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TWI265978B - Solution-vaporization type CVD apparatus - Google Patents

Solution-vaporization type CVD apparatus

Info

Publication number
TWI265978B
TWI265978B TW094106953A TW94106953A TWI265978B TW I265978 B TWI265978 B TW I265978B TW 094106953 A TW094106953 A TW 094106953A TW 94106953 A TW94106953 A TW 94106953A TW I265978 B TWI265978 B TW I265978B
Authority
TW
Taiwan
Prior art keywords
raw
material solution
orifice
tube
solution
Prior art date
Application number
TW094106953A
Other languages
Chinese (zh)
Other versions
TW200611991A (en
Inventor
Hisayoshi Yamoto
Shinichi Koshimae
Original Assignee
Youtec Co Ltd
Hisayoshi Yamoto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Youtec Co Ltd, Hisayoshi Yamoto filed Critical Youtec Co Ltd
Publication of TW200611991A publication Critical patent/TW200611991A/en
Application granted granted Critical
Publication of TWI265978B publication Critical patent/TWI265978B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4486Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Memories (AREA)

Abstract

The vaporizer of the solution-vaporization type CVD apparatus comprises: the orifice tube, inside the nozzle (32), dispersing at least one kind of a raw-material solution in a carrier gas in a fine particulate or misty form; at least one path for at least one kind of the raw-material solution, the at least one path supplying at least one kind of the raw-material solution to the orifice tube separately from one another; the path for the carrier gas supplying the carrier gas to the orifice tube separately from the raw-material solution; the vaporizing tube vaporizing at least one kind of the raw-material solution dispersed by the orifice tube; and the orifice connected to the vaporizing tube (31) and the orifice tube, the orifice introducing at least one kind of the raw-material solution dispersed by the orifice tube into the vaporizing member.
TW094106953A 2004-10-01 2005-03-08 Solution-vaporization type CVD apparatus TWI265978B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004290087A JP3896594B2 (en) 2004-10-01 2004-10-01 Vaporizer for CVD, solution vaporization type CVD apparatus, and vaporization method for CVD

Publications (2)

Publication Number Publication Date
TW200611991A TW200611991A (en) 2006-04-16
TWI265978B true TWI265978B (en) 2006-11-11

Family

ID=35521158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106953A TWI265978B (en) 2004-10-01 2005-03-08 Solution-vaporization type CVD apparatus

Country Status (6)

Country Link
US (1) US20060070575A1 (en)
EP (1) EP1643003A1 (en)
JP (1) JP3896594B2 (en)
KR (1) KR100654400B1 (en)
CN (1) CN1754982A (en)
TW (1) TWI265978B (en)

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JP2007308774A (en) * 2006-05-19 2007-11-29 Utec:Kk Thin-film-forming apparatus and thin-film-forming method
FR2900071B1 (en) * 2006-08-24 2009-02-13 Kemstream Soc Par Actions Simp DEVICE FOR INTRODUCING OR INJECTING OR SPRAYING A MIXTURE OF VECTOR GAS AND LIQUID COMPOUNDS AND METHOD FOR IMPLEMENTING SAID DEVICE
JP5427344B2 (en) 2007-05-23 2014-02-26 株式会社渡辺商行 Vaporization apparatus and film forming apparatus equipped with vaporization apparatus
JP2008294190A (en) * 2007-05-24 2008-12-04 Hitachi Kokusai Electric Inc Substrate processing equipment
JP2009239082A (en) * 2008-03-27 2009-10-15 Tokyo Electron Ltd Gas feeding device, treating device, and treating method
JP5422177B2 (en) * 2008-11-11 2014-02-19 ルネサスエレクトロニクス株式会社 Method for restarting film forming equipment
US9353625B2 (en) * 2009-01-13 2016-05-31 General Electric Technology Gmbh Device for cleaning oxidized or corroded components in the presence of a halogenous gas mixture
FI20115236A0 (en) * 2011-03-09 2011-03-09 Beneq Oy Coating method, apparatus and application
JP5720406B2 (en) * 2011-05-10 2015-05-20 東京エレクトロン株式会社 GAS SUPPLY DEVICE, HEAT TREATMENT DEVICE, GAS SUPPLY METHOD, AND HEAT TREATMENT METHOD
KR101678100B1 (en) * 2015-02-12 2016-11-22 (주)티티에스 Source supply device and substrate processing apparatus
JP6578125B2 (en) * 2015-04-30 2019-09-18 株式会社フジキン Vaporization supply device
WO2020213104A1 (en) 2019-04-17 2020-10-22 株式会社Welcon Vaporizer and method for manufacture thereof
CN113058342B (en) * 2021-04-13 2022-10-28 西安航空制动科技有限公司 CVD furnace filter equipment convenient to online real-time clearance
CN116145249A (en) * 2022-12-15 2023-05-23 西安电子科技大学 A vertical structure Mist-CVD equipment with multi-source high-pressure gas atomization

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US5362328A (en) * 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
DE69218152T2 (en) * 1991-12-26 1997-08-28 Canon K.K., Tokio/Tokyo Manufacturing process of a deposited layer by means of CVD, using liquid raw material and suitable device
KR940011791B1 (en) * 1992-04-15 1994-12-26 금성일렉트론주식회사 Temperature Stabilized Mass Flow Controller Sensors
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Also Published As

Publication number Publication date
JP2006108230A (en) 2006-04-20
EP1643003A1 (en) 2006-04-05
KR20060043838A (en) 2006-05-15
TW200611991A (en) 2006-04-16
JP3896594B2 (en) 2007-03-22
CN1754982A (en) 2006-04-05
KR100654400B1 (en) 2006-12-06
US20060070575A1 (en) 2006-04-06

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees