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TWI268591B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TWI268591B
TWI268591B TW092101799A TW92101799A TWI268591B TW I268591 B TWI268591 B TW I268591B TW 092101799 A TW092101799 A TW 092101799A TW 92101799 A TW92101799 A TW 92101799A TW I268591 B TWI268591 B TW I268591B
Authority
TW
Taiwan
Prior art keywords
cap
substrate
semiconductor device
chip part
chip
Prior art date
Application number
TW092101799A
Other languages
English (en)
Other versions
TW200402855A (en
Inventor
Kazuo Yokoyama
Shigeki Kageyama
Jun Otsuji
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200402855A publication Critical patent/TW200402855A/zh
Application granted granted Critical
Publication of TWI268591B publication Critical patent/TWI268591B/zh

Links

Classifications

    • H10W40/77—
    • H10W42/276—
    • H10W76/12—
    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H10W42/20—
    • H10W70/682—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
TW092101799A 2002-08-08 2003-01-28 Semiconductor device TWI268591B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002231832A JP2004071977A (ja) 2002-08-08 2002-08-08 半導体装置

Publications (2)

Publication Number Publication Date
TW200402855A TW200402855A (en) 2004-02-16
TWI268591B true TWI268591B (en) 2006-12-11

Family

ID=31492387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101799A TWI268591B (en) 2002-08-08 2003-01-28 Semiconductor device

Country Status (3)

Country Link
US (1) US6818974B2 (zh)
JP (1) JP2004071977A (zh)
TW (1) TWI268591B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258192A (ja) * 2002-03-01 2003-09-12 Hitachi Ltd 半導体装置およびその製造方法
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
JP4042785B2 (ja) * 2004-02-13 2008-02-06 株式会社村田製作所 電子部品及びその製造方法
CN100472780C (zh) * 2004-02-13 2009-03-25 株式会社村田制作所 电子零部件及其制造方法
JP2006059928A (ja) * 2004-08-18 2006-03-02 Orion Denki Kk プリント基板
JP4720162B2 (ja) * 2004-12-02 2011-07-13 株式会社村田製作所 電子部品装置
KR101007958B1 (ko) 2006-02-24 2011-01-14 후지쯔 가부시끼가이샤 반도체 장치
JP4691455B2 (ja) * 2006-02-28 2011-06-01 富士通株式会社 半導体装置
JP2011166024A (ja) 2010-02-12 2011-08-25 Toshiba Corp 電子機器
JP5573645B2 (ja) 2010-12-15 2014-08-20 富士通セミコンダクター株式会社 半導体装置及び半導体装置の製造方法
CN103620335B (zh) * 2011-05-31 2016-01-13 阿威德热合金有限公司 使散热器可定位的散热器支座
US9082633B2 (en) * 2011-10-13 2015-07-14 Xilinx, Inc. Multi-die integrated circuit structure with heat sink
JP5725050B2 (ja) * 2013-01-29 2015-05-27 トヨタ自動車株式会社 半導体モジュール
KR20150053592A (ko) * 2013-11-08 2015-05-18 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
WO2017175274A1 (ja) * 2016-04-04 2017-10-12 株式会社日立製作所 封止構造体及びその製造方法
EP3749072A1 (de) * 2019-06-07 2020-12-09 ZKW Group GmbH Verfahren zur herstellung eines ein steuergerät umschliessenden gehäuses
JP7124795B2 (ja) * 2019-06-27 2022-08-24 株式会社村田製作所 電子部品モジュール、電子部品ユニット、および、電子部品モジュールの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106471A (ja) 1993-10-05 1995-04-21 Toshiba Corp 半導体装置
JP2601171B2 (ja) 1993-12-17 1997-04-16 日本電気株式会社 スタティック型半導体記憶装置
US5753529A (en) 1994-05-05 1998-05-19 Siliconix Incorporated Surface mount and flip chip technology for total integrated circuit isolation
TW388976B (en) * 1998-10-21 2000-05-01 Siliconware Precision Industries Co Ltd Semiconductor package with fully exposed heat sink
US6207354B1 (en) * 1999-04-07 2001-03-27 International Business Machines Coporation Method of making an organic chip carrier package
US6472741B1 (en) * 2001-07-14 2002-10-29 Siliconware Precision Industries Co., Ltd. Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same

Also Published As

Publication number Publication date
US20040026777A1 (en) 2004-02-12
JP2004071977A (ja) 2004-03-04
TW200402855A (en) 2004-02-16
US6818974B2 (en) 2004-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees