1258324 九、發明說明： — 【發明所屬之技術領域】 . 本發明是有關於一種軟性電路基板（FleXlble Pnnted1258324 IX. Description of the invention: - [Technical field to which the invention pertains] The present invention relates to a flexible circuit substrate (FleXlble Pnnted)
Circmtry;簡稱FPC)，特別是指一種使用濺鍍方式製造之 軟性電路基板。 【先前技術】 . 白知权性電路基板是在在一層由高分子塑膠材質如聚 馨 酸亞胺（P〇lyimide，簡稱PI)、聚酉旨（Polyester，簡稱PET)所 衣成薄膜型悲之高分子薄膜層的一側表面上濺鍍—層鉻 附著層，接著於鉻附著層上濺鍍一層銅（Cu)附著層；鉻附著 層和銅附著層之厚度小於1μηι。最後，再依需要，於銅附 著層上電鐘-層適當厚度之銅箱層。此種軟性電路基板以 該鉻附著層作為高分子薄膜層與銅附著層間的中介層，藉 由路材料與高分子薄膜層的附著力，及絡材料與㈣㈣ 力皆優於銅與高分子薄膜層的附著性，使整體軟性電路基 春板之各層結構間的剝離強度也獲得提彳，其剝離強度約可 達 〇.5kgf/cm。 則述軟性電路基板，路附著層與銅附著層會相對剝離 ‘ ，其原因乃在路與銅的熱膨脹係數（C〇efflcient of Thermal . ㈣咖10；1 ;簡稱CTE)差異相當大，分別為6·5χ10-δ和 口此遂有在鉻附著層和銅附著層加入一膨脹係 數介於鉻和銅之間的鎳路合金層的技術，以避免後續製程 中經過錫爐的高溫產生的應力造成鉻附著層和銅附著層的 剝離，例如中華民國第519860號專利。 5 !258324 y而，上述採用濺鍍配合電 路基板，由於 、又 所衣&出之軟性電 私机 、吏㈣鍍方式，因此在製程中，不可避^ 於_時所使用之真空腔 :了避免的 生，a α& 衣兄中會有粉塵等雜質產 虽此寻粉塵掉落在各層時， 、 象。在南 曰使侍各層產生針孔的現 製尸^ 處，因無導電物質，如此將使得後續的電鍍 成：二路L孔處進行，也就是在針孔處無法形成銅而造 性心：：銅會有缺陷產生。如以此種缺陷之軟Circmtry; referred to as FPC), especially refers to a flexible circuit substrate manufactured by sputtering. [Prior Art] The Baizhiquan circuit board is made of a polymer plastic material such as polyphthalate imide (PI) and polyester (PET). A layer of chromium adhesion layer is sputtered on one surface of the molecular film layer, and then a copper (Cu) adhesion layer is sputtered on the chromium adhesion layer; the thickness of the chromium adhesion layer and the copper adhesion layer is less than 1 μm. Finally, on the copper attachment layer, a layer of copper can be layered to the appropriate thickness. The flexible circuit substrate uses the chromium adhesion layer as an intervening layer between the polymer film layer and the copper adhesion layer, and the adhesion between the road material and the polymer film layer, and the bulk material and (4) (4) force are superior to copper and polymer film. The adhesion of the layer is also improved by the peel strength between the layers of the overall flexible circuit base plate, and the peel strength is about 〇5 kgf/cm. In the case of a flexible circuit board, the road adhesion layer and the copper adhesion layer are relatively peeled off, because the difference between the thermal expansion coefficient of the road and the copper (C〇efflcient of Thermal (C), 10; 1; CTE for short) is quite large, respectively. 6·5χ10-δ and 遂 遂 There is a technique of adding a nickel alloy layer with a coefficient of expansion between chromium and copper in the chromium adhesion layer and the copper adhesion layer to avoid chromium caused by the stress generated by the high temperature of the tin furnace in the subsequent process. Peeling of the adhesion layer and the copper adhesion layer, for example, Patent No. 519860 of the Republic of China. 5 !258324 y, the above-mentioned sputtering using the circuit board, because of the clothing and the soft electric private machine, 吏 (four) plating method, so in the process, can not avoid the vacuum chamber used in _: Avoid the raw, a α & brothers will have dust and other impurities, although the dust is found in the layers, the image. In the current corpse of Nanxun to make the pinholes in the various layers, because there is no conductive material, this will cause the subsequent electroplating to proceed: the two-way L hole, that is, the copper can not form at the pinhole and create a heart: : Copper will have defects. Such as the softness of such defects
路的現象。 甚至會在缺陷處產生斷 【發明内容】 因此，本發明之目的，即在提供一種提升剝離強度且 降低針孔缺陷之軟性電路基板。 於是，本發明之軟性電路基板包含一基礎層、一形成 於該基礎層上的鉻附著層、—形成於該鉻附著層上的第一 附著單元、一形成於該第一附著單元的第一銅附著層，及 形成於5亥弟一銅附著層上的第二銅附著層。 該基礎層可為由聚醯亞胺或聚脂所製成之高分子薄膜 層。該第一附著單元，接合在該鉻附著層遠離該基礎層上 的一側面上，該第一附著單元之熱膨脹係數介於鉻和銅之 間。較佳地，該第一附著單元包括一鎳銅（Ni/Cii)合金附著 層或一鎳鉻（Ni/Cr)合金附著層。更佳地，該第一附著單元 包括一與該基礎層接合的鎳鉻合金附著層，及一形成在該 鎳鉻合金附著層上的鎳銅合金附著層。 该第一銅附著層具有一第一侧面和一相反於該第一側 6 1258324 面的第二側面。該第 礎層的一側面，該第 濺鍍而產生的粉塵。 之第二側面。 —側面連㈣帛—附著#元遠離該基 二側面經一電漿表面處理，以去除因 該第二銅附著層連接該第一銅附著層 /父仏地，本發明軟性電路基板更包含-介於該第一銅 附著層和該第二銅附著層之間的第二附著單元。該第二附 著單^具有—第—側面和—相反於該第—側面的第二側面 ’遠罘二附著單元的第一側面接合在該第—銅附著層 一側面上，該第二鋼附著層接合在該第二附著單元的第二 側面上，該第二附著單元之熱膨脹係數介於鉻和鋼之間。 車乂‘地’該弟二附著單元由-鎳鉻合金附著層或一鎳銅合 金附著層所構成。 本毛月之Α目的，即在提供—種提升剝離強度且降 低針孔缺陷之軟性電路基板的製造方法。 於是，本發-種軟性電路基板之製造方法， 步驟： 〜 —百先在一基礎層上形成一路附著層。接著，在該鉻附 :層上形成H著單元，該第—附著單元之熱膨服係 數介於鉻和銅之間。在該第一附著單元上形成_第一銅附 著層，該第-銅附著層具有一連接該第一銅附著層的第— 側面和一相反的第二側面。接下來，對該第-鋼附著芦之 第二側面進行電襞表面處理。然後在該第-鋼附著層：第 一側面上形成一第二銅附著層。 較佳地，該軟性電路基板之製造方法更包含一在進行 l258324 :敷表面處理之後’和在形成第二銅附著層之前的形成一 於鉻和銅之間。 -附者早兀之熱膨脹係數介 【實施方式】 有關本發明之前述及其他技術内容 以下配合參考圖式之數個 沾，κ、功效’在 清枯的口,目,. 半乂佺只轭例的詳細說明中，將可 疋的主現。在本發明被詳細描 以下的說明内容中，類似的元件 „疋’在 夾 干疋以相冋的編號來表示。 茶閱圖卜本發明軟性電路基板之第 包含一基礎層卜―路附著層2、-第—附著1例依序 ‘銅附著層6，及 -銅附著層4、一第二附著單元5、_第…、-第 —銅箔層7。 該基礎層1是採用PI所製 一 2是以鉻材亀材，而以該基礎層心：。該：喝 成，其麟功率為^咖w、#景氣===鍍而$ 乾材與基礎層I的距離為12啦。成 =X〇 一路 製成之鉻附著層2厚度小们心。' 該第一附著單元3依序且 的錄鉻合金附著層31和一形成於’:成於該鉻附著層2上 的鎳銅合金附著A 32 / 、^’桌鉻合金附著層31上 町耆層32。該鎳鉻合金 著層”分別是以滅鍍 者層31和錄銅合金附 鉻附著層.2相同，# B j日衣…麵條件與上述竣鑛 材而製成。疋分別是以錄絡材料和錄鋼材料為乾 該第一鋼附荖厣 Λ Η、 γ 致 者層4疋以濺鍍的方式製成，其具有 8 1258324 該鎳銅合金附著層32連接的第—側面4ι和 一側面41的第二側面42 相反方；s亥弟 的_第二側…進行=後:使嶋^ 程時嵌入於該鉻附著層2 _猎以去除因濺鍍製 層4的粉塵，而移去粉塵後會m3、或第一銅附著 針孔8。此時料第—銅附著二之間會留下相對應的 時，該第二附著單元5除了 :二上:成該第二附著單元5 在該針孔8處，合盘裸、夂、：弟—銅附著層4連接外， 連接。因為該第:附:L的:=粉塵大小™^ 及相匹配的熱膨脹係數^層間具有良好的附著力 溫而產生剝離。而此第-較佳實了：：中^孔第8厂會因高 使用的是-形成於該第_銅 4—附者單元5 亦是以減鑛的方式製成。4上的錄路合金層，其 =銅=層6是以_的方式而形成 者早兀5上。由於該第二 丨1了 處的第-㈣的存在，使得在針孔8 著=:=可牢固的附著;且同時，該第二銅附 者潛6亦臭供針孔8處導雷妯斯乂士 7 以在針孔8處進行電鑛。Μ ’使得後續銅落層7也可 接下來的銅箔層7，是以銅 〇-5八，電鐘速率^—而；：材；：，=鐘電流為 程的時間，但並非絕對必要。“’的厚度’並減短製 1期〇二旬而的=嚴係數差異相當大，分別為6上10-6和 而本發明利用魏合金和錄銅合金的搭配，其熱. 9 1258324 膨脹係數分別為11_13 Y lrr6^ J x w 和 14-16 x 10-6，皆 的熱膨脹係數之間，因& )丨於鉻和銅 口此了U減少各層之間的 另外，利用經過電漿表面處 應力开厂交。 形成的第二附著單元5知笙^ 使侍其後 早兀5和弟二銅附著層6可 孔所造成的缺陷，進而提 I文去除針 击艮好銅消層7 ’使得本發明之 車人性廷路基板進行蝕刻製作 ^ 〇 衣作線叫，不會有斷路的現象發 參閱圖2,本發明軟性電 替-.,t 低 < 弟一較佳貫施例如同 弟一較‘糊的依序包含-基礎層！、-鉻附著層2、— 第-附著單元3、_第一銅附著層4、—第二附著單元5、 -第二銅附著層6，及一銅羯層7。所不同的是 佳實施例之第-附著單元3具有鎮鉻合金附著層Μ和辞銅 合金嘯32,而本第二較佳實施例之第—附著單元3僅 具有一鎳鉻合金附著層3 1。 "參閱圖3,本發明軟性電路基板之第三較佳實施例類似 該第一較佳實施例，不同之處是， 一抑 处疋莓昂一較佳實施例之第 一附著單元3具有鎳鉻合金附著層3 1釦禮如 有席1和鎳鋼合金附著層32 ，而本第三較佳實施例之第一附著單元 干凡j僅具有一鎳銅合 金附著層32。 值得一提的是，在該第一、第二、笛一土 ^ 一昂二較佳實施例中 該第一附著單元疋以鎳鉻合金附著層所構成，但該第二 附著單元5亦可以是由鎳銅合金所構成。 此外，參閱圖4，本發明軟性電路基板 一 吩丞敬之弟四較佳實施 例類似該第一較佳實施例，不同之處是 处疋該弟四較佳實施 10 1258324 例省略该弟一較私杏— 早“土貫施例中的第二附著單元5。 本發明軟性電路美$ /i ^ ^ 土 弟五較佳實施例類似該第二較 隹貫施例，不同 旁θ — 佳實施例中的第二：單二㈣佳實施例省略該㈣ 本發明軟性電路美柄 i ^ 土 弟/、較佳實施例類似該第三較 —免疋該弟五較佳實施例省略該第三較 乜貝施例中的第二附著單元5。 :據：上各較佳實施例之制離強度測 貫施例之剝離強度皆可達1 Λ, - ^ ^ . . gWm以上。且由背透光觀察 、十孔缺卩曰的^形，也皆大幅改善。 、 板，確能達到本發明之目的。 &之人性電路基 处、准以上所述者，僅為本發明之較佳實施例而已，當不 月匕以此限定本發明實施 田 ^ 貝也之乾圍，即大凡依本發明申請專利 屬士八 所作之間早的等效變化與修飾，皆仍 本^明專利涵蓋之範圍内。 【圖式簡單說明】 使圖H是—本發明第—較佳實施例之剖面示意圖，為了 回式更“斤易k，僅繪出一針孔的狀態； 圖2是一本發明第二較佳實施例之剖面示意圖 圖3是一本發明第三較佳實施例之剖面示意圖；及 圖4是一本發明第四較佳實施例之剖面示意圖。 1258324 【主要元件符號說明】The phenomenon of the road. There is even a break in the defect. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a flexible circuit board which improves peel strength and reduces pinhole defects. Therefore, the flexible circuit substrate of the present invention comprises a base layer, a chromium adhesion layer formed on the base layer, a first attachment unit formed on the chromium adhesion layer, and a first formation formed on the first attachment unit. a copper adhesion layer, and a second copper adhesion layer formed on the 5th layer of the copper adhesion layer. The base layer may be a polymer film layer made of polyimide or polyester. The first attachment unit is bonded to a side of the chromium adhesion layer away from the base layer, and the first attachment unit has a coefficient of thermal expansion between the chromium and the copper. Preferably, the first attachment unit comprises a nickel-copper (Ni/Cii) alloy adhesion layer or a nickel-chromium (Ni/Cr) alloy adhesion layer. More preferably, the first attachment unit includes a nichrome adhesion layer bonded to the base layer, and a nickel-copper alloy adhesion layer formed on the nichrome adhesion layer. The first copper adhesion layer has a first side and a second side opposite the first side 6 1258324. One side of the first base layer, the dust generated by the first sputtering. The second side. - the side of the (four) 帛-attachment #元 away from the two sides of the base through a plasma surface treatment to remove the second copper adhesion layer connected to the first copper adhesion layer / father 仏, the flexible circuit substrate of the present invention further includes - a second attachment unit between the first copper adhesion layer and the second copper adhesion layer. The second attachment sheet has a first side surface and a second side surface opposite to the first side surface. The first side surface of the second attachment unit is joined to one side of the first copper adhesion layer, and the second steel is attached. The layer is bonded to the second side of the second attachment unit, the second attachment unit having a coefficient of thermal expansion between the chromium and the steel. The second attachment unit of the rut is composed of a nichrome alloy adhesion layer or a nickel-copper alloy adhesion layer. The purpose of this month is to provide a method of manufacturing a flexible circuit board that improves peel strength and reduces pinhole defects. Therefore, the present invention relates to a method of manufacturing a flexible circuit substrate, the steps of: - a first layer of an adhesion layer formed on a base layer. Next, an H-cell is formed on the chrome-attached layer, and the thermal expansion coefficient of the first-attachment unit is between chrome and copper. A first copper attaching layer is formed on the first attaching unit, the first copper attaching layer having a first side surface and an opposite second side surface connecting the first copper attaching layer. Next, the second side of the first steel-attached reed is subjected to an electric surface treatment. Then, a second copper adhesion layer is formed on the first side of the first steel adhesion layer. Preferably, the method of fabricating the flexible circuit substrate further comprises a step of performing a surface treatment after l258324: applying a surface and forming a second copper adhesion layer between the chromium and the copper. - Thermal expansion coefficient of the attached person early [Embodiment] The above and other technical contents of the present invention are as follows with reference to the reference pattern of several dip, κ, efficacy 'in the mouth of the clear, the purpose, the half yoke In the detailed description of the example, it will be awkward. In the following detailed description of the present invention, similar elements „疋' are denoted by the same number in the folder. The soft magnetic circuit substrate of the present invention comprises a base layer and a road adhesion layer. 2, - the first - attached 1 case in sequence 'copper adhesion layer 6, and - copper adhesion layer 4, a second attachment unit 5, _ ..., - first - copper foil layer 7. The base layer 1 is using PI The system 2 is a chrome coffin, and the base layer is: The: The power of the lining is ^ coffee w, # boom === plating and the distance between the dry material and the base layer I is 12 The thickness of the chrome-attachment layer 2 made of = 〇 〇 〇 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The nickel-copper alloy adheres to the A 32 / , ^ ' table chrome alloy adhesion layer 31 on the choline layer 32. The nickel-chromium alloy layer "is the same as the deplater layer 31 and the recorded copper alloy with the chrome adhesion layer. 2 the same, # B j 日 ... ... surface conditions and the above-mentioned 竣 mineral material. The 钢 is made of a recording material and a steel recording material, and the first steel 荖厣Λ Η, γ 层 layer 4 疋 is made by sputtering, which has 8 1258324, the nickel-copper alloy adhesion layer 32 is connected. The first side 4ι and the second side 42 of the one side 41 are opposite to each other; the second side of the sieving is performed = after: the chrome is adhered to the chrome-attached layer 2 _ hunting to remove the layer due to sputtering 4 dust, and after removing the dust, m3, or the first copper is attached to the pinhole 8. At this time, when the first-copper attachment 2 is left corresponding, the second attachment unit 5 is divided into two: the second attachment unit 5 is at the pinhole 8, and the disk is bare, 夂, and: Brother—the copper adhesion layer 4 is connected and connected. Because the first: attached: L: = dust size TM ^ and the matching coefficient of thermal expansion ^ between the layers has a good adhesion temperature and peeling occurs. And this is the best -: the middle of the 8th factory will be used because of the high - formed in the first copper - the attached unit 5 is also made by means of reduced ore. The recording alloy layer on 4, which = copper = layer 6 is formed in the form of _. Due to the presence of the first (fourth) of the second 丨1, the pinhole 8 === can be firmly attached; and at the same time, the second copper occupant 6 is also odorous for the pinhole 8 to lead the thunder The gentleman 7 carries out the electric ore at the pinhole 8. Μ 'Let the subsequent copper falling layer 7 can also be followed by the copper foil layer 7, which is copper 〇-5 八, electric clock rate ^ -;; material;:, = clock current is the time, but not absolutely necessary . "The thickness of the 'thickness' and the shortening of the system 1 〇 〇 而 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = 严The coefficients are 11_13 Y lrr6^ J xw and 14-16 x 10-6, respectively, between the thermal expansion coefficients, due to &) 丨 in the chrome and copper mouth, this U reduces the additional between the layers, using the surface through the plasma The stress is opened at the factory. The second attachment unit 5 is formed to know the defects caused by the hole of the second layer and the second layer of the copper adhesion layer, and then the needle is removed and the copper layer 7' is removed. The invention discloses that the substrate of the vehicle of the invention is etched and made into a wire, and there is no disconnection. Referring to FIG. 2, the soft electric device of the present invention is low, and the second is preferably the same. The second one contains a base layer!, a chromium adhesion layer 2, a first attachment unit 3, a first copper adhesion layer 4, a second attachment unit 5, and a second copper adhesion layer 6, And a copper ruthenium layer 7. The difference is that the first-attachment unit 3 of the preferred embodiment has a chrome alloy adhesion layer 辞 and a copper alloy 啸 32, and this The first attachment unit 3 of the preferred embodiment has only a nickel-chromium alloy adhesion layer 31. Referring to Figure 3, a third preferred embodiment of the flexible circuit substrate of the present invention is similar to the first preferred embodiment. Wherein, the first attachment unit 3 of the preferred embodiment has a nickel-chromium alloy adhesion layer 3 1 buckled with a seat 1 and a nickel steel alloy adhesion layer 32, and the third preferred embodiment The first attachment unit has only one nickel-copper alloy adhesion layer 32. It is worth mentioning that in the first, second, flute, and the second preferred embodiment, the first attachment unit The nickel-chromium alloy adhesion layer is formed, but the second adhesion unit 5 may be made of a nickel-copper alloy. Further, referring to FIG. 4, the flexible circuit substrate of the present invention is similar to the preferred embodiment. A preferred embodiment, the difference is that the fourth embodiment of the preferred embodiment is 10 129,324. The omitting of the younger apricot - the second attachment unit 5 in the earlier embodiment. The soft circuit of the present invention is similar to the second comparative embodiment, the different side θ - the second of the preferred embodiment: the single two (four) preferred embodiment omits the (four) invention The preferred circuit of the soft circuit is the same as the third embodiment. The preferred embodiment omits the second attachment unit 5 of the third embodiment. : According to the above preferred examples, the peel strength of the separation strength measurement examples can reach 1 Λ, - ^ ^ . . gWm or more. Moreover, the shape of the ten-hole defect and the shape of the ten-hole defect are also greatly improved. , board, can achieve the purpose of the present invention. The human circuit base of the & the above is only the preferred embodiment of the present invention, and the present invention is not limited to the implementation of the present invention. The early equivalent changes and modifications between the sects and the eight are still within the scope of this patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a cross-sectional view of a preferred embodiment of the present invention. In order to return to the formula, only one pinhole is drawn; FIG. 2 is a second comparison of the present invention. 3 is a schematic cross-sectional view of a third preferred embodiment of the present invention; and FIG. 4 is a cross-sectional view of a fourth preferred embodiment of the present invention. 1258324 [Explanation of main component symbols]
1 ^ … 基礎層 4… * 第一銅附著層 2 * * * 鉻附著層 5 · * • 第二附著單元 3 * *，第一附著單元 6… ♦ 第二銅附著層 31 * …鎳鉻合金附著層 7 · · ♦ 銅箔層 32* …鎳銅合金附著層 8 * · ， 針孑L1 ^ ... base layer 4... * first copper adhesion layer 2 * * * chromium adhesion layer 5 · * • second attachment unit 3 * *, first attachment unit 6... ♦ second copper adhesion layer 31 * ... nickel-chromium alloy Adhesive layer 7 · · ♦ Copper foil layer 32* ... Nickel-copper alloy adhesion layer 8 * · , Acupuncture L
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