TWI264481B - Copper electroplating method using insoluble anode - Google Patents
Copper electroplating method using insoluble anodeInfo
- Publication number
- TWI264481B TWI264481B TW90125040A TW90125040A TWI264481B TW I264481 B TWI264481 B TW I264481B TW 90125040 A TW90125040 A TW 90125040A TW 90125040 A TW90125040 A TW 90125040A TW I264481 B TWI264481 B TW I264481B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper electroplating
- insoluble anode
- atom
- electroplating method
- filled
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 238000009713 electroplating Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 238000006263 metalation reaction Methods 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- 125000004430 oxygen atom Chemical group O* 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 125000004434 sulfur atom Chemical group 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/8305—Miscellaneous [e.g., treated surfaces, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000309456 | 2000-10-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI264481B true TWI264481B (en) | 2006-10-21 |
Family
ID=18789611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW90125040A TWI264481B (en) | 2000-10-10 | 2001-10-11 | Copper electroplating method using insoluble anode |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040050706A1 (zh) |
| EP (1) | EP1325972A4 (zh) |
| JP (1) | JPWO2002031228A1 (zh) |
| KR (1) | KR20030055278A (zh) |
| CN (1) | CN1469940A (zh) |
| AU (1) | AU2001294204A1 (zh) |
| TW (1) | TWI264481B (zh) |
| WO (1) | WO2002031228A1 (zh) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040101665A1 (en) * | 2001-02-14 | 2004-05-27 | Shipley Company, L.L.C. | Direct patterning method |
| US20040253450A1 (en) * | 2001-05-24 | 2004-12-16 | Shipley Company, L.L.C. | Formaldehyde-free electroless copper plating process and solution for use in the process |
| JP4510369B2 (ja) * | 2002-11-28 | 2010-07-21 | 日本リーロナール有限会社 | 電解銅めっき方法 |
| US20040118691A1 (en) * | 2002-12-23 | 2004-06-24 | Shipley Company, L.L.C. | Electroplating method |
| US20050072683A1 (en) * | 2003-04-03 | 2005-04-07 | Ebara Corporation | Copper plating bath and plating method |
| JP2006294725A (ja) | 2005-04-07 | 2006-10-26 | Fujikura Ltd | 配線基板、多層配線基板およびそれらの製造方法 |
| WO2011154493A1 (en) * | 2010-06-11 | 2011-12-15 | Alchimer | Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition |
| JP5851233B2 (ja) | 2011-12-22 | 2016-02-03 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| JP5843606B2 (ja) * | 2011-12-27 | 2016-01-13 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| JP5952093B2 (ja) * | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| JP6031319B2 (ja) * | 2012-10-04 | 2016-11-24 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| CN103320820B (zh) * | 2013-06-18 | 2015-08-19 | 河南江河机械有限责任公司 | 酸性光亮镀铜电镀工艺 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| JPH0452296A (ja) * | 1990-06-20 | 1992-02-20 | Permelec Electrode Ltd | 銅めっき方法 |
| JPH07316875A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| CA2359473A1 (en) * | 1999-01-21 | 2000-07-27 | Atotech Deutschland Gmbh | Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits |
| JP4394234B2 (ja) * | 2000-01-20 | 2010-01-06 | 日鉱金属株式会社 | 銅電気めっき液及び銅電気めっき方法 |
| TWI268966B (en) * | 2001-06-07 | 2006-12-21 | Shipley Co Llc | Electrolytic copper plating method |
| JP6101616B2 (ja) * | 2013-10-04 | 2017-03-22 | 株式会社日立産機システム | 変圧器 |
-
2001
- 2001-10-09 KR KR10-2003-7005014A patent/KR20030055278A/ko not_active Withdrawn
- 2001-10-09 US US10/398,829 patent/US20040050706A1/en not_active Abandoned
- 2001-10-09 AU AU2001294204A patent/AU2001294204A1/en not_active Abandoned
- 2001-10-09 EP EP01974740A patent/EP1325972A4/en not_active Withdrawn
- 2001-10-09 JP JP2002534591A patent/JPWO2002031228A1/ja active Pending
- 2001-10-09 WO PCT/JP2001/008853 patent/WO2002031228A1/ja not_active Ceased
- 2001-10-09 CN CNA018171869A patent/CN1469940A/zh active Pending
- 2001-10-11 TW TW90125040A patent/TWI264481B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20040050706A1 (en) | 2004-03-18 |
| WO2002031228A1 (fr) | 2002-04-18 |
| EP1325972A1 (en) | 2003-07-09 |
| JPWO2002031228A1 (ja) | 2004-02-19 |
| EP1325972A4 (en) | 2007-01-24 |
| AU2001294204A1 (en) | 2002-04-22 |
| CN1469940A (zh) | 2004-01-21 |
| KR20030055278A (ko) | 2003-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |