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TWI268354B - Method and related apparatus for chip testing - Google Patents

Method and related apparatus for chip testing

Info

Publication number
TWI268354B
TWI268354B TW094110455A TW94110455A TWI268354B TW I268354 B TWI268354 B TW I268354B TW 094110455 A TW094110455 A TW 094110455A TW 94110455 A TW94110455 A TW 94110455A TW I268354 B TWI268354 B TW I268354B
Authority
TW
Taiwan
Prior art keywords
chip
circuit
transmission
circuits
output
Prior art date
Application number
TW094110455A
Other languages
English (en)
Other versions
TW200636269A (en
Inventor
Chin-Fa Hsiao
Chin-Yi Chiang
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW094110455A priority Critical patent/TWI268354B/zh
Priority to US11/160,591 priority patent/US7049839B1/en
Publication of TW200636269A publication Critical patent/TW200636269A/zh
Application granted granted Critical
Publication of TWI268354B publication Critical patent/TWI268354B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31716—Testing of input or output with loop-back
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3187—Built-in tests

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW094110455A 2005-04-01 2005-04-01 Method and related apparatus for chip testing TWI268354B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094110455A TWI268354B (en) 2005-04-01 2005-04-01 Method and related apparatus for chip testing
US11/160,591 US7049839B1 (en) 2005-04-01 2005-06-30 Method and related apparatus for chip testing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094110455A TWI268354B (en) 2005-04-01 2005-04-01 Method and related apparatus for chip testing

Publications (2)

Publication Number Publication Date
TW200636269A TW200636269A (en) 2006-10-16
TWI268354B true TWI268354B (en) 2006-12-11

Family

ID=36423827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110455A TWI268354B (en) 2005-04-01 2005-04-01 Method and related apparatus for chip testing

Country Status (2)

Country Link
US (1) US7049839B1 (zh)
TW (1) TWI268354B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7437591B1 (en) * 2005-01-18 2008-10-14 Altera Corporation Method and apparatus for hardware timing optimizer
TWI306195B (en) * 2006-04-07 2009-02-11 Lite On It Corp Device and method for generating predetermined signal patterns
TWI304889B (en) * 2006-10-26 2009-01-01 Via Tech Inc Method and related apparatus for testing chip
TWI306951B (en) * 2006-12-19 2009-03-01 Via Tech Inc Chipset and chipset testing method
JP2008232702A (ja) * 2007-03-19 2008-10-02 Nec Electronics Corp 半導体装置
JP5096024B2 (ja) * 2007-03-19 2012-12-12 株式会社リコー Ｕｓｂコントローラ及びｕｓｂコントローラ試験方法
KR101085565B1 (ko) * 2008-06-02 2011-11-24 가부시키가이샤 어드밴티스트 시험용 웨이퍼 유닛, 및 시험 시스템
US8564322B2 (en) * 2009-12-21 2013-10-22 International Business Machines Corporation Receiver signal probing using a shared probe point
CN102955729A (zh) * 2011-08-18 2013-03-06 鸿富锦精密工业（深圳）有限公司 高速信号端口测试系统及其测试治具
CN103049357B (zh) * 2011-10-12 2017-05-31 中盈创信(北京)商贸有限公司 电子电路产品芯片级维修智能检测卡
EP2731280B8 (en) * 2012-11-07 2019-03-20 Telefonaktiebolaget LM Ericsson (publ) Loopback-based built-in-self-test
KR102336455B1 (ko) * 2015-01-22 2021-12-08 삼성전자주식회사 집적 회로 및 집적 회로를 포함하는 스토리지 장치
CN110988734B (zh) * 2019-12-23 2022-09-06 深圳市洲明科技股份有限公司 故障检测装置、方法和设备
CN114578217B (zh) * 2022-05-06 2022-08-09 南京邮电大学 一种可控的Chiplet串行测试电路
CN116016248A (zh) * 2022-12-05 2023-04-25 中车大连电力牵引研发中心有限公司 一种以太网物理层接口内环检测方法
CN119336561B (zh) * 2024-10-31 2025-05-13 上海泰矽微电子有限公司 一种提高低功耗数模混合芯片测试覆盖率的装置及方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254940A (en) * 1990-12-13 1993-10-19 Lsi Logic Corporation Testable embedded microprocessor and method of testing same
US5371457A (en) * 1991-02-12 1994-12-06 Lipp; Robert J. Method and apparatus to test for current in an integrated circuit
US5534774A (en) * 1992-04-23 1996-07-09 Intel Corporation Apparatus for a test access architecture for testing of modules within integrated circuits
JP4201878B2 (ja) * 1998-05-07 2008-12-24 株式会社ルネサステクノロジ 半導体装置及び試験ボード

Also Published As

Publication number Publication date
TW200636269A (en) 2006-10-16
US7049839B1 (en) 2006-05-23

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