embodiment, is the droplet for itself? In the early position and in the two positions of the handle, the two droplets of the bomb can be contacted first. For this reason, in the droplets which are subsequently bounced, the force acting in the opposite direction acts as a result, and the droplets which are bounced are expanded to a shape symmetrical from the projecting position. For this reason, according to the discharge method of the present embodiment, it is difficult to cause uneven coating of the liquid material. However, the present invention can be applied to the shower head 112 without even having the appearance of ejection as shown in Fig. 3A. Specifically, the present invention can be applied even to a shape asymmetrical about the center of the effective length HL of the head -31 - (29) 1269073. The total amount of discharge from the overlapping portion G is such that either one is the same, and the above effect can be obtained when each of the weights G includes the sub-range SR. Further, according to the present embodiment, in the discharge device, the nozzle interval in the X-axis direction of the head group 1 1 4G is 1/Ν times the nozzle interval in the x-axis direction of the head. Here, ν is the number of the heads 1 1 4 of the head group 1 14G. To this end, spit out the device!喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴As a result, a more dense elastic pattern can be formed in the X-axis direction only during the period in which the carriage 103 is moved once in the z-axis direction. [Embodiment 2] An example in which the present invention is applied to a manufacturing apparatus of a color filter substrate will be described. The substrate 10A shown in Figs. 9(a) and 9(b) is processed by a manufacturing apparatus 1 (Fig. 10) which will be described later, and becomes a substrate of the color filter substrate 1A. The base 10A has a plurality of discharged portions 18R, 18G, and 18B arranged in a matrix. Specifically, the substrate 10A includes a light-transmitting support substrate 12, a black matrix 14 formed on the support substrate 12, and a partition 16 formed on the black matrix 14. The black matrix 14 is formed of a material having a light blocking property. Then, the partition walls 16 on the black matrix 14 and the black matrix 14 are positioned on the plurality of light-transmitting portions of the predetermined matrix in the support substrate 12, i.e., a plurality of pixel ranges of a predetermined matrix shape. -32- (30) (30)1269073 In the pixel range, the concave portion defined by the support substrate 1 2, the black matrix 144, and the partition wall 16 corresponds to the spouted portion 18R and the spouted portion 18G. The part 18B is discharged. The sputtered portion 18R is intended to form a range of the filter layer 1 Π FR that transmits only light in the red wavelength region, and the sputter portion 18 8 is a filter layer 1 1 1FG that is intended to form light that transmits only the green wavelength region. The range and the spouted portion 18b are ranges in which the filter layer 1 1 1 FB that transmits only the light in the blue wavelength region is formed. The base 10A shown in Fig. 9(b) is located on the imaginary plane parallel to both the X-axis direction and the Y-axis direction. Then, the row direction and the column direction of the matrix forming the plurality of spouted portions 18R, 18G, and 18B are parallel to the X-axis direction and the Y-axis direction. In the base 10A, the discharge portion 18R, the discharge portion 1 8 G, and the discharge portion 1 8 B are periodically arranged in this order in the Y-axis direction. On the other hand, the spouted portions 1 8 R are arranged in a row at a predetermined interval in the X-axis direction, and then the spouted portions 1 8 B are in the X-axis direction with a predetermined interval therebetween. Arranged in a column. However, the X-axis direction and the Y-axis direction are orthogonal to each other.
沿被吐出部1 8 R彼此之Y軸方向之特定間隔LRY, 即間隔乃幾近5 6 0 μηι。此間隔乃與沿被吐出部丨8 g彼此 之Υ軸方向之特定間隔L G Υ相同。亦與沿被吐出部1 § Β 彼此之 Υ軸方向之特定間隔LB Υ相同。又,被吐出部 1 8R之平面像乃以長邊和短邊決定之矩形。具體而言, 被吐出部18R之Υ軸方向之長度乃幾近100 μπι,X軸方 向之長度乃幾近200 μηι。被吐出部UG及被吐出部18Β 亦與被吐出部1 8 R有同樣之形狀·大小。被吐出部1 8 R -33 - (31) (31)1269073 彼此之上述間隔及被吐出部丨8 R之上述大小乃對應於4 〇 英吋程度之大小之高傳真電視之同一色的畫素範圍間隔 或大小。 圖10所示製造裝置1乃對於圖9之基體1〇A之被吐 出部18R、18G、18B,吐出對應彩色濾光片材料的裝置 。具體而言’製造裝置1乃具備於所有被吐出部18R, 塗佈彩色濾光片材料1 1 1R之吐出裝置1〇 〇R,和乾燥被 吐出部1 8 R上之彩色濾光片材料1丨丨r的乾燥裝置丨5 〇 R ’和所有被吐出部1 8 G,塗佈彩色濾光片材料n丨G之吐 出裝置100G,和乾燥被吐出部18G上之彩色濾光片材料 1 1 1 G的乾燥裝置1 5 0 G,和所有被吐出部丨8 b,塗佈彩色 濾光片材料11 1 B之吐出裝置1 〇OB,和乾燥被吐出部 1 8B上之彩色濾光片材料i i 1B的乾燥裝置} 50B,和再 度加熱(熱烘烤)彩色濾光片材料111R、111G、111B之烘 烤爐1 6 0、和於被烘烤之彩色濾光片材料n〗r、n丨g、 1 1 1 B層上,設置保護膜2 0之吐出裝置1 〇 〇 c,和乾燥保 護膜20之乾燥裝置150C,和再度加熱硬化乾燥之保護 膜20的硬化裝置165。更且製造裝置1乃具備依吐出裝 置100R、乾燥裝置150R、吐出裝置100G、乾燥裝置 150G、吐出裝置100B、乾燥裝置150B、吐出裝置i〇OC 、乾燥裝置150C、硬化裝置165之順序,輸送基體ι〇Α 之輸送裝置170。 如圖1 1示所示,吐出裝置1 0 0 R之構成乃與實施例 1之吐出裝置10之構成其本上爲相同的。但,代替墨槽 -34- (32) (32)1269073 101與輸送管11〇,吐出裝置10OR在具備液狀之彩色濾 光片材料111R用之墨槽101R和輸送管110R之部分, 吐出裝置100R構成乃與吐出裝置10〇之構成不同。然而 ,吐出裝置100R之構成要素中,與吐出裝置1〇〇之構成 要素同樣者,則與實施例1同樣附上參照符號,省略重 複之說明。 吐出裝置100G之構成,和吐出裝置ιοοΒ之構成, 和吐出裝置100C之構成乃皆在基本上與吐出裝置1〇〇R 之構造相同。惟,代替吐出裝置1 〇 〇 R之墨槽1 〇 1 R和輸 送管110R,吐出裝置100G具備彩色濾光片材料1110用 之墨槽和輸送管的部分,吐出裝置1 00B之構成乃與吐出 裝置100R不同。同樣地,代替吐出裝置1〇〇r之墨槽 1 0 1 R和輸送管1 1 〇 r,吐出裝置i 〇 〇 B備彩色濾光片材料 111b用之墨槽和輸送管的部分,吐出裝置i〇〇B之構成 乃與吐出裝置100R不同。更且,代替吐出裝置l〇〇R之 墨槽101R和輸送管i iOR,吐出裝置1〇〇G具備彩色濾光 片材料1 1 1G用之墨槽和輸送管的部分,吐出裝置1〇〇c 之構成乃與吐出裝置10 0C不同。然而,本實施例之液狀 之彩色濾光片材料 1 1 1 R、1 1 1 B、1 1 1 G乃本發明之液狀 之材料之一例。 接著’說明吐出裝置10 0R之動作。吐出裝置1〇 〇R 乃於基體1 〇 A上,於配置呈矩陣狀之複數之被吐出部 18R,吐出同一材料。然而,於實施例3〜5中加以說明。 基體10A乃置換呈電激發光顯示裝置用之基板亦可,亦 -35- (33) (33)1269073 可置換呈電漿顯示裝置之背面基板。 圖12之基體10A乃被吐出部18R之長邊方向及短邊 方向’ 一致於X軸方向及γ軸方向地,保持於平台1 06 〇 首先’於1之掃瞄期間開始之前,控制部1 1 2乃含 於對應於吐出資料之重疊部G(圖12中爲Gl,G2..·)之幾 個噴嘴118之X座標會收容於被吐出部18r之X座範圍 地,將托架103、即噴頭群1 14G,對於基體10A,向X 軸方向相對移動。被吐出部1 8 R之X座標範圍乃以被吐 出部18R之長邊之兩端之X座標加以決定之範圍。本實 施例中,被吐出部18R之長邊長度乃約3 00 μηι噴頭群 1 14G之X軸方向之噴嘴間隔ΗΧΡ乃17.5 um。爲此,噴 頭群U4G之16個或17個之噴嘴1 18乃進入至1個之被 吐出部1 8R之X座標範圍。從X座標範圍外之噴嘴1 1 8 乃於掃瞄期間佞,不吐出任何之彩色濾光片材料1 1 1 R。 然而,於本實施例中,「掃猫期間」乃意味如圖29 所示,托架103之一邊乃沿Y軸方向,從掃瞄範圍134 之一端E1(又另一端E2)至另一端E2(或一端E1),進行 一次相對移動之期間。「掃瞄範圍1 3 4」乃意味於基體 1 0 A上之所有被吐出部1 8 R,爲塗佈材料,相對移動托架 1 〇 3之範圍,經由掃瞄範圍1 3 4被覆所有之被吐出部i 8 R 。然而,視情形,用語「掃瞄範圍」乃可意味1個噴嘴 1 1 8相對移動之範圍,亦可意味1個噴嘴1 1 8相對移動之 範圍,並可意味1個噴頭1 1 4相對移動之範圍。 -36- (34) (34)1269073 控制部112乃於每吐出周期EP(圖7(b))之整數倍之 時間間隔,與1個噴嘴1 1 8向Y軸方向排列之被吐出部 18R重疊地,決定托架103之相對移動速度。如此,包 含該1個噴嘴1 1 8之噴嘴列之其他噴嘴1 1 8亦於每每吐 出周期EP之整數倍之時間間隔,與各被吐出部1 8R重疊 。本實施例中,被吐出部18R之Y軸方向之間隔爲LRY( 圖8(b))之故,令對於平台106之托架103之相對速度爲 V時,貝ij V = LRY/(k · EP)。在此,k爲整數。 開始第1之掃瞄期間時,從掃瞄範圍1 34之一端E1 ,Y軸方向之正之方向(圖1 2之紙面上方向),開始相對 移動噴頭群1 14G。結果,以噴嘴列1A、IB、2A、2B、 3A、3B、4A > 4B、5A、5B、6A、6B、7A、7B 之順序, 此等之噴嘴列侵入至對應於被吐出部丨8r之範圍。然而 ,第1之掃瞄期間之間、噴頭群1 1 4 G之X座標則不變 化。 圖1 2所示例中,於從左下之被吐出部1 8 R之左方第 1至第4之彈著位置,從屬於重疊部G1之噴嘴丨丨8,吐 出彩色濾光片材料i丨〗R。從左第5至第8之彈著位置, 則從屬於重疊部G2之噴嘴1 1 8,吐出彩色濾光片材料 1 1 1 R。從左第1 3至第i 6之彈著位置,則從屬於重疊部 G4之噴嘴1 1 8,吐出彩色濾光片材料1 1 1 R。 於1個被吐出部1 8 R內,從複數之重疊部G吐出彩 色濾光片材料1丨〗R之液滴。從各重疊部〇吐出之液滴之 體積(即含於從1個之重疊部G之所有噴嘴1 1 8所吐出之 -37- (35) (35)1269073 液滴的總體積)乃皆爲相同之故,被吐出部1 8R內則經由 彩色濾光片材料1 1 1 R均勻地加以被覆。而且,如實施例 1所說明,屬於各種副範圍SR之噴嘴1 1 8則於噴頭群 1 1 4G,鄰接在X軸方向之故,關連於噴嘴1 1 8之位置之 吐出量差則易於被消除。結果,被吐出部1 8 R彼此間之 塗佈不均亦會不明顯。 更且,根據本實施例時,於1個掃瞄期間內,可於1 個之被吐出部1 8R,吐出必需之體積之彩色濾光片材料 1 1 1R。此乃噴頭群1 14G之X軸方向之噴嘴間隔GXP, 爲1個噴頭1 14之X軸方向之噴嘴間隔HXP之幾近1/4 ,爲此,於1個掃瞄期間內,更多之噴嘴1 1 8則重疊於1 個之被吐出部。 另一方面,如圖12所示,於第1之掃瞄期間內,與 噴嘴列1 A之最左側噴嘴1 1 8,和噴嘴列2 A之從右起第 2之噴嘴1 1 8,和噴嘴列3 A之從右起第2之噴嘴1 1 8, 和噴嘴列4 A之從右起第2之噴嘴1 1 8,一次也不會重疊 於被吐出部1 8R。因此,從此等噴嘴不進行任何之彩色 濾光片材料1 1 1 R之吐出。 第1之掃瞄期終止時,控制部1 1 2乃將噴頭群1丨4 G 向X軸方向相對移動之後,接著開始掃瞄期間,於未塗 佈之被吐出部1 8 R,吐出彩色濾光片材料1丨〗r。 以上,僅說明於被吐出部1 8R塗佈彩色濾光片材料 1 1 1 R之工程。以下,則說明經由製造裝置1至獲得彩色 濾光片基板1 0之一連串工程。 -38- (36) (36)1269073 首先,根據以下之手續,作成圖9之基體1 0 A。首 先,經由濺鍍法或蒸著法,於支持基板1 2上形成金屬薄 膜。之後,經由微縮術工程,從此金屬薄膜形成格子狀 之黑矩陣1 4。黑矩陣1 4之材料例爲金屬鉻或氧化鉻。然 而,支持基板1 2乃對於可視光而言,具有光透過性之基 板,例如玻璃基板。接著,被覆支持基板1 2及黑矩陣1 4 地,塗佈負片型之感光性樹脂組成物所成之光阻層。於 此光阻層上,牙成呈矩陣圖案形狀之光罩薄膜被密著地 ,曝光此光阻層。之後,將光阻層之未曝光部分,以蝕A specific interval LRY along the Y-axis direction of the spouted portions 1 8 R, that is, the interval is approximately 560 μm. This interval is the same as the specific interval L G 沿 along the x-axis direction of the spouted portion g 8 g. It is also the same as the specific interval LB 沿 along the x-axis direction of the spouted portion 1 § 彼此. Further, the plane image of the spouted portion 18R is a rectangle determined by the long side and the short side. Specifically, the length of the axial direction of the spouted portion 18R is approximately 100 μπι, and the length of the X-axis direction is approximately 200 μm. The spouted portion UG and the spouted portion 18' have the same shape and size as the spouted portion 1 8 R. The above-mentioned interval between the discharge portion 1 8 R -33 - (31) (31) 1269073 and the size of the discharge portion 丨 8 R are the same color of the high-definition television of the size of 4 inches. Range interval or size. The manufacturing apparatus 1 shown in Fig. 10 discharges the corresponding color filter material to the discharged portions 18R, 18G, and 18B of the substrate 1A of Fig. 9 . Specifically, the manufacturing apparatus 1 is provided in all of the discharge portions 18R, the discharge device 1〇〇R that applies the color filter material 1 1 1R, and the color filter material 1 on the dried discharge portion 1 8 R. The drying device 丨丨5 〇R ' and all the spouted portions 1 8 G, the discharge device 100G to which the color filter material n丨G is applied, and the color filter material 1 1 on the dried spouted portion 18G 1 G drying device 150 V, and all discharged portions 8 b, coating color filter material 11 1 B discharging device 1 〇 OB, and drying the color filter material on the ejection portion 1 8B Ii 1B drying device} 50B, and reheating (hot baking) the color filter materials 111R, 111G, 111B baking oven 160, and the baked color filter material n〗 R, n On the layer B of 丨g, 1 1 1 , a discharge device 1 〇〇c of the protective film 20, a drying device 150C for drying the protective film 20, and a curing device 165 for reheating and drying the protective film 20 are provided. Further, the manufacturing apparatus 1 is provided with a delivery substrate in the order of the discharge device 100R, the drying device 150R, the discharge device 100G, the drying device 150G, the discharge device 100B, the drying device 150B, the discharge device i〇OC, the drying device 150C, and the curing device 165. 〇Α 输送 conveying device 170. As shown in Fig. 11, the configuration of the discharge device 100R is the same as the configuration of the discharge device 10 of the first embodiment. However, instead of the ink tanks -34-(32) (32)1269073 101 and the transfer tube 11A, the discharge device 10OR is provided with a portion of the ink tank 101R and the transfer tube 110R for the liquid color filter material 111R, and the discharge device The 100R configuration is different from the configuration of the discharge device 10〇. In the same manner as the components of the discharge device 1R, the components of the discharge device 100R are denoted by the same reference numerals as in the first embodiment, and the description thereof will be omitted. The configuration of the discharge device 100G, the configuration of the discharge device ιοοΒ, and the configuration of the discharge device 100C are basically the same as those of the discharge device 1〇〇R. However, instead of the ink tank 1 〇 1 R of the discharge device 1 〇〇R and the transfer tube 110R, the discharge device 100G includes a portion for the ink tank and the transfer tube for the color filter material 1110, and the discharge device 100B is configured and spouted. The device 100R is different. Similarly, instead of the ink tank 1 0 1 R of the discharge device 1〇〇r and the transfer tube 1 1 〇r, the discharge device i 〇〇B prepares the ink tank and the portion of the transfer tube for the color filter material 111b, and the discharge device The configuration of i〇〇B is different from that of the discharge device 100R. Further, in place of the ink tank 101R of the discharge device 100R and the transfer tube i iOR, the discharge device 1A has a portion of the ink tank for the color filter material 1 1 1G and the transfer tube, and the discharge device 1〇〇 The configuration of c is different from the discharge device 100C. However, the liquid color filter materials 1 1 1 R, 1 1 1 B, and 1 1 1 G of the present embodiment are examples of the liquid material of the present invention. Next, the operation of the discharge device 100R will be described. The discharge device 1 〇 R is placed on the substrate 1 〇 A, and a plurality of discharged portions 18R arranged in a matrix are arranged to discharge the same material. However, it is explained in Examples 3 to 5. The substrate 10A may be replaced with a substrate for an electroluminescence display device, and -35-(33) (33) 12279073 may be replaced with a rear substrate of the plasma display device. The base body 10A of FIG. 12 is held in the X-axis direction and the γ-axis direction by the longitudinal direction and the short-side direction of the discharge portion 18R, and is held by the platform 106. First, before the scanning period of 1 is started, the control unit 1 The X coordinate of the nozzles 118 included in the overlapping portion G (G1, G2..· in Fig. 12) corresponding to the discharge data is accommodated in the X seat of the spouted portion 18r, and the bracket 103 is placed. That is, the head group 1 14G moves relative to the base 10A in the X-axis direction. The X coordinate range of the spouted portion 1 8 R is determined by the X coordinate of both ends of the long side of the spout portion 18R. In the present embodiment, the length of the long side of the spouted portion 18R is about 7.5 μm, and the nozzle spacing in the X-axis direction of the head group 1 14G is 17.5 μm. For this reason, 16 or 17 nozzles 18 of the nozzle group U4G enter the X coordinate range of one of the discharge portions 1 8R. From the nozzle 1 1 8 outside the X coordinate range, during the scanning period, no color filter material 1 1 1 R is discharged. However, in the present embodiment, "sweeping period" means that as shown in FIG. 29, one side of the carriage 103 is along the Y-axis direction, from one end E1 (the other end E2) of the scanning range 134 to the other end E2. (or one end E1), during a relative movement. The "scanning range 1 3 4" means that all of the spouted portions 1 8 R on the substrate 10 A are coated materials, and the range of the moving carriage 1 〇 3 is covered by the scanning range 1 3 4 . Is spit out i 8 R. However, depending on the situation, the term "scanning range" means a range in which one nozzle 1 18 is relatively moved, and may also mean a range in which one nozzle 1 18 is relatively moved, and may mean that one nozzle 1 1 4 is relatively moved. The scope. -36- (34) (34) 1269037 The control unit 112 is a discharge portion 18R that is arranged in the Y-axis direction with one nozzle 181 at a time interval of an integral multiple of the discharge period EP (Fig. 7(b)). Overlapping, the relative movement speed of the carriage 103 is determined. In this manner, the other nozzles 1 1 8 including the nozzle rows of the one nozzles 1 18 are overlapped with the respective discharge portions 18R at intervals of an integral multiple of the discharge period EP. In the present embodiment, the interval between the Y-axis directions of the spouted portion 18R is LRY (Fig. 8(b)), so that when the relative velocity of the cradle 103 of the stage 106 is V, ij ν V = LRY / (k) · EP). Here, k is an integer. When the scanning period of the first scanning period is started, the relative movement of the head group 1 14G is started from the positive direction E1 of the scanning range 1 34 and the positive direction of the Y-axis direction (the direction on the paper surface of Fig. 12). As a result, in the order of the nozzle rows 1A, IB, 2A, 2B, 3A, 3B, 4A > 4B, 5A, 5B, 6A, 6B, 7A, 7B, the nozzle rows of the nozzles invade to correspond to the spouted portion 丨8r The scope. However, between the first scan period, the X coordinate of the head group 1 1 4 G is not changed. In the example shown in Fig. 12, the color filter material i is discharged from the nozzle 丨丨8 belonging to the overlapping portion G1 from the first to fourth projecting positions on the left side of the discharge portion 1 8 R from the lower left side. R. From the left fifth to eighth projecting position, the color filter material 1 1 1 R is discharged from the nozzle 1 1 8 belonging to the overlapping portion G2. From the leftmost position of the left thirteenth to the i-th sixth, the color filter material 1 1 1 R is discharged from the nozzle 1 1 8 belonging to the overlapping portion G4. In one of the spouted portions 1 8 R, droplets of the color filter material 1 丨 R are discharged from the plurality of overlapping portions G. The volume of the liquid droplets ejected from each of the overlapping portions (i.e., the total volume of the -37-(35) (35) 1269073 droplets discharged from all the nozzles 1 1 8 of the overlapping portion G) are Similarly, the inside of the spouted portion 1 8R is uniformly covered by the color filter material 1 1 1 R. Further, as described in the first embodiment, the nozzles 1 1 8 belonging to the various sub-ranges SR are adjacent to the head group 1 1 4G, and adjacent to the X-axis direction, the difference in the discharge amount at the position of the nozzles 1 18 is easily eliminate. As a result, the unevenness of coating between the spouted portions 1 8 R is also inconspicuous. Further, according to the present embodiment, the color filter material 1 1 1R of a necessary volume can be ejected in one of the discharge portions 1 8R in one scanning period. This is the nozzle interval GXP of the nozzle group 1 14G in the X-axis direction, which is nearly 1/4 of the nozzle interval HXP of the X-axis direction of one nozzle 1 14 . For this reason, in one scanning period, more The nozzles 1 1 8 are superposed on one of the discharged portions. On the other hand, as shown in FIG. 12, in the first scanning period, the leftmost nozzle 1 1 8 of the nozzle row 1 A and the nozzle 1 1 8 of the nozzle row 2 A from the right from the right are The second nozzle 1 1 8 from the right of the nozzle row 3 A and the second nozzle 1 1 8 from the right of the nozzle row 4 A do not overlap the spout portion 18R once. Therefore, no discharge of any of the color filter materials 1 1 1 R is performed from the nozzles. When the first scanning period is terminated, the control unit 1 1 2 moves the head group 1丨4 G relatively in the X-axis direction, and then starts the scanning period, and discharges the color in the uncoated discharge unit 1 8 R. The filter material is 1 丨 r. In the above, only the process of applying the color filter material 1 1 1 R to the spouted portion 1 8R will be described. Hereinafter, a series of processes for obtaining one of the color filter substrates 10 via the manufacturing apparatus 1 will be described. -38- (36) (36) 1269073 First, the base 10 A of Fig. 9 was produced according to the following procedure. First, a metal thin film is formed on the support substrate 12 by a sputtering method or a vapor deposition method. Thereafter, a grid-like black matrix 14 is formed from the metal thin film via a microscopy process. The material of the black matrix 14 is exemplified by metallic chromium or chromium oxide. However, the support substrate 12 is a light transmissive substrate such as a glass substrate for visible light. Next, the support substrate 1 2 and the black matrix 14 are coated, and a photoresist layer made of a negative-type photosensitive resin composition is applied. On the photoresist layer, the photomask film in the shape of a matrix pattern is adhered to the photoresist layer. After that, the unexposed portion of the photoresist layer is etched
刻處理除去,得間隔壁1 6。經由以上工程,得基體1 〇 A 〇 然而,代替間隔壁1 6,使用樹脂黑所成間隔壁亦可 。此時,金屬薄膜(黑矩陣14)則不需,間隔壁層則僅爲 _層。 接著,經由大氣壓下之氧電漿處理,親液化基體 1 0 A。經由此處理,支持基板1 2,和黑矩陣1 4,和以間 隔壁1 6所規定之各凹部(畫素範圍之一部分)之支持基板 1 2之表面,和黑矩陣14之表面,和間隔壁1 6之表面則 呈親液性。更且,之後,對於基體10 A,進行以4氟化 甲烷爲處理氣體之電漿處理。經由使用4氟化甲烷進行 電漿處理,各凹部之間隔壁1 6之表面被氟化處理(處理 呈疏液性),經由使用4氟化甲烷之電漿處理,先前給予 親液性之支持基板1 2之表面受黑矩陣1 4之表面雖會失 去一些親液性,但是此等表面仍然能維持親液性。由此 -39- (37) 1269073 ,於經由支持基板1 2,和黑矩陣1 4 ’和間隔壁1 6 定之凹部表面,施以特定之表面處理’凹部之表面 爲被吐出部18R、18G、18B。 然而,由於支持基板12之材質、黑矩陣14之 、及間隔壁1 6之材質,即使不進行上述表面處理, 可得呈期望親液性及疏液性之表面之情形。此時, 施以上述表面處理,經由支持基板1 2,和黑矩陣i, 間隔壁16所規定之凹部表面,即爲被吐出部18R 、1 8B 〇 形成被吐出部18R、18G、18B之基體i〇A乃經 送裝置170,運到吐出裝置100R之平台1〇6。然後 圖13(a),吐出裝置100R乃以參照圖13說明之吐出 ,於被吐出部1 8R塗佈彩色濾光片材料丨丨〗R。於所 體10A之被吐出部18R,形成彩色濾光片材料丨丨1R ’輸送裝置17G乃令基體10A位於乾燥裝置i5〇R內 後’完全乾燥被吐出部1 8R上之彩色濾光片材料n 於被吐出部18R上,得濾光片層i11FR。 接著,輸送裝置170乃將基體1〇A位於吐出 100G之平台106。然後,如圖13(B)所示,吐出 100G乃於所有被吐出部18G ’形成彩色濾光片材料 地,從噴頭1 1 4吐出彩色濾光片材料n i G。具體而 吐出裝置100G乃以參照圖12所說明之吐出方法, 吐出部18G塗佈彩色濾光片材料U1G。於所有基體 之被吐出部18G’形成彩色濾光片材料niG時,輸 所規 丨則成 :材質 亦有 無需 4,和 、18G 丨由輸 :,如 丨方法 :有基 層時 丨。然 1R, 裝置 裝置 1 1 1 G 於被 :10A 送裝 -40. (38) 1269073The engraved treatment is removed to obtain a partition wall 16 . Through the above works, the substrate 1 〇 A 〇 is obtained. However, instead of the partition wall 16, a partition wall made of resin black may be used. At this time, the metal thin film (black matrix 14) is not required, and the partition layer is only the _ layer. Next, the substrate was lyophilized to 10 A by treatment with oxygen plasma at atmospheric pressure. By this treatment, the support substrate 12, and the black matrix 14, and the surface of the support substrate 12 which is defined by the partition walls 16 (one part of the pixel range), and the surface of the black matrix 14, and The surface of the partition 16 is lyophilic. Further, after that, for the substrate 10 A, plasma treatment using 4 fluorinated methane as a processing gas is performed. By plasma treatment using 4 fluorinated methane, the surface of the partition wall 16 of each recess is fluorinated (treated as lyophobic), and previously treated with lyophilic support via plasma treatment using 4 fluorinated methane. Although the surface of the substrate 12 is subjected to some lyophilicity by the surface of the black matrix 14, the surfaces are still capable of maintaining lyophilicity. Thus, -39-(37) 1269073, the surface of the concave portion is defined by the support substrate 12, and the black matrix 14' and the partition wall 16. The surface of the concave portion is treated as the spouted portions 18R, 18G, 18B. However, due to the material of the support substrate 12, the material of the black matrix 14, and the material of the partition wall 16, even if the surface treatment is not performed, a surface having a desired lyophilic property and liquid repellency can be obtained. At this time, by the surface treatment described above, the surface of the concave portion defined by the partition wall 16 via the support substrate 12 and the black matrix i, that is, the substrate to be ejected 18R, 18G, and 18B is formed by the discharge portions 18R and 18B. The i〇A is sent to the platform 1〇6 of the ejection device 100R via the delivery device 170. Then, in Fig. 13(a), the discharge device 100R is discharged as described with reference to Fig. 13, and the color filter material 丨丨R is applied to the discharge portion 1 8R. The color filter material 丨丨1R 'transporting device 17G is formed in the spouted portion 18R of the body 10A, and the substrate 10A is placed in the drying device i5〇R, and the color filter material on the spouted portion 1 8R is completely dried. n The filter layer i11FR is obtained on the spouted portion 18R. Next, the transport device 170 places the substrate 1A on the platform 106 where the 100G is discharged. Then, as shown in Fig. 13(B), the discharge 100G is formed by forming the color filter material on all of the discharge portions 18G', and the color filter material n i G is discharged from the head 112. Specifically, the discharge device 100G is a discharge method described with reference to Fig. 12, and the discharge portion 18G applies the color filter material U1G. When the color filter material niG is formed on the sputtered portion 18G' of all the substrates, the specification is as follows: the material is also not required to be 4, and 18G is outputted by, for example, the method: when there is a base layer. However, 1R, device device 1 1 1 G is delivered by :10A -40. (38) 1269073
