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TWI253769B - Light-emitting diode backlight module formed with photoluminescent phosphor - Google Patents

Light-emitting diode backlight module formed with photoluminescent phosphor Download PDF

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Publication number
TWI253769B
TWI253769B TW94120669A TW94120669A TWI253769B TW I253769 B TWI253769 B TW I253769B TW 94120669 A TW94120669 A TW 94120669A TW 94120669 A TW94120669 A TW 94120669A TW I253769 B TWI253769 B TW I253769B
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Taiwan
Prior art keywords
light
emitting diode
backlight module
phosphor powder
powder
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TW94120669A
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Chinese (zh)
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TW200700816A (en
Inventor
Shu-Tung Lu
Chong-Jen Huang
Chi-Yuan Chen
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Synage Technology Corp
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Publication of TW200700816A publication Critical patent/TW200700816A/en

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Abstract

Light-emitting diode (LED) backlight module includes a light guide plate, an LED element, and photoluminescent phosphor. The photoluminescent phosphor is formed on the surface of the light guide plate, within the light guide plate or on the housing of the LED element. The light generated by the LED element will mix with light excited by the photoluminescent phosphor to form light of a different color.

Description

1253769 九、發明說明: 【發明所屬之技術領威】 本發明係相關於一種發光二極體背光模組,尤指一種具 有螢光粉之發光二極體背光模組。 【先前技術】 • 由於具有低耗電、長壽命(約為傳統日光燈的十倍)、以 及可產生不會對蟄術品造成傷害之電磁輻射(visible radiation)等優點,發光二極體(light_emittingdi〇de LED)已 漸漸成為一種最受市場歡迎的照明元件了。 傳統的LED只要在其内之LED晶片上輸入適當的電流 便可發出具有如后列波長的色光:紅光(波長635±10nm)、 鲁綠光(波長520±10nm)、藍光(波長450-475nm)、及黃光(波 長565±10nm)等。因此,只要在紅光LED内之LED晶片上 輸入適當的電流,該紅光LED便可發出紅光。同樣地,只 要在藍光LED内之LED晶片上輸入適當的電流,該藍光 LED晶片便可發出藍光。 然而,並非所有的色光都可以用上述之方式產生。舉例 來說,白光便無法用上述之方式產生。 1253769 一種最直覺製作一白光led之方法為··將三個分別發 出藍光、紅光、及綠光之監光、紅光、及綠光LED組合起 來、以形成該白光LED。如此一來,該白光LED便可發射 出該藍光、該紅光、及該綠光所混合而成之白光了。然而, 由於必需包含三個LED,所以,上述之三合一白光LED之 製作成本相當高。 為了克服上述之缺點,日亞化學(Nichia Chemical)提出 一種内含單一 LED及一種光激發光螢光粉 (photoluminescence phosphor)之白光 LED,該螢光粉之化學 式為(Yi-p-q-rGdpCeqSmr)3(Ali_sGas)5〇i2,其中,p 係介於 0 及0.8之間、q係介於0.003及0.2之間、r係介於0.0003 及0·08之間、而s係介於0及1之間。該單一 LED可發射 一激發光線,而該螢光粉係覆蓋於該單一 LED上、並藉由 吸收該單一 LED所發射之部分激發光線之方式,激發出一 發射光線。如此一來,該單一 LED所發射之未被該螢光粉 所吸收之剩餘激發光線與該螢光粉所激發之發射光線便可 混合成白光。 由於LED上用以發出該激發光線之表面積約僅有0.35 平方毫米(mm2),所以,螢光粉不易均勻地覆蓋於LED上, 造成LED僅具有較差之發光效率。 1253769 白光LED除了可單獨地作為照明元件外,也可應用於 各種不同的裝置中,以作為該裝置中之光源。舉例來說, 白光LED可應用於一背光(backlight)模組中,作為該背光 模組之光源。然而,同樣地,背光模組中之白光led也同 樣會有上述之螢光粉不易均勻地覆蓋於該單一 LED上的問 題。 馨 【發明内容】 因此本發明之主要目的在於提供一種具有螢光粉之發 光二極體背光模組,以解決前述問題。 本發明揭露之發光二極體背光模組包含一導光板,一發 光二極體元件以及螢光粉。該導光板包含一入光口用來接 收光線,一本體用來將該入光口所接收之光線霧化成面光 線 出光面用來發射該本體霧化光線所產生之面光線, 、及反射面用來反射該本體霧化光線所產生之面光線。 该發光二極體元件係設置於該導光板之入光口之一側,用 2朝::光口發射激發光線。該螢光粉係設置於該導光板 、, 來吸收忒發光二極體元件所發出之部分激發光線, =據^敫發出波長異於該發光二極體元件所發出之激發光 線之波長的發射光線。 8 1253769 【實施方式】 請麥閱第1圖,第1圖為本發明之第—實施例中一白光 發光二極體背光模組10之示意圖。模組1〇包含一導光板 (lightgUidePlate)12、一 LED 元件 14、一 營光粉 16、以及 - LED燈罩18 ’其巾’ LED燈罩18係可選擇性地設置模 組10中。 導光板12包含—用來接收树(如第i时所顯示之激 發光線LEX、發射光線Lph〇、及白色光線LwH等)之入光口 20、-用來將人光口2〇所接收之光線霧化成面光線(pi_er hght)之本體(bGdy)22、—用來發射本體22麟化之面光線 之出光面24、以及—用來反射面光線之反射面26。等效 上,導光板12係將入光口 20所接收之線光線(nnearlight) 轉換成發射自出光面24之面光線。 ‘光板12可為楔形板、或平板。筆記型電腦因盆内之 =間有限’所有大都採用楔形導光板,而LCD顯示器則多 導光板。導光板12上設有網點分佈(pa—, 進=、可破壞人光σ 2G所接收光線之干涉現象、並 可分為㈣網时狀製作技術約 網印方式將油墨印在式(射出板)兩種,前者係利用 而後者則直接以射出= 〜製作光學網點分佈, 氓t技銜,將網點分佈設計在模具鋼 1253769 内,比較之下,非印刷式之製程較為簡單且精密度高,為 目前導光板之主流技術。 LED元件14係設置於導光板12之入光口 2〇旁,用來 朝入光口 20發射一激發光線lex。LED元件14包含一封 裝殼體30、一設置於封裝殼體3〇内用來發射激發光線乙以 之LED晶片28、以及一填充於封裝殼體3〇内用來覆蓋lED ❿晶片28之膠體(gel material)32。在本發明之第一實施例 中,膠體32係由環氧樹脂(epoxy resin)之材質所製成。 螢光粉16可吸收LED元件14所發出之部分激發光線 LEX、並據以激發出一發射光線LpH〇,發射光線LpH〇之波 長係相異於激發光線LEX之波長。 在本發明之第一實施例中,LED元件14内之LED晶片 28為一藍光LED晶片’也就是說’ LED元件14可發射藍 色激發光線Lex ’而螢光粉16為混入膠中並被塗抹於led 元件14的封裝殼體30的表面上之紀紹石梅石榮^光粉 (Yttrium Aluminum Garnet,YAG),其可吸收藍光 LED 元件 14所發射之監色激發光線Lex、並據以激發出黃色發射光 線LPHO。如此一來,由於LED元件14所發射之未被yag 16所吸收之剩餘藍色激發光線LEX可與yAg 16所激發出 之育色發射光線LpHO混合成白色光線L_,所以,等效上, 1253769 LED元件14係發射白色光線LWH ’相應地,導光板12之 入光口 20所接收的線光線為白色光線LWH,而導光板12 之出光面24所發射的面光線亦為白色光線lwh。 在本發明之第一實施例中’螢光粉16係塗抹於LED元 件14之封裝殼體3〇的表面上,然而,在本發明之背光模 組中’螢光粉16也可:(1)依一預定比例混入用於製造led # 元件14之封裝殼體3〇的塑料内、並藉由模具射出成型之 方式,使螢光粉16散佈於LED元件14之封裝殼體3〇中; (2)混入一化學溶劑中,再以喷墨之方式將該化學溶劑塗佈 於LED元件14之封I殼體3〇的表面上;(3)採用目前將螢 光粉16塗佈於LED晶片上之方式,將螢光粉16混入膠中、 再將該混有螢光粉16之膠塗佈於LED元件14之封裝殼體 〇的表面上,(4)採用傳統將螢光粉塗佈於crt映像管之 修方式、將螢光粉I6塗佈於LED元件M之封裝殼體so的 表面上。 清茶閱第2圖,第2圖為本發明之第二實施例中一白光 發光二極體背光模組4〇之示意圖。模組4〇亦包含導光板 12、LED兀件14、螢光粉16、以及LED燈罩18等但與 模組1〇不同的是,模組40中之螢光粉16係塗抹於導光板 12上,如第2圖所示,螢光粉16係塗抹於導光板12之出 光面24上,當然,螢光粉16也可塗抹於導光板12之反射 1253769 面26上、或入光口 20處,或乾脆滲雜於本體22内。如此 一來,LED元件14所發出之激發光線LEX會由入光口 20 先進入至本體22、再由本體22霧化成面激發光線LEX,其 中部分面激發光線LEX會被螢光粉16所吸收、而激發出發 射光線LPH0。所以,等效上,導光板12之出光面24會射 出白色光線Lwh。 在本發明之第二實施例中,螢光粉16係塗抹於導光板 12上’然而,同樣地,在本發明之背光模組中,螢光粉16 也可:(1)依一預定比例混入用於製造導光板12的塑料内、 並藉由模具射出成型之方式,使螢光粉16散佈於導光板 12中;(2)混入一化學溶劑中,再以喷墨之方式將該化學溶 劑塗佈於導光板12的表面上;(3)採用目前將螢光粉16塗 佈於LED晶片上之方式,將螢光粉16混入膠中、再將該 混有螢光粉16之膠塗佈於導光板12的表面上;(4)採用傳 統將螢光粉塗佈於CRT映像管之方式、將螢光粉16塗佈 於導光板12的表面上。 在上述之第一實施例及第二實施例中,模組1〇及4〇皆 選用ό亥監光LED晶片,作為發出激發光線lex之led元 件14。然而,在本發明之白光發光二極體背光模組中,也 可選用一紅光LED晶片、或一綠光LED晶片取代該藍光 LED晶片,作為發出激發光線Lex之LED元件14,相應 12537691253769 IX. Description of the Invention: [Technology Leading Technology of the Invention] The present invention relates to a light-emitting diode backlight module, and more particularly to a light-emitting diode backlight module having a fluorescent powder. [Prior Art] • Light-emitting diodes (light_emittingdi) due to its low power consumption, long life (about ten times that of conventional fluorescent lamps), and electromagnetic radiation that can cause no damage to sputum products. 〇de LED) has gradually become one of the most popular lighting components in the market. Conventional LEDs can emit colored light with a wavelength of the following columns by inputting an appropriate current on the LED chip: red light (wavelength 635±10 nm), lu green light (wavelength 520±10 nm), blue light (wavelength 450- 475 nm), and yellow light (wavelength 565 ± 10 nm). Therefore, the red LED can emit red light as long as an appropriate current is input to the LED chip in the red LED. Similarly, the blue LED chip emits blue light as long as the appropriate current is applied to the LED chip within the blue LED. However, not all shades of light can be produced in the manner described above. For example, white light cannot be produced in the manner described above. 1253769 One of the most intuitive ways to make a white LED is to combine three light, red, and green LEDs that emit blue, red, and green light respectively to form the white LED. In this way, the white LED can emit white light mixed by the blue light, the red light, and the green light. However, since it is necessary to include three LEDs, the above-described three-in-one white LED is relatively expensive to manufacture. In order to overcome the above disadvantages, Nichia Chemical proposed a white LED containing a single LED and a photoluminescence phosphor, the chemical formula of which is (Yi-pq-rGdpCeqSmr)3 (Ali_sGas)5〇i2, where p is between 0 and 0.8, q is between 0.003 and 0.2, r is between 0.0003 and 0.08, and s is between 0 and 1. between. The single LED emits an excitation light, and the phosphor powder covers the single LED and excites a emitted light by absorbing a portion of the excitation light emitted by the single LED. In this way, the residual excitation light emitted by the single LED that is not absorbed by the phosphor powder and the emission light excited by the phosphor powder can be mixed into white light. Since the surface area on the LED for emitting the excitation light is only about 0.35 square millimeters (mm2), the phosphor powder does not easily cover the LED uniformly, resulting in LEDs having only poor luminous efficiency. 1253769 White LEDs can be used in a variety of different devices as a source of light in the device, in addition to being individually illuminable. For example, a white LED can be applied to a backlight module as a light source for the backlight module. However, similarly, the white light LED in the backlight module also has the problem that the above-mentioned phosphor powder does not easily cover the single LED uniformly. SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a light-emitting diode backlight module having a phosphor powder to solve the aforementioned problems. The LED backlight module disclosed in the present invention comprises a light guide plate, a light emitting diode element and a phosphor powder. The light guide plate includes an light entrance port for receiving light, and a body for atomizing the light received by the light entrance port into a surface light emitting surface for emitting surface light generated by the body atomizing light, and a reflecting surface It is used to reflect the surface light generated by the atomizing light of the body. The light emitting diode element is disposed on one side of the light entrance of the light guide plate, and emits excitation light by using the 2:: optical port. The phosphor powder is disposed on the light guide plate to absorb part of the excitation light emitted by the LED element, and emits a wavelength different from the wavelength of the excitation light emitted by the LED element. Light. 8 1253769 [Embodiment] Please refer to Fig. 1, which is a schematic view of a white light emitting diode backlight module 10 in the first embodiment of the present invention. The module 1A includes a light guide (lightgUidePlate) 12, an LED component 14, a camping powder 16, and an LED lampshade 18's wiper LED lampshade 18 are selectively disposed in the die set 10. The light guide plate 12 includes an entrance port 20 for receiving a tree (such as the excitation light LEX, the emitted light Lph〇, and the white light LwH displayed in the ith), and is used to receive the human optical port 2 The light is atomized into a body of pi_er hght (bGdy) 22, a light exit surface 24 for emitting surface light of the body 22, and a reflective surface 26 for reflecting surface light. Equivalently, the light guide plate 12 converts the ray light received by the light entrance port 20 into the surface light emitted from the light exit surface 24. The light panel 12 can be a wedge plate or a flat plate. Notebook computers have limited wedges in the basin. Most of them use wedge-shaped light guides, while LCD monitors have multiple light guides. The light guide plate 12 is provided with a dot distribution (pa-, into=, which can destroy the interference phenomenon of the received light of the human light σ 2G, and can be divided into four (4) mesh time-like manufacturing techniques, about the screen printing method, the ink is printed on the type (the ejection plate) ), the former is used, while the latter is directly used to produce optical dot distribution, 氓t technology, and the dot distribution is designed in die steel 1253769. In comparison, the non-printing process is simpler and more precise. The LED element 14 is disposed adjacent to the light entrance port 2 of the light guide plate 12 for emitting an excitation light lex toward the light entrance port 20. The LED element 14 includes a package housing 30 and a An LED chip 28 disposed in the package housing 3 for emitting excitation light B, and a gel material 32 filled in the package housing 3 for covering the lED wafer 28. In the present invention In one embodiment, the colloid 32 is made of an epoxy resin. The phosphor 16 absorbs a portion of the excitation light LEX emitted by the LED element 14 and thereby excites an emitted light LpH〇. The wavelength of the emitted light LpH〇 is different from The wavelength of the light-emitting line LEX. In the first embodiment of the present invention, the LED chip 28 in the LED element 14 is a blue LED chip 'that is, the LED element 14 can emit blue excitation light Lex' and the phosphor powder 16 Yttrium Aluminum Garnet (YAG), which is mixed in the glue and applied to the surface of the package casing 30 of the LED element 14, absorbs the color-excited light emitted by the blue LED element 14 Lex And, according to the yellow emission light LPHO, the remaining blue excitation light LEX emitted by the LED element 14 and not absorbed by the yag 16 can be mixed with the ray emission light LpHO excited by the yAg 16 The white light L_, so, equivalently, the 1253769 LED element 14 emits white light LWH 'correspondingly, the line light received by the light entrance 20 of the light guide plate 12 is white light LWH, and the light exit surface 24 of the light guide plate 12 is The emitted surface light is also white light lwh. In the first embodiment of the present invention, the phosphor powder 16 is applied to the surface of the package casing 3 of the LED element 14, however, in the backlight module of the present invention. 'Fluorescent powder 16 is also available (1) The phosphor powder 16 is dispersed in the package casing 3 of the LED element 14 by mixing it into a plastic for manufacturing the package case 3 of the LED #14 by a predetermined ratio and by injection molding. (2) mixing into a chemical solvent, and then applying the chemical solvent to the surface of the I-shell 3 of the LED element 14 by inkjet; (3) coating the phosphor powder 16 at present In the manner of the LED chip, the phosphor powder 16 is mixed into the glue, and the glue mixed with the phosphor powder 16 is applied on the surface of the package casing LED of the LED element 14, and (4) the fluorescent is conventionally used. The powder is applied to the crt image tube repair method, and the phosphor powder I6 is applied onto the surface of the package case so of the LED element M. The tea is in Fig. 2, and Fig. 2 is a schematic view showing a white light emitting diode backlight module 4 in the second embodiment of the present invention. The module 4A also includes a light guide plate 12, an LED element 14, a phosphor powder 16, and an LED lamp cover 18, etc., but unlike the module 1A, the phosphor powder 16 in the module 40 is applied to the light guide plate 12. As shown in FIG. 2, the phosphor powder 16 is applied to the light-emitting surface 24 of the light guide plate 12. Of course, the phosphor powder 16 can also be applied to the reflection surface 1253 of the light guide plate 12 or the light entrance port 20. Or, it is simply infiltrated into the body 22. In this way, the excitation light LEX emitted by the LED element 14 will first enter the body 22 from the light entrance port 20, and then be atomized into the surface excitation light LEX by the body 22, wherein the partial surface excitation light LEX will be absorbed by the phosphor powder 16. And emits the emitted light LPH0. Therefore, equivalently, the light exit surface 24 of the light guide plate 12 emits white light Lwh. In the second embodiment of the present invention, the phosphor powder 16 is applied to the light guide plate 12. However, in the backlight module of the present invention, the phosphor powder 16 may also be: (1) at a predetermined ratio. The phosphor powder 16 is dispersed in the light guide plate 12 by being mixed into the plastic for manufacturing the light guide plate 12, and the phosphor powder 16 is dispersed in the light guide plate 12; (2) mixed into a chemical solvent, and then the ink is sprayed. The solvent is coated on the surface of the light guide plate 12; (3) the phosphor powder 16 is mixed into the glue in the manner that the phosphor powder 16 is currently coated on the LED wafer, and the glue mixed with the phosphor powder 16 is used. Applying to the surface of the light guide plate 12; (4) Applying the phosphor powder 16 to the surface of the light guide plate 12 by conventionally applying the phosphor powder to the CRT image tube. In the first embodiment and the second embodiment described above, the modules 1 and 4 are both selected as the LED elements 14 for emitting the excitation light lex. However, in the white light emitting diode backlight module of the present invention, a red LED chip or a green LED chip may be used instead of the blue LED chip as the LED component 14 emitting the excitation light Lex, corresponding 1253769

土也,V + ’ AG螢光粉16也可分別以綠色+藍色螢光粉、及紅色 +監色螢光粉取代之。 明苓閱第3圖’第3圖為本發明之第三實施例中一白光At the same time, V + ’ AG phosphor powder 16 can also be replaced by green + blue phosphor powder and red + monitor color phosphor powder. 3A is a white light in a third embodiment of the present invention.

^光—極體背光模組50之示意圖。除了導光板12、及LED^ Schematic diagram of the light-polar body backlight module 50. In addition to the light guide plate 12, and the LED

燈罩18外,模組50另包含-紫外光(ultra vi〇let,uv)LED 凡件52、一紅色螢光粉54、一藍色螢光粉%、及一綠色 螢光粉58,其中,同樣地,;led燈罩18亦係可選擇性地 設置模組50中。 务、外光LED元件52包含封装殼體3〇、膠體32、以及 =置於封裝殼體30内用來發射一紫外光激發光線[,以 之紫外光LED晶片60。 、、、工色螢光粉54係塗抹於紫外光LED元件52之封裝殼 體30的表面上,用來吸收紫外光LED元件52所發出之第 、邻刀务、外光激發光線LUVEX1、並據以激發出一紅色發射 光線LRPHO,紅色發射光線Lrph〇之波長係相異於紫外光激 發光線luvex之波長;藍色螢光粉56係塗抹於導光板12 上,如第3圖所示,藍色螢光粉56係塗抹於導光板12之 出光面24上,用來吸收紫外光LED元件52所發出之第二 口ί5勺备、外光激發光線LuVEX2、並據以激發出一藍色發射光 線LBPHO ’監色發射光線lbpho之波長係相異於紫外光激發 1253769 光線luvex之波長;綠色螢光粉58係滲雜於 本體22内,用來吸收紫外光LED元件52所&光板12之 分紫外光激發光線LuvEX3、並據以激發出—厅:出之第三部 LGPH0,綠色發射光線lg_之波長係彳目|表色發射光線 MUVEX之波長。 4紫外光激發光 由於紫外光LED晶片60所發出的紫外光、表,Outside the lamp cover 18, the module 50 further includes an ultraviolet (ultra vi〇let, uv) LED member 52, a red phosphor powder 54, a blue phosphor powder, and a green phosphor powder 58, wherein Similarly, the led lampshade 18 is also selectively mountable in the module 50. The external LED element 52 includes a package housing 3, a colloid 32, and a packaged housing 30 for emitting an ultraviolet light to excite the ultraviolet light LED wafer 60. And, the work color fluorescent powder 54 is applied on the surface of the package casing 30 of the ultraviolet LED element 52 for absorbing the first, adjacent, and external light excitation light LUVEX1 emitted by the ultraviolet LED element 52. According to the excitation of a red emission light LRPHO, the wavelength of the red emission light Lrph〇 is different from the wavelength of the ultraviolet excitation light luvex; the blue fluorescent powder 56 is applied to the light guide plate 12, as shown in FIG. The blue phosphor powder 56 is applied to the light-emitting surface 24 of the light guide plate 12 for absorbing the second surface of the ultraviolet LED element 52, and the external light excitation light LuVEX2, and thereby exciting a blue color. The emitted light LBPHO 'the color of the emitted light lbpho is different from the wavelength of the ultraviolet light excitation 1253769 light luvex; the green fluorescent powder 58 is immersed in the body 22 for absorbing the ultraviolet light LED element 52 & light board 12 The ultraviolet light excites the light LuvEX3, and according to the excitation, the third part of the LGPH0, the wavelength of the green emission light lg_ is the wavelength of the color emission light MUVEX. 4 ultraviolet light excitation light due to the ultraviolet light emitted by the ultraviolet LED chip 60, the table,

Luvex 其波長係介於380至405nm,其係皆余—、 '、复 54所激發之紅色發射光線L_、藍色鸯光色螢光粉 藍色發射光線1^_、以及綠色螢光粉58 2 56所激發之 射光線LGPHO,所以,紫外光LED晶片6〇確。&之綠色發 之白光發光二極體背光模組中的L E D元件。可作為本發明 如此一來,紫外光LED元件52所發射之未被紅色發光 粉54、k色螢光粉56、或綠色螢光粉58所吸收之剩餘激 發光線LUVEX與紅色螢光粉54所激發出之紅色發射光線 LRPH0、藍色螢光粉56所激發出之藍色發射光線Lbph〇、以 及綠色螢光粉58所激發出之綠色發射光線[仰⑽可混合成 白色光線Lwh ◦ 當然,紅色螢光粉54、藍色螢光粉56、及綠色螢光粉 58也可分別或全部、塗抹或滲雜於紫外光LED元件52之 封裝殼體30内或其表面上、或導光板12之入光口 20處、 1253769 反射板26及出光面24上、或乾脆滲雜於本體22内,只要 這些螢光粉係位於一激發光線路徑上,該激發光線路徑係 起自紫外光LED晶片60、途經封裝殼體30之内部、封裝 殼體30之表面、導光板12之入光口 20、本體22、及反射 板26、而終至出光面24。 在本發明之第三實施例中,模組50係包含紫外光LED φ 元件52、及三種螢光粉,亦即紅色螢光粉54、藍色螢光粉 56、及綠色螢光粉58,然而,本發明之其内係包含紫外光 LED元件52之發光二極體背光模組,也可僅包含兩種、或 甚至僅包含一種螢光粉。 具體言之,若該模組係僅包含兩種螢光粉,則該兩種螢 光粉所激發之發射光線之波長可分別介於505至570nm、 及介於570至650nm之間。為了使得人眼能感受到較佳之 * 演色性,若該僅包含兩種螢光粉之模組係應用於白天的環 境中,則該兩種螢光粉所激發之發射光線之波長可分別介 於550至565nm、及介於580至600nm之間;另一方面, 若該模組係應用於夜晚的環境中,則該兩種螢光粉所激發 之發射光線之波長可分別介於505至510nm、及介於630 至645nm之間。 若該模組係僅包含一種螢光粉,則該螢光粉所激發之發 15 l253769 於白^ 性’若該僅包含—料光粉之模組係應用 二天的環境中,則該螢光粉所激發之發射光線之波長可 "於550至565·之間;另-方面,若該模組係應用於夜 晚的環境中,則該螢光粉所激發之發射光線之波長可介於 5〇5至51〇nm之間。 # 在本發明之實施例中,皆係以發出白光的LED背光模 組為例,然而本發明的LED背光模組亦可藉由螢光粉的設 置混合出其他顏色的光線,因此不論LED背光模組產生之 光線的顏色是否為白色,只要在led背光模組中將螢光粉 設置在LED元件之封裝殼體上或在導光板上,皆屬本發明 之範疇。 相較於習知技術,本發明之白光LED背光模組係包含 一導光板、一 LED元件、以及一螢光粉。該螢光粉可塗抹 於該LED元件之封裝殼體的表面上或該導光板中之反射 面、出光面或入光口處、或可混合形成於該LED元件之封 裝殼體上及該導光板上。如此一來,該白光LED背光模組 便可發射出具有高發光效率之白色光線。 以上所述僅為本發明之較佳實施例,凡依本發明申請專 利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 16 1253769 【圖式簡单說明】 第1圖為本發明之第一實施例中一白光發光二極體背光模 組之示意圖。 第2圖為本發明之第二實施例中一白光發光二極體背光模 組之示意圖。 第3圖為本發明之第三實施例中一白光發光二極體背光模 組之示意圖。 【主要元件符號說明】 10、 40、50白光LED背光模組 12 導光板 14 LED元件 16 螢光粉 18 LED燈罩 20 入光口 22 本體 24 出光面 26 反射面 28 LED晶片 30 封裝殼體 32 膠體 52 紫外光LED元件 54 紅色螢光粉 56 藍色螢光粉 58 綠色螢光粉 60 紫外光LED晶片Luvex has a wavelength range of 380 to 405 nm, and its system is all--, ', complex 54 excited red emission light L_, blue neon light fluorescent powder blue emission light 1 ^ _, and green fluorescent powder 58 2 56 excitation of the light LGPHO, so the UV LED chip 6 is indeed. & green LED light emitting diode backlight module L E D components. As the present invention, the remaining excitation light LUVEX and the red fluorescent powder 54 which are emitted by the ultraviolet LED element 52 and are not absorbed by the red luminescent powder 54, the k luminescent powder 56, or the green luminescent powder 58 can be used. The emitted red light LRPH0, the blue emitted light Lbph〇 excited by the blue fluorescent powder 56, and the green emitted light excited by the green fluorescent powder 58 [Yang (10) can be mixed into white light Lwh ◦ Of course, The red phosphor powder 54, the blue phosphor powder 56, and the green phosphor powder 58 may also be separately or entirely coated or immersed in or on the surface of the package housing 30 of the ultraviolet LED element 52, or the light guide plate 12. The light entrance 20, the 1253769 reflector 26 and the light exit surface 24, or simply doped in the body 22, as long as the phosphor powder is located in an excitation light path, the excitation light path is from the ultraviolet LED chip 60, through the inside of the package housing 30, the surface of the package housing 30, the light entrance 20 of the light guide plate 12, the body 22, and the reflector 26, and finally to the light exit surface 24. In a third embodiment of the present invention, the module 50 includes an ultraviolet LED φ element 52 and three types of phosphor powder, namely, red phosphor powder 54, blue phosphor powder 56, and green phosphor powder 58, However, the present invention includes a light-emitting diode backlight module including an ultraviolet LED element 52, and may include only two types, or even only one type of phosphor powder. Specifically, if the module contains only two types of phosphors, the wavelengths of the emitted light excited by the two types of phosphors may be between 505 and 570 nm and between 570 and 650 nm, respectively. In order to make the human eye feel better color rendering, if the module containing only two kinds of phosphor powder is applied in the daytime environment, the wavelengths of the emitted light excited by the two kinds of phosphor powders can be separately introduced. 550 to 565 nm, and between 580 and 600 nm; on the other hand, if the module is used in a night environment, the wavelengths of the emitted light excited by the two kinds of phosphors may be respectively 505 to 510 nm, and between 630 and 645 nm. If the module contains only one kind of fluorescent powder, the fluorescent powder is excited by 15 l 253769 in the case of white color. If the module containing only the light powder is applied for two days, the fluorescent light is emitted. The wavelength of the emitted light excited by the powder can be between 550 and 565. On the other hand, if the module is used in a night environment, the wavelength of the emitted light excited by the phosphor can be between 5〇5 to 51〇nm. In the embodiment of the present invention, the LED backlight module that emits white light is taken as an example. However, the LED backlight module of the present invention can also mix other colors of light by setting the phosphor powder, so regardless of the LED backlight. Whether the color of the light generated by the module is white, as long as the fluorescent powder is disposed on the package casing of the LED component or on the light guide plate in the LED backlight module, it is within the scope of the present invention. Compared with the prior art, the white LED backlight module of the present invention comprises a light guide plate, an LED component, and a phosphor powder. The phosphor powder may be applied to the surface of the package housing of the LED component or the reflective surface, the light exit surface or the light entrance of the light guide plate, or may be mixed and formed on the package housing of the LED component and the guide On the light board. In this way, the white LED backlight module can emit white light with high luminous efficiency. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the patent scope of the present invention are intended to be within the scope of the present invention. 16 1253769 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a white light emitting diode backlight module in the first embodiment of the present invention. Fig. 2 is a schematic view showing a white light emitting diode backlight module in the second embodiment of the present invention. Fig. 3 is a schematic view showing a white light emitting diode backlight module in the third embodiment of the present invention. [Main component symbol description] 10, 40, 50 white LED backlight module 12 light guide plate 14 LED component 16 fluorescent powder 18 LED lampshade 20 light inlet 22 body 24 light emitting surface 26 reflective surface 28 LED wafer 30 package housing 32 colloid 52 UV LED Components 54 Red Fluorescent Powder 56 Blue Fluorescent Powder 58 Green Fluorescent Powder 60 UV LED Chip

Claims (1)

1253769 十、申請專利範圍: 1. 一 種具有螢光粉(photoluminescence phosphor)之發光 二極體(light-emitting diode,LED)背光(backlight)模 組,其包含: 一導光板(light guide plate),其包含: 一入光口,用來接收光線; 一本體,用來將該入光口所接收之光線霧化成面光 線, 一出光面,用來發射該本體霧化光線所產生之面光 線;以及 一反射面,用來反射該本體霧化光線所產生之面光 線; 一發光二極體元件,設置於該導光板之入光口之一側, 用來朝該入光口發射激發光線;以及 螢光粉,設置於該導光板上,用來吸收該發光二極體元 件所發出之部分激發光線,並據以激發出波長異於 該發光二極體元件所發出之激發光線之波長的發 射光線。 2. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係滲雜於該導光板之本體内。 18 1253769 3. 如申請專利範圍第2項所述之發光二極體背光模組, 其中該螢光粉係依一預定比例混入用於製造該導光板 之本體的塑料中,並藉由模具射出成型之方式,散佈 於該導光板之本體内。· 4. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係混入於一化學溶劑中,該化學溶劑係 φ 以喷墨方式塗佈於該導光板上。 5. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係形成於該導光板之入光口處。 6. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係形成於該導光板之出光面上。 • 7.如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係形成於該導光板之反射面上。 8. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係混入於塗佈在該導光板上的膠中。 9. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該螢光粉係以塗佈於一陰極射線管(cathode ray tube, CRT)之方式塗佈於該導光板上。 1253769 10. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該發光二極體元件為一藍光發光二極體元件,而 該榮光粉為紀銘石權石螢光粉(Yttrium Aluminum Garnet, YAG) 〇 11. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該發光二極體元件為一綠光發光二極體元件,而 該螢光粉包含藍色螢光粉及紅色螢光粉。 12. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該發光二極體元件為一紅光發光二極體元件,而 該螢光粉包含藍色螢光粉及綠色螢光粉。 13. 如申請專利範圍第1項所述之發光二極體背光模組, 其中該發光二極體元件為一紫外光(ultra violet, UV)發 光二極體元件,而該螢光粉包含藍色螢光粉。 14. 如申請專利範圍第13項所述之發光二極體背光模組, 其中該螢光粉另包含釔鋁石榴石螢光粉。 15. 如申請專利範圍第14項所述之發光二極體背光模組, 其中該螢光粉另包含綠色螢光粉。 16. 如申請專利範圍第13項所述之發光二極體背光模組, 20 1253769 其中該螢光粉另包含綠色料粉及紅色 螢光粉 參 17·如申凊專利範圍第Γ .s ^ 貝所述之發光二極體背光模組, /、另匕3 —燈罩,該發光- 尤一極體兀件係設於該燈罩上 如申請專利範圍第1項 ^ ^ 所述之發光二極體背光模組, 二二二一極體疋件為—紫外光發光二極體元件, 而^螢先粉所激發之發射光線之波長係介於 565nm之間〇 18. 505至 19·如申凊專利範圍第igj 其中該螢光粉所激發 565nm之間〇 項所述之發光二極體背光模組, 之發射光線之波長係介於55〇至 20·如申请專利範圍第a· 其中該螢光粉所激發 510nm之間 項所述之發光二極體背光模組, 之發射光線之波長係介於505至 21. 如申請專利範圍第丨 、 其中該發光二極體&、所述之發光二極體背光模組, 而該螢光粉所激發1為—紫外光發光二極體元件, 570nm、及介於”之^射光線之波長係介於505至 〇至65〇nm之間。 22·如申凊專利範圍第 21 項所述之發光二極體背光模組 21 1253769 其中該螢光粉所激發之發射光線之波長係介於550至 565nm、及介於580至600nm之間。 23.如申請專利範圍第21項所述之發光二極體背光模組, 其中該螢光粉所激發之發射光線之波長係介於505至 510nm、及介於630至645nm之間。 _ 24.如申請專利範圍第1項所述之發光二極體背光模組, 其中該發光二極體元件包含: 一封裝殼體; 一 LED晶片,設置於該封裝殼體内,用來發射激發光 線;以及 膠體,覆蓋於該LED晶片上。 25. 如申請專利範圍第24項所述之發光二極體背光模組, • 其中該封裝殼體上設有螢光粉。 26. —種具有螢光粉之發光二極體背光模組,其包含: 一導光板, 一發光二極體元件’設置於該導光板之一側’該發光二 極體元件包含: 一封裝殼體; 一 LED晶片,設置於該封裝殼體内,用來朝該導光 22 1253769 板發射激發光線 ;以及 一膠體,覆蓋於該LED晶片上;以及 螢光粉,散佈於該發光二極體元件之封裝殼體上,用來 吸收該LED晶片所發出之部分激發光線,並據以 激發出波長異於該激發光線之波長的發射光線。 27·如申請專利範圍第26項所述之發光二極體背光模組, • 其中該螢光粉係混入於一化學溶劑中,該化學溶劑係 以喷墨方式塗佈於該封裝殼體上。 28·如申請專利範圍第26項所述之發光二極體背光模組, 其中該螢光粉係混入在塗佈於該發光二極體元件之封 裝殼體上的膠中。 29·如申請專利範圍第26項所述之發光二極體背光模組, 鲁 其中及螢光粉係以塗佈於一陰極射線管(cathode ray tube,CRT)之方式塗佈於該發光二極體元件之封裝殼 體上。 30·如申請專利範圍第26項所述之發光二極體背光模組, 其中该LED晶片為一藍光LED晶片,而該螢光粉為 紀紹石植石螢光粉(Yttrium Aluminum Garnet, YAG)。 23 1253769 31. 如申請專利範圍第26項所述之發光二極體背光模組, 其中該LED晶片為一綠光LED晶片,而該螢光粉包 含藍色螢光粉及紅色螢光粉。 32. 如申請專利範圍第26項所述之發光二極體背光模組, 其中該LED晶片為一紅光LED晶片,而該螢光粉包 含藍色螢光粉及綠色螢光粉。 33. 如申請專利範圍第26項所述之發光二極體背光模組, 其中該LED晶片為一紫外光(ultra violet,UV) LED晶 片,其中該螢光粉包含藍色螢光粉。 34. 如申請專利範圍第33項所述之發光二極體背光模組, 其中該螢光粉另包含釔鋁石榴石螢光粉。 • 35.如申請專利範圍第34項所述之發光二極體背光模組, 其中該螢光粉另包含綠色螢光粉。 36. 如申請專利範圍第33項所述之發光二極體背光模組, 其中該螢光粉另包含綠色螢光粉及紅色螢光粉。 37. 如申請專利範圍第26項所述之發光二極體背光模組, 其另包含一燈罩,該發光二極體元件係設於該燈罩上。 24 1253769 38·如申請專利範圍第26項戶斤述之發光二極體背光模組, 其中該導光板的表面上設有螢光粉。 39.如申請專利範圍第26項所述之發光二極體背光模組, 其中該導光板的本體内設有螢光粉。 40·如申請專利範圍第26項所述之發光二極體背光模組, 其中該LED晶片為一紫外光LED晶片,而該螢光粉 所激發之發射光線之波長係介於505至565nm之間。 41·如申請專利範圍第4〇項所述之發光二極體背光模組, 其中该螢光粉所激發之發射光線之波長係介於550至 565nm之間〇 ^ (ij 其中該咖晶片為^述之發光二極體背光模紅 所激發之發射光線之波\卜光LED日日日片,而該螢以 於570至650_之間/係介於505至57〇nm、及' 44·如申 晴專利範’ 43項所述之發光二極體背光模組 25 1253769 其中該螢光粉所激發之發射光線之波長係介於550至 565nm、及介於580至600nm之間。 45.如申請專利範圍第43項所述之發光二極體背光模組, 其中該螢光粉所激發之發射光線之波長係介於505至 510nm、及介於630至645nm之間。 t十一、圖式:1253769 X. Patent Application Range: 1. A light-emitting diode (LED) backlight module having a photoluminescence phosphor, comprising: a light guide plate, The method comprises: an optical port for receiving light; a body for atomizing the light received by the optical port into a surface light, and a light emitting surface for emitting surface light generated by the atomizing light of the body; And a reflective surface for reflecting the surface light generated by the atomizing light of the body; a light emitting diode element disposed on one side of the light entrance of the light guide plate for emitting excitation light toward the light entrance port; And a phosphor powder disposed on the light guide plate for absorbing a portion of the excitation light emitted by the light emitting diode element, and thereby exciting a wavelength different from the wavelength of the excitation light emitted by the light emitting diode element Light is emitted. 2. The light-emitting diode backlight module of claim 1, wherein the fluorescent powder is immersed in the body of the light guide plate. The light-emitting diode backlight module of claim 2, wherein the phosphor powder is mixed into a plastic for manufacturing the body of the light guide plate in a predetermined ratio, and is ejected by a mold. The molding method is dispersed in the body of the light guide plate. 4. The light-emitting diode backlight module according to claim 1, wherein the fluorescent powder is mixed in a chemical solvent, and the chemical solvent is applied to the light guide plate by inkjet method. . 5. The light-emitting diode backlight module of claim 1, wherein the fluorescent powder is formed at an entrance of the light guide plate. 6. The light-emitting diode backlight module of claim 1, wherein the phosphor powder is formed on a light-emitting surface of the light guide plate. The light-emitting diode backlight module of claim 1, wherein the phosphor powder is formed on a reflective surface of the light guide plate. 8. The light-emitting diode backlight module of claim 1, wherein the phosphor powder is mixed in a glue coated on the light guide plate. 9. The light-emitting diode backlight module of claim 1, wherein the phosphor powder is applied to the light guide plate by being applied to a cathode ray tube (CRT). . The light-emitting diode backlight module of claim 1, wherein the light-emitting diode component is a blue light-emitting diode component, and the glory powder is Yttrium Aluminum Garnet. The illuminating diode backlight module of claim 1, wherein the illuminating diode component is a green illuminating diode component, and the phosphor powder comprises blue fluorescing Light powder and red fluorescent powder. 12. The light-emitting diode backlight module of claim 1, wherein the light-emitting diode component is a red light-emitting diode component, and the phosphor powder comprises blue phosphor powder and green color. Fluorescent powder. 13. The light-emitting diode backlight module of claim 1, wherein the light-emitting diode component is an ultraviolet (UV) light-emitting diode component, and the phosphor powder comprises blue Fluorescent powder. 14. The light-emitting diode backlight module of claim 13, wherein the phosphor powder further comprises yttrium aluminum garnet phosphor powder. 15. The light-emitting diode backlight module of claim 14, wherein the phosphor powder further comprises green phosphor powder. 16. The light-emitting diode backlight module according to claim 13 of the patent scope, 20 1253769, wherein the phosphor powder further comprises green powder powder and red fluoresce powder ginseng. The light-emitting diode backlight module described in the above, /, and the other 3 - the lamp cover, the light-emitting body element is disposed on the lamp cover as the light-emitting diode described in the first item of the patent application. The body backlight module, the 221 polar body element is an ultraviolet light emitting diode element, and the wavelength of the emitted light excited by the first powder is between 565 nm 〇 18. 505 to 19·凊 凊 凊 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray ray The illuminating powder is excited by the illuminating powder according to the illuminating diode backlight module of 510 nm, and the wavelength of the emitted light is between 505 and 21. According to the scope of the patent application, wherein the illuminating diode & Light-emitting diode backlight module, and the phosphor powder is excited by 1 - ultraviolet The light-emitting diode element, 570 nm, and the wavelength of the light emitted between the electrodes is between 505 and 〇 to 65 〇 nm. 22 · The light-emitting diode backlight module described in claim 21 of the patent application scope The light-emitting diode backlight module of claim 21, wherein the wavelength of the emitted light of the phosphor powder is between 550 and 565 nm, and between 580 and 600 nm. The wavelength of the emitted light that is excited by the phosphor is between 505 and 510 nm, and between 630 and 645 nm. _ 24. The LED backlight module of claim 1, The light emitting diode component comprises: a package housing; an LED chip disposed in the package housing for emitting excitation light; and a colloid covering the LED chip. 25. The light-emitting diode backlight module of the present invention, wherein: the package housing is provided with phosphor powder. 26. A light-emitting diode backlight module with phosphor powder, comprising: a light guide plate, The light emitting diode element is disposed on one of the light guide plates The side of the LED component comprises: a package housing; an LED chip disposed in the package housing for emitting excitation light toward the light guide 22 1253769; and a gel covering the LED wafer And a phosphor powder dispersed on the package casing of the LED component for absorbing a portion of the excitation light emitted by the LED chip and thereby emitting an emission light having a wavelength different from the wavelength of the excitation light. The light-emitting diode backlight module according to claim 26, wherein the fluorescent powder is mixed in a chemical solvent, and the chemical solvent is applied to the package by inkjet method. . The light-emitting diode backlight module of claim 26, wherein the phosphor powder is mixed in a glue applied to a package casing of the light-emitting diode element. 29. The light-emitting diode backlight module according to claim 26, wherein the light-emitting and phosphor powder are applied to the cathode light ray tube (CRT) in the form of a cathode ray tube (CRT). On the package housing of the polar body component. 30. The LED backlight module of claim 26, wherein the LED chip is a blue LED chip, and the phosphor powder is Yttrium Aluminum Garnet (YAG). The light-emitting diode backlight module of claim 26, wherein the LED chip is a green LED chip, and the phosphor powder comprises blue phosphor powder and red phosphor powder. 32. The LED backlight module of claim 26, wherein the LED chip is a red LED chip, and the phosphor powder comprises blue phosphor powder and green phosphor powder. 33. The LED backlight module of claim 26, wherein the LED chip is an ultra violet (UV) LED wafer, wherein the phosphor powder comprises blue phosphor powder. The light-emitting diode backlight module of claim 33, wherein the phosphor powder further comprises yttrium aluminum garnet phosphor powder. The light-emitting diode backlight module of claim 34, wherein the phosphor powder further comprises green phosphor powder. The light-emitting diode backlight module of claim 33, wherein the phosphor powder further comprises green phosphor powder and red phosphor powder. The light-emitting diode backlight module of claim 26, further comprising a lamp cover, the light-emitting diode element being disposed on the lamp cover. 24 1253769 38. The light-emitting diode backlight module of claim 26, wherein the surface of the light guide plate is provided with phosphor powder. The light-emitting diode backlight module of claim 26, wherein the light guide plate is provided with phosphor powder in the body. 40. The LED backlight module of claim 26, wherein the LED chip is an ultraviolet LED chip, and the wavelength of the emitted light excited by the phosphor is between 505 and 565 nm. between. The light-emitting diode backlight module of claim 4, wherein the wavelength of the emitted light excited by the phosphor powder is between 550 and 565 nm (wherein the coffee wafer is ^The light emitted by the light-emitting diode backlight red is excited by the wave of light, and the light is between 570 and 650_/ between 505 and 57〇nm, and '44 The light-emitting diode backlight module 25 1253769, as described in the patent application of the patent specification, wherein the wavelength of the emitted light excited by the phosphor powder is between 550 and 565 nm and between 580 and 600 nm. The illuminating diode backlight module of claim 43, wherein the illuminating powder emits light having a wavelength of between 505 and 510 nm and between 630 and 645 nm. ,figure: 2626
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Cited By (1)

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US8870431B2 (en) 2010-12-31 2014-10-28 Industrial Technology Research Institute Light mixing module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8870431B2 (en) 2010-12-31 2014-10-28 Industrial Technology Research Institute Light mixing module

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