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TWI265382B - Lithographic projection apparatus, array of individually controllable elements, and method for manufacturing devices involving fine structures - Google Patents

Lithographic projection apparatus, array of individually controllable elements, and method for manufacturing devices involving fine structures

Info

Publication number
TWI265382B
TWI265382B TW093132822A TW93132822A TWI265382B TW I265382 B TWI265382 B TW I265382B TW 093132822 A TW093132822 A TW 093132822A TW 93132822 A TW93132822 A TW 93132822A TW I265382 B TWI265382 B TW I265382B
Authority
TW
Taiwan
Prior art keywords
array
individually controllable
controllable elements
projection apparatus
lithographic projection
Prior art date
Application number
TW093132822A
Other languages
English (en)
Other versions
TW200527151A (en
Inventor
Arno Jan Bleeker
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200527151A publication Critical patent/TW200527151A/zh
Application granted granted Critical
Publication of TWI265382B publication Critical patent/TWI265382B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70566—Polarisation control
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/12—Function characteristic spatial light modulator

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Polarising Elements (AREA)
TW093132822A 2003-11-07 2004-10-28 Lithographic projection apparatus, array of individually controllable elements, and method for manufacturing devices involving fine structures TWI265382B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03257056 2003-11-07

Publications (2)

Publication Number Publication Date
TW200527151A TW200527151A (en) 2005-08-16
TWI265382B true TWI265382B (en) 2006-11-01

Family

ID=34610135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132822A TWI265382B (en) 2003-11-07 2004-10-28 Lithographic projection apparatus, array of individually controllable elements, and method for manufacturing devices involving fine structures

Country Status (7)

Country Link
US (2) US7196772B2 (zh)
JP (2) JP4397791B2 (zh)
KR (1) KR100592826B1 (zh)
CN (1) CN100517073C (zh)
DE (1) DE602004017400D1 (zh)
SG (1) SG112084A1 (zh)
TW (1) TWI265382B (zh)

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US7196772B2 (en) * 2003-11-07 2007-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060088076A1 (en) * 2004-10-25 2006-04-27 Yoram Lubianiker Operational range designation and enhancement in optical readout of temperature
US7268357B2 (en) * 2005-05-16 2007-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography apparatus and method
KR100764061B1 (ko) * 2006-12-04 2007-10-08 삼성전자주식회사 이미지 센서 및 그 형성 방법
EP2179329A1 (en) * 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
EP2179330A1 (en) * 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
EP2219077A1 (en) * 2009-02-12 2010-08-18 Carl Zeiss SMT AG Projection exposure method, projection exposure system and projection objective
KR101658494B1 (ko) * 2009-06-30 2016-09-21 에이에스엠엘 네델란즈 비.브이. 반사성 요소의 어레이의 회전을 위한 마운팅 및 이를 포함하는 리소그래피 장치
US8318409B2 (en) * 2009-10-21 2012-11-27 GM Global Technology Operations LLC Dynamic masking method for micro-truss foam fabrication
FR2959025B1 (fr) * 2010-04-20 2013-11-15 St Microelectronics Rousset Procede et dispositif de photolithographie
NL2024009A (en) * 2018-10-18 2020-05-07 Asml Netherlands Bv Control of optical modulator
WO2023172228A2 (en) * 2022-03-07 2023-09-14 Istanbul Medipol Universitesi A photolithography method and system

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EP1482373A1 (en) * 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1530092B1 (en) 2003-11-07 2008-10-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7196772B2 (en) * 2003-11-07 2007-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
US7196772B2 (en) 2007-03-27
CN1614514A (zh) 2005-05-11
TW200527151A (en) 2005-08-16
JP4397791B2 (ja) 2010-01-13
US7826035B2 (en) 2010-11-02
CN100517073C (zh) 2009-07-22
US20050118528A1 (en) 2005-06-02
SG112084A1 (en) 2005-06-29
JP2009021618A (ja) 2009-01-29
KR20050044295A (ko) 2005-05-12
DE602004017400D1 (de) 2008-12-11
US20070165203A1 (en) 2007-07-19
JP2005150714A (ja) 2005-06-09
KR100592826B1 (ko) 2006-06-26
JP4860674B2 (ja) 2012-01-25

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MM4A Annulment or lapse of patent due to non-payment of fees