置17〇則令基體10A位於乾燥位置i5〇G * ^ in 全乾燥被吐出部18G上之彩色濾光片材料lnG, 出部18G上得濾光片層111FG。 接著’輸送裝置170乃令基體1〇A位於吐 100B之平台1〇6。然後,如圖l3(c)所示,吐 100B乃於所有被吐出部18B,形成彩色爐光片材 之層,從噴頭1 1 4吐出彩色濾光片材料丨丨丨B。眞 ,吐出裝置100B乃以參照圖12說明之吐出方g 吐出部18B塗佈彩色濾光片材料ι11β。於所有基 之被吐出部1 8B,形成彩色濾光片材料n i b之層 送裝置170則令基體l〇A位於乾燥裝置i5〇b內。 完全乾燥被吐出部18B上之彩色濾光片材料ηΐί 吐出部18Β上得濾光片層1 1 ifb。 接著,輸送裝置170乃將基體ι〇Α位於吐 100C之平台106。然後,吐出裝置i〇〇c乃被覆濾、 111FR、111FG、111FB及間隔壁16,形成保.護膜 ’吐出液狀之保護膜材料。被覆濾光片層〗i i F R、 、1 1 1FB及間隔壁16,形成保護膜20之後,硬 1 6 5則經由加熱保護膜2 0完全硬化,基體1 〇 A乃 色濾光片基板1 0。 根據本實施例時,於各吐出裝置1 〇 〇 R、1 〇 〇 G ’噴頭群1 14G之X軸方向之噴嘴間隔乃噴頭i】 軸方向之噴嘴間隔之1 / N倍之長度。在此,N乃 頭群114G之噴頭114之數目。爲此,吐出裝置 U戔,完 於被吐 :出裝置 出裝置 料 1 1 1 B ^體而言 t,於被 :體 10A ^時,輸 然後, i,於被 出裝置 光片層 ;20地 1 1 1 FG 化裝置 成爲彩 、1 00B 4之X 含於噴 1 00R、 -41 - (39) (39)1269073 100G、100B之x軸方向之噴嘴線密度較通常之噴墨裝置 之X軸方向之噴嘴線密度爲高。因此,製造裝置1乃僅 變更吐出資料,可於各種大小之被吐出部,塗佈彩色濾 光片材料。更且,製造裝置1乃僅變更吐出資料,可製 造種種之間隔之彩色濾光片基板。 又,根據本實施例時,於各被吐出部 1 8 R、1 8 G、 1 8 B ’從複數之重疊部G吐出反射電極n丨之液滴。從各 重疊部G吐出之液滴之總體積(即從含於一個之所有重疊 部G之所有噴嘴丨丨8吐出之液滴之總體積)乃皆爲相同之 故,被吐出部1 8 R、1 8 G、1 8 B內則經由彩色濾光片材料 1 1 1 R,均勻被覆。而且,如實施例丨所說明,屬於各種 之副範圍SR之噴嘴1 18,於噴頭群1 14G中,鄰接於X 軸方向之故,關連於噴嘴1 1 8之位置之吐出量差則易於 被抵消。結果,被吐出部1 8R彼此間之塗佈不均,或被 吐出部1 8 G彼此間之塗佈不均,或被吐出部1 8 B彼此間 之塗佈不均會變得不明顯。 更且,根據本實施例時,彩色濾光片材料1 1 1 R、 1 11 G、1 1 1 B之液滴乃有彈著於已以液滴被覆之2個之位 置之中間位置的情形。爲此,之後,彈著之液滴乃對於 自我之彈著位置呈對稱之2個之位置中,與前先彈著之2 個液滴接觸。爲此,於後彈著之液滴乃擴散呈從該彈著 位置對稱之形狀。由此理由,根據本實施例之吐出方法 ,難以產生彩色濾光片材料1 1 1 R、1 1 1 G、1 1 1 B之塗佈 不均。 -42 - (40) 1269073 【實施例3】 製 置 於 層 36 之 視 又 矩 狀 由 Μ 方 加 複 之 複 接著,說明將本發明適用於電激發光顯示裝置之 造裝置。 圖14(a)及(b)所示基體30A乃經由後述之製造裝 2(圖15)所成處理,成爲電激發光顯示裝置30之基板 基體30A乃具有配置呈矩陣狀之複數之被吐出部38R 38G、38B。 具體而言,基體30A乃具有支持基板32、和形成 支持基板3 2上之電路元件層3 4,和形成於電路元件 34上之複數之畫素電極36,和形成於複數之畫素電極 間之間隔壁40。支持基板乃對於可視光具有光透過性 基板,例如玻璃基板。各複數之畫素電極3 6乃對於可 光具有光透過性之電極,例如IT 0 (銦錫氧化物)電極。 ,複數之畫素電極3 6乃於電路元件層3 4上,配置呈 陣狀,各規定畫素範圍。然後,間隔壁40乃具有格子 之形狀,包圍各複數之畫素電極3 6。又,間隔壁40乃 形成於電路元件層3 4上之無機物間隔壁40 A,和位於 機物間隔壁40A有機物間隔壁40B所成。 電路元件層34乃具有於支持基板32上向特定之 向延伸之複數之掃猫電極,和被覆複數之掃目苗電極地 以形成之絕緣膜42,和位於絕緣膜42上的同時,對於 數之掃瞄電極延伸之方向,向正交之方向延伸之複數 信號電極,和位於掃瞄電極及信號電極之交點附近之 -43- (41) (41)1269073 數之開關元件44,被覆複數之開關元件44地所形成聚醯 亞胺等之層間絕緣膜45的層。各開關元件44之閘極電 極44G及源極電極44S乃與各對應之掃瞄電極及對應之 信號電極碗性連接。於層間絕緣膜45上,位有複數之畫 素電極36。於層間絕緣膜45中,在於對應於各開關元件 44之汲極電極44D的部位,設置穿孔44V,藉由此穿孔 44 V,形成開關元件44,和對應之畫素電極3 6間之電性 連接。又,於對應於間隔壁40之位置,位有各別之開關 元件44。即,從垂直於圖13(b)之紙面之方向觀察時,各 複數之開關元件44乃被覆於開關元件44地加以定位。 基體30A之畫素電極36和間隔壁40所規定之凹部( 畫素範圍之一部分)乃對應於被吐出部3 8R、被吐出部 38G、被吐出部38B。被吐出部38R乃欲形成紅色之波長 域之光線的發光層2 11 FR之範圍,被吐出部3 8 G乃欲形 成綠色之波長域之光線的發光層21 1FG之範圍,被吐出 部38B乃欲形成藍色之波長域之光線的發光層211GB之 範圍。 圖14(b)所示之基體30A乃於X軸方向和Y軸方向 之雙方,位於平行之假想平面上。然後,形成複數之被 吐出部3 8 R、3 8 G、3 8 B之矩陣之行方向及列方向,乃各 與X軸方向及Y軸方向平行。於基體3 0A,被吐出部 3 8R、被吐出部38G、被吐出部38B乃於Y軸方向,以此 順序周期性排列。另一方面,被吐出部3 8 R彼此乃於X 軸方向,隔著特定之一定間隔,排列呈一列,又,被吐 -44- (42) (42)1269073 出部3 8G彼此乃於X軸方向,隔著特定之一定間隔,排 列呈一列,同樣,被吐出部3 8B彼此乃於X軸方向,隔 著特定之一定間隔,排列呈一列。然而,X軸方向及γ 軸方向乃相互正交。 沿被吐出部38R彼此之Y軸方向之特定間隔LRY, 即間隔乃幾近5 6 0 μπι。此間隔乃與沿被吐出部3 8 G彼此 之Υ軸方向之特定間隔LGY相同,亦與沿被吐出部1 8Β 彼此之Υ軸方向之特定間隔LB Υ相同。又,被吐出部 3 8R之平面像乃以長邊和短邊決定之矩形。具體而言, 被吐出部38R之Y軸方向之長度乃幾近1〇〇 μπι,X軸方 向之長度乃幾近300 μπι。被吐出部38G及被吐出部38Β 亦與被吐出部3 8R有同樣之形狀·大小。 被吐出部38R彼此之上述間隔及被吐出部38R之上 述大小乃對應於40英吋程度之大小之高傳真電視之同一 色的畫素範圍間隔或大小。 圖15所示製造裝置2乃對於圖14之基體3 0Α之被 吐出部38R、38G、38Β,吐出對應發光材料的裝置。製 造裝置2乃具備於所有被吐出部3 8 R,塗佈發光材料 211R之吐出裝置200R,和乾燥被吐出部38R上之發光 材料2 1 1 R的乾燥裝置2 5 0 R,和所有被吐出部3 8 G,塗 佈發光材料21 1G之吐出裝置200G,和乾燥被吐出部 3 8 G上之發光材料2 1 1 G的乾燥裝置2 5 0 G,和所有被吐 出部38Β,塗佈發光材料21 1Β之吐出裝置200Β,和乾 燥被吐出部3 8 Β上之發光材料2 1 1 Β的乾燥裝置2 5 0 Β。 -45- (43) (43)1269073 更且製造裝置2乃具備依吐出裝置2 0 OR、乾燥裝置25 OR 、吐出裝置200G、乾燥裝置250G、吐出裝置200B、乾 燥裝置250B之順序,輸送基體30A之輸送裝置270。 圖16所示吐出裝置200R乃具備保持液狀之發光材 料211R之墨槽201R,和輸送管210R,藉由輸送管210R ,從墨槽2 0 1 R供給發光材料2 1 1 R的吐出掃瞄部1 02。 吐出掃瞄部102之構成乃實施例1之吐出掃瞄部1〇2 (圖 1)之構成相同之故,同樣之構成要素則附上同一之參照 符號的同時,省略重複之說明。又,顯示裝置2 0 0 G之構 成,和顯示裝置20 0B之構成乃皆在基本上與吐出裝置 200R之構造相同。惟,代替墨槽201R和輸送管210R, 吐出裝置200G具備發光材料211G用之墨槽和輸送管的 部分,吐出裝置200g之構成乃與吐出裝置200R不同。 同樣地,代替墨槽2 01R和輸送管210R,吐出裝置200B 具備發光材料201B用之墨槽和輸送管的部分,吐出裝置 200B之構成乃與吐出裝置20 0R不同。然而,本實施例 之液狀之發光材料2 1 1 R、2 1 1 B、2 1 1 G乃本發明之液狀 之材料之一例。 說明使用製造裝置2之電激發光顯示裝置30之製造 方法。首先,使用公知之製膜技術和圖案化技術,製造 圖14所示基體30A。 接者’經由大热壓下之氧電榮處理,親液化基體 3 0 A。經由此處理,畫素電極3 6和間隔壁4 0所規定之各 凹部(晝素範圍之一部分)之晝素電極36之表面,和無機 -46- (44) (44)1269073 物間隔壁4 0 A之表面及有機物間隔壁4 0 B之表面則呈親 液性。更且,之後,對於基體3 0 A,進行以4氟化甲烷 爲處理氣體之電漿處理。經由使用4氟化甲烷進行電漿 處理,各凹部之有機物間隔壁40B之表面被氟化處理(處 理呈疏液性),由此,有機物間隔壁40B之表面則成爲疏 液性。然而,經由使用4氟化甲烷之電漿處理,先前給 予親液性之畫素電極36及無機物間隔壁40A之表面雖會 失去一些親液性,但是仍然能維持親液性。由此,於經 由畫素電極3 6,和間隔壁1 6所規定之凹部表面,施以特 定之表面處理,凹部之表面則成爲被吐出部38R、38G、 38B 〇 然而,由於畫素電極36之材質、間隔壁40之材質 、及間隔壁40之材質,即使不進行上述表面處理,亦有 可得呈期望親液性及疏液性之表面之情形。此時,無需 施以上述表面處理,經由畫素電極3 6,和間隔壁4 0所規 定之凹部表面,即爲被吐出部38R、38G、38B。 在此,於各施以表面處理之複數之畫素電極3 6上, 形成對應之正孔輸送層37R、37G、37B亦可。正孔輸送 層3711、370、378,位於畫素電極36,和後述之發光層 2 1 1RF、21 1GF、21 1BF間,提供電激發光顯示裝置之發 光效率。於各複數之畫素電極36上,設置正孔輸送層時 ,經由正孔輸送層,和間隔壁40所規定之凹部乃對應於 被吐出部3 8 R、3 8 G、3 8 B。 然而,可將正孔輸送層37R、37G、37B經由噴墨法 -47- (45) 1269073 加以形成。此時,將爲形成正孔輸送層37R、37G、37B 之材料的溶液,於每各畫素範圍,以特定量加以塗佈, 之後,經由加以乾燥,形成正孔輸送層。 形成被吐出部38R、38G、38B之基體30A乃經由輸 送裝置270,運到吐出裝置200R之平台1〇6。然後,如 圖i7(a)所示,吐出裝置200R乃於所有被吐出部38R, 形成發光材料2 1 1 R之層地,從噴頭1 1 4吐出發光材料 211R。具體而言,吐出裝置200R乃以參照圖12說明之 吐出方法,於被吐出部3 8 R塗佈發光材料2 1 1 R。於所有 基體30A之被吐出部38R,形成發光材料21 1R層時,輸 送裝置270乃令基體30A位於乾燥裝置2 5 0R內。然後, 完全乾燥被吐出部3 8R上之彩色濾光片材料2 1 1 R,於被 吐出部38R上,得濾光片層21 1FR。 接著,輸送裝置270乃將基體30A位於吐出裝置 200G之平台206。然後,如圖17(b)所示,吐出裝置 2 0 0G乃於所有被吐出部38G,形成發光材料21 1G地, 從噴頭114吐出發光材料211G。具體而言,吐出裝置 200G乃以參照圖所說明之吐出方法,於被吐出部 3 8G塗佈發光材料21 1G。於所有基體30A之被吐出部 38G,形成發光材料211G層時,輸送裝置270則令基體 3 0 A位於乾燥位置2 5 0 G內。然後,完全乾燥被吐出部 3 8 G上之發光材料2 1 1 G,於被吐出部3 8 G上得濾光片層 2 1 1 FG。 接著,輸送裝置2 70乃令基體30A位於吐出裝置 -48- (46) (46)1269073 200B之平台206。然後,如圖17(c)所示,吐出裝置 2〇〇B乃於所有被吐出部38B,形成發光材料21 1B之層 ,從噴頭1 1 4吐出發光材料2 1 1 B。具體而言,吐出裝置 2 0 0B乃以參照圖12說明之吐出方法,於被吐出部38B 塗佈發光材料211B。於所有基體30A之被吐出部38B, 形成發光材料211B之層時,輸送裝置270則令基體3 0A 位於乾燥裝置2 5 0B內。然後,完全乾燥被吐出部38B上When 17 turns, the substrate 10A is placed at the dry position i5〇G*^in to dry the color filter material lnG on the spouted portion 18G, and the filter layer 111FG is obtained on the exit portion 18G. Next, the transport device 170 is such that the substrate 1A is located on the platform 1〇6 of the spit 100B. Then, as shown in Fig. 13 (c), the spout 100B forms a layer of the colored furnace light sheet in all of the discharged portions 18B, and discharges the color filter material 丨丨丨B from the head 112.眞 The discharge device 100B applies the color filter material ι11β to the discharge unit g discharge unit 18B described with reference to Fig. 12 . The layering device 170 for forming the color filter material n i b is disposed in the drying device i5〇b at all of the substrate 10 8B. The color filter material ηΐί on the ejection portion 18B is completely dried, and the filter layer 1 1 ifb is obtained. Next, the transport device 170 places the substrate ι on the platform 106 of the spit 100C. Then, the discharge device i〇〇c is coated with a filter, 111FR, 111FG, 111FB, and a partition wall 16 to form a protective film material which is discharged into a protective film. After the protective film 20 is formed, the filter layer is formed, and the hard film 16 is completely cured by the heating protection film 20, and the substrate 1 〇A is the color filter substrate 10 . According to the present embodiment, the nozzle interval in the X-axis direction of each of the discharge devices 1 〇 〇 R, 1 〇 〇 G ′ head group 1 14G is 1 / N times the nozzle interval of the nozzle i] in the axial direction. Here, N is the number of heads 114 of the head group 114G. To this end, the spouting device U戋, after the spit is discharged: the device discharge device 1 1 1 B ^ body t, when the body 10A ^, then, i, at the device light sheet; The ground 1 1 1 FG device becomes a color, 100 B 4 X is contained in the jet 1 00R, -41 - (39) (39) 12279073 100G, 100B, the nozzle line density in the x-axis direction is higher than that of the conventional ink jet device. The nozzle line density in the axial direction is high. Therefore, the manufacturing apparatus 1 can apply only the discharge data, and can apply the color filter material to the discharge portions of various sizes. Further, in the manufacturing apparatus 1, only the discharge data can be changed, and various color filter substrates can be manufactured. Further, according to the present embodiment, the droplets of the reflective electrode n丨 are discharged from the plurality of overlapping portions G at the respective discharge portions 1 8 R, 1 8 G, and 1 8 B '. The total volume of the liquid droplets ejected from the respective overlapping portions G (i.e., the total volume of the liquid droplets ejected from all the nozzles 8 included in all of the overlapping portions G) is the same, and the spouted portion is 1 8 R In the case of 1 8 G and 1 8 B, the color filter material 1 1 1 R is uniformly coated. Further, as described in the embodiment, the nozzles 1 18 belonging to the various sub-ranges SR are adjacent to the X-axis direction in the head group 1 14G, and the difference in the discharge amount at the position of the nozzles 1 18 is easily offset. As a result, coating unevenness between the spouted portions 1 8R or coating unevenness between the spouted portions 1 8 G or unevenness in coating between the spouted portions 1 8 B becomes inconspicuous. Furthermore, according to the present embodiment, the droplets of the color filter materials 1 1 1 R, 1 11 G, and 1 1 1 B are in the middle of the position where the two droplets have been covered. . For this reason, the droplets that are played are then in contact with the two droplets that were previously played in the position where the droplets of the self are symmetrical. For this reason, the droplets that are played back are diffused in a shape symmetrical from the position of the projectile. For this reason, according to the discharge method of the present embodiment, it is difficult to cause uneven coating of the color filter materials 1 1 1 R, 1 1 1 G, and 1 1 1 B. -42 - (40) 1269073 [Embodiment 3] The present invention is applied to an apparatus for electroluminescent display device, which is formed by the addition of the layer 36 and the rectangular shape. The substrate 30A shown in Figs. 14(a) and 14(b) is processed by a manufacturing device 2 (Fig. 15) which will be described later, and the substrate substrate 30A which is the electroluminescent display device 30 has a plurality of substrates which are arranged in a matrix. Parts 38R 38G, 38B. Specifically, the substrate 30A has a support substrate 32, and a circuit element layer 34 formed on the support substrate 32, and a plurality of pixel electrodes 36 formed on the circuit element 34, and formed between the plurality of pixel electrodes. The partition wall 40. The support substrate is a light transmissive substrate such as a glass substrate for visible light. Each of the plurality of pixel electrodes 36 is an electrode having light transmissivity, such as an IT 0 (indium tin oxide) electrode. The plurality of pixel electrodes 36 are arranged on the circuit element layer 34 in a matrix, each of which has a predetermined pixel range. Then, the partition wall 40 has a lattice shape surrounding each of the plurality of pixel electrodes 36. Further, the partition wall 40 is formed of the inorganic partition wall 40A formed on the circuit element layer 34 and the organic partition wall 40B of the machine partition wall 40A. The circuit element layer 34 has a plurality of spur electrodes on the support substrate 32 extending in a specific direction, and an insulating film 42 formed by coating a plurality of smear electrodes, and on the insulating film 42, The scanning electrode extends in a direction of a plurality of signal electrodes extending in an orthogonal direction, and a switching element 44 of -43-(41) (41) 1260073 located near the intersection of the scanning electrode and the signal electrode is covered with a plurality of The switching element 44 is formed of a layer of an interlayer insulating film 45 of polyimide or the like. The gate electrode 44G and the source electrode 44S of each switching element 44 are connected to the respective scan electrodes and the corresponding signal electrodes. On the interlayer insulating film 45, a plurality of pixel electrodes 36 are placed. In the interlayer insulating film 45, a via hole 44V is provided in a portion corresponding to the drain electrode 44D of each switching element 44, whereby the switching element 44 is formed by the via hole 44V, and the electrical property between the corresponding pixel electrode 36 is formed. connection. Further, at the position corresponding to the partition wall 40, respective switching elements 44 are located. That is, when viewed in a direction perpendicular to the plane of the paper of Fig. 13 (b), the plurality of switching elements 44 are positioned over the switching element 44. The concave portion (a part of the pixel range) defined by the pixel electrode 36 of the base 30A and the partition wall 40 corresponds to the discharge portion 38R, the discharge portion 38G, and the discharge portion 38B. The discharge portion 38R is a range of the light-emitting layer 2 11 FR of the light beam in the wavelength region to be red, and the discharge portion 38 G is a range of the light-emitting layer 21 1FG which is a light beam to form a green wavelength region, and the discharge portion 38B is a portion The range of the luminescent layer 211 GB of light that is intended to form a blue wavelength region. The base 30A shown in Fig. 14 (b) is located on the imaginary plane parallel to both the X-axis direction and the Y-axis direction. Then, the row direction and the column direction of the matrix of the plurality of spouted portions 3 8 R, 3 8 G, and 3 8 B are formed in parallel with the X-axis direction and the Y-axis direction. In the base body 30A, the discharge portion 38R, the discharge portion 38G, and the discharge portion 38B are periodically arranged in this order in the Y-axis direction. On the other hand, the spouted portions 3 8 R are arranged in a row at a predetermined interval in the X-axis direction, and are spit-44-(42) (42) 1226073. The axial direction is arranged in a line at a predetermined interval, and similarly, the discharged portions 38B are arranged in a line in a predetermined interval at a predetermined interval in the X-axis direction. However, the X-axis direction and the γ-axis direction are orthogonal to each other. The specific interval LRY along the Y-axis direction of the spouted portions 38R, that is, the interval is approximately 560 μm. This interval is the same as the specific interval LGY along the x-axis direction of the spouted portion 3 8 G, and is also the same as the specific interval LB 沿 along the x-axis direction of the spouted portion 18 8 . Further, the plane image of the spouted portion 3 8R is a rectangle determined by the long side and the short side. Specifically, the length of the spouted portion 38R in the Y-axis direction is approximately 1 〇〇 μπι, and the length of the X-axis direction is approximately 300 μπι. The discharge portion 38G and the discharge portion 38A have the same shape and size as the discharge portion 38R. The above-described interval between the discharge portions 38R and the above-described size of the discharge portion 38R correspond to a pixel interval or size of the same color of a high-definition television of a size of 40 inches. The manufacturing apparatus 2 shown in Fig. 15 is a device for discharging the corresponding luminescent material to the discharged portions 38R, 38G, and 38 of the substrate 30 of Fig. 14 . The manufacturing apparatus 2 is provided in all the discharge parts 3 8 R, the discharge apparatus 200R to which the luminescent material 211R is applied, and the drying apparatus 2 5 0 R which illuminates the luminescent material 2 1 1 R on the discharge part 38R, and all of the discharge apparatus 2 The portion 3 8 G, the discharge device 200G coated with the luminescent material 21 1G, and the drying device 2 5 0 G for drying the luminescent material 2 1 1 G on the discharge portion 3 8 G, and all the discharged portions 38 Β, coated with luminescence The material 21 is discharged from the discharge device 200 Β, and the drying device 2 5 Β of the luminescent material 2 1 1 Β on the discharge portion 3 8 Β is dried. -45- (43) (43) 1269073 The manufacturing apparatus 2 further has a transport base 30A in the order of the discharge device 20 OR, the drying device 25 OR, the discharge device 200G, the drying device 250G, the discharge device 200B, and the drying device 250B. Conveying device 270. The discharge device 200R shown in Fig. 16 is provided with an ink tank 201R for holding a liquid luminescent material 211R, and a transfer tube 210R for supplying a discharge scan of the luminescent material 2 1 1 R from the ink tank 2 0 1 R by a transfer tube 210R. Department 1 02. The configuration of the discharge scanning unit 102 is the same as that of the discharge scanning unit 1 2 (Fig. 1) of the first embodiment, and the same components are denoted by the same reference numerals, and the description thereof will not be repeated. Further, the configuration of the display device 200G and the configuration of the display device 20B are basically the same as those of the discharge device 200R. However, in place of the ink tank 201R and the transfer tube 210R, the discharge device 200G includes a portion for the ink tank and the transfer tube for the luminescent material 211G, and the discharge device 200g is different from the discharge device 200R. Similarly, instead of the ink tank 201R and the transfer tube 210R, the discharge device 200B is provided with a portion for the ink tank and the transfer tube for the light-emitting material 201B, and the discharge device 200B is configured differently from the discharge device 20 0R. However, the liquid luminescent materials 2 1 1 R, 2 1 1 B, and 2 1 1 G of the present embodiment are examples of the liquid material of the present invention. A method of manufacturing the electroluminescence display device 30 using the manufacturing apparatus 2 will be described. First, the substrate 30A shown in Fig. 14 is produced by using a known film forming technique and patterning technique. The receiver's liquefaction of the substrate 30 A by oxygen treatment under a large heat. By this treatment, the surface of the pixel electrode 36 of each of the recesses (one part of the pixel range) specified by the pixel electrode 36 and the partition wall 40, and the inorganic-46-(44) (44) 1227073 partition wall 4 The surface of 0 A and the surface of the organic partition wall 40 B are lyophilic. Further, after that, for the substrate 30 A, plasma treatment with 4 fluorinated methane as a processing gas was performed. By plasma treatment using tetrafluoromethane, the surface of the organic partition wall 40B of each concave portion is subjected to fluorination treatment (the treatment is lyophobic), whereby the surface of the organic partition wall 40B becomes liquid repellency. However, the surface of the previously obtained lyophilic pixel electrode 36 and inorganic partition wall 40A loses some lyophilicity by plasma treatment using 4-fluorinated methane, but still maintains lyophilicity. Thereby, a specific surface treatment is applied to the surface of the concave portion defined by the pixel electrode 36 and the partition wall 16, and the surface of the concave portion becomes the discharged portion 38R, 38G, 38B. However, due to the pixel electrode 36 The material, the material of the partition wall 40, and the material of the partition wall 40 may have a surface having a desired lyophilic property and liquid repellency without performing the above surface treatment. At this time, it is not necessary to apply the above-described surface treatment, and the surface of the concave portion defined by the pixel electrode 36 and the partition wall 40 is the discharged portions 38R, 38G, and 38B. Here, the corresponding positive hole transport layers 37R, 37G, and 37B may be formed on each of the plurality of surface-treated pixel electrodes 36. The positive hole transporting layers 3711, 370, and 378 are located between the pixel electrodes 36 and the light-emitting layers 2 1 1RF, 21 1GF, and 21 1BF to be described later, and provide the light-emitting efficiency of the electroluminescence display device. When the positive hole transport layer is provided on each of the plurality of pixel electrodes 36, the concave portion defined by the vertical hole transport layer and the partition wall 40 corresponds to the discharge portions 3 8 R, 3 8 G, and 3 8 B. However, the positive hole transport layers 37R, 37G, 37B can be formed via the ink jet method -47-(45) 1269073. At this time, a solution for forming the material of the positive hole transport layers 37R, 37G, and 37B is applied in a specific amount for each pixel range, and then dried to form a positive hole transport layer. The substrate 30A forming the discharge portions 38R, 38G, and 38B is transported to the stage 1〇6 of the discharge device 200R via the transport device 270. Then, as shown in Fig. i7(a), the discharge device 200R forms a layer of the luminescent material 2 1 1 R in all of the discharged portions 38R, and discharges the luminescent material 211R from the head 1 1 4 . Specifically, the discharge device 200R applies the luminescent material 2 1 1 R to the discharged portion 380 R by the discharge method described with reference to Fig. 12 . When the luminescent material 21 1R layer is formed in the sputtered portion 38R of all the substrates 30A, the transporting device 270 places the substrate 30A in the drying device 250R. Then, the color filter material 2 1 1 R on the discharge portion 38R is completely dried, and the filter layer 21 1FR is obtained on the discharge portion 38R. Next, the transport device 270 places the substrate 30A on the platform 206 of the discharge device 200G. Then, as shown in Fig. 17 (b), the discharge device 200G is formed of the luminescent material 21 1G in all of the discharged portions 38G, and the luminescent material 211G is discharged from the head 114. Specifically, the discharge device 200G applies the luminescent material 21 1G to the discharged portion 380G by the discharge method described with reference to the drawings. When the luminescent material 211G layer is formed in the sputtered portion 38G of all the substrates 30A, the transporting device 270 places the substrate 30A in the dry position 2500 G. Then, the luminescent material 2 1 1 G on the spouted portion 3 8 G is completely dried, and the filter layer 2 1 1 FG is obtained on the spun portion 3 8 G. Next, the delivery device 270 is such that the substrate 30A is positioned on the platform 206 of the ejection device -48-(46) (46) 1260073 300B. Then, as shown in Fig. 17 (c), the discharge device 2A is formed as a layer of the luminescent material 21 1B in all of the discharged portions 38B, and the luminescent material 2 1 1 B is discharged from the head 1 1 4 . Specifically, the discharge device 200B is coated with the luminescent material 211B at the discharge portion 38B by the discharge method described with reference to FIG. When the layer of the luminescent material 211B is formed in the spouted portion 38B of all the substrates 30A, the transporting device 270 places the substrate 30A in the drying device 250B. Then, it is completely dried on the spouted portion 38B.
之發光材料2 11B,於被吐出部38B上得濾光片層211FB 〇 如圖17所示,接著被覆發光層21 1FR、21 1FG、 21 1FB及間隔壁40地,設置對向電極46。對向電極46 乃做爲陰極加以工作。 之後,將封閉基板4 8和基體3 0 A,於相互周邊部加 以連接,得圖17(d)所示電激發光顯示裝置30。然而,3 封閉基板48和基體30A間,封入不活性氣體49。 於電激發光顯示裝置30中,從發光層211 FR、 211FG、211FN發光之光線乃藉由畫素電極36、電路元 件層3 4、支持基板3 2射出。如此,藉由電路元件層3 4 ,射出光線之電激發光顯示裝置乃稱爲底放射型之顯示 裝置。 根據本實施例時,於各吐出裝置200R、200G、200B ,噴頭群1 1 4 G之X軸方向之噴嘴間隔乃噴頭1 1 4之X 軸方向之噴嘴間隔之1 /N倍之長度。在此,N乃含於噴 頭群1 14G之噴頭1 14之數目。爲此,吐出裝置2 00R、 -49- (47) 1269073 2 α 〇 G、2 GOB之X軸方向之噴嘴線密度較通常之噴 之x軸方向之噴嘴線密度爲高。因此,製造裝置 變更吐出資料,可於各種大小之被吐出部,塗佈 料。更且’製造裝置2乃僅變更吐出資料,可製 之間隔之電激發光顯示裝置。 又’根據本實施例時,於各1個之被吐出部 3 8 G、3 8 B,從複數之重疊部G吐出發光材料 2 1 1 G、2 1 1 B之液滴,乃有彈著於已被液滴被覆之 位置之中間位置之情形。爲此,之後,彈著之液 於自我之彈著位置呈對稱之2個之位置中,與前 之2個液滴接觸。爲此,於後彈著之液滴乃擴散 彈著位置對稱之形狀。由此理由,根據本實施例 方法,難以產生發光材料 211R、211G、211B之 均。 【實施例4】 說明將本發明適用於電漿顯示裝置之背面基 造裝置。 圖18(a)及(b)所示基體50A乃經由後述之製 3 (圖19)所成處理,成爲電漿顯示裝置之背面基板 基板。基體5 0 A乃具有配置呈矩陣狀之複數之被 58R、58G、58B。 具體而言,基體5 0A乃包含支持基板32、和 基板5 2上形成呈條紋狀位址電極54,和被覆位 墨裝置 2乃僅 發光材 造種種 3 8R、 21 1R、 2個之 滴乃對 先彈著 呈從該 之吐出 塗佈不 板之製 造裝置 50B之 吐出部 於支持 址電極 -50· (48) 1269073 54而形成之介電質玻璃層50’和具有格子形狀之 規定複數之畫素範圍之間隔壁6 〇。複數之畫素範 位呈矩陣狀’形成複數之畫素範圍之各矩陣列乃 各複數之位址電極54。如此之基體50A乃以公知 印刷技術加以形成。 基體3 0A之各畫素範圍中,介電質玻璃層56 壁60所規定之凹部乃對應於被吐出部58R、被 58G、被吐出部58B。被吐出部58R乃欲形成紅色 域之光線的螢光層3 1 1 FR之範圍,被吐出部5 8 G 成綠色之波長域之光線的螢光層3 1 1 F G之範圍, 部58B乃欲形成藍色之波長域之光線的螢光層31 範圍。 圖18(b)所示之基體50A乃於X軸方向和Y 之雙方,位於平行之假想平面上。然後,形成複 吐出部58R、58G、58B之矩陣之行方向及列方向 與X軸方向及 Y軸方向平行。於基體50A,被 5 8R、被吐出部58G、被吐出部58B乃於Y軸方向 順序周期性排列。另一方面,被吐出部5 8 R彼此 軸方向,隔著特定之一定間隔,排列呈一列,又 出部58G彼此乃於X軸方向,隔著特定之一定間 列呈一列,同樣,被吐出部5 8 B彼此乃於X軸方 著特定之一定間隔,排列呈一列。然而,X軸方丨 軸方向乃相互正交。 沿被吐出部5 8 R彼此之Y軸方向之特定間隔 同時, 圍乃定 對應於 之網版 及間隔 吐出部 之波長 乃欲形 被吐出 1FB之 軸方向 數之被 ,乃各 吐出部 ,以此 乃於X ,被吐 隔,排 向,隔 向及 Y LRY, -51 - (49) (49)1269073 即間隔乃幾近5 6 0 μπι。此間隔乃與沿被吐出部5 8 G彼此 之Y軸方向之特定間隔L G Y相同。亦與沿被吐出部5 8 B 彼此之Y軸方向之特定間隔LB Y相同。又,被吐出部 5 8 R之平面像乃以長邊和短邊決定之矩形。具體而言, 被吐出部58R之Y軸方向之長度乃幾近1〇〇 μηι,X軸方 向之長度乃幾近300 μπι。被吐出部58G及被吐出部58Β 亦與被吐出部58R有同樣之形狀·大小。 被吐出部58R彼此之上述間隔及被吐出部58r之上 述大小乃對應於4 0英吋程度之大小之高傳真電視之同一 色的畫素範圍間隔或大小。 圖19所示製造裝置3乃對於圖18之基體5 0Α之被 吐出部 58R、58G、58Β,吐出對應螢光材料的裝置。具 體而言,製造裝置3乃具備於所有被吐出部58R,塗佈 螢光材料311R之吐出裝置3 00R,和乾燥被吐出部58R 上之螢光材料31 1R的乾燥裝置3 5 0R,和所有被吐出部 5 8G,塗佈螢光材料31 1G之吐出裝置3 00G,和乾燥被吐 出部5 8 G上之螢光材料3 1 1 G的乾燥裝置3 5 0 G,和所有 被吐出部58B,塗佈螢光材料311B之吐出裝置100B, 和乾燥被吐出部5 8 B上之螢光材料3 1 1 B的乾燥裝置 3 5 0B。更且製造裝置3乃具備依吐出裝置3 00R、乾燥裝 置3 5 0R、吐出裝置3 00G、乾燥裝置3 5 0G、吐出裝置 3 00B、乾燥裝置3 5 0B之順序,輸送基體50A之輸送裝 置 3 7 0 〇 圖20所示吐出裝置3 00R乃具備保持液狀之螢光材 -52- (50) (50)1269073 料311R之墨槽301R,和輸送管310R,藉由輸送管310R ,從墨槽3 0 1 R供給彩色濾光片材料的吐出掃瞄部1 〇2。 吐出掃瞄部1 〇2之構成乃於實施例1說明之故,省略重 複之說明。 顯示裝置3 00G之構成,和顯示裝置3 00B之構成乃 皆在基本上與吐出裝置3 0 0R之構造相同。惟,代替墨槽 301R和輸送管310R,吐出裝置3 00G具備螢光材料31 1G 用之墨槽和輸送管的部分,吐出裝置3 00G之構成乃與吐 出裝置3 00R不同。同樣地,代替墨槽301R和輸送管 310R,吐出裝置300B具備螢光材料311B用之墨槽和輸 送管的部分,吐出裝置3 00B之構成乃與吐出裝置3 00R 不同。然而,本實施例之液狀之螢光材料3 1 1R、3 1 1B、 3 1 1 G乃本發明之液狀之材料之一例。 說明使用製造裝置3之電漿顯示裝置之製造方法。 首先,經由公知之網版印刷技術,於支持基板5 2上,形The light-emitting material 2 11B has a filter layer 211FB on the discharge portion 38B. As shown in Fig. 17, the counter electrode 46 is provided by coating the light-emitting layers 21 1FR, 21 1FG, 21 1FB and the partition wall 40. The counter electrode 46 operates as a cathode. Thereafter, the substrate 48 and the substrate 30A are closed and connected to each other at the peripheral portion, whereby the electroluminescent display device 30 shown in Fig. 17(d) is obtained. However, between the closed substrate 48 and the substrate 30A, the inert gas 49 is sealed. In the electroluminescence display device 30, light emitted from the light-emitting layers 211 FR, 211FG, and 211FN is emitted by the pixel electrode 36, the circuit element layer 34, and the support substrate 32. Thus, the electric excitation light display device that emits light by the circuit element layer 34 is called a bottom emission type display device. According to the present embodiment, in each of the discharge devices 200R, 200G, and 200B, the nozzle interval in the X-axis direction of the head group 1 1 4 G is 1/N times the nozzle interval in the X-axis direction of the head 1 1 4 . Here, N is the number of the heads 14 14 included in the head group 1 14G. For this reason, the nozzle line density in the X-axis direction of the discharge device 2 00R, -49-(47) 1269073 2 α 〇 G, 2 GOB is higher than the nozzle line density in the x-axis direction of the normal spray. Therefore, the manufacturing apparatus changes the discharge data, and can apply the material to the spouted parts of various sizes. Further, the manufacturing apparatus 2 is an electric excitation light display device in which only the discharge data is changed. Further, according to the present embodiment, the droplets of the luminescent materials 2 1 1 G and 2 1 1 B are ejected from the overlapping portions G of the plurality of discharged portions 3 8 G and 3 8 B, respectively. In the middle of the position where the droplet has been covered. For this purpose, the bombing liquid is then brought into contact with the first two droplets in two positions in which the self-bounce position is symmetrical. For this reason, the droplets that are bounced behind are diffusely bombarded with a positionally symmetrical shape. For this reason, according to the method of the present embodiment, it is difficult to generate the average of the luminescent materials 211R, 211G, and 211B. [Embodiment 4] The present invention is applied to a back surface infrastructure of a plasma display device. The substrate 50A shown in Figs. 18(a) and (b) is processed by a process 3 (Fig. 19) which will be described later, and becomes a back substrate of the plasma display device. The substrate 50 A has a plurality of 58R, 58G, 58B arranged in a matrix. Specifically, the substrate 50A includes the support substrate 32, and the stripe address electrode 54 is formed on the substrate 52, and the covered ink device 2 is only a light-emitting material, and the seed is made up of 3 8R, 21 1R, and 2 drops. The dielectric glass layer 50' formed by the discharge portion of the manufacturing apparatus 50B from which the coating plate is discharged is applied to the address electrode -50 (48) 1269073 54 and the predetermined plural number having the lattice shape The partition wall of the pixel range is 6 〇. The complex pixel ranges are in a matrix form. The matrix columns forming the complex pixel range are the address electrodes 54 of the complex numbers. Such a substrate 50A is formed by well-known printing techniques. In the respective pixel ranges of the substrate 30A, the concave portion defined by the wall 60 of the dielectric glass layer 56 corresponds to the discharged portion 58R, the 58G, and the discharged portion 58B. The portion to be emitted 58R is the range of the fluorescent layer 3 1 1 FR of the light to form the red region, and the range of the fluorescent layer 3 1 1 FG of the light in the wavelength region of the green portion by the discharge portion 5 8 G is the portion 58B The range of the phosphor layer 31 that forms the light of the blue wavelength domain. The base 50A shown in Fig. 18(b) is located on the imaginary plane parallel to each other in the X-axis direction and Y. Then, the row direction and the column direction of the matrix forming the re-extrusion portions 58R, 58G, and 58B are parallel to the X-axis direction and the Y-axis direction. The substrate 50A is periodically arranged in the order of the Y 8 axis, the discharged portion 58G, and the discharged portion 58B in the Y-axis direction. On the other hand, the discharge portions 5 8 R are arranged in a line in a predetermined axial direction with respect to each other in the axial direction, and the outlet portions 58G are arranged in a row along the X-axis direction, and are discharged in a row. The portions 5 8 B are arranged in a row at a certain interval on the X-axis. However, the X-axis 丨 axis directions are orthogonal to each other. At the same time in the Y-axis direction of the discharge portion 5 8 R, the wavelength corresponding to the screen and the interval discharge portion is the number of the axial direction in which the 1FB is to be discharged, and is the discharge portion. This is X, is spit, venting, and facing Y LRY, -51 - (49) (49) 1269073, that is, the interval is nearly 5 60 μπι. This interval is the same as the specific interval L G Y along the Y-axis direction of the spouted portion 5 8 G. It is also the same as the specific interval LB Y along the Y-axis direction of the spouted portion 5 8 B. Further, the plane image of the spouted portion 5 8 R is a rectangle determined by the long side and the short side. Specifically, the length of the spouted portion 58R in the Y-axis direction is approximately 1 〇〇 μηι, and the length of the X-axis direction is approximately 300 μπι. The spouted portion 58G and the spouted portion 58A have the same shape and size as the spouted portion 58R. The above-described interval between the discharge portions 58R and the pixel size interval or size of the same color of the high-definition television having a size corresponding to the size of 40 inches is the size of the discharge portion 58r. The manufacturing apparatus 3 shown in Fig. 19 is a device for discharging the corresponding fluorescent material to the discharged portions 58R, 58G, and 58 of the substrate 50 of Fig. 18. Specifically, the manufacturing apparatus 3 is provided in all of the discharge unit 58R, the discharge device 3 00R to which the fluorescent material 311R is applied, and the drying device 3 50R to dry the fluorescent material 31 1R on the discharge portion 58R, and all The discharge unit 5 8G, the discharge device 3 00G to which the fluorescent material 31 1G is applied, and the drying device 3 5 0 G for drying the fluorescent material 3 1 1 G on the discharge portion 5 8 G, and all the discharged portions 58B The discharge device 100B of the fluorescent material 311B is coated, and the drying device 3 50B of the fluorescent material 3 1 1 B on the discharge portion 5 8 B is dried. Further, the manufacturing apparatus 3 is provided with a conveying apparatus 3 for conveying the substrate 50A in the order of the discharging apparatus 300R, the drying apparatus 305R, the discharging apparatus 00G, the drying apparatus 305G, the discharging apparatus 00B, and the drying apparatus 305B. 7 0 吐 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 The groove 3 0 1 R is supplied to the discharge scanning unit 1 〇 2 of the color filter material. The configuration of the discharge scanning unit 1 〇 2 is described in the first embodiment, and the description of the repetition is omitted. The configuration of the display device 300G and the configuration of the display device 300B are basically the same as those of the discharge device 3000R. However, in place of the ink tank 301R and the transfer tube 310R, the discharge device 300G has a portion for the ink tank and the transfer tube for the fluorescent material 31 1G, and the discharge device 3 00G is different from the discharge device 300R. Similarly, instead of the ink tank 301R and the transfer tube 310R, the discharge device 300B is provided with a portion for the ink tank and the transfer tube for the fluorescent material 311B, and the discharge device 300B is configured differently from the discharge device 300R. However, the liquid fluorescent materials 3 1 1R, 3 1 1B, and 3 1 1 G of the present embodiment are examples of the liquid material of the present invention. A method of manufacturing a plasma display device using the manufacturing apparatus 3 will be described. First, on the support substrate 52, via a well-known screen printing technique
成介電質玻璃層56、間隔壁60,得圖18所示基體50A 〇 接著,經由大氣壓下之氧電漿處理,親液化基體 50A。經由此處理,間隔壁60及介電質玻璃層56所規定 之各凹部(畫素範圍之一部分)之間隔壁60之表面,和介 電質玻璃層5 6之表面則呈親液性,此等表面則成被吐出 部5 8R、5 8G、5 8B。然而,由於材質,即使不進行上述 表面處理,亦有可得呈期望親液性之表面之情形。此時 ,無需施以上述表面處理,經由間隔壁6 0,和介電質玻 - 53- (51) 1269073 璃層5 6所規定之凹部表面,即爲被吐出部3 8 R、 38B。 形成被吐出部58R、58G、58B之基體5〇a乃 送裝置370,運到吐出裝置300R之平台1〇6。然 圖21(a)所示,吐出裝置300R乃於所有被吐出部 形成螢光材料3 1 1 R之層地,從噴頭1 1 4吐出螢 3 11R。具體而言,吐出裝置3 00R乃以參照圖12 吐出方法’於被吐出部5 8R塗佈螢光材料3丨丨R。 基體50A之被吐出部58R,形成螢光材料3丨1R層 送裝置3 70乃令基體50A位於乾燥裝置3 5 0R內。 完全乾燥被吐出部58R上之螢光材料31 1R,於被 58R上,得螢光層311FR。 接著’輸送裝置370乃將基體50A位於吐 3 00G之平台106。然後,如圖21(b)所示,吐 300G乃於所有被吐出部58G,形成螢光材料311 從噴頭1 1 4吐出發光材料3 1 1 G。具體而言,吐 3 00G乃以參照圖12所說明之吐出方法,於被 5 8G塗佈螢光材料311G。於所有基體50A之被 58G,形成螢光材料311G層時,輸送裝置370則 5 0 A位於乾燥位置3 5 0 G內。然後,完全乾燥被 5 8 G上之發光材料3 1 1 G,於被吐出部5 8 G上得 311FG。 接者’輸送裝置370乃令基體50A位於吐 3 0 0B之平台106。然後,如圖21(c)所示,吐 38G、 經由輸 後,如 58R, 光材料 說明之 於所有 時,輸 然後, 吐出部 出裝置 出裝置 G地, 出裝置 吐出部 吐出部 令基體 吐出部 螢光層 出裝置 出裝置 -54- (52) (52)1269073 3 00B乃於所有被吐出部58B,形成螢光材料31 1B之層 ,從噴頭1 1 4吐出發光材料3 1 1 B。具體而言,吐出裝置 3 00B乃以參照圖12說明之吐出方法,於被吐出部58B 塗佈螢光材科‘ 3 1 1B。於所有基體50A之被吐出部58B, 形成螢光材料31 1B之層時,輸送裝置3 70則令基體50A 位於乾燥裝置3 5 0B內。然後,完全乾燥被吐出部58B上 之發光材料311B,於被吐出部58B上得螢光層311FB。 經由以上工程,基體50A乃成爲電漿顯示裝置之背 面基板5 0 B。 接著,如圖22所示,將背面基板5 0B,和前面背板 50C,經由公知之方法貼合,得電漿顯示裝置50。前面 背板50C乃具有玻璃基板68、於玻璃基板68上相互平 行圖案化顯示電極66A及顯示掃瞄電極66B、和被覆顯 示電極66A及顯示掃瞄電極66B形成之介電質玻璃層64 、形成於介電質玻璃層64上之MgO保護層62。背面基 板5 0B和前面背板50C乃背面基板50B之位址電極54, 和前面背板50C之顯示電極66A ·顯示掃瞄電極66B相 互正交地位置配合。以各間隔壁60所包圍之單元(畫素 範圍)中,以特定壓力封入放電氣體69。 根據本實施例時,於各吐出裝置3 00R、3 00G、3 00B ,噴頭群1 1 4 G之X軸方向之噴嘴間隔乃噴頭1 1 4之X 軸方向之噴嘴間隔之 WN倍之長度。在此,N乃含於噴 頭群1 14G之噴頭1 14之數目。爲此,吐出裝置3 00R、 3 00G、3 00B之X軸方向之噴嘴線密度較通常之噴墨裝置 - 55- (53) (53)1269073 之X軸方向之噴嘴線密度爲高。因此,製造裝置3乃僅 變更吐出資料,可於各種大小之被吐出部,塗佈發光材 料。更且,製造裝置3乃僅變更吐出資料,可製造種種 之間隔之電黎顯不裝置。 又,根據本實施例時,於各1個之被吐出部5 8 R、 58G、58B,從複數之重疊部G吐出螢光材料311R、 3 1 1 G、3 1 1 B之液滴。從各重疊部G吐出之液滴之總體積 (即從含於1個重疊部G之所有噴嘴1 1 8吐出之液滴之總 體積)乃皆爲相同之故,被吐出部58R、58G、58B內乃經 由螢光材料311R、311B、311G均勻被覆。而且,如實 施例1所說明,屬於各種之副範圍S R之噴嘴1 1 8,於噴 頭群1 1 4 G中,鄰接於X軸方向之故,關連於噴嘴i J 8 之位置之吐出量差則易於被抵消。結果,被吐出部5 8 r 彼此間之塗佈不均,或被吐出部5 8 G彼此間之塗佈不均 ’或被吐出部5 8 B彼此間之塗佈不均會變得不明顯。 更且,根據本實施例時,螢光材料3 1 1 R 、3 1 1 G、 3 1 1 B之液滴乃有彈著於已被液滴被覆之2個之位置之中 間位置之情形。爲此,之後,彈著之液滴乃對於自我之 彈著位置呈對稱之2個之位置中,與前先彈著之2個液 滴接觸。爲此,於後彈著之液滴乃擴散呈從該彈著位置 對稱之形狀。由此理由,根據本實施例之吐出方法,難 以產生螢光材料311R、311G、311B之塗佈不均。 【實施例5】 -56- (54) (54)1269073 接著,說明將本發明適用具備電子放射元件之畫像 顯示裝置之製造裝置之例。 圖23(a)及(b)所示基體70A乃經由後述之製造裝置 3(圖24)所成處理,成爲畫像顯示裝置之電子源基板70B 之基板。基體70A乃具有配置呈矩陣狀之複數之被吐出 部78。 具體而言,基體70A乃具備基體72、和位於基體72 之鈉擴散防止層74,和位於鈉擴散防止層74上之複數之 元件電極76A、76B,和位於複數之元件電極76A上之複 數之金屬配線79A,和位於複數之元件電極76B上之複 數之金屬配線79B。各複數之金屬配線79A乃具有向Y 軸方向延伸之形狀。另一方面,各複數之金屬配線79B 乃具有向X軸方向延伸之形狀。於金屬配線79A和金屬 配線79B間,形成絕緣膜75之故,與金屬配線79A和金 屬配線79B電性絕緣。 包含1對之元件電極76A及元件電極76B之部分乃 對應於1個之畫素範圍。 1對之元件電極76A及元件電極76B乃相互離開特 定之間隔,於鈉擴散防止層74對向。對應於某畫素範圍 之元件電極76A乃與對應之金屬配線79A電性連接。又 ,對應於該畫素範圍之元件電極76B乃與對應之金屬配 線7 9B電性連接。然而,本說明書中,將合倂基體72和 鈉擴散防止層74之部分以支持基板加以表記。 基體70A之各畫素範圍中,元件電極76A之一部分 -57- (55) (55)1269073 ,和元件電極76B之一部分,和於元件電極76A與元件 電極76B間曝露之鈉擴散防止層74,則對應於被吐出部 7 8。更具體而言,被吐出部7 8乃欲形成導電性薄膜 411F(圖27)之範圍,導電性薄膜411F乃被覆元件電極 76A之一部分,和元件電極 76B之一部分,和被覆元件 電極76A、76B間之間隔地加以形成。如圖23(b)以點線 顯示,本實施例之被吐出部7 8之平面形狀乃圓形。如此 ,本發明之被吐出部之平面形狀乃以X座標範圍和Y座 標範圍所決定之圓形亦可。 圖23(b)所示之基體70A乃於X軸方向和Y軸方向 之雙方,位於平行之假想平面上。然後,形成複數之被 吐出部78之矩陣之行方向及列方向,乃各與X軸方向及 γ軸方向平行。於基體70A,複數之被吐出部78乃排列 於X軸方向及Y軸方向。然而,X軸方向及Y軸方向乃 相互正交。 沿被吐出部78R彼此之Y軸方向之一定間隔LRY, 即間隔乃幾近1 9 0 μιη。又,被吐出部7 8彼此之X軸方 向之長度(X座標範圍之長度)乃幾近100 μχη。Υ軸方向 之長度(Υ座標範圍之長度)亦幾近100 μηι。被吐出部78 彼此之上述間隔及被吐出部之上述大小乃對應於40英口寸 程度之大小之高傳真電視之同一色的畫素範圔間隔或大 小0 圖24所示製造裝置4乃對於各圖23之基體7〇Α之 被吐出部7 8,吐出導電性薄膜材料4丨丨之裝置。具體而 -58- (56) 1269073 言’製造裝置4乃具備於所有被吐出部78,塗佈導 薄膜材料41 1之吐出裝置400,和乾燥被吐出部78 導電性薄膜材料4 1 1的乾燥裝置4 5 0。更且製造裝置 具備依吐出裝,置400、乾燥裝置45之順序,輸送 70 A之輸送裝置470。 圖25所示吐出裝置40〇乃具備保持液狀之導電 月旲材料411之墨槽401,和輸送管410,藉由輸送管 ’從墨槽4 0 1供給彩色濾光片材料的吐出掃瞄部1 〇 2 出掃瞄部1 02之構成乃於實施例1說明之故省略。 ,本實施例中,液狀之導電性薄膜材料4 1 1乃有機 液。然而’本實施例之液狀導電性薄膜材料4〗i乃 明之液狀之材料之一例。 在此說明使用製造裝置4之畫像顯示裝置之製 法。首先,於由鈉玻璃等形成之基體72上,形成 爲主成分之鈉擴散防止層74。具體而言,使用濺鍍 於基體72上,經由形成厚1 μΓη之Si02膜,得鈉擴 止層7 4。接著,於鈉擴散防止層7 4上,經由濺鍍法 空蒸著法,形成厚5 nm之鈦層。然後,使用微縮術 及蝕刻技術,從該鈦層,複數對形成位於僅離開相 定之距離之1對之兀件電極76A及元件電極76B。 然後,使用網版印刷技術,於鈉擴散防止層74 數之元件電極76A上,塗佈Ag糊加以燒成,形成 軸方向延伸之複數之金屬配線79A。接著,使用網 刷技術,於各金屬配線7 9 A之一部分,塗佈玻璃糊 電性 上之 4乃 基體 性薄 4 10 0吐 然而 鈀溶 本發 造方 Si02 法, 散防 或真 技術 互特 及複 向Y 版印 加以 -59- (57) (57)1269073 燒成,形成絕緣膜75。然後,使用網版印刷技術’於鈉 擴散防止層74及複數之元件電極76B上’塗佈Ag糊加 以燒成,形成向X軸方向延伸之複數之金屬配線7 9B ° 然而,製作金屬配線79B時,金屬配線79B藉由絕緣膜 絕緣膜75,與金屬配線79A交叉地,塗佈Ag糊。經由 以上工程,得顯示圖23所示之基體70A。 接著,經由大氣壓下之氧電漿處理,親液化基體 7 0 A。經由此處理,元件電極7 6 A之表面的一部分,和 元件電極76B之表面的一部分,和元件電極76A與元件 電極76B間露出之支持基板之表面則被親液化,然後, 此等表面則成被吐出部78。然而,由於材質,即使不進 行上述表面處理,亦有可得呈期望親液性之表面之情形 。此時,無需施以上述表面處理,元件電極76A之表面 的一部分,和元件電極76B之表面的一部分,和元件電 極76A與元件電極76B間露出之支持基板之表面則呈被 吐出部7 8。 形成被吐出部78B之基體70A乃經由輸送裝置470 ,運到吐出裝置400之平台106。然後,如圖26所示, 吐出裝置4 0 0乃於所有被吐出部7 8,形成導電性薄膜 4 1 1 F地,從噴頭1 1 4吐出導電性薄膜材料4 1 1。具體而 言’吐出裝置400乃以參照圖12說明之吐出方法,於被 吐出部7 8塗佈導電性薄膜材料4 1 1。本實施例中,爲使 在於被吐出部78上彈著之導電性薄膜材料4〗i之液滴之 直徑呈60 μηι至80 μιτι之範圍,控制部]丨2乃於噴頭 -60- (58) 1269073 1 14供予信號。於所有基體70A之被吐出部78, 電性薄膜材料41丨層時,輸送裝置470乃令基體 於乾燥裝置4 5 0內。然後,完全乾燥被吐出部7 8 電性薄膜材料4 1 1,於被吐出部78上,得氧化鈀 之導電性薄膜4 1 1 F。如此,於各畫素範圍,形成 件電極76A之表面的一部分,和元件電極76B之 一部分’和元件電極76A與元件電極76B間露出 散防止層74之導電性薄膜4 1 1 F。 接著,於元件電極76A及元件電極76B間, 加脈衝狀之特定電壓,於導電性薄膜4 1 1 F之一部 電子放射部41 1D。然而,將元件電極76A及元 76B之間之電壓之施加,各於有機物環境及真空 進行爲佳。如此之時,從導電性薄膜4 1 1 F之電子 率會更高。元件電極76A,和對應之元件電極76B 置電子放射部4 1 1 D之導電性薄膜4 1 1 F乃電子放 。又,各電子放射元件子乃對應於各畫素範圍。 經由以上工程,如圖2 7所示,基體7 0 A乃成 源基板70B。 接著,如圖2 8所示,將電子源基板7 0 B,和 板7 0C,經由公知之方法貼合,得畫像顯示裝置 面背板70C乃具有玻璃基板82、於玻璃基板82 陣狀定位之複數螢光部84,和被覆複數螢光部84 板8 6。金屬板8 6乃做爲爲了加速從電子放射部4 電子束之電極而工作。電子源基板70B和前面背:The dielectric glass layer 56 and the partition 60 are obtained by the substrate 50A shown in Fig. 18. Next, the substrate 50A is lyophilized by treatment with oxygen plasma at atmospheric pressure. By this treatment, the surface of the partition 60 of each of the recesses (one of the pixel ranges) defined by the partition 60 and the dielectric glass layer 56 and the surface of the dielectric glass layer 65 are lyophilic. The surface is formed into the discharge portions 5 8R, 5 8G, and 5 8B. However, due to the material, even if the above surface treatment is not carried out, there is a case where a surface having a desired lyophilic property can be obtained. At this time, it is not necessary to apply the above-described surface treatment, and the surface of the concave portion defined by the partition wall 60 and the dielectric glass-53-(51) 1269073 glass layer 56 is the discharged portion 3 8 R, 38B. The substrate 5〇a of the discharge portions 58R, 58G, and 58B is transported to the platform 〇6 of the discharge device 300R. As shown in Fig. 21 (a), the discharge device 300R discharges the phosphor 3 11R from the head 1 1 4 by forming a layer of the fluorescent material 3 1 1 R in all the discharged portions. Specifically, the discharge device 300R applies a fluorescent material 3丨丨R to the discharged portion 580R with reference to the discharge method of Fig. 12 . The sputtered portion 58R of the base 50A forms a fluorescent material 3丨1R layering device 3 70 such that the substrate 50A is located in the drying device 305R. The phosphor material 31 1R on the discharge portion 58R is completely dried, and the phosphor layer 311FR is obtained on the 58R. Next, the delivery device 370 places the substrate 50A on the platform 106 of the spun 300G. Then, as shown in Fig. 21 (b), the discharge 300G is formed in the discharge portion 58G, and the fluorescent material 311 is formed to discharge the luminescent material 3 1 1 G from the head 1 1 4 . Specifically, the spun 3 00G is coated with the fluorescent material 311G at a temperature of 58 G by the discharge method described with reference to Fig. 12 . When all of the base 50A is 58G to form the layer of the fluorescent material 311G, the conveying means 370 is located within the dry position of 3 5 0 G. Then, the luminescent material 3 1 1 G on the 5 8 G was completely dried, and 311 FG was obtained on the discharged portion 5 8 G. The pick-up device 370 is such that the base 50A is located on the platform 106 of the spit 300B. Then, as shown in Fig. 21(c), after the discharge 38G, after the return, such as 58R, the light material is described as being all the time, the discharge is performed, and the discharge unit is discharged from the apparatus G, and the discharge unit of the discharge unit is discharged. The fluorescent light-emitting device-out device -54-(52) (52)1269073 3 00B forms a layer of the fluorescent material 31 1B in all the spouted portions 58B, and discharges the luminescent material 3 1 1 B from the shower head 1 1 4 . Specifically, the discharge device 300B applies the phosphor material section "3 1 1B" to the discharge portion 58B by the discharge method described with reference to FIG. When the layer of the fluorescent material 31 1B is formed in the spouted portion 58B of all the substrates 50A, the transporting device 3 70 places the substrate 50A in the drying device 350B. Then, the luminescent material 311B on the discharge portion 58B is completely dried, and the fluorescent layer 311FB is obtained on the discharged portion 58B. Through the above work, the substrate 50A becomes the back substrate 50B of the plasma display device. Next, as shown in Fig. 22, the back substrate 50B and the front back plate 50C are bonded together by a known method to obtain a plasma display device 50. The front back plate 50C has a glass substrate 68, a display electrode 66A and a display scan electrode 66B parallel to each other on the glass substrate 68, and a dielectric glass layer 64 formed by the cover display electrode 66A and the display scan electrode 66B. The MgO protective layer 62 on the dielectric glass layer 64. The rear substrate 50B and the front back plate 50C are the address electrodes 54 of the rear substrate 50B, and the display electrodes 66A of the front back plate 50C and the display scanning electrodes 66B are orthogonally positioned to each other. The discharge gas 69 is sealed at a specific pressure in a unit (pixel range) surrounded by the partition walls 60. According to the present embodiment, the nozzle spacing in the X-axis direction of each of the discharge devices 3 00R, 300G, and 300B and the head group 1 1 4 G is WN times the nozzle interval in the X-axis direction of the head 1 1 4 . Here, N is the number of the heads 14 14 included in the head group 1 14G. For this reason, the nozzle line density in the X-axis direction of the discharge devices 3 00R, 300G, and 300B is higher than the nozzle line density in the X-axis direction of the conventional ink jet apparatus - 55-(53) (53) 1260073. Therefore, the manufacturing apparatus 3 can apply only the discharge material, and can apply the luminescent material to the discharge portion of various sizes. Further, the manufacturing apparatus 3 can change only the discharge data, and can manufacture various types of electric discharge devices. Further, according to the present embodiment, the droplets of the fluorescent materials 311R, 3 1 1 G, and 3 1 1 B are discharged from the plurality of overlapping portions G in the respective ejection portions 5 8 R, 58G, and 58B. The total volume of the liquid droplets discharged from the respective overlapping portions G (that is, the total volume of the liquid droplets discharged from all the nozzles 1 1 8 included in one overlapping portion G) are all the same, and the discharged portions 58R, 58G, The inside of 58B is uniformly covered by the fluorescent materials 311R, 311B, and 311G. Further, as described in the first embodiment, the nozzles 1 1 8 belonging to the various sub-ranges SR are in the nozzle group 1 1 4 G, and adjacent to the X-axis direction, the discharge amount difference at the position of the nozzle i J 8 It is easy to be offset. As a result, the coating unevenness between the discharged portions 58 8 r or the uneven coating between the discharged portions 5 8 G or the uneven coating between the discharged portions 5 8 B becomes inconspicuous. . Further, according to the present embodiment, the droplets of the fluorescent materials 3 1 1 R , 3 1 1 G, and 3 1 1 B are bounced at positions between the two positions covered by the droplets. For this reason, after that, the droplets that are bombarded are in two positions symmetrical with respect to the position at which the self is ejected, and are