TWI263311B - High-voltage device structure having high endurance capability of ESD - Google Patents
High-voltage device structure having high endurance capability of ESDInfo
- Publication number
- TWI263311B TWI263311B TW092136356A TW92136356A TWI263311B TW I263311 B TWI263311 B TW I263311B TW 092136356 A TW092136356 A TW 092136356A TW 92136356 A TW92136356 A TW 92136356A TW I263311 B TWI263311 B TW I263311B
- Authority
- TW
- Taiwan
- Prior art keywords
- esd
- drain region
- device structure
- voltage device
- endurance capability
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/115—Dielectric isolations, e.g. air gaps
- H10D62/116—Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW092136356A TWI263311B (en) | 2003-12-22 | 2003-12-22 | High-voltage device structure having high endurance capability of ESD |
| US10/992,362 US7129546B2 (en) | 2003-12-22 | 2004-11-19 | Electrostatic discharge protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW092136356A TWI263311B (en) | 2003-12-22 | 2003-12-22 | High-voltage device structure having high endurance capability of ESD |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200522280A TW200522280A (en) | 2005-07-01 |
| TWI263311B true TWI263311B (en) | 2006-10-01 |
Family
ID=34676149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092136356A TWI263311B (en) | 2003-12-22 | 2003-12-22 | High-voltage device structure having high endurance capability of ESD |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7129546B2 (zh) |
| TW (1) | TWI263311B (zh) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100558046B1 (ko) * | 2004-12-28 | 2006-03-07 | 주식회사 하이닉스반도체 | 온도에 둔감한 포화전류를 갖는 모스트랜지스터 및 그를이용한 정전압 발생기 |
| US7855419B2 (en) * | 2006-06-15 | 2010-12-21 | Himax Technologies Limited | ESD device layout for effectively reducing internal circuit area and avoiding ESD and breakdown damage and effectively protecting high voltage IC |
| US9385241B2 (en) | 2009-07-08 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrostatic discharge (ESD) protection circuits, integrated circuits, systems, and methods for forming the ESD protection circuits |
| US8405941B2 (en) * | 2009-11-30 | 2013-03-26 | Nuvoton Technology Corporation | ESD protection apparatus and ESD device therein |
| JP5703790B2 (ja) * | 2011-01-31 | 2015-04-22 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
| US8686509B2 (en) | 2012-02-09 | 2014-04-01 | Macronix International Co., Ltd. | Semiconductor structure and method for manufacturing the same |
| JP6255421B2 (ja) * | 2013-01-30 | 2017-12-27 | マイクロチップ テクノロジー インコーポレイテッドMicrochip Technology Incorporated | Esd自己保護を有するdmos半導体デバイスおよびそれを備えたlinバスドライバ |
| CN107611121B (zh) * | 2016-07-11 | 2020-12-29 | 联华电子股份有限公司 | 用于静电放电保护的半导体结构 |
| US12132042B2 (en) * | 2022-07-25 | 2024-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strap technology to improve ESD HBM performance |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763919A (en) * | 1996-07-08 | 1998-06-09 | Winbond Electronics Corporation | MOS transistor structure for electro-static discharge protection circuitry having dispersed parallel paths |
| TW305071B (en) * | 1996-08-14 | 1997-05-11 | Winbond Electronics Corp | The MOSFET in electro-static discharge protecting circuit |
| JP2953416B2 (ja) * | 1996-12-27 | 1999-09-27 | 日本電気株式会社 | 半導体装置 |
| US5882967A (en) * | 1997-05-07 | 1999-03-16 | International Business Machines Corporation | Process for buried diode formation in CMOS |
| US6013932A (en) * | 1998-01-07 | 2000-01-11 | Micron Technology, Inc. | Supply voltage reduction circuit for integrated circuit |
| US6258672B1 (en) | 1999-02-18 | 2001-07-10 | Taiwan Semiconductor Manufacturing Company | Method of fabricating an ESD protection device |
| US6825504B2 (en) * | 1999-05-03 | 2004-11-30 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of manufacturing the same |
| US6424013B1 (en) * | 1999-07-09 | 2002-07-23 | Texas Instruments Incorporated | Body-triggered ESD protection circuit |
| US6344385B1 (en) * | 2000-03-27 | 2002-02-05 | Chartered Semiconductor Manufacturing Ltd. | Dummy layer diode structures for ESD protection |
| US6492208B1 (en) * | 2000-09-28 | 2002-12-10 | Taiwan Semiconductor Manufacturing Company | Embedded SCR protection device for output and input pad |
| US6448123B1 (en) * | 2001-02-20 | 2002-09-10 | Taiwan Semiconductor Manufacturing Company | Low capacitance ESD protection device |
| US6444511B1 (en) * | 2001-05-31 | 2002-09-03 | Taiwan Semiconductor Manufacturing Company | CMOS output circuit with enhanced ESD protection using drain side implantation |
| TW493265B (en) * | 2001-08-16 | 2002-07-01 | Winbond Electronics Corp | ESD protection circuit with high trigger current |
| US6936896B2 (en) * | 2001-12-21 | 2005-08-30 | Freescale Semiconductor, Inc. | Semiconductor apparatus |
-
2003
- 2003-12-22 TW TW092136356A patent/TWI263311B/zh not_active IP Right Cessation
-
2004
- 2004-11-19 US US10/992,362 patent/US7129546B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050133871A1 (en) | 2005-06-23 |
| US7129546B2 (en) | 2006-10-31 |
| TW200522280A (en) | 2005-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |