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TWI263311B - High-voltage device structure having high endurance capability of ESD - Google Patents

High-voltage device structure having high endurance capability of ESD

Info

Publication number
TWI263311B
TWI263311B TW092136356A TW92136356A TWI263311B TW I263311 B TWI263311 B TW I263311B TW 092136356 A TW092136356 A TW 092136356A TW 92136356 A TW92136356 A TW 92136356A TW I263311 B TWI263311 B TW I263311B
Authority
TW
Taiwan
Prior art keywords
esd
drain region
device structure
voltage device
endurance capability
Prior art date
Application number
TW092136356A
Other languages
English (en)
Other versions
TW200522280A (en
Inventor
Ming-Dou Ker
Kuen-Shien Lin
Geeng-Lih Lin
Original Assignee
Vanguard Int Semiconduct Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Int Semiconduct Corp filed Critical Vanguard Int Semiconduct Corp
Priority to TW092136356A priority Critical patent/TWI263311B/zh
Priority to US10/992,362 priority patent/US7129546B2/en
Publication of TW200522280A publication Critical patent/TW200522280A/zh
Application granted granted Critical
Publication of TWI263311B publication Critical patent/TWI263311B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/603Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • H10D62/116Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
TW092136356A 2003-12-22 2003-12-22 High-voltage device structure having high endurance capability of ESD TWI263311B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092136356A TWI263311B (en) 2003-12-22 2003-12-22 High-voltage device structure having high endurance capability of ESD
US10/992,362 US7129546B2 (en) 2003-12-22 2004-11-19 Electrostatic discharge protection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092136356A TWI263311B (en) 2003-12-22 2003-12-22 High-voltage device structure having high endurance capability of ESD

Publications (2)

Publication Number Publication Date
TW200522280A TW200522280A (en) 2005-07-01
TWI263311B true TWI263311B (en) 2006-10-01

Family

ID=34676149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092136356A TWI263311B (en) 2003-12-22 2003-12-22 High-voltage device structure having high endurance capability of ESD

Country Status (2)

Country Link
US (1) US7129546B2 (zh)
TW (1) TWI263311B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100558046B1 (ko) * 2004-12-28 2006-03-07 주식회사 하이닉스반도체 온도에 둔감한 포화전류를 갖는 모스트랜지스터 및 그를이용한 정전압 발생기
US7855419B2 (en) * 2006-06-15 2010-12-21 Himax Technologies Limited ESD device layout for effectively reducing internal circuit area and avoiding ESD and breakdown damage and effectively protecting high voltage IC
US9385241B2 (en) 2009-07-08 2016-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge (ESD) protection circuits, integrated circuits, systems, and methods for forming the ESD protection circuits
US8405941B2 (en) * 2009-11-30 2013-03-26 Nuvoton Technology Corporation ESD protection apparatus and ESD device therein
JP5703790B2 (ja) * 2011-01-31 2015-04-22 富士通セミコンダクター株式会社 半導体装置及びその製造方法
US8686509B2 (en) 2012-02-09 2014-04-01 Macronix International Co., Ltd. Semiconductor structure and method for manufacturing the same
JP6255421B2 (ja) * 2013-01-30 2017-12-27 マイクロチップ テクノロジー インコーポレイテッドMicrochip Technology Incorporated Esd自己保護を有するdmos半導体デバイスおよびそれを備えたlinバスドライバ
CN107611121B (zh) * 2016-07-11 2020-12-29 联华电子股份有限公司 用于静电放电保护的半导体结构
US12132042B2 (en) * 2022-07-25 2024-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Strap technology to improve ESD HBM performance

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763919A (en) * 1996-07-08 1998-06-09 Winbond Electronics Corporation MOS transistor structure for electro-static discharge protection circuitry having dispersed parallel paths
TW305071B (en) * 1996-08-14 1997-05-11 Winbond Electronics Corp The MOSFET in electro-static discharge protecting circuit
JP2953416B2 (ja) * 1996-12-27 1999-09-27 日本電気株式会社 半導体装置
US5882967A (en) * 1997-05-07 1999-03-16 International Business Machines Corporation Process for buried diode formation in CMOS
US6013932A (en) * 1998-01-07 2000-01-11 Micron Technology, Inc. Supply voltage reduction circuit for integrated circuit
US6258672B1 (en) 1999-02-18 2001-07-10 Taiwan Semiconductor Manufacturing Company Method of fabricating an ESD protection device
US6825504B2 (en) * 1999-05-03 2004-11-30 Hitachi, Ltd. Semiconductor integrated circuit device and method of manufacturing the same
US6424013B1 (en) * 1999-07-09 2002-07-23 Texas Instruments Incorporated Body-triggered ESD protection circuit
US6344385B1 (en) * 2000-03-27 2002-02-05 Chartered Semiconductor Manufacturing Ltd. Dummy layer diode structures for ESD protection
US6492208B1 (en) * 2000-09-28 2002-12-10 Taiwan Semiconductor Manufacturing Company Embedded SCR protection device for output and input pad
US6448123B1 (en) * 2001-02-20 2002-09-10 Taiwan Semiconductor Manufacturing Company Low capacitance ESD protection device
US6444511B1 (en) * 2001-05-31 2002-09-03 Taiwan Semiconductor Manufacturing Company CMOS output circuit with enhanced ESD protection using drain side implantation
TW493265B (en) * 2001-08-16 2002-07-01 Winbond Electronics Corp ESD protection circuit with high trigger current
US6936896B2 (en) * 2001-12-21 2005-08-30 Freescale Semiconductor, Inc. Semiconductor apparatus

Also Published As

Publication number Publication date
US20050133871A1 (en) 2005-06-23
US7129546B2 (en) 2006-10-31
TW200522280A (en) 2005-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees