[go: up one dir, main page]

TWI268189B - Wave solder apparatus - Google Patents

Wave solder apparatus

Info

Publication number
TWI268189B
TWI268189B TW095103761A TW95103761A TWI268189B TW I268189 B TWI268189 B TW I268189B TW 095103761 A TW095103761 A TW 095103761A TW 95103761 A TW95103761 A TW 95103761A TW I268189 B TWI268189 B TW I268189B
Authority
TW
Taiwan
Prior art keywords
conveyer
heater
circuit board
heating
disposed
Prior art date
Application number
TW095103761A
Other languages
English (en)
Other versions
TW200730284A (en
Inventor
Wen-Chi Chen
Jau-Whei Hong
Original Assignee
Quanta Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanta Comp Inc filed Critical Quanta Comp Inc
Priority to TW095103761A priority Critical patent/TWI268189B/zh
Priority to US11/380,221 priority patent/US20070181634A1/en
Application granted granted Critical
Publication of TWI268189B publication Critical patent/TWI268189B/zh
Publication of TW200730284A publication Critical patent/TW200730284A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H05K3/346—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW095103761A 2006-02-03 2006-02-03 Wave solder apparatus TWI268189B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095103761A TWI268189B (en) 2006-02-03 2006-02-03 Wave solder apparatus
US11/380,221 US20070181634A1 (en) 2006-02-03 2006-04-26 Wave solder apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095103761A TWI268189B (en) 2006-02-03 2006-02-03 Wave solder apparatus

Publications (2)

Publication Number Publication Date
TWI268189B true TWI268189B (en) 2006-12-11
TW200730284A TW200730284A (en) 2007-08-16

Family

ID=38332999

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103761A TWI268189B (en) 2006-02-03 2006-02-03 Wave solder apparatus

Country Status (2)

Country Link
US (1) US20070181634A1 (zh)
TW (1) TWI268189B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102163533B1 (ko) * 2013-03-29 2020-10-08 미쓰비시 마테리알 가부시키가이샤 금속-세라믹스판 적층체의 제조 장치 및 제조 방법, 파워 모듈용 기판의 제조 장치 및 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4600137A (en) * 1985-02-21 1986-07-15 Hollis Automation, Inc. Method and apparatus for mass soldering with subsequent reflow soldering
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
US6913183B2 (en) * 2002-09-30 2005-07-05 Speedline Technologies, Inc. Selective gas knife for wave soldering

Also Published As

Publication number Publication date
US20070181634A1 (en) 2007-08-09
TW200730284A (en) 2007-08-16

Similar Documents

Publication Publication Date Title
TW200745568A (en) Probe structures with electronic components
DE602007006735D1 (de) Vorrichtung zum schnellen beidseitigen Kochen von Lebensmitteln
DE602007014161D1 (de) Tintenstrahlaufzeichnungsvorrichtung
TW200603218A (en) Proximity meniscus manifold
WO2008143235A1 (ja) 表示装置
ATE552977T1 (de) Tintenstrahldruckvorrichtung mit einer station zur kontaktlosen wartung des kopfs
TW200633119A (en) Film pattern forming method, film pattern, resist film, insulation film, circuit board, semiconductor device, surface elastic wave device, surface elastic wave oscillation device, electro-optic device, and electronic device
EP1862042A4 (en) METHOD FOR FORMING METAL PATTERN, METAL PATTERN RECEIVED THEREFOR, PCB WITH IT AND TFT PCB WITH IT
TW200738401A (en) Method of detaching platelike substance and apparatus therefor
TW200507038A (en) Apparatus for treating substrate and method of treating substrate
DE602006018927D1 (de) Uiden auf verzehrbare substrate
TW200611613A (en) Method for providing a layer, wiring substrate, electro-optical device, and electronic equipment
TWI268189B (en) Wave solder apparatus
EP1722018A4 (en) DOUBLE TEXTILE GLASS TEXTILE, AND PREIMPREGNE AND SUBSTRATE FOR PRINTED WIRING BOARD USING TEXTILE GLASS FABRIC
WO2009127923A3 (en) Method of processing chocolate prior to ink jet printing
TW200605967A (en) Wiring board, manufacturing method thereof, and electronic appliance
CN205017695U (zh) 软性电路板emi热熔假贴机
TW200731901A (en) Wave solder apparatus
TW200701846A (en) Production method of solder circuit board
TW200612798A (en) Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus
TW200702951A (en) Photomask, manufacturing method thereof, and manufacturing method of electronic device
TW200607418A (en) Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device
TW200725780A (en) Making method for semiconductor integrated circuit apparatus and probe card
WO2005115669A3 (en) Selective soldering apparatus with jet wave solder jet and nitrogen preheat
TW200705540A (en) Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees