1254405 13369twf.doc 九、發明說明： 【發明所屬之技術領域】 ^發明是有關於—種組裝裝置，且特別是有關於一種 氏二空度之組裝環境下之對位組裝製程及其組裝裝置。 【先前技術】 隨ί半導體製造技術的曰漸成熟，各種感測器也應用 _黾子產σσ中就數位相機與具有照相功能之行動電 活而έ ’影像感測器是產品品質的_，而影像感測器例 如電荷耦合元件感測器（Charge Coupled Device sensor， CCD Sensor)或互補金氧半導體影像感測器^⑽咖職吻1254405 13369twf.doc IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to an assembly apparatus, and particularly to an alignment assembly process and an assembly apparatus thereof in an assembly environment of a two-cavity. [Prior Art] With the maturity of semiconductor manufacturing technology, various sensors are also used. _ 黾 产 产 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 就 έ έ έ έ έ έ έ 影像 影像 影像 影像 影像 影像And an image sensor such as a Charge Coupled Device Sensor (CCD Sensor) or a complementary MOS image sensor ^ (10)
Metal Oxide Semiconductor image sensor, CMOS image sensor)。無論是CMOS影像感測器或CCD影像感測器， 兩者均具有一光二極體陣列(ph〇t〇di〇de array)位於其感光 區(illumination area)中，而光二極體陣列可接收外部影像 訊號（或光線強弱訊號），並由類比/數位轉換器將影像訊 號轉換為電氣訊號，以進行影像重組處理。此外，對於習 知影像感測器之結構，其係簡述如後。 請芩照圖1，其係繪示習知影像感測器之剖面結構示 意圖。習知影像感測器100包括晶片no、玻璃板12〇與 膠框130。其中，膠框130係配置於晶片11〇與玻璃板 之間，而晶片110、玻璃板120與膠框130構成一空間 100a。此外，晶片no例如為CMOS影像感測晶片，而晶 片110能夠接收穿透玻璃板120之光線，並輸出電子訊號。 值得注意的是，玻璃板120與膠框130之組合能夠防止灰 1254405 13369twf.doc 塵或水氣侵入晶片110,以避免灰塵或水氣造成晶片n〇 失效或損壞。另外，對於習知影像感測器1〇〇之封裝製造 流程，其簡述如後。 請繼續參照圖1，習知影像感測器100之封裝製造流 程包括下列步驟。首先，提供一晶圓（未繪示），而晶圓 包含多個晶片110。之後，將膠框130貼附於晶圓之每一 晶片110之周圍表面上。然後，將玻璃板丨2〇貼附於膠框 130上。接著，對於完成貼合之晶圓、玻璃板120與膠框 130進行固化製程(curing process)。最後，對於上述製程所 形成之結構進行切割製程(cutting process)，以形成多個習 知影像感測器100。 值得注意的是，在將玻璃板120置放於膠框13〇上之 組裝過程中，製程環境為大氣環境，因此在膠框13〇不留 透氣孔的情況下，膠框130容易因為空氣衝擊而產生破 裂。此外，由於製程環境為大氣環境，因此空間1〇〇a所密 封之氣體壓力為大氣壓力。當對於習知影像感測器1〇〇進 行有關於溫度之可靠度分析例如溫度循環測試 (Temperature Cycling Test，TCT)，溫度升高將造成空間 l〇〇a所密封之氣體產生熱膨脹，其結果可能造成膠框13〇 發生破裂（fracture)現象或劣化(deterioration)，進而使得灰 塵或水氣侵入晶片110。 【發明内容】 有鑒於此，本發明的目的就是在提供一種組裝裝置， 其係提供低真空度之組裝環境，以降低元件所密封之氣體 1254405 13369twf.doc 量。 此外，本發明的目的就是在提供一種對位組裝製程， 以提高元件的可靠度(reliability)。 基於上述目的或其他目的，本發明提出一種組裝裳 置，其係適於將一第二板件組裝至一第一板件上，而組裝 裝置例如包括一第一承載板與一第二承載板。第一承載板 具有一第一氣體通道、多個第一開孔與一第一承載區，其 中這些第一開孔係配置於第一承載區上，並連通至第一氣 體通道，且第一板件係配置於第一承載區上，並覆蓋這些 第一開孔。此外，第二承載板係樞接至第一承載板，並疊 置於第一承載板上。第二承載板具有一第二氣體通道、多 個第二開孔與一第二承載區，其中這些第二開孔係配置於 第二^載區上，並連通至第二氣體通道，且第二板件係配 置=第二承載區上，並覆蓋這些第二開孔，而第二承載板 或第一承載板具有一第三氣體通道與至少一第三開孔，且 對應之第二板件或第—板件係暴露出第三開孔，而第三開 孔係與第三氣體通道連通。 依照本發明的較佳實施例所述，第—承載板更具有多 個弟一同心環狀凹槽’其係配置於第一承載區上，而這些 弟-開孔係配置於這些第—同心環狀凹槽内。 依=本發明的較佳實關所述，第二承載板更具有多 i 槽’其係配置於第二承載區上，而這些 弟一開孔係配置於這些第二同心環狀凹槽内。 依'、、、本毛明的較佳實施例所述，第—承載板例如更包 1254405 13369twf.doc 括多個第-定位柱，其係配置於第—承載區上。 依，，明的較佳實施例所述，第二承載板例如更包 括多個第一定位柱，其係配置於第二承載區上。 依照本發明的較佳實施例所述，第—承載板例如更包 括一密封環，其係配置於該第一承載區外圍上。 依照本發明的較佳實施例所述，第—承載板之材 如包括金屬或塑膠。 、 依照本發明的較佳實施例所述，第二承載板之材 如包括金屬或塑膠。 、 基於上述目的或其他目的，本發明提出一種組裝裝 置，其係適於將一第二板件組裝至一第一板件上，而組裝 衣置例如包括一第一承載板與一第二承載板。第一板件係 配置於第一承載區上，並覆蓋這些第一開孔。此外，第二 承載板係樞接至第一承載板，並疊置於第一承載板上。第 二承載板具有一第二氣體通道、多個第二開孔與一第二承 載區，其中這些第二開孔係配置於第二承載區上，並連通 至第一氣體通道連通，且第二板件係配置於第二承載區 上，並復盍运些第二開孔，而弟二承載板或第一承載板具 有一第三氣體通道與至少一第三開孔，且對應之第二板件 或第一板件係暴露出第三開孔，而第三開孔係與第三氣體 通道連通。 依照本發明的較佳實施例所述，第二承載板更具有多 個第二同心環狀凹槽，其係配置於第二承載區上，而這些 第二開孔係配置於這些第二同心環狀凹槽内。 1254405 13369twf.doc 依A?、本發明的較佳實施例所述，第一承載板例如更勹 括多個第一定位柱，其係配置於第一承載區上。 匕 依照本發明的較佳實施例所述，第二承載板例如更包 括多個第二定位柱，其係配置於第二承載區上。 匕 依照本發明的較佳實施例所述，第—承載板例如更包 括一密封環，其係配置於第一承載區外圍上。 匕Metal Oxide Semiconductor image sensor, CMOS image sensor). Whether it is a CMOS image sensor or a CCD image sensor, both have a photodiode array located in its illumination area, and the photodiode array can receive An external image signal (or a strong light signal), and an analog/digital converter converts the image signal into an electrical signal for image recombination processing. In addition, the structure of the conventional image sensor is briefly described below. Referring to Figure 1, a cross-sectional view of a conventional image sensor is shown. The conventional image sensor 100 includes a wafer no, a glass plate 12A, and a bezel 130. The plastic frame 130 is disposed between the wafer 11 and the glass plate, and the wafer 110, the glass plate 120 and the plastic frame 130 form a space 100a. Further, the wafer no is, for example, a CMOS image sensing wafer, and the wafer 110 is capable of receiving light that penetrates the glass plate 120 and outputs an electronic signal. It should be noted that the combination of the glass plate 120 and the plastic frame 130 can prevent the dust or water from entering the wafer 110 to prevent the dust or moisture from causing the wafer to fail or be damaged. In addition, a brief description of the package manufacturing process of the conventional image sensor 1 is as follows. With continued reference to FIG. 1, the package manufacturing process of the conventional image sensor 100 includes the following steps. First, a wafer (not shown) is provided, and the wafer includes a plurality of wafers 110. Thereafter, the bezel 130 is attached to the peripheral surface of each wafer 110 of the wafer. Then, the glass plate 丨 2 〇 is attached to the plastic frame 130. Next, a curing process is performed on the completed wafer, the glass plate 120, and the bezel 130. Finally, a cutting process is performed on the structure formed by the above process to form a plurality of conventional image sensors 100. It is worth noting that in the assembly process of placing the glass plate 120 on the plastic frame 13〇, the process environment is an atmospheric environment, so in the case that the plastic frame 13 does not leave a vent hole, the plastic frame 130 is easily impacted by air. And it broke. In addition, since the process environment is an atmospheric environment, the gas pressure sealed in the space 1〇〇a is atmospheric pressure. When a temperature sensitivity analysis, such as a Temperature Cycling Test (TCT), is performed on a conventional image sensor, the temperature rise will cause thermal expansion of the gas sealed by the space l〇〇a, and the result It may cause a fracture phenomenon or deterioration of the frame 13 to cause dust or moisture to invade the wafer 110. SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide an assembly apparatus that provides a low vacuum assembly environment to reduce the amount of gas sealed by the component 1254405 13369 twf.doc. Furthermore, it is an object of the present invention to provide an alignment assembly process to improve the reliability of the component. Based on the above or other objects, the present invention provides an assembly skirt adapted to assemble a second panel to a first panel, and the assembly apparatus includes, for example, a first carrier panel and a second carrier panel. . The first carrier plate has a first gas passage, a plurality of first openings and a first bearing region, wherein the first openings are disposed on the first bearing region and communicate with the first gas passage, and first The plate is disposed on the first bearing area and covers the first openings. In addition, the second carrier board is pivotally connected to the first carrier board and stacked on the first carrier board. The second carrier plate has a second gas passage, a plurality of second openings and a second bearing region, wherein the second openings are disposed on the second loading region and communicated to the second gas passage, and The second plate member is disposed on the second load-bearing area and covers the second openings, and the second carrier plate or the first carrier plate has a third gas passage and at least a third opening, and the corresponding second plate The piece or the first plate exposes the third opening, and the third opening is in communication with the third gas passage. According to a preferred embodiment of the present invention, the first carrier plate further has a plurality of concentric annular grooves configured to be disposed on the first bearing area, and the brother-opening system is disposed at the first-concentric Inside the annular groove. According to a preferred embodiment of the present invention, the second carrier plate further has a plurality of slots configured to be disposed on the second carrier region, and the plurality of apertures are disposed in the second concentric annular grooves. . According to the preferred embodiment of the ',, and the present invention, the first carrier plate includes, for example, a plurality of first positioning pins, which are disposed on the first load bearing area, for example, 1254405 13369 twf. According to a preferred embodiment of the present invention, the second carrier plate further includes a plurality of first positioning posts, which are disposed on the second load-bearing area. According to a preferred embodiment of the present invention, the first carrier plate further includes a sealing ring disposed on a periphery of the first carrying area. According to a preferred embodiment of the present invention, the material of the first carrier plate comprises, for example, metal or plastic. According to a preferred embodiment of the present invention, the material of the second carrier plate comprises metal or plastic. Based on the above object or other objects, the present invention provides an assembly apparatus adapted to assemble a second panel to a first panel, and the assembly garment includes, for example, a first carrier and a second carrier. board. The first plate is disposed on the first bearing area and covers the first openings. In addition, the second carrier plate is pivotally connected to the first carrier plate and stacked on the first carrier plate. The second carrier plate has a second gas passage, a plurality of second openings and a second bearing region, wherein the second openings are disposed on the second bearing region and communicate with the first gas passage, and the first carrier The second plate member is disposed on the second load-bearing area, and the second open hole is reclaimed, and the second load-bearing plate or the first load-bearing plate has a third gas passage and at least a third opening, and the corresponding The second plate or the first plate exposes a third opening, and the third opening is in communication with the third gas passage. According to a preferred embodiment of the present invention, the second carrier plate further has a plurality of second concentric annular grooves disposed on the second bearing area, and the second opening holes are disposed on the second concentric lines Inside the annular groove. According to a preferred embodiment of the present invention, the first carrier plate further includes a plurality of first positioning posts disposed on the first load bearing area. In accordance with a preferred embodiment of the present invention, the second carrier plate further includes a plurality of second positioning posts disposed on the second load bearing area. In accordance with a preferred embodiment of the present invention, the first carrier plate further includes a seal ring disposed on a periphery of the first load bearing area. dagger
依照本發明的較佳實施例所述，第一承載板之材質 如包括金屬或塑膠。 貝歹,J ‘不戰板之材質例 很知、本發明的較佳實施例所述，第 如包括金屬或塑膠。 基於上述目的或其他目的，本發明提出一種低真空户 下之對位組裝裝置至少包括一抽真空裝置與一密閉腔 〃中描真空裝置係連通至密閉腔室。此外，密閉腔室係由 贫第一承載板、一第二承載板以及一密封環所構成，其中 二封％於抽真空之狀態下係密封於第_與第二承載板之 壯而么封腔室内的二板件適於在真空環境下進行對位組 衣，以使組裝後之這些板件之間所密封的空氣壓力 一 大氣壓力。 、 一 依照本發明的較佳實施例所述，抽真空裝置例如包括 :真空幫浦，而第一承載板對應具有一氣體通道，其連通 於真空幫浦與密閉腔室之間。 依照本發明的較佳實施例所述，抽真空裝置例如包括 〜I _浦，而弟—承載板對應具有一氣體通道，i造捐 於真空幫浦與密閉腔室之間。 〃連通 1254405 13369twf.doc 基於上述目的或其他目的，本發明提出 製程’適用於-影像感測科之膠框對位。對^ = ―包括幾個步驟。首先，放置—第—板件與—第二板According to a preferred embodiment of the present invention, the material of the first carrier plate comprises metal or plastic. Bessie, J ‘The material of the non-warfare plate is well known, as described in the preferred embodiment of the present invention, for example, including metal or plastic. Based on the above objects or other objects, the present invention provides a low-vacuum sub-alignment assembly apparatus including at least one vacuuming device and a closed cavity 〃 vacuuming device connected to the sealed chamber. In addition, the closed chamber is composed of a lean first carrier plate, a second carrier plate and a sealing ring, wherein the second sealing member is sealed to the first and second carrier plates in a vacuumed state. The two plates in the chamber are adapted to perform an alignment coating in a vacuum environment such that the air pressure sealed between the assembled panels is at atmospheric pressure. According to a preferred embodiment of the present invention, the vacuuming device includes, for example, a vacuum pump, and the first carrier plate has a gas passage corresponding to the vacuum pump and the sealed chamber. In accordance with a preferred embodiment of the present invention, the vacuuming apparatus includes, for example, a pump, and the carrier-loading plate has a gas passage corresponding to the vacuum pump and the sealed chamber. 〃Connecting 1254405 13369twf.doc For the above or other purposes, the present invention proposes a process for the collimation of the frame of the image sensing department. For ^ = ―include several steps. First, place - the first plate and the second plate
Gil板二承載板上’其中第—與第二承載板係 刀另巧通-抽絲置’以使第—與第二板件分別吸附於第 -與弟二承載板上。然後’覆蓋第一承載板於第二承載板 上，以形成-密閉腔室，並使第一與第二板件密封於密閉 腔室中。接著’抽離密_室内之空氣，使其保持在低於 外界壓力之-第-壓力值下。隨後，釋放第—板件，使其 自第一承載板落下並覆蓋於第二板件上，且第—與第二板 件之間係以一膠框相互貼合。之後，回壓密閉腔室之壓力， 使其保持在高於第一壓力值之一第二壓力值下。再來，進 行一光固化製程(light curing process)，使其光線射入於密 閉腔室中，以固化膠框。令密閉腔室内之氣體壓力恢復成 為一外界壓力值，以便於取出完成組裝之第一板件與 板件。 依照本發明的較佳實施例所述，第一壓力值與外界壓 力值之差係介於40kpa至5〇kpa之間。 依照本發明的較佳實施例所述，第二壓力值與外界壓 力值之差係介於30kpa至37.5kpa之間。 1 依照本發明的較佳實施例所述，光固化製程例如利用 一紫外線光源直接曝照膠框，以使膠框固化。 基於上述，本發明之對位組裝製程及其組裝裝置採用 第一承載板、一第二承載板與氣體通道之組合，以提供低 1254405 13369twf.doc 真空度之絲壤境2⑦之組裝環境 成之結構體具有較佳的可靠度。此外，相較於昂主、、' 、^ 設備’本發明之組裝裝置具有結構簡單的優點:貝之真空 為讓本發明之上述和其他目的、特徵和優點能 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細二、 明如下。 。、、、田况 【實施方式】 【第一實施例】 圖2A繪示依照本發明第一較佳實施例之組裝裳置的 立體示意圖。目2B績示依照本發明第—較佳實施例之組 裝裝置的剖面結構示意圖。請同時參照圖2A與圖，組 裝裝置300適於將一第二板件22〇組裝至一第'一板件’2忉 上，而第二板件220例如是玻璃板、壓克力板或其他透明 基板，且第一板件210例如是晶圓（wafer)，其中膠框23〇 係配置於第一板件210上（如圖2B所示）或第二板件22〇 上。此外，第一板件210、第二板件220與膠框230能夠 構成多個CMOS影像感測晶片或多個CCD影像感測晶 片，因此CMOS影像感測晶片或CCD影像感測晶片的均 可利用本發明所提出之組裝裝置3〇〇進行對位組裝。 承上所述，組裝裝置300例如包括一第一承載板310 與一第一承載板320。第一承載板310具有一第一氣體通 道312、多個弟一開孔312a與一第一承載區310a，其中這 些第一開孔312a係配置於第一承載區31〇a上，並連通至 第一氣體通道312。此外，第一板件210係配置於第一承 12 1254405 13369twf.doc 載區310a上（如圖2B所示），並覆蓋這些第一開孔312a。 另外，第一承載板310更具有一第三氣體通道314與至少 一第三開孔314a，且第一板件21〇係暴露出第三開孔 314a，而第三開孔314a係與第三氣體通道314連通。再者， 第一承載板310更包括一密封環316，其係配置於第一承 載區310a外圍上。 請繼續參照圖2A與圖2B，第二承載板320係樞接至 第一承載板310，並疊置於第一承載板310上（如圖2B所 示）。此外，第二承載板320具有一第二氣體通道322、 多個第二開孔322a與一第二承載區320a，其中這些第二 開孔322a係配置於第二承載區320a上，並連通至第二氣 體通道322。另外，第二板件220係配置於第二承載區320a 上（如圖2B所示）’並覆蓋這些第二開孔322a。再者， 第一承載板310與第二承載板320之材質例如包括金屬或 塑膠，其中塑膠例如是壓克力塑膠(acrylic plastic)或其他硬 質塑膠。此外，如果第一承載板310與第二承載板320之 材質為金屬，則採用鑄造(casting)與鑽孔之組合以製造第 一氣體通道312、第二氣體通道322與第三氣體通道314。 如果第一承載板310與第二承載板320之材質為塑膠，則 採用鑄造與鑽孔或射出成型（injection molding)與鑽孔之組 合以製造第一承載板310與第二承載板320。值得注意的 是，本發明並不限定第一承載板310與第二承載板320之 材質均為金屬或塑膠，亦可為一金屬與一塑膠之組合。再 者，密封環316並不限定配置於第一承載區31〇a外圍上， 13 1254405 13369twf.doc 而密封環316亦可配置於第二承載區32〇a外圍上。有關於 使用此組裝裝置3⑻所進行之對位組裝製程將詳述如後。 請繼續參照圖2A與圖2B，對位組裝製程包括下列步 驟。首先，掀開組裝裝置300 (如圖2A所示），將第一板 件210與第二板件220分別置於第一承載板31()之第一承 載區310a與第二承載板320之第二承載區320a上。之後， 使用真空幫浦（未繪示）及其管線（未繪示）連通第一氣 體通道312與第二氣體通道322以進行抽氣，因此第一板 件210與第二板件220便被吸附於第一承載板31〇與第二 承載板320上。 然後’將第二承載板320翻轉疊合於第一承載板310 上，而第一承載板310、第二承載板320與密封環316形 成一密閉腔室(sealed chamber)，並且再以真空幫浦及其管 線連通第三氣體通道314以進行抽氣，而真空幫浦與第三 氣體通道314之組合能夠將密閉腔室之壓力保持在低於外 界壓力之一第一壓力值下。值得注意的是，第一壓力值與 外界壓力值之差例如係介於40kpa至50kpa之間。 圖2C繪示依照本發明較佳實施例之對位組裝製程的 示意圖。請參照圖2C，接著使用第二氣體通道322進行回 壓，以使密閉腔室之壓力保持在高於第一壓力值之一第二 壓力值下，因此第二板件220藉由自身的重力（在真空壓 力下空氣阻力較小）脫離第二承載板320並貼合於第一板 件210之膠框230上，以完成第一與第二板件210、220 之膠框230對位的步驟。值得注意的是，第二壓力值與外 14 1254405 13369twf.doc 界壓力值之差係介於30kpa至37 5kpa之間。也由於密封 於膠框230内的氣體壓力（第一壓力值）小於密閉腔室内 之氣體壓力（第二壓力值），在膠框23〇内外壓差之作用 下’利用氣體加壓的效果可協助加快膠框230之貼合作業。 請繼續參照圖2C，隨後對於完成對位之第一板件21〇 與第二板件220進行一光固化製程，並將光固化製程之所 、 使用之光線330射入於密閉腔室中，以固化膠框23〇。此 外，光固化製程例如利用一紫外線光源直接曝照膠框 230,以使膠框230固化。當然，除了紫外線光源之外，亦 # 可以其他高能階之光源取代。 最後，使用第二氣體通道322與第三氣體通道314將 密閉腔室内之氣體壓力恢復成為外界壓力值，因此第一承 ，板310與第二承載板320便可分開，以便於取出完成組 裝之第一板件210、第二板件220與膠框230。 · 承上所述，在習知影像感測器100中（如圖1所示）， - 空間100a所密封之氣體壓力與大氣壓力相近，因此當氣體 ，度上升時，氣體壓力也隨之增加，進而造成膠框13〇破 鲁 裂或損壞。請參照圖2，本發明之組裝裝置3⑽藉由第一 承載板310、第二承載板320與第三氣體通道314形成低 真空度之密閉腔室，而第一板件210與第二板件220在低 真空度之環境中進行組裝，因此第一板件210與第二板件 所密封之氣體壓力較小，而所密封之氣體壓力與大氣 壓力之壓力差最佳為50kpa。相較於習知影像感測器丨⑻， 祛用本發明之組裝裝置300所組裴之第一板件21〇與第二 15 1254405 13369twf.doc 板件220更能承受溫度變化所產生的壓力變化，因此本發 明之組裝裝置300所組裝之結構體具有較佳的可靠度。值 得一提的是，本發明並不限定第三氣體通道314與第三開 口 314a係配置於第一承載板310上，而第三氣體通道314 與第三開口 314a亦可配置於第二承載板320上。此外，第 一氣體通道312與第一開孔312a、第二氣體通道322與第 二開孔322a、及第三氣體通道314與第三開u 3l4a之配 置位置與設計並不限定於圖示所繪示，亦可針對需求進行 不同的設計’在此不再贊述。 【第二實施例】 圖3A繪不依照本發明第二較佳實施例之組裝裝置的 立體示意圖。圖3B繪示依照本發明第二較佳實施例之組 衣衣置的刹面結構示意圖。若是第二實施例的標號與第一 實施例相同者，其係表示在第二實施例中所指明的構件係 雷同於在第一實施例中所指明的構件，在此不再贅述。 為了提高第一承載板310與第二承載板320吸附第一 板件210與第二板件220的能力，第一承載板31()與第二 承載板320分別例如更具有多個第一同心環狀凹槽31沘 與多個第二同心環狀凹槽322b，而第一同心環狀凹槽312b 與第二同心環狀凹槽322b係分別位於第一承載區31〇a與 第二承載區320a上，且第一開孔312a與第二開孔322a係 分別位於第一同心環狀凹槽312b與第二同心環狀凹槽 322b内。由於第一板件21〇與第一氣體通道312，及第二 板件220與第二氣體通道322之接觸面積增加，因此第一 16 1254405 13369twf.doc 板件210與第二板件220更能分別貼附於第一承載板310 與第二承載板320上。 值得一提的是，本發明並不限定第一承載板310與第 二承載板320具有第一同心環狀凹槽312b與第二同心環狀 凹槽322b之設計，亦可採用其他適當之凹槽形狀。此外， 第一承載板310與第二承載板320也不限定必須同時具有 第一同心環狀凹槽312b與第二同心環狀凹槽322b，亦可 採用不同凹槽之搭配。另外，第一同心環狀凹槽312b與第 二同心環狀凹槽322b之製造方法例如採用銑床(milling machine)，而第一氣體通道312、第二氣體通道322與第三 氣體通道314例如使用鑄造與鑽孔。 承上所述，為了便於使用者將第一板件210與第二板 件220分別置於第一承載板310與第二承載板320，第一 承載板310與第二承載板320更包括多個第一定位柱318 與第二定位柱328，其係分別配置於第一承載區310a與第 二承載區320a上。由於第一定位柱318與第二定位柱328 之設計，使用者能夠更快速地將第一板件210與第二板件 220擺至定位。 【第三實施例】 圖4A繪示依照本發明第三較佳實施例之組裝裝置的 立體示意圖。圖4B繪示依照本發明第三較佳實施例之組 裝裝置的剖面結構示意圖。若是第三實施例的標號與第二 貫施例相同者，其係表不在弟二貝加例中所指明的構件係 雷同於在第二實施例中所指明的構件，在此不再贅述。 17 1254405 13369twf.doc 在第-實施例與第二實施例中，本發明之植裝裝置 300制第-氣體通道312進行抽氣使得第—板件別貼 於^ 載板则上。值得注意的是，在整個組裝過程 中，々弟-板件2H)無須翻轉或移動，因此就第一實施例而 二’弟—承載板310並不限定需具有第—氣體通道312與 弟-開孔312a。同理，在第二實施例中，第—承載板31〇 也不限定需具有第-氣體通道312、第一開孔仙與第一 同心環狀凹槽312b。The first and second plate members of the Gil plate are placed on the first and second plates, respectively, so that the first and second plates are respectively attached to the second plate. Then, the first carrier plate is covered on the second carrier plate to form a sealed chamber, and the first and second plates are sealed in the sealed chamber. The air in the chamber _ is then evacuated to maintain it at a pressure below the external pressure. Subsequently, the first plate is released from the first carrier plate and covers the second plate member, and the first and second plates are bonded to each other by a plastic frame. Thereafter, the pressure of the closed chamber is returned to maintain a second pressure value above one of the first pressure values. Further, a light curing process is carried out to inject light into the closed chamber to cure the frame. The gas pressure in the closed chamber is restored to an external pressure value to facilitate removal of the assembled first plate and plate. According to a preferred embodiment of the invention, the difference between the first pressure value and the ambient pressure value is between 40 kPa and 5 〇 kpa. According to a preferred embodiment of the invention, the difference between the second pressure value and the ambient pressure value is between 30 kPa and 37.5 kPa. 1 In accordance with a preferred embodiment of the present invention, a photocuring process, for example, utilizes an ultraviolet light source to directly expose the frame to cure the frame. Based on the above, the alignment assembly process and the assembly device thereof of the present invention adopt a combination of a first carrier plate, a second carrier plate and a gas passage to provide an assembly environment with a low level of 1254405 13369 twf.doc vacuum. The structure has better reliability. In addition, the assembly apparatus of the present invention has the advantage of being simpler in structure than the apparatus of the present invention, and the vacuum and the other objects, features and advantages of the present invention are readily understood. The embodiments, in conjunction with the drawings, are described in detail below. . [First Embodiment] Fig. 2A is a perspective view showing the assembled skirt according to a first preferred embodiment of the present invention. 2B is a schematic cross-sectional view showing the assembly apparatus in accordance with the first preferred embodiment of the present invention. Referring to FIG. 2A and FIG. 2 simultaneously, the assembly device 300 is adapted to assemble a second plate member 22 to a first plate member 2, and the second plate member 220 is, for example, a glass plate, an acrylic plate or The other transparent substrate, and the first plate 210 is, for example, a wafer, wherein the plastic frame 23 is disposed on the first plate 210 (as shown in FIG. 2B) or the second plate 22. In addition, the first board 210, the second board 220, and the frame 230 can form a plurality of CMOS image sensing chips or a plurality of CCD image sensing chips, and thus the CMOS image sensing chip or the CCD image sensing chip can be The alignment assembly is performed using the assembly device 3 proposed by the present invention. As described above, the assembly device 300 includes, for example, a first carrier plate 310 and a first carrier plate 320. The first carrier plate 310 has a first gas passage 312, a plurality of first apertures 312a and a first bearing area 310a, wherein the first openings 312a are disposed on the first bearing area 31〇a and are connected to First gas passage 312. In addition, the first plate member 210 is disposed on the first bearing 12 1254405 13369 twf. doc carrier region 310a (as shown in FIG. 2B) and covers the first opening 312a. In addition, the first carrier plate 310 further has a third gas passage 314 and at least a third opening 314a, and the first plate member 21 exposes the third opening 314a, and the third opening 314a is connected to the third. The gas passages 314 are in communication. Furthermore, the first carrier plate 310 further includes a sealing ring 316 disposed on the periphery of the first carrier area 310a. 2A and 2B, the second carrier 320 is pivotally connected to the first carrier 310 and stacked on the first carrier 310 (as shown in FIG. 2B). In addition, the second carrier plate 320 has a second gas channel 322, a plurality of second openings 322a and a second carrier region 320a, wherein the second openings 322a are disposed on the second carrier region 320a and are connected to Second gas passage 322. In addition, the second plate member 220 is disposed on the second carrying area 320a (as shown in Fig. 2B) and covers the second openings 322a. Furthermore, the material of the first carrier plate 310 and the second carrier plate 320 includes, for example, metal or plastic, and the plastic is, for example, acrylic plastic or other hard plastic. In addition, if the material of the first carrier plate 310 and the second carrier plate 320 is metal, a combination of casting and drilling is used to manufacture the first gas passage 312, the second gas passage 322 and the third gas passage 314. If the material of the first carrier plate 310 and the second carrier plate 320 is plastic, a combination of casting and drilling or injection molding and drilling is used to manufacture the first carrier plate 310 and the second carrier plate 320. It should be noted that the present invention does not limit that the materials of the first carrier 310 and the second carrier 320 are both metal or plastic, and may also be a combination of a metal and a plastic. Further, the seal ring 316 is not limited to be disposed on the periphery of the first load-bearing area 31a, 13 1254405 13369 twf. doc, and the seal ring 316 may be disposed on the periphery of the second load-bearing area 32 〇 a. The alignment assembly process performed using this assembly device 3 (8) will be described in detail later. 