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TWI256328B - Method for thickening electroformed shell mold - Google Patents

Method for thickening electroformed shell mold

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Publication number
TWI256328B
TWI256328B TW94116607A TW94116607A TWI256328B TW I256328 B TWI256328 B TW I256328B TW 94116607 A TW94116607 A TW 94116607A TW 94116607 A TW94116607 A TW 94116607A TW I256328 B TWI256328 B TW I256328B
Authority
TW
Taiwan
Prior art keywords
shell mold
thickening
electroformed shell
rare earth
earth elements
Prior art date
Application number
TW94116607A
Other languages
Chinese (zh)
Other versions
TW200640601A (en
Inventor
Chia-Hua Chang
Cheng-Yu Su
Jen-Chin Wu
Chun-Lung Hsu
Original Assignee
Chung Shan Inst Of Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chung Shan Inst Of Science filed Critical Chung Shan Inst Of Science
Priority to TW94116607A priority Critical patent/TWI256328B/en
Application granted granted Critical
Publication of TWI256328B publication Critical patent/TWI256328B/en
Publication of TW200640601A publication Critical patent/TW200640601A/en

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  • Manufacture And Refinement Of Metals (AREA)

Abstract

Disclosed is a method for thickening an electroformed shell mold, which serves to increase thickness of a metal shell mold by using active solder containing rare earth elements to enhance wettability of the solder on a surface of a base during a jointing process. Mechanical stirring is employed to remove oxides of the rare earth elements so as to provide a clean contact surface and thus enhancing wettability of molten filler on the surface of the base to effect jointing.
TW94116607A 2005-05-20 2005-05-20 Method for thickening electroformed shell mold TWI256328B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94116607A TWI256328B (en) 2005-05-20 2005-05-20 Method for thickening electroformed shell mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94116607A TWI256328B (en) 2005-05-20 2005-05-20 Method for thickening electroformed shell mold

Publications (2)

Publication Number Publication Date
TWI256328B true TWI256328B (en) 2006-06-11
TW200640601A TW200640601A (en) 2006-12-01

Family

ID=37614630

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94116607A TWI256328B (en) 2005-05-20 2005-05-20 Method for thickening electroformed shell mold

Country Status (1)

Country Link
TW (1) TWI256328B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395662B (en) * 2009-11-25 2013-05-11 Univ Lunghwa Sci & Technology Method of forming shell mold and high strength ceramic or metal-ceramic composite prototype using such shell mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395662B (en) * 2009-11-25 2013-05-11 Univ Lunghwa Sci & Technology Method of forming shell mold and high strength ceramic or metal-ceramic composite prototype using such shell mold

Also Published As

Publication number Publication date
TW200640601A (en) 2006-12-01

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