in contact with the two droplets that were previously played. For this reason, the droplets that are played back are diffused in a shape that is symmetrical from the position of the projectile. For this reason, according to the discharge method of the present embodiment, it is difficult to cause uneven coating of the fluorescent materials 311R, 311G, and 311B. [Embodiment 5] -56- (54) (54) 12270073 Next, an example in which the present invention is applied to a manufacturing apparatus of an image display device including an electron emitting element will be described. The substrate 70A shown in Figs. 23(a) and (b) is processed by a manufacturing apparatus 3 (Fig. 24) which will be described later, and serves as a substrate of the electron source substrate 70B of the image display apparatus. The base 70A has a plurality of discharged portions 78 arranged in a matrix. Specifically, the substrate 70A is provided with a substrate 72, a sodium diffusion preventing layer 74 located on the substrate 72, and a plurality of element electrodes 76A, 76B on the sodium diffusion preventing layer 74, and a plurality of element electrodes 76A on the plurality of element electrodes 76A. The metal wiring 79A and the plurality of metal wirings 79B on the plurality of element electrodes 76B. Each of the plurality of metal wires 79A has a shape extending in the Y-axis direction. On the other hand, each of the plurality of metal wires 79B has a shape extending in the X-axis direction. The insulating film 75 is formed between the metal wiring 79A and the metal wiring 79B, and is electrically insulated from the metal wiring 79A and the metal wiring 79B. The portion including the pair of element electrodes 76A and the element electrodes 76B corresponds to one pixel range. The pair of element electrodes 76A and element electrodes 76B are separated from each other by a predetermined interval, and are opposed to the sodium diffusion preventing layer 74. The element electrode 76A corresponding to a certain pixel range is electrically connected to the corresponding metal wiring 79A. Further, the element electrode 76B corresponding to the pixel range is electrically connected to the corresponding metal wiring 7 9B. However, in the present specification, portions of the combined base 72 and the sodium diffusion preventing layer 74 are indicated by the support substrate. In the pixel range of the substrate 70A, a portion of the element electrode 76A is -57-(55) (55)1269073, and a portion of the element electrode 76B, and a sodium diffusion preventing layer 74 exposed between the element electrode 76A and the element electrode 76B, Then, it corresponds to the spouted portion 78. More specifically, the discharge portion 78 is intended to form a range of the conductive film 411F (Fig. 27), the conductive film 411F is a portion covering the element electrode 76A, and a portion of the element electrode 76B, and the coated element electrodes 76A, 76B They are formed at intervals. As shown in Fig. 23(b), the plane shape of the spouted portion 78 of the present embodiment is circular. Thus, the planar shape of the spouted portion of the present invention may be a circle determined by the X coordinate range and the Y coordinate range. The base 70A shown in Fig. 23(b) is located on the imaginary plane parallel to both the X-axis direction and the Y-axis direction. Then, the row direction and the column direction of the matrix of the plurality of discharged portions 78 are formed in parallel with the X-axis direction and the γ-axis direction. In the base 70A, the plurality of discharged portions 78 are arranged in the X-axis direction and the Y-axis direction. However, the X-axis direction and the Y-axis direction are orthogonal to each other. A certain interval LRY along the Y-axis direction of the spouted portions 78R, that is, the interval is approximately 190 μm. Further, the length of the X-axis direction (the length of the X coordinate range) of the spouted portions 7 is approximately 100 μχη. The length of the x-axis direction (the length of the Υ coordinate range) is also approximately 100 μηι. The interval between the discharge portion 78 and the above-mentioned size of the discharge portion is a pixel interval or size of the same color of the high-fidelity television corresponding to a size of 40 inches. The manufacturing apparatus 4 shown in Fig. 24 is Each of the substrates 7 of Fig. 23 is discharged from the discharge portion 7 and the conductive thin film material 4 is discharged. Specifically, -58-(56) 1269073, the manufacturing apparatus 4 is provided in all the discharge parts 78, the discharge apparatus 400 which coats the film material 411, and the dry discharge part 78. The conductive film material 4 1 1 is dried. Device 4500. Further, the manufacturing apparatus is provided with a transporting device 470 that transports 70 A in the order of the discharge device, the 400, and the drying device 45. The discharge device 40 shown in Fig. 25 is provided with an ink tank 401 for holding a liquid conductive mooncake material 411, and a transfer tube 410 for supplying a discharge scan of the color filter material from the ink tank 410 by the transfer tube The configuration of the portion 1 〇 2 output scanning unit 012 is omitted in the description of the first embodiment. In the present embodiment, the liquid conductive film material 41 is an organic liquid. However, the liquid conductive film material of the present embodiment is an example of a liquid material. Here, a method of using the image display device of the manufacturing apparatus 4 will be described. First, a sodium diffusion preventing layer 74 as a main component is formed on a substrate 72 formed of soda glass or the like. Specifically, the sodium diffusion layer 74 is obtained by sputtering on the substrate 72 and forming a SiO 2 film having a thickness of 1 μΓ. Next, on the sodium diffusion preventing layer 704, a titanium layer having a thickness of 5 nm was formed by a sputtering method. Then, using the micro-shrinking technique and the etching technique, from the titanium layer, the plural pairs form the pair of the electrode electrodes 76A and the element electrodes 76B which are separated from each other by a predetermined distance. Then, an Ag paste is applied onto the element electrode 76A having the number of the sodium diffusion preventing layers 74 by a screen printing technique, and fired to form a plurality of metal wirings 79A extending in the axial direction. Next, using a net brush technique, one part of each metal wiring 7 9 A is coated with a glass paste, and the substrate is thin, and the substrate is thin, 4 10 0, but the palladium is dissolved by the Si02 method, and the radiation prevention or the real technology mutual Special and reversal Y-printing -59- (57) (57) 1269073 is fired to form an insulating film 75. Then, an Ag paste is applied onto the sodium diffusion preventing layer 74 and the plurality of element electrodes 76B by a screen printing technique to be fired to form a plurality of metal wirings 7 9B extending in the X-axis direction. However, the metal wiring 79B is formed. At the time of the metal wiring 79B, the Ag paste is applied to the metal wiring 79A by the insulating film insulating film 75. Through the above works, the substrate 70A shown in Fig. 23 is displayed. Next, the substrate was lyophilized to 70 A by treatment with oxygen plasma at atmospheric pressure. By this treatment, a part of the surface of the element electrode 76 A, a part of the surface of the element electrode 76B, and a surface of the support substrate exposed between the element electrode 76A and the element electrode 76B are lyophilized, and then the surfaces are formed. The spit portion 78 is discharged. However, due to the material, even if the above surface treatment is not carried out, there is a case where a surface having a desired lyophilic property can be obtained. At this time, it is not necessary to apply the above-described surface treatment, and a part of the surface of the element electrode 76A and a part of the surface of the element electrode 76B and the surface of the support substrate exposed between the element electrode 76A and the element electrode 76B are the discharge portions 78. The base 70A forming the spouted portion 78B is transported to the platform 106 of the discharge device 400 via the transport device 470. Then, as shown in Fig. 26, the discharge device 400 forms a conductive thin film 4 1 1 F at all of the discharged portions 7 8, and discharges the conductive thin film material 41 1 from the head 1 1 4 . Specifically, the discharge device 400 is coated with the conductive thin film material 4 1 1 at the discharge portion 78 by the discharge method described with reference to Fig. 12 . In the present embodiment, in order to make the diameter of the liquid droplets of the conductive thin film material 4 i i which is ejected on the ejected portion 78 in the range of 60 μη to 80 μm, the control unit 丨 2 is in the head-60- (58). ) 1269073 1 14 signal. In the spouted portion 78 of all of the substrates 70A, and the electrically thin film material 41 is layered, the transporting means 470 is such that the substrate is in the drying means 4500. Then, the discharged portion 7 8 of the conductive film material 411 is completely dried on the discharged portion 78 to obtain a palladium oxide conductive film 4 1 1 F. Thus, in a range of pixels, a part of the surface of the device electrode 76A is formed, and a portion of the element electrode 76B and the conductive film 4 1 1 F of the diffusion preventing layer 74 are exposed between the element electrode 76A and the element electrode 76B. Next, a pulse-shaped specific voltage is applied between the element electrode 76A and the element electrode 76B to the electron-emitting portion 41 1D of one of the conductive thin films 4 1 1 F . However, it is preferable to apply the voltage between the element electrodes 76A and 76B in an organic environment and a vacuum. In this case, the electron ratio from the conductive film 4 1 1 F is higher. The element electrode 76A and the corresponding element electrode 76B are placed on the conductive film 4 1 1 F of the electron-emitting portion 4 1 1 D. Further, each of the electron emitting elements corresponds to each pixel range. Through the above works, as shown in Fig. 27, the substrate 70A is the source substrate 70B. Next, as shown in FIG. 28, the electron source substrate 70B and the plate 70C are bonded together by a known method, and the image display device back surface plate 70C has the glass substrate 82 and is positioned on the glass substrate 82. The plurality of fluorescent portions 84 and the plurality of fluorescent portions 84 are plated 86. The metal plate 86 is operated to accelerate the electrode of the electron beam from the electron emission portion 4. Electron source substrate 70B and front back:
形成導 70A位 上之導 爲主成 被覆元 表面的 之鈉擴 經由施 分形成 件電極 條件下 放出效 ,和設 射元件 爲電子 前面背 7〇。前 上呈矩 之金屬 11D之 板7 0C -61 - (59) 1269073 乃各複數之電子放射元件,各對向於複數螢光部84地, 加以位置配合。又,電子源基板70B和前面背板70C間 則保持真空狀態。 然而,具備上述電子放射元件之畫像顯示裝置70乃 稱SED(表面接觸電子放射顯示器)或FED(電場放射顯示 器) 根據本實施例時,於吐出裝置400,噴頭群1 14G之 X軸方向之噴嘴間隔乃噴頭1 1 4之X軸方向之噴嘴間隔 之1/N倍之長度。在此,N乃含於噴頭群114G之噴頭 114之數目。爲此,吐出裝置400之X軸方向之噴嘴線 密度較通常之噴墨裝置之X軸方向之噴嘴線密度爲高。 因此,製造裝置4乃僅變更吐出資料,可於各種大小之 被吐出部,塗佈導電性薄膜材料4 1 1。更且,製造裝置4 乃僅變更吐出資料,可製造種種之間隔之電漿顯示裝置 〇 又,根據本實施例時,於被吐出部7 8,從複數之重 疊部G吐出導電性薄膜材料4 1 1之液滴。從重疊部G吐 出之液滴之總體積(即從含於1個重疊部G之所有噴嘴 1 1 8吐出之液滴之總體積)乃皆爲相同之故,被吐出部7 8 內乃經由導電性薄膜材料4 1 1均勻被覆。而且,如實施 例1所說明,屬於各種之副範圍S R之噴嘴1 1 8,於噴頭 群1 1 4 G中,鄰接於X軸方向之故,關連於噴嘴〗丨8之 位置之吐出量差則易於被抵消。結果,被吐出部78彼此 間之塗佈不均會變得不明顯。 -62- (60) (60)1269073 更且,根據本實施例時,導電性薄膜材料4 1 1之液 滴乃有彈著於已被液滴被覆之2個之位置之中間位置之 情形。爲此,之後,彈著之液滴乃對於自我之彈著位置 呈對稱之2個之位置中,與前先彈著之2個液滴接觸。 爲此,於後彈著之液滴中,相反之2個方向之力量被發 揮,結果,於後彈著之液滴乃擴散呈從該彈著位置對稱 之形狀。由此理由,根據本實施例之吐出方法,難以產 生導電性薄膜材料4 1 1之塗佈不均。 【圖式簡單說明】 【圖1】顯示實施例1之吐出裝置的模式圖 【圖2】顯示實施例i之托架模式圖。 【圖3】顯示實施例1之噴頭模式圖。 【圖4】(a)及(b)乃顯示實施例丨之噴頭之吐出部的 模式圖。 【圖5】顯示實施例1之噴頭群之噴頭之相對位置關 係模式圖。 【圖6】顯示實施例1之控制部之模式圖。 【圖7】(a)乃顯示實施例1之噴頭驅動部之模式圖 ’(b)乃顯示噴頭驅動部之驅動信號、選擇信號及吐出信 號的時間流程圖。 【圖8】(a)及(b)乃顯示從實施例1之噴頭群之液滴 之吐出之順序的模式圖。 【圖9】顯示實施例2之基體的模式圖。 -63- (61) (61)1269073 【圖1 〇】顯示實施例2之製造裝置的模式圖。 【圖11】顯示實施例2之吐出裝置的模式圖。 【圖1 2】顯示實施例2之吐出方法的模式圖。 【圖1 3】顯示實施例2之製造方法的模式圖。 【圖14】(a)及(b)乃顯示實施例3之基體的模式圖。 【圖1 5】顯示實施例3之製造裝置的模式圖。 【圖16】顯示實施例3之吐出裝置的模式圖。 【圖17】顯示實施例3之製造方法的模式圖。 【圖18】(a)及(b)乃顯示實施例4之基體的模式圖。 【圖19】顯示實施例4之製造裝置的模式圖。 【圖20】顯示實施例4之吐出裝置的模式圖。 【圖2 1】顯示實施例4之製造方法的模式圖。 【圖22】顯示實施例4之製造方法的模式圖。 【圖23】(a)及(b)乃顯示實施例5之基體的模式圖。 【圖24】顯示實施例5之製造裝置的模式圖。 【圖2 5】顯示實施例5之吐出裝置的模式圖。 【圖2 6】顯示實施例5之製造方法的模式圖。 【圖2 7】顯示實施例5之製造方法的模式圖。 【圖28】顯示實施例5之製造方法的模式圖。 【圖29】顯示掃瞄範圍之模式圖。 【圖3 0】模式性顯示實施例1之吐出量之外觀之圖The formation of the conduction at the 70A position is mainly based on the surface of the coated element, and the element is placed on the front side of the electron. The front metal plate 11D plate 7 0C - 61 - (59) 1269073 is a plurality of electron emitting elements, each of which is aligned with the plurality of phosphor portions 84. Further, a vacuum state is maintained between the electron source substrate 70B and the front back plate 70C. However, the image display device 70 including the above-described electron emitting element is referred to as an SED (Surface Contact Electron Emission Display) or an FED (Electrode Emission Display). According to the present embodiment, the ejection device 400 and the nozzle of the head group 1 14G in the X-axis direction are provided. The interval is 1/N times the nozzle spacing of the nozzle 1 14 in the X-axis direction. Here, N is the number of nozzles 114 included in the head group 114G. For this reason, the nozzle line density in the X-axis direction of the discharge device 400 is higher than the nozzle line density in the X-axis direction of the conventional ink jet apparatus. Therefore, in the manufacturing apparatus 4, only the discharge data is changed, and the conductive thin film material 4 1 1 can be applied to the discharge portions of various sizes. Further, the manufacturing apparatus 4 can change the discharge data, and can manufacture a plasma display device of various intervals. According to the present embodiment, the conductive film material 4 is discharged from the plurality of overlapping portions G at the discharge portion 7 . 1 1 droplet. The total volume of the liquid droplets discharged from the overlapping portion G (that is, the total volume of the liquid droplets discharged from all the nozzles 1 1 8 included in the one overlapping portion G) are all the same, and the discharged portion 7 is via The conductive thin film material 41 1 is uniformly coated. Further, as described in the first embodiment, the nozzles 1 1 8 belonging to the various sub-ranges SR are adjacent to the X-axis direction in the nozzle group 1 1 4 G, and the discharge amount difference at the position of the nozzle 丨8 is It is easy to be offset. As a result, the unevenness in coating between the spouted portions 78 becomes inconspicuous. Further, according to the present embodiment, the liquid droplet of the conductive thin film material 41 is bounced in the middle of the position where the liquid droplets have been covered by the liquid droplets. For this reason, the droplets that are bombarded are in contact with the two droplets that were previously played in the position where the droplets of the self are symmetrical. For this reason, in the droplets that are subsequently bounced, the forces in the opposite directions are emitted, and as a result, the droplets that are subsequently bounced are diffused in a shape symmetrical from the projecting position. For this reason, according to the discharge method of the present embodiment, it is difficult to cause coating unevenness of the conductive thin film material 41. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a discharge device of a first embodiment. Fig. 2 is a view showing a carriage pattern of an embodiment i. Fig. 3 is a view showing the pattern of the head of the embodiment 1. Fig. 4 (a) and (b) are schematic views showing the discharge portion of the head of the embodiment. Fig. 5 is a view showing a relative positional relationship pattern of the heads of the head group of the first embodiment. Fig. 6 is a schematic view showing a control unit of the first embodiment. Fig. 7 (a) is a schematic view showing the head driving unit of the first embodiment. (b) is a timing chart showing the driving signal, the selection signal, and the discharge signal of the head driving unit. Fig. 8 (a) and (b) are schematic views showing the order of discharge from the liquid droplets of the head group of the first embodiment. Fig. 9 is a schematic view showing the substrate of the second embodiment. -63- (61) (61) 1269073 [Fig. 1] A schematic view of a manufacturing apparatus of the second embodiment is shown. Fig. 11 is a schematic view showing a discharge device of the second embodiment. Fig. 12 is a schematic view showing the discharge method of the second embodiment. Fig. 13 is a schematic view showing the manufacturing method of the second embodiment. Fig. 14 (a) and (b) are schematic views showing the substrate of the third embodiment. Fig. 15 is a schematic view showing the manufacturing apparatus of the third embodiment. Fig. 16 is a schematic view showing the discharge device of the third embodiment. Fig. 17 is a schematic view showing a manufacturing method of the third embodiment. Fig. 18 (a) and (b) are schematic views showing the substrate of the fourth embodiment. Fig. 19 is a schematic view showing the manufacturing apparatus of the fourth embodiment. Fig. 20 is a schematic view showing a discharge device of the fourth embodiment. Fig. 21 is a schematic view showing a manufacturing method of the fourth embodiment. Fig. 22 is a schematic view showing a manufacturing method of the fourth embodiment. Fig. 23 (a) and (b) are schematic views showing the substrate of the fifth embodiment. Fig. 24 is a schematic view showing the manufacturing apparatus of the fifth embodiment. Fig. 25 is a schematic view showing the discharge device of the fifth embodiment. Fig. 26 is a schematic view showing the manufacturing method of the fifth embodiment. Fig. 27 is a schematic view showing the manufacturing method of the fifth embodiment. Fig. 28 is a schematic view showing a manufacturing method of the fifth embodiment. [Fig. 29] A schematic diagram showing the scanning range. [Fig. 30] Schematic diagram showing the appearance of the discharge amount of Example 1.
【主要元件符號說明】 -64- (62) (62)1269073 1、2、3、4…製造裝置 ΙΑ、IB、2A、2B、3A、3B、4A、4B·.·噴嘴歹〇 1 0A、30A、50A、70A·"基體 100、 100R、 100G、 100B、 100C、 200R、 200G、 200B 3 0 0R、3 00G、3 00B、400.··吐出裝置 1 0 2…吐出掃猫部 1 03 ...托架 104.. .第1位置控制裝置 1 06 ...平台 10 8...第2位置控制裝置 1 11…液狀之材料 111R、111G、111B…彩色濾光片材料 114、1141、1142、1143、1144 …噴頭 1 12...控制部 1 14G...噴頭群[Description of main component symbols] -64- (62) (62)1269073 1, 2, 3, 4... Manufacturing equipment ΙΑ, IB, 2A, 2B, 3A, 3B, 4A, 4B···Nozzle 歹〇1 0A, 30A, 50A, 70A·"Base 100, 100R, 100G, 100B, 100C, 200R, 200G, 200B 3 0 0R, 3 00G, 3 00B, 400.··Discharge device 1 0 2...Spell out the cat department 1 03 ... bracket 104.. . 1st position control device 1 06 ... platform 10 8 ... second position control device 1 11 ... liquid material 111R, 111G, 111B ... color filter material 114, 1141, 1142, 1143, 1144 ... nozzle 1 12... control unit 1 14G... nozzle group
1 16A、1 16B...噴嘴歹IJ 1 18...噴嘴 1 1 8R...基準噴嘴 1 2 4…振動子 124C…壓電元件 124A、124B...電極 1 2 7…吐出部 208…噴頭驅動部 203.. .驅動信號生成部 -65- (63) 1269073 A S ...類比開關 DS…驅動信號 2 04…處理部 SC…選擇信號 ES…吐出信號 1 0A、30A、50A、70A …基體 10.. .彩色濾光片基板1 16A, 1 16B...nozzle 歹IJ 1 18...nozzle 1 1 8R...reference nozzle 1 2 4...vibrator 124C...piezoelectric element 124A, 124B...electrode 1 2 7...discharge unit 208 ...head drive unit 203.. drive signal generation unit-65- (63) 1269073 AS ... analog switch DS... drive signal 2 04... processing unit SC... selection signal ES... discharge signal 1 0A, 30A, 50A, 70A ...substrate 10.. .Color filter substrate
18R、18G、18B、38R、38G、38B、58R > 58G、58B、 78 ...被吐出部 111FR、111FG、111FB...濾光片層 1 3 4…掃瞄範圍 30.. .電激發光顯示裝置 5 0B...電漿顯示裝置之背面基板 5 0...電漿顯示裝置18R, 18G, 18B, 38R, 38G, 38B, 58R > 58G, 58B, 78 ... the spouted parts 111FR, 111FG, 111FB... filter layer 1 3 4... scan range 30.. Excitation light display device 5 0B... Back surface substrate of plasma display device 50... Plasma display device
-66--66-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003335546A JP2005095835A (en) | 2003-09-26 | 2003-09-26 | Discharge device, color filter substrate manufacturing device, electroluminescence display device manufacturing device, plasma display device manufacturing device, and discharge method |
Publications (2)
| Publication Number | Publication Date |
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| TW200525193A TW200525193A (en) | 2005-08-01 |
| TWI269073B true TWI269073B (en) | 2006-12-21 |
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| TW093129091A TWI269073B (en) | 2003-09-26 | 2004-09-24 | Sprayer, substrate of color filter and mfg. of electroluminescent display device |
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| Country | Link |
|---|---|
| JP (1) | JP2005095835A (en) |
| KR (1) | KR100690529B1 (en) |
| CN (1) | CN100359377C (en) |
| TW (1) | TWI269073B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8187777B2 (en) | 2007-11-12 | 2012-05-29 | Hon Hai Precision Industry Co., Ltd. | Method for manufacturing patterned layer on substrate |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4345716B2 (en) | 2005-06-10 | 2009-10-14 | セイコーエプソン株式会社 | Droplet ejection method |
| US20070076040A1 (en) * | 2005-09-29 | 2007-04-05 | Applied Materials, Inc. | Methods and apparatus for inkjet nozzle calibration |
| JP4600363B2 (en) * | 2006-07-31 | 2010-12-15 | セイコーエプソン株式会社 | Liquid drawing method |
| JP4306730B2 (en) | 2007-01-15 | 2009-08-05 | セイコーエプソン株式会社 | Pattern formation method |
| JP2011000535A (en) * | 2009-06-18 | 2011-01-06 | Ulvac Japan Ltd | Discharge device |
| KR101485980B1 (en) * | 2014-03-03 | 2015-01-27 | 주식회사 기가레인 | Coating Apparatus |
| KR102652755B1 (en) * | 2018-04-09 | 2024-04-01 | 세메스 주식회사 | Method and Apparatus for Ejecting Droplet |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071482A (en) * | 1998-08-28 | 2000-03-07 | Toshiba Tec Corp | Color inkjet printer |
| JP2002221616A (en) * | 2000-11-21 | 2002-08-09 | Seiko Epson Corp | Color filter manufacturing method and manufacturing apparatus, liquid crystal device manufacturing method and manufacturing apparatus, EL device manufacturing method and manufacturing apparatus, inkjet head control apparatus, material discharging method and material discharging apparatus, and electronic equipment |
| JP3997747B2 (en) * | 2001-10-19 | 2007-10-24 | セイコーエプソン株式会社 | Head unit, setting method thereof, and electronic apparatus |
-
2003
- 2003-09-26 JP JP2003335546A patent/JP2005095835A/en active Pending
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2004
- 2004-09-24 KR KR1020040076869A patent/KR100690529B1/en not_active Expired - Fee Related
- 2004-09-24 TW TW093129091A patent/TWI269073B/en not_active IP Right Cessation
- 2004-09-27 CN CNB200410011984XA patent/CN100359377C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8187777B2 (en) | 2007-11-12 | 2012-05-29 | Hon Hai Precision Industry Co., Ltd. | Method for manufacturing patterned layer on substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1601344A (en) | 2005-03-30 |
| TW200525193A (en) | 2005-08-01 |
| CN100359377C (en) | 2008-01-02 |
| KR20050030868A (en) | 2005-03-31 |
| KR100690529B1 (en) | 2007-03-09 |
| JP2005095835A (en) | 2005-04-14 |
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