TWI267531B - Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same - Google Patents
Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same Download PDFInfo
- Publication number
- TWI267531B TWI267531B TW93122464A TW93122464A TWI267531B TW I267531 B TWI267531 B TW I267531B TW 93122464 A TW93122464 A TW 93122464A TW 93122464 A TW93122464 A TW 93122464A TW I267531 B TWI267531 B TW I267531B
- Authority
- TW
- Taiwan
- Prior art keywords
- catalyst precursor
- electroless gold
- precursor composition
- substrate
- electromagnetic interference
- Prior art date
Links
- 239000012018 catalyst precursor Substances 0.000 title claims abstract description 78
- 239000000203 mixture Substances 0.000 title claims abstract description 71
- 239000000463 material Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims description 7
- 238000007772 electroless plating Methods 0.000 title abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims abstract description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 60
- 229910052737 gold Inorganic materials 0.000 claims description 60
- 239000010931 gold Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 50
- 238000007747 plating Methods 0.000 claims description 40
- 239000003054 catalyst Substances 0.000 claims description 15
- -1 propoxy glyceryl Chemical group 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 150000002894 organic compounds Chemical class 0.000 claims description 8
- 239000002243 precursor Substances 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 125000002009 alkene group Chemical group 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- PZKNFJIOIKQCPA-UHFFFAOYSA-N oxalic acid palladium Chemical compound [Pd].OC(=O)C(O)=O PZKNFJIOIKQCPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000052 vinegar Substances 0.000 claims description 2
- 235000021419 vinegar Nutrition 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- IGGZRGUPRFINQE-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxy-3-propoxypropyl) prop-2-enoate Chemical compound CCCOC(OC(=O)C=C)C(C)(C)COC(=O)C=C IGGZRGUPRFINQE-UHFFFAOYSA-N 0.000 claims 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims 1
- GPEHQHXBPDGGDP-UHFFFAOYSA-N acetonitrile;propan-2-one Chemical compound CC#N.CC(C)=O GPEHQHXBPDGGDP-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 33
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
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- 239000011342 resin composition Substances 0.000 description 3
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- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
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- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000007644 letterpress printing Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MEIRMGYEZZQBNV-UHFFFAOYSA-N (3-ethoxy-2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C(C=C)(=O)OC(C(C)(COC(C=C)=O)C)OCC MEIRMGYEZZQBNV-UHFFFAOYSA-N 0.000 description 1
- KHPNGCXABLTQFJ-UHFFFAOYSA-N 1,1,1-trichlorodecane Chemical compound CCCCCCCCCC(Cl)(Cl)Cl KHPNGCXABLTQFJ-UHFFFAOYSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- VSRMDJXITMVPNC-UHFFFAOYSA-N 2,2-dimethoxy-1,2-diphenylethanol Chemical compound C=1C=CC=CC=1C(OC)(OC)C(O)C1=CC=CC=C1 VSRMDJXITMVPNC-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- ZCNNPIISAUSYSN-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCCOCCO ZCNNPIISAUSYSN-UHFFFAOYSA-N 0.000 description 1
- QXZJDGNHGLPKQB-UHFFFAOYSA-N 2-(2-hydroxypropoxy)propan-1-ol prop-1-ene Chemical group CC(COC(C)CO)O.C=CC.C=CC QXZJDGNHGLPKQB-UHFFFAOYSA-N 0.000 description 1
- BHEFUPPIKIGXRC-UHFFFAOYSA-N 2-(2-propanoyloxypropoxy)propyl propanoate Chemical compound CCC(=O)OCC(C)OCC(C)OC(=O)CC BHEFUPPIKIGXRC-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- GEADFHLCHUFFBM-UHFFFAOYSA-N C(C)#N.C(C(=O)C)(=O)O Chemical compound C(C)#N.C(C(=O)C)(=O)O GEADFHLCHUFFBM-UHFFFAOYSA-N 0.000 description 1
- BHOQZFDFSMPLOU-UHFFFAOYSA-N C(C)NC(=O)OCC.C(C=C)(=O)O Chemical compound C(C)NC(=O)OCC.C(C=C)(=O)O BHOQZFDFSMPLOU-UHFFFAOYSA-N 0.000 description 1
- 235000011511 Diospyros Nutrition 0.000 description 1
- 244000236655 Diospyros kaki Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- VQNIOZLNRYKVEF-UHFFFAOYSA-N decylphosphane Chemical compound CCCCCCCCCCP VQNIOZLNRYKVEF-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- LKKRAZFAACYENL-UHFFFAOYSA-N didecylphosphane Chemical compound CCCCCCCCCCPCCCCCCCCCC LKKRAZFAACYENL-UHFFFAOYSA-N 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- IJVWVMFRYAVQJF-UHFFFAOYSA-N ethyl N-ethylcarbamate prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.C(C)NC(=O)OCC IJVWVMFRYAVQJF-UHFFFAOYSA-N 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- PBDBXAQKXCXZCJ-UHFFFAOYSA-L palladium(2+);2,2,2-trifluoroacetate Chemical compound [Pd+2].[O-]C(=O)C(F)(F)F.[O-]C(=O)C(F)(F)F PBDBXAQKXCXZCJ-UHFFFAOYSA-L 0.000 description 1
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- BGKZULDOBMANRY-UHFFFAOYSA-N sulfanyl prop-2-enoate Chemical compound SOC(=O)C=C BGKZULDOBMANRY-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C—CHEMISTRY; METALLURGY
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C23C18/405—Formaldehyde
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- H01—ELECTRIC ELEMENTS
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Description
1267531 九、發明說明： 【發明所屬之技術領域】 本發明係錢於-_於無電鑛金(dee㈣ess咖㈣ 之觸媒先質(CatalySt P職騰)组成物，以及一種使用該觸 媒先質組成物之透明電磁干擾遮蔽材料(以下簡稱「歷」 5遮蔽材料)的製備方法。具體言之，簡媒先質組成物包含 有-種UV(紫外線)可固化樹脂，其對於基材具有極佳的黏 合性，因而在製備EMI舰材料時，不需其它額外的預處 理。疋以’本發明提供—種易於製備刪遮蔽材料的觸媒 先質組成物’和-種使賴觸媒先f組成物之EMI遮蔽材 10 料的製備方法。 【先前技術】 電漿顯示板(以下簡稱「PDP」）具有一個能對其正面玻 璃整個表面提供訊號及電力的電極，相較於其它顯示裝 15置，該電極在操作時產生較大量的電磁輻射。 疋以’PDP必須配備一片濾光片，以供遮蔽在操作 時=產生的有害電磁波。濾光片是由若干道在玻璃上層合 的薄膜組成，例如一道抗反射薄膜(以下簡稱「AR」薄膜）， 一道近紅外線遮蔽薄膜(以下簡稱rNIR」薄膜），一道氖光 2〇 (霓虹光)切截(Neon-cut)薄膜，一道EMI遮蔽薄膜等。 具有良好透明性的EMI遮蔽材料宜能使可見光穿透。 把導電材料，例如銅、銀和鎳以格狀圖案黏附在一透明基 材上，就可製備EMI遮蔽材料。將導電材料黏附在一基板 上的方法，可分成包括濺鍍法及真空沉積在内的乾式方 -6- 1267531 法，以及包括無電鍍金(化學鍍金)等在内的濕式方法。因為 乾式方法需要昂貴的製造設備，所以最被廣泛採用的是廉 價的濕式方法。 無電鍍金方法是讓鍍金溶液與一觸媒接觸而引發鍍金 5反應，因而金屬僅鍍在觸媒上。以一格狀圖案之型態將觸 媒印在透明基材上，接著進行無電鍍金製程即產生透明的 EMI遮蔽材料。 一般說來，因為用於無電鍍金的觸媒是在水中製備， 因此其不易黏附到平滑與疏水性的基材。是以，基材必須 K)經過姓刻等的預處理，以增加其表面粗糙度及親水性質。 ;、、i而這種預處理卻會使得基材表面缺乏均勻性與可視性。 曰本第2_·311527號早期公開糊申請公報曾揭示 -種透明導電薄朗製備方法，該方法係將—種包含有無 ，鍍金用之觸媒的樹脂組成物印刷在一基材上以形成一^ I5疋的圖樣’目後藉由無魏金方法而於該圖樣上形成一導 電金屬層。此方法之優點在於其可以很容易地提供各種圖 樣^金屬層；然而，此方法中的無電鑛金觸媒必須透過非 系複雜的程序方可獲得，且在無電鑛金製程發生之前，在 基材的表面必須形成-層可以承接該樹脂組成物之接受 20 層。 曰本第2GG1_177292號早期公開專射請公報示 一種透明導電薄臈的製備方法，該方法係將—種包 電鍍金用之觸媒的疏水性透明樹脂塗布在一基材上德、 進行無電錢金。於該樹脂層上塗布一種耐鍵化合物後進行 -7- 1267531 透:ί置if 布—種光阻化合物，使光 罩照射，再傾刻，即獲得透明金屬圖案。在大 2情況下’疏水性麵係㈣黏_疏水縣材，但這 二P*_為黏合性低，以致無法獲得高耐久性之透明 ^溥膜的問題。此外’使金屬圖案成型的過程也複雜， =諸如光罩之類昂貴的裝置，而且剌到不含水的鑛層 洛液，以致增加生產成本。
日本第繼·18遞號早期公開專利申請公報也揭示 一種透明刪遮蔽材料的製備方法，該方法係將一種含有 10無電鍍金觸媒的樹脂組成物以格狀圖案印在一基材上，接 著進行無電鑛金。在這案件中’透明圖案係以:種印刷方 法製成’因而不需諸如光單機之類的昂貴裝置，但在鑛金 前卻必須對基材從事預處理以形成_接受層或一錫固層， 以便易於將樹脂組成物黏附到該基材上。此
15分組成之溶液所塗布的錨固層，約需三天始能固化了以致 難以應用到實際場合。 【發明内容】 本發明的動機在於解決前述及其它問題。本發明之目 20的之一在於提供一種用於無電鍍金之觸媒先質組成物，其 包括一種對基材具有良好黏合性的紫外線(ϋν)可固化樹 月曰，以致不需要對基材從事額外的預處理，便可輕易製備 一種電磁干擾遮蔽材料者。 本發明的另一目的在於提供一種使用前述觸媒先質組 -8- 1267531 成物而製備一電磁干擾遮蔽材料的製備方法。 本發明的再-目的是提供-種依本發明;方法所製備 的％磁干擾遮蔽材料。 ，發明的又—目的是提供—種含有前述之電磁干擾遮 敝材料的電漿顯示板(PDP)濾光片。 本發明的另一目的是提供一種含有前述之pDp濾光片 的電漿顯示板(PDP)。 【圖式簡單說明】 茲舉實施例並配合圖式，將本發明詳予說明於後，其 中： 、- 第一圖係依據本發明一實施例所提供之PDp的配置圖 (11 ·機设，12 :操作電路基板，13 :面板總成，14 :電漿 顯示濾光片，15 :蓋板）；以及 第二圖係第一圖所示PDP之PDP濾光片的放大剖視圖 (140:透明基材，142:校色薄膜，144:電磁干擾遮蔽薄膜， 鲁 146 :近紅外線遮蔽薄膜，148 :防反射薄膜）。 【實施方式】 本發明係有關於一種觸媒先質組成物，其包含有(a) — 種反應性低聚物(reactive oligomer) ; (b) —種反應性單體 (reactive monomer) ; (c) —種光引發劑(photoinitiator) ; (d) 一種用於無電鑛金之觸媒先質；和(e) —種溶劑。 " 本發明亦有關於一種透明電磁干擾(EMI)遮蔽材料的 - 1267531 ’其包含有將—種觸媒先質組成物以-格狀圖樣 固化，接著_化表*柿無電照射使其 料得亦有關於—種透明電磁干擾遮蔽材料，且該材 枓係依據上述本發明之方法所製備者。 兹將本發明詳予說明於後。 本案發明人致力開發-種不需對基材加以預處理，便 對基材具有高度黏合性的觸媒先質組成物，藉此可提供一 種電磁干擾遮蔽材制㈣生產料，和降低其生產成本。 15 所如此做時，本案發明人發現一種用於無電鍍金之觸媒 先質組成物，其係藉由將一種作為觸媒先質、包含有VIIIB 私或I B族金屬的無機化合物或有機化合物，溶解於一溶劑 中，再將一種具有極佳黏合性的uv可固化樹脂印在基材 上。此外’因為添加這種對基材具有高度黏合性的uv可 固化樹脂，即不需對基材加以預處理，所以本案發明人亦 發展出以這觸媒先質組成物所製備的透明電磁干擾遮蔽材 料0 此種用於無電鍍金之觸媒先質組成物包含有(a) —種 反應性低聚物；（b) —種反應性單體；（c) 一種光引發劑； 2〇 (d) —種用於無電鍍金之觸媒先質；和(e) 一種溶劑。 該透明導電薄膜的製備方法，係將前述之觸媒先質組 成物以一格狀圖案之型態印在一基礎材料上，將其乾燥， 再用UV照射使其固化，接著進行無電鍍金而成。在這些 製程中，溶解於該組成物中的該觸媒先質，係經由UV照 1267531 射所引發的反應而被轉變成一種適於無電鍍金的觸媒。 该觸媒先質是以離子形式存在於該組成物中，因而亦 稱為「觸媒先質離子(Mn+)」。觸媒的範例包括鈷，铑，銥， 鎳，鈀，鉑，銅，銀和金。藉由利用uv照射觸媒先質組 5成物使該光引發劑轉變成一個基(radical)，而後還原該觸媒 先質離子成一種適於無電鍍金的金屬元素(M〇)。 此外，本發明的優點在於該觸媒先質組成物含有對基 礎材料具備良好黏合性的UV可固化樹脂，因而在無電鍍 金之前不需先將該基材預處理成具有一道接受層(receptive 10 layer) 〇 茲將該觸媒先質組成物的各組成成分詳予說明於後。 在本發明的觸媒先質組成物中，該(幻反應性低聚物決 定了這觸媒先質組成物的各種基本物理化學特性，例如反 應性、黏性、表面光澤、黏合性、以及對化學物與污染的 15 耐抗性。 在本發明的觸媒先質組成物中，該反應性低聚物宜採 用一種具有丙烯酸酯（acrylate)或甲基丙烯酸酯 (methacrylate)作為官能基的材料。例如，適宜的反應性低 聚物包括丙晞酸胺基甲酸乙酯，二丙烯酸胺基甲酸乙酯， 2〇三丙烯酸胺基甲酸乙酯，甲基丙烯酸胺基甲酸乙酯，環氧 丙烯酸酯，環氧二丙烯酸酯，聚酯丙烯酸酯，丙烯酸丙烯 酸酯，或其混合物，但並不以其等為限。 该反應性低聚物的分子量範圍宜為5〇〇到5〇〇〇。該反 應性低聚物的數量可視印刷方法而定。相對於該觸媒先質 -11- 1267531 組成物的總重量，該反應性低聚物的含量為5到50 wt% (重 篁百分比），但以20至45 wt%為宜。 本發明之觸媒先質組成物中所含之該(b)反應性單體， 可供減低該反應性低聚物的黏性，以便易於加工。此外， 反應性單體藉由參與一交聯反應而成為該固化材料的一部 份0 反應性單體係採用一種具有丙稀酸酯或曱基丙稀酸酯 作為g能基的材料，例如，異冰片丙烯酸醋，丙烯酸辛酯， 丙烯酸癸酯，1,6-己二醇二丙烯酸酯，二丙二醇二丙稀酸 1〇 S曰，二丙^一醇^一丙稀酸s旨，二乙二醇二丙稀酸醋，四乙二 醇二丙烯酸酯，乙氧基新戊二醇二丙烯酸酯，丙氧基新戊 一醇一丙:酸酯，2-苯氧基乙基丙烯酸g旨，丙氧基甘油基三 丙席3文S日’乙氧基二甲醇基丙统三丙稀酸醋，季戊四醇三 丙稀酸酯，及其混合物。 15 該反應性單體的分子量範圍宜為100到600。反應性單 體的數量可視印刷方法而定。相對於該觸媒先質組成物的 總重量，該反應性低聚物的含量為1〇到55 wt%，但以25 到45 wt%較宜。
在本發明中，具有丙烯酸酯或甲基丙烯酸酯作為官能 2〇基的該反應性低聚物及該反應性單體可供用於加速觸媒先 質離子(Mn+)變成觸媒先質元素(μ0)的還原反應（r· L
Jackson, J· Electrochem· Soc· 1990, 137(1)，95·; Y· Nakao, J. Colloid Interface Sci. 1995, 171，386)。 此外，本發明的觸媒先質組成物含有（c)項的光引發 -12- 1267531 劑，其係由UV照射而離解成基，和引發該υν可固化樹脂 的交聯反應。 除了這基本功能外，本發明的光引發劑尚可將觸媒先 質組成物中的觸媒先質離子(Μη+)還原成當作無電鍍金反應 5觸媒的觸媒先質元素(Μ0)。 舉例來說，該光引發劑可為α-羥基酮，苯基乙醛酸， 苯偶醯二甲基縮醛，α-氨基酮，單醯基膦，雙醯基膦，及 其混合物。 肇 觸媒先質離子(Μη+)變成元素(Μ’的還原率視所用光引 ίο發劑的種類而定。一般說來，α-羥基酮具有最高的還原率， 但這還原率也取決於反應性低聚物與反應性單體的種類而 略有不同。 相對於不包括該溶劑的觸媒先質組成物，該光引發劑 在該觸媒先質組成物中的含量為1.5到6.0 wt%，但以2.5 15 到4.0 wt%較宜。 此外，該(d)項的無電鍍金用觸媒先質是種VIII B族元 鲁 素或I B族元素的無機化合物或有機化合物。 考慮到該觸媒先質在溶劑的溶解性，宜採用一種有機 化合物，最宜者是具有一種包括Pd2+之羰基或烯烴基的有 20機化合物的鹽類，例如醋酸鈀，三氟醋酸鈀，草酸鈀，乙 醯丙酮酸鈀等。 在某一範圍内，無電鍍金的反應率是與觸媒含量成正 比。該VIII B族金屬或I B族金屬的無機或有機化合物相 、 當昂貴，因而使該化合物數量最佳化是重要的。尤其，該 . -13- 1267531 化合物的含量雖然取決於無電鍍金的種類而略有不同，但 相對於不包括溶劑的該觸媒先質組成物而言，該觸媒先質 的含里宜為〇·2到6.0 wt%，但以〇·4到3.0 wt%較宜。 再者’該(e)項的溶劑在該觸媒先質組成物中並無特別 5設限，所以可以是業界一般採用的溶劑。該溶劑宜為一種 不能參與交聯反應，且在室溫及1大氣壓力時係以液相存 在的有機化合物。該溶劑的黏性及表面張力亦未特別設 限。然而，該溶劑對觸媒先質及光引發劑需有良好的溶解 性’且應與反應性低聚物及反應性單體充分混合，且在1 ίο大氣壓力時的沸點為6〇至85 °C。沸點在60 °C以下的溶劑 雖可使用，但有安全上的顧慮。 滿足這些要求的溶劑範例包括三氯曱烷，乙腈，甲基 乙基酮，醋酸乙酯，及其混合物。 相對於觸媒先質組成物的總重量，該溶劑的含量為2〇 15到45 wt%，但以30到40 wt%較宜。 以前述觸媒先質組成物來製備一電磁干擾遮蔽材料的 方法可歸納成下列幾個步驟：以一格狀圖案之型態印刷該 觸媒先質組成物，使其乾燥，並於其上照射uv，再進行無 電鍍金。茲將該方法詳予說明於後。 2〇 將一種包含VI11 B族或1 B族金屬的無機化合物或有 機化合物的-觸媒先質以及一種光引發劑溶解於一溶劑中 而獲得一溶液，接著將獲得的溶液與一反應性單體和一反 應性低聚物賴拌邊混合，據以提供—侧媒先質組成 物。對這觸媒先質組成物各組分進行混合所用的容器宜為 -14- 1267531 -種以财熱玻璃’例如Pyrex _所製成的三頸圓底燒瓶。 因為金屬擾拌器可能會被該觸媒先f腐敍，所以宜用鐵氟 龍(聚四氟乙烯)材質的攪拌器。 製備觸媒先質組成物後，可依照適用的方法將這組成 5物印在一基材上。印刷方法並未特別設限，但宜為喷墨印 刷，凹版印刷，凸版印刷，和網版印刷等。以觸媒先質組 成物的黏性為基礎，便可選用最佳的印刷方法。在乃T的 溫度條件下，熟知印刷油墨對喷墨印刷而言的適當黏性為i 到100 cps，對凹版印刷為30到300 cps，對凸版印刷為5〇 1〇到500 cps，而對網版印刷則為1〇〇〇到5〇〇〇 cps。 該基材可以是種對可見光具有充分透明性，和具有能 以該觸媒先質組成物輕易印刷之表面的材料，但並未特別 設限。基材的形狀可以是扁平狀，或可具有曲形表面，其 厚度亦未特別設限。基材的範例包括玻璃，聚酯，聚苯乙 15稀’聚（甲基)丙稀酸甲酯，聚碳酸酯，聚丙稀，和聚ί風。因 為基材在印上觸媒先質組成物之後即被加熱和接受無電鍍 金’所以應具有良好的財熱性及低吸濕率。因此，宜用聚 酉旨。 印刷的同時或在其後立刻對基材加熱，就會將觸媒先 20質組成物中的溶劑蒸發。在蒸發過程中，溶解於溶劑中的 觸媒先質離子(Μη+)即會大量移到組成物的表面層。 基材是在對觸媒先質組成物加熱當時或其後接受υν 的照射。UV照射會使該光引發劑離解成各種基，而弓丨發與 5亥反應性單體及該反應性低聚物的交聯反應。隨著交聯反 -15- 1267531 應，該觸媒先質離子(Mn+)便被還原成觸媒金屬(MG)，而可 作為無電鍍金的觸媒。取決於觸媒先質組成物的組成，雖 然是在不同的時期照射UV，但UV的照射時間為1到3分 鐘。在此情況下，UV的能量密度範圍是1500到450〇m 5 J/cm2 〇 當該觸媒先質離子(Mn+)被還原成觸媒金屬（MG)狀態 時，VIII B族或IB族金屬便在基材的表面上顯現出獨特的 顏色。把所顯現的是銀灰色。 經UV照射後，便將該基材浸潰在無電鍍金溶液中。 1〇無電鍍金是以一般的無電鍍金方法來進行，但較宜者為鎳 無電鍍金和銅無電鍍金。在本發明的一較佳實施例中，鎳 無電鍍金溶液宜含有16·5至18.5 g/L的NiS04 (硫酸鎳）， 29 至 31 g/L 的 NaC6H507，8.9 至 9.1 g/L 的 NaC2H302，87 至 89 g/L 的 NaHyPO2,和 3·7 至 3·9 g/L 的 KOH (氳氧化鉀)。 15銅無電鍍金的溶液則宜含有4·5至5.5 g/L的CuS04 (硫酸 銅），7至8 g/L的NaOH (氫氧化鈉）,2至3.5 g/L的HCHO， 和 30 至 36 g/L 的 EDTA。 無電鑛金的反應通常是在浸潰後的2到5分鐘引發， 但這引發反應仍取決於鍍金溶液的種類而略有不同。基材 20在無電鍍金溶液中浸潰約30分鐘後，即會在格狀圖案上產 生一道厚度約幾微米的金屬鍍層。因為無電鍍金的反應僅 與觸媒發生，所以由無電鍍金所獲得的金屬層也僅在印刷 的部份上。這金屬層屬於格狀圖案，因而具有透明性及導 電性。 -16- 1267531 本發明的電磁干擾遮蔽材料係為—由下往上具有一基 材，一 uv可固化層以及一鍍金層的層合結構。大體上， 該基材宜為—種透明材料，例如電聚顯示器濾光片廣泛採 用的玻璃。 5 如前所述，該觸媒先質組成物含有對基材具高度黏合 ' 性的UV可固化樹脂’因此可免除對基材進行預處理步驟 的需要’從而提供—種容易且簡單的電磁干擾遮蔽材料的 製備方法。 0 、此外，本發明提供一種PDP(電漿顯示板)濾光片，其包 括以本發明所獲待的電磁干擾遮蔽薄膜，一道近紅夕卜線遮 蔽薄膜_ '薄膜）’ 一道抗反射塗布薄膜(AR薄膜），一道 氖光切截(Ne〇n-cut)層，一道校色層，和一道黑色層。 本發明亦提供一種含有前述之電漿顯示濾光片的電漿 顯示板。 15 第一圖所示者係依本發明一實施例構成的電漿顯示 板。現將配合第-目詳予說明本發_電細示板。㈣馨 ^顯不板配置-烟以顯示晝面的機殼u，—片位於該機 鈸11月面、配置有電子元件用以操作該面板的操作電路基 板12 , 一片用以顯示紅、綠和藍色的面板總成13，一片配 2〇置在面板總成13正面之上的電漿顯示濾光片14，和一片用 以容置電漿顯示板U，操作電路基板12，面板總成13，和 電漿顯示濾光片14的蓋板15。 第二圖所示者係第―圖之電漿顯㈣光片14的放大剖 - 視圖。該電漿顯示濾光片具有在一透明基材上層合若干二 •17- 1267531 此!·生擅的、、、。構。參_二圖，該電 在-透明基材140上層人龍⑷邏^ 4具有 镇膜M4，-、“ <_ &色細142’ —電磁干擾遮蔽 社 m線遮蔽薄膜146，和—防反射薄膜148 的結構。 在 =電漿顯示㈣光片14巾’該近紅外線遮蔽薄膜 146包括-道近紅外線吸收薄膜，其中是將—混合有近紅外 線吸收染料的聚合物塗布在透明基材 140 上。 、本發明的電漿顯示板包括一種在第二圖所示之面板總 成上部具有-電磁干擾遮蔽㈣的電軒擾遮㈣光片。 因此，本發明可降低電漿顯示板的生產成本。 兹舉若干範例將本發明詳予說明於後。然而，下列的 各範例僅供用以瞭解本發明而已，並非用以限制本發明。 範例 範例1 15 Α·觸媒先質組成物的製備 將15 g的醋酸鈀和35 g的Irgacure 184 (Ciba公司產製) 溶解於400 g的甲基乙基_中，據以獲得一種溶液。一邊攪 拌這溶液，一邊添加300 g的三丙二醇二丙晞酸酯以及1〇〇 g的季戊四醇三丙烯酸酯作為反應性單體。使溶液均質化 2〇後’再將600g的脂族丙稀酸胺基甲酸乙醋(Ebecry 264， SK-ucb)作為反應性低聚物添加到這混合物溶液，接著對其 攪拌而變成一種均質化溶液，即提供一種在室溫時之黏性 為298 cps的觸媒先質組成物。 B.觸媒先質組成物的印刷 -18- 1267531 依照凹板印刷方法，係以一矩形格狀圖案之型態將該 觸媒先質溶液印在一聚酯基材料(SH34，SKC)上，其中該 格狀圖案具有30μηι的線寬和300μπι的間隔。於80 °C的 溫度下將溶劑乾燥1分鐘之後，立刻用uv燈照射基材。 5約經過2分鐘後，該觸媒先質溶液被固化到顯現出鈀的銀 灰色的固相。 C·無電鍵金 在50 °C的溫度條件下，將UV照射過的基材浸潰於一 鍍鎳溶液中。約經過5分鐘後，印刷圖案的表面上即產生 10虱氣’表示已引發無電鑛鎳還原反應。再經過約30多分鐘 後，便對圖案表面選擇性形成一道厚度為6μιη的鍍鎳層。 以Nichiban膠帶從事測試的結果顯示，這無電鍍鎳層對基 材的黏合性為99/100。所製成之透明電磁干擾遮蔽材料的 表面電阻為120Q/sq.，透光度則為78%。 15 範例2 A·觸媒先質組成物的製備 將20 g的乙醯丙酮酸纪，30 g的Irgacure 184 (Ciba公 司產製），和5 g的Irgacure TPO (Ciba公司產製)溶解於4〇〇 20 g的三氯甲烷中，據以獲得一種溶液。一邊攪拌這溶液，一 邊添加200 g的1，6·己二醇二丙烯酸酯，250 g的二丙二醇 二丙晞酸酯，150 g的三乙二醇二丙烯酸酯，和300 g的丙 稀酸辛/癸酯作為反應性單體。使溶液均質化後，再將100 g 的丙晞酸聚酯(CN2200，Sartomer)作為反應性低聚物添加到 -19· 1267531 這混合物溶液，接著對其攪拌而變成一種均質化溶液，即 提供一種在室溫時之黏性為4.1 cps的觸媒先質組成物。 B·觸媒先質組成物的印刷 將該觸媒先質溶液倒入喷墨印刷的中空墨水匣内，再 5將其安裝到一喷墨印表機。該印表機及墨水匣分別是Epson 公司製售的Stylus 980印表機與T003墨水匣。採用 Autodesk公司的AutoCAD 2002程式，以電腦製作出線寬 為40μπι和間隔為300μπι的矩形格狀圖案。連接電腦與印 ❿ 表機，以該格狀圖案之型態將該觸媒先質溶質印在一聚酯 1〇基材上。於65 °C的溫度下將溶劑乾燥丨分鐘之後，立刻用 UV燈照射基材。UV是採用光纖照射出。約經過丨分鐘後， 該觸媒先質溶液被固化到顯現出鈀的銀灰色的固相。 C.無電鍍金 在46 的溫度條件下，將！；¥照射過的基材浸潰於_ I5鍍銅溶液中。約經過5分鐘後，即在圖案表面上引發鍍金 反應。再經過約30多分鐘後，便對圖案表面選擇性黏附— 道厚度為1·5μιη的鑛銅層。以Nichiban膠帶從事測試的結 果顯示’這無電鑛銅對基材的黏合性為99/100。所製成之 透明電磁干擾遮蔽材料的表面電阻為15Q/sq，透光度則為 2〇 780/〇 〇 _ 量測 該觸媒先質溶液的黏性是用Brookfield公司製造的 DV_II+黏度計予以量測。表面電阻和透光度則是分別用 Guardian公司製造的Guardian 232-1000表面電阻計與 -20- 1267531
Murakami Color Research Laboratory 製造的 HR-100 透射反 射計予以量測。至於無電鍍金屬層對基材的黏合性，則是 依照JIS D0202標準從事Nichiban膠帶測試予以量測。 無電鍍金溶液 5 鎳無電鐘金溶液係在範例中製備，而銅無電鑛金溶液 則是購自Cuposit 250™ (Shipley)。該等無電鍍金溶液具有 下列組成及條件。 鎳無電鍛金溶液： 16.5 至 18·5 g/L 的 NiS〇4 (硫酸鎳）；29 至 31 g/L 的 ⑴ NaC6H507 ; 8.9 至 9.1 g/L 的 NaC2H302 ; 87 至 89 g/L 的 NaH2P〇2 ; 3.7至3·9 g/L的KOH (氫氧化鉀）。溫度：47至 53°C 〇 銅無電鑛金溶液(Cuposit 250TM) 4·5 至 5·5 g/L 的 CuS〇4 (硫酸銅）;7 至 8 g/L 的 NaOH (氫 15 氧化納）；2 至 3.5 g/L 的 HCHO ; 30 至 36 g/L 的 EDTA。溫 度：43-49 °C。 依據該等範例，係將本發明的觸媒先質組成物印在一 基材上而產生一圖案，再予乾燥，用UV照射，和對其進 仃無電鍍金，因而本發明提供一種僅在基材的圖案上鍍上 20諸如鎳和銅之類金屬的圖案，無需讓基材接受其它的預處 理，以致能輕易製備該電磁干擾遮蔽材料。此外，這種電 磁干擾材料具有良好的表面電阻及透光度。 -21- 1267531 【圖式簡單說明】 第一圖係依據本發明一實施例所提供之PDP的配置 圖；以及 第二圖係第一圖所示PDP之PDP濾光片的放大剖視 5圖0 【主要元件符號說明】 11 :機殼 13 :面板總成 ίο 15 :蓋板 140 :透明基材 144 :電磁干擾遮蔽薄膜 148 :防反射薄膜 12 :操作電路基板 _ 14 :電漿顯示濾光片 142 :校色薄膜 146 :近紅外線遮蔽薄膜 15 -22-
Claims (1)
1267531 丙氧基新戊二醇二丙烯酸酯，2-苯氧基乙基丙烯酸酯，丙氧 基甘油基三丙烯酸醋’乙氧基三甲醇基丙烷三丙烯酸賴= 季戊四醇三丙烯酸酯，及其混合物所構成之族群中所^ 者。 、 5 4·如申請專利範圍第1項所述之用於無電鍍金的觸媒 先質組成物，其中該(d)用於無電鑛金之觸媒先質，是種勺' 括羰基或烯烴基，以及Pd2+的有機化合物的鹽類。 匕 5.如申請專利範圍第4項所述之用於無電鍍金的觸媒 先質組成物，其中該有機化合物的鹽類是從醋酸鈀，三氟 比醋酸鈀，草酸鈀，乙醯丙酮酸鈀，及其混合物所構成 群中所選用者。 ' 6. 如申請專利範圍第丨項所述之用於無電鑛金的觸媒 先質組成物，其中該(e)溶劑是從三氯甲烷，乙腈，甲基乙 基酮，醋酸乙S旨’及其混合物所構成之族群中所選用 7. —種透明電磁干擾遮蔽材料的製備方法，包 列步驟·· 负下
將一種包含有Θ) 一種反應性低聚物、（b)—種反應性單 體（C)種光引發劑、（d)一種用於無電鑛金之觸媒先質以 及⑻一種溶劑之觸媒先質組成物，以-格狀圖樣之型態印 照射紫外(UV)線使其固化 ;以及 在基材的固化表面上進行無電鍍金。 範圍 第7 8· 一種透明電磁干擾遮蔽㈣，其細申請專利 項所述之製備方法製備者。 -24- 1267531 9.如申請專利範圍第8項所述之透明電磁干擾遮蔽材 料，其包括由下往上層合的一基材，一紫外線可固化層， 以及一無電鍍金層。
-25-
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| KR10-2003-0052425A KR100529371B1 (ko) | 2003-07-29 | 2003-07-29 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
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| US (2) | US7378478B2 (zh) |
| EP (1) | EP1649077B1 (zh) |
| JP (1) | JP4160598B2 (zh) |
| KR (1) | KR100529371B1 (zh) |
| CN (1) | CN100427643C (zh) |
| AT (1) | ATE411412T1 (zh) |
| DE (1) | DE602004017183D1 (zh) |
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-
2004
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- 2004-07-23 EP EP04748475A patent/EP1649077B1/en not_active Expired - Lifetime
- 2004-07-23 CN CNB2004800009320A patent/CN100427643C/zh not_active Expired - Lifetime
- 2004-07-23 WO PCT/KR2004/001860 patent/WO2005010234A1/en not_active Ceased
- 2004-07-23 JP JP2005518227A patent/JP4160598B2/ja not_active Expired - Lifetime
- 2004-07-23 DE DE200460017183 patent/DE602004017183D1/de not_active Expired - Lifetime
- 2004-07-27 TW TW93122464A patent/TWI267531B/zh not_active IP Right Cessation
- 2004-07-28 US US10/900,622 patent/US7378478B2/en not_active Expired - Lifetime
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Also Published As
| Publication number | Publication date |
|---|---|
| CN100427643C (zh) | 2008-10-22 |
| TW200505977A (en) | 2005-02-16 |
| JP2006510809A (ja) | 2006-03-30 |
| US20080213506A1 (en) | 2008-09-04 |
| KR20050013842A (ko) | 2005-02-05 |
| US20050022692A1 (en) | 2005-02-03 |
| CN1701135A (zh) | 2005-11-23 |
| DE602004017183D1 (de) | 2008-11-27 |
| US7378478B2 (en) | 2008-05-27 |
| KR100529371B1 (ko) | 2005-11-21 |
| US8053540B2 (en) | 2011-11-08 |
| ATE411412T1 (de) | 2008-10-15 |
| EP1649077B1 (en) | 2008-10-15 |
| JP4160598B2 (ja) | 2008-10-01 |
| WO2005010234A1 (en) | 2005-02-03 |
| EP1649077A1 (en) | 2006-04-26 |
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