2A and 2B, the alignment assembly process includes the following steps. First, the first board member 210 and the second board member 220 are respectively disposed on the first carrying area 310a and the second carrying board 320 of the first carrying board 31 (), as shown in FIG. 2A. On the second carrying area 320a. Thereafter, a vacuum pump (not shown) and a pipeline (not shown) are used to communicate the first gas passage 312 and the second gas passage 322 for pumping, so that the first plate 210 and the second plate 220 are It is adsorbed on the first carrier plate 31 and the second carrier 320. Then, the second carrier plate 320 is flipped over the first carrier plate 310, and the first carrier plate 310, the second carrier plate 320 and the sealing ring 316 form a sealed chamber, and The pump and its line are connected to the third gas passage 314 for pumping, and the combination of the vacuum pump and the third gas passage 314 can maintain the pressure of the closed chamber at a first pressure lower than one of the external pressures. It is worth noting that the difference between the first pressure value and the external pressure value is, for example, between 40 kPa and 50 kPa. 2C is a schematic diagram of a alignment assembly process in accordance with a preferred embodiment of the present invention. Referring to FIG. 2C, the second gas passage 322 is used to perform back pressure to maintain the pressure of the closed chamber at a second pressure value higher than the first pressure value, so that the second plate member 220 is supported by its own gravity. (the air resistance is small under the vacuum pressure) is disengaged from the second carrier plate 320 and is attached to the plastic frame 230 of the first plate member 210 to complete the alignment of the plastic frame 230 of the first and second plates 210 and 220. step. It is worth noting that the difference between the second pressure value and the external 14 1254405 13369twf.doc boundary pressure is between 30kpa and 37 5kpa. Also, since the gas pressure (first pressure value) sealed in the plastic frame 230 is smaller than the gas pressure (second pressure value) in the sealed chamber, the effect of pressurizing the gas under the action of the pressure difference between the inside and the outside of the frame 23 can be Assist in speeding up the cooperation of plastic frame 230. Referring to FIG. 2C, a photocuring process is performed on the first plate member 21A and the second plate member 220, and the light curing process is used to inject the light 330 into the sealed chamber. In order to cure the plastic frame 23 〇. In addition, the photocuring process directly exposes the bezel 230 using, for example, an ultraviolet light source to cure the bezel 230. Of course, in addition to the ultraviolet light source, # can be replaced by other high-energy light sources. Finally, the gas pressure in the closed chamber is restored to the external pressure value by using the second gas passage 322 and the third gas passage 314, so that the first bearing plate 310 and the second carrier plate 320 can be separated, so as to be taken out and assembled. The first plate 210, the second plate 220 and the plastic frame 230. · As described above, in the conventional image sensor 100 (as shown in FIG. 1), the gas pressure sealed by the space 100a is close to the atmospheric pressure, so when the gas is increased, the gas pressure is also increased. , causing the plastic frame 13 to break or crack. Referring to FIG. 2, the assembly device 3 (10) of the present invention forms a closed chamber of low vacuum by the first carrier 310, the second carrier 320 and the third gas passage 314, and the first plate 210 and the second plate The assembly is carried out in a low vacuum environment, so that the gas pressure of the first plate member 210 and the second plate member is small, and the pressure difference between the sealed gas pressure and the atmospheric pressure is preferably 50 kPa. Compared with the conventional image sensor 丨 (8), the first plate member 21 裴 and the second 15 1254405 13369 twf. doc plate member 220 assembled by the assembly device 300 of the present invention can withstand the pressure generated by the temperature change. As a result, the structure assembled by the assembling device 300 of the present invention has better reliability. It is to be noted that the third gas channel 314 and the third opening 314a are not disposed on the first carrier plate 310, and the third gas channel 314 and the third opening 314a are also disposed on the second carrier plate. 320 on. In addition, the arrangement position and design of the first gas passage 312 and the first opening 312a, the second gas passage 322 and the second opening 322a, and the third gas passage 314 and the third opening u 3l4a are not limited to the illustrated It can be shown that different designs can be made for the needs', and will not be mentioned here. [Second Embodiment] Fig. 3A is a perspective view showing an assembling apparatus which is not in accordance with a second preferred embodiment of the present invention. FIG. 3B is a schematic view showing the structure of the brake surface of the group clothes according to the second preferred embodiment of the present invention. If the reference numerals of the second embodiment are the same as those of the first embodiment, it means that the components specified in the second embodiment are the same as those specified in the first embodiment, and will not be described again. In order to improve the ability of the first carrier plate 310 and the second carrier plate 320 to adsorb the first plate member 210 and the second plate member 220, the first carrier plate 31 and the second carrier plate 320 respectively have a plurality of first concentric portions. The annular groove 31沘 and the plurality of second concentric annular grooves 322b, and the first concentric annular groove 312b and the second concentric annular groove 322b are respectively located in the first bearing area 31〇a and the second bearing The first opening 312a and the second opening 322a are located in the first concentric annular groove 312b and the second concentric annular groove 322b, respectively. Since the contact area of the first plate member 21〇 with the first gas passage 312 and the second plate member 220 and the second gas passage 322 is increased, the first 16 1254405 13369 twf.doc plate member 210 and the second plate member 220 are more capable. They are attached to the first carrier 310 and the second carrier 320, respectively. It should be noted that the present invention does not limit the design of the first carrier 310 and the second carrier 320 having the first concentric annular groove 312b and the second concentric annular groove 322b, and other suitable concave shapes may be adopted. Slot shape. In addition, the first carrier plate 310 and the second carrier plate 320 are not limited to have a first concentric annular groove 312b and a second concentric annular groove 322b, and may also be matched with different grooves. In addition, the manufacturing method of the first concentric annular groove 312b and the second concentric annular groove 322b is, for example, a milling machine, and the first gas passage 312, the second gas passage 322, and the third gas passage 314 are used, for example. Casting and drilling. As described above, in order to facilitate the user to place the first board member 210 and the second board member 220 on the first carrier board 310 and the second carrier board 320, the first carrier board 310 and the second carrier board 320 further include The first positioning post 318 and the second positioning post 328 are respectively disposed on the first carrying area 310a and the second carrying area 320a. Due to the design of the first positioning post 318 and the second positioning post 328, the user can position the first panel 210 and the second panel 220 more quickly. [THIRD EMBODIMENT] Fig. 4A is a perspective view showing an assembling apparatus in accordance with a third preferred embodiment of the present invention. Fig. 4B is a cross-sectional view showing the assembly apparatus of the third preferred embodiment of the present invention. If the reference numerals of the third embodiment are the same as those of the second embodiment, the components specified in the second embodiment are the same as those specified in the second embodiment, and will not be described again. 17 1254405 13369twf.doc In the first embodiment and the second embodiment, the first gas passage 312 of the planting apparatus 300 of the present invention is evacuated so that the first plate member is attached to the carrier plate. It is worth noting that during the entire assembly process, the younger brother-plate 2H does not need to be turned or moved, so the first embodiment and the second carrier-supporting plate 310 are not limited to have the first gas passage 312 and the younger brother- Opening 312a. Similarly, in the second embodiment, the first carrier plate 31 is not limited to have the first gas passage 312, the first opening and the first concentric annular groove 312b.
承上所述，在第-、第二與第三實施例中，第一板件 210與第二板件21G均在小於大氣壓力之環境下進行组 裝，因此組裝後之結構體較能承受溫度變化所產生壓力變 化。值得注意的是，第一板件21〇與第二板件22〇當然可 以在真空腔體(vacuum Chamber)内並配合使用機器手臂直 接組裝，但是真空設備之價格與維護費用較為昂^。相較 於使用叩貴之真空設備，本發明之組裝裝置3〇〇只需配合 使用第二氣體通道314與抽氣設備之組合便可提供低真空As described above, in the first, second, and third embodiments, the first plate member 210 and the second plate member 21G are assembled in an environment less than atmospheric pressure, so that the assembled structure is more bearable. The change in pressure caused by temperature changes. It is to be noted that the first plate member 21〇 and the second plate member 22〇 can of course be assembled directly in a vacuum chamber and in conjunction with a robot arm, but the price and maintenance cost of the vacuum device are relatively high. The assembly device 3 of the present invention can provide a low vacuum by simply using a combination of the second gas passage 314 and the pumping device as compared to the use of a vacuum apparatus.
度之組裝環境。 〃二 綜上所述，本發明之對位組裝製程及其組裝裝置具有 下列優點： 一、 本發明之組裝裝置只需配合使用第三氣體通道與 抽氣設備之組合便可提供低真空度之組裝環境。 二、 相較於習知技術，本發明之對位組裝製程所組裂 成之結構體具有較佳的可靠度。 三、 相較於真空設備，本發明之組裝裝置具有結構簡 18 1254405 13369twf.doc 單與價格便宜等優點。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1係繪示習知影像感測器之剖面結構示意圖。 圖2A繪示依照本發明第一較佳實施例之組裝裝置的 立體示意圖。 圖2B繪示依照本發明第一較佳實施例之組裝裝置的 剖面結構示意圖。 圖2C繪示依照本發明較佳實施例之對位組裝製程的 示意圖。 圖3A繪示依照本發明第二較佳實施例之組裝裝置的 立體示意圖。 圖3B繪示依照本發明第二較佳實施例之組裝裝置的 剖面結構示意圖。 圖4A繪示依照本發明第三較佳實施例之組裝裝置的 立體示意圖。 圖4B繪示依照本發明第三較佳實施例之組裝裝置的 剖面結構示意圖。 【主要元件符號說明】 100 :習知影像感測器 110a :空間 19 1254405 13369twf.doc 110 :晶片 120 ··玻璃板 130、230 ··膠框 210 :第一板件 220 ·•第二板件 300 :組裝裝置 310 :第一承載板 310a ··第一承載區 312 :第一氣體通道 312a ··第一開孔 312b :第一同心環狀凹槽 314 :第三氣體通道 314a :第三開孔 316 :密封環 318 :第一定位柱 320 :第二承載板 320a :第二承載區 322 :第二氣體通道 322a :第二開孔 322b :第二同心環狀凹槽 328 :第二定位柱 3 3 0 :光線 20Assembly environment. In the second embodiment, the alignment assembly process and the assembly device thereof have the following advantages: 1. The assembly device of the present invention can provide a low vacuum degree only by using a combination of the third gas passage and the pumping device. Assembly environment. 2. The structure of the split assembly process of the present invention has better reliability than the prior art. Third, compared with the vacuum equipment, the assembly device of the invention has the advantages of simple structure and low price. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing a conventional image sensor. 2A is a perspective view of an assembly apparatus in accordance with a first preferred embodiment of the present invention. 2B is a schematic cross-sectional view showing the assembly apparatus according to the first preferred embodiment of the present invention. 2C is a schematic diagram of a alignment assembly process in accordance with a preferred embodiment of the present invention. 3A is a perspective view of an assembly apparatus in accordance with a second preferred embodiment of the present invention. Figure 3B is a cross-sectional view showing the assembly apparatus in accordance with a second preferred embodiment of the present invention. 4A is a perspective view of an assembly apparatus in accordance with a third preferred embodiment of the present invention. 4B is a cross-sectional structural view of an assembly apparatus in accordance with a third preferred embodiment of the present invention. [Main component symbol description] 100: conventional image sensor 110a: space 19 1254405 13369twf.doc 110: wafer 120 · glass plate 130, 230 · plastic frame 210: first plate 220 · second plate 300: assembly device 310: first carrier plate 310a · first bearing zone 312: first gas channel 312a · first opening 312b: first concentric annular groove 314: third gas channel 314a: third opening Hole 316: sealing ring 318: first positioning post 320: second carrier plate 320a: second bearing zone 322: second gas channel 322a: second opening 322b: second concentric annular groove 328: second positioning column 3 3 0 : Light 20