TWI258208B - Loading device for wafer and the supporting structure thereof - Google Patents

Abstract

A loading device for wafer includes a wafer stand, a holder and a capping ring. The holder is used to support the fringe of wafer stand, and comprises at least a holder main body, a pad and at least a fixed part. The pad uses fixed part to fix on the holder main body. The pad has at least one opening. The fixed part has an end point containing in the capping ring. The capping ring is installed on the holder.

Description

1258208 V. INSTRUCTIONS (1) The technical field to which the invention belongs: 'Specially related to one. The present invention relates to a wafer carrier device that can be used for wafer deposition in vapor deposition equipment. Prior art: Current vapor deposition equipment, such as physical vapor deposition equipment, utilizes plasma to bombard metal targets. In order to sputter the metal material on the wafer. However, during the deposition process, the metal particles will not only deposit on the surface of the wafer, but will also be deposited on other love parts of the physical vapor deposition equipment. The cover ring of the wafer carrier device is easily replaced by gold. The particles are stained == pieces. Therefore, at intervals, the cover ring needs to be cleaned to the quality of physical vapor deposition. The cover ring is usually made by chemical solvent and sandblasting. The sandblasting system uses gas to blow the sand through the surface of the cover ring at high speed to scrape off the surface of the contaminant. However, in the process of removing contaminants, the material of the body is also consumed. Therefore, after several times of spraying, the thin part of the cover ring is often worn out, which causes the frost to be used. The present invention provides a wafer carrier and an assembly thereof. The cover ring of the present invention is designed such that the cover ring is cleaned by means of cleaning, for example, chemical solvent and sand blasting, and the service life of the device is reduced by slowing down the consumption of the material. Especially due to

1258208 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the structure of the present invention; the wafer carrier of the embodiment is shown in Fig. 2a to show the structure of the κ of the present invention; The 2b figure shows the spacer and the 2c figure shows the structure of the fastener end piece; the shape; P is completely accommodated in the opening of the spacer. The 2d figure shows the fixing shape; 1 4 points out of the dog Fig. 3a shows the enlarged view of the β part of the 2f f @ :丁弟h diagram; Fig. 4 shows the opening of the love piece carried by the crystal solid support device of a target case of the local 昍 Φ Wafer. DESCRIPTION OF REFERENCE NUMERALS: 100~ wafer carrier 110~ crystal holder 120~ support seat 121~ support base main 12^ body 122~ fixing piece 123~ spacer 124~ opening 125~ end 130~ cover ring

1258208 Simple description of the 131 type 131~ Matching part 132~ Groove 140~ Crimp ring 150~ Crimp ring support module 160~ Outer cover 200~ Wafer ο <1

IBB 0467 -Α40153TW( η); 920008; HEARTA. p td第11页

Claims (1)

1258208 VI. Patent application scope 1. A support structure comprising at least: a support base comprising at least one support base body, wherein: a support member is fixed to the support base body by the fixing member The gasket has at least one opening, the fixing member has the end portion received in the opening; and a cover ring disposed on the support seat. 2. The support 钤 end portion according to item 1 of the patent application scope protrudes from the surface of the gasket, and the height of the protrusion is less than ι 公二. 3. The support knot according to item j of the patent application scope::=The second cover ring has a fitting portion, and the fitting portion is disposed at the position of the fixing member. The corresponding 4 sides of the garment 4 The support knot fitting portion according to claim 3 is a groove. The mold is as described in claim 3, and the support structure is as described in claim 3 of the patent application scope. The thickness of the support portion is a groove, and the end portion protrudes from the surface of the cymbal, and the yoke is smaller than the depth of the groove. 7) If the application is within the scope of the patent application, the fixed part is a bolt. The Ting Shuo Wen Cun... structure, wherein the support structure as described in item 7 of the patent scope, complex φ The bolt is a Phillips bolt (pl〇wb〇lt). The mold/structure is the same as the support structure in the first aspect of the invention. 1< In the cake, the 12th page 1258208 6. The patent application scope is 10. The claim is as described in item 1 of the patent application scope. The structure of the cover ring comprises a stainless steel. The support structure according to claim 1, wherein the cover ring comprises a non-magnetic material. 1 2. As claimed in claim 1 The support structure further includes a thermal sensing component disposed between the spacer and the support body. 1 3. A wafer carrier device comprising: a crystal holder; a support base for supporting An edge of the crystal holder, comprising at least a support body, a gasket and at least one fixing member, the gasket is fixed on the support body by the fixing member, the gasket having at least one opening, the fixing member An end portion of the wafer carrying device according to claim 13 wherein the end portion is received in the opening, and a cover ring is disposed on the support base. a portion of the wafer carrying device, wherein the covering ring has a mating portion, and the mating portion is provided, and the protruding portion has a height of less than 1 mm. For the coverage The wafer bearing device of claim 15, wherein the mating portion is a groove. 1 7. If the patent application scope is item 15 The wafer carrying device, wherein the engaging portion is a groove, and the end portion protrudes from the surface of the gasket 0467-A40153TWF(η);920008;HEARTA.ptd Page 13 1258208 VI. Patent Application The height of the protrusion is less than the depth of the groove. The wafer carrier device according to claim 15 of the patent application, wherein the thickness of the cover ring is greater than 4 mm at the mating portion. 1 9 · Wafer bearing as described in item 3 of the patent application. The fixing member is a bolt. 2 0. The wafer carrying device described in claim 19 is a plow bolt. 2 1 · The wafer according to item 3 of the patent application is a tapered opening. The wafer carrier described in item 3 of the patent application scope includes the stainless steel. 2 2 3 · Wafer carrying device as described in item 1 of the patent application scope. The composition of the covering ring comprises a non-magnetic material. 24. The wafer carrier 5 of claim 13 includes a thermal sensing component disposed between the spacer and the spacer. Among the soils and soils, among them,