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TWI268429B - Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus - Google Patents

Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus

Info

Publication number
TWI268429B
TWI268429B TW093136293A TW93136293A TWI268429B TW I268429 B TWI268429 B TW I268429B TW 093136293 A TW093136293 A TW 093136293A TW 93136293 A TW93136293 A TW 93136293A TW I268429 B TWI268429 B TW I268429B
Authority
TW
Taiwan
Prior art keywords
sensor apparatus
communicating
wirelessly
maintenance unit
systems
Prior art date
Application number
TW093136293A
Other languages
Chinese (zh)
Other versions
TW200532465A (en
Inventor
Mason L Freed
Costas J Spanos
Randall S Mundt
Original Assignee
Onwafer Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/888,526 external-priority patent/US7282889B2/en
Application filed by Onwafer Technologies Inc filed Critical Onwafer Technologies Inc
Publication of TW200532465A publication Critical patent/TW200532465A/en
Application granted granted Critical
Publication of TWI268429B publication Critical patent/TWI268429B/en

Links

Landscapes

  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A maintenance unit is for maintaining and storing a sensor apparatus. The sensor apparatus includes a sensor apparatus power source. In one embodiment, the maintenance unit includes a housing configured for receiving and storing the sensor apparatus, a maintenance unit power supply attached to the housing, and a power charger connected with the maintenance unit power supply for coupling power from the maintenance unit power supply to charge the sensor apparatus power source. Another aspect of the present invention includes methods for the operation of the sensor apparatus and the operation of the maintenance unit. Still another aspect of the present invention includes systems that have the maintenance unit or functions corresponding to the functions of the maintenance unit.
TW093136293A 2003-11-29 2004-11-25 Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus TWI268429B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52571003P 2003-11-29 2003-11-29
US10/888,526 US7282889B2 (en) 2001-04-19 2004-07-10 Maintenance unit for a sensor apparatus

Publications (2)

Publication Number Publication Date
TW200532465A TW200532465A (en) 2005-10-01
TWI268429B true TWI268429B (en) 2006-12-11

Family

ID=34830427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136293A TWI268429B (en) 2003-11-29 2004-11-25 Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus

Country Status (2)

Country Link
JP (1) JP4874540B2 (en)
TW (1) TWI268429B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411193B (en) * 2006-09-29 2013-10-01 Semiconductor Energy Lab Wireless power storage device, semiconductor device including the wireless power storage device, and method for operating the same
US8853995B2 (en) 2009-06-12 2014-10-07 Qualcomm Incorporated Devices for conveying wireless power and methods of operation thereof
TWI488402B (en) * 2009-11-17 2015-06-11 高通公司 Method, device and non-transitory computer readable medium for power management
TWI586067B (en) * 2012-12-28 2017-06-01 精工半導體有限公司 Electronic component, power receiving device, and power feeding system

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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KR101356623B1 (en) 2011-11-10 2014-02-03 주식회사 스파콘 Power transmission coil and wireless power transmission apparatus
US9548621B2 (en) * 2012-05-28 2017-01-17 Panasonic Intellectual Property Management Co., Ltd. Contactless connector system tolerant of position displacement between transmitter coil and receiver coil and having high transmission efficiency
US9356822B2 (en) * 2012-10-30 2016-05-31 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
JP2014029860A (en) * 2013-08-27 2014-02-13 Advantest Corp Power supply device and measuring device
JP6855774B2 (en) * 2016-12-13 2021-04-07 Tdk株式会社 Wafer transfer container atmosphere measuring device, wafer transfer container, wafer transfer container internal cleaning device, and wafer transfer container internal cleaning method
US20180366354A1 (en) * 2017-06-19 2018-12-20 Applied Materials, Inc. In-situ semiconductor processing chamber temperature apparatus
JP7660554B2 (en) * 2019-07-26 2025-04-11 ラム リサーチ コーポレーション Integrated adaptive positioning system and routines for training and health checking of automated wafer handling robots
JP7467152B2 (en) 2020-02-13 2024-04-15 東京エレクトロン株式会社 Storage container and method for charging substrate-like sensor
KR102584512B1 (en) * 2020-12-31 2023-10-05 세메스 주식회사 Buffer unit and method for storaging substrate type senseor for measuring of horizontal of a substrate support member provided on the atmosphere in which temperature changes are accompanied by
KR102594075B1 (en) * 2021-05-31 2023-10-24 세메스 주식회사 Container and system for processing substreate
KR102650610B1 (en) * 2021-05-31 2024-03-26 세메스 주식회사 Apparatus and system for processing substreate
KR102858235B1 (en) * 2021-07-15 2025-09-09 삼성전자주식회사 Wafer transportation system and method of manufacturing semiconductor device using the same
TWI899491B (en) 2021-08-04 2025-10-01 日商東京威力科創股份有限公司 Accommodation container and charging method for substrate-shaped sensor
WO2023089795A1 (en) * 2021-11-22 2023-05-25 三菱電機株式会社 Power transmission device, wireless power transmission system, and voltage control device
KR20250142391A (en) * 2023-02-09 2025-09-30 도쿄엘렉트론가부시키가이샤 substrate processing device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466614A (en) * 1993-09-20 1995-11-14 At&T Global Information Solutions Company Structure and method for remotely measuring process data
JPH10142068A (en) * 1996-11-14 1998-05-29 Sony Corp Temperature measuring device and temperature measuring method using the same
US6691068B1 (en) * 2000-08-22 2004-02-10 Onwafer Technologies, Inc. Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411193B (en) * 2006-09-29 2013-10-01 Semiconductor Energy Lab Wireless power storage device, semiconductor device including the wireless power storage device, and method for operating the same
US8853995B2 (en) 2009-06-12 2014-10-07 Qualcomm Incorporated Devices for conveying wireless power and methods of operation thereof
TWI488402B (en) * 2009-11-17 2015-06-11 高通公司 Method, device and non-transitory computer readable medium for power management
TWI552479B (en) * 2009-11-17 2016-10-01 高通公司 Method, device and non-transitory computer readable medium for power management
US9680313B2 (en) 2009-11-17 2017-06-13 Qualcomm Incorporated Authorized based receipt of wireless power
TWI586067B (en) * 2012-12-28 2017-06-01 精工半導體有限公司 Electronic component, power receiving device, and power feeding system

Also Published As

Publication number Publication date
JP4874540B2 (en) 2012-02-15
JP2005202933A (en) 2005-07-28
TW200532465A (en) 2005-10-01

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