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TWI268595B - Damascene structure and process at semiconductor substrate level - Google Patents

Damascene structure and process at semiconductor substrate level

Info

Publication number
TWI268595B
TWI268595B TW092134639A TW92134639A TWI268595B TW I268595 B TWI268595 B TW I268595B TW 092134639 A TW092134639 A TW 092134639A TW 92134639 A TW92134639 A TW 92134639A TW I268595 B TWI268595 B TW I268595B
Authority
TW
Taiwan
Prior art keywords
semiconductor substrate
damascene structure
substrate level
contact region
opening
Prior art date
Application number
TW092134639A
Other languages
English (en)
Other versions
TW200507225A (en
Inventor
Horng-Huei Tseng
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200507225A publication Critical patent/TW200507225A/zh
Application granted granted Critical
Publication of TWI268595B publication Critical patent/TWI268595B/zh

Links

Classifications

    • H10W20/035—
    • H10W20/0526—
    • H10W20/056—
    • H10W20/076—
    • H10W20/081—
    • H10W20/084—
    • H10W20/40—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW092134639A 2003-08-14 2003-12-09 Damascene structure and process at semiconductor substrate level TWI268595B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/640,757 US7049702B2 (en) 2003-08-14 2003-08-14 Damascene structure at semiconductor substrate level

Publications (2)

Publication Number Publication Date
TW200507225A TW200507225A (en) 2005-02-16
TWI268595B true TWI268595B (en) 2006-12-11

Family

ID=34136161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092134639A TWI268595B (en) 2003-08-14 2003-12-09 Damascene structure and process at semiconductor substrate level

Country Status (2)

Country Link
US (2) US7049702B2 (zh)
TW (1) TWI268595B (zh)

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CN111261709B (zh) * 2018-11-30 2024-08-30 长鑫存储技术有限公司 导电插塞结构、半导体器件及其形成方法
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US11171084B2 (en) 2020-04-06 2021-11-09 International Business Machines Corporation Top via with next level line selective growth
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Also Published As

Publication number Publication date
TW200507225A (en) 2005-02-16
US20050035460A1 (en) 2005-02-17
US7049702B2 (en) 2006-05-23
US7413991B2 (en) 2008-08-19
US20060163735A1 (en) 2006-07-27

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