1260583 坎、發明說明： 【發明所屬之技術領咸】 本發明是有關於一種磁光式之近場光學光儲存元 件，尤指一種玎以連貫的製造方法製作出内部包含超半 球固態浸沒式透鏡（s〇l id immersion lens)、奈米微 孔、金屬線圈、空氣軸承之磁光（M0)讀取頭’使其具有 高解析度的光學重複記錄裝置’可達到光儲存產業中高 儲存密度與重複擦拭寫入記錄的目的。 【先前技術】 按，一般習用之技術如下： 一、，’Super-resolution by combination of a sol id immersion lens and an aperture” Jpn. J. Appl. Phys. Vol· 40 (2001) pp· 1778-1782 。 上述文獻之技術，係提出利用固態浸沒式透鏡（SIL) 結合微孔（aperture)，將入射光源聚焦成一極小的光點 且同時具有較高的光點能量強度，這是由於入射光源經 物鏡聚焦後又以固態浸沒式透鏡再進一步聚焦至微孔輸 出，相較於僅以物鏡將入射光源聚焦至微孔，會有較密 集的能量集中在微孔上方，故經微孔輸出的光點會有更 佳的能量以供寫入資料至碟片，另外此文獻也提到固態 浸沒式透鏡與微孔的結合有助於在信號讀取，信號對比 可藉此提升。 1260583 另外該文獻之技術，固態浸沒式透鏡（SIL)結合微 孔之製程是分別製作固態浸沒式透鏡與微孔，再進行組 裝，此光學系統組裝必須精準。固態浸沒式透鏡的製作 方式並無詳述，但製作出之固態浸沒式透鏡尺寸直徑達1 厘米，而微孔之製作方式是利用離子束轟擊，這是一項 昂貴且耗時的技術，且該架構均只利用固態浸沒式透鏡 (SIL)來提高光儲存效率，均無如本發明採用效能更佳之 超半球固態浸沒式透鏡（SSIL)。 二、’’Design and fabrication technology of optical flying head for first surface MO recording66 Sookyung Kim; Jin-Moo Park; Hewon Jeong; Gunsoon Park; Jin-Yong Kira; Optical Memory and Optical Data Storage Topical Meeting， 2002· International Symposium on ， 2002 Page(s): 204 -206 〇 上述文獻之技術，是提出一磁光（magneto-optic)讀 取頭，内含空氣軸承（air bearing)、超半球固態浸沒式 透鏡（SSIL)與微線圈（microcoi 1)。此文獻提出之製程是 分別製作上述元件再進行組裝，其中固態浸沒式透鏡 (SIL)製作方式較本製程複雜，且整個元件的完成需經過 組裝，且該架構均只利用固態浸沒式透鏡（SIL)來提高光 儲存效率，均無如本發明採用效能更佳之超半球固態浸 沒式透鏡（SSIL)。 1260583 三、 United State Patent No: 6, 094, 803。該專利 之技術提出一磁光讀取頭之設計及其製程’該讀取頭内 含空氣軸承、微透鏡與微線圈。空氣軸承是單獨製作在 一片基材，而微透鏡與微線圈是製作在另一片基材上’ 再進行接合（bonding)。其中微透鏡的製作方式是以熱壓 成型的方式製作’微線圈則是利用薄膜製程製作’並有 金屬插銷（Plu§)作為金屬内連線以供輸入電流至微線 圈，該架構均只利用固態浸沒式透鏡（SIL)來提高光儲存 效率，均無如本發明採用效能更佳之超半球固態浸沒式 透鏡（SSIL)。 四、 United State Patent No: US 6,055,220 、該 專利之技術係提出一光學讀取頭之設計及其製程，内含 一固態浸沒式透鏡與一微孔，分別用來提南光學讀取頭 的有效數值孔徑值（numerical aPerture)與縮小光點大 小。而此光學讀取頭也内含一空氣軸承以控制穩定的飛 行高度，此架構與上述專利United State Patent No: 6, 094, 803相同，均只利用固態浸沒式透鏡（SIL)來提高 光儲存效率，均無如本發明採用效能更佳之超半球固態 浸沒式透鏡（SSIL)。且該專利提及兩種製作微孔之技 術；第一種是利用精密先進的微影技術配合後續蝕刻， 在金屬薄膜上直接製作出微孔，此種方式需利用精密昂 貴的曝光機台與先進的製程技術才可完成◦第二種則是 利用散佈微小高分子顆粒在固態浸沒式透鏡底部，接著 1260583 =金^_後’湘㈣法（lift_Qff)肋除去微小 二；7子顆才立，即可得到微孔，^旦以此法製作微孔，並無 :月如何控制微小高分子顆粒的位置，故也無法得知製 出的微孔是否可對準於關浸沒式透鏡的聚焦處以供 出光。 、 ^ 五、United State Patent No: US 6,335,522 B1 。 =專利述之技術係提出—微透鏡結合—微孔之設計與製 程，另有一物鏡。該技術提出多種製程，但其共同之特 色均是需利用兩片基材分別製作在晶片接合，製程上極 為複雜且易產生對準誤差，也不利於連續之大量生產。 且該'程技術中製作微孔的方式是採微影製程結合蝕 •I在彳放孔尺寸上會受制於微影與餘刻的製程能力，且 該專利製作微透鏡技術，是利用製作—母模，再以麗模 的方式製造，製作母模的過程複雜，且以電鍍方式形成 之半球狀結構以作為壓模時的輪廓，表面曲率與粗㈣ 是否能滿足光學上之需求也是問題。 【發明内容】 口此本4月之主要目的係在於，可將磁光（肋） 讀取頭結合超半球固態浸沒式透鏡（s〇Ud version lens)、奈米微孔、金屬線圈、空氣軸承利用一連 ^完成整^元件製作，免去組裝的步驟，並且不用高精 岔度之儀器即可製作，達到高資料儲存與複寫。 本發明之另-目的係在於，不需精密昂貴的設備， 1260583 並可批-人大;^生產，免去組裝的步 ^ 度之儀器即可f作，丨^ 一 ”，亚且不用高精密 丨乂衣作，達到兩貧料儲存與複寫。 '、、、達上述之目的，本發明係一種磁 光儲存元件，係於—基材上沉積—材料场光學 與餘刻在材料層上定義出日、·用广 配合乾二：Ϊ 者沉積—介電層，利用微影 某材置人㈣2s層内部定義出—起始的微小孔徑，將 騎内，㈣掉微孔所在位置下方 手声：者再沉積上一導電材料做為後續的電鍍種 子層’並經微影製程定義—電㈣域，再 1 ：：；：^ 程形成光阻層配合電鑛製程製作出微金屬線圈 後圈相、^電極區，且該第二電極區與製作出之微金屬 線圈相連接；接著絲光阻層，然後_電鍍種子層， ，塗佈另-光阻層覆蓋過微金屬線圈，再湘微影製程 光阻層上疋義出凹槽結構，且於該第二電極區通入電 源進行再-次的電”程，而可在微金屬線圈上方沿著 凹槽結構沉積出金屬内連線，之後再塗佈一光阻層，並 ，用微影製程中以不同光罩配合不同曝光劑量的調整， 定義該光阻層成一凸起圓柱狀結構，最後利用回流 —步驟使凸起的圓柱狀結構自然形成圓球狀曲 面，形成一超半球固態浸沒式透鏡（SSIL)，最後將整片 基材置入犧牲層的蝕刻液，直至完全蝕刻掉犧牲層使基 1260583 材脫離。 【實施方式】 請參閱『第1〜1 3圖』所示，係本發明步驟一之示 意圖、本發明步驟二之示意圖、本發明步驟三之示意圖、 本發明步驟四之示意圖、本發明步驟五之示意圖、本發 明步驟六之示意圖。如圖所示：本發明係一種磁光式之 近場光學光儲存元件，可於記錄資料時，該寫入光源經 此超半球結構聚焦至奈米微孔後，由奈米微孔出光。此 製程特點是不需組裝即可批次製造結合超半球固態浸沒 =透鏡（solid immersi〇n lens)、奈米微孔、金屬線圈、 空氣軸承的磁光近場光學讀取頭；其係包括下列步驟： 步驟-：（如第！圖所示）取—基材i ◦丨，並於該 土材上沉積一材料層1 〇 2，該材料層1 0 2可為二氧 化=之材料所製成’並利用微影與蝕刻在材料層1 〇 2 2義出空氣軸承（air bearing)的形狀，之後再沉積— 二義？層1 0 3 (如第2圖所示）’而該犧牲層1 〇 3可 化奴材料所製成，並於該犧牲層1 ◦ 3上沉積 利二半Γ財氣軸承(air bearing)結構’係 的犧❹τ =的微影絲刻製程，預歧義最底部 介+ ^ 3成一特定的高低起伏結構，接著沉積— 成該介電層1 ◦ 4可為氮切之材料所製 圖所不），待蝕刻去犧牲層1 〇 3後，元件下 即形成空氣軸承（air bearing)結構； 1260583 立—v驟一 ·利用微影配合乾钱刻，在介電層1 〇 4内 P疋義出-起始的微小孔徑，接著將基材1 1置入犧 牲層1 0 3的㈣液内’綱掉微孔所在位置下方的犧 牲層10 3 (如帛4圖所示），接著再沉積上一導電材料 做為後續的電鑛種子声 厥裡于層1 1 1 (如第5圖所示），· 經傲影製程定義 m鍍區域後，再利用 :::屬J 1 2鈿小上述之微小孔徑至奈米尺度，形成- 該微小孔徑是先以半導體製程中的微影配 合乾飿刻製程在一介電声]n j μ a M 声介雷爲7 n j 定義一初始微孔、此 " 疋沉積在有一犧牲層1 0 3的基材1 〇 上方二的梦晶片’接著在此初始微孔 初始微孔至:十二1，接著進行電錄，縮小此 屬1 1 2淨你一上 所不），之後於電鍍金 阻層1 2 T配人+ :層1 2 1，並經過微影製程形成光 —第1#「^ 4㈣作出微金屬線圈1 1 3以及 磁二:第而：金屬線圈⑴乃做為通 圈113結構相連（如第7圖所示）；乍出之被金屬線 ㈣四：去除光阻層121， 11 1，接著塗佈另—# j電鍍種子層 1 1 3，該光阻層：，蓋過微金屬線圈 力，例如Su_8，接著/田係八有抵擋正光阻顯影液之能 義出凹槽結構813^ _^程在·層122上定 傅丄d 1 (如第8圖所示）； 1260583 步驟五·於第二電極區通入電源，利用再一次的電 鍍製程，在微金屬線圈1 1 3上方沿著凹槽結構！ 3 ! 沉積出金屬内連線114以供通人電流產生磁場，該金 屬内連線1 1 4的材料可與微金屬線圈i i 3的材料相 =(如第9圖所不），接著再塗佈一光阻層1 2 2 1 (如 弟1〇圖所示），並定義該光阻層1221成-凸起圓柱 狀1口構1 2 3 (如第1 1圖所示），該凸起圓柱狀結構1 2 3係利用微影製程中以不同光罩配合不同曝光劑量的 調整，對光阻層1 2 2 1加以定義； 社槿i 利用回流（refl⑽）步驟，使凸起的圓柱狀 、、、口構1 2 3自然形成圓純姑& & _ , 賴球狀曲面H超半球固態浸 :工At : (如第1 2圖所示），可使光線經此超半 球固態浸沒式透鏡i 2 4聚f、後，$ # 再經由該微孔出光，最後將整片基材;=置= 1 〇 3的蝕刻液’直至完全蝕 ； 1〇1脫離（如第13圖所 =使^ 構成-全新之磁光式之近場光學光錯疋存元错件由上述之步驟 淮^上所述者，料本發明m實施例而已，& 艮定本發明實施之範圍：故，凡依本發明申： 飾，皆應㈣㈣她==早峨變化與修 1260583 【圖式簡單說明】 第1、2、3圖，係本發明步驟一之示意圖。 第4、5圖，係本發明步驟二之示意圖。 第6、7圖，係本發明步驟三之示意圖。 第8圖，係本發明步驟四之示意圖。 第9、10圖、11圖，係本發明步驟五之示意圖。 第1 2、1 3圖，係本發明步驟六之示意圖。 【元件標號對照】 基材1 0 1 材料層1 0 2 犧牲層1 0 3 介電層1 0 4 電鍍種子層111 電鍍金屬112 微金屬線圈113 金屬内連線1 1 4 光阻層121、122、1221 凹槽結構131 凸起圓柱狀結構1 2 3 超半球固態浸沒式透鏡1 2 4 13The invention relates to a magneto-optical near-field optical optical storage element, in particular to a crucible manufacturing method comprising a super hemispherical solid immersion lens. (s〇l id immersion lens), nanopore, metal coil, air bearing magneto-optical (M0) read head 'make it with high-resolution optical repeat recording device' to achieve high storage density in the optical storage industry Repeat the purpose of writing the record. [Prior Art] Press, the commonly used technique is as follows: 1. "Super-resolution by combination of a sol immer immersion lens and an aperture" Jpn. J. Appl. Phys. Vol. 40 (2001) pp·1778-1782 The technique of the above literature proposes to use a solid-state immersion lens (SIL) in combination with an aperture to focus the incident light source into a very small spot and at the same time have a high spot energy intensity due to the incident light source passing through the objective lens. After focusing, the solid-state immersion lens is further focused to the micro-hole output. Compared with focusing only the incident light source to the micro-hole, the dense energy is concentrated above the micro-hole, so the light spot output through the micro-hole There will be better energy for writing data to the disc, and the literature also mentions that the combination of a solid-immersion lens and micro-holes helps in signal reading, and signal contrast can be improved. 1260583 Technology, solid-state immersion lens (SIL) combined with micro-hole process is to make solid immersion lens and micro-hole separately, and then assembled, the optical system must be assembled accurately. Solid-state immersion The way the mirror is made is not detailed, but the solid-immersion lens is made up to 1 cm in diameter, and the micro-holes are made by ion beam bombardment, which is an expensive and time-consuming technique, and the architecture is The use of a solid immersion lens (SIL) to improve light storage efficiency is not as good as the super hemispherical solid immersion lens (SSIL) of the present invention. 2. Design and fabrication technology of optical flying head for first surface MO Recording 66 Sookyung Kim; Jin-Moo Park; Hewon Jeong; Gunsoon Park; Jin-Yong Kira; Optical Memory and Optical Data Storage Topical Meeting, 2002· International Symposium on, 2002 Page(s): 204 -206 A magneto-optic read head is provided, which comprises an air bearing, a super hemispherical solid immersion lens (SSIL) and a microcoil (microcoi 1). The process proposed in this document is to separately fabricate the above components. Assembly is further carried out, in which the solid immersion lens (SIL) is made in a more complicated manner than the current process, and the completion of the entire component is assembled. Moreover, the architecture utilizes only a solid immersion lens (SIL) to improve light storage efficiency, and is less efficient than the super hemispherical solid immersion lens (SSIL). 1260583 3. United States Patent No: 6, 094, 803. The technique of this patent teaches the design of a magneto-optical read head and its process. The read head contains air bearings, microlenses and microcoils. The air bearing is fabricated separately on one piece of substrate, and the microlens and microcoil are fabricated on another piece of substrate' for bonding. The microlens is produced by hot press molding. The microcoil is made by a thin film process and has a metal plug (Plu§) as a metal interconnect for inputting current to the microcoil. Solid-state immersion lenses (SIL) to improve light storage efficiency are not as effective as the super hemispherical solid immersion lens (SSIL). 4, United State Patent No: US 6,055,220, the technology of the patent proposes an optical read head design and a process thereof, comprising a solid immersion lens and a micro hole for respectively effective use of the optical read head of the South Numerical aperture value (numerical aPerture) and reduced spot size. The optical pickup also includes an air bearing to control the stable flying height. This structure is the same as the above-mentioned patent United State Patent No: 6, 094, 803, and only utilizes a solid immersion lens (SIL) to improve light storage. The efficiency is not as good as the super hemispherical solid immersion lens (SSIL) of the present invention. And the patent mentions two techniques for making micropores; the first is to use precision and advanced lithography technology with subsequent etching to directly make micropores on the metal film, which requires the use of sophisticated and expensive exposure machines. The advanced process technology can be completed. The second is to use the scattering of tiny polymer particles at the bottom of the solid immersion lens, followed by 1260583 = gold ^ _ after the 'sho (four) method (lift_Qff) rib to remove the tiny two; Micropores can be obtained by this method. There is no such thing as how to control the position of the tiny polymer particles in the month, so it is impossible to know whether the prepared micropores can be aligned with the focus of the immersion lens. For the light. , ^ 5, United State Patent No: US 6,335,522 B1. The patented technology is proposed - microlens bonding - micropore design and process, and an objective lens. This technology proposes a variety of processes, but the common features are that the two substrates are separately fabricated in the wafer bonding process, which is extremely complicated in process and easy to produce alignment errors, and is not conducive to continuous mass production. Moreover, the method of making micropores in the process technology is to adopt the lithography process to combine the etch and the lithography. The size of the boring hole is subject to the process capability of lithography and the lithography, and the patented microlens technology is made using - The master mold is manufactured in the same manner as the ram, and the process of making the master mold is complicated, and the hemispherical structure formed by electroplating is used as the contour of the stamper, and whether the surface curvature and the thickness (4) satisfy the optical requirements are also problems. SUMMARY OF THE INVENTION The main purpose of this month is to combine a magneto-optical (rib) read head with a super hemispherical solid immersion lens (s〇Ud version lens), a nanopore, a metal coil, an air bearing. The use of a continuous ^ complete component production, eliminating the need for assembly steps, and can be produced without the use of high-precision instruments, to achieve high data storage and replication. Another object of the present invention is that, without the need for sophisticated and expensive equipment, 1260583 can be batch-large; ^ production, eliminating the need for assembly steps, the device can be made, 丨 ^ one", and does not require high precision The invention is a storage and rewriting of two poor materials. ',, for the above purpose, the present invention is a magneto-optical storage element, which is deposited on a substrate - the material field optics and the residual are defined on the material layer Out of the day, with the wide mix of dry two: Ϊ sediment deposition - dielectric layer, using lithography of a certain material placed (4) 2s layer defined inside - the initial micro-aperture, will ride inside, (four) off the micro-pod position below the hand : The second conductive material is deposited as a subsequent electroplating seed layer' and defined by the lithography process - the electric (four) domain, and then the 1:::: ^ process forms a photoresist layer and the electric ore process to produce a micro-metal coil rear ring a phase, an electrode region, and the second electrode region is connected to the fabricated micro-metal coil; then a silk photoresist layer, and then a plating seed layer, coated with another photoresist layer covering the micro-metal coil, and then a groove structure on the photoresist layer of the shadow process, and The two electrode regions are connected to the power source for a second-time electrical process, and a metal interconnection can be deposited along the groove structure over the micro-metal coil, and then a photoresist layer is coated and used in the lithography process. With different masks and different exposure dose adjustments, the photoresist layer is defined as a convex cylindrical structure. Finally, the rectification-step is used to make the convex cylindrical structure naturally form a spherical curved surface to form a super hemispherical solid immersion lens. (SSIL) Finally, the entire substrate is placed in the etchant of the sacrificial layer until the sacrificial layer is completely etched away to detach the substrate 1260583. [Embodiment] Please refer to FIG. 1 to FIG. 3 for a schematic diagram of the first step of the present invention, a schematic diagram of the second step of the present invention, a schematic diagram of the third step of the present invention, a schematic diagram of the fourth step of the present invention, and a fifth step of the present invention. Schematic diagram of the sixth step of the present invention. As shown in the figure, the present invention is a magneto-optical near-field optical optical storage element which, when recording data, is focused by the super hemispherical structure to the nanopore and then emitted by the nanopore. The process features a magneto-optical near-field optical pickup that combines a super hemisphere solid immersion lens, a nanopore, a metal coil, and an air bearing without assembly. The following steps: Step-: (as shown in Figure!) take the substrate i ◦丨, and deposit a material layer 1 〇 2 on the soil material, the material layer 1 0 2 can be a material of oxidation = Made 'and using lithography and etching in the material layer 1 〇 2 2 out of the shape of the air bearing (air bearing), and then deposited - second meaning? Layer 1 0 3 (as shown in Fig. 2) is formed by the sacrificial layer 1 〇3, and the air bearing structure is deposited on the sacrificial layer 1 ◦ 3 The lithography process of the sacrificial τ =, the bottom of the pre-ambiguity + ^ 3 into a specific high and low relief structure, and then deposited - the dielectric layer 1 ◦ 4 can be made for the material of the nitrogen cut) After the sacrificial layer 1 〇3 is etched, an air bearing structure is formed under the component; 1260583 立—v 一一·Using lithography with dry money, in the dielectric layer 1 〇4 P 疋 - The initial micro-aperture, then the substrate 11 is placed in the (four) liquid of the sacrificial layer 103, and the sacrificial layer 10 3 below the micropore position (as shown in FIG. 4) is deposited. The conductive material is used as the subsequent electro-mineral seed sonar in layer 1 1 1 (as shown in Figure 5). After the m-plating area is defined by the AO Ying process, it is reused::: J 1 2钿 small Micro-aperture to nanometer scale, formed - the micro-aperture is first immersed in a semiconductor process with a lithography process for a dielectric sound] nj μ a M Ray 7 nj defines an initial micropore, this " 疋 deposited on a substrate 1 with a sacrificial layer of 10 3 〇 above the dream wafer' then proceeds to the initial microporous initial micropore to: 12, then proceed Electric recording, reduce this genus 1 1 2 net you do not go on), after the plating gold barrier layer 1 2 T with + + layer 1 2 1, and through the lithography process to form light - the first # "^ 4 (four) made Micro-metal coil 1 1 3 and magnetic two: first: the metal coil (1) is connected as a through-turn 113 structure (as shown in Fig. 7); the drawn metal wire (four) four: removing the photoresist layer 121, 11 1 And then coating another -# j electroplating seed layer 1 1 3, the photoresist layer: covering the micro-metal coil force, such as Su_8, and then / Tian system eight has the ability to resist the positive photoresist development of the groove structure 813 ^ _^程在层122, 丄 丄 1 d 1 (as shown in Figure 8); 1260583 Step 5 · Pass the power supply in the second electrode area, using another plating process, above the micro-metal coil 1 1 3 A metal interconnect 114 is deposited along the recess structure! 3! The metal interconnect 114 is deposited for generating a magnetic field through the current. The metal interconnect 1 14 material can be combined with the micro metal line. The material phase of ii 3 = (as shown in Fig. 9), followed by coating a photoresist layer 1 2 2 1 (as shown in Fig. 1), and defining the photoresist layer 1221 into a convex cylindrical shape 1 port configuration 1 2 3 (as shown in Fig. 1), the convex cylindrical structure 1 2 3 is adjusted by using different masks with different exposure doses in the lithography process, and the photoresist layer 1 2 2 1 It is defined; the community i uses the reflow (refl (10)) step to make the convex cylindrical shape, the mouth structure 1 2 3 naturally form a round pure auspicious && _, 球 spherical surface H super hemisphere solid state immersion: work At : (as shown in Figure 12), the light can be passed through the super hemisphere solid immersion lens i 2 4 f, then, # #, then through the micro-hole, and finally the whole substrate; = set = 1蚀刻3 etchant 'to complete etch; 1 〇 1 detachment (as shown in Figure 13 = make ^ constitute - the new magneto-optical near-field optical optical error 错 元 由 由 由 由According to the present invention, the scope of the present invention is determined by the present invention. Therefore, according to the present invention, the decoration should be (4) (four) she == early change and repair 1260583 [simple description of the figure] 2 and 3 are schematic diagrams of the first step of the present invention. Figures 4 and 5 are schematic views of the second step of the present invention. Figures 6 and 7 are schematic views of the third step of the present invention. Figure 8 is a schematic view of the fourth step of the present invention. Figures 9, 10 and 11 are schematic views of the fifth step of the present invention. Figures 1 2 and 1 3 are schematic views of the sixth step of the present invention. [Component number comparison] Substrate 1 0 1 Material layer 1 0 2 Sacrificial layer 1 0 3 Dielectric layer 1 0 4 Electroplated seed layer 111 Electroplated metal 112 Micro metal coil 113 Metal interconnection 1 1 4 Photoresist layer 121, 122 , 1221 groove structure 131 raised cylindrical structure 1 2 3 super hemisphere solid immersion lens 1 2 4 13