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Application filed by Chung Shan Inst Of SciencefiledCriticalChung Shan Inst Of Science
Priority to TW94116607ApriorityCriticalpatent/TWI256328B/en
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Publication of TW200640601ApublicationCriticalpatent/TW200640601A/en
Disclosed is a method for thickening an electroformed shell mold, which serves to increase thickness of a metal shell mold by using active solder containing rare earth elements to enhance wettability of the solder on a surface of a base during a jointing process. Mechanical stirring is employed to remove oxides of the rare earth elements so as to provide a clean contact surface and thus enhancing wettability of molten filler on the surface of the base to effect jointing.
TW94116607A2005-05-202005-05-20Method for thickening electroformed shell mold
TWI256328B
(en)
Method for the electrolytic polishing of a metal in the presence of an electrolyte composition, as well as a moulded element obtained by using such a method