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TWI256118B - Three dimension package - Google Patents

Three dimension package

Info

Publication number
TWI256118B
TWI256118B TW094105476A TW94105476A TWI256118B TW I256118 B TWI256118 B TW I256118B TW 094105476 A TW094105476 A TW 094105476A TW 94105476 A TW94105476 A TW 94105476A TW I256118 B TWI256118 B TW I256118B
Authority
TW
Taiwan
Prior art keywords
connector
chip
package
substrate
chip package
Prior art date
Application number
TW094105476A
Other languages
Chinese (zh)
Other versions
TW200631142A (en
Inventor
Ming-Hsiang Cheng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094105476A priority Critical patent/TWI256118B/en
Application granted granted Critical
Publication of TWI256118B publication Critical patent/TWI256118B/en
Publication of TW200631142A publication Critical patent/TW200631142A/en

Links

Classifications

    • H10W74/00—
    • H10W74/15—
    • H10W90/724—
    • H10W90/754—

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

A three dimension (3D) package is disclosed. A first chip package includes a first chip, a first substrate and at least a first connector. The first connector is deposed on an upper surface of the first substrate and electrically connected to the first chip. A second chip package includes a second chip, a second substrate and at least a second connector. The second connector is deposed on a lower surface of the second substrate and electrically connected to the second chip. The second connector is plugged into the first connector to electrically connect the first chip package and the second chip package and stack the second chip package on the first chip package, then makes the 3D package have functions of easily electrical connection, easily rework and easily assembly. Preferably, the first connector and the second connector are USB (universal serial bus) connector to let the 3D package have better efficiency of electrical transmission.
TW094105476A 2005-02-23 2005-02-23 Three dimension package TWI256118B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094105476A TWI256118B (en) 2005-02-23 2005-02-23 Three dimension package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094105476A TWI256118B (en) 2005-02-23 2005-02-23 Three dimension package

Publications (2)

Publication Number Publication Date
TWI256118B true TWI256118B (en) 2006-06-01
TW200631142A TW200631142A (en) 2006-09-01

Family

ID=37614083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105476A TWI256118B (en) 2005-02-23 2005-02-23 Three dimension package

Country Status (1)

Country Link
TW (1) TWI256118B (en)

Also Published As

Publication number Publication date
TW200631142A (en) 2006-09-01

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent