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TWI265643B - Package structure of light emitted diode with U-groove - Google Patents

Package structure of light emitted diode with U-groove

Info

Publication number
TWI265643B
TWI265643B TW94100567A TW94100567A TWI265643B TW I265643 B TWI265643 B TW I265643B TW 94100567 A TW94100567 A TW 94100567A TW 94100567 A TW94100567 A TW 94100567A TW I265643 B TWI265643 B TW I265643B
Authority
TW
Taiwan
Prior art keywords
led
groove
substrate
light intensity
light
Prior art date
Application number
TW94100567A
Other languages
Chinese (zh)
Other versions
TW200631193A (en
Inventor
Yi-Heng Su
Ya-Mei Su
Original Assignee
Yi-Heng Su
Ya-Mei Su
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yi-Heng Su, Ya-Mei Su filed Critical Yi-Heng Su
Priority to TW94100567A priority Critical patent/TWI265643B/en
Publication of TW200631193A publication Critical patent/TW200631193A/en
Application granted granted Critical
Publication of TWI265643B publication Critical patent/TWI265643B/en

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  • Led Devices (AREA)

Abstract

The present invention discloses a package structure of light emitted diode (LED). In order to increase the brightness of the LED by decreasing the substrate absorption, an U-groove etched by selective chemical etching from the back side of the substrate is performed after the wafer processing is completed. Part of the substrate is etched away and left the pn junction and the buffer layer of the LED device. A metal layer is deposited on the U-groove to form a reflective layer, thus increasing the light intensity; or a transparent conductive layer is deposited on the U-groove, thus the LED will emit light to both sides. The light intensity of both sides may be equal. This structure package 2 or 3 LED in cascaded to form a full color LED or a white light LED. The light intensity is also enhanced. Then the packaged LED wafer is scribed into single chips or LED array. This structure need not put the positive and negative electrodes in one side (the front side). But can put them in the front side and the back side respectively. Thus the emitting area may increase and heat sink also quickly.
TW94100567A 2005-02-21 2005-02-21 Package structure of light emitted diode with U-groove TWI265643B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94100567A TWI265643B (en) 2005-02-21 2005-02-21 Package structure of light emitted diode with U-groove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94100567A TWI265643B (en) 2005-02-21 2005-02-21 Package structure of light emitted diode with U-groove

Publications (2)

Publication Number Publication Date
TW200631193A TW200631193A (en) 2006-09-01
TWI265643B true TWI265643B (en) 2006-11-01

Family

ID=38122270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94100567A TWI265643B (en) 2005-02-21 2005-02-21 Package structure of light emitted diode with U-groove

Country Status (1)

Country Link
TW (1) TWI265643B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368705B2 (en) 2013-09-02 2016-06-14 Lextar Electronics Corporation LED packaging structure and method for manufacturing the same
TWI708085B (en) * 2018-04-25 2020-10-21 睿宇興業有限公司 Electronic device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878039B (en) * 2024-03-04 2025-03-21 虹光精密工業股份有限公司 Light-emitting semiconductor structure and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368705B2 (en) 2013-09-02 2016-06-14 Lextar Electronics Corporation LED packaging structure and method for manufacturing the same
TWI708085B (en) * 2018-04-25 2020-10-21 睿宇興業有限公司 Electronic device

Also Published As

Publication number Publication date
TW200631193A (en) 2006-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees