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TWI267147B - Semiconductor device and hybrid integrated circuit device - Google Patents

Semiconductor device and hybrid integrated circuit device

Info

Publication number
TWI267147B
TWI267147B TW93115614A TW93115614A TWI267147B TW I267147 B TWI267147 B TW I267147B TW 93115614 A TW93115614 A TW 93115614A TW 93115614 A TW93115614 A TW 93115614A TW I267147 B TWI267147 B TW I267147B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
semiconductor device
common leads
hybrid integrated
island
Prior art date
Application number
TW93115614A
Other languages
English (en)
Other versions
TW200503124A (en
Inventor
Isao Ochiai
Masato Take
Original Assignee
Sanyo Electric Co
Kanto Sanyo Semiconductors Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34187786&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI267147(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sanyo Electric Co, Kanto Sanyo Semiconductors Co filed Critical Sanyo Electric Co
Publication of TW200503124A publication Critical patent/TW200503124A/zh
Application granted granted Critical
Publication of TWI267147B publication Critical patent/TWI267147B/zh

Links

Classifications

    • H10W40/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H10W70/461—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/5524—
    • H10W72/884—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW93115614A 2003-07-01 2004-06-01 Semiconductor device and hybrid integrated circuit device TWI267147B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003189633A JP4326275B2 (ja) 2003-07-01 2003-07-01 半導体装置

Publications (2)

Publication Number Publication Date
TW200503124A TW200503124A (en) 2005-01-16
TWI267147B true TWI267147B (en) 2006-11-21

Family

ID=34187786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93115614A TWI267147B (en) 2003-07-01 2004-06-01 Semiconductor device and hybrid integrated circuit device

Country Status (5)

Country Link
US (1) US7102211B2 (zh)
JP (1) JP4326275B2 (zh)
KR (1) KR100585896B1 (zh)
CN (1) CN100346476C (zh)
TW (1) TWI267147B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004028796D1 (de) * 2004-02-12 2010-10-07 Askoll Holding Srl Diskrete elektronische Komponente und Montagemethode dafür
KR101340512B1 (ko) * 2006-12-01 2013-12-12 삼성디스플레이 주식회사 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리
US8116102B2 (en) * 2007-12-26 2012-02-14 Infineon Technologies Ag Integrated circuit device and method of producing
JP5634033B2 (ja) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法
DE102010002950A1 (de) * 2010-03-17 2011-09-22 Robert Bosch Gmbh Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug
DE102010002945A1 (de) * 2010-03-17 2011-09-22 Robert Bosch Gmbh Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug
JP5755186B2 (ja) * 2012-06-25 2015-07-29 三菱電機株式会社 半導体装置の製造方法および半導体装置
US9397017B2 (en) 2014-11-06 2016-07-19 Semiconductor Components Industries, Llc Substrate structures and methods of manufacture
US9408301B2 (en) 2014-11-06 2016-08-02 Semiconductor Components Industries, Llc Substrate structures and methods of manufacture
US11437304B2 (en) 2014-11-06 2022-09-06 Semiconductor Components Industries, Llc Substrate structures and methods of manufacture
US9530749B2 (en) * 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
CN110957301A (zh) * 2019-12-09 2020-04-03 合肥镭士客微电路有限公司 带有外置线路的集成电路芯片及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
US4965654A (en) * 1989-10-30 1990-10-23 International Business Machines Corporation Semiconductor package with ground plane
JP2536436B2 (ja) * 1993-11-19 1996-09-18 日本電気株式会社 モ―ルド型半導体装置
US6011694A (en) * 1996-08-01 2000-01-04 Fuji Machinery Mfg. & Electronics Co., Ltd. Ball grid array semiconductor package with solder ball openings in an insulative base
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
KR100411206B1 (ko) * 2001-02-19 2003-12-18 삼성전자주식회사 반도체 패키지

Also Published As

Publication number Publication date
KR20050004007A (ko) 2005-01-12
TW200503124A (en) 2005-01-16
CN100346476C (zh) 2007-10-31
US7102211B2 (en) 2006-09-05
JP4326275B2 (ja) 2009-09-02
US20050236706A1 (en) 2005-10-27
KR100585896B1 (ko) 2006-06-07
CN1577826A (zh) 2005-02-09
JP2005026415A (ja) 2005-01